An M-type magnetic coupling structure on an integrated circuit package lead frame

Abstract

This invention belongs to the field of radio frequency technology, specifically relating to an M-type magnetic coupling structure on an integrated circuit package lead frame. The M-type magnetic coupling structure involves the lead frame, metal bonding wires, and die within the plastic encapsulation of the integrated circuit package. The M-type magnetic coupling structure includes a first M-type conductive structure formed by the lead frame, metal bonding wires, and die, and a second M-type conductive structure that is electrically isolated from and symmetrical with it. Compared to traditional structures, its special parallel double-ring (M-type) structure has the following advantages: simple manufacturing process, with all coupling structures being easily processed rectangles, eliminating the need for complex arcs on the lead frame; the coupling structure is basically symmetrical, thus the transmit and receive structures are also basically symmetrical, which is beneficial for bidirectional communication; strong anti-interference capability, as the parallel double-ring structure provides conductive rings with opposite currents, canceling out noise coupled to the coil from external magnetic field interference; and low external magnetic field radiation and a small external radiation area.

Description

Technical Field

[0001] This invention belongs to the field of radio frequency technology, and specifically relates to an M-type magnetic coupling structure on an integrated circuit package lead frame. Background Technology

[0002] Many electronic products require electrical isolation, which is mainly achieved through optocoupler isolation, capacitive isolation, and magnetic isolation. Traditional optocoupler isolation technology, due to its drawbacks such as rapid aging, high power consumption, slow speed, and difficulty in integration, is gradually failing to meet the requirements of modern industrial equipment. Meanwhile, capacitive and magnetic isolation technologies, with their advantages of low power consumption, high speed, and ease of integration, are gradually replacing optocouplers as the mainstream isolation solutions. Capacitive isolation technology typically involves fabricating on-chip isolation capacitors on the silicon substrate of a semiconductor chip, using a metal layer on the silicon substrate as the capacitor's plates, with the plates separated by a SiO2 dielectric. Capacitive isolation technology introduces extremely high semiconductor process complexity, and achieving higher voltage withstand capabilities further increases the complexity of the on-chip isolation capacitor fabrication process. Magnetic isolation technology mainly includes two schemes: on-chip transformer magnetic coupling and packaged leadframe magnetic coupling. On-chip transformers suffer from the same process complexity issues as on-chip capacitors. Therefore, magnetic isolation structures based on packaged leadframes are a lower-cost and simpler solution.

[0003] However, the poor resistance to magnetic interference hinders the further promotion and application of leadframe magnetic coupling isolation solutions. Since magnetic coupling isolation technology achieves isolated communication through magnetic field coupling, traditional leadframe magnetic coupling isolation solutions, which use two arc-shaped conductive rings on the leadframe for coupling, are easily affected by external magnetic fields and also exhibit significant external radiation. Some improved solutions can only achieve single-sided interference resistance for either transmission or reception, and greatly increase the complexity of the manufacturing process, without improving external radiation. Poor resistance to magnetic interference, strong external radiation, and high process complexity have become key issues restricting the development and application of leadframe magnetic coupling isolation technology. Summary of the Invention

[0004] This invention proposes an M-type magnetic coupling structure on the lead frame of an integrated circuit package to achieve magnetic coupling with high anti-magnetic interference capability, low external radiation, and low process complexity.

[0005] The technical solution adopted by this invention to solve its technical problem is as follows:

[0006] The first type of M-type magnetic coupling structure on an integrated circuit package lead frame includes a lead frame, metal bonding wires, and a die. The M-type magnetic coupling structure includes a first M-type conductive structure and a second M-type conductive structure electrically isolated therefrom. The first M-type conductive structure includes a first conductor frame, a first die, a first metal bonding wire, and a second metal bonding wire. The first conductor frame includes a first conductor, a second conductor, a third conductor, a fourth conductor, a fifth conductor, and a sixth conductor. The first conductor serves as a first ground plane. One end of the second conductor is connected to the first conductor, and the other end of the second conductor is connected to one end of the fourth conductor to form a first bend structure. One end of the third conductor is connected to the first conductor, and the other end of the third conductor is connected to one end of the fifth conductor to form a second bend structure. The other ends of the fourth and fifth conductors are simultaneously connected to one end of the sixth conductor to form a first coupling conductor. The first metal bonding wire connects the other end of the sixth conductor to the first die, and the second metal bonding wire connects the first conductor to the first die.

