Mini LED backlight module and display device

Abstract

The present application discloses a Mini LED backlight module and a display device, which relates to the field of display technology. The Mini LED backlight module includes a back panel, a heat sink and an LED light board. The heat sink is arranged on the back panel and is made of metal indium material. The LED light board is arranged on the heat sink. The back panel, the heat sink and the LED light board are attached to each other in sequence, and the heat sink and the LED light board are fixed on the back panel. Through the above design, the heat conduction effect of the LED light board can be greatly improved, so that the Mini LED backlight module has a good heat dissipation effect, thereby improving the luminous brightness of the LED.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a Mini LED backlight module and a display device. Background Art

[0002] In recent years, Mini LED has been widely used in direct-type backlight modules. Compared with traditional LED backlight sources, Mini LED backlight technology achieves thin and light LCD panels, high image quality, and low power consumption by arranging thousands of narrow-pitch light-emitting diodes with a size of several hundred microns. Its performance level is close to that of OLED, and it is superior to OLED in terms of brightness and color rendering. In addition, Mini LED backlight can be combined with sophisticated local dimming technology to control the switch and brightness adjustment of the corresponding backlight area in real time according to the bright and dark fields in various parts of the picture in the TV signal, which can make the black area darker, present high contrast, and more vivid colors, achieving a high dynamic range (HDR) screen effect.

[0003] At present, heat dissipation technology is the main bottleneck of Mini LED technology. The heat dissipation effect of current LED light panels is poor, so the brightness of the LED is limited by the heat dissipation bottleneck. Summary of the invention

[0004] The purpose of this application is to provide a Mini LED backlight module and a display device, which can improve the heat dissipation effect of the Mini LED backlight module and thereby improve the brightness of the LED.

[0005] The present application discloses a Mini LED backlight module, which includes a back panel, a heat sink and an LED light board. The heat sink is arranged on the back panel and is made of at least metal indium material; the LED light board is arranged on the heat sink, and the back panel, heat sink and LED light board are attached to each other in sequence, and the heat sink and the LED light board are fixed on the back panel.

[0006] Optionally, a side of the heat sink facing the LED light board is provided with a plurality of first needle spikes distributed in an array, and a side of the heat sink facing the back plate is provided with a plurality of second needle spikes distributed in an array; a side of the LED light board facing the heat sink is provided with a plurality of first pits distributed in an array, and the first pits correspond to the first needle spikes; a side of the back plate facing the heat sink is provided with a plurality of second pits distributed in an array, and the second pits correspond to the second needle spikes.

[0007] Optionally, the first acupuncture and the second acupuncture have the same shape, and the orthographic projection of the first acupuncture on the backboard coincides with the orthographic projection of the second acupuncture on the backboard.

[0008] Optionally, the depth of the first pit and the second pit is 0.01-0.03mm, the diameter is 0.01-0.03mm, and the interval between adjacent first pits and adjacent second pits is 0.01-0.05mm; the thickness of the heat sink is 0.1-0.15mm, and the diameter of the first needle puncture and the second needle puncture gradually decreases in the direction away from the heat sink, the diameter of the end of the first needle puncture and the second needle puncture connected to the heat sink is 0.01-0.03mm, and the height of the first needle puncture and the second needle puncture is 0.05-0.06mm.

[0009] Optionally, the first pit is formed by sandblasting the surface of the LED lamp board, and the second pit is formed by sandblasting the surface of the back panel; the first needling and the second needling are formed by powder metallurgy.

[0010] Optionally, the Mini LED backlight module also includes a diffusion plate, the LED light board and the heat sink are arranged on the bottom plate of the back plate, and the edge of the diffusion plate is arranged on the side plate of the back plate; the Mini LED backlight module also includes a support column, the support column is located between the bottom plate of the back plate and the diffusion plate, the support column includes a connected threaded portion and a supporting portion, a plurality of threaded holes are provided on the bottom plate of the back plate, a plurality of first through holes are provided at positions of the heat sink corresponding to the threaded holes, a plurality of second through holes are provided at positions of the LED light board corresponding to the threaded holes, the threaded portion passes through the second through holes and the first through holes, and is matched and connected with the threaded holes; the area of ​​the orthographic projection of the support portion on the bottom plate of the back plate is greater than the area of ​​the orthographic projection of the second through hole on the bottom plate of the back plate, and the support column abuts against the LED light board.

