Semiconductor processing apparatus

Abstract

A semiconductor processing device includes a liquid supply device and a receiving device. Before a process starts, the receiving device controls an outlet at the bottom of a receiving tank to be closed and moves the receiving tank to a spouting position below the nozzle and above a wafer to be processed. At this time, the liquid supply device controls the nozzle to spout liquid medicine into the receiving tank. A sensing unit detects the real-time flow of the liquid medicine. The liquid medicine in the receiving tank is discharged in real time by a liquid discharge unit. When the real-time flow detected by the sensing unit reaches a preset flow, the receiving device controls the outlet at the bottom of the receiving tank to be opened. The liquid medicine spouted by the nozzle is spouted to the surface of the wafer to be processed through the outlet. The process starts. Thus, the time / flow of the liquid medicine in the process is matched with the setting, the amount or volume of the liquid medicine in the process is sufficient, and the situation that the liquid medicine abnormally drips when the nozzle leaves after the process ends is avoided. Thus, the process effect is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductors, and more particularly to a semiconductor processing device. Background Technology

[0002] The wafer manufacturing process typically includes many steps such as photolithography, ion implantation, etching, chemical mechanical polishing (CMP), and vapor deposition. After these steps, such as CMP, the wafer needs to be cleaned to remove impurities from its surface. If the wafer is not cleaned sufficiently, leaving impurities and / or particles on its surface, it may damage the wafer in the next process, leading to its scrapping.

[0003] Therefore, how to remove impurities and / or particles from the wafer surface has always been a research hotspot in the field of semiconductor technology. Currently, wafer cleaning equipment is usually used to clean the wafer after performing a related semiconductor process to remove impurities and / or particles that may form on the wafer surface.

[0004] However, when using existing wafer cleaning equipment, there is a problem of insufficient solution volume, which affects process accuracy and yield. Summary of the Invention

[0005] In view of this, some embodiments of this application provide a semiconductor processing apparatus, including:

[0006] A liquid supply device includes a liquid supply unit, a nozzle, and a sensing unit. The liquid supply unit is used to supply a liquid solution, the nozzle is used to spray the liquid solution supplied by the liquid supply unit, and the sensing unit is used to detect the real-time flow rate of the liquid solution supplied in the liquid supply unit. The liquid supply device is also used to move the nozzle to a spraying position above the wafer to be processed before the process begins.

[0007] The receiving device includes a receiving tank and a draining unit connected to the receiving tank. The bottom of the receiving tank has an outlet that can be opened or closed. The receiving tank is used to receive the liquid sprayed by the nozzle. The draining unit is used to discharge the liquid from the receiving tank. The receiving device is also used to control the outlet at the bottom of the receiving tank to close before the process starts, and to move the receiving tank along with the nozzle to a spraying position above the wafer to be processed. The liquid supply device controls the nozzle to spray the liquid into the receiving tank. The sensing unit detects the real-time flow rate of the liquid. The liquid in the receiving tank is discharged in real time through the draining unit. When the real-time flow rate detected by the sensing unit reaches a preset flow rate, the receiving device controls the outlet at the bottom of the receiving tank to open. The liquid sprayed by the nozzle passes through the outlet and is sprayed onto the surface of the wafer to be processed, and the process begins.

[0008] In some embodiments, the liquid supply device is further configured to control the nozzle to stop spraying liquid droplets and move the nozzle to an initial position at the end of the process, and the receiving device is further configured to control the liquid outlet to close and move the receiving tank to an initial position synchronously with the nozzle at the end of the process.

[0009] In some embodiments, the number of receiving tanks and liquid outlets is one.

[0010] In some embodiments, the receiving tank includes an upper receiving tank and a lower receiving tank located below the upper receiving tank. The draining unit is connected to the upper receiving tank and the lower receiving tank respectively. The outlet includes an inner outlet and an outer outlet. The inner outlet is located at the bottom of the upper receiving tank, and the outer outlet is located at the bottom of the lower receiving tank. Both the inner outlet and the outer outlet can be opened or closed.

[0011] In some embodiments, before the process begins, the receiving device controls both the inner outlet at the bottom of the upper receiving tank and the outer outlet at the bottom of the lower receiving tank to be closed; when the real-time flow rate detected by the sensing unit reaches the preset flow rate, the receiving device first controls the outer outlet at the bottom of the lower receiving tank to open, and then controls the inner outlet at the bottom of the upper receiving tank to open.

[0012] In some embodiments, at the end of the process, the receiving device first controls the inner outlet at the bottom of the upper receiving tank to close, and then controls the outer outlet at the bottom of the lower receiving tank to close.

[0013] In some embodiments, the receiving device further includes a gas purging unit for purging the liquid outlet after the liquid outlet is closed.

[0014] In some embodiments, the gas ejected by the gas purging unit is an inert gas.

[0015] In some embodiments, when the liquid outlet includes an inner liquid outlet and an outer liquid outlet, the gas purging unit includes an upper air outlet and a lower air outlet. The upper air outlet is used to purge the inner liquid outlet, and the lower air outlet is used to purge the outer liquid outlet.