[0007] The second M-type conductive structure and the first M-type conductive structure are symmetrical. The second M-type conductive structure includes a second conductor frame, a second die, a third metal bonding wire, and a fourth metal bonding wire. The second conductor frame includes a seventh conductor, an eighth conductor, a ninth conductor, a tenth conductor, an eleventh conductor, and a twelfth conductor. The seventh conductor is the second ground plane. One end of the eighth conductor is connected to one end of the seventh conductor, and the other end of the eighth conductor is connected to one end of the tenth conductor to form a third bend structure. One end of the ninth conductor is connected to the seventh conductor, and the other end of the ninth conductor is connected to one end of the eleventh conductor to form a fourth bend structure. The other ends of the tenth conductor and the eleventh conductor are both connected to one end of the twelfth conductor to form a second coupling conductor. The third metal bonding wire connects the other end of the twelfth conductor to the second die, and the fourth metal bonding wire connects the seventh conductor to the second die.

[0008] The first and second coupling conductors are isolated from each other and parallel to each other. The first M-type conductive structure and the second M-type conductive structure are magnetically coupled through the first and second coupling conductors. The first M-type conductive structure includes a first conductive loop formed by a first die, a first metal bonding wire, a sixth conductor, a fourth conductor, a second conductor, a first conductor, and a second metal bonding wire, and a second conductive loop formed by the same conductor. The second M-type conductive structure includes a third conductive loop formed by a second die, a third metal bonding wire, a twelfth conductor, a tenth conductor, an eighth conductor, a seventh conductor, and a fourth metal bonding wire, and a fourth conductive loop formed by the same conductor. The current directions of the first and second conductive loops are opposite, and the magnetic field directions are opposite. The current directions of the third and fourth conductive loops are also opposite, and the magnetic field directions are opposite. This reduces the external radiation of the magnetic coupling structure and enhances its anti-interference capability against external magnetic fields.

[0009] Furthermore, the first M-type conductive structure is symmetrical on both sides with the center line of the sixth conductor and the first chip die as the center; the second M-type conductive structure is symmetrical on both sides with the center line of the twelfth conductor and the second chip die as the center; therefore, the area of ​​the first conductive loop is equal to that of the second conductive loop, and the area of ​​the third conductive loop is equal to that of the fourth conductive loop.

[0010] Furthermore, the minimum width of the sixth conductor is the width of the fourth conductor, and the minimum width of the twelfth conductor is the width of the tenth conductor.

[0011] Furthermore, the first, second, third, and fourth bending structures are either zigzag or arc-shaped.

[0012] A second type of M-type magnetic coupling structure on an integrated circuit package lead frame includes a lead frame, metal bonding wires, and a die; characterized in that the M-type magnetic coupling structure includes a first M-type conductive structure and a second M-type conductive structure electrically isolated therefrom; the first M-type conductive structure includes a first conductor frame, a first die, a first metal bonding wire, a second metal bonding wire, and a third metal bonding wire; the first conductor frame includes a first conductor, a second conductor, a third conductor, a fourth conductor, a fifth conductor, a sixth conductor, a seventh conductor, an eighth conductor, and a ninth conductor; wherein the first conductor is a first ground plane; one end of the second conductor is connected to the first... One conductor is connected to another conductor; the other end of the second conductor is connected to one end of the third conductor and one end of the fourth conductor; one end of the fifth conductor is connected to the other end of the third conductor, and the other end of the fifth conductor is connected to the sixth conductor to form a first bent structure; one end of the seventh conductor is connected to the other end of the sixth conductor; one end of the eighth conductor is connected to one end of the seventh conductor, and the other end of the eighth conductor is connected to one end of the ninth conductor to form a second bent structure; a first metal bonding wire connects the other end of the seventh conductor to the first chip die; a second metal bonding wire connects the other end of the ninth conductor to the other end of the fourth conductor; and a third metal bonding wire connects the first conductor to the first chip die.

[0013] The second M-type conductive structure includes a second conductor frame, a second die, a fourth metal bonding wire, a fifth metal bonding wire, and a sixth metal bonding wire; the second conductor frame includes a tenth conductor, an eleventh conductor, a twelfth conductor, a thirteenth conductor, a fourteenth conductor, a fifteenth conductor, a sixteenth conductor, a seventeenth conductor, and an eighteenth conductor; wherein the tenth conductor is the second ground plane; one end of the eleventh conductor is connected to the tenth conductor, and the other end of the eleventh conductor is connected to one end of the twelfth conductor and one end of the thirteenth conductor; one end of the fourteenth conductor is connected to the other end of the thirteenth conductor; the other end of the fourteenth conductor is connected to one end of the fifteenth conductor to form a third bend structure; one end of the sixteenth conductor is connected to the other end of the fifteenth conductor; one end of the seventeenth conductor is connected to one end of the sixteenth conductor, and the other end of the seventeenth conductor is connected to the eighteenth conductor to form a fourth bend structure; the fourth metal bonding wire connects the other end of the sixteenth conductor to the second die, the fifth metal bonding wire connects the other end of the eighteenth conductor to the other end of the thirteenth conductor, and the sixth metal bonding wire connects the tenth conductor to the second die;

