A fingerprint module and display device

Abstract

This application discloses a fingerprint module and display device, comprising: a substrate, a sensor element disposed on one side surface of the substrate, the sensor element including a recognition area for fingerprint recognition; a circuit board assembly electrically connected to the sensor element; and an electromagnetic shielding film covering a portion of the side surface of the substrate on which the sensor element is disposed and a portion of the circuit board, but not covering the recognition area, and electrically connected to a grounding wire on the circuit board assembly. By using the electromagnetic shielding film covering the substrate and the circuit board assembly, electromagnetic interference generated by the display panel and other components on the display device can be avoided; simultaneously, the electromagnetic shielding film's electrical connection to the grounding wire forms an electrostatic discharge path, thereby releasing static electricity that may enter the fingerprint module, preventing damage to the fingerprint module, and improving the reliability of the fingerprint recognition module.

Description

Technical Field

[0001] This application generally relates to the field of fingerprint recognition technology, and specifically to a fingerprint module and display device. Background Technology

[0002] Currently, most mobile phones, tablets, and other devices are equipped with fingerprint recognition technology. The function of fingerprint recognition has evolved from simple unlocking to include unlocking, payment, and launching various applications, making it more convenient for users while also protecting user information security. As screen-to-body ratios continue to increase, fingerprint recognition modules are gradually transitioning to under-display designs.

[0003] Under-display fingerprint recognition modules face a more severe ESD (Electro-Static Discharge) risk. Because fingerprint products are used in scenarios where hands are close to the screen and static electricity accumulates there, the module may permanently fail, requiring it to withstand very high static voltages. When a finger contacts the sensor, the sensor receives the static electricity carried by the human body. This static electricity can seep in through gaps and, because there is no low-impedance path to conduct it away, damage the fingerprint module.

[0004] Improving the ESD resistance of fingerprint modules has become an urgent problem to be solved. Summary of the Invention

[0005] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a fingerprint module and display device that can achieve electromagnetic shielding and electrostatic discharge.

[0006] In a first aspect, this application provides a fingerprint module, including:

[0007] A substrate, wherein a sensor is disposed on one side surface of the substrate, the sensor including a recognition area for recognizing fingerprints;

[0008] A circuit board assembly, which is electrically connected to the sensor device;

[0009] An electromagnetic shielding film covers a portion of the surface of the substrate on which the sensor is mounted and a portion of the circuit board, but does not cover the identification area. The electromagnetic shielding film is electrically connected to the grounding wire on the circuit board assembly.

[0010] Optionally, the sensor includes a thin-film transistor layer, a photosensitive device layer, and a light adjustment layer stacked on the substrate, wherein the light adjustment layer is used to adjust the light incident on the photosensitive device layer; and the recognition area is disposed within the range of the light adjustment layer.

[0011] The electromagnetic shielding film covers the areas on the substrate other than the identification area.

[0012] Optionally, the orthographic projection of the recognition area on the substrate is located within the orthographic projection range of the light adjustment layer on the substrate;

[0013] The electromagnetic shielding film covers a portion of the light adjustment layer.

[0014] Optionally, the orthographic projection of the photosensitive device in the photosensitive device layer onto the substrate does not overlap with the orthographic projection of the thin-film transistor in the thin-film transistor layer onto the substrate;

[0015] The orthogonal projection of the light adjustment layer on the substrate at least covers the orthogonal projections of the photosensitive device and the thin-film transistor on the substrate.

[0016] Optionally, the electromagnetic shielding film includes an insulating layer, a metal layer, and an adhesive layer stacked together, and the electromagnetic shielding film is fixedly disposed on the substrate and the circuit board assembly through the adhesive layer.

[0017] Optionally, the circuit board assembly includes a flexible circuit board, which is bonded to the substrate via a flip-chip film, and the flexible circuit board has a copper drain area connected to the ground wire;

[0018] The electromagnetic shielding film extends from the substrate through the flip-chip film to the flexible circuit board, and the electromagnetic shielding film is electrically connected to the copper leakage area.

[0019] Optionally, the flexible circuit board includes a device area and a bonding area bonded to the substrate;

[0020] The electromagnetic shielding film at least covers the bonding area, and the copper leakage area includes a first copper leakage area disposed at the location of the bonding area; or, the electromagnetic shielding film at least covers the device area and the bonding area, and the copper leakage area includes a second copper leakage area disposed at the location of the device area, the second copper leakage area being disposed around the edge of the device area and having a certain length.

[0021] Optionally, the electromagnetic shielding film covers a portion of the copper leakage area, and the electromagnetic shielding film is electrically connected to the copper leakage area via silver paste, the silver paste extending from the surface of the electromagnetic shielding film through its end face to the copper leakage area.

[0022] Optionally, the copper leakage area is provided with conductive protrusions, which are used to achieve electrical connection with the electromagnetic shielding film when piercing the electromagnetic shielding film.

[0023] Secondly, this application provides a display device including a fingerprint module as described above.

