A high-temperature alloy hot end component and its preparation method

Abstract

The present invention provides a high-temperature alloy hot-end component, comprising a high-temperature alloy substrate and a cooling film layer. The cooling film layer is located on the surface of the high-temperature alloy substrate, the high-temperature alloy substrate having an internal cooling structure, and the cooling film layer has cooling holes and a cooling passage located within the cooling film layer. The cooling passage communicates with the internal cooling structure, and the cooling holes connect the cooling passage and the outer surface of the cooling film layer. The technical solution of the present invention can improve the cooling efficiency of the hot-end component and extend the life of the cooling film layer.

Description

Technical Field

[0001] The present invention relates to a high-temperature alloy hot end component and a preparation method thereof, and in particular to a hot end component of a gas turbine or an aircraft engine and a preparation method thereof. Background Art

[0002] The hot-end components of gas turbines and aircraft engines are typically coated with a high-temperature, oxidation-resistant coating. This coating is crucial for increasing the operating temperature and lifespan of these components. This coating consists of four main layers: the outermost layer is a ceramic thermal barrier; beneath it is a metallic bonding layer, which improves the bond strength between the ceramic layer and the substrate and provides high-temperature oxidation and corrosion resistance; during high-temperature service, a thermally grown oxide layer forms at the interface between the bonding layer and the ceramic layer; beneath these three layers lies the load-bearing high-temperature alloy substrate. The thermal barrier coating, bonding layer, and the thermally grown oxide layer dynamically generated during high-temperature operation provide protection for the high-temperature alloy substrate, thereby extending the service life of the hot-end components.

[0003] For example, patent publication CN103966539B discloses a plasma-evaporated, long-life, high-insulation lanthanide thermal barrier coating ceramic layer with a composite structure and a preparation method thereof, belonging to the field of thermal barrier coating technology. The ceramic layer material is composed of a lanthanide zirconate or a cerate. The thermal barrier coating includes a bonding layer, a first ceramic layer, and a second ceramic layer prepared on a substrate. The first ceramic layer is a YSZ coating. The second ceramic layer is composed of a lanthanide zirconate or a cerate. In the preparation method of the above-mentioned ceramic layer, the pressure of the vacuum chamber is less than 1 mbar; by adjusting parameters such as the spraying power, current, gas flow, substrate temperature, powder feed rate, and spraying distance, a YSZ coating and a lanthanide thermal barrier coating ceramic layer can be obtained, each having a microstructure of a columnar crystal structure, a layered structure, a layered plus columnar crystal structure, or a nanostructured coating. The thermal barrier coating has a long service life and good thermal insulation properties.

[0004] For example, patent publication CN1621556A discloses a thermal barrier coating with high thermal stability, high temperature sintering resistance, and low thermal conductivity. It uses electron beam physical vapor deposition to deposit a bonding layer and a ceramic layer on the surface of a nickel-based high-temperature alloy substrate. The bonding layer material is MCrAlY, where M can be a Ni alloy element, a Co alloy element, or a Ni+Co mixed alloy element; the ceramic layer material is lanthanum cerate La. 2.0～3.0 CeO 7.0～8.5 The thermal barrier coating of the invention has a high melting point, no phase change from room temperature to operating temperature, low thermal conductivity, chemical stability, and thermal expansion matching with the nickel-based high-temperature alloy substrate.

[0005] However, coating failure and detachment, resulting in damage to the hot-end component substrate and a shortened hot-end component lifespan, are key contributors to the high operating and maintenance costs of existing gas turbine hot-end components. Coating failure is closely linked to the interfaces of the multilayer structure. The main causes are: 1) the significant difference in thermal expansion coefficients between ceramic and metal; 2) the integrity of the thermally grown oxide layer is compromised, significantly reducing its antioxidant properties and weakening its interfacial bonding strength with the bonding layer and ceramic layer.

