A method and device for processing silver-copper solder

Abstract

The present application is applicable to the field of electroplating technology, and provides a method and device for processing silver-copper solder, the method comprising: placing the workpiece before electroplating in a processing tank for processing for a first preset time to obtain a processed workpiece; placing a processing solution in the processing tank, the processing solution containing potassium permanganate; placing the processed workpiece in a reduction tank for reduction for a second preset time to obtain a reduced workpiece; placing a reducing solution in the reduction tank, the reducing solution containing ferrous sulfate; placing the reduced workpiece in a cleaning tank for cleaning for a third preset time to obtain a cleaned workpiece; placing the cleaned workpiece in a pickling tank for cleaning for a fourth preset time to obtain a pickled workpiece. The method of the present application can effectively remove solder, scale, oil stains, organic impurities, etc. on the surface of the material, eliminate the excessive corrosion of the plated parts and damage to the electroplating equipment by the strong acid environment, and ensure the quality of the product.

Description

Technical Field

[0001] The present invention relates to the field of electroplating technology, and more particularly to a method and device for processing silver-copper solder. Background Art

[0002] In the electroplating industry, the way solder is handled in the field of ceramic packaging directly affects the quality of the products produced. In the traditional electroplating process, most of the solder on the workpiece is not treated or chromic acid is used to treat the solder on the workpiece. If the solder is not treated before electroplating, it is impossible to ensure that the product surface is clean, flat and free of defects, which will greatly increase the probability of pits, peeling, and uneven color on the plated parts during electroplating. If chromic acid is used to treat the solder, the chromic acid system is highly toxic and has serious harm to the human body and the environment. The strong acid environment formed may cause over-corrosion of the plated parts, causing irreversible damage to the tank body and driving devices of the plating tank. Therefore, how to perform appropriate silver-copper solder treatment to ensure the quality of the plated parts needs to be solved urgently. Summary of the invention

[0003] In order to overcome the problems existing in the related art, the embodiments of the present application provide a method and device for processing silver-copper solder, which solves the problem of how to perform appropriate silver-copper solder processing to ensure the quality of plated parts.

[0004] This application is implemented through the following technical solutions:

[0005] In a first aspect, an embodiment of the present application provides a method for processing silver-copper solder, comprising: placing a workpiece before electroplating in a processing tank for processing for a first preset time to obtain a processed workpiece; a processing solution is placed in the processing tank, and the processing solution contains potassium permanganate; silver solder or copper solder remains on the surface of the workpiece;

[0006] Placing the workpiece to be processed in a reduction tank for reduction for a second preset time to obtain a reduced workpiece; a reducing solution is placed in the reduction tank, and the reducing solution contains ferrous sulfate;

[0007] Placing the reduced workpiece in the cleaning tank for cleaning for a third preset time to obtain a cleaned workpiece;

[0008] The cleaned workpiece is placed in the pickling tank for cleaning for a fourth preset time to obtain a pickled workpiece.

[0009] In a possible implementation, the concentration of potassium permanganate ranges from 5 to 25 g / L.

[0010] In one possible implementation, the treatment solution further includes phosphoric acid and oxalic acid;

[0011] The volume ratio of phosphoric acid to oxalic acid is 3:1; the concentration of the first mixed solution after mixing phosphoric acid and oxalic acid is 5-15 g / L.

[0012] In a possible implementation, the concentration of ferrous sulfate in the reducing solution is in the range of 5-25 g / L.

[0013] In a possible implementation, a pickling solution is placed in the pickling tank, the pickling solution includes phosphoric acid and oxalic acid, the volume ratio of phosphoric acid to oxalic acid is 3:1, and the concentration of the second mixed solution after the phosphoric acid and oxalic acid are mixed is 5-15 g / L;

[0014] Deionized water is contained in the cleaning tank.

[0015] In a possible implementation, the first preset time is 20 seconds, the second preset time is 10 seconds, and the fourth preset time is 5 seconds.

[0016] In a possible implementation, the treatment tank, reduction tank, cleaning tank and pickling tank are all equipped with a circulating filtration device; the circulating filtration device maintains the concentration of the treatment solution, reduction solution, pickling solution and deionized water.

[0017] In a possible implementation, placing the restored workpiece in a cleaning tank for cleaning for a third preset time includes:

[0018] Placing the reduced workpiece in the deionized water in the cleaning tank for cleaning for a third preset time;

[0019] After cleaning, the workpiece is dried using air at a preset temperature.

[0020] In a possible implementation, before electroplating, the workpiece is sequentially placed in the above-mentioned processing tank, reduction tank, cleaning tank and pickling tank for a preset number of cycles.

