A liquid storage tank for integrated thermal management and an integrated thermal management module including the tank.

Abstract

A liquid storage tank for integrated thermal management is disclosed, the liquid storage tank comprising: a first liquid storage section connected to an electronic component line connected to an electronic component core, such that cooling water flowing into / out of the electronic component line is stored in the first liquid storage section; and a second liquid storage section connected to a battery line connected to a high-voltage battery core, such that cooling water flowing into / out of the battery line is stored separately from the cooling water stored in the first liquid storage section in the second liquid storage section.

Description

Technical Field

[0001] This disclosure relates to a reservoir for integrated thermal management and an integrated thermal management module including the reservoir, and more particularly to a reservoir configured to integrally store cooling water flowing to battery lines and cooling water flowing to electronic device component lines. Background Technology

[0002] In recent years, electric vehicles have emerged as a social issue in order to implement environmentally friendly technologies and address problems such as energy depletion. Electric vehicles are powered by motors that receive electricity from batteries and output power. Therefore, electric vehicles have garnered significant attention as environmentally friendly vehicles because they emit no carbon dioxide, produce negligible noise, and their motors are more energy-efficient than engines.

[0003] Battery module technology is crucial for realizing such electric vehicles, and recent research has focused on making batteries lighter, smaller, and reducing charging time. Battery modules need to operate within optimal temperature environments to maintain best performance and long lifespan. However, the heat generated during driving and external temperature variations make it difficult to operate in these optimal temperature environments.

[0004] Recently, integrated thermal management systems have been developed that integrate such battery cooling / heating systems with air conditioning systems used for vehicle interior air conditioning, allowing them to operate together. However, a problem with existing technologies is that the thermal management of batteries, which need to be controlled within different temperature ranges, and the thermal management of electronic device components can interfere with each other, making them difficult to control independently.

[0005] The relevant prior art is Korean patent KR10-1448656B1.

[0006] The above description of the background technology is only for the purpose of helping to understand the background of this disclosure, and those skilled in the art should not assume that it corresponds to known prior art. Summary of the Invention

[0007] Technical issues

[0008] This disclosure is made to solve the above-mentioned problems, and its purpose is to provide a liquid storage tank for integrated thermal management and an integrated thermal management module including the liquid storage tank, wherein an integrated liquid storage tank and a device integrated with the liquid storage tank are used, and they can be independently controlled for thermal management.

[0009] Technical solution

[0010] To address the aforementioned problems, a liquid storage tank for integrated thermal management according to this disclosure includes: a first liquid storage section connected to an electronic device component line connected to an electronic device component core, such that cooling water flowing into / out of the electronic device component line is stored in the first liquid storage section; and a second liquid storage section connected to a battery line connected to a high-voltage battery core, such that cooling water flowing into / out of the battery line is stored separately from the cooling water stored in the first liquid storage section in the second liquid storage section.

[0011] The liquid storage tank for integrated thermal management may further include a partition barrier that extends upward from the lower surface of the tank between the first liquid storage section and the second liquid storage section to divide the first liquid storage section and the second liquid storage section.

[0012] The liquid storage tank for integrated thermal management may further include an injection barrier that extends in a plane parallel to the ground in a first or second liquid storage section.

[0013] The first liquid storage section and the second liquid storage section can be interconnected at the upper part of the injection barrier, and can pass through the injection barrier to form a through hole, so that the upper and lower parts of the injection barrier are interconnected.

[0014] The liquid storage tank for integrated thermal management may further include an inlet formed through the tank wall, such that the first liquid storage section and the second liquid storage section are in communication with each other at the top, and that the interior of the first liquid storage section and the interior of the second liquid storage section are in communication with the outside.

[0015] The first liquid reservoir may have a first inlet formed to allow cooling water to flow into the electronic device assembly pipeline and a first outlet formed to allow cooling water to be discharged to the electronic device assembly pipeline. The first inlet may be located in the lower part of the injection barrier and the first outlet may be located at a position relatively lower than the first inlet.