[0006] Furthermore, hot-end components must be well-designed for cooling. However, current cooling designs fail to optimize the surface curves and film structures. Consequently, the film structure's cooling is affected by its distance from the cooling channels and by the dynamic variations in film cooling coverage and cooling efficiency, making it difficult to achieve adequate cooling protection.

[0007] If the current cooling structure is moved to a surface layer closer to the surface, it will be unable to be manufactured due to the limitations of the manufacturing method capabilities or will fail prematurely due to insufficient surface bonding strength. The existing bonding layer metal manufacturing method is thermal spraying methods such as plasma spraying: on the one hand, it is impossible to use this spraying method to form complex surface cooling structures; on the other hand, the bonding strength between the bonding layer metal and the substrate needs to pass the ASTM C633-13 (2021) test to determine whether the film bonding strength is qualified. On this basis, the higher the tensile strength of the bonding layer metal material, the more it can withstand load stress. Practical application experience data shows that the tensile strength level of thermally sprayed bonding layer metal is about 100-200MPa. When the cooling structure is located on the surface and the surface structure is very thin, this strength is relatively low. When working in a high-temperature environment, the cooling channel must withstand the high pressure of the cooling gas. An overly thin surface layer will fail prematurely due to insufficient strength.

[0008] Therefore, improving the existing high-temperature resistant and anti-oxidation coating to make it have a longer service life and reduce the maintenance cost of the hot end components is of great significance for the long-term normal operation of the gas turbine and the guarantee of electricity and power supply. Summary of the Invention

[0009] The main purpose of the present invention is to provide a high-temperature alloy hot end component and a method for preparing the high-temperature alloy hot end component, so as to solve the problems in the prior art.

[0010] In order to achieve the above-mentioned purpose, according to one aspect of the present invention, a high-temperature alloy hot end component is provided, comprising a high-temperature alloy substrate and a cooling film layer, wherein the cooling film layer is located on the surface of the high-temperature alloy substrate, and the high-temperature alloy substrate has an internal cooling structure, characterized in that the cooling film layer has cooling holes and a cooling passage located inside the cooling film layer, the cooling passage is communicated with the internal cooling structure, and the cooling holes connect the cooling passage and the outer surface of the cooling film layer.

[0011] Furthermore, at least a portion of the cooling passages are arranged parallel to the outer surface of the cooling film layer.

[0012] Furthermore, the cooling passage includes a plurality of cooling branches, and at least two of the cooling branches extend in the same direction.

[0013] Furthermore, the cooling passage includes a first cooling branch and a second cooling branch, and at least a portion of the first cooling branch and at least a portion of the second cooling branch extend in different directions.

[0014] Furthermore, the first cooling branch is communicated with the second cooling branch, and the first cooling branch and the second cooling branch form a mesh cooling structure.

[0015] Furthermore, the cooling film layer is manufactured on the high-temperature alloy substrate by an additive manufacturing method.

[0016] Furthermore, the thickness of the cooling film layer is 0.5-5 mm.

[0017] Furthermore, the dimension of the cooling passage in the thickness direction of the cooling film layer is 0.1-1.5 mm.

[0018] Furthermore, the spacing between the cooling holes is 1-4 mm, and the diameter of the cooling holes is 0.2-0.8 mm.

[0019] Furthermore, the cooling hole is a special-shaped cooling hole.

[0020] Furthermore, the cooling film layer is a metal-based material including Ni, Co and Al elements.

[0021] Furthermore, the cooling film layer includes a metal matrix and a strengthening phase distributed in the metal matrix. The chemical composition of the metal matrix includes, by weight percentage: 22-24% Co, 19-21% Cr, 8-9% Al, 3.5-4.5% Ta, 0.3-0.9% Y, the sum of the impurity (C, S, O) content is <0.02%, and the balance is Ni.

[0022] Furthermore, the cooling film layer is manufactured by an additive manufacturing method, and the particle size distribution of the spherical powder of the metal matrix used in the additive manufacturing is:

[0023] D10=15±2um;

[0024] D50=25±2um;

[0025] D90=45±2um;

[0026] The fluidity of the spherical powder is less than 15s / 50g.