[0021] In a second aspect, an embodiment of the present application provides a device for processing silver-copper solder, comprising: a processing tank, for placing a workpiece before electroplating in the processing tank for processing for a first preset time to obtain a processed workpiece; a processing solution is contained in the processing tank, and the processing solution contains potassium permanganate;

[0022] A reduction tank is used to place the workpiece for treatment in the reduction tank for reduction for a second preset time to obtain a reduced workpiece; a reduction solution is placed in the reduction tank, and the reduction solution contains ferrous sulfate;

[0023] A cleaning tank, used to place the reduced workpiece in the cleaning tank for cleaning for a third preset time to obtain a cleaned workpiece;

[0024] The pickling tank places the workpiece to be cleaned in the pickling tank for a fourth preset time to obtain the pickled workpiece.

[0025] It can be understood that the beneficial effects of the second aspect mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here.

[0026] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0027] In the embodiment of the present application, a treatment solution containing potassium permanganate and a reducing solution containing ferrous sulfate are prepared to treat the workpiece. Since potassium permanganate has a strong oxidizing property, it can effectively remove the oxide scale, oil stains, solder and organic impurities on the surface of the material, and it cannot cause a strong acid environment, thereby eliminating the excessive corrosion of the plated parts and the damage to the electroplating equipment by the strong acid environment, thereby ensuring the quality of the product. At the same time, by adding a pickling tank to treat the workpiece, the degree of cleaning the solder is improved, and the quality of the product is improved.

[0028] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0030] Figure 1 It is a schematic flow chart of a method for processing silver-copper solder provided in one embodiment of the present application;

[0031] Figure 2 It is a schematic diagram of the structure of a device for processing silver-copper solder provided in one embodiment of the present application. DETAILED DESCRIPTION

[0032] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0033] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0034] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0035] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.

[0036] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0037] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0038] If the brazed product is not treated with solder before electroplating, it is impossible to ensure that the product surface is clean, flat and free of defects. This will directly lead to problems such as pits, peeling, and uneven color on the plated parts, which will in turn affect the product's yield and pass rate.

[0039] Although the use of chromic acid-anhydrous sodium sulfite system to pre-treat the solder before electroplating can improve the effect of solder on the quality of plated parts during the electroplating process, its improvement effect is limited and its defects are also very obvious. The chromic acid system is highly toxic and seriously harmful to the human body. It is difficult to be discharged from the human body and has great harm to the environment. The industrial wastewater generated by it is difficult to treat. The strong acid environment it creates may cause over-corrosion of the plated parts, which has an adverse effect on the quality of the product and causes irreversible damage to the tank body of the plating tank. If the plated parts are driving equipment, over-corrosion of the plated parts will cause irreversible damage to the driving equipment.

[0040] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0041] Figure 1 is a schematic diagram of a process for treating silver-copper solder provided by an embodiment of the present application, with reference to Figure 1 , the method for treating silver-copper solder is described in detail as follows:

[0042] The present application embodiment provides a method for processing silver-copper solder, comprising:

[0043] Step 101, placing the workpiece before electroplating in a processing tank for a first preset time to obtain a processed workpiece; the processing tank contains a processing solution, and the processing solution contains potassium permanganate. Silver solder or copper solder remains on the surface of the workpiece.

[0044] Exemplarily, the treatment solution further includes phosphoric acid and oxalic acid; the volume ratio of phosphoric acid to oxalic acid may be 3:1; and the concentration of the first mixed solution after mixing phosphoric acid and oxalic acid may be 5-15 g / L.

[0045] The concentration range of potassium permanganate can be 5-25g / L. Through reaction analysis and experiments after the workpiece is placed in the treatment solution, it is determined that when the concentration range of potassium permanganate is 5-25g / L, the effect of the workpiece after treatment is better, and considering the reduction and pickling processes, after the cleaning of the treatment tank, the workpiece will not be over-cleaned in this concentration range.

[0046] Exemplarily, before electroplating, the workpiece is placed in a treatment tank and treated with a mixed solution of potassium permanganate, phosphoric acid and oxalic acid for 20 seconds to obtain a treated workpiece. The treated workpiece is then placed in a reduction tank and reduced with a ferrous sulfate solution for 10 seconds to obtain a reduced workpiece. The reduced workpiece is then placed in a cleaning tank and cleaned for 20 seconds to wash away various solutions remaining on the workpiece to obtain a cleaned workpiece. Finally, the cleaned workpiece is placed in a pickling tank and cleaned with a mixed solution of phosphoric acid and oxalic acid for 5 seconds to obtain a pickled workpiece.

[0047] Potassium permanganate has extremely strong oxidizing properties and is effective in removing solder, scale, oil stains and organic impurities from the surface of workpiece materials. It is less toxic than chromic acid and cannot create a strong acid environment, eliminating excessive corrosion of plated parts and damage to electroplating equipment caused by a strong acid environment, ensuring the dimensional accuracy and quality of the products, and making the generated industrial wastewater easier to process and recycle.