[0011] Optionally, the Mini LED backlight module also includes a plurality of washers, wherein the washers are arranged on the LED light board and correspond to the second through holes, and the distance between a side of the washer away from the LED light board and the bottom of the threaded hole is greater than the length of the threaded portion; the threaded portion passes through the washer, the second through hole and the first through hole, and is connected with the threaded hole in cooperation; the supporting portion squeezes the washer, the LED light board and the heat sink onto the back panel.

[0012] Optionally, a plurality of heat dissipation teeth are provided on a side of the back plate away from the LED light board.

[0013] Optionally, the orthographic projection of the threaded hole on the heat sink does not overlap with the orthographic projection of the heat dissipation tooth on the heat sink, and the threaded hole passes through the back plate.

[0014] The present application also discloses a display device, which includes a display panel and the Mini LED backlight module as described above, and the Mini LED backlight module provides backlight for the display panel.

[0015] Compared with the solution of simply transferring the heat on the lamp board to the back panel for heat dissipation through thermal conductive adhesive, the present application adds a heat sink made of metal indium material between the back panel and the LED lamp board, and the back panel, heat sink and LED lamp board are attached to each other in sequence, so that the heat on the LED lamp board is transferred to the back panel for heat dissipation through the heat sink; since the thermal conductivity of metal indium is 86w / mK, while the thermal conductivity of thermal conductive adhesive is only about 1w / mK, the thermal conductivity of metal indium is about 86 times that of thermal conductive adhesive, which can greatly improve the thermal conductivity of the LED lamp board, so that the Mini LED backlight module has a better heat dissipation effect, thereby improving the brightness of the LED; and, since indium is a relatively soft metal, it can adaptively deform after being subjected to the force of the back panel and the LED lamp board, thereby avoiding the problem of LED lamp board warping like other hard metals. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0017] Figure 1 is a cross-sectional schematic diagram of a Mini LED backlight module provided in the first embodiment of the present application;

[0018] Figure 2 is a microscopic schematic diagram of a Mini LED backlight module in a first state provided by the second embodiment of the present application;

[0019] Figure 3 is a microscopic schematic diagram of the Mini LED backlight module in the first embodiment of the present application;

[0020] Figure 4 is a cross-sectional schematic diagram of a Mini LED backlight module provided in the second embodiment of the present application;

[0021] Figure 5 is a microscopic schematic diagram of a Mini LED backlight module in a second state provided by the second embodiment of the present application;

[0022] Figure 6is a cross-sectional schematic diagram of another Mini LED backlight module provided in the second embodiment of the present application;

[0023] Figure 7 It is a partial schematic diagram of a display device provided by the present application.

[0024] Among them, 10, display device; 100, Mini LED backlight module; 110, back panel; 111, second pit; 112, threaded hole; 120, heat sink; 121, first acupuncture; 122, second acupuncture; 130, LED light board; 131, first pit; 140, diffusion plate; 150, support column; 151, threaded portion; 152, support portion; 160, gasket; 170, heat dissipation teeth; 200, display panel. DETAILED DESCRIPTION

[0025] It should be understood that the terms used herein, the specific structures and functional details disclosed are only for describing specific embodiments and are representative, but the present application can be implemented in many alternative forms and should not be construed as being limited to only the embodiments described herein.

[0026] In the description of the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating relative importance or implicitly indicating the number of the indicated technical features. In addition, terms such as "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicating orientation or positional relationship are described based on the orientation or relative positional relationship shown in the accompanying drawings, and are only simplified descriptions for the convenience of describing the present application, rather than indicating that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the present application.

[0027] The present application is described in detail below with reference to the accompanying drawings and optional embodiments.

[0028] like Figure 1 As shown, Figure 1 It is a cross-sectional schematic diagram of a Mini LED backlight module provided in the first embodiment of the present application. The embodiment of the present application provides a Mini LED backlight module 100, and the Mini LED backlight module 100 includes a back panel 110, a heat sink 120 and an LED light board 130. The heat sink 120 is arranged on the back panel 110 and is made of at least metal indium material; the LED light board 130 is arranged on the heat sink 120, and the back panel 110, the heat sink 120 and the LED light board 130 are attached to each other in sequence, and the heat sink 120 and the LED light board 130 are fixed on the back panel 110.