[0027] Furthermore, the reinforcement phase is oxide particles, and the particle size of the dispersed oxide particles is 5-50 nm.

[0028] Furthermore, the strengthening phase includes one or more of Y2O3, ZrO2 or Al2O3.

[0029] Furthermore, the mass percentage of the strengthening phase in the cooling film layer is 0.1-5%, and the strengthening phase is distributed in a gradient in the cooling film layer. The content of the strengthening phase gradually increases from the high-temperature alloy substrate to the outer surface of the cooling film layer.

[0030] In order to achieve the above object, according to another aspect of the present invention, a method for preparing the above-mentioned high-temperature alloy hot end component is provided, comprising an additive manufacturing step,

[0031] In the additive manufacturing step, the cooling film layer is formed on the surface of the high-temperature alloy substrate by an additive manufacturing method.

[0032] Furthermore, the additive manufacturing method is directed energy deposition additive manufacturing.

[0033] Furthermore, after the additive manufacturing step, a roughness reduction step is also included. In the roughness reduction step, abrasive flow or chemical polishing is used to reduce the roughness of the inner surfaces of the cooling passages and cooling holes.

[0034] Furthermore, it also includes a strengthening phase treatment step and a mixing step,

[0035] In the strengthening phase treatment step, the surface of the strengthening phase is treated to achieve better bonding between the strengthening phase and the metal matrix;

[0036] In the mixing step, the reinforcing phase is mixed with the powder of the metal matrix so that the reinforcing phase is evenly coated on the surface of the metal powder particles.

[0037] Furthermore, the strengthening phase treatment step includes a surface pretreatment step and a nickel plating step.

[0038] In the surface pretreatment step, the surface of the reinforcement phase is pretreated to reduce the surface energy of the reinforcement phase;

[0039] In the nickel plating step, a nickel plating layer is formed on the surface of the reinforcement phase.

[0040] The application of the technical solution of the present invention has achieved at least the following beneficial effects:

[0041] 1. By cooling the film layer, the heat exchange between the inner and outer surfaces of the film layer is enhanced, the cooling efficiency is improved, and a significant temperature reduction is achieved on the film layer.

[0042] It replaces the thermal insulation effect of the original ceramic layer and avoids the risk of short life due to the large difference in thermal physical properties between the ceramic layer and the metal.

[0043] 2. The cooling passage of the present application is very close to the surface and parallel to the surface. Since the surface of the hot end component may be curved, this conformal cooling passage has an excellent cooling effect on the surface of the hot end component.

[0044] 3. The cooling film layer is a metal-based composite material. The film layer with a cooling structure is prepared by 3D printing on the high-temperature alloy substrate of the hot end component. The interface with the hot end component substrate is an interdiffusion layer, forming a good metallurgical bond in the microstructure, improving the film layer strength and bonding strength, and effectively reducing the damage to the film layer caused by thermal stress and internal pressure in the cooling channel.

[0045] 4. The metal matrix is ​​strengthened by nano-scale oxide dispersion, and its mechanical properties are better than those of the metal matrix without dispersion strengthening under the same high temperature conditions, and it can be used in a higher temperature range.

[0046] 5. The presence of dispersed nano-scale oxides can reduce the growth rate of the thermally grown oxide layer, improve the interface adhesion of the oxide layer, and extend the service life.

[0047] 6. The cooling film layer of the present application has good strength and oxidation resistance at high temperatures, so that the thinner cooling film layer of the present application can have a service life that meets the requirements under service conditions, and can also withstand the pressure of the gas in the cooling passage. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] The accompanying drawings, which constitute part of the present invention, are intended to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are intended to explain the present invention and do not constitute an undue limitation of the present invention. In the accompanying drawings:

[0049] Figure 1 A schematic diagram of a hot end component according to an embodiment of the present invention is shown; and

[0050] Figure 2 A schematic diagram showing a cooling film layer on the surface of a hot end component according to an embodiment of the present invention; and

[0051] Figure 3 A schematic diagram of a cooling film layer structure according to an embodiment of the present invention is shown;

[0052] Figure 4 Figures 1 and 2 show (a) a qualified bonding test result of the cooling film material and Mar M247 superalloy conducted according to ASTM C633-13(2021); and the tensile strength test results of the additively manufactured cooling film and plasma sprayed film materials, wherein (b) shows the tensile strength of the cooling film according to an embodiment of the present invention, and (c) shows the tensile strength of the plasma sprayed film and the superalloy substrate.