[0016] In some embodiments, after the nozzle and the receiving tank reach the spraying position, the liquid supply device controls the nozzle to spray liquid into the receiving tank. The sensing unit detects the real-time flow rate of the liquid. The liquid in the receiving tank is discharged in real time through the draining unit. When the real-time flow rate detected by the sensing unit reaches the preset flow rate, the receiving device controls the outlet at the bottom of the receiving tank to open. The liquid sprayed by the nozzle passes through the outlet and is sprayed onto the surface of the wafer to be processed, and the process begins.

[0017] In some embodiments, before the nozzle and receiving tank reach the spraying position, the liquid supply device controls the nozzle to spray liquid into the receiving tank. The sensing unit detects the real-time flow rate of the liquid. The liquid in the receiving tank is discharged in real time through the draining unit. After the nozzle and receiving tank reach the spraying position, when the real-time flow rate detected by the sensing unit reaches the preset flow rate, the receiving device controls the outlet at the bottom of the receiving tank to open. The liquid sprayed by the nozzle passes through the outlet and is sprayed onto the surface of the wafer to be processed, and the process begins.

[0018] In some embodiments, the liquid supply unit of the liquid supply device includes a liquid supply end and a liquid supply pipeline. The inlet end of the liquid supply pipeline is connected to the liquid supply end, and the outlet end of the liquid supply pipeline is connected to the nozzle. The liquid supply pipeline is provided with a first switching valve and a first back suction valve. The first switching valve is used to control the flow of the liquid in the liquid supply pipeline, and the first back suction valve is used to control the amount of back suction in the liquid supply pipeline and the nozzle.

[0019] In some embodiments, the sensing unit is disposed on the liquid supply line, and the sensing unit includes a flow meter.

[0020] In some embodiments, the draining unit of the receiving device includes a draining pipeline, one end of which is connected to the receiving tank and the other end of which is connected to the factory discharge end. A second switching valve and a second back suction valve are provided on the draining pipeline. The second switching valve is used to control the flow of the liquid medicine in the draining pipeline, and the second back suction valve is used to control the amount of back suction in the draining pipeline.

[0021] In some embodiments, the liquid supply device and the receiving device further include a driving unit having a movable end. The nozzle of the liquid supply device and the receiving groove of the receiving device are both fixed on the movable end of the driving unit. The receiving groove is located below the nozzle, and the driving unit drives the nozzle and the receiving groove to move simultaneously.

[0022] In some embodiments, the liquid supply device further includes a first driving unit, and the receiving device further includes a second driving unit. The first driving unit has a first movable end, the nozzle of the liquid supply device is fixed to the first movable end, and the first driving unit drives the nozzle to move. The second driving unit has a second movable end, the receiving groove of the receiving device is fixed to the second movable end, and the second driving unit drives the receiving groove to move.

[0023] In some embodiments, the semiconductor processing apparatus further includes a control unit for issuing control signals to control the liquid supply device and the receiving device to perform corresponding operations.

[0024] In some embodiments, the control unit is at least configured to send a first control signal to the liquid supply device and a second control signal to the receiving device before the process begins. After receiving the first control signal, the liquid supply device moves the nozzle to a spray position above the wafer to be processed. After receiving the second control signal, the receiving device controls the outlet at the bottom of the receiving tank to close and moves the receiving tank along with the nozzle to the spray position above the wafer to be processed. After the receiving tank moves to the spray position, the receiving device sends a first feedback signal to the control unit. After receiving the first feedback signal, the control unit sends a third control signal to the liquid supply device. After receiving the third control signal, the liquid supply device controls the nozzle to spray the liquid into the receiving tank. The sensing unit detects the real-time flow rate of the liquid and sends the detected real-time flow rate to the control unit. The control unit compares the detected real-time flow rate with a preset flow rate. When the detected real-time flow rate reaches the preset flow rate, the control unit sends a fourth control signal to the receiving device. When receiving the fourth control signal, the receiving device controls the outlet at the bottom of the receiving tank to open.

[0025] In some embodiments, the semiconductor processing equipment is a wafer cleaning equipment.

[0026] In some embodiments, the solution comprises at least deionized water.