[0014] The second, third, and fourth conductors are isolated from and parallel to the fifteenth and seventeenth conductors; the eleventh, twelfth, and thirteenth conductors are isolated from and parallel to the sixth and eighth conductors; the fifth and eighteenth conductors are isolated from and parallel to each other; the fourteenth and ninth conductors are isolated from and parallel to each other; and the seventh and sixteenth conductors are isolated from and parallel to each other.

[0015] The first M-type conductive structure includes a first conductive loop formed by a first die, a first metal bonding wire, a seventh conductor, an eighth conductor, a ninth conductor, a second metal bonding wire, a third conductor, a second conductor, a first conductor, and a third metal bonding wire, and a second conductive loop formed by the first die, a third metal bonding wire, a seventh conductor, a sixth conductor, a fifth conductor, a fourth conductor, a second conductor, a first conductor, and a third metal bonding wire; the second M-type conductive structure includes a second die, a fourth metal bonding wire, a sixteenth conductor, a seventeenth conductor, an eighteenth conductor, a fifth metal bonding wire, and a third metal bonding wire. The third conductive loop is formed by the twelfth conductor, the eleventh conductor, the tenth conductor, and the sixth metal bonding wire, and the fourth conductive loop is formed by the second chip die, the fourth metal bonding wire, the sixteenth conductor, the fifteenth conductor, the fourteenth conductor, the thirteenth conductor, the eleventh conductor, the tenth conductor, and the sixth metal bonding wire; the current direction of the first conductive loop is opposite to that of the second conductive loop, and the magnetic field direction is opposite to that of the third conductive loop and the fourth conductive loop; this reduces the external radiation of the magnetic coupling structure and enhances the anti-interference capability of the magnetic coupling structure against external magnetic fields.

[0016] Furthermore, the areas of the first conductive circuit and the second conductive circuit are equal, and the areas of the third conductive circuit and the fourth conductive circuit are equal.

[0017] Furthermore, the minimum width of the second conductor is the same as that of the third conductor, the minimum width of the eleventh conductor is the same as that of the twelfth conductor, the minimum width of the seventh and ninth conductors is the width of the eighth conductor, the minimum width of the sixteenth and eighteenth conductors is the width of the seventeenth conductor, the length of the second conductor is equal to the length of the third conductor and the length of the fourth conductor, and the length of the eleventh conductor is equal to the length of the twelfth conductor and the length of the thirteenth conductor, and the length of the tenth conductor.

[0018] Furthermore, the first, second, third, and fourth bending structures are either zigzag or arc-shaped.

[0019] The M-type magnetic coupling structure on the integrated circuit package lead frame in the above scheme is used to achieve electrical isolation in the form of magnetic coupling, and can be applied to various products such as digital isolator chips, isolated gate driver chips, and isolated switching power supply control chips.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] This invention proposes a novel M-type magnetic coupling structure on the lead frame of an integrated circuit package. Compared with traditional structures, its special parallel double-ring (M-type) structure has the following advantages: simple manufacturing process, as the coupling structures are all easily processed rectangles, eliminating the need to create complex arcs on the lead frame; the coupling structure is basically symmetrical, thus the transmitting and receiving structures are also basically symmetrical, which is beneficial for the realization of bidirectional communication; strong anti-interference capability, as the parallel double-ring structure provides conductive rings with opposite currents, canceling out noise coupled to the coil from external magnetic field interference; and small external magnetic field radiation, as the magnetic field of the parallel double-ring structure is directly above the coil, canceling out magnetic field accumulation near the coil, resulting in a small external radiation area. Attached Figure Description

[0022] Figure 1 A schematic diagram of one embodiment of an M-type magnetic coupling structure on an integrated circuit package lead frame according to the teachings of the present invention is shown.

[0023] Figure 2 A schematic diagram of another embodiment of the M-type magnetic coupling structure on the lead frame of an integrated circuit package according to the teachings of the present invention is shown.

[0024] Figure 3 A schematic diagram of a coupling structure on a conventional integrated circuit package lead frame is shown.

[0025] Figure 4 A schematic diagram of a coupling structure on another existing integrated circuit package lead frame is shown.