[0053] Figure 5 Sample photos of cooling holes with diameters of 0.2 mm (a) and 0.4 mm (b) prepared according to embodiments of the present invention are shown.

[0054] The above drawings include the following reference numerals:

[0055] 1. High-temperature alloy hot end component, 2. High-temperature alloy substrate, 3. Cooling film layer, 4. Internal cooling structure, 5. Cooling hole, 6. Cooling passage, 61. First cooling branch, 62. Second cooling branch. DETAILED DESCRIPTION

[0056] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0057] The present invention is further described in detail below with reference to specific examples. These examples should not be construed as limiting the scope of protection claimed in the present invention.

[0058] Example 1

[0059] like Figure 1-3 As shown, a high-temperature alloy hot end component 1 includes a high-temperature alloy substrate 2 and a cooling film layer 3, wherein the cooling film layer 3 is located on the surface of the high-temperature alloy substrate 1, and the high-temperature alloy substrate 1 has an internal cooling structure 4, characterized in that the cooling film layer 3 has cooling holes 5 and a cooling passage 6 located inside the cooling film layer, the cooling passage 6 is connected to the internal cooling structure 4, and the cooling holes 5 connect the cooling passage 6 and the outer surface of the cooling film layer 3.

[0060] Furthermore, at least a portion of the cooling channel 6 is arranged parallel to the outer surface of the cooling film layer 3. Furthermore, the cooling channel 6 includes a first cooling branch 61 and a second cooling branch 62, with at least a portion of the first cooling branch 61 and at least a portion of the second cooling branch 62 extending in different directions. Furthermore, the first cooling branch 61 is connected to the second cooling branch 62, forming a mesh cooling structure.

[0061] For example, Figure 2 As shown, the first cooling branches 61 and the second cooling branches 62 are both linear structures and include multiple first cooling branches 61 and multiple second cooling branches 62. The multiple first cooling branches 61 are parallel to each other, and the multiple second cooling branches 62 are parallel to each other. The first cooling branches 61 and at least some of the second cooling branches 62 extend in different directions. This arrangement allows the first cooling branches 61 and the second cooling branches 62 to form a network cooling structure.

[0062] During operation, cooling air flows through the internal cooling structure within the substrate into the meshed cooling channels, maintaining good heat transfer inside the cooling film while simultaneously dissipating heat to the outer surface through the cooling holes, creating "sweating cooling." Compared to traditional air film cooling, the cooling holes of sweating cooling are evenly and finely distributed across the film surface, providing better coverage of the cooling area and a more effective cooling effect.

[0063] However, in other embodiments, the first cooling branch and the second cooling branch may be in the form of curves, broken lines, or other forms; and the specific positions, directions, and flow relationships between multiple first cooling branches, between multiple second cooling branches, and between the first cooling branch and the second cooling branch, whether they are parallel or connected, etc., can be designed and selected by those skilled in the art based on actual conditions, and are not limited to the specific embodiments of the present invention.

[0064] Furthermore, the cooling film layer is manufactured on the high-temperature alloy substrate by an additive manufacturing method.

[0065] Furthermore, the thickness of the cooling film layer is 0.5-5 mm. Preferably, the thickness of the cooling film layer is 1-2 mm.

[0066] Furthermore, the dimension of the cooling passage in the thickness direction of the cooling film layer is 0.1-1.5 mm. Preferably, the dimension of the cooling passage in the thickness direction of the cooling film layer is 0.5-1 mm.