[0027] In some of the foregoing embodiments of this application, the semiconductor processing apparatus includes a receiving device, which includes a receiving tank and a draining unit connected to the receiving tank. The bottom of the receiving tank has an outlet that can be opened or closed. The receiving tank is used to receive the liquid sprayed by the nozzle. The draining unit is used to discharge the liquid in the receiving tank. The receiving device is also used to control the outlet at the bottom of the receiving tank to close before the process starts, and to move the receiving tank along with the nozzle to a spraying position above the wafer to be processed. The supply device controls the nozzle to spray the liquid into the receiving tank. The sensing unit detects the real-time flow rate of the liquid. The liquid in the receiving tank is discharged in real time through the draining unit. When the real-time flow rate detected by the sensing unit reaches a preset flow rate, the receiving device controls the outlet at the bottom of the receiving tank to open. The liquid sprayed by the nozzle passes through the outlet and is sprayed onto the surface of the wafer to be processed, and the process starts. At the start of the process, a receiving device is used to collect the liquid medicine sprayed from the nozzle. Once the liquid medicine flow rate reaches the set flow rate, the outlet holes in the receiving device open sequentially, and the process begins. This ensures that the time / flow rate of the liquid medicine during the process matches the set parameters, resulting in sufficient liquid medicine quantity or volume. Furthermore, the liquid supply device is also used to control the nozzle to stop spraying droplets and move the nozzle back to its initial position at the end of the process. The receiving device is also used to control the outlet to close and move the receiving tank synchronously to its initial position along with the nozzle at the end of the process. Therefore, at the end of the process, the inner and outer outlets close and move back to their initial positions along with the nozzle, preventing abnormal dripping of liquid medicine due to various unpredictable factors during the nozzle's departure from the spraying position, thereby improving the process effect. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of a semiconductor processing device in some embodiments of this application;

[0029] Figure 2 This is a schematic diagram showing the positions of the liquid supply device and the receiving device in some embodiments of this application;

[0030] Figure 3 This is an enlarged structural schematic diagram of the receiving groove in some embodiments of this application;

[0031] Figure 4 This is a schematic diagram of the structure of a semiconductor processing device in some other embodiments of this application;

[0032] Figure 5 This is a piping diagram of a semiconductor processing device in some embodiments of this application. Detailed Implementation

[0033] As mentioned in the background section, when using existing wafer cleaning equipment, there is a problem of insufficient solution volume, which affects process accuracy and yield.

[0034] Research has found that due to the inherent characteristics of wafer cleaning equipment, it takes a certain amount of time for the flow rate to reach the set flow rate in the initial stage of the cleaning process. However, this time is also included in the total cleaning process time, causing the required volume of cleaning solution to fall short of the standard, thus affecting process accuracy and yield. For cleaning processes with shorter processing times, the impact is even more pronounced, affecting both process accuracy and yield.

[0035] In addition, after the cleaning process is completed, the liquid supply valve is closed and the liquid stops flowing out. However, under the condition of nozzle operation or other vibration, the liquid from the nozzle may drip onto the wafer, which may affect the process results and cause contamination.

[0036] Therefore, this application provides a semiconductor processing device that, after the cleaning process begins, ensures that the time / flow rate of the cleaning solution matches the settings during the process, thereby improving the process effect. In addition, after the cleaning process is completed, it can also ensure that the cleaning solution will not drip onto the wafer and contaminate the wafer, thereby reducing adverse effects on the process.

[0037] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. In the detailed description of the embodiments of this application, for ease of explanation, the schematic diagrams may be partially enlarged without adhering to general proportions, and the schematic diagrams are merely examples and should not limit the scope of protection of this application. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0038] This application provides a wafer cleaning apparatus in some embodiments, in conjunction with reference to [reference]. Figure 1 and Figure 2 ,include:

[0039] The liquid supply device 101 includes a liquid supply unit 102, a nozzle 103, and a sensing unit (not shown in the figure). The liquid supply unit 102 is used to supply liquid medicine, the nozzle 103 is used to spray out the liquid medicine supplied by the liquid supply unit 102, and the sensing unit is used to detect the real-time flow rate of the liquid medicine supplied in the liquid supply unit 102. The liquid supply device 101 is also used to move the nozzle 103 to the spray position 22 above the wafer 109 to be processed before the process starts.

[0040] The receiving device 104 includes a receiving tank 106 and a draining unit 105 connected to the receiving tank 106. The bottom of the receiving tank 106 has an outlet 110 that can be opened or closed. The receiving tank 106 is used to receive the liquid medicine sprayed by the nozzle 103. The draining unit 105 is used to discharge the liquid medicine in the receiving tank 106. The receiving device 104 is also used to close the outlet 110 at the bottom of the receiving tank 106 before the process begins, and to move the receiving tank 106 along with the nozzle 103 to the... At the spray position 22 above the wafer 109 to be processed, the liquid supply device 101 controls the nozzle 103 to spray the liquid into the receiving tank 106. The sensing unit detects the real-time flow rate of the liquid. The liquid in the receiving tank 106 is discharged in real time through the draining unit 105. When the real-time flow rate detected by the sensing unit reaches the preset flow rate, the receiving device 104 controls the outlet 110 at the bottom of the receiving tank 106 to open. The liquid sprayed by the nozzle 103 passes through the outlet 110 and is sprayed onto the surface of the wafer 109 to be processed, and the process begins.

[0041] The semiconductor processing equipment is used to perform corresponding processes on the wafer 109 to be processed. In some embodiments, the semiconductor processing equipment is a wafer cleaning equipment, and the process includes a cleaning process, wherein the cleaning solution includes deionized water or other cleaning solutions. In other embodiments, the semiconductor processing equipment can be other equipment, and the process can be other processes, such as the semiconductor processing equipment being a developing equipment, and the process being a developing process (a process of developing exposed photoresist), wherein the cleaning solution includes a developing solution.