[0016] The second liquid reservoir may have a second inlet formed to allow cooling water to flow into the battery line and a second outlet formed to allow cooling water to drain out of the battery line. The second inlet may be located in the lower part of the injection barrier and the second outlet may be located at a position relatively lower than the second inlet.

[0017] To address the aforementioned issues, an integrated thermal management module including a reservoir for integrated thermal management may further include: a cooler, directly or indirectly coupled to be integrally connected to the reservoir, such that refrigerant and cooling water flowing in / out exchange heat with each other; a first pump, connected to a first outlet for discharging cooling water from a first reservoir, to circulate cooling water through electronic device component lines; a first valve configured to regulate the flow of cooling water from the first reservoir and cooling water that has passed through the cooler into the first pump; a second pump, connected to a second outlet for discharging cooling water from a second reservoir, to circulate cooling water through battery lines; and a second valve configured to regulate the flow of cooling water from the second reservoir and cooling water that has passed through the cooler into the second pump.

[0018] The cooler can be configured such that cooling water flows in from electronic device component lines and from battery lines, and the cooling water flows separately from each other.

[0019] The integrated thermal management module may further include: a first branch pipe, branching between the first radiator and the cooler, allowing cooling water to flow into the electronic device component line after passing through the electronic device component core; and a second branch pipe, branching between the second radiator and the cooler, allowing cooling water to flow into the battery line after passing through the high-voltage battery core, and the first and second branch pipes may be integrally connected to the cooler or the reservoir.

[0020] The integrated thermal management module may further include: a first discharge line extending between the cooler and a first valve, such that cooling water from the electronic device component line discharged from the cooler flows into the first valve; and a second discharge line extending between the cooler and a second valve, such that cooling water from the battery line discharged from the cooler flows into the second valve, and the first discharge line and the second discharge line may be integrally connected to the cooler or the reservoir.

[0021] The first pump and the second pump can be integrally connected to the cooler or the liquid storage tank, and the rotation direction of the first pump during operation is opposite to that of the second pump during operation.

[0022] The integrated thermal management module may further include a controller integrally coupled to the first pump and the second pump to jointly control the drive of the first pump and the second pump.

[0023] Beneficial effects of the present invention

[0024] According to this disclosure, an advantage of a liquid storage tank for integrated thermal management and an integrated thermal management module including the liquid storage tank is that a single liquid storage tank includes a first liquid storage section and a second liquid storage section having mutually separated spaces, which enables the reduction of manufacturing costs while providing packaging efficiency.

[0025] Another advantage is that the refrigerant is heated by the waste heat of the cooling water that is heated by the high-voltage battery or electronic equipment components, thereby improving the overall energy efficiency of the integrated cooling circuit. Attached Figure Description

[0026] Figure 1 This is a perspective view of an integrated thermal management module including a liquid storage tank for integrated thermal management, according to an embodiment of the present disclosure.

[0027] Figure 2 This is an AA cross-sectional view of a liquid storage tank for integrated thermal management according to an embodiment of the present disclosure.

[0028] Figure 3 A thermal management loop is shown according to an embodiment of the present disclosure, including an integrated thermal management module for an integrated thermal management tank.

[0029] Figure 4 This is a BB cross-sectional view of an integrated thermal management module according to an embodiment of the present disclosure.

[0030] Figure 5 This is an exploded perspective view of the first and second pumps of the integrated thermal management module according to an embodiment of the present disclosure. Detailed Implementation

[0031] The specific structural or functional descriptions of embodiments of this disclosure set forth in the specification or application are merely for the purpose of describing embodiments according to this disclosure. Therefore, embodiments according to this disclosure may be implemented in various forms, and this disclosure should not be construed as being limited to the embodiments described in the specification or application.

