Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board

Abstract

This resin composition contains a curable resin. In the present invention, according to viscoelasticity measurement, at 100°C to 200°C, the minimum value (Min) of the ratio of the loss modulus (E") to the storage modulus (E') of the cured product of the resin composition, i.e., the loss tangent (tan δ = E" / E') is 0.04 or more.

Description

Technical Field

[0001] The present disclosure generally relates to a resin composition, a prepreg, a film with a resin, a metal foil sheet with a resin, a metal-clad laminate, and a printed wiring board. More specifically, the present disclosure relates to a resin composition containing a curable resin, and a prepreg, a film with a resin, a metal foil sheet with a resin, a metal-clad laminate, and a printed wiring board all using the resin composition. Background Art

[0002] Research has been conducted in the art on reducing the warpage of substrate materials to improve the mounting reliability of semiconductor packages (PKGs). One of the results of this research is a way to increase the rigidity of the substrate material and reduce its coefficient of thermal expansion (CTE). This approach is based on the concept of offsetting the mismatch in CTE between the substrate and the semiconductor chip mounted on the substrate by making the CTE of the substrate closer to the CTE of the semiconductor chip mounted on the substrate.

[0003] However, there have been significant developments in the field of semiconductor technology in recent years. Therefore, there is a possibility that the structure of a semiconductor package will change significantly in the future. If this happens, the approach based on this concept may no longer be applicable to a semiconductor package with a significantly changed structure. In other words, it must be said that this approach lacks versatility.

[0004] In order to overcome this problem, another method different from the above-mentioned concept has also been proposed. For example, Patent Document 1 discloses a prepreg that adopts a method different from the known method. The prepreg of Patent Document 1 is composed of a resin composition and a fabric base material. The resin composition contains an epoxy resin (A) or any other resin having a naphthalene skeleton, a high molecular weight substance (B) having a specific structure, and an inorganic filler (C).

[0005] The prepreg of Patent Document 1 is a highly versatile substrate material. However, the prepreg still has room for improvement in terms of warpage reduction and heat resistance.

[0006] Reference List

[0007] Patent Literature

[0008] Patent Document 1: JP 2017-002305 A Summary of the invention

[0009] An object of the present disclosure is to provide a resin composition, a prepreg, a film with a resin, a metal foil sheet with a resin, a metal-clad laminate, and a printed wiring board, all of which contribute to the manufacture of a substrate with reduced warpage and improved heat resistance.

[0010] A resin composition according to one aspect of the present disclosure contains a curable resin. The minimum value of the loss tangent (tanδ=E" / E') of the cured product of the resin composition is equal to or greater than 0.04. The loss tangent is the ratio of the loss modulus (E") of the cured product of the resin composition to its storage modulus (E'). The loss modulus (E"), storage modulus (E') and loss tangent (tanδ=E" / E') are obtained by dynamic mechanical analysis at a temperature equal to or higher than 100°C and equal to or lower than 200°C.

[0011] A prepreg according to another aspect of the present disclosure includes: a substrate; and a resin layer containing the above resin composition or a semi-cured product of the resin composition. The resin composition or the semi-cured product of the resin composition is impregnated into the substrate.

[0012] A film having a resin according to still another aspect of the present disclosure includes: a resin layer containing the above-mentioned resin composition or a semi-cured product of the resin composition; and a supporting film supporting the resin layer.

[0013] A metal foil sheet with resin according to still another aspect of the present disclosure includes: a resin layer containing the above resin composition or a semi-cured product of the resin composition; and a metal foil sheet combined with the resin layer.

[0014] A metal clad laminate according to still another aspect of the present disclosure includes: an insulating layer containing a cured product of the above resin composition or a cured product of the above prepreg; and a metal layer bonded to the insulating layer.

[0015] A printed wiring board according to still another aspect of the present disclosure includes: an insulating layer containing a cured product of the above resin composition or a cured product of the above prepreg; and a conductor line formed on the insulating layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 shows a tan δ-temperature curve showing the temperature dependence of the loss tangent (tan δ) according to specific embodiments and comparative examples;

[0017] Figure 2 is a schematic cross-sectional view showing a prepreg according to an exemplary embodiment of the present disclosure;

[0018] Figure 3 is a schematic plan view showing a base material used in a prepreg;

[0019] Figure 4 A is a schematic cross-sectional view showing a film with a resin (and without a protective film) according to an exemplary embodiment of the present disclosure;

[0020] Figure 4 B is a schematic cross-sectional view showing a film with a resin (and with a protective film) according to an exemplary embodiment of the present disclosure;

[0021] Figure 5 is a schematic cross-sectional view showing a metal foil sheet with resin according to an exemplary embodiment of the present disclosure;

[0022] Figure 6 is a schematic cross-sectional view showing a metal-clad laminate according to an exemplary embodiment of the present disclosure;

[0023] Figure 7 A is a schematic cross-sectional view showing a printed wiring board (without interlayer connection) according to an exemplary embodiment of the present disclosure;

[0024] Figure 7 B is a schematic cross-sectional view showing a printed wiring board (with interlayer connections) according to an exemplary embodiment of the present disclosure; and

[0025] Figure 8 is a schematic cross-sectional view showing a semiconductor package according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0026] 1. Summary

[0027] The resin composition according to the exemplary embodiment includes a curable resin and can be used as a substrate material. Examples of applications of the substrate material may include, but are not limited to: a prepreg 1, a film with a resin 2, a metal foil sheet with a resin 3, a metal-clad laminate 4, and a printed wiring board 5 (see Figure 2-7 B).

[0028] While studying the warpage of the substrate, the inventors found that by adjusting the loss tangent (tan δ) of the substrate material to a higher value than the known value, the substrate tends to absorb stress more easily. In other words, the inventors found that by increasing tan δ, stress absorption capability can be exhibited and the warpage of the substrate can be reduced. In addition, the inventors also found that heat resistance can also be improved in this case.

[0029] Specifically, the minimum value (Min) of the loss tangent (tan δ) of the cured product of the resin composition according to the present embodiment measured at a temperature equal to or higher than 100° C. and equal to or lower than 200° C. is equal to or greater than 0.04. This will be described with reference to the drawings. Figure 1 The tan δ-temperature curve showing the temperature dependence of the loss tangent (tan δ) is shown. Figure 1, the first and third embodiments satisfy the conditions of the resin composition according to the present embodiment. This makes it easier for the substrate to absorb stress. Therefore, the first and third embodiments enable the manufacture of a substrate with reduced warpage and improved heat resistance (see Table 1).

[0030] In contrast, the first comparative example, the second comparative example, and the fifth comparative example all fail to meet the conditions of the resin composition according to the present embodiment. This makes it more difficult for the substrate to absorb stress. Therefore, in the first comparative example, the second comparative example, and the fifth comparative example, the substrate tends to have increased warpage.