[0042] In some embodiments, the semiconductor processing apparatus includes a process chamber 100, which is a chamber for performing a corresponding process, and the liquid supply device 101 and the receiving device 104 are located in the process chamber 100.

[0043] In some embodiments, reference Figure 5The liquid supply unit 102 includes a liquid supply end 123 and a liquid supply pipeline 102a. The inlet end of the liquid supply pipeline 102a is connected to the liquid supply end 123, and the outlet end of the liquid supply pipeline 102a is connected to a nozzle 103. The liquid supply end is connected to a liquid supply cabinet or a factory liquid supply center. The liquid supply pipeline 102a is equipped with a first switching valve 117 and a first back suction valve 118. The first switching valve 117 is used to control the flow of the liquid medicine in the liquid supply pipeline 102a. When the first switching valve 117 is open, the liquid medicine flows in the liquid supply pipeline 102a. When the first switching valve 117 is closed, the liquid medicine stops flowing in the liquid supply pipeline 102a. The first back suction valve 118 is used to control the back suction amount in the liquid supply line 102a and the nozzle 103. When the first back suction valve 118 is opened, the back suction force is used to make the liquid in the liquid supply line 102a a certain distance away from the port of the nozzle 103, which can effectively prevent the liquid in the liquid supply line 102a and the nozzle 103 from dripping after the process is completed.

[0044] The first switching valve 117 can be an electrically controlled pneumatic valve. The first back suction valve 118 can also be an electrically controlled pneumatic valve, and the back suction amount of the first back suction valve 118 can be adjusted.

[0045] In some specific embodiments, the first back suction valve 118 is located at the front end of the first switching valve 117 (the end away from the nozzle). The first back suction valve 118 is closed, and then the first switching valve 117 is opened, and the liquid supply unit 102 starts to supply liquid. The sensing unit detects the real-time flow rate of the liquid supplied in the liquid supply unit 102 in real time. When the liquid supply stops, the first back suction valve 118 is opened (operated) to draw the liquid in the liquid supply pipeline 102a back to a certain position away from the nozzle 103. Then the first switching valve 117 is closed to keep the liquid in the liquid supply pipeline 102a at a certain position.

[0046] The sensing unit 116 is disposed on the liquid supply pipeline 102a, and the sensing unit 116 can measure the real-time flow rate of the liquid medicine in the liquid supply pipeline 102a. In some embodiments, the sensing unit 116 includes a flow meter.

[0047] Continue to refer to Figure 1 and Figure 2 The liquid supply unit 102 may further include a first arm-shaped support, which is used to support and fix the liquid supply pipeline 102a (reference). Figure 5 The first arm-shaped support is made of metal.

[0048] In some embodiments, the liquid supply device 101 is further configured to control the nozzle 103 to stop ejecting liquid droplets and to move the nozzle 103 to an initial position 21 (see reference) at the end of the process. Figure 2The receiving device 104 is also used to control the liquid outlet 110 to close and to move the receiving groove 106 synchronously with the nozzle 103 to the initial position 21 (see reference) at the end of the process. Figure 2 ).

[0049] In some embodiments, after the nozzle 103 and the receiving tank 106 reach the spray position 22, the liquid supply device 101 controls the nozzle 103 to spray liquid into the receiving tank 106. The sensing unit detects the real-time flow rate of the liquid. The liquid in the receiving tank 106 is discharged in real time through the draining unit 105. When the real-time flow rate detected by the sensing unit reaches the preset flow rate, the receiving device 104 controls the outlet 110 at the bottom of the receiving tank 106 to open. The liquid sprayed by the nozzle 106 passes through the outlet 110 and is sprayed onto the surface of the wafer 109 to be processed, and the process begins.

[0050] In some embodiments, before the nozzle 103 and the receiving tank 106 reach the spraying position 22, the liquid supply device 101 controls the nozzle 101 to spray liquid into the receiving tank 106. The sensing unit detects the real-time flow rate of the liquid. The liquid in the receiving tank 106 is discharged in real time through the draining unit 105. After the nozzle 103 and the receiving tank 106 reach the spraying position 22, when the real-time flow rate detected by the sensing unit reaches the preset flow rate, the receiving device 104 controls the outlet 110 at the bottom of the receiving tank 106 to open. The liquid sprayed by the nozzle 106 passes through the outlet 110 and is sprayed onto the surface of the wafer 109 to be processed, and the process begins. During the process of the nozzle 103 and the receiving groove 106 moving from the initial position to the spraying position 22, the liquid is sprayed and the flow rate is detected. When the nozzle 103 and the receiving groove 106 reach the spraying position 22, the real-time flow rate of the liquid reaches the preset flow rate in advance. The nozzle 103 can directly spray the liquid onto the surface of the wafer 109 to be processed, thus saving process time.

[0051] In this embodiment, reference Figure 1 and Figure 3 The receiving tank 106 includes an upper receiving tank 106a and a lower receiving tank 106b located below the upper receiving tank 106a. The draining unit 105 is connected to the upper receiving tank 106a and the lower receiving tank 106b respectively. The outlet 110 includes an inner outlet 110a and an outer outlet 110b. The inner outlet 110a is located at the bottom of the upper receiving tank 106a, and the outer outlet 110b is located at the bottom of the lower receiving tank 106b. Both the inner outlet 110a and the outer outlet 110b can be opened or closed.