[0026] Figure 5 schematically shown Figure 1 and Figure 2 The proposed M-type coupling structure and Figure 3 and Figure 4 The diagram shows the near-field radiation distribution of the existing coupled structure. Detailed Implementation

[0027] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0028] Example 1:

[0029] This embodiment describes an M-type magnetic coupling structure on an integrated circuit package lead frame, including the lead frame, metal bonding wires, and bare die within the integrated circuit package structure. Figure 1As shown, the lead frame 1001 includes a first conductor frame 1101 and a second conductor frame 1102, which are electrically isolated from each other. The first conductor frame 1101 includes a first conductor 1201, a second conductor 1202, a third conductor 1203, a fourth conductor 1204, a fifth conductor 1205, and a sixth conductor 1206. The first conductor 1201 serves as a first ground plane. One end of the second conductor 1202 is connected to the first conductor 1201, and the other end is connected to the fourth conductor 1204, forming a first bend structure 1221. One end of the third conductor 1203 is connected to the first conductor 1201, and the other end is connected to the fifth conductor 1205, forming a second bend structure 1222. The fourth conductor 1204, the fifth conductor 1205, and the sixth conductor 1206 are connected to form a first coupling conductor 1231. The first metal bonding wire 1401 connects the sixth conductor 1206 to the first chip die 1301, and the second metal bonding wire 1402 connects the first conductor 1201 to the first chip die 1301.

[0030] The second conductor frame 1102 includes a seventh conductor 1207, an eighth conductor 1208, a ninth conductor 1209, a tenth conductor 1210, an eleventh conductor 1211, and a twelfth conductor 1212. The seventh conductor 1207 serves as the second ground plane. One end of the eighth conductor 1208 is connected to the seventh conductor 1207, and the other end is connected to the tenth conductor 1210, forming a third bend structure 1223. One end of the ninth conductor 1209 is connected to the seventh conductor 1207, and the other end is connected to the eleventh conductor 1211, forming a fourth bend structure 1224. The tenth conductor 1210, the eleventh conductor 1211, and the twelfth conductor 1212 are connected to form a second coupling conductor 1232. A third metal bonding wire 1403 connects the twelfth conductor 1212 to the second chip die 1302, and a fourth metal bonding wire 1404 connects the seventh conductor 1207 to the second chip die 1302.

[0031] The first coupling conductor 1231 and the second coupling conductor 1232 are spaced apart from each other and parallel to each other. The first M-type conductive structure 1501 and the second M-type conductive structure 1502 are magnetically coupled through the first coupling conductor 1231 and the second coupling conductor 1232. The first M-type conductive structure 1501 includes a first conductive loop 1601 formed by a first die 1301, a first metal bonding wire 1401, a sixth conductor 1206, a fourth conductor 1204, a second conductor 1202, a first conductor 1201, and a second metal bonding wire 1402, and a second conductive loop 1602 formed by the first die 1301, the first metal bonding wire 1401, the sixth conductor 1206, the fifth conductor 1205, the third conductor 1203, the first conductor 1201, and the second metal bonding wire 1402. The second M-type conductive structure 1502 includes a third conductive circuit 1603 formed by the second chip die 1302, the third metal bonding line 1403, the twelfth conductor 1212, the tenth conductor 1210, the eighth conductor 1208, the seventh conductor 1207, and the fourth metal bonding line 1404, and a fourth conductive circuit 1604 formed by the second chip die 1302, the third metal bonding line 1403, the twelfth conductor 1212, the eleventh conductor 1211, the ninth conductor 1209, the seventh conductor 1207, and the fourth metal bonding line 1404.

[0032] The first die 1301 and the second die 1302 can be transceiver chips. The currents generated in the first conductive circuit 1601 and the second conductive circuit 1602 are in opposite directions, and the magnetic fields generated are in opposite directions. The currents in the third conductive circuit 1603 and the fourth conductive circuit 1604 are in opposite directions, and the magnetic fields generated are in opposite directions. This can effectively reduce the external radiation of the magnetic coupling structure and enhance the anti-interference capability of the external magnetic field of the magnetic coupling structure.

[0033] In this embodiment, the width of the first conductor frame 1101 of the M-type magnetic coupling structure is 9.4 mm, and the typical circuit parameters are: first self-inductance 3 nH, second self-inductance 3.8 nH, mutual inductance 0.21 nH, and coupling coefficient 0.06.