[0031] On the other hand, the fourth comparative example also does not meet the conditions of the resin composition according to the present embodiment. According to the fourth comparative example, the warping of the substrate is not so significant, but the heat resistance is poor (see Table 2). The details of each embodiment and comparative example will be described later (see the "Example" section for further details).

[0032] 2. Details

[0033] Next, the resin composition according to the present embodiment will be described in detail. After that, the prepreg 1, the film 2 with resin, the metal foil sheet 3 with resin, the metal-clad laminate 4, the printed wiring board 5 and the semiconductor package 100 according to the present embodiment will be described in detail with reference to the accompanying drawings. In some drawings, for the convenience of description, arrows indicating mutually orthogonal X, Y and Z directions are shown. Note that the arrows are not substantial.

[0034] (1) Resin composition

[0035] <Viscoelasticity>

[0036] The resin composition according to the present embodiment exhibits the following viscoelastic properties. Specifically, one of the characteristics of the resin composition according to the present embodiment is that its loss tangent (tan δ = E " / E') is higher than the loss tangent of known materials. Specifically, the minimum value (Min) of the loss tangent of the cured product of the resin composition at a temperature equal to or higher than 100 ° C and equal to or lower than 200 ° C is equal to or greater than 0.04 (see Figure 1 tan δ-temperature curves of the first and third embodiments shown).

[0037] In this case, the loss tangent (tanδ) is the ratio (E” / E’) of the loss modulus (E”) to the storage modulus (E’). The storage modulus (E’) refers to the energy generated by strain inside an object (cured product). On the other hand, the loss modulus (E”) refers to the thermal energy generated in an object by strain. As described above, the minimum value (Min) of the loss tangent at a temperature equal to or higher than 100°C and equal to or lower than 200°C is made equal to or greater than 0.04, which makes it easier to dissipate the stress generated inside the cured product due to friction between molecules inside the cured product as thermal energy. Note that the storage modulus (E’), the loss modulus (E”) and the loss tangent (tanδ=E” / E’) are obtained by dynamic mechanical analysis (DMA).

[0038] Another feature of the resin composition according to the present embodiment is that the tan δ-temperature curves each have a base line but have no peak in the range of 100° C. to 200° C. (see Figure 1 In other words, the cured product of the resin composition according to the present embodiment does not have a glass transition temperature (Tg) within the range of 100° C. to 200° C. Figure 1 In the embodiment of the present invention, the range of 100°C to 200°C is the range between two vertical axes Y(100) and Y(200), wherein Y(100) is the vertical axis indicating the position of 100°C and Y(200) is the vertical axis indicating the position of 200°C. Figure 1 , the fifth comparative example has a peak in the range of 100°C to 200°C.

[0039] As used herein, "baseline" refers to the portion of the curve of the temperature range of the sample where the loss tangent hardly changes. In other words, the baseline refers to the substantially flat straight line portion of the tan δ-temperature curve in the range of 100°C to 200°C. As used herein, a peak refers to the portion of the tan δ-temperature curve between the point where the curve leaves the baseline and the point where the curve returns to the baseline.

[0040] Another feature of the resin composition according to the present embodiment is that the base line of the tan δ-temperature curve is located at a higher level than the base line of the tan δ-temperature curve of the existing material. Figure 1 , the baselines of the tanδ-temperature curves of the first and third examples are located at a level higher than the horizontal axis X(0.05), while the baselines of the tanδ-temperature curves of the first, second, fourth, and fifth comparative examples are located at a level lower than the horizontal axis X(0.05). Note that X(0.05) is the horizontal axis indicating the position where the loss tangent (tanδ) is 0.05.

[0041] The resin composition according to the present embodiment shows such viscoelasticity, thereby making it easier for the substrate to absorb stress. That is, when deformation (strain) is caused in the substrate, the viscosity of the substrate converts dynamic energy into thermal energy, which makes it possible for the substrate to absorb stress. Therefore, the resin composition according to the present embodiment makes it possible to manufacture a substrate with reduced warpage.

[0042] The resin composition according to the present embodiment preferably exhibits the following viscoelastic properties. Specifically, Figure 1 As shown in the tan δ-temperature curves of the first and third embodiments, the Max(B) / Max(A) ratio is preferably less than 1. This enables further reduction in the warpage of the substrate.

[0043] In this case, Max(B) represents the maximum value of the loss tangent of the cured product of the resin composition at a temperature equal to or higher than 100°C and equal to or lower than 200°C. Max(A) represents the maximum value of the loss tangent of the cured product of the resin composition at a temperature equal to or higher than 30°C and lower than 100°C and at a temperature higher than 200°C and equal to or lower than 300°C. Figure 1 In the embodiment, the temperature range of 30°C or higher and lower than 100°C is between two vertical axes Y(30) and Y(100), where Y(30) is the vertical axis indicating the position of 30°C. On the other hand, the temperature range of higher than 200°C and 300°C or lower is between two vertical axes Y(200) and Y(300), where Y(300) is the vertical axis indicating the position of 300°C.

[0044] Figure 1 The maximum value (Max(A)) of the loss tangent of the first and third embodiments shown is not located in the temperature range of 30°C or higher and lower than 100°C, but is located in the temperature range of higher than 200°C and equal to or lower than 300°C. Figure 1 Although not shown in the figure, the maximum value (Max(A)) of the loss tangent may be located in the temperature range of 30°C or higher and lower than 100°C, and may not be located in the temperature range of higher than 200°C and equal to or lower than 300°C. In addition, the maximum value (Max(A)) of the loss tangent in the temperature range of 30°C or higher and lower than 100°C may be the same as the maximum value (Max(A)) in the temperature range of higher than 200°C and equal to or lower than 300°C.

[0045] The inventors have further conducted research and development to determine the constituent components of the resin composition that will exhibit such viscoelasticity. Specifically, the resin composition according to the present embodiment contains a curable resin. The resin composition preferably also contains a styrene copolymer (C). More preferably, the resin composition also contains an inorganic filler (D). The resin composition may also further contain other components (E).

[0046] The curable resin preferably contains a long-chain compound (A1). The curable resin more preferably also contains a long-chain-free compound (A2). The curable resin even more preferably contains a resin component (B). The resin component (B) is a resin component other than the long-chain-containing compound (A1), the long-chain-free compound (A2) and the styrene copolymer (C). These constituent components of the resin composition will be described one by one below.

[0047] <Curable Resin>

[0048] 《Long-chain compounds (A1)》

[0049] The long chain-containing compound is a compound including a long chain hydrocarbon group and a first functional group.