[0052] Both the upper receiving tank 106a and the lower receiving tank 106b have accommodating spaces to hold the received liquid medicine. When both the inner outlet 110a and the outer outlet 110b are closed, the accommodating spaces of the upper receiving tank 106a and the lower receiving tank 106b are independent. The tank walls of the upper receiving tank 106a and the lower receiving tank 106b can be made of metal, alloy, hard plastic, or ceramic.

[0053] The inner liquid outlet 110a and the outer liquid outlet 110b can be electrically controlled valves or gate-shaped structures that open and close.

[0054] When the receiving tank 106 has the aforementioned specific structure, the receiving device 104 controls the inner liquid outlet 110a at the bottom of the upper receiving tank 106a and the outer liquid outlet 110b at the bottom of the lower receiving tank 106b to be closed before the process begins; when the sensing unit 116 (reference) Figure 5 When the detected real-time flow rate reaches the preset flow rate, the receiving device 106 first controls the opening of the outlet 110b at the bottom of the lower receiving tank 106b, and then controls the opening of the inner outlet 110a at the bottom of the upper receiving tank 106a. In this embodiment, at the start of the process, the receiving device 104 is used to receive the liquid sprayed from the nozzle. After the liquid flow rate reaches the set flow rate, the outer and inner outlet holes in the center of the receiving device 104 open successively, and the process begins. This ensures that the time / flow rate of the liquid during the process matches the set value, so that the amount or volume of liquid during the process is sufficient, thereby improving the process effect. Furthermore, opening the outlet 110b first saves time and reduces the contamination of the inner wall of the outlet 110b with liquid.

[0055] At the end of the process, the receiving device 104 first controls the inner outlet 110a at the bottom of the upper receiving tank 106a to close, and then controls the outer outlet 110b at the bottom of the lower receiving tank 106b to close. This prevents the liquid from dripping onto the wafer and contaminating it at the end of the process. Even if droplets fall from the nozzle, they will only drip into the receiving tank and not onto the wafer, reducing adverse effects on the process. Furthermore, this double-layer receiving tank structure, when the outlet is closed, ensures that even if there is contamination on the outer wall after the inner outlet 110a closes, the outer outlet 110b subsequently closes, effectively protecting the wafer from contamination.

[0056] It should be noted that in some other embodiments, the number of the receiving tank and the liquid outlet may both be one.

[0057] In some embodiments, the receiving device 106 further includes a gas purging unit for purging the liquid outlet 110 after it is closed, to prevent liquid droplets from remaining in the receiving tank 106 and affecting subsequent processes.

[0058] The gas emitted by the gas purging unit is an inert gas, including nitrogen.

[0059] In some embodiments, reference Figure 3 When the liquid outlet includes an inner liquid outlet 110a and an outer liquid outlet 110b, the gas purging unit includes an upper air outlet 111a and a lower air outlet 111b. The upper air outlet 111a is used to purge the inner liquid outlet 110, and the lower air outlet 111b is used to purge the outer liquid outlet 110b.

[0060] The number of upper air outlets 111a and lower air outlets 111b can be one or more. In some embodiments, when there are multiple upper air outlets 111a and lower air outlets 111b, the multiple upper air outlets 111a are evenly distributed on the sidewall of the upper receiving groove 106a, and the multiple lower air outlets 111b are evenly distributed on the sidewall of the lower receiving groove 106b, so as to improve the purging effect.

[0061] In some embodiments, in conjunction with reference Figure 1 and Figure 5 The draining unit 105 of the receiving device 104 includes a draining pipe 105a (reference). Figure 5 One end of the drain pipe 105a is connected to the receiving tank 106, and the other end is connected to the factory's lower discharge end 121. A second switching valve and a second back-suction valve 119 are installed on the drain pipe 105a. The second switching valve controls the flow of the liquid in the drain pipe 105a, and the second back-suction valve 119 controls the amount of back-suction in the drain pipe 105a. The function of the second back-suction valve 119 is to maintain a negative pressure in the pipe, ensuring that the liquid in the receiving tank 106 and the drain pipe 105a is promptly introduced into the factory's lower discharge end. Since the flow rate of the liquid varies depending on the process menu, the amount of liquid to be recovered within the same time period also varies. Therefore, the amount of back-suction from the second back-suction valve 119 can be adjusted to better prevent liquid residue in the receiving tank 106 under different process conditions.

[0062] In one embodiment, the backflow amount in the second backflow valve 119 is adjusted according to the real-time flow rate of the liquid supplied by the liquid supply unit 102 detected by the sensing unit. Specifically, a certain liquid flow rate or a certain range can be set as the standard flow rate. Under this standard flow rate, the second backflow valve has a corresponding standard backflow amount. In the actual process, when the sensing unit detects that the real-time flow rate under a certain menu is greater than the standard flow rate, the backflow amount of the second backflow valve is increased accordingly to the second backflow amount. When the detected real-time flow rate is less than the standard flow rate, the backflow amount of the second backflow valve is decreased accordingly to the first backflow amount. When the real-time flow rate is equal to the standard flow rate or within the standard flow rate range, the backflow amount of the second backflow valve is adjusted to the standard backflow amount.