[0032] Various changes and modifications can be made to the embodiments according to this disclosure, and therefore specific embodiments will be illustrated in the accompanying drawings and described in the specification or application. However, it should be understood that the embodiments according to the concepts of this disclosure are not limited to the specific disclosed embodiments, but rather this disclosure includes all modifications, equivalents, and alternatives falling within the spirit and scope of this disclosure.

[0033] Terms such as “first” and / or “second” may be used to describe various components, but these components should not be limited by these terms. These terms are intended only to distinguish one component from others. For example, without departing from the scope of this disclosure, a first component may be named a second component, and similarly, a second component may be named a first component.

[0034] When a component is described as being "connected" or "in contact" with other components, it should be understood that the component is not only directly connected or in contact with other components, but there may also be another component between them. Conversely, when a component is described as being "directly connected" or "directly in contact" with any other component, it should be understood that there is no component between them. Other expressions describing the relationships between structural components, namely "between" and "only between," or "adjacent to" and "directly adjacent to," should be interpreted similarly to the descriptions above.

[0035] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the disclosure. Singular expressions may include plural expressions unless they are clearly distinguished in the context. As used herein, the terms “comprising” or “having” are intended to indicate the presence of the mentioned features, quantities, steps, operations, components, parts or combinations thereof, and should be construed as not excluding the possibility of the presence or addition of one or more other features, quantities, steps, operations, components, parts or combinations thereof.

[0036] Unless otherwise defined, all terms used herein, including technical and scientific terms, shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Such terms, as defined in a general dictionary, may be interpreted as having the same meaning as in the context of the relevant technical field, and shall not be construed as having an ideal or overly formal meaning unless expressly defined in this disclosure.

[0037] In the following, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Similar or identical reference numerals appearing in the drawings denote similar or identical parts.

[0038] Figure 1 This is a perspective view of an integrated thermal management module 1000 including a liquid storage tank 200 for integrated thermal management, according to an embodiment of the present disclosure. Figure 2 This is a cross-sectional view (AA) of a liquid storage tank 200 for integrated thermal management according to an embodiment of the present disclosure.

[0039] Reference Figure 1 and Figure 2 According to an embodiment of the present disclosure, a liquid storage tank 200 for integrated thermal management includes: a first liquid storage section 210 connected to an electronic device component line 300 connected to an electronic device component core 310 for storing cooling water flowing into / out of the electronic device component line 300; and a second liquid storage section 220 connected to a battery line 400 connected to a high-voltage battery core 410 for storing cooling water flowing into / out of the battery line 400, while being separate from the cooling water stored in the first liquid storage section 210.

[0040] The liquid storage tank 200 disclosed herein can be a case surrounded by walls, thereby forming a space therein. The liquid storage tank 200 may include a first liquid storage section 210 and a second liquid storage section 220.

[0041] The first liquid reservoir 210 can be connected to allow cooling water to flow into / out of the electronic device assembly line 300, and the second liquid reservoir 220 can be connected to allow cooling water to flow into / out of the battery line 400. Specifically, the electronic device assembly line 300 used for cooling the electronic device assembly and the battery line 400 used for cooling the high-voltage battery need to be maintained at different temperatures, therefore, the temperature of the cooling water needs to be controlled differently.

[0042] The first liquid storage section 210 and the second liquid storage section 220 may have mutually separate internal spaces, thereby preventing the cooling water stored in each internal space from mixing or exchanging heat.

[0043] Therefore, a single liquid storage tank 200 includes a first liquid storage section 210 and a second liquid storage section 220 having mutually separated spaces. This approach reduces manufacturing costs while providing packaging efficiency.

[0044] Specifically, the liquid storage tank 200 may further include a partition barrier 240 extending upward from the lower surface of the liquid storage tank 200 between the first liquid storage section 210 and the second liquid storage section 220, so as to divide the first liquid storage section 210 and the second liquid storage section 220.