[0050] The long-chain hydrocarbon group has an alkyl group having a carbon number equal to or greater than six, and / or an alkylene group having a carbon number equal to or greater than six. In other words, the long-chain hydrocarbon group includes at least one of an alkyl group having a carbon number equal to or greater than six or an alkylene group having a carbon number equal to or greater than six. The upper limit value of the carbon number of the alkyl group is not limited to any specific value, but may be, for example, 100. The upper limit value of the carbon number of the alkylene group is not limited to any specific value, but may be, for example, 100. It can be seen that the long-chain-containing compound (A1) includes a long-chain hydrocarbon group having a chain length of C6 or more, and therefore it is possible not only to improve the loss tangent (tanδ) of the substrate, but also to improve the heat resistance of the substrate.

[0051] On the other hand, the first functional group includes at least one selected from the group consisting of an epoxy group, a maleimide group, an imide group, and a hydroxyl group.

[0052] The long chain-containing compound (A1) preferably includes at least one selected from the group consisting of a maleimide compound (A3) represented by the following formula (a3), a maleimide compound (A4) represented by the following formula (a4), and a maleimide compound (A5) represented by the following formula (a5). Adding such a maleimide compound (A3), (A4) or (A5) to the resin composition enables the loss tangent (tan δ) of the substrate to be increased:

[0053]

[0054] wherein n is an integer in the range of 1 to 10.

[0055]

[0056] wherein n is an integer in the range of 1 to 10.

[0057]

[0058] The long-chain containing compound (A1) is preferably a maleimide compound having a maleimide equivalent weight equal to or greater than 400 g / eq. This makes it possible to further reduce the warping of the substrate. The upper limit value of the maleimide equivalent weight is preferably equal to or less than 3000 g / eq, and more preferably equal to or less than 2000 g / eq. Note that the maleimide equivalent weight is a value calculated by dividing the molecular weight of the maleimide compound by the number of maleimide groups possessed by the maleimide compound. In other words, the maleimide equivalent weight is the molecular weight of each maleimide group.

[0059] The content of the long chain-containing compound (A1) is preferably equal to or greater than 30 parts by mass and equal to or less than 75 parts by mass relative to 100 parts by mass in total of the curable resin and the styrene copolymer (C). This enables further reduction in warpage of the substrate.

[0060] 《No long-chain compounds (A2)》

[0061] The long-chain-free compound (A2) is a compound having no long-chain hydrocarbon group but having a second functional group.

[0062] The long-chain hydrocarbon group is as described above. It can be seen that the long-chain-free compound (A2) does not have a long-chain hydrocarbon group having a chain length of C6 or more.

[0063] On the other hand, the second functional group includes at least one selected from the group consisting of: epoxy, maleimide, imide and hydroxyl. That is, the second functional group of the long-chain-free compound (A2) and the first functional group of the long-chain-containing compound (A1) are selected from the same functional group group. The second functional group may be the same or different from the first functional group.

[0064] Note that if the second functional group of the long chain-free compound (A2) is different from the first functional group of the long chain-containing compound (A1), the two functional groups are not easily compatible with each other, but may cause phase separation. This makes it easier to maintain the loss tangent of the cured product of the resin composition within a predetermined temperature range (e.g., equal to or higher than 100° C. and equal to or lower than 200° C.).

[0065] The compound (A2) not containing long chains is preferably a maleimide compound with a maleimide equivalent weight less than 400g / eq. This makes it possible to increase the glass transition temperature (Tg) of the substrate. Improving the Tg of the substrate can reduce the possibility of causing cracks in the substrate, and improve the reliability of interlayer connection. That is to say, for example, even if stress is applied to the substrate in a thermal shock test, this can also reduce the possibility of causing cracks in a substrate such as a multilayer printed wiring board, thereby reducing the resistance value of through holes (via hole) and vias (through hole) to increase. This can improve the reliability of interlayer connection. In recent years, in particular, as the lines are arranged more and more densely and their feature size is further reduced, the diameters of through holes and vias have been further reduced. Therefore, it is effective to improve the Tg of the substrate to handle situations such as this. The lower limit of the maleimide equivalent is preferably equal to or greater than 150g / eq, and more preferably equal to or greater than 200g / eq.

[0066] For example, the long chain-free compound (A2) having a maleimide equivalent weight of less than 400 g / eq may include, but is not limited to, a maleimide compound (A7) represented by the following formula (a7). The maleimide compound (A7) is 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide.

[0067]

[0068] If the curable resin contains both the long chain-containing compound (A1) and the long chain-free compound (A2), the content of the long chain-free compound (A2) is preferably equal to or more than 5 parts by mass and equal to or less than 50 parts by mass, and more preferably equal to or more than 10 parts by mass and equal to or less than 40 parts by mass, relative to 100 parts by mass in total of the long chain-containing compound (A1) and the long chain-free compound (A2).

[0069] 《Resin component (B)》

[0070] The curable resin preferably further contains a resin component (B). The resin component (B) herein refers to a resin component other than the long chain-containing compound (A1), the non-long chain-containing compound (A2) and the styrene copolymer (C).

[0071] At least long-chain-containing compound (A1) and resin component (B) are added to the resin composition so that the loss tangent of the cured product of the resin composition can be improved. For example, if the curable resin contains long-chain-containing compound (A1) and long-chain-free compound (A2) at the same time, and the long-chain-containing compound (A1) and the long-chain-free compound (A2) are both maleimide compounds, then the long-chain-containing compound (A1) and the long-chain-free compound (A2) will cause phase separation, because the former has a long-chain hydrocarbon group, and the latter does not have a long-chain hydrocarbon group, but can still react with each other. This still makes it possible to adjust the loss tangent of the cured product to a value higher than a known value. If the reaction can be reduced while maintaining a phase separation state, the loss tangent of the cured product can be adjusted to an even higher value. Resin component (B) causes phase separation at least relative to the long-chain-containing compound (A1), and is at least unlikely to react with the long-chain-containing compound (A1). Therefore, the resin composition preferably contains a long-chain-containing compound (A1) and a resin component (B). In this case, the resin composition may further contain a compound (A2) not containing a long chain.

[0072] The glass transition temperature (Tg) of the resin component (B) is preferably equal to or higher than 200°C. The resin component (B) is more preferably incompatible with at least one of the long chain-containing compound (A1), the long chain-free compound (A2) or the styrene copolymer (C), or is less likely to be compatible. If the resin composition is less likely to cause phase separation in this way, the tan δ-temperature curve may have a base line in a temperature range of equal to or higher than 100°C and equal to or lower than 200°C. On the contrary, if those components of the resin composition are easily compatible, the tan δ-temperature curve may have a sharp peak in a temperature range of equal to or higher than 100°C and equal to or lower than 200°C.

