Methods and systems for generating 3D models of multi-thickness objects in a computer-aided design environment

Abstract

A method and system for generating a three-dimensional model of a multi-thickness object in a formed state within a computer-aided design (CAD) environment are disclosed. The method includes: receiving a request to generate features of the three-dimensional model; creating a virtual reference plane; and dynamically calculating an offset value for the feature based on thickness values ​​and referencing the virtual reference plane. The offset value determines an offset between the virtual reference plane and a surface of the feature. The method further includes: generating the feature in the formed state based on the thickness values, the position of the feature in the three-dimensional model, and the offset value, referencing the virtual reference plane. The method also includes outputting a three-dimensional model of the multi-thickness object having the generated features in the formed state.

Description

Technical Field

[0001] This disclosure generally relates to the field of computer-aided design (CAD), and more specifically to a method and system for generating three-dimensional models of multi-thickness objects in a CAD environment. Background Technology

[0002] Computer-aided design (CAD) tools enable users to design physical objects. Typically, CAD tools implement designs for physical objects with features that have varying thicknesses in a flat state (e.g., in two-dimensional form). Based on a scheme definition, physical objects such as printed circuit boards (PCBs) are connected by flexible segments. Each of the PCB and the flexible segments (hereinafter referred to as "features") is considered a unique region. Each region has a different thickness and a different offset from the top of the PCB in its flat state, where the top of the PCB is located at a global reference plane.

[0003] Current CAD tools allow for the design of multi-thickness objects, such as PCBs, connected by flexible sections in two-dimensional form (e.g., flat state). However, current CAD tools may not allow for the design of multi-thickness objects in three-dimensional form (e.g., formed state). This is due to the fact that the global reference plane is static, which can pose challenges in designing multi-thickness objects with features that are not in the same plane as the global reference plane. Moreover, any modification to a feature in one area may affect downstream features in other areas of the multi-thickness object, potentially violating user requirements. Summary of the Invention

[0004] The scope of this disclosure is defined only by the appended claims and is not affected in any way by the statements within this description. This embodiment can eliminate one or more of the defects or limitations in the related art. A method and system for creating a three-dimensional model of a multi-thickness object in a computer-aided design (CAD) environment are disclosed.

[0005] In one aspect, a method includes: generating the first feature in a formed state based on a first thickness value of a first feature of a three-dimensional model of a multi-thickness object and referencing a first virtual reference plane. The method includes: receiving a request from a user to generate a second feature of the three-dimensional model. The request includes a second thickness value of the second feature and a position of the second feature. The method includes: creating a second virtual reference plane aligned with the first virtual reference plane; and dynamically calculating an offset value in the three-dimensional model relative to the second feature based on the second thickness value and referencing the second virtual reference plane. The offset value indicates the distance by which the second feature is to be offset from the second virtual reference plane.

[0006] The method includes: generating the second feature in the formed state based on the second thickness value, the position and offset value of the second feature of the 3D model, and referencing the second virtual reference plane. The generated second feature is offset from the second virtual reference plane by the offset value. The method further includes: outputting a 3D model of a multi-thickness object in the formed state, including the first feature and the second feature. The first thickness value of the first feature is different from the second thickness value of the second feature. The first virtual reference plane and the second virtual reference plane may be located on a global virtual reference plane in a flattened state. The second feature may be offset from the global virtual reference plane in the flattened state by the offset value. The first feature and the second feature may belong to the same region or different regions. Additionally, the method may include: converting the 3D model of the multi-thickness object in the formed state into a flattened state. Moreover, the method may include: creating the first virtual reference plane in a CAD environment.

[0007] In dynamically calculating the offset value for the second feature in the three-dimensional model based on the second thickness value and with reference to the second virtual reference plane, the method includes: determining an element of the first feature for creating the second feature; and dynamically calculating the offset value for the second feature based on the determined element and the second thickness value of the second feature, with reference to the second virtual reference plane.

[0008] In another aspect, a data processing system includes: a processing unit; and a memory unit communicatively coupled to the processing unit. The memory unit includes: a CAD module configured to generate the first feature in a formed state based on a first thickness value of a first feature of a three-dimensional model of a multi-thickness object, referencing a first virtual reference plane. The CAD module is configured to: receive a request from a user to generate a second feature of the three-dimensional model. The request includes a second thickness value of the second feature and the position of the second feature. The CAD module is configured to: create a second virtual reference plane aligned with the first virtual reference plane; and dynamically calculate an offset value in the three-dimensional model relative to the second feature based on the second thickness value and referencing the second virtual reference plane. The offset value determines an offset between the second virtual reference plane and one of the surfaces of the second feature.