[0029] In the embodiment of the present application, there is no need to process the surfaces of the back panel 110, the heat sink 120 and the LED light board 130. A flat heat sink 120 can be directly stacked on the back panel 110, and then the LED light board 130 can be stacked on the heat sink 120. At this time, the two sides of the heat sink 120 can be respectively attached to the back panel 110 and the LED light board 130, so as to achieve a good heat dissipation effect; further, the LED light board 130 and the heat sink 120 can be pressed onto the back panel 110 in sequence. Specifically, the LED light board 130 and the heat sink 120 can be fixed to the back panel 110 by screws, rivets, clamping, etc., so that the LED light board 130 and the back panel 110 have a larger extrusion force on the heat sink 120, thereby further increasing the contact area with the heat sink 120.

[0030] like Figure 2 As shown, Figure 2 It is a microscopic schematic diagram of a Mini LED backlight module in a first state provided by the second embodiment of the present application. The first state is the state of the Mini LED backlight module 100 when it is not assembled. Compared with the first embodiment, in the embodiment of the present application, the surfaces of the back plate 110, the heat sink 120 and the LED light board 130 are processed, so that pits are arranged on the side of the back plate 110 and the LED light board 130 facing the heat sink 120, and punctures are arranged on both sides of the heat sink 120.

[0031] Specifically, a side of the heat sink 120 facing the LED light board 130 is provided with a plurality of first needle punctures 121 distributed in an array, and a side of the heat sink 120 facing the back panel 110 is provided with a plurality of second needle punctures 122 distributed in an array; a side of the LED light board 130 facing the heat sink 120 is provided with a plurality of first pits 131 distributed in an array, and the first pits 131 correspond to the first needle punctures 121; a side of the back panel 110 facing the heat sink 120 is provided with a plurality of second pits 111 distributed in an array, and the second pits 111 correspond to the second needle punctures 122.

[0032] like Figure 3 As shown, it is a microscopic schematic diagram of the Mini LED backlight module in the first embodiment of the present application. It can be seen in the microscopic view that when the back panel 110 or the LED light panel 130 is in contact with the heat sink 120 (indium sheet), since the surfaces of the three cannot be absolutely flat, there are gaps on the contact surface, which leads to reduced heat transfer efficiency.

[0033] Based on this, the embodiment of the present application performs special treatment on the heat sink 120, the back plate 110, and the LED light board 130. Since indium is a relatively soft metal, after the heat sink 120 contacts the back plate 110 and the LED light board 130 and is subjected to the pressure brought by the LED light board 130, the needle punctures on the heat sink 120 will be squeezed into the pits of the back plate 110 and the LED light board 130, thereby increasing the contact area between the heat sink 120 and the back plate 110 and the LED light board 130, thereby facilitating improving the thermal conductivity of the heat sink 120.

[0034] As a specific implementation, this implementation processes the heat sink 120, the back panel 110, and the LED light board 130 at the microscopic level. Specifically, the first pit 131 is formed by sandblasting the surface of the LED light board 130, and the second pit 111 is formed by sandblasting the surface of the back panel 110; the first needling 121 and the second needling 122 are formed by powder metallurgy.

[0035] Among them, the first pit 131 and the second pit 111 are arc-shaped pits, and the depth is 0.01-0.03mm, the diameter is 0.01-0.03mm, and the interval between adjacent first pits 131 and adjacent second pits 111 is 0.01-0.05mm; the thickness of the heat sink 120 is 0.1-0.15mm, specifically 0.1mm, to avoid the cost increase caused by the excessive thickness of the heat sink 120; the shape of the first acupuncture 121 and the second acupuncture 122 is triangular, that is, the diameter of the first acupuncture 121 and the second acupuncture 122 gradually decreases in the direction away from the heat sink 120; the diameter of the end of the first acupuncture 121 and the second acupuncture 122 connected to the heat sink 120 is 0.01-0.03mm, and the height of the first acupuncture 121 and the second acupuncture 122 is 0.05-0.06mm.

[0036] When fixing the LED light board 130, the heat sink 120 and the back plate 110, the first needle 121 and the second needle 122 are inserted into the first pit 131 and the second pit 111 respectively. Since the height of the first needle 121 and the second needle 122 is slightly greater than the depth of the first pit 131 and the second pit 111, and the first needle 121 and the second needle 122 are small in volume and have sharp corners at the top, they are easily deformed and can fill the first pit 131 and the second pit 111, thereby reducing the gap between the heat sink 120 and the LED light board 130 and the back plate 110, and increasing the heat conduction area and heat conduction effect.