[0073] The resin component (B) preferably includes at least one selected from the group consisting of epoxy compounds, phenolic compounds, polyphenylene ether compounds, modified polyphenylene ether compounds each having a reactive unsaturated group, benzophenone compounds, The resin component (B) may be a quaternary ammonium chloride compound, a free radical polymerizable compound each having a polymerizable unsaturated group, a cyanate compound, and an amine compound. This can impart properties unique to each resin component (B) to the resin composition. For example, this can improve stain resistance and electrical properties. In particular, if the long-chain-containing compound (A1) includes a maleimide compound, the resin component (B) preferably includes an epoxy compound.

[0074] Epoxide refers to a compound having at least one epoxy group (preferably more than two epoxy groups) per molecule in this article. Specific examples of epoxy include, but are not limited to, dicyclopentadiene epoxy resin, naphthalene epoxy resin, biphenyl epoxy resin, and mesogen skeleton epoxy resin. Mesogen skeleton epoxy resin is an epoxy resin having at least one mesogen group per molecule. Mesogen group has a rigid structure and is the minimum unit structure that can form a liquid crystal structure. Examples of mesogen groups include, but are not limited to, biphenyl structure and phenyl benzoate structure.

[0075] The epoxy equivalent of the epoxy compound is preferably equal to or greater than 200 g / eq and equal to or less than 350 g / eq. This makes it possible to increase the glass transition temperature (Tg) of the substrate. As described above, increasing the Tg of the substrate can reduce the possibility of cracks in the substrate and improve the reliability of interlayer connection.

[0076] The phenolic compound is a compound generated by polymerizing phenol and formaldehyde using an acidic catalyst or a basic catalyst. For example, the phenolic compound may be, but is not limited to, phenol novolac.

[0077] If the curable resin further contains a resin component (B), the content of the resin component (B) is preferably equal to or greater than 5 parts by mass and equal to or less than 55 parts by mass, and more preferably equal to or greater than 10 parts by mass and equal to or less than 50 parts by mass, relative to 100 parts by mass in total of the curable resin and the styrene copolymer (C).

[0078] <Styrene Copolymer (C)>

[0079] The resin composition preferably further contains a styrene copolymer (C). This enables further reduction in the warpage of the substrate.

[0080] The styrene copolymer (C) has at least one structure derived from a styrene compound and / or a styrene derivative. Examples of styrene compounds and / or styrene derivatives include, but are not limited to, styrene, α-methylstyrene, p-methylstyrene, compounds in which some hydrogen atoms in these aromatic rings are substituted by alkyl groups, and polymers thereof. The styrene copolymer (C) may also have a structure derived from a conjugated diene compound.

[0081] Styrene copolymer (C) can be a non-hydrogenated product or a hydrogenated product, whichever is suitable. Non-hydrogenated product refers to non-hydrogenated substances in this article. Hydrogenated product refers to hydrogenated substances in this article. The weight average molecular weight of styrene copolymer (C) is preferably equal to or greater than 10,000 and equal to or less than 150,000. Such a styrene copolymer (C) is added to the resin composition so that the warping of the substrate can be further reduced. Making the weight average molecular weight of styrene copolymer (C) equal to or greater than 10,000 can suppress the decline in stain resistance. Stain resistance refers to the ability to remove stains sufficiently but not excessively in this article, and the stains are resin stains left even after the substrate has been hole cut. On the other hand, making the weight average molecular weight of styrene copolymer (C) equal to or less than 150,000 can suppress the decline in flame retardancy.

[0082] The styrene copolymer (C) preferably includes at least one selected from the group consisting of methylstyrene (ethylene / butylene) methylstyrene copolymer, methylstyrene (ethylene-ethylene / propylene) methylstyrene copolymer, styrene-isoprene copolymer, styrene-isoprene-styrene copolymer, styrene (ethylene / butylene) styrene copolymer, styrene (ethylene-ethylene / propylene) styrene copolymer, and hydrogenated products thereof. Adding such a styrene copolymer (C) to the resin composition enables further reduction of the warpage of the substrate.

[0083] If the resin composition further contains a styrene copolymer (C), the content of the styrene copolymer (C) is preferably equal to or greater than 1 part by mass and equal to or less than 40 parts by mass, and more preferably equal to or greater than 10 parts by mass and equal to or less than 35 parts by mass, relative to 100 parts by mass in total of the curable resin and the styrene copolymer (C). This makes it possible to further reduce the warpage of the substrate.

[0084] <Inorganic filler (D)>

[0085] The resin composition preferably further contains an inorganic filler (D). This makes it possible to reduce the coefficient of thermal expansion (linear expansion coefficient) of the substrate.

[0086] The inorganic filler (D) preferably contains at least one selected from the group consisting of metal oxides, metal hydroxides, talc, aluminum borate, barium sulfate, calcium carbonate and zinc molybdate. Examples of metal oxides include, but are not limited to, silicon dioxide, aluminum oxide, titanium oxide and mica. Examples of metal hydroxides include, but are not limited to, aluminum hydroxide and magnesium hydroxide.

[0087] The inorganic filler (D) is preferably surface treated with a surface treatment agent. This improves the wettability of the inorganic filler (D) with a long-chain compound (A1), a long-chain-free compound (A2), a resin component (B) and a styrene copolymer (C), thereby improving the dispersibility of the inorganic filler (D). Examples of surface treatment agents include, but are not limited to, silane coupling agents, titanate coupling agents, fatty acids and surfactants. The silane coupling agent preferably includes at least one functional group selected from the group consisting of the following: vinyl, epoxy, styryl, methacrylic, acrylic, amino, isocyanurate, urea, mercapto, isocyanate and anhydride.

[0088] The inorganic filler (D) preferably has a spherical shape. This can improve the fluidity of the resin composition during the molding process.

[0089] The average particle size of the inorganic filler (D) is preferably equal to or greater than 0.01 μm and equal to or less than 50 μm, and more preferably equal to or greater than 0.05 μm and equal to or less than 20 μm. Note that the average particle size herein refers to a particle size at a cumulative value of 50% in a particle size distribution obtained by a laser diffraction and scattering method.

[0090] If the resin composition further contains an inorganic filler (D), the content of the inorganic filler (D) is preferably equal to or greater than 20 parts by mass and equal to or less than 200 parts by mass, and more preferably equal to or greater than 50 parts by mass and equal to or less than 150 parts by mass, relative to 100 parts by mass in total of the curable resin and the styrene copolymer (C).

[0091] <Other components (E)>

[0092] Resin combination can also contain other components (E). The example of other components (E) includes but is not limited to catalytic curing agent, crosslinking agent, reaction initiator, resin modifier, defoamer, heat stabilizer, antistatic agent, ultraviolet absorber, dye, pigment, lubricant, dispersant such as wetting dispersant and leveling agent. Catalytic curing agent includes imidazole compound, such as 2-ethyl-4-methylimidazole. Reaction initiator includes organic peroxide, such as α, α′-di(tert-butylperoxy) diisopropylbenzene. Unless the advantage of the present embodiment is damaged, the content of other components (E) is not limited to any specific value.