[0009] The CAD module is configured to generate the second feature in the formed state based on the second thickness value, the position and offset value of the second feature of the 3D model, and a reference to the second virtual reference plane. The generated second feature is offset from the second virtual reference plane. The CAD module is also configured to output a 3D model of a multi-thickness object in the formed state, including the first feature and the second feature. The first thickness value of the first feature is different from the second thickness value of the second feature. The first virtual reference plane and the second virtual reference plane may be located on a global virtual reference plane in a flattened state. The second feature may be offset from the global virtual reference plane in the flattened state by the offset value. The first feature and the second feature may belong to the same area or different areas. Additionally, the CAD module may be configured to convert the 3D model of the multi-thickness object in the formed state into a flattened state. Moreover, the CAD module may be configured to create the first virtual reference plane in a CAD environment.

[0010] In dynamically calculating the offset value for the second feature in the 3D model based on the second thickness value and with reference to the second virtual reference plane, the CAD module can be configured to: determine the element of the first feature for creating the second feature; and dynamically calculate the offset value for the second feature based on the determined element and the second thickness value of the second feature, with reference to the second virtual reference plane.

[0011] In another aspect, a non-transitory computer-readable storage medium is also provided having machine-readable instructions stored thereon, which, when executed by a data processing system, cause the data processing system to perform the methods described above.

[0012] The present invention is provided to introduce options of the concept in simplified form, which are further described below. The present invention is not intended to identify features or essential features of the claimed subject matter. Furthermore, the claimed subject matter is not limited to implementations that address any or all of the shortcomings pointed out in any part of this disclosure. Attached Figure Description

[0013] Figure 1 This is a block diagram of an exemplary data processing system for a three-dimensional model of a multi-thickness object in a computer-aided design (CAD) environment, according to one embodiment.

[0014] Figure 2 This is a flowchart illustrating an exemplary method for creating a 3D model of a multi-thickness object in a CAD environment according to one embodiment.

[0015] Figure 3This is a schematic representation of a data processing system for performing trimming operations on intersecting bodies in a geometric model within a CAD environment, according to another embodiment.

[0016] Figure 4 The diagram illustrates a block diagram of a data processing system for generating three-dimensional models of multi-thickness objects in a CAD environment, according to yet another embodiment.

[0017] Figure 5A -D is a graphical user interface view depicting a generated three-dimensional model of a printed circuit board (PCB) assembly according to one embodiment.

[0018] Figures 6A-6B It is a graphical user interface view depicting a PCB assembly in a formed state and a PCB assembly in a flat state according to one embodiment. Detailed Implementation

[0019] A method and system for generating three-dimensional (3D) models of multi-thickness objects in a computer-aided design (CAD) environment are disclosed. Various embodiments are described with reference to the accompanying drawings, in which similar reference numerals are used with reference to the drawings. Similar reference numerals are used throughout to refer to similar elements. Numerous specific details are set forth in the following description to provide a thorough understanding of the embodiments. These specific details are not required to be adopted in practicing the embodiments. In other instances, well-known materials or methods have not been described in detail to avoid unnecessarily obscuring the embodiments. While this disclosure is susceptible to various modifications and substitutions, specific embodiments thereof are shown by way of example in the drawings and will be described in detail herein. There is no intention to limit this disclosure to the specific forms disclosed. Instead, this disclosure is intended to cover all modifications, equivalents, and substitutions falling within the spirit and scope of this disclosure.

[0020] Figure 1 This is a block diagram of an exemplary data processing system 100 for a three-dimensional model of a multi-thickness object in a computer-aided design (CAD) environment, according to one embodiment. The data processing system 100 may be a desktop computer, laptop computer, tablet PC, workstation, etc. Figure 1 In this system, the data processing system 100 includes a processing unit 102, a memory unit 104, a storage unit 106, a bus 108, an input unit 110, and a display unit 112. The data processing system 100 is a dedicated computer configured to trim the cross-shaped geometric model.