[0063] In some specific embodiments, the second back suction valve 119 is located at the front end of the second switching valve (at the end away from the receiving tank). When the second back suction valve 119 is closed, the second switching valve is opened to start draining. When draining stops, the second back suction valve 119 is opened, and the second switching valve is closed.

[0064] In some embodiments, when the receiving tank 106 includes an upper receiving tank 106a and a lower receiving tank 106b, the drain pipe 105a is connected to the upper receiving tank 106a and the lower receiving tank 106b respectively through a pipe branch, and a second switch valve (122a and 122b) is respectively provided on the two pipe branches.

[0065] The liquid supply unit 102 may further include a second arm-shaped support, which is used to support and fix the liquid supply pipeline 102a (reference). Figure 5 The second arm-shaped support is made of metal.

[0066] In some embodiments, continue to refer to Figure 1 The liquid supply device 101 further includes a first driving unit 113, and the receiving device 104 further includes a second driving unit 114. The first driving unit 113 has a first movable end, and the nozzle of the liquid supply device 101 is fixed to the first movable end. The first driving unit 113 drives the nozzle 103 to move. The second driving unit 114 has a second movable end, and the receiving groove 106 of the receiving device 104 is fixed to the second movable end. The second driving unit 114 drives the receiving groove 106 to move.

[0067] In a specific embodiment, the nozzle 103 is fixed to the first movable end of the first driving unit 113 via a first arm-shaped structure. The first driving unit 113 drives the first arm-shaped structure to move, thereby causing the nozzle 103 to move. The receiving groove 106 is fixed to the second movable end of the second driving unit 114 via a second arm-shaped structure. The second driving unit 114 drives the second arm-shaped structure to move, thereby causing the receiving groove 106 to move.

[0068] In some embodiments, the first drive unit 113 may cause the nozzle 103 to start from an initial position 21 (reference 21) at the beginning of the process. Figure 2 Move to spray position 22 (reference) Figure 2 At the end of the process, the nozzle 103 moves from the spray position 22 back to the initial position 21. The specific movement of the nozzle 103 may include up-and-down movement, left-and-right movement, and / or rotational movement. The second drive unit 114 can cause the receiving groove 106 to start from the initial position 21 (see reference) at the beginning of the process. Figure 2 Move to spray position 22 (reference) Figure 2 At the end of the process, the receiving groove 106 moves back from the spray position 22 to the initial position 21. The specific movement process of the receiving groove 106 includes up-and-down movement, left-and-right movement and / or rotational movement.

[0069] In other embodiments, reference is made to... Figure 4 The liquid supply device 101 and the receiving device 104 further include a drive unit 115. The drive unit 115 has a movable end. The nozzle 103 of the liquid supply device 101 and the receiving groove 106 of the receiving device 104 are both fixed on the movable end of the drive unit 115. The receiving groove 106 is located below the nozzle 103. The drive unit 115 drives the nozzle 103 and the receiving groove 106 to move simultaneously. That is, only one drive unit 115 is needed. The nozzle 103 and the receiving groove 106 are both fixed on the movable end of the drive unit. The relative position between the nozzle 103 and the receiving groove 106 is fixed. The receiving groove 106 is located exactly below the nozzle 103. The simultaneous movement of the nozzle 103 and the receiving groove 106 is controlled by the drive unit 115, thereby saving costs and space.

[0070] In some embodiments, reference Figure 1 , Figure 4 and Figure 5The semiconductor processing equipment further includes a control unit 120, which sends control signals to control the liquid supply device 101 and the receiving device 104 to perform corresponding operations. These operations include at least the movement of the nozzle 103 and the receiving groove 106, and the opening and closing of the first switching valve, the second switching valve, and the liquid outlet. The control unit 120 is electrically connected to the corresponding first switching valve 117, second switching valves (122a, 122b), liquid outlet 110, first back suction valve 118, and second back suction valve 119 to control the corresponding switching operations of each component. The control unit 120 is also connected to the first drive unit 113 and the second drive unit 114 (see reference). Figure 1 Electrically connected, or electrically connected to drive unit 115 (see reference). Figure 4 ), to control the drive unit to perform corresponding drive operations.