[0037] It should be noted that in this embodiment, there is no need for one-to-one correspondence between the first pit 131 and the first needle 121, and between the second pit 111 and the second needle 122, that is, the first pit 131 and the first needle 121 do not need to maintain the same shape and number, and the second pit 111 and the second needle 122 do not need to maintain the same shape and number; a first pit 131 or a second pit 111 may be filled with multiple needles, or the volume of the needles is greater than the capacity of the pit. Even, the first pits 131 on the LED light board 130 may be arranged irregularly, and the shape of each first pit 131 is different; the second pits 111 on the back plate 110 may also be arranged irregularly, and the shape of each second pit 111 is different; the first needle 121 and the second needle 122 on the heat sink 120 may also be arranged irregularly, and the shape of each first needle 121 and the second needle 122 is different. By using the above-mentioned sandblasting and powder metallurgy methods, dense and microscopic pits or needle punctures can be formed on the surfaces of the LED lamp board 130, the back plate 110 and the heat sink 120, which can further improve the bonding effect at a microscopic level.

[0038] Moreover, in this embodiment, the treatment degree of both sides of the heat sink 120 is the same, and at this time, it is ensured as much as possible that the shapes of the first needle puncture 121 and the second needle puncture 122 are the same, and the orthographic projection of the first needle puncture 121 on the back plate 110 coincides with the orthographic projection of the second needle puncture 122 on the back plate 110; and the surface treatment degree of the LED light board 130 and the back plate 110 is also the same. In this way, even if the heat sink 120 is turned over so that the first needle puncture 121 matches the second pit 111 and the second needle puncture 122 matches the first pit 131, it will not affect the bonding effect of the heat sink 120 with the LED light board 130 and the back plate 110. Therefore, when placing the heat sink 120, it is not necessary to consider which side of the heat sink 120 faces down and which side faces up, which facilitates the installation of the heat sink 120 and helps to improve the installation efficiency of the heat sink 120.

[0039] Of course, it is also possible to process only one side of the heat sink 120 so that one side of the heat sink 120 has punctures, and correspondingly, there are pits on the back panel 110 or the LED light board 130. This can also improve the fitting effect between the heat sink 120 and the back panel 110 or the LED light board 130 to a certain extent.

[0040] As another embodiment, the thickness of the heat sink 120 can be increased, the volume of the first needle puncture 121 and the second needle puncture 122 can be increased, and the capacity of the first pit 131 and the second pit 111 can be increased, so that the first needle puncture 121, the second needle puncture 122, the first pit 131 and the second pit 111 can be seen by the naked eye. Specifically, the first pit 131 and the second pit 111 can be directly formed on the surface of the LED light board 130 and the back panel 110 by a die-casting process, and the first needle puncture 121 and the second needle puncture 122 can be formed on both sides of the heat sink 120 by using powder metallurgy combined with a mold design.

[0041] In this embodiment, compared with the planar bonding method of the back panel 110, the heat sink 120 and the LED light board 130, since the heat sink 120 has a protruding first needle puncture 121 and a second needle puncture 122, the surface of the LED light board 130 has a sunken first pit 131, and the surface of the back panel 110 has a sunken second pit 111, when the needle punctures and the pits are matched, the contact area between the heat sink 120 and the LED light board 130 and the back panel 110 is larger, thereby improving the thermal conductivity effect of the heat sink 120 on the LED light board 130.

[0042] like Figure 4 As shown, as a further implementation of the present embodiment, a connection method among a back panel 110, a heat sink 120 and an LED light board 130 is also disclosed, the Mini LED backlight module 100 also includes a diffusion plate 140, the LED light board 130 and the heat sink 120 are arranged on the bottom plate of the back panel 110, and the edge of the diffusion plate 140 is arranged on the side panel of the back panel 110; specifically, the side panel of the back panel 110 is provided with a notch, and the edge of the diffusion plate 140 is bonded to the notch of the side panel by tape.

[0043] The Mini LED backlight module 100 also includes a support column 150, which is located between the bottom plate of the back plate 110 and the diffuser plate 140. One end of the support column 150 is fixed on the back plate 110, and the other end is located below the diffuser plate 140. A gap of more than 1 mm is reserved between the support column 150 and the diffuser plate 140 to support the diffuser plate 140 when the diffuser plate 140 is bent due to gravity or pressure, thereby preventing the diffuser plate 140 from deforming significantly and affecting the optical performance. Moreover, since the support column 150 does not abut against the diffuser plate 140, the gap between the support column 150 and the diffuser plate 140 is sufficient to prevent the support column 150 from pushing the display panel 200 to death due to deformation of the back plate 110 or tolerance accumulation, thereby causing defects such as scratches on the diaphragm and the polarizer.