[0021] As used herein, processing unit 102 can be any type of computing circuit, such as, but not limited to, a microprocessor, microcontroller, complex instruction set computing microprocessor, reduced instruction set computing microprocessor, very long instruction word microprocessor, explicit parallel instruction computing microprocessor, graphics processor, digital signal processor, or any other type of processing circuit. Processing unit 102 may also include an embedded controller, such as a general-purpose or programmable logic device or array, application-specific integrated circuit, single-chip computer, etc.

[0022] Accessible memory cell 104 may be non-transitory volatile memory and non-volatile memory. Memory cell 104 may be coupled for communication with processing unit 102, such as as a computer-readable storage medium. Processing unit 102 may execute instructions and / or code stored in memory cell 104. Various computer-readable instructions may be stored in and accessed from memory cell 104. Memory cell 104 may include any suitable element for storing data and machine-readable instructions, such as read-only memory, random access memory, erasable programmable read-only memory, electrically erasable programmable read-only memory, hard disk drive, removable media drive for disposing of compact disks, digital video disk, magnetic disk, tape cassette, memory card, etc.

[0023] In this embodiment, memory unit 104 includes a computer-aided design (CAD) module 114 stored in the form of machine-readable instructions on any of the aforementioned storage media, and is communicable to and executed by processing unit 102. When the machine-readable instructions are executed by processing unit 102, CAD module 114 causes processing unit 102 to generate a three-dimensional model of a multi-thickness object in the formed state. The multi-thickness object can be an object with different connection areas of bodies having different thickness values. An example is a printed circuit board (PCB) component, in which two boards of different thicknesses are connected by cables having a thickness different from that of the boards. The formed state is a state in which features are designed in a three-dimensional mode. In the three-dimensional mode, the features are curved or planar. In one embodiment, CAD module 114 is configured to generate the first feature in the formed state based on the thickness value of a first feature of the three-dimensional model of the multi-thickness object and referencing a first virtual reference plane. In one embodiment, the first feature can be a body creation feature, such as a base plane segment (e.g., a printed circuit board). In this embodiment, the first virtual reference plane is a global virtual reference plane and is located at an offset distance from the first feature of the multi-thickness object.

[0024] CAD module 114 is configured to receive a request from a user to generate a second feature of a 3D model. The request includes a thickness value for the second feature and the location of the second feature. In one embodiment, the second feature may include a body extension feature, such as a flexible segment connecting two PCBs. The thickness of the second feature may differ from the thickness of the first feature. CAD module 114 is configured to create a second virtual reference plane aligned with a first virtual reference plane; and to dynamically calculate an offset value in the 3D model relative to the second feature based on the thickness value of the second feature and referencing the second virtual reference plane. In one embodiment, the second virtual reference plane is a local virtual reference plane located at an offset distance from the first virtual reference plane. The offset value indicates the distance the second feature is to be offset from the second virtual reference plane.

[0025] CAD module 114 is further configured to generate the second feature in the formed state based on the thickness value of the second feature of the 3D model, the position and offset value of the second feature, and a reference to a second virtual reference plane. The generated second feature is offset from the second virtual reference plane by the offset value. CAD module 114 is configured to output a 3D model of the multi-thickness object in the formed state, including the first and second features. Furthermore, CAD module 114 is configured to convert the 3D model of the multi-thickness object in the formed state into a flattened state. The flattened state is the state of the multi-thickness object when all surfaces in the multi-thickness object have been converted into planes based on the position of the neutral layer. The neutral layer is defined as a layer in the material in which there is neither tension nor compression. Figure 2 The method actions performed by the processing unit 102 to achieve the above functions are described in more detail below.

[0026] Storage unit 106 may be a non-temporary storage medium for storing a geometric model database 116. The geometric model database 116 stores three-dimensional models of objects with multiple thicknesses. Input unit 110 may include an input device capable of receiving input signals, such as those for requesting the generation of features in the three-dimensional model, such as a keypad, a touch-sensitive display, a camera (e.g., a camera that receives gesture-based input), etc. Display unit 112 may be a device with a graphical user interface that displays a multi-dimensional visual representation of the three-dimensional model. The graphical user interface may also enable the user to request the generation of the three-dimensional model, request the generation of features in the three-dimensional model, select the thickness value of a feature, and select the position of a feature. Bus 108 serves as an interconnection between processing unit 102, memory unit 104, storage unit 106, input unit 110, and display unit 112.