[0034] Figure 1 The withstand voltage capability of the M-type magnetic coupling structure shown is mainly determined by the minimum spacing between the first M-type conductive structure 1501 and the second M-type conductive structure 1502, which is determined by the minimum spacing between the first conductor frame 1101 and the second conductor frame 1102.

[0035] Example 2:

[0036] This embodiment describes another M-type magnetic coupling structure on an integrated circuit package lead frame, including the lead frame, metal bonding wires, and chip within the integrated circuit package structure. Figure 2As shown, the lead frame 2001 includes a first conductor frame 2101 and a second conductor frame 2102, and the first conductor frame 2101 and the second conductor frame 2102 are electrically isolated from each other. The first conductor frame 2101 includes a first conductor 2201, a second conductor 2202, a third conductor 2203, a fourth conductor 2204, a fifth conductor 2205, a sixth conductor 2206, a seventh conductor 2207, an eighth conductor 2208, and a ninth conductor 2209. The first conductor 2201 is the first ground plane. One end of the second conductor 2202 is connected to the first conductor 2201, and the other end is connected to the third conductor 2203 and the fourth conductor 2204. One end of the fifth conductor 2205 is connected to the third conductor 2203, and the other end is connected to the sixth conductor 2206 to form a first bending structure 2221. The seventh conductor 2207 is connected to the sixth conductor 2206. One end of the eighth conductor 2208 is connected to the seventh conductor 2207, and the other end is connected to the ninth conductor 2209 to form a second bending structure 2222. The first metal bonding wire 2401 connects the seventh conductor 2207 to the first chip die 2231, the second metal bonding wire 2402 connects the ninth conductor 2209 to the fourth conductor 2204, and the third metal bonding wire 2403 connects the first conductor 2201 to the first chip die 2301.

[0037] The second conductor frame 2102 includes a tenth conductor 2210, an eleventh conductor 2211, a twelfth conductor 2212, a thirteenth conductor 2213, a fourteenth conductor 2214, a fifteenth conductor 2215, a sixteenth conductor 2216, a seventeenth conductor 2217, and an eighteenth conductor 2218. The tenth conductor 2210 is the second ground plane. One end of the eleventh conductor 2211 is connected to the tenth conductor 2210, and the other end is connected to the twelfth conductor 2212 and the thirteenth conductor 2213. One end of the fourteenth conductor 2214 is connected to the thirteenth conductor 2213, and the other end is connected to the fifteenth conductor 2215 to form a third bending structure 2223. The sixteenth conductor 2216 is connected to the fifteenth conductor 2215. One end of the seventeenth conductor 2217 is connected to the sixteenth conductor 2216, and the other end is connected to the eighteenth conductor 2218 to form a fourth bending structure 2224. The fourth metal bonding wire 2404 connects the sixteenth conductor 2216 to the second chip die 2302, the fifth metal bonding wire 2405 connects the eighteenth conductor 2218 to the thirteenth conductor 2213, and the sixth metal bonding wire 2406 connects the tenth conductor 2210 to the second chip die 2302.

[0038] The second conductor 2202, the third conductor 2203, and the fourth conductor 2204 are separated from and parallel to the fifteenth conductor 2215 and the seventeenth conductor 2217. The eleventh conductor 2211, the twelfth conductor 2212, and the thirteenth conductor 2213 are separated from and parallel to the sixth conductor 2206 and the eighth conductor 2208. The fifth conductor 2205 is separated from and parallel to the eighteenth conductor 2218. The fourteenth conductor 2214 is separated from and parallel to the ninth conductor 2209. The seventh conductor 2207 is separated from and parallel to the sixteenth conductor 2216. The first M-type conductive structure 2501 includes a first conductive circuit 2601 formed by a first die 2301, a first metal bonding wire 2401, a seventh conductor 2207, an eighth conductor 2208, a ninth conductor 2209, a second metal bonding wire 2402, a third conductor 2203, a second conductor 2202, a first conductor 2201, and a third metal bonding wire 2403, and a second conductive circuit 2602 formed by the first die 2301, the third metal bonding wire 2403, the seventh conductor 2207, the sixth conductor 2206, the fifth conductor 2205, the fourth conductor 2204, the second conductor 2202, the first conductor 2201, and the third metal bonding wire 2403. The second M-type conductive structure 2502 includes a third conductive circuit 2603 formed by the second die 2302, the fourth metal bonding wire 2404, the sixteenth conductor 2216, the seventeenth conductor 2217, the eighteenth conductor 2218, the fifth metal bonding wire 2405, the twelfth conductor 2212, the eleventh conductor 2211, the tenth conductor 2210, and the sixth metal bonding wire 2406, and a fourth conductive circuit 2604 formed by the second die 2302, the fourth metal bonding wire 2404, the sixteenth conductor 2216, the fifteenth conductor 2215, the fourteenth conductor 2214, the thirteenth conductor 2213, the eleventh conductor 2211, the tenth conductor 2210, and the sixth metal bonding wire 2406.