[0045] The partition barrier 240 may be formed to extend upward from the lower surface of the liquid storage tank 200 in order to divide the first liquid storage section 210 and the second liquid storage section 220 and separate the internal space between the first liquid storage section 210 and the second liquid storage section 220.

[0046] Therefore, it is possible to prevent the cooling water stored in the first liquid storage section 210 and the cooling water stored in the second liquid storage section 220 from mixing.

[0047] In another embodiment, the first liquid reservoir 210 and the second liquid reservoir 220 can be separated to form an empty space extending in an upward / downward direction between the first liquid reservoir 210 and the second liquid reservoir 220. This embodiment has the advantage of also preventing heat exchange between the first liquid reservoir 210 and the second liquid reservoir 220.

[0048] The liquid storage tank 200 may further include an injection barrier 250, which is formed in the first liquid storage section 210 or the second liquid storage section 220 in a plane direction parallel to the ground.

[0049] Specifically, the injection barrier 250 may be formed in the upper part of the interior of the reservoir 200 and may extend through the entire first reservoir 210 and second reservoir 220. In an embodiment, the injection barrier 250 may extend laterally from the upper end of the aforementioned separating barrier 240 and extend from the first reservoir 210 and second reservoir 220 to the inner surface of the reservoir 200.

[0050] The advantage of this is that the injection barrier 250 can reduce the flow of cooling water stored in the first reservoir 210 and the second reservoir 220, and in particular, can prevent the flow of cooling water flowing in through the inlet.

[0051] In addition, the first liquid storage section 210 and the second liquid storage section 220 can be interconnected at the upper part of the injection barrier 250, and can form a through hole 251 through the injection barrier 250, so that the upper and lower parts of the injection barrier 250 are interconnected.

[0052] The injection barrier 250 can be located above the first liquid reservoir 210 and the second liquid reservoir 220, and the first liquid reservoir 210 and the second liquid reservoir 220 can communicate with each other above the injection barrier 250. An empty space filled with air can be formed above the injection barrier 250, and the cooling water in the first liquid reservoir 210 and the second liquid reservoir 220 can partially fill the upper part of the injection barrier 250.

[0053] A through-hole 251 can be formed through the injection barrier 250, which divides the first reservoir 210 and the second reservoir 220 in the vertical direction. The through-hole 251 allows the upper and lower parts of the injection barrier 250 to communicate with each other, so that cooling water can move partially between the first reservoir 210 and the second reservoir 220 to naturally compensate for the lack of cooling water between the first reservoir 210 and the second reservoir 220.

[0054] The advantage of this is that even without separate injection of cooling water or manipulation of the movement of cooling water, the lack of cooling water can be naturally compensated by the movement of cooling water between the first reservoir 210 and the second reservoir 220 inside the reservoir 200.

[0055] The liquid storage tank 200 may further include an inlet 230 formed through the wall of the liquid storage tank 200, such that the first liquid storage section 210 and the second liquid storage section 220 are interconnected at the top, and that the interior of the first liquid storage section 210 and the interior of the second liquid storage section 220 are in communication with the outside.

[0056] The inlet 230 can be located in the upper part of the injection barrier 250, thereby communicating with both the first liquid storage section 210 and the second liquid storage section 220. Cooling water can be replenished from the outside through the inlet 230, and the replenished cooling water can be added to the first liquid storage section 210 and the second liquid storage section 220 through the through hole 251 in the upper part of the injection barrier 250.

[0057] The advantage of this is that even if cooling water is added through a single inlet 230, both the first reservoir 210 and the second reservoir 220 are also replenished with cooling water, and the cooling water is naturally distributed or replenished between the first reservoir 210 and the second reservoir 220.

[0058] The first reservoir 210 may have a first inlet 211 formed therein, allowing cooling water to flow into the electronic device assembly line 300, and may have a first outlet 212 formed therein, allowing cooling water in the first reservoir 210 to be discharged into the electronic device assembly line 300. The first inlet 211 may be located below the injection barrier 250. The first outlet 212 may be located at a position relatively lower than the first inlet 211.