[0048] The first preset time may be 20 seconds. The first preset time is determined based on the material of the solder and the concentration of the treatment solution, so as to significantly remove the oxide scale, oil stains, solder and organic impurities on the surface of the workpiece.

[0049] Step 102, placing the workpiece to be processed in a reduction tank for reduction for a second preset time to obtain a reduced workpiece; a reducing solution is placed in the reduction tank, and the reducing solution contains ferrous sulfate.

[0050] For example, the concentration range of ferrous sulfate in the reducing solution can be 5-25 g / L. Similarly, through reaction analysis and experiments after the workpiece is placed in the reducing solution, the concentration range of ferrous sulfate is determined to be 5-25 g / L, and the effect of the workpiece after treatment is better, and the workpiece will not be over-cleaned in this concentration range.

[0051] The second preset time may be 10 seconds. The second preset time is determined based on the material of the solder, the processing condition of the workpiece and the concentration of the reducing solution.

[0052] Step 103 , placing the restored workpiece in a cleaning tank for cleaning for a third preset time to obtain a cleaned workpiece.

[0053] Wherein, deionized water is contained in the cleaning tank.

[0054] Exemplarily, placing the reduced workpiece in a cleaning tank for cleaning for a third preset time includes: placing the reduced workpiece in deionized water in the cleaning tank for cleaning for a third preset time; after cleaning, drying the workpiece using air with a preset temperature.

[0055] Exemplarily, the third preset time may be 20 seconds. The length of the third preset time is not limited. However, in order to improve process efficiency, the third preset time is generally sufficient to rinse the solution on the surface of the workpiece.

[0056] Step 104 , placing the cleaned workpiece in a pickling tank for cleaning for a fourth preset time to obtain a pickled workpiece.

[0057] Exemplarily, a pickling solution is placed in the pickling tank, the pickling solution includes phosphoric acid and oxalic acid, the volume ratio of phosphoric acid to oxalic acid can be 3:1, and the concentration of the second mixed solution after mixing phosphoric acid and oxalic acid is 5-15g / L.

[0058] Among them, by analyzing and experimenting the reaction after the workpiece is placed in the pickling solution, setting the ratio of the mixed acid including phosphoric acid and oxalic acid, and determining the concentration range after mixing to be 5-15g / L, the workpiece is treated with better effect, and the workpiece will not be over-cleaned within this concentration range.

[0059] Exemplarily, the fourth preset time may be 5 seconds. The fourth preset time is determined based on the material of the solder and the cleaning condition of the workpiece. Usually, the pickling time is shorter to prevent excessive cleaning and damage to the workpiece.

[0060] Exemplarily, the treatment tank, reduction tank, cleaning tank and pickling tank are all equipped with a circulating filter device; the circulating filter device maintains the concentration of the treatment solution, reduction solution, pickling solution and deionized water. Adding a circulating filter device improves the problem of the hanger and the workpiece carrying out the washing solution and causing the solution concentration to become low during the process of taking the workpiece out of each tank, solves the problem of impurities accumulating in the solution during the cleaning process, and greatly increases the number of times the solution is recycled. Thereby improving the efficiency of the cleaning solution system for cleaning solder.

[0061] Exemplarily, before electroplating, the workpiece is sequentially placed in the above-mentioned treatment tank, reduction tank, cleaning tank and pickling tank for a preset number of cycles.

[0062] Exemplarily, the preset number of processing times can be set to 1-4 times, and the processing time can be extended by repeating the processing operation mode, and the residual solder and oxide substances on the workpiece can be cleaned more thoroughly.

[0063] It can be seen that the method for treating silver-copper solder of the present invention treats the workpiece by preparing a treatment solution containing potassium permanganate and a reducing solution containing ferrous sulfate. Since potassium permanganate has extremely strong oxidizing properties, it can effectively remove the oxide scale, oil stains, solder and organic impurities on the surface of the material, and cannot cause a strong acid environment, thereby eliminating the excessive corrosion of the plated parts and the damage to the electroplating equipment caused by the strong acid environment, thereby ensuring the quality of the product. At the same time, by adding a pickling tank to treat the workpiece, the degree of solder cleaning is improved, and the quality of the product is improved. Each tank is equipped with a circulating filtration device, which not only improves the problem of solution being carried out during the cleaning process of the hanger and the workpiece, resulting in a lower concentration, but also solves the problem of impurities accumulating in the washing liquid during the cleaning process, thereby greatly improving the number of times the washing liquid can be recycled.