[0067] Furthermore, the spacing between the cooling holes is 1-4 mm, and the diameter of the cooling holes is 0.2-0.8 mm. Preferably, the spacing between the cooling holes is 1-2 mm, and the diameter of the cooling holes is 0.3-0.5 mm.

[0068] From the practical experience of hot-end component thermal design, the cross-sectional shape and angle of surface cooling holes significantly influence the coverage of the cooling film on the hot-end component surface. In other embodiments, the cooling holes are special-shaped cooling holes. Specifically, these special-shaped cooling holes can be inclined holes, curved holes, or other special cooling hole shapes created using 3D printing technology. Special hole shapes, inclined holes, and curved holes facilitate additive manufacturing, but are difficult to achieve using traditional methods such as laser processing.

[0069] Furthermore, the cooling film layer is a metal-based material including Ni, Co and Al elements.

[0070] Furthermore, the cooling film layer includes a metal matrix and a strengthening phase distributed within the metal matrix. The chemical composition of the metal matrix, by weight, includes: 22-24% Co, 19-21% Cr, 8-9% Al, 3.5-4.5% Ta, 0.3-0.9% Y, and the sum of impurity contents (C, S, O) is less than 0.02%. In this embodiment, the chemical composition of the metal matrix, by weight, includes: 23% Co, 20% Cr, 8.5% Al, 4% Ta, 0.6% Y, and the sum of impurity contents (C, S, O) is less than 0.02%, with the balance being Ni.

[0071] Furthermore, the reinforcement phase is oxide particles, and the particle size of the oxide particles is 2-200 nm. Specifically, the particle size of the oxide particles is about 5-50 nm.

[0072] Furthermore, the strengthening phase includes one or more of Y2O3, ZrO2 or Al2O3. Specifically, the strengthening phase is yttrium oxide, and is in the form of ellipsoidal or irregular particles.

[0073] Furthermore, the strengthening phase comprises a mass percentage of 0.1-5% within the cooling film layer, and the strengthening phase is distributed in a gradient within the cooling film layer, with the content of the strengthening phase gradually increasing from the superalloy substrate toward the outer surface of the cooling film layer. Specifically, the interface region with the superalloy substrate has a low oxide content (0-1% by weight), while the oxide content near the outer surface is high (1.5-5% by weight).

[0074] Compared to conventional film cooling, which results in a temperature drop of approximately 200°C, the "sweating cooling" outer surface of the cooling film layer of the present invention achieves a significantly greater temperature drop of approximately 300-350°C. For example, at an ambient temperature of 1500°C, the oxide-dispersion-strengthened metal-matrix composite material must withstand a long-term operating temperature of approximately 1150°C. At this temperature, the cooling film layer possesses the required strength to withstand the pressure and flow of the cooling gas medium, exceeding 50 MPa.

[0075] Example 2

[0076] A method for preparing the above-mentioned high-temperature alloy hot end component includes a strengthening phase treatment step, a mixing step, an additive manufacturing step, and a roughness reduction step.

[0077] S1. Strengthening phase treatment steps

[0078] In the strengthening phase treatment step, the surface of the strengthening phase is treated so that the strengthening phase and the metal matrix can be better bonded. Furthermore, the strengthening phase treatment step includes a surface pretreatment step and a nickel plating step.

[0079] S1-1. Surface pretreatment steps

[0080] In the surface pretreatment step, the surface of the reinforcement phase is pretreated to reduce the surface energy of the reinforcement phase.

[0081] S1-2, nickel plating step

[0082] In the nickel plating step, a nickel layer is formed on the surface of the reinforcement phase. The purpose of surface nickel plating is to form a better interface bonding with the substrate during the micro-molten pool solidification process in the additive manufacturing process, while also having a very uniform distribution.

[0083] S2, mixing step

[0084] In the mixing step, the reinforcing phase is mixed with the powder of the metal matrix.