[0027] Those skilled in the art will understand that Figure 1The hardware depicted may vary for a particular implementation. For example, in addition to or replacing the depicted hardware, other peripheral devices such as optical disc drives, local area network (LAN) / wide area network (WAN) / wireless (e.g., Wi-Fi) adapters, graphics adapters, disk controllers, and input / output (I / O) adapters may be used. The examples depicted are provided for illustrative purposes only and are not intended to imply any architectural limitations with respect to this disclosure.

[0028] The data processing system 100 according to an embodiment of this disclosure includes an operating system employing a graphical user interface. The operating system allows multiple display windows, each providing an interface to different applications or different instances of the same application, to be simultaneously presented in the graphical user interface. A cursor in the graphical user interface can be manipulated by a user using a pointing device. The cursor position can be changed and / or events such as clicking a mouse button can be generated to induce a desired response.

[0029] With appropriate modifications, one of various commercial operating systems can be used, such as Microsoft Windows, a product of Microsoft Corporation located in Redmond, Washington. TM Version of [the document / disclosure]. Modify or create an operating system according to this disclosure as described.

[0030] Figure 2 This is a flowchart 200 illustrating an exemplary method for generating a 3D model of a multi-thickness object in a CAD environment according to one embodiment. At action 202, a first virtual reference plane is generated in the CAD environment. At action 204, the first feature is generated in the formed state based on a first thickness value of a first feature of the 3D model of the multi-thickness object and reference to the first virtual reference plane. The first virtual reference plane is positioned opposite to the thickness direction of the first feature.

[0031] At action 206, a request to generate a second feature of the 3D model is received from the user. This request includes a second thickness value for the second feature and the position of the second feature. The thickness of the second feature differs from the thickness of the first feature. At action 208, a second virtual reference plane aligned with the first virtual reference plane is created.

[0032] At action 210, an offset value for the second feature in the 3D model is dynamically calculated based on a second thickness value. In some embodiments, elements of the first feature are determined for creating the second feature based on the position of the second feature. For example, elements of the first feature may be edges or faces of the first feature. Accordingly, an offset value for the second feature is dynamically calculated based on the determined elements and the second thickness value of the second feature, with reference to a second virtual reference plane. The offset value indicates the distance by which the second feature is offset from the second virtual reference plane. In some embodiments, a relative offset from the second virtual reference plane is calculated based on the thickness and offset of the first and second features, such that the first and second virtual reference planes are aligned. In these embodiments, the relative offset is calculated based on whether the face or edge of the first feature selected for generating the second feature is on a reference side or a non-reference side. The reference side is the side of the first feature that coincides with the first virtual reference plane, and the non-reference side is the side opposite to the reference side. If the selected face or edge is on the reference side, the relative offset is a positive offset value, and if the selected face or edge is on the non-reference side, the relative offset is a negative offset value. If a face or edge is on a non-reference side, then the thickness of the first feature and the thickness of the second feature are not considered in the calculation of the relative offset.

[0033] At action 212, the second feature is generated in the formed state based on the second thickness value, the position and offset value of the second feature of the 3D model, and a reference to the second virtual reference plane. The generated second feature is offset from the second virtual reference plane by the offset value. At action 214, the 3D model of the multi-thickness object in the formed state, including the first feature and the second feature, is output on the display unit 110. The first feature and the second feature may belong to the same area or different areas.

[0034] At action 216, the 3D model of the multi-thickness object in the formed state is converted into a flattened state. In the flattened state, the first virtual reference plane and the second virtual reference plane are located on the global virtual reference plane. Moreover, the second feature is offset from the global virtual reference plane in the flattened state by this offset value. Furthermore, in the flattened state, the region definitions associated with the first feature and the second feature remain intact.

[0035] Figure 3 This is a schematic representation of a data processing system 300 for a three-dimensional model of a multi-thickness object in a CAD environment, according to another embodiment. For example, the data processing system 300 includes a cloud computing system 302 configured to provide cloud services for designing multi-thickness objects.

[0036] The cloud computing system 302 includes a cloud communication interface 306, cloud computing hardware and OS 308, a cloud computing platform 310, a CAD module 114, and a geometric model database 116. The cloud communication interface 306 enables communication between the cloud computing platform 310 and user devices 312A-N (such as smartphones, tablets, computers, etc.) via a network 304.