[0059] The second reservoir 220 may have a second inlet 221 formed therein, allowing cooling water to flow in from the battery line 400, and may have a second outlet 222 formed therein, allowing cooling water in the second reservoir 220 to be discharged out of the battery line 400. The second inlet 221 may be located below the injection barrier 250. The second outlet 222 may be located at a position relatively lower than the second inlet 221.

[0060] The first inlet 211 and the second inlet 221 can be formed in the first reservoir 210 and the second reservoir 220 respectively at the lower part of the injection barrier 250, and cooling water can flow in from the electronic device assembly line 300 or from the battery line 400 respectively. The lower part of the injection barrier 250 can prevent the flow of cooling water flowing in through the first inlet 211 and the second inlet 221.

[0061] Furthermore, the first outlet 212 and the second outlet 222 may be located at a position lower than the first inlet 211 and the second inlet 221, respectively. In particular, the first outlet 212 and the second outlet 222 may be formed in the lower part of the first liquid storage section 210 and the second liquid storage section 220, respectively.

[0062] The advantage of this is that cooling water can be discharged from the first liquid reservoir 210 and the second liquid reservoir 220 after air bubbles are removed from them, and cooling water can be discharged to the maximum extent even if the first liquid reservoir 210 or the second liquid reservoir 220 is short of cooling water.

[0063] Figure 3 A thermal management circuit of an integrated thermal management module 1000 including a liquid storage tank 200 for integrated thermal management is shown according to an embodiment of the present disclosure.

[0064] Further reference Figure 3 According to embodiments of the present disclosure, an integrated thermal management module 1000 including a reservoir 200 for integrated thermal management may further include: a cooler 100, directly or indirectly connected to the reservoir 200 so as to be integrally connected to the reservoir 200, such that refrigerant and cooling water flowing into / out of the reservoir 200 exchange heat with each other; a first pump 340, connected to a first outlet 212 for discharging cooling water from the first reservoir 210 so as to circulate the cooling water through the electronic device assembly line 300; a first valve 330 configured to regulate the flow of cooling water in the first reservoir 210 and cooling water that has passed through the cooler 100 into the first pump 340; a second pump 440, connected to a second outlet 222 for discharging cooling water from the second reservoir 220 so as to circulate the cooling water through the battery line 400; and a second valve 430 configured to regulate the flow of cooling water in the second reservoir 220 and cooling water that has passed through the cooler 100 into the second pump 440.

[0065] The vehicle is equipped with various types of heating devices, such as electronic components including motors and inverters, high-voltage batteries, and vehicle interior air conditioning systems. These all need to be managed within different temperature ranges, and can be managed independently due to their different operating times.

[0066] The electronic device component pipeline 300 can be separate from the battery pipeline 400, allowing cooling water to flow within it, and can be connected to the electronic device component core 310 to cool the electronic device component through heat exchange. A first cooling water pipeline can be connected to the electronic device component pipeline 300, allowing cooling water to flow into and out of the electronic device component pipeline 300.

[0067] Battery line 400 allows cooling water to flow through it and can be connected to high-voltage battery cell 410 to cool the high-voltage battery through heat exchange. A second cooling water line can be connected to battery line 400 so that cooling water flows in from and is discharged from battery line 400.

[0068] The cooler 100 can be directly or indirectly connected to the reservoir 200 as an integral part. The cooler 100 can be adjacent to and fixed to the reservoir 200. Valves and pumps (described later) can be located below the reservoir 200 and the cooler 100.

[0069] The first inlet 211 of the first liquid reservoir 210 can be connected to the outlet of the first radiator 320, through which some or all of the cooling water that has passed through the electronic device component core 310 is introduced, and the second inlet 221 of the second liquid reservoir 220 can be connected to the outlet of the second radiator 420, through which some or all of the cooling water that has passed through the high-voltage battery cell 410 is introduced.