[0024] The technical solutions provided by the embodiments of this application may include the following beneficial effects:

[0025] The fingerprint module provided in this application embodiment can avoid electromagnetic interference generated by the display panel and other components on the display device by covering the substrate and the circuit board assembly with an electromagnetic shielding film. At the same time, the electromagnetic shielding film is electrically connected to the grounding wire to form an electrostatic discharge path, thereby releasing the static electricity that enters the fingerprint module, avoiding damage to the fingerprint module by static electricity, and improving the reliability of the fingerprint recognition module. Attached Figure Description

[0026] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0027] Figure 1-2 A schematic diagram of the structure of a fingerprint module provided for an embodiment of this application;

[0028] Figure 3 A schematic diagram of the structure of a sensor device provided for an embodiment of this application;

[0029] Figure 4 A schematic diagram of electrostatic damage to a device provided for an embodiment of this application;

[0030] Figure 5 A schematic diagram of the structure of an electromagnetic shielding film provided for an embodiment of this application;

[0031] Figure 6-8 A schematic diagram of the structure of a fingerprint module provided for an embodiment of this application;

[0032] Figure 9 A schematic diagram of the structure of a fingerprint module provided for an embodiment of this application;

[0033] Figure 10 A schematic diagram of the electrostatic discharge path of a fingerprint module provided for an embodiment of this application;

[0034] Figure 11 A schematic diagram of another fingerprint module provided for an embodiment of this application;

[0035] Figure 12 A schematic diagram of an electrostatic discharge path for another fingerprint module provided in an embodiment of this application. Detailed Implementation

[0036] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0037] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0038] Please see details. Figure 1-2 This application provides a fingerprint module, including:

[0039] A substrate 100, wherein a sensor 200 is disposed on one side surface of the substrate 100, the sensor 200 including a recognition area D1 for recognizing fingerprints;

[0040] Circuit board assembly 300, which is electrically connected to sensor 200;

[0041] An electromagnetic shielding film 400 covers a portion of the surface of the substrate 100 on the side where the sensor 200 is disposed and a portion of the circuit board, but does not cover the identification area D1. The electromagnetic shielding film 400 is electrically connected to the grounding wire on the circuit board assembly 300.

[0042] The fingerprint module provided in this embodiment can avoid electromagnetic interference (EMI) generated by the display panel and other components on the display device by covering the substrate 100 and the circuit board assembly 300 with an electromagnetic shielding film 400. At the same time, the electromagnetic shielding film 400 is electrically connected to the grounding wire to form an electrostatic discharge path, thereby releasing the static electricity that enters the fingerprint module, avoiding damage to the fingerprint module by static electricity, and improving the reliability of the fingerprint recognition module.

[0043] It is understood that the electromagnetic shielding film 400 provided in this embodiment can prevent the chip and surrounding circuits from generating electromagnetic radiation that could affect the circuitry in the display module; it can also prevent the electromagnetic radiation generated by the circuitry in the display module from affecting the circuitry in the fingerprint module. This reduces the complexity of the manufacturing process and thus saves on production costs.

[0044] Optionally, such as Figure 3As shown, the sensor device 200 includes a thin-film transistor layer 110, a photosensitive device layer 120, and a light adjustment layer 130 stacked on the substrate 100. The light adjustment layer 130 is used to adjust the light incident on the photosensitive device layer 120. The recognition area D1 is disposed within the range of the light adjustment layer 130. The electromagnetic shielding film 400 covers the other areas on the substrate 100 except for the recognition area D1.

[0045] It is understood that the fingerprint module described in this embodiment can be applied to under-display fingerprint recognition on a display panel. After the fingerprint module is fixed on the display panel, the light adjustment layer 130 is disposed on the side of the substrate 100 near the display panel. When a finger presses on the recognition area D1, light (e.g., light emitted from the display panel) shines on the fingerprint (i.e., the finger texture), and is then reflected by the fingerprint onto the sensor 200 below the display panel, thereby generating a fingerprint image. It should be noted that the recognition area D1 needs to allow the light reflected from the fingerprint to pass through and reach the sensor 200. The position and shape of the recognition area D1 can be configured in various ways; for example, the shape of the recognition area D1 can be rectangular (e.g., a rectangle, or a square), circular, or rounded rectangle, etc.

[0046] In this embodiment, the electromagnetic shielding film 400 has the same shape as the substrate 100, covering the substrate 100 outside the recognition area D1. By increasing the coverage area of ​​the electromagnetic shielding film 400, the protection area of ​​the electromagnetic shielding film 400 is increased, the contact impedance is reduced, and rapid electrostatic discharge is achieved. This effectively shields the fingerprint module from interference from external electromagnetic waves and prevents external electrostatic discharge from damaging the surface of the fingerprint module. The fingerprint module of this application has high ESD resistance and can withstand voltages of ±15kV.

[0047] The specific structure of the light adjustment layer 130 is not limited in this embodiment. Exemplarily, the optical film layer includes, for example, a collimating light path film 101, a filter film 102, and a light-shielding film 103 disposed between the collimating light path film 101 and the filter film 102. The collimating light path film 101 can be a lens layer, which has one or more lenses 104 to collimate the light. The filter film 102 can resist strong light, and the light-shielding film 103 has at least one light-transmitting hole 105 to adjust the incident light. The cross-sectional shape of the light-transmitting hole 105 parallel to the substrate is triangular, square, or circular.