[0037] The cloud computing hardware and OS 308 may include one or more servers on which an operating system (OS) is installed, and include one or more processing units, one or more storage devices for storing data, and other peripheral devices for providing cloud computing capabilities. The cloud computing platform 310 is a platform that implements functions on the cloud hardware and OS 308, such as data storage, data analysis, data visualization, and data communication, via application programming interfaces (APIs) and algorithms; and delivers the aforementioned cloud services using cloud-based applications (e.g., computer-aided design applications). The cloud computing platform 310 employs a CAD module 114 for generating three-dimensional models of multi-thickness objects, such as... Figure 2 As described in [the original text]. The cloud computing platform 310 also includes: a geometric model database 116 for storing 3D models; and / or computer-aided design files for manufacturing parts using additive manufacturing processes. The cloud computing platform 310 may include a combination of dedicated hardware and software built on top of cloud hardware and OS 308.

[0038] According to the foregoing embodiments, the cloud computing system 302 enables users to generate 3D models of objects with multiple thicknesses within a CAD environment. For example, the CAD module 114 is configured to generate the first feature in a formed state based on the thickness value of a first feature of the 3D model of the multiple-thickness object and referencing a first virtual reference plane. The CAD module 114 is also configured to receive a request from the user to generate a second feature of the 3D model. This request includes the thickness value of the second feature and the position of the second feature. The thickness of the second feature differs from the thickness of the first feature.

[0039] CAD module 114 is configured to: create a second virtual reference plane aligned with a first virtual reference plane; and dynamically calculate an offset value for the second feature in the 3D model based on the thickness value of the second feature and referencing the second virtual reference plane. The offset value indicates the distance by which the second feature is offset from the second virtual reference plane. CAD module 114 is also configured to: generate a second feature of the 3D model in the formed state based on the thickness value of the second feature, the position and offset value of the second feature, and referencing the second virtual reference plane. The generated second feature is offset from the second virtual reference plane by this offset value. CAD model 114 is also configured to: output a 3D model of a multi-thickness object in the formed state, including the first and second features. Furthermore, CAD model 114 is configured to: convert the 3D model of the multi-thickness object in the formed state into a flattened state.

[0040] User equipment 312A-N includes a graphical user interface 314A-N for receiving selections of CAD commands, providing inputs such as the thickness and location of features, and displaying a CAD environment with a 3D model. Each of user equipment 312A-N may be provided with a communication interface for interfacing with cloud computing system 302. Users of user equipment 312A-N can access cloud computing system 302 via graphical user interface 314A-N. For example, a user can send a request to cloud computing system 302 to generate a 3D model of a multi-thickness object. Graphical user interface 314A-N may be specifically configured to access CAD module 114 in cloud computing system 302.

[0041] Figure 4 A block diagram of a data processing system 400 for generating three-dimensional models of multi-thickness objects in a CAD environment, according to yet another embodiment, is illustrated. For example, the data processing system 400 includes a server 402 and a plurality of user devices 406A-N. Each of the plurality of user devices 406A-N is connected to the server 402 via a network 404 (e.g., a local area network (LAN), a wide area network (WAN), Wi-Fi, etc.). The data processing system 400 is... Figure 1 Another implementation of the data processing system 100 is that the CAD module 114 resides in the server 402 and is accessed by the user equipment 406A-N via the network 404.

[0042] Server 402 includes a CAD module 114 and a geometric model database 116. Server 402 may also include a processing unit, a memory unit, and a storage unit. The CAD module 114 may be stored on the memory in the form of machine-readable instructions executable by the processing unit. The geometric model database 116 may be stored in the storage unit. Server 402 may also include a communication interface for communicating with client devices 406A-N via network 404.

[0043] When machine-readable instructions are executed, CAD module 114 causes server 402 to generate a 3D model of a multi-thickness object. For example, CAD module 114 is configured to generate the first feature in the formed state based on the thickness value of a first feature of the 3D model of the multi-thickness object and referencing a first virtual reference plane. CAD module 114 is configured to receive a request from a user to generate a second feature of the 3D model. The request includes the thickness value of the second feature and the position of the second feature. The thickness of the second feature is different from the thickness of the first feature. CAD module 114 is configured to create a second virtual reference plane aligned with the first virtual reference plane; and to dynamically calculate an offset value in the 3D model relative to the second feature based on the thickness value of the second feature and referencing the second virtual reference plane. The offset value indicates the distance by which the second feature is offset from the second virtual reference plane.