[0064] The embodiment of the present application provides a device for processing silver-copper solder, including: a processing tank 201, a reduction tank 202, a cleaning tank 203 and a pickling tank 204.

[0065] The processing tank 201 is used to place the original solder before electroplating in the processing tank for a first preset time to obtain processed solder; the processing tank contains a processing solution, and the processing solution contains potassium permanganate.

[0066] The reduction tank 202 is used to place the processed solder in the reduction tank for reduction for a second preset time to obtain reduced solder; the reduction tank contains a reducing solution, which contains ferrous sulfate.

[0067] The cleaning tank 203 is used to place the reduced solder in the cleaning tank for cleaning for a third preset time to obtain cleaned solder.

[0068] The pickling tank 204 places the cleaned solder in the pickling tank for a fourth preset time to obtain the pickled solder.

[0069] Exemplarily, the apparatus for processing silver-copper solder further includes a circulating filtration device.

[0070] Among them, the treatment tank, reduction tank, cleaning tank and pickling tank are all equipped with a circulation filtration device; the circulation filtration device is used to maintain the concentration of the treatment solution, reduction solution, pickling solution and deionized water.

[0071] It can be understood that the beneficial effects of the above-mentioned method for processing silver-copper solder can be found in the relevant description in the embodiment of the above-mentioned method for processing silver-copper solder, and will not be repeated here.

[0072] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0073] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for processing silver-copper solder, characterized in that: include: Placing the workpiece before electroplating in a processing tank for processing for a first preset time to obtain a processed workpiece; The processing tank contains a processing solution, wherein the processing solution contains potassium permanganate; silver solder or copper solder remains on the surface of the workpiece; Placing the processed workpiece in a reduction tank for reduction for a second preset time to obtain a reduced workpiece; A reducing solution is placed in the reducing tank, and the reducing solution contains ferrous sulfate; The concentration range of ferrous sulfate in the reducing solution is 5-25 g / L; Placing the reduced workpiece in a cleaning tank for cleaning for a third preset time to obtain a cleaned workpiece; The cleaned workpiece is placed in a pickling tank for cleaning for a fourth preset time to obtain a pickled workpiece.

2. The method for processing silver-copper solder according to claim 1, characterized in that: The concentration range of the potassium permanganate is 5-25 g / L.

3. The method for processing silver-copper solder according to claim 1, characterized in that: The treatment solution also includes phosphoric acid and oxalic acid; The volume ratio of the phosphoric acid to the oxalic acid is 3:1; the concentration of the first mixed solution after the phosphoric acid and the oxalic acid are mixed is 5-15 g / L.

4. The method for processing silver-copper solder according to claim 1, characterized in that: A pickling solution is placed in the pickling tank, the pickling solution includes phosphoric acid and oxalic acid, the volume ratio of the phosphoric acid to the oxalic acid is 3:1, and the concentration of the second mixed solution after the phosphoric acid and the oxalic acid are mixed is 5-15g / L; Deionized water is contained in the cleaning tank.

5. The method for treating silver-copper solder according to any one of claims 1 to 4, characterized in that: The first preset time is 20 seconds, the second preset time is 10 seconds, and the fourth preset time is 5 seconds.

6. The method for processing silver-copper solder according to claim 4, characterized in that: The treatment tank, the reduction tank, the cleaning tank and the pickling tank are all equipped with a circulation filtering device; the circulation filtering device maintains the concentration of the treatment solution, the reduction solution, the pickling solution and the deionized water.

7. The method for processing silver-copper solder according to claim 4, characterized in that: Placing the restored workpiece in a cleaning tank for cleaning for a third preset time includes: Placing the reduced workpiece in deionized water in a cleaning tank for cleaning for a third preset time; After cleaning, the workpiece is dried using air at a preset temperature.

8. The method for treating silver-copper solder according to claim 1, characterized in that: Before electroplating, the workpiece is sequentially placed in the above-mentioned treatment tank, reduction tank, cleaning tank and pickling tank for a preset number of cycles.

9. The method for treating silver-copper solder according to claim 1, characterized in that: The processing equipment using the method is a device for processing silver-copper solder, comprising: A processing tank, used to place the workpiece before electroplating in the processing tank for processing for a first preset time to obtain a processed workpiece; the processing tank contains a processing solution, and the processing solution contains potassium permanganate; A reduction tank, used for placing the processed workpiece in the reduction tank for reduction for a second preset time to obtain a reduced workpiece; a reduction solution is placed in the reduction tank, and the reduction solution contains ferrous sulfate; A cleaning tank, used to place the reduced workpiece in the cleaning tank for cleaning for a third preset time to obtain a cleaned workpiece; The pickling tank places the cleaned workpiece in the pickling tank for cleaning for a fourth preset time to obtain a pickled workpiece.

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