[0070] That is, cooling water cooled by the first radiator 320 can flow into the first reservoir 210, and cooling water can be discharged from the first reservoir 210 to the first valve 330. Cooling water cooled by the second radiator 420 can flow into the second reservoir 220, and cooling water can be discharged from the second reservoir 220 to the second valve 430.

[0071] The first valve 330 can regulate the cooling water in the cooler 100 and the cooling water in the first reservoir 210 so as to selectively introduce it into the electronic device component core 310. In particular, the first valve 330 can be a three-way valve and can selectively introduce the cooling water discharged from the cooler 100 and the cooling water discharged from the first reservoir 210 into the electronic device component core 310 of the electronic device component pipeline 300.

[0072] The second valve 430 can be adjusted to selectively introduce cooling water from the cooler 100 and the second reservoir 220 into the high-voltage battery cell 410. In particular, the second valve 430 can be a three-way valve and can selectively introduce cooling water discharged from the cooler 100 and cooling water discharged from the second reservoir 220 into the high-voltage battery cell 410 of the battery line 400.

[0073] The first valve 330 and the second valve 430 can be controlled to open / close by separately provided actuators. The actuators can control the first valve 330 or the second valve 430 according to commands from the controller 800. Furthermore, the first pump 340 and the second pump 40 are controlled by the controller 800.

[0074] The first pump 340 can circulate cooling water through the electronic device assembly line 300, allowing cooling water introduced from the cooler 100 or from the first reservoir 210 to flow into the electronic device assembly core 310 via the rear end of the first valve 330.

[0075] The second pump 440 can circulate cooling water through the battery line 400, allowing cooling water introduced from the second cooling water line or from the second reservoir 220 to flow selectively into the high-voltage battery cell 410 via the rear end of the second valve 430.

[0076] In an embodiment, the cooler 100 may be configured such that cooling water flows into the electronic device component line 300 and the battery line 400, and the flow of cooling water is separate from each other. The refrigerant may be configured to exchange heat with both the cooling water in the electronic device component line 300 and the cooling water in the battery line 400, which are separate from each other.

[0077] Specifically, the cooler 100 may include a first cooling water line, a second cooling water line, and a refrigerant heating line. The refrigerant heating line may be connected to exchange heat with at least one of the first and second cooling water lines. The first cooling water line may be connected to the electronic device component line 300, and the second cooling water line may be connected to the battery line 400.

[0078] The advantage of this approach is that it improves the overall energy efficiency of the integrated cooling circuit by utilizing the waste heat from the cooling water heated by the high-voltage battery or electronic device components to heat the refrigerant.

[0079] The refrigerant heating line can be connected to the refrigerant flow line, which can be connected to exchange heat with the air conditioning cooling line. The air conditioning cooling line allows coolant to flow through it and can be connected to a heating element for interior air conditioning. Air heated by this heating element can then flow into the vehicle's interior space via an air blower.

[0080] Figure 4 This is a BB cross-sectional view of an integrated thermal management module according to an embodiment of the present disclosure.

[0081] Reference Figure 4 The module may further include: a first branch pipe 600, branching between the first radiator 320 and the cooler 100, allowing cooling water already in the electronic device component pipeline 300 of the electronic device component core 310 to flow into the first branch pipe 600; and a second branch pipe 700, branching between the second radiator 420 and the cooler 100, allowing cooling water already in the battery pipeline 400 of the high-voltage battery core 410 to flow into the second branch pipe 700. The first branch pipe 600 and the second branch pipe 700 may be integrally connected to the cooler 100 or the liquid storage tank 200.

[0082] The first branch pipe 600 and the second branch pipe 700 can respectively discharge the tributaries of cooling water flowing into the electronic device component line 300 and the battery line 400. In particular, the flow direction of the cooling water in the first branch pipe 600 and the second branch pipe 700 can be changed by adjusting the opening degree of the first valve 330 and the second valve 430, respectively.