[0039] The first die 2301 and the second die 2302 can be transceiver chips. The current directions of the first conductive circuit 2601 and the second conductive circuit 2602 are opposite, and the magnetic fields they generate are opposite. The current directions of the third conductive circuit 2603 and the fourth conductive circuit 2604 are opposite, and the magnetic fields they generate are opposite. This can effectively reduce the external radiation of the magnetic coupling structure and enhance the anti-interference capability of the external magnetic field of the magnetic coupling structure.

[0040] In this embodiment, the width of the first conductor frame 2101 of the M-type magnetic coupling structure is 9.4 mm, and the typical circuit parameters are: first self-inductance 5.9 nH, second self-inductance 5.9 nH, mutual inductance 1.2 nH, and coupling coefficient 0.21.

[0041] Figure 2The withstand voltage capability of the M-type magnetic coupling structure shown is mainly determined by the minimum spacing between the first M-type conductive structure 2501 and the second M-type conductive structure 2502. This minimum spacing is determined by the minimum values ​​of the spacing between the first conductor frame 2101 and the second conductor frame 2102, the spacing between the first metal bonding line 2401 and the second conductor frame 2102, the spacing between the second metal bonding line 2402 and the second conductor frame 2102, the spacing between the fourth metal bonding line 2404 and the first conductor frame 2101, and the spacing between the fifth metal bonding line 2405 and the first conductor frame 2101.

[0042] Compared with the M-type coupling structure in Embodiment 1, the coupling length of the structure in this embodiment is longer and the coupling coefficient is higher; however, two more metal bonding wires are used.

[0043] Example 1:

[0044] This example describes a magnetic coupling structure on a conventional integrated circuit package lead frame. Figure 3 The diagram shows a traditional single-ring magnetic coupling structure, which is coupled through the first conductor 311 and the second conductor 312 of the single-ring structure.

[0045] Example 2:

[0046] This example describes a magnetic coupling structure on a conventional integrated circuit package lead frame. Figure 4 It is a coupling structure described by the power integration company in the invention entitled "Noise cancellation of magnetically coupled communication links using lead frame", authorized announcement number CN108493180 B, which is coupled through a first conductor 411 and a second conductor 412.

[0047] Now compare Figure 3 , Figure 4 The near-field distribution of the two existing magnetic coupling structures and the M-type magnetic coupling structure described in Embodiments 1 and 2. Figure 5 As shown Figure 3 , Figure 4 The diagram shows a comparison of the near-field distribution of the coupling structure on the XZ plane with the coupling structures described in Examples 1 and 2. All four structures are shown at a port impedance of 1KΩ and a range of 100MHz. Z Simulations were performed at the signal source frequency, and the simulation results used the same scale 501. Separate simulations were established in the electromagnetic simulation software. Figure 3 The encapsulation model 521 of the single-ring coupling structure is described above. Figure 4 The encapsulation model 522 of the coupling structure proposed by the power integration company, the coupling structure 523 proposed in Example 1, and the coupling structure 524 proposed in Example 2 are compared. Figure 3 The near-field distribution diagram of the XZ plane of the single-ring coupling structure is shown in Figure 511. Figure 4The XZ plane near-field distribution diagrams 512, 513, and 514 of the coupling structure proposed by the power integration company show that the near-field distribution of the coupling structure proposed in Examples 1 and 2 is much smaller than that of the coupling structure proposed in Examples 2. Figure 3 and Figure 4 The existing coupling structure is shown. Therefore, the external radiation of the coupling structure proposed in Embodiments 1 and 2 is much smaller than that of the traditional single-ring coupling and the coupling structure proposed by the power integration company.

[0048] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, substitutions, improvements, etc., made within the spirit and principles of the present invention are within the protection scope of the present invention.