[0044] CAD module 114 is further configured to generate the second feature in the formed state based on the thickness value of a second feature of the 3D model, the position and offset value of the second feature, and a reference to a second virtual reference plane. The generated second feature is offset from the second virtual reference plane by the offset value. CAD module 114 is also configured to output a 3D model of a multi-thickness object in the formed state, including the first and second features. Furthermore, CAD module 114 is configured to convert the 3D model of the multi-thickness object in the formed state into a flattened state. Figure 2 The method and actions performed by server 402 to achieve the above functions are described in more detail.

[0045] User equipment 406A-N includes a graphical user interface 408A-N for receiving CAD command selections and displaying a CAD environment including a 3D model. Each of user equipment 406A-N may be provided with a communication interface for interfacing with server 402. A user of user equipment 406A-N can access server 402 via graphical user interface 408A-N. For example, a user can send a request to server 402 to generate a 3D model of a multi-thickness object. Graphical user interface 408A-N may be specifically configured to access CAD module 114 in server 402.

[0046] Figure 5A-D are graphical user interface views 500, 525, 550, and 575, respectively, depicting a generated graphical user interface view 595 of a 3D model 595 for a flexible printed circuit board (PCB) assembly according to one embodiment. As shown in the graphical user interface 500, a subject creation feature 505 (e.g., PCB) is created in region 510. The subject creation feature 505 defines a global virtual reference plane 515 for the PCB assembly. In one embodiment, region 510 has a zero offset relative to the global virtual reference plane 515, such as... Figure 5A As shown in the diagram. In another embodiment, region 510 may have a non-zero offset relative to the global virtual reference plane 515.

[0047] refer to Figure 5B The graphical user interface view 525 depicts the creation of a main extension feature 530 (e.g., a flexible segment of a PCB assembly) in region 535. A local virtual reference plane 540 is created in alignment with the global virtual reference plane 515. Subsequently, the main extension feature 530 is generated in region 535 at an offset from the local virtual reference plane 540, based on the thickness of the main extension feature 530 and the region definition in the flat state of the PCB assembly.

[0048] refer to Figure 5C The graphical user interface view 550 depicts the creation of a main extension feature 555 (e.g., a flexible segment of a PCB cell) within region 535. A local virtual reference plane 540 extends at the orientation of the main extension feature 555 within region 535. An offset from the local virtual reference plane 540 is calculated based on the thickness and flatness of the region definition of the main extension feature 555. The main extension feature 555 is created within region 535 at the calculated offset from the local virtual reference plane 540.

[0049] refer to Figure 5D The graphical user interface view 575 depicts the creation of a main connection feature 580 (e.g., a PCB) in zone 585. A global virtual reference plane 590 is created in zone 585, aligned with a local virtual reference plane 540 and a global virtual reference plane 515. Accordingly, the main connection feature 580 is generated in zone 585 with reference to the global virtual reference plane 590. Thus, a 3D model 595 of the PCB assembly is generated directly in the formed state, such that the zone definitions in the flat state are respected and the local virtual reference plane 540 is aligned with the global virtual reference plane 515 and the global virtual reference plane 590 in the flat state. Moreover, modifications to one zone do indeed affect downstream features in other zones, as expected by industry standards. The above method provides that each zone has an appropriate position in the flat state.

[0050] Figures 6A-6BThese are graphical user interface views 600 and 650 depicting a PCB assembly in a formed state and a flat state according to one embodiment. Reference Figure 6A The graphical user interface view 600 depicts the situation according to the... Figure 2 The action described herein generates a 3D model 605 of the PCB assembly in the formed state. The 3D model 605 includes multiple zones 610, 615, 620, and 625. Zones 610 and 620 contain the PCB, and zones 615 and 625 respectively contain flexible segments connecting the PCBs in zones 610 and 620. As shown, zone 610 contains the main creation feature defining a global virtual reference plane 630. The features in zones 615, 620, and 625 have different thicknesses and are offset from the global virtual reference plane 630.

[0051] refer to Figure 6B The global user interface view 650 depicts a two-dimensional model 655 of the PCB components in a flat state. Areas 615, 620, and 625 are offset from the global virtual reference plane by offset values ​​660, 665, and 670, respectively. Figure 6B This shows the area definition that does not affect PCB components in a flat state.