[0071] In some embodiments, the control unit 120 is at least configured to send a first control signal to the liquid supply device 101 and a second control signal to the receiving device 104 before the process begins. After receiving the first control signal, the liquid supply device 101 moves the nozzle 103 to a spray position above the wafer to be processed. After receiving the second control signal, the receiving device 104 controls the liquid outlet 110 at the bottom of the receiving tank 106 to close and moves the receiving tank 106, along with the nozzle 103, to the spray position above the wafer to be processed. After the receiving tank 106 moves to the spray position, the receiving device 104 sends a first feedback signal to the control unit 120. After receiving the first feedback signal, unit 120 sends a third control signal to the liquid supply device 101. After receiving the third control signal, the liquid supply device 101 controls the nozzle 103 to spray the liquid into the receiving tank 106. The sensing unit 116 detects the real-time flow rate of the liquid and sends the detected real-time flow rate to the control unit 120. The control unit 120 compares the detected real-time flow rate with the preset flow rate. When the detected real-time flow rate reaches the preset flow rate, the control unit 120 sends a fourth control signal to the receiving device 104. When the receiving device 104 receives the fourth control signal, it controls the outlet 110 at the bottom of the receiving tank 106 to open.

[0072] The control unit 120 is also used to send a fifth control signal to the receiving device 104 and a sixth control signal to the liquid supply device 101 at the end of the process. When the liquid supply device 101 receives the sixth control signal, the nozzle 103 stops spraying liquid and moves the nozzle back to the initial position. When the receiving device 104 receives the fifth control signal, it controls the liquid outlet 110 at the bottom of the receiving tank 106 to close and moves the receiving tank 106 back to the initial position.

[0073] Although this application has been disclosed above with reference to preferred embodiments, it is not intended to limit this application. Any person skilled in the art can make possible changes and modifications to the technical solutions of this application by utilizing the methods and techniques disclosed above without departing from the spirit and scope of this application. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this application without departing from the content of the technical solutions of this application shall fall within the protection scope of the technical solutions of this application.

Claims

1. A semiconductor processing apparatus, characterized by, The application relates to a liquid supply device and a liquid receiving device. The liquid supply device comprises a liquid supply unit, a nozzle and a sensing unit, the liquid supply unit is used for supplying liquid medicine, the nozzle is used for spraying the liquid medicine supplied by the liquid supply unit, and the sensing unit is used for detecting the real-time flow of the liquid medicine supplied in the liquid supply unit. The liquid receiving device comprises a receiving groove and a liquid discharging unit connected with the receiving groove, the bottom of the receiving groove is provided with an openable and closable liquid outlet, the receiving groove is used for receiving the liquid medicine sprayed by the nozzle, and the liquid discharging unit is used for discharging the liquid medicine in the receiving groove.

2. The semiconductor processing apparatus of claim 1, wherein, Before the process starts, the liquid receiving device controls the liquid outlet at the bottom of the receiving groove to be closed, and controls the receiving groove to move to the spraying position above the wafer to be processed together with the nozzle.

3. The semiconductor processing apparatus of claim 1, wherein, The liquid supply device controls the nozzle to spray liquid medicine into the receiving groove, the sensing unit detects the real-time flow of the liquid medicine, the liquid medicine in the receiving groove is discharged in real time through the liquid discharging unit, when the real-time flow detected by the sensing unit reaches a preset flow, the liquid receiving device controls the liquid outlet at the bottom of the receiving groove to be opened, and the liquid medicine sprayed by the nozzle is sprayed to the surface of the wafer to be processed through the liquid outlet, and the process starts.

4. The semiconductor processing apparatus of claim 2, wherein, The liquid supply device is also used for controlling the nozzle to stop spraying liquid drops and moving the nozzle to an initial position when the process ends.

5. The semiconductor processing apparatus of claim 4, wherein, The liquid receiving device is also used for controlling the liquid outlet to be closed and synchronously moving the receiving groove to the initial position together with the nozzle when the process ends.

6. The semiconductor processing apparatus of claim 5, wherein, The number of the receiving groove and the liquid outlet is one.

7. The semiconductor processing apparatus of claim 3 or 6, wherein The receiving groove comprises an upper receiving groove and a lower receiving groove below the upper receiving groove, the liquid discharging unit is connected with the upper receiving groove and the lower receiving groove respectively, the liquid outlet comprises an inner liquid outlet and an outer liquid outlet, the inner liquid outlet is located at the bottom of the upper receiving groove, and the outer liquid outlet is located at the bottom of the lower receiving groove.

8. The semiconductor processing apparatus of claim 7, wherein, The inner liquid outlet and the outer liquid outlet can be opened or closed.

9. The semiconductor processing apparatus of claim 7, wherein, Before the process starts, the liquid receiving device controls the inner liquid outlet at the bottom of the upper receiving groove and the outer liquid outlet at the bottom of the lower receiving groove to be closed. When the real-time flow detected by the sensing unit reaches the preset flow, the liquid receiving device controls the outer liquid outlet at the bottom of the lower receiving groove to be opened first, and then controls the inner liquid outlet at the bottom of the upper receiving groove to be opened. When the process ends, the liquid receiving device controls the inner liquid outlet at the bottom of the upper receiving groove to be closed first, and then controls the outer liquid outlet at the bottom of the lower receiving groove to be closed. The liquid receiving device further comprises a gas blowing unit used for blowing the liquid outlet after the liquid outlet is closed. The gas blown by the gas blowing unit is inert gas. When the liquid outlet comprises the inner liquid outlet and the outer liquid outlet, the gas blowing unit comprises an upper gas outlet and a lower gas outlet, the upper gas outlet is used for blowing the inner liquid outlet, and the lower gas outlet is used for blowing the outer liquid outlet.