Claims

1. An M-type magnetic coupling structure on an integrated circuit package leadframe, comprising a leadframe, a metal bonding wire and a chip die; characterized in that, The M-type magnetic coupling structure comprises a first M-type conductive structure and a second M-type conductive structure electrically isolated therefrom; the first M-type conductive structure comprises a first conductor frame, a first chip die, a first metal bonding wire and a second metal bonding wire; the first conductor frame comprises a first conductor, a second conductor, a third conductor, a fourth conductor, a fifth conductor and a sixth conductor; the first conductor is a first ground plane; one end of the second conductor is connected to the first conductor, and the other end of the second conductor is connected to one end of the fourth conductor to form a first bending structure; one end of the third conductor is connected to the first conductor, and the other end of the third conductor is connected to one end of the fifth conductor to form a second bending structure; the other end of the fourth conductor and the other end of the fifth conductor are connected to one end of the sixth conductor to form a first coupling conductor; the other end of the sixth conductor is connected to the first chip die through the first metal bonding wire, and the first conductor is connected to the first chip die through the second metal bonding wire; The second M-type conductive structure and the first M-type conductive structure are in a symmetrical structure; the second M-type conductive structure comprises a second conductor frame, a second chip die, a third metal bonding wire and a fourth metal bonding wire; the second conductor frame comprises a seventh conductor, an eighth conductor, a ninth conductor, a tenth conductor, an eleventh conductor and a twelfth conductor; the seventh conductor is a second ground plane; one end of the eighth conductor is connected to one end of the seventh conductor, and the other end of the eighth conductor is connected to one end of the tenth conductor to form a third bending structure; one end of the ninth conductor is connected to the seventh conductor, and the other end of the ninth conductor is connected to one end of the eleventh conductor to form a fourth bending structure; the other end of the tenth conductor and the other end of the eleventh conductor are connected to one end of the twelfth conductor to form a second coupling conductor; the other end of the twelfth conductor is connected to the second chip die through the third metal bonding wire, and the seventh conductor is connected to the second chip die through the fourth metal bonding wire; The first coupling conductor and the second coupling conductor are isolated from each other and parallel to each other; the first M-type conductive structure and the second M-type conductive structure are magnetically coupled through the first coupling conductor and the second coupling conductor; the first M-type conductive structure comprises a first conductive loop formed by the first chip die, the first metal bonding wire, the sixth conductor, the fourth conductor, the second conductor, the first conductor and the second metal bonding wire, and a second conductive loop formed by the first chip die, the first metal bonding wire, the sixth conductor, the fifth conductor, the third conductor, the first conductor and the second metal bonding wire; the second M-type conductive structure comprises a third conductive loop formed by the second chip die, the third metal bonding wire, the twelfth conductor, the tenth conductor, the eighth conductor, the seventh conductor and the fourth metal bonding wire, and a fourth conductive loop formed by the second chip die, the third metal bonding wire, the twelfth conductor, the eleventh conductor, the ninth conductor, the seventh conductor and the fourth metal bonding wire; the first conductive loop and the second conductive loop have opposite current directions and opposite magnetic field directions; the third conductive loop and the fourth conductive loop have opposite current directions and opposite magnetic field directions; The magnetic coupling structure can weaken external radiation and enhance the anti-interference ability of the external magnetic field.

2. The M-type magnetic coupling structure on an integrated circuit package lead frame according to claim 1, wherein, The first M-shaped conductive structure is symmetrically arranged on both sides of the center line of the sixth conductor and the first chip die, and the second M-shaped conductive structure is symmetrically arranged on both sides of the center line of the twelfth conductor and the second chip die, so that the first conductive loop and the second conductive loop have equal areas, and the third conductive loop and the fourth conductive loop have equal areas.

3. The M-type magnetic coupling structure on an integrated circuit package lead frame according to claim 1, wherein, The minimum width of the sixth conductor is equal to the width of the fourth conductor, and the minimum width of the twelfth conductor is equal to the width of the tenth conductor.

4. The M-type magnetic coupling structure on an integrated circuit package lead frame according to claim 1, wherein, The first bending structure, the second bending structure, the third bending structure and the fourth bending structure are in a line shape or an arc shape.