[0085] S3, additive manufacturing steps

[0086] In the additive manufacturing step, the cooling film layer is formed on the surface of the high-temperature alloy substrate using an additive manufacturing method. Furthermore, the additive manufacturing method is DED additive manufacturing (DED is an abbreviation for Directed Energy Deposition, an additive manufacturing method in the national standard GB / T 35021-2018). In this step, the connection structure between the internal cooling structure of the high-temperature alloy substrate and the cooling passage of the cooling film layer needs to be designed in a coordinated manner. For example, holes of equal diameter can be provided at the respective joint locations, and the cooling passage of the cooling film layer is designed with these holes as the core.

[0087] The cooling holes are formed in an additive manufacturing step, and thus the cooling holes can be formed into special-shaped holes.

[0088] S4、 Roughness reduction steps

[0089] In the roughness reducing step, the roughness of the inner surfaces of the cooling passages and cooling holes is reduced using abrasive flow or chemical polishing.

[0090] Bonding strength between film layer and substrate layer: When the materials are the same, the bonding strength between the film layer and the high-temperature alloy substrate obtained by additive manufacturing in this application meets the ASTM C633-13 (2021) test standard. Figure 4 (a). Attached Figure 4 The experimental result photos in (a) are experimental result photos of two groups of samples (each group of samples has two parallel experimental samples, a total of four samples).

[0091] Comparison of film tensile strength: The tensile strength of the present invention is about 1000MPa, while the tensile strength of the plasma sprayed film is about 100MPa. Due to the high strength of the film in the present invention, a thinner film structure can be formed. See the attached test results. Figure 4 (b), (c).

[0092] The samples with cooling holes of 0.2 mm and 0.4 mm in diameter prepared according to the method of this embodiment are shown in the attached Figure 5 .

[0093] Example 3

[0094] A high-temperature alloy hot end component 1 includes a high-temperature alloy substrate 2 and a cooling film layer 3. The cooling film layer 3 is located on the surface of the high-temperature alloy substrate 1. The high-temperature alloy substrate 1 has an internal cooling structure 4. The component is characterized in that the cooling film layer 3 has cooling holes 5 and a cooling passage 6 located inside the cooling film layer. The cooling passage 6 is connected to the internal cooling structure 4, and the cooling holes 5 connect the cooling passage 6 and the outer surface of the cooling film layer 3.

[0095] Furthermore, at least part of the cooling passage 6 is arranged parallel to the outer surface of the cooling film layer 3. Furthermore, the cooling passage includes a plurality of cooling branches, at least two of which extend in the same direction. (Not shown in the figure)

[0096] That is, in this embodiment, a mesh-shaped cooling passage is not used, but a structure of multiple cooling passages extending in the same direction is used.

[0097] However, in other embodiments, the cooling branches may be in the form of curves, broken lines, or other forms; and the specific positions, directions, and flow relationships between the cooling branches, such as whether they are parallel or connected, can be designed and selected by those skilled in the art based on actual conditions, and are not limited to the specific embodiments of the present invention.

[0098] Other features of this embodiment are the same as those of embodiment 1.

[0099] Example 4

[0100] A high-temperature alloy hot end component 1 includes a high-temperature alloy substrate 2 and a cooling film layer 3. The cooling film layer 3 is located on the surface of the high-temperature alloy substrate 1. The high-temperature alloy substrate 1 has an internal cooling structure 4. The component is characterized in that the cooling film layer 3 has cooling holes 5 and a cooling passage 6 located inside the cooling film layer. The cooling passage 6 is connected to the internal cooling structure 4, and the cooling holes 5 connect the cooling passage 6 and the outer surface of the cooling film layer 3.

[0101] Furthermore, the cooling film layer includes a metal matrix and a strengthening phase distributed in the metal matrix. The chemical composition of the metal matrix includes, by weight percentage, 22-24% Co, 19-21% Cr, 8-9% Al, 3.5-4.5% Ta, 0.3-0.9% Y, the sum of the impurity content (C, S, O) is less than 0.02%, and the balance is Ni. In this embodiment, the chemical composition of the metal matrix includes, by weight percentage, 22% Co, 21% Cr, 8% Al, 3.5% Ta, 0.3% Y, the sum of the impurity content (C, S, O) is less than 0.02%, and the balance is Ni.