[0044] The support column 150 not only fixes the LED light board 130 and the heat sink 120 on the light board, but also pressurizes the LED light board 130 and the heat sink 120, further deforming the heat sink 120 to a greater extent, and further reducing the gap between the heat sink 120 and the LED light board 130 and the back panel 110. Specifically, the support column 150 can be mushroom-shaped or T-shaped, specifically including a connected threaded portion 151 and a support portion 152. A plurality of threaded holes 112 are provided on the bottom plate of the back plate 110, and a plurality of first through holes are provided at positions corresponding to the threaded holes 112 on the heat sink 120, and a plurality of second through holes are provided at positions corresponding to the threaded holes 112 on the LED light board 130, and the threaded portion 151 passes through the second through holes and the first through holes, and is connected with the threaded holes 112; the area of ​​the orthographic projection of the support portion 152 on the bottom plate of the back plate 110 is greater than the area of ​​the orthographic projection of the second through hole on the bottom plate of the back plate 110, and the bottom of the support column 150 abuts against the LED light board 130.

[0045] like Figure 5 As shown, at this time, the Mini LED backlight module 100 has been assembled. After adopting this embodiment, the support column 150 is installed to prevent the diffusion plate 140 from collapsing, and the LED lamp board 130, the heat sink 120, and the back plate 110 are locked and pressurized in combination with screws, so that the softer needle punctures on the surface of the heat sink 120 can fully fill the pit structure of the back plate 110 and the lamp board, and the thermal conductivity and heat transfer efficiency of the indium sheet can be fully utilized, which can greatly improve the current of the LED and increase the number of LEDs to improve the brightness of the Mini LED backlight module 100. Under normal circumstances, the brightness of the Mini LED backlight module 100 can reach 3000Nit.

[0046] In addition, the Mini LED backlight module 100 also includes a plurality of washers 160, which are arranged on the LED light board 130 and correspond to the second through hole. The threaded portion 151 passes through the washer 160, the second through hole and the first through hole and is connected with the threaded hole 112. The supporting portion 152 squeezes the washer 160, the LED light board 130 and the heat sink 120 onto the back panel 110.

[0047] By adding the washer 160, the pressure effect of the support column 150 on the LED light board 130 and the heat sink 120 can be further improved, so as to prevent the LED light board 130 from loosening, so as to cause gaps between the heat transfer bodies and lose the heat conduction efficiency. Moreover, the distance between the side of the washer 160 away from the LED light board 130 and the bottom of the threaded hole 112 is greater than the length of the threaded portion 151; in this way, after the threaded portion 151 is inserted into the threaded hole 112, it cannot contact the bottom of the threaded hole 112 no matter how it is rotated, so that the support column 150 can be tightened according to the specific situation, so that the extrusion force between the LED light board 130, the heat sink 120 and the back plate 110 reaches the maximum, so that the needle punctures on the heat sink 120 are completely deformed and fully filled in the pit, so that the LED light board 130, the heat sink 120 and the back plate 110 are seamlessly fitted.

[0048] Furthermore, if Figure 6 As shown, a plurality of heat dissipation teeth 170 are provided on one side of the back plate 110 away from the LED light board 130 ; the heat dissipation teeth 170 are used to improve the heat dissipation efficiency of the back plate 110 , so that the back plate 110 has a better heat absorption effect on the heat sink 120 .

[0049] Moreover, the orthographic projection of the threaded hole 112 on the heat sink 120 does not overlap with the orthographic projection of the heat dissipation tooth 170 on the heat sink 120, and the threaded hole 112 passes through the back plate 110. Since there is no heat dissipation tooth 170 in the back plate 110 area corresponding to the threaded hole 112, the back plate 110 is thinner here, which makes it convenient to pass the threaded hole 112 through the entire back plate 110. In addition, the bottom of the threaded portion 151 is in contact with the outside air, and the threaded portion 151 can be cooled by the outside air. Since the threaded portion 151 is made of metal material and is in contact with the heat sink 120 and the LED light board 130, the heat on the heat sink 120 and the LED light board 130 can be transferred to the air through the threaded portion 151, thereby accelerating the heat dissipation effect. Of course, the threaded hole 112 may also not pass through the back plate 110.