[0093] <Form>

[0094] The resin composition can have any form without limitation. That is, the resin composition can be in liquid form or solid form, whichever is suitable. The liquid form includes a varnish form. The varnish can be prepared by mixing the resin composition with a solvent and stirring the mixture. Examples of solvents include, but are not limited to, toluene, methyl ethyl ketone, cyclohexanone and propylene glycol monomethyl ether acetate.

[0095] (2) Prepreg

[0096] Figure 2 A prepreg 1 according to the present embodiment is shown. The prepreg 1 has a shape of a sheet or film as a whole. That is, the prepreg 1 extends in the X direction and the Y direction. The prepreg 1 can be used as a material for a metal-clad laminate 4, as a material for a printed wiring board 5, and for making a printed wiring board 5 having multiple layers (by an accumulation method). When heated or irradiated with light (such as ultraviolet rays), the prepreg 1 is cured to become a cured product. The cured product in the prepreg 1 can form an insulating layer 40 of the metal-clad laminate 4 or an insulating layer 50 of the printed wiring board 5 (refer to Figure 6-7 B).

[0097] The prepreg 1 includes: a base material 11; and a resin layer 10 containing a resin composition or a semi-cured product of the resin composition, each of which is impregnated into the base material 11. The sheet of the prepreg 1 includes at least one base material 11.

[0098] The material of the substrate 11 is not limited to any specific material, but may be, for example, woven fabric or nonwoven fabric.

[0099] Examples of textile fabrics include, but are not limited to, glass cloth, aramid cloth, and polyester cloth.

[0100] Examples of the nonwoven fabric include, but are not limited to, glass nonwoven fabric, aramid nonwoven fabric, polyester nonwoven fabric, pulp paper, and linter paper.

[0101] Examples of glass fibers as constituent materials of the glass cloth and the glass nonwoven fabric include, but are not limited to, Q glass, NE glass, E glass, S glass, T glass, L glass, and L2 glass.

[0102] The base material 11 preferably has a thickness of 5 μm or more and 300 μm or less, and more preferably has a thickness of 10 μm or more and 200 μm or less.

[0103] The surface of the substrate 11 may be surface-treated with a silane coupling agent. The silane coupling agent may be, but is not limited to, a silane coupling agent having at least one functional group selected from the group consisting of, for example, a vinyl group, an epoxy group, a styrene group, a methacrylic group, an acrylic group, an amino group, an isocyanurate group, a urea group, a mercapto group, an isocyanate group, and an anhydride group.

[0104] Figure 3 An exemplary substrate 11 is shown. The substrate 11 is a piece of textile in which warp yarns 111 and weft yarns 112 are woven. The direction of the warp yarns 111 (X direction) and the direction of the weft yarns 112 (Y direction) are orthogonal to each other. The substrate 11 extends in the X direction and the Y direction. The bias direction BD is a direction intersecting with the direction of the warp yarns 111 (X direction). The angle formed between the bias direction BD and the direction of the warp yarns 111 (X direction) is θ (for example, it may be 45 degrees).

[0105] The resin layer 10 may be a resin layer containing a resin composition (the first case) or a resin layer containing a semi-cured product of the resin composition (the second case).

[0106] In the first case, the resin layer 10 can be formed in the following manner. Specifically, the resin layer 10 can be formed by impregnating the varnish of the resin composition into the substrate 11 and then volatilizing the solvent. This resin layer 10 is formed into a resin composition in an unreacted state (its dried product). As used herein, "unreacted state" includes a completely unreacted state and an almost unreacted state. When heated, the resin layer 10 changes from an unreacted state to a cured state.

[0107] On the other hand, in the second case, the resin combination is in a semi-cured state. As used herein, "semi-cured state" refers to the intermediate stage (stage B) of the curing reaction. The intermediate stage is the stage between the stage A in the varnish state and the stage C in the fully cured state. In the second case, the resin layer 10 can be formed in the following manner. Specifically, the resin layer 10 can be formed by impregnating a substrate 11 with the varnish of the resin combination, heating the substrate 11 so that the solvent is volatilized, and the curing reaction of the resin combination is carried out to the intermediate stage. This resin layer 10 is made of a resin combination in a semi-cured state (i.e., a semi-cured product of the resin combination).

[0108] As can be seen from the above description, the degree of progress of the curing reaction of the resin layer 10 varies depending on the resin composition used.

[0109] The thickness of the prepreg 1 (ie, the thickness measured in the Z direction) may be, but is not limited to, equal to or greater than 10 μm and equal to or less than 120 μm. This can achieve the advantage of reducing the thickness of the substrate.

[0110] It can be seen that the resin layer 10 of the prepreg 1 according to the present embodiment is made of the above-mentioned resin composition, thereby enabling the substrate to be manufactured while reducing its warpage.

[0111] (3) Film with resin

[0112] Figure 4 A shows a film 2 with resin according to the present embodiment. The film 2 with resin has a film or sheet shape as a whole. The film 2 with resin includes: a resin layer 20 containing a resin composition or a semi-cured product of a resin composition; and a support film 21 supporting the resin layer 20. For example, the film 2 with resin can be used to form a printed wiring board 5 having multiple layers (by an accumulation method).

[0113] When heated or irradiated with light (eg, ultraviolet rays), the resin layer 20 is cured to form the insulating layer 40 of the metal-clad laminate 4 or the insulating layer 50 of the printed wiring board 5 (see Figure 6-7 B) The resin layer 20 is the same as the resin layer 10 of the prepreg 1 except that the resin layer 20 is not impregnated into the base material 11 .

[0114] The thickness of the resin layer 20 is not limited to any specific value, but may be, for example, equal to or greater than 10 μm and equal to or less than 120 μm. This enables the thickness of the substrate to be reduced.

[0115] The support film 21 supports the resin layer 20 thereon. Supporting the resin layer 20 in this way enables easier handling of the resin layer 20. The support film 21 can be peeled off from the resin layer 20 as needed. After the resin layer 20 has been cured to form the insulating layer 40, the support film 21 is preferably peeled off from the insulating layer 40. The same description applies to the case where the insulating layer 50 is formed from the resin layer 20.

[0116] For example, the support film 21 may be, but is not limited to, an electrical insulating film. Specific examples of the support film 21 include polyethylene terephthalate (PET) films, polyimide films, polyester films, polyoxadiurea (polyparabanic acid) films, polyetheretherketone films, polyphenylene sulfide films, polyaramide films, polycarbonate films, and polyacrylate films. However, these are only examples, and the support film 21 is not necessarily one of these films.