[0052] Of course, those skilled in the art will recognize that, unless specifically instructed or required by the sequence of operations, certain actions in the process described above may be omitted, performed simultaneously or sequentially, or performed in a different order.

[0053] Those skilled in the art will recognize that, for the sake of brevity and clarity, this document does not depict or describe the complete structure and operation of all data processing systems suitable for use with respect to this disclosure. Instead, only those data processing systems that are unique to or necessary for understanding this disclosure are depicted and described. The remainder of the construction and operation of the data processing systems may conform to any of the various current implementations and practices known in the art.

[0054] The systems and methods described herein can be implemented in various forms, including hardware, software, firmware, dedicated processors, or combinations thereof. One or more of the embodiments described herein may take the form of a computer program product comprising program modules accessible from a computer-usable or computer-readable medium storing program code for use by or in conjunction with one or more computers, processors, or instruction execution systems. For the purposes of this description, a computer-usable or computer-readable medium can be any means that can contain, store, transmit, propagate, or transmit a program for use by or in conjunction with an instruction execution system, apparatus, or device. The medium can be an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system (or apparatus or device), or a propagation medium within or in itself, since signal carriers are not included in the definition of a physical computer-readable medium. Physical computer-readable media can include semiconductor or solid-state memory, magnetic tape, removable computer disks, random access memory (RAM), read-only memory (ROM), rigid disks, and optical disks, such as compact disc read-only memory (CD-ROM), compact disc read / write, and digital versatile discs (DVDs). The processors and program code used to implement each aspect of the technology can both be centralized or distributed (or a combination thereof), as is known to those skilled in the art.

[0055] While this disclosure has been described in detail with reference to certain embodiments, it should be understood that this disclosure is not limited to those embodiments. In view of this disclosure, many modifications and variations will be apparent to those skilled in the art without departing from the scope of the various embodiments of this disclosure, as described herein. Therefore, the scope of this disclosure is indicated by the following claims, rather than by the foregoing description. All changes, modifications, and variations falling within the meaning and scope of equivalents of the claims are to be considered within their scope.

Claims

1. A method for generating a three-dimensional (3D) model of a multi-thickness PCB in a computer-aided design (CAD) environment in a formed state, the method comprising: The data processing system generates the first feature of the 3D model in the formed state based on the first thickness value of the first feature of the 3D model of the multi-thickness printed circuit board (PCB) and a reference to the first virtual reference plane; The data processing system receives a request from the user via a graphical user interface to generate a second feature of the 3D model, wherein the request includes a second thickness value of the second feature and the position of the second feature; The data processing system creates a second virtual reference plane aligned with the first virtual reference plane in the flattened state; The data processing system dynamically calculates the offset value for the second feature in the 3D model based on the second thickness value and with reference to the second virtual reference plane, wherein the offset value indicates the distance by which the second feature is offset from the second virtual reference plane; The data processing system generates the second feature in the formed state based on the second thickness value, the position and offset value of the second feature of the 3D model, and with reference to the second virtual reference plane, wherein the generated second feature is offset from the second virtual reference plane by the offset value; The graphical user interface displays a 3D model of a multi-thickness PCB in the CAD environment, including the first feature and the second feature, in the formed state. as well as The multi-thickness PCB having the first feature and the second feature is manufactured by an additive manufacturing process based on the 3D model of the multi-thickness PCB.

2. The method of claim 1, further comprising: The 3D model of the multi-thickness PCB in the formed state is converted into a flat state.

3. The method of claim 2, wherein the first virtual reference plane and the second virtual reference plane are located on the global virtual reference plane in the flattened state, and The second feature of the 3D model is offset from the global virtual reference plane in the flattened state by the offset value.

4. The method of claim 1, wherein dynamically calculating the offset value in the 3D model relative to the second feature based on the second thickness value and with reference to the second virtual reference plane comprises: Determine the element of the first feature used to create the second feature; as well as The offset value for the second feature is dynamically calculated based on the determined element and the second thickness value of the second feature, with reference to the second virtual reference plane.

5. The method of claim 1, wherein the first feature and the second feature belong to the same region or different regions.