[0050] like Figure 7As shown, the present application also discloses a display device, the display device 10 includes a display panel 200 and the Mini LED backlight module 100 as described above, and the Mini LED backlight module 100 provides backlight for the display panel 200. The display panel 200 can be a TN (Twisted Nematic) display panel, an IPS (In-Plane Switching) display panel, a VA (Vertical Alignment) display panel or an MVA (Multi-Domain Vertical Alignment) display panel, which is not limited here. The display device 10 provided by the present application can avoid the problem of overheating, which is conducive to improving the display brightness of the display device 10.

[0051] In addition, the inventive concept of the present application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effects will be enhanced.

[0052] The above content is a further detailed description of the present application in combination with specific optional implementation methods, and it cannot be determined that the specific implementation of the present application is limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be deemed to fall within the scope of protection of the present application.

Claims

1. A Mini LED backlight module, characterized in that: include: Back panel; A heat sink is arranged on the back plate, and the heat sink is an indium sheet; as well as An LED light board is arranged on the heat sink; Wherein, the back plate, the heat sink and the LED light board are attached to each other in sequence, and the heat sink and the LED light board are fixed to the back plate; A side of the heat sink facing the LED light board is provided with a plurality of first needle thorns distributed in an array, and a side of the heat sink facing the back plate is provided with a plurality of second needle thorns distributed in an array; A plurality of first pits distributed in an array are provided on one side of the LED light board facing the heat sink, and the first pits correspond to the first punctures; A plurality of second pits distributed in an array are provided on one side of the back plate facing the heat sink, and the second pits correspond to the second needle punctures; The first pit and the second pit have a depth of 0.01-0.03 mm and a diameter of 0.01-0.03 mm, and an interval between adjacent first pits and adjacent second pits is 0.01-0.05 mm; The thickness of the heat sink is 0.1-0.15 mm, and the diameters of the first and second needle punctures gradually decrease in the direction away from the heat sink. The diameters of the ends of the first and second needle punctures connected to the heat sink are 0.01-0.03 mm, and the heights of the first and second needle punctures are 0.05-0.06 mm.

2. The Mini LED backlight module according to claim 1, wherein: The first acupuncture and the second acupuncture have the same shape, and the orthographic projection of the first acupuncture on the backboard coincides with the orthographic projection of the second acupuncture on the backboard.

3. The Mini LED backlight module according to claim 1, wherein: The first concave pit is formed by sandblasting the surface of the LED light board, and the second concave pit is formed by sandblasting the surface of the back plate; The first needling and the second needling are formed by powder metallurgy.

4. The Mini LED backlight module according to any one of claims 1 to 3, characterized in that: The Mini LED backlight module further includes a diffusion plate, the LED light board and the heat sink are arranged on the bottom plate of the back plate, and the edge of the diffusion plate is arranged on the side plate of the back plate; The Mini LED backlight module further includes a support column, the support column is located between the bottom plate of the back plate and the diffusion plate, the support column includes a connected threaded portion and a support portion, a plurality of threaded holes are provided on the bottom plate of the back plate, a plurality of first through holes are provided at positions of the heat sink corresponding to the threaded holes, a plurality of second through holes are provided at positions of the LED light board corresponding to the threaded holes, the threaded portion passes through the second through holes and the first through holes, and is matched and connected with the threaded holes; The area of ​​the orthographic projection of the support portion on the bottom plate of the back plate is larger than the area of ​​the orthographic projection of the second through hole on the bottom plate of the back plate, and the support column abuts against the LED light board.

5. The Mini LED backlight module according to claim 4, wherein: The Mini LED backlight module further includes a plurality of washers, which are arranged on the LED light board and correspond to the second through holes, and the distance between a side of the washer away from the LED light board and the bottom of the threaded hole is greater than the length of the threaded portion; The threaded portion passes through the washer, the second through hole and the first through hole, and is connected with the threaded hole in cooperation; the supporting portion squeezes the washer, the LED light board and the heat sink onto the back plate.

6. The Mini LED backlight module according to claim 4, wherein: A plurality of heat dissipation teeth are arranged on one side of the back plate away from the LED light board.

7. The Mini LED backlight module according to claim 6, wherein: The orthographic projection of the threaded hole on the heat sink does not overlap with the orthographic projection of the heat dissipation tooth on the heat sink, and the threaded hole passes through the back plate.

8. A display device, characterized in that: It comprises a display panel and a Mini LED backlight module as described in any one of claims 1 to 7, wherein the Mini LED backlight module provides backlight for the display panel.

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