10. The semiconductor processing apparatus of claim 1, wherein, The liquid supply device controls the nozzle to spray the chemical liquid into the receiving groove after the nozzle and the receiving groove reach the spraying position, the sensing unit detects the real-time flow rate of the chemical liquid, the chemical liquid in the receiving groove is discharged in real time by the liquid discharge unit, and the receiving device controls the opening of the liquid outlet at the bottom of the receiving groove when the real-time flow rate detected by the sensing unit reaches the preset flow rate, the chemical liquid sprayed by the nozzle is sprayed to the surface of the wafer to be processed through the liquid outlet, and the process starts.

11. The semiconductor processing apparatus of claim 1, wherein, The liquid supply device controls the nozzle to spray the chemical liquid into the receiving groove after the nozzle and the receiving groove reach the spraying position, the sensing unit detects the real-time flow rate of the chemical liquid, the chemical liquid in the receiving groove is discharged in real time by the liquid discharge unit, and the receiving device controls the opening of the liquid outlet at the bottom of the receiving groove when the real-time flow rate detected by the sensing unit reaches the preset flow rate, the chemical liquid sprayed by the nozzle is sprayed to the surface of the wafer to be processed through the liquid outlet, and the process starts.

12. The semiconductor processing apparatus of claim 1, wherein, The liquid supply unit of the liquid supply device comprises a liquid supply end and a liquid supply pipeline, the inlet end of the liquid supply pipeline is connected to the liquid supply end, the outlet end of the liquid supply pipeline is connected to the nozzle, a first on-off valve and a first back suction valve are arranged on the liquid supply pipeline, the first on-off valve is used to control the opening and closing of the chemical liquid in the liquid supply pipeline, and the first back suction valve is used to control the back suction amount in the liquid supply pipeline and the nozzle.

13. The semiconductor processing apparatus of claim 12, wherein, The sensing unit is arranged on the liquid supply pipeline, and the sensing unit comprises a flow meter.

14. The semiconductor processing apparatus of claim 1, wherein, The liquid discharge unit of the receiving device comprises a liquid discharge pipeline, one end of the liquid discharge pipeline is connected to the receiving groove, the other end of the liquid discharge pipeline is connected to a factory lower discharge end, a second on-off valve and a second back suction valve are arranged on the liquid discharge pipeline, the second on-off valve is used to control the opening and closing of the chemical liquid in the liquid discharge pipeline, and the second back suction valve is used to control the back suction amount in the liquid discharge pipeline.

15. The semiconductor processing apparatus of claim 1, wherein, The liquid supply device and the receiving device further comprise a driving unit, the movable end of the driving unit, the nozzle of the liquid supply device and the receiving groove of the receiving device are fixed on the movable end of the driving unit, the receiving groove is located below the nozzle, and the driving unit drives the nozzle and the receiving groove to move simultaneously.

16. The semiconductor processing apparatus of claim 1, wherein, The liquid supply device further comprises a first driving unit, the receiving device further comprises a second driving unit, the first driving unit has a first movable end, the nozzle of the liquid supply device is fixed on the first movable end, the first driving unit drives the nozzle to move, the second driving unit has a second movable end, the receiving groove of the receiving device is fixed on the second movable end, and the second driving unit drives the receiving groove to move.

17. The semiconductor processing apparatus of any of claims 1, 10-16, wherein, The semiconductor processing equipment further comprises a control unit, and the control unit is used to send a control signal to control the liquid supply device and the receiving device to perform corresponding operations. The semiconductor processing equipment further comprises a control unit, and the control unit is used to send a control signal to control the liquid supply device and the receiving device to perform corresponding operations.

18. The semiconductor processing apparatus of claim 17, wherein, The control unit is used for sending a first control signal to the liquid supply device and a second control signal to the receiving device before the process starts. After receiving the first control signal, the liquid supply device moves the nozzle to a spraying position above the wafer to be processed. After receiving the second control signal, the receiving device controls the liquid outlet at the bottom of the receiving groove to be closed and moves the receiving groove together with the nozzle to the spraying position above the wafer to be processed. After the receiving groove is moved to the spraying position, the receiving device sends a first feedback signal to the control unit. After receiving the first feedback signal, the control unit sends a third control signal to the liquid supply device. After receiving the third control signal, the liquid supply device controls the nozzle to spray the liquid medicine into the receiving groove. The sensing unit detects the real-time flow of the liquid medicine and sends the detected real-time flow to the control unit. The control unit compares the detected real-time flow with a preset flow. When the detected real-time flow reaches the preset flow, the control unit sends a fourth control signal to the receiving device. After receiving the fourth control signal, the receiving device controls the liquid outlet at the bottom of the receiving groove to be opened.

19. The semiconductor processing apparatus of claim 1, wherein, The semiconductor processing equipment is a wafer cleaning equipment.

20. The semiconductor processing apparatus of claim 1 or 19, wherein, The liquid medicine at least includes deionized water.

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