[0083] The first branch pipe 600 allows cooling water heated by the electronic device component core 310 to branch between the first radiator 320 and the cooler 100. The second branch pipe 700 allows cooling water heated by the high-voltage battery core 410 to branch between the second radiator 420 and the cooler 100.

[0084] Specifically, both the first branch pipe 600 and the second branch pipe 700 can be integrally connected to the liquid storage tank 200 or the cooler 100. The advantage of doing so is that manufacturing costs can be reduced by decreasing the number of components, while providing encapsulation efficiency.

[0085] The module may further include: a first discharge line 110 extending between the cooler 100 and the first valve 330, such that cooling water from the electronic device component line 300 discharged from the cooler 100 flows into the first valve 330; and a second discharge line 120 extending between the cooler 100 and the second valve 430, such that cooling water from the battery line 400 discharged from the cooler 100 flows into the second valve 430. The first discharge line 110 and the second discharge line 120 may be integrally connected to the cooler 100 or the reservoir 200.

[0086] Figure 5 This is an exploded perspective view of the first and second pumps of the integrated thermal management module according to an embodiment of the present disclosure.

[0087] Reference Figure 5 The first pump 340 and the second pump 440 can be integrally connected to the cooler 100 or the liquid storage tank 200, and the rotation direction of the first pump 340 during operation can be opposite to the rotation direction of the second pump 440 during operation.

[0088] The first pump 340 and the second pump 440 can be integrally connected to the liquid storage tank 200 or the cooler 100. The first pump 340 and the second pump 440 can also be integrally connected to the first valve 330 and the second valve 430.

[0089] In an embodiment, it is assumed that the first pump 340 rotates clockwise during drive, and the second pump 440 can rotate in the opposite direction (counterclockwise).

[0090] In another embodiment, the first pump 340 and the second pump 440 may be configured such that the rotation axes of the first pump 340 and the second pump 440 are offset from or perpendicular to each other.

[0091] Therefore, when the first pump 340 and the second pump 440 operate simultaneously, the vibrations caused by rotation in the aforementioned directions cancel each other out, thereby improving vibration performance. Another advantage is that the first pump 340 and the second pump 440 are integrally connected to the liquid storage tank 200 and the cooler 100, thus increasing their mass and improving vibration performance when operating individually.

[0092] The module may further include a controller 800 integrally coupled to the first pump 340 and the second pump 440 to jointly control the drive of the first pump 340 and the second pump 440. Additionally, the controller 800 may control actuators for driving the first valve 330 and the second valve 430.

[0093] The controller 800 can be integrally connected to the first pump 340 and the second pump 440 to control the first pump 340 and the second pump 440. In particular, the controller 800 can communicate with the vehicle's motor control unit (MCU), battery management system (BMS), electronic equipment component control unit, or electronic control unit (ECU) to control the drive of the first pump 340 and the second pump 440.

[0094] Although the present disclosure has been described and illustrated in conjunction with specific embodiments, it will be apparent to those skilled in the art that various improvements and modifications can be made to the present disclosure without departing from the technical spirit of the disclosure as defined by the appended claims.

[0095] [Brief Explanation of Figure Labels]