[0117] Despite Figure 4 In the example shown in A, one surface of the resin layer 20 is covered with a support film 21, but Figure 4B, in the case where one surface of the resin layer 20 is covered with the support film 21, the other surface of the resin layer 20 may be covered with the protective film 22. The protective film 22 as well as the support film 21 may also be peeled off from the resin layer 20 as needed. Covering both surfaces of the resin layer 20 in this way enables even easier handling of the resin layer 20. This also reduces the possibility of foreign particles attaching to the resin layer 20.

[0118] For example, the protective film 22 may be, but is not limited to, an electrical insulating film. Specific examples of the protective film 22 include polyethylene terephthalate (PET) films, polyolefin films, polyester films, and polymethylpentene films. However, these are only examples, and the protective film 22 is not necessarily one of these films.

[0119] It can be seen that the resin layer 20 of the film 2 with resin according to the present embodiment is made of the above-mentioned resin composition, thereby enabling the substrate to be manufactured while reducing the warpage thereof.

[0120] (4) Metal foil sheet with resin

[0121] Figure 5 The metal foil sheet 3 with resin according to the present embodiment is shown. The metal foil sheet 3 with resin has a film or sheet shape as a whole. The metal foil sheet 3 with resin includes: a resin layer 30 containing a resin composition or a semi-cured product of a resin composition; and a metal foil sheet 31 combined with the resin layer 30. For example, the metal foil sheet 3 with resin can be used to form a printed wiring board 5 having multiple layers (by an additive method).

[0122] When heated or irradiated with light (eg, ultraviolet rays), the resin layer 30 is cured to form the insulating layer 40 of the metal-clad laminate 4 or the insulating layer 50 of the printed wiring board 5 (see Figure 6-7 B) The resin layer 30 is the same as the resin layer 10 of the prepreg 1 except that the resin layer 30 is not impregnated into the base material 11 .

[0123] The thickness of the resin layer 30 is not limited to any specific value, but may be, for example, equal to or greater than 10 μm and equal to or less than 120 μm. This enables the thickness of the substrate to be reduced.

[0124] The metal foil sheet 31 is bonded to the resin layer 30. The metal foil sheet 31 may be specifically, but not limited to, a copper foil sheet, an aluminum foil sheet, or a nickel foil sheet. For example, the metal foil sheet 31 may be patterned into a conductor line 51 (for example, see FIG. 5 ) by etching away its unnecessary portion using a subtractive method. Figure 7 A).

[0125] The thickness of the metal foil sheet 31 is not limited to any specific value, but is preferably equal to or greater than 0.2 μm and equal to or less than 35 μm.

[0126] If the metal foil sheet 31 is constructed as an extremely thin metal foil sheet, from the perspective of improving its handling properties, the metal foil sheet 31 preferably forms a part of an extremely thin metal foil sheet with a carrier. The extremely thin metal foil sheet with a carrier includes a metal foil sheet 31 (extremely thin metal foil sheet), a peelable layer and a carrier. In this case, for example, the thickness of the metal foil sheet 31 is equal to or less than 10 μm. The peelable layer is used to temporarily combine the metal foil sheet 31 with the carrier. The metal foil sheet 31 is peeled off from the peelable layer or the carrier as needed. The carrier is a support for the metal foil sheet 31 supported thereon. Specific examples of the carrier include copper foil sheets and aluminum foil sheets. The carrier is thicker than the metal foil sheet 31.

[0127] It can be seen that the resin layer 30 of the metal foil sheet 3 with resin according to the present embodiment is made of the above-mentioned resin composition, thereby enabling the substrate to be manufactured while reducing its warpage.

[0128] (5) Metal-clad laminate

[0129] Figure 6 A metal-clad laminate 4 according to the present embodiment is shown. The metal-clad laminate 4 includes an insulating layer 40 and a metal layer 41 bonded to the insulating layer 40. The insulating layer 40 includes a cured product of a resin composition or a cured product of a prepreg 1. The metal-clad laminate 4 can be used as a material of a printed wiring board 5, for example.

[0130] Although the single insulating layer 40 is Figure 6 The illustrated example includes a single substrate 42 , but a single insulating layer 40 may include more than two substrates 42 .

[0131] The thickness of the insulating layer 40 is not limited to any specific value, but may be, for example, equal to or greater than 10 μm and equal to or less than 120 μm. This enables the thickness of the substrate to be reduced.

[0132] Although in Figure 6 In the example shown, the metal layer 41 is respectively bonded to both surfaces of the insulating layer 40, but the metal layer 41 may be bonded to only one surface of the insulating layer 40. The metal-clad laminate 4 having the metal layer 41 bonded to both surfaces of the insulating layer 40 is a double-sided metal-clad laminate. The metal-clad laminate 4 having the metal layer 41 bonded to only one surface of the insulating layer 40 is a single-sided metal-clad laminate.

[0133] For example, the metal layer 41 may be, but is not limited to, a metal foil sheet. For example, the metal foil sheet may be, but is not limited to, a copper foil sheet, an aluminum foil sheet, or a nickel foil sheet.

[0134] The thickness of the metal layer 41 is not limited to any specific value, but may be, for example, equal to or greater than 0.2 μm and equal to or less than 35 μm. If the metal layer 41 is configured as an extremely thin metal foil sheet, the metal layer 41 preferably forms a part of the extremely thin metal foil sheet with a carrier from the viewpoint of improving its handling properties. The extremely thin metal foil sheet with a carrier is as described above.

[0135] It can be seen that the insulating layer 40 of the metal-clad laminate 4 according to the present embodiment is made of the above-mentioned resin composition, thereby enabling the substrate to be manufactured while reducing the warpage thereof.

[0136] (6) Printed circuit board

[0137] Figure 7 7A and 7B show printed wiring boards 5 according to the present embodiment. Each of the printed wiring boards 5 includes an insulating layer 50 and a conductor line 51 formed on the insulating layer 50. The insulating layer 50 contains a cured product of a resin composition or a cured product of a prepreg 1.

[0138] Figure 7 The printed wiring board 5 shown in A includes a single insulating layer 50. Figure 7 In A, a single insulating layer 50 includes a single substrate 52. However, this is only an example and should not be construed as limiting. Alternatively, a single insulating layer 50 may include more than two substrates 52. On the other hand, Figure 7 The printed wiring board 5 shown in B includes a plurality of (specifically, three) insulating layers 50, namely a first insulating layer 510, a second insulating layer 520, and a third insulating layer 530. The three insulating layers 50 are sequentially stacked on each other in the thickness direction and are bonded to each other. Figure 7 In FIG. 4B , each of the first insulating layer 510 , the second insulating layer 520 and the third insulating layer 530 may not include the substrate 52 , or may include one or more substrates 52 . It can be seen that the insulating layer 50 is the same as the insulating layer 40 of the metal-clad laminate 4 described above.