[0102] Other features of this embodiment are the same as those of embodiment 1.

[0103] Example 5

[0104] A high-temperature alloy hot end component 1 includes a high-temperature alloy substrate 2 and a cooling film layer 3. The cooling film layer 3 is located on the surface of the high-temperature alloy substrate 1. The high-temperature alloy substrate 1 has an internal cooling structure 4. The component is characterized in that the cooling film layer 3 has cooling holes 5 and a cooling passage 6 located inside the cooling film layer. The cooling passage 6 is connected to the internal cooling structure 4, and the cooling holes 5 connect the cooling passage 6 and the outer surface of the cooling film layer 3.

[0105] Furthermore, the cooling film layer includes a metal matrix and a strengthening phase distributed in the metal matrix. The chemical composition of the metal matrix includes, by weight percentage, 22-24% Co, 19-21% Cr, 8-9% Al, 3.5-4.5% Ta, 0.3-0.9% Y, the sum of the impurity content (C, S, O) is less than 0.02%, and the balance is Ni. In this embodiment, the chemical composition of the metal matrix includes, by weight percentage, 24% Co, 19% Cr, 9% Al, 4.5% Ta, 0.9% Y, the sum of the impurity content (C, S, O) is less than 0.02%, and the balance is Ni.

[0106] Other features of this embodiment are the same as those of embodiment 1.

[0107] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:.

[0108] 1. By cooling the film layer, the heat exchange between the inner and outer surfaces of the film layer is enhanced, the cooling efficiency is improved, and a significant temperature reduction is achieved on the film layer.

[0109] It replaces the thermal insulation effect of the original ceramic layer and avoids the risk of short life due to the large difference in thermal physical properties between the ceramic layer and the metal.

[0110] 2. The cooling passage of the present application is very close to the surface and parallel to the surface. Since the surface of the hot end component may be curved, this conformal cooling passage has an excellent cooling effect on the surface of the hot end component.

[0111] 3. The cooling film layer is a metal-based composite material. The film layer with a cooling structure is prepared by 3D printing on the high-temperature alloy substrate of the hot end component. The interface with the hot end component substrate is an interdiffusion layer, forming a good metallurgical bond in the microstructure, effectively reducing the damage of thermal stress to the film layer.

[0112] 4. The metal matrix is ​​strengthened by nano-scale oxide dispersion, and its mechanical properties are better than those of the metal matrix without dispersion strengthening under the same high temperature conditions, and it can be used in a higher temperature range.

[0113] 5. The presence of dispersed nano-scale oxides can reduce the growth rate of the thermally grown oxide layer, improve the interface adhesion of the oxide layer, and extend the service life.

[0114] 6. The cooling film layer of the present application has good strength and oxidation resistance at high temperatures, so that the thinner cooling film layer of the present application can have a service life that meets the requirements under service conditions, and can also withstand the pressure of the gas in the cooling passage.

[0115] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. A high-temperature alloy hot end component, comprising a high-temperature alloy substrate and a cooling film layer, wherein the cooling film layer is located on the surface of the high-temperature alloy substrate, and the high-temperature alloy substrate has an internal cooling structure, characterized in that: The cooling film layer has cooling holes and a cooling passage located inside the cooling film layer, the cooling passage is connected to the internal cooling structure, and the cooling holes connect the cooling passage and the outer surface of the cooling film layer; the cooling film layer is a metal-based material including Ni, Co and Al elements; the cooling film layer includes a metal matrix and a strengthening phase distributed in the metal matrix, and the chemical composition of the metal matrix includes, by weight percentage, 22-24% Co, 19-21% Cr, 8-9% Al, 3.5-4.5% Ta, 0.3-0.9% Y, the sum of the impurity (C, S, O) content is <0.02%, and the balance is Ni; the cooling film layer is manufactured by an additive manufacturing method, and the particle size distribution of the spherical powder of the metal matrix used in the additive manufacturing is: D10=15±2um, D50=25±2um, D90=45±2um, The flowability of the spherical powder is <15 s / 50g.