[0096] 100: Cooler

[0097] 200: Liquid storage tank; 210: First liquid storage section

[0098] 220: Second liquid storage section; 230: Inlet port

[0099] 240: Separation Barrier 250: Injection Barrier

[0100] 300: Electronic device component wiring; 400: Battery wiring

[0101] 500: Refrigerant flow line; 600: First branch pipe

[0102] 700: Second branch pipe; 800: Controller

Claims

1. An integrated thermal management module, comprising: Liquid storage tank, including: A first liquid reservoir is connected to an electronic device component pipeline connected to the electronic device component core, such that cooling water flowing into / out of the electronic device component pipeline is stored in the first liquid reservoir; and The second liquid storage section is connected to the battery pipeline connected to the high-voltage battery cell, such that the cooling water flowing into / out of the battery pipeline is stored separately from the cooling water stored in the first liquid storage section in the second liquid storage section; A cooler, directly or indirectly connected to the liquid storage tank, allows the refrigerant and cooling water flowing in / out to exchange heat with each other; A first pump is connected to a first outlet for cooling water that discharges from the first reservoir, so that cooling water circulates through the piping of the electronic equipment components. The first valve is configured to regulate the flow of cooling water in the first reservoir and cooling water that has passed through the cooler into the first pump. A second pump is connected to a second outlet for the cooling water that discharges from the second reservoir, so that the cooling water circulates through the battery lines; and The second valve is configured to regulate the cooling water in the second reservoir and the cooling water that has passed through the cooler so that it selectively flows into the second pump.

2. The integrated thermal management module according to claim 1, characterized in that, It further includes a partition barrier that extends upward from the lower surface of the reservoir between the first and second liquid storage sections to divide the first and second liquid storage sections.

3. The integrated thermal management module according to claim 1, characterized in that, It further includes an injection barrier that extends in the first or second liquid reservoir in a plane parallel to the ground.

4. The integrated thermal management module according to claim 3, characterized in that, The first liquid storage section and the second liquid storage section are interconnected at the upper part of the injection barrier and form a through hole through the injection barrier, so that the upper and lower parts of the injection barrier are interconnected.

5. The integrated thermal management module according to claim 1, characterized in that, It further includes an injection port that is formed through the wall of the liquid storage tank, such that the first liquid storage section and the second liquid storage section are interconnected at the top, and that the interior of the first liquid storage section and the interior of the second liquid storage section are in communication with the outside.

6. The integrated thermal management module according to claim 3, characterized in that, The first reservoir has a first inlet formed to allow cooling water to flow into the electronic device assembly pipeline and a first outlet formed to allow cooling water in the first reservoir to drain out of the electronic device assembly pipeline. The first inlet is located in the lower part of the injection barrier, and the first outlet is located at a position relatively lower than the first inlet.

7. The integrated thermal management module according to claim 3, characterized in that, The second reservoir has a second inlet formed to allow cooling water to flow into the battery line and a second outlet formed to allow cooling water in the second reservoir to drain out of the battery line. The second inlet is located in the lower part of the injection barrier, and the second outlet is located at a position relatively lower than the second inlet.

8. The integrated thermal management module according to claim 1, characterized in that, The cooler is configured such that cooling water flows into the cooler from the electronic device component lines and into the cooler from the battery lines, and the cooling water flows separately from each other.

9. The integrated thermal management module according to claim 1, characterized in that, Further includes: The first branch pipe branches between the first radiator and the cooler, allowing cooling water to flow from the electronic device assembly line after passing through the electronic device assembly core. as well as The second branch pipe branches between the second radiator and the cooler, allowing cooling water to flow into the battery pipeline after passing through the high-voltage battery cell. The first branch pipe and the second branch pipe are integrally connected to the cooler or the liquid storage tank.

10. The integrated thermal management module according to claim 1, characterized in that, Further includes: A first discharge line extends between the cooler and the first valve, such that cooling water from the electronic device component line discharged from the cooler flows into the first valve. as well as A second discharge line extends between the cooler and the second valve, such that cooling water from the battery line discharged from the cooler flows into the second valve. The first discharge pipeline and the second discharge pipeline are integrally connected to the cooler or the liquid storage tank.

11. The integrated thermal management module according to claim 1, characterized in that, The first pump and the second pump are integrally connected to the cooler or the liquid storage tank, and the rotation direction of the first pump during operation is opposite to that of the second pump during operation.

12. The integrated thermal management module according to claim 1, characterized in that, The system further includes a controller integrally coupled to the first pump and the second pump to jointly control the drive of the first pump and the drive of the second pump.

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