[0139] exist Figure 7 In the printed wiring board 5 shown in A, the conductor line 51 is formed on each of both surfaces of the insulating layer 50. Alternatively, the conductor line 51 may be formed on only one surface of the insulating layer 50.

[0140] On the other hand, Figure 7In the printed wiring board 5 shown in FIG. B, the conductor line 51 includes an internal circuit 511 and an external circuit 512. The internal circuit 511 is located between two insulating layers 50. Specifically, the internal circuit 511 is located between the first insulating layer 510 and the second insulating layer 520, and between the second insulating layer 520 and the third insulating layer 530. The external circuit 512 is located outside the insulating layer 50. That is, the external circuit 512 is formed on the surface of the first insulating layer 510 and on the surface of the third insulating layer 530. Figure 7 The printed wiring board 5 shown in B further includes through-holes 8 and blind vias 9. The through-holes 8 and blind vias 9 electrically connect the internal circuit 511 and the external circuit 512 to each other. That is, the internal circuit 511 and the external circuit 512 are interconnected via the through-holes 8 and the blind vias 9.

[0141] The conductor line 51 may be formed by, for example, but not limited to, a subtractive method or a semi-additive method (SAP).

[0142] It can be seen that the insulating layer 50 of the printed wiring board 5 according to the present embodiment is made of the above-mentioned resin composition, thereby enabling the substrate to be manufactured while reducing its warpage.

[0143] (7) Semiconductor package

[0144] Figure 8 A semiconductor package 100 according to the present embodiment is shown. The semiconductor package 100 includes a printed wiring board 5 and a semiconductor chip 7 mounted on the printed wiring board 5. In this case, the printed wiring board 5 is also referred to as a "package substrate", "module substrate" or "interposer". The printed wiring board 5 includes at least one insulating layer 50. The insulating layer 50 includes at least one substrate 52. Optionally, the insulating layer 50 may not include the substrate 52.

[0145] The insulating layer 50 includes a conductor line 51. The conductor line 51 includes a pad 513. The pad 513 is formed on the surface of the insulating layer 50.

[0146] The semiconductor chip 7 is not limited to any specific semiconductor chip. The semiconductor chip 7 includes bumps 70. The bumps 70 are connected to the pads 513. This enables the semiconductor chip 7 and the printed wiring board 5 to be electrically connected to each other.

[0147] An underfill resin layer 500 is formed between the semiconductor chip 7 and the printed wiring board 5. The underfill resin layer 500 is formed by filling a gap between the semiconductor chip 7 and the printed wiring board 5 with an underfill liquid encapsulant and curing the encapsulant.

[0148] It can be seen that the semiconductor package 100 according to the present embodiment includes the printed wiring board 5 , and thus the warpage thereof can be reduced.

[0149] Example

[0150] Next, the present disclosure will be specifically described by way of specific embodiments. Note that the embodiments described below are merely embodiments of the present disclosure and should not be construed as limiting.

[0151] (1) Resin composition

[0152] The materials of the resin composition are as follows:

[0153] <Curable Resin>

[0154] 《Long-chain compounds (A1)》

[0155] A maleimide compound (A5) represented by the formula (a5), product name "BMI-689", produced by Designer Molecules Inc. (DMI), maleimide group equivalent weight is 345 g / ep;

[0156] A maleimide compound (A4) represented by the formula (a4), product name "BMI-1500", produced by Designer Molecules Inc. (DMI), maleimide group equivalent weight 750 g / ep;

[0157] A maleimide compound (A3) represented by the formula (a3), product name "BMI-3000", produced by Designer Molecules Inc. (DMI), maleimide group equivalent weight is 1500 g / ep;

[0158] 《No long-chain compounds (A2)》

[0159] A maleimide compound (A7) represented by the formula (a7), product name "BMI-5100", produced by Daiwa Kasei Industry Co., Ltd., maleimide group equivalent weight 221 g / ep;

[0160] 《Resin component (B)》

[0161] [Epoxides]

[0162] Dicyclopentadiene epoxy resin, product name "HP-7200", produced by DIC Corporation, epoxy equivalent weight is 254-264g / eq;

[0163] Naphthalene epoxy resin, product name "HP-9500", produced by DIC Corporation, epoxy equivalent weight 230 g / eq;

[0164] [Phenolic compounds]

[0165] Phenol novolac, product name "TD-2090", manufactured by DIC Corporation, hydroxyl equivalent weight 105 g / eq;

[0166] <Styrene Copolymer (C)>

[0167] ·Hydrogenated methylstyrene (ethylene / butylene) methylstyrene copolymer, hydrogenated styrene thermoplastic elastomer (SEBS), product name " V9827”, produced by Kuraray Co., Ltd., with a weight average molecular weight of 92,000;

[0168] <Acrylic resin>

[0169] Acrylic resin, product name "KV-8161", produced by Shin-Nakamura Chemical Co., Ltd;

[0170] <Inorganic filler (D)>

[0171] Fused silica, product name "SC2050-MTX", produced by Admatechs, with an average particle size of 0.5 μm; and

[0172] <Other components (E)>

[0173] · 2-Ethyl-4-methylimidazole, "2E4MZ", manufactured by Shikoku Chemicals Corporation.

[0174] The long chain-containing compound (A1), the long chain-free compound (A2), the resin component (B), the styrene copolymer (C), the inorganic filler (D) and the other components (E) are mixed together to obtain any one of the compositions shown in the following Tables 1 and 2, and mixed with a suitable solvent. The mixture is stirred uniformly. In this way, a varnish of a resin composition is prepared.

[0175] (2) Prepreg

[0176] The prepreg was prepared by impregnating a piece of glass cloth (#2116 type, WEA116E, produced by NittoBoseki Co., Ltd., E glass, thickness 0.1 mm) with varnish, and then heating and drying the glass cloth impregnated with the varnish for about two to eight minutes.

[0177] (3) Metal-clad laminate

[0178] Two such prepregs are stacked on each other. The laminate thus obtained is sandwiched between two copper foil sheets each having a thickness of 12 μm. Then, the assembly is heated to 220° C. under a pressure of 3 MPa for two hours. In this way, a double-sided copper-clad laminate (as an exemplary double-sided metal-clad laminate) with a thickness of about 0.2 mm is manufactured. The following test is carried out by using it as an evaluation substrate.