2. The high-temperature alloy hot end component according to claim 1, characterized in that: At least a portion of the cooling passages are arranged parallel to the outer surface of the cooling film layer.

3. The high-temperature alloy hot end component according to claim 1, characterized in that: The cooling passage includes a plurality of cooling branches, and at least two of the cooling branches extend in the same direction.

4. The high-temperature alloy hot end component according to claim 1, characterized in that: The cooling passage includes a first cooling branch and a second cooling branch, and at least a portion of the first cooling branch and at least a portion of the second cooling branch extend in different directions.

5. The high-temperature alloy hot end component according to claim 4, characterized in that: The first cooling branch is communicated with the second cooling branch, and the first cooling branch and the second cooling branch form a mesh cooling structure.

6. The high-temperature alloy hot end component according to any one of claims 1 to 5, characterized in that: The cooling film layer is manufactured on the high-temperature alloy substrate by an additive manufacturing method.

7. The high-temperature alloy hot end component according to any one of claims 1 to 5, characterized in that: The thickness of the cooling film layer is 0.5-5 mm.

8. The high-temperature alloy hot end component according to claim 7, characterized in that: The dimension of the cooling passage in the thickness direction of the cooling film layer is 0.1-1.5 mm.

9. The high-temperature alloy hot end component according to claim 8, characterized in that: The spacing between the cooling holes is 1-4 mm, and the diameter of the cooling holes is 0.2-0.8 mm.

10. The high-temperature alloy hot end component according to claim 9, characterized in that: The cooling holes are special-shaped cooling holes.

11. The high-temperature alloy hot end component according to claim 1, characterized in that: The reinforcement phase is dispersed oxide particles, and the particle size of the oxide particles is 5-50 nm.

12. The high-temperature alloy hot end component according to claim 11, characterized in that: The strengthening phase includes one or more of Y2O3, ZrO2 or Al2O3.

13. The high-temperature alloy hot end component according to claim 12, characterized in that: The mass percentage of the strengthening phase in the cooling film layer is 0.1-5%, and the strengthening phase is distributed in a gradient in the cooling film layer. The content of the strengthening phase gradually increases in the direction from the high-temperature alloy substrate to the outer surface of the cooling film layer.

14. A method for preparing a high-temperature alloy hot end component according to any one of claims 1 to 13, comprising an additive manufacturing step, In the additive manufacturing step, the cooling film layer is formed on the surface of the high-temperature alloy substrate by an additive manufacturing method.

15. The method for preparing a high-temperature alloy hot end component according to claim 14, characterized in that: The additive manufacturing method is directed energy deposition additive manufacturing.

16. The method for preparing a high-temperature alloy hot end component according to claim 14, characterized in that: After the additive manufacturing step, a roughness reduction step is further included, in which abrasive flow or chemical polishing is used to reduce the roughness of the inner surfaces of the cooling passages and cooling holes.

17. The method for preparing a high-temperature alloy hot end component according to any one of claims 14 to 16, characterized in that: It also includes a strengthening phase processing step and a mixing step: In the strengthening phase treatment step, the surface of the strengthening phase is treated to achieve better bonding between the strengthening phase and the metal matrix; In the mixing step, the reinforcing phase is mixed with the powder of the metal matrix so that the reinforcing phase is evenly coated on the surface of the metal powder particles.

18. The method for preparing a high-temperature alloy hot end component according to claim 17, characterized in that: The strengthening phase treatment step includes a surface pretreatment step and a nickel plating step, In the surface pretreatment step, the surface of the reinforcement phase is pretreated to reduce the surface energy of the reinforcement phase; In the nickel plating step, a nickel plating layer is formed on the surface of the reinforcement phase.

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