5. An M-type magnetic coupling structure on an integrated circuit package leadframe, comprising a leadframe, a metal bond wire, and a chip die; characterized in that, The M-shaped magnetic coupling structure comprises a first M-shaped conductive structure and a second M-shaped conductive structure electrically isolated from the first M-shaped conductive structure; the first M-shaped conductive structure comprises a first conductor frame, a first chip die, a first metal bonding wire, a second metal bonding wire and a third metal bonding wire; the first conductor frame comprises a first conductor, a second conductor, a third conductor, a fourth conductor, a fifth conductor, a sixth conductor, a seventh conductor, an eighth conductor and a ninth conductor; the first conductor is a first ground plane; one end of the second conductor is connected to the first conductor, and the other end of the second conductor is connected to one end of the third conductor and one end of the fourth conductor; one end of the fifth conductor is connected to the other end of the third conductor, and the other end of the fifth conductor is connected to the sixth conductor to form a first bending structure; one end of the seventh conductor is connected to the other end of the sixth conductor; one end of the eighth conductor is connected to one end of the seventh conductor, and the other end of the eighth conductor is connected to one end of the ninth conductor to form a second bending structure; the first metal bonding wire connects the other end of the seventh conductor to the first chip die, the second metal bonding wire connects the other end of the ninth conductor to the other end of the fourth conductor, and the third metal bonding wire connects the first conductor to the first chip die. The second M-shaped conductive structure comprises a second conductor frame, a second chip die, a fourth metal bonding wire, a fifth metal bonding wire and a sixth metal bonding wire; the second conductor frame comprises a tenth conductor, an eleventh conductor, a twelfth conductor, a thirteenth conductor, a fourteenth conductor, a fifteenth conductor, a sixteenth conductor, a seventeenth conductor and an eighteenth conductor; the tenth conductor is a second ground plane; one end of the eleventh conductor is connected to the tenth conductor, and the other end of the eleventh conductor is connected to one end of the twelfth conductor and one end of the thirteenth conductor; one end of the fourteenth conductor is connected to the other end of the thirteenth conductor; the other end of the fourteenth conductor is connected to one end of the fifteenth conductor to form a third bending structure; one end of the sixteenth conductor is connected to the other end of the fifteenth conductor; one end of the seventeenth conductor is connected to one end of the sixteenth conductor, and the other end of the seventeenth conductor is connected to the eighteenth conductor to form a fourth bending structure; the fourth metal bonding wire connects the other end of the sixteenth conductor to the second chip die, the fifth metal bonding wire connects the other end of the eighteenth conductor to the other end of the thirteenth conductor, and the sixth metal bonding wire connects the tenth conductor to the second chip die. The second conductor, the third conductor, the fourth conductor and the fifteenth conductor, the seventeenth conductor are isolated and parallel, the eleventh conductor, the twelfth conductor, the thirteenth conductor and the sixth conductor, the eighth conductor are isolated and parallel, the fifth conductor and the eighteenth conductor are isolated and parallel, the fourteenth conductor and the ninth conductor are isolated and parallel, the seventh conductor and the sixteenth conductor are isolated and parallel; The first M-type conductive structure includes a first conductive loop formed by the first chip die, the first metal bonding wire, the seventh conductor, the eighth conductor, the ninth conductor, the second metal bonding wire, the third conductor, the second conductor, the first conductor and the third metal bonding wire, and a second conductive loop formed by the first chip die, the third metal bonding wire, the seventh conductor, the sixth conductor, the fifth conductor, the fourth conductor, the second conductor, the first conductor and the third metal bonding wire; the second M-type conductive structure includes a third conductive loop formed by the second chip die, the fourth metal bonding wire, the sixteenth conductor, the seventeenth conductor, the eighteenth conductor, the fifth metal bonding wire, the twelfth conductor, the eleventh conductor, the tenth conductor and the sixth metal bonding wire, and a fourth conductive loop formed by the second chip die, the fourth metal bonding wire, the sixteenth conductor, the fifteenth conductor, the fourteenth conductor, the thirteenth conductor, the eleventh conductor, the tenth conductor and the sixth metal bonding wire; the first conductive loop and the second conductive loop have opposite current directions and opposite magnetic field directions; the third conductive loop and the fourth conductive loop have opposite current directions and opposite magnetic field directions; The magnetic coupling structure can weaken external radiation and enhance the anti-interference ability of the magnetic coupling structure to external magnetic fields.

6. The M-type magnetic coupling structure on an integrated circuit package lead frame according to claim 5, wherein, The first conductive loop and the second conductive loop have equal areas, and the third conductive loop and the fourth conductive loop have equal areas.

7. The M-type magnetic coupling structure on an integrated circuit package lead frame according to claim 5, wherein, The minimum width of the second conductor is equal to that of the third conductor, the minimum width of the eleventh conductor is equal to that of the twelfth conductor, the minimum width of the seventh conductor and the ninth conductor is equal to that of the eighth conductor, the minimum width of the sixteenth conductor and the eighteenth conductor is equal to that of the seventeenth conductor, the length of the second conductor is equal to the sum of the lengths of the third conductor and the fourth conductor, and the length of the eleventh conductor is equal to the sum of the lengths of the twelfth conductor and the thirteenth conductor.

8. The M-type magnetic coupling structure on an integrated circuit package lead frame according to claim 5, wherein, The first bending structure, the second bending structure, the third bending structure and the fourth bending structure are zigzag or arc-shaped.

Images