[0179] (4) Experiment

[0180] (4.1) Loss tangent (tanδ)

[0181] First, an unclad plate was obtained by etching away the copper foil sheet from both sides of the evaluation substrate. Next, the unclad plate was cut into strips with a width of 5 mm in an offset direction with a 45-degree inclination relative to the warp direction of the substrate, thereby obtaining a sample with a length of 25 mm. Under conditions including a fixture spacing of 10 mm, a heating rate of 5°C / min, a frequency of 10 Hz, and the tensile mode adopted, a dynamic mechanical analysis (DMA) was performed on this sample using a dynamic mechanical spectrometer (DMS6100, manufactured by SII Nanotechnology Inc.). By performing this measurement, the minimum value in the range of 100°C to 200°C was obtained as the loss tangent (tan δ).

[0182] Next, Max(B) / Max(A) is obtained based on the tan δ-temperature curve. In particular, Figure 1 tan δ-temperature curves of the first specific embodiment and the third specific embodiment and the first comparative example, the second comparative example, the fourth comparative example and the fifth comparative example are shown in FIG.

[0183] (4.2) Warpage of the package

[0184] First, a semiconductor package (PKG) is manufactured to measure the warpage of the package (refer to Figure 8 ). Specifically, unnecessary portions of the copper foil sheet on one side of the evaluation substrate (12 mm × 12 mm in size) were etched away to form a conductor line (as a pad). In addition, the copper foil sheet on the other side of the evaluation substrate was completely etched away. On the other hand, a semiconductor chip having a size of 10 mm × 10 mm × 0.1 mm (thickness) was provided. The semiconductor chip had bumps.

[0185] Then, the bumps of the semiconductor chip were bonded to the pads of the evaluation substrate, and the gap between the evaluation substrate and the semiconductor chip was filled with a bottom-fill liquid encapsulant (product name "CV5300AM", produced by Panasonic Corporation), and then the encapsulant was cured. In this way, a simple semiconductor package for measuring the warpage of the package was produced.

[0186] Next, the warpage of the semiconductor package is measured by using a warpage measurement tool (model "TherMoiré PS200", manufactured by Akrometrix Corporation) based on the shadow moiré measurement principle. Specifically, the warpage of the package is measured in the following manner. The semiconductor package is heated twice. The first time, the semiconductor package is heated from 30°C (starting temperature) to 260°C, and then cooled to 30°C (ending temperature). The second time, the semiconductor package is also heated from 30°C (starting temperature) to 260°C, and then cooled to 30°C (ending temperature). The second warpage at 30°C is defined as the warpage of the package. Note that when the semiconductor package is heated for the second time, its warpage at the starting temperature is approximately the same as its warpage at the ending temperature.

[0187] (4.3) Glass transition temperature (Tg)

[0188] First, an unclad plate is obtained by etching away copper foil sheets from both sides of the evaluation substrate. Next, a viscoelastic spectrometer (DMS100) manufactured by Seiko Instruments, Inc is used to measure the glass transition temperature (Tg) of the unclad plate. At this time, a bending module with a frequency setting of 10 Hz is used for dynamic mechanical analysis (DMA). The temperature at which the loss tangent (tan δ) reaches a local maximum when the temperature is increased from room temperature to 320°C at a heating rate of 5°C / min is defined as the glass transition temperature (Tg). Note that the glass transition temperature (Tg) above 300°C is represented by ">300" in Tables 1 and 2.

[0189] (4.3) Heat resistance

[0190] A test piece with a size of 5 em×5 em was cut out from the evaluation substrate and then loaded into a 290°C dryer for 1 hour. After that, the test piece was taken out of the dryer, visually observed, and rated according to its heat resistance as follows:

[0191] Grade A: The test piece does not expand; or

[0192] Grade B: The test piece swells.

[0193]

[0194]

[0195] Reference numerals list

[0196] 1 Prepreg

[0197] 10 Resin layer

[0198] 11. Substrate

[0199] 2 Film with resin

[0200] 20 Resin layer

[0201] 21 Support film

[0202] 3 Metal foil sheet with resin

[0203] 30 Resin layer

[0204] 31. Metal foil

[0205] 4 Metal-clad laminate

[0206] 40 Insulation layer

[0207] 41 Metal layer

[0208] 5. Printed Circuit Board

[0209] 50 Insulation layer

[0210] 51 Conductor lines

Claims

1. A resin composition comprising a curable resin and an inorganic filler, The minimum value of the loss tangent (tanδ=E" / E') of the cured product of the resin composition is equal to or greater than 0.04, the loss tangent being the ratio of the loss modulus (E") of the cured product of the resin composition to the storage modulus (E') thereof, the loss modulus (E"), the storage modulus (E') and the loss tangent (tanδ=E" / E') being obtained by dynamic mechanical analysis at a temperature equal to or higher than 100°C and equal to or lower than 200°C, The curable resin comprises a long-chain compound, The long chain-containing compound includes at least one selected from the group consisting of a maleimide compound (A3) represented by the following formula (a3), a maleimide compound (A4) represented by the following formula (a4), and a maleimide compound (A5) represented by the following formula (a5): (a3) wherein n is an integer ranging from 1 to 10; (a4) wherein n is an integer ranging from 1 to 10; (a5)； The curable resin further comprises a compound without long chains, The long chain-free compound includes a maleimide compound represented by the following formula (a7): (a7)； The resin composition further comprises a resin component (B), The resin component (B) includes an epoxy compound.

2. The resin composition according to claim 1, wherein The ratio of Max (B) to Max (A) is less than 1, wherein Max (B) is the maximum value of the loss tangent of the cured product measured by dynamic mechanical analysis at a temperature equal to or higher than 100°C and equal to or lower than 200°C, and Max (A) is the maximum value of the loss tangent of the cured product measured by dynamic mechanical analysis at a temperature equal to or higher than 30°C and lower than 100°C and at a temperature higher than 200°C and equal to or lower than 300°C.

3. The resin composition according to claim 1 or 2, further comprising a styrene copolymer.

4. A prepreg, comprising: Base material; and a resin layer containing the resin composition according to any one of claims 1 to 3 or a semi-cured product of the resin composition, the resin composition or the semi-cured product of the resin composition being impregnated into the substrate.

5. A film having a resin, comprising: A resin layer comprising the resin composition according to any one of claims 1 to 3 or a semi-cured product of the resin composition; and a supporting film for supporting the resin layer.

6. A metal foil sheet with resin, comprising: A resin layer comprising the resin composition according to any one of claims 1 to 3 or a semi-cured product of the resin composition; and a metal foil sheet combined with the resin layer.

7. A metal-clad laminate, comprising: An insulating layer comprising a cured product of the resin composition according to any one of claims 1 to 3 or a cured product of the prepreg according to claim 4; and a metal layer combined with the insulating layer.

8. A printed circuit board, comprising: An insulating layer comprising a cured product of the resin composition according to any one of claims 1 to 3 or a cured product of the prepreg according to claim 4; and a conductor line formed on the insulating layer.

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