6. The method of claim 1, further comprising: The first virtual reference plane is created in the CAD environment.

7. A data processing system for generating three-dimensional (3D) models of PCBs with multiple thicknesses, comprising: Processing unit; as well as A memory unit, communicatively coupled to the processing unit, wherein the memory unit includes a computer-aided design (CAD) module, the CAD module being configured to: The first feature is generated in the formed state based on the first thickness value of the first feature of the three-dimensional (3D) model of the multi-thickness printed circuit board (PCB) and a reference to the first virtual reference plane; A request to generate a second feature of the 3D model is received from the user via a graphical user interface, wherein the request includes a second thickness value of the second feature and the position of the second feature; Create a second virtual reference plane aligned with the first virtual reference plane; The offset value for the second feature in the 3D model is dynamically calculated based on the second thickness value and with reference to the second virtual reference plane, wherein the offset value indicates the distance by which the second feature is offset from the second virtual reference plane; Based on the second thickness value, the position and offset value of the second feature of the 3D model, and with reference to the second virtual reference plane, the second feature is generated in the formed state, wherein the generated second feature is offset from the second virtual reference plane by the offset value; A 3D model of a multi-thickness PCB in a formed state, including the first feature and the second feature, is displayed on the graphical user interface; and Store a 3D model of the multi-thickness PCB for manufacturing the multi-thickness PCB, having the first feature and the second feature.

8. The data processing system of claim 7, wherein the CAD module is configured to convert the 3D model of the multi-thickness PCB in the formed state into a flat state.

9. The data processing system of claim 8, wherein the first virtual reference plane and the second virtual reference plane are located on the global virtual reference plane in the flattened state, and The second feature is offset from the global virtual reference plane in the flat state by the offset value.

10. The data processing system of claim 7, wherein in dynamically calculating the offset value of the 3D model relative to the second feature based on the second thickness value and referencing the second virtual reference plane, the CAD module is configured to: Determine the element for creating the second feature of the first feature; and The offset value for the second feature is dynamically calculated based on the determined element and the second thickness value of the second feature, with reference to the second virtual reference plane.

11. The data processing system of claim 7, wherein the first feature and the second feature belong to the same region or different regions.

12. The data processing system of claim 7, wherein the CAD module is further configured to: create the first virtual reference plane in a CAD environment.

13. A non-transitory computer-readable storage medium storing machine-readable instructions executable by a data processing system to generate a three-dimensional (3D) model of a multi-thickness PCB, the machine-readable instructions comprising: The first feature is generated in the formed state based on the first thickness value of the first feature of the 3D model of the multi-thickness printed circuit board (PCB) and a reference to the first virtual reference plane; A request to generate a second feature of the 3D model is received from the user via a graphical user interface, wherein the request includes a second thickness value of the second feature and the position of the second feature; Create a second virtual reference plane aligned with the first virtual reference plane; The offset value for the second feature in the 3D model is dynamically calculated based on the second thickness value and with reference to the second virtual reference plane, wherein the offset value indicates the distance by which the second feature is offset from the second virtual reference plane; Based on the second thickness value, the position and offset value of the second feature of the 3D model, and with reference to the second virtual reference plane, the second feature is generated in the formed state, wherein the generated second feature is offset from the second virtual reference plane by the offset value; A 3D model of a multi-thickness PCB in a formed state, including the first feature and the second feature, is displayed on the graphical user interface; and Store a 3D model of the multi-thickness PCB for manufacturing the multi-thickness PCB, having the first feature and the second feature.

14. The non-transitory computer-readable storage medium of claim 13, wherein the machine-readable instructions further comprise: The 3D model of the multi-thickness PCB in the formed state is converted into a flat state.

15. The non-transitory computer-readable storage medium of claim 14, wherein the first virtual reference plane and the second virtual reference plane are located on the global virtual reference plane in the flattened state, and The second feature is offset from the global virtual reference plane in the flat state by the offset value.

16. The non-transitory computer-readable storage medium of claim 13, wherein dynamically calculating the offset value in the 3D model relative to the second feature based on the second thickness value and referencing the second virtual reference plane comprises: Determine the element of the first feature used to create the second feature; as well as The offset value for the second feature is dynamically calculated based on the determined element and the second thickness value of the second feature, with reference to the second virtual reference plane.

17. The non-transitory computer-readable storage medium of claim 13, wherein the machine-readable instructions further comprise: Create the first virtual reference plane in the CAD environment.

Images