[0048] In specific implementations, the photosensitive functional layer includes a photosensitive device. In the embodiments of this application, the photosensitive device includes a first electrode 201 made of a metallic conductive material, a second electrode 203 made of a transparent conductive material, and a photosensitive layer PIN 202 located between the first electrode 201 and the second electrode 203. In one example, both the first electrode 201 and the second electrode 203 are in contact with the photosensitive layer PIN 202. It should be noted that this disclosure does not limit the material of the photosensitive layer PIN 202, and those skilled in the art can choose it as needed. In addition, the first electrode 201 can be formed using the source / drain metal layer 307 of a thin-film transistor.

[0049] Thin-film transistors (TFTs) can have top-gate, bottom-gate, or other structures. Taking a top-gate TFT as an example, the TFT specifically includes: a buffer layer 302 disposed on a substrate 100, and an active layer 303, a gate insulating layer 304, a gate electrode 305, an interlayer insulating layer 306, and a source / drain metal layer 307 sequentially disposed on the buffer layer 302. The source and drain electrodes formed on the source / drain metal layer 307 are in contact with the active layer 303 through vias penetrating the interlayer insulating layer 306 and the gate insulating layer 304, respectively.

[0050] In this embodiment, the sensor 200 further includes a multilayer shielding layer disposed above the photosensitive device layer. The shielding layer includes a passivation layer and a transparent common electrode layer. During the configuration, a cover layer 401 is formed on the second electrode 203; a planarization layer 402 is formed on the cover layer; a first passivation layer 403 is formed on the planarization layer 402; a first transparent common electrode layer 404 is formed on the first passivation layer 403; a second passivation layer 405 is formed on the first transparent common electrode layer 404; and a second transparent electrode 406 is formed on the second passivation layer 405.

[0051] The orthographic projection of the photosensitive device in the photosensitive layer 120 onto the substrate 100 does not overlap with the orthographic projection of the thin-film transistor in the thin-film transistor layer 110 onto the substrate 100. This avoids reflections caused by the source / drain metal layer 307 on the thin-film transistor being located below the photosensitive device, which could affect fingerprint recognition accuracy. Simultaneously, it also reduces noise interference from capacitance changes caused by overlap on the PIN. The orthographic projection of the light adjustment layer 130 onto the substrate 100 at least covers the orthographic projections of both the photosensitive device and the thin-film transistor onto the substrate 100. The light adjustment layer 130 adjusts the incident light from the photosensitive device, thereby improving fingerprint recognition performance.

[0052] In this embodiment, the orthographic projection of the recognition area D1 onto the substrate 100 is located within the orthographic projection range of the light adjustment layer 130 onto the substrate 100. The area of ​​the recognition area D1 is smaller than the area of ​​the light adjustment layer 130, which can prevent stray light such as ambient light from directly irradiating the photosensitive device, thereby improving fingerprint recognition efficiency and accuracy. It is understood that this embodiment does not limit the range of the recognition area D1. For example, the recognition area D1 is configured to allow incident light with an incident angle in the range of 3° to 7° to strike the photosensitive device layer 120.

[0053] The electromagnetic shielding film 400 covers a portion of the light adjustment layer 130. In this embodiment, by covering the peripheral area of ​​the light adjustment layer 130 with the electromagnetic shielding film 400, which extends from the upper surface of the light adjustment layer 130 to its side surface and onto the substrate 100, static electricity on the light adjustment layer 130 can be released. In particular, the static electricity introduced onto the surface of the transparent common electrode layer at the perpendicular junction of the light adjustment layer 130 and the substrate 100 has a better static discharge effect, preventing the film layer from being broken down. Figure 4 (I) shows a schematic diagram of electrostatic damage to a transparent common electrode layer, and (II) shows a schematic diagram of electrostatic damage to a display panel pixel layer.

[0054] It is understood that, in this application, the exposed area of ​​the electromagnetic shielding layer on the light adjustment layer 130 is the recognition area D1. The electromagnetic shielding layer can adjust the incident light and the edge light leakage at the light adjustment layer 130, control its light receiving angle within a preset range, allow only a portion of the light to enter the photosensitive device layer 120, and block light within a certain angle range, thus solving the influence of strong ambient light on optical sensing performance and further improving recognition performance. In addition, the electromagnetic shielding film 400 covers the perimeter of the light adjustment layer 130, ensuring the surface flatness of the light adjustment layer 130 for subsequent assembly and application on the display screen.

[0055] Optionally, such as Figure 5 As shown, the electromagnetic shielding film 400 includes an insulating layer 501, a metal layer 502, and an adhesive layer 503 stacked together. The electromagnetic shielding film 400 is fixedly disposed on the substrate 100 and the circuit board assembly 300 through the adhesive layer 503.

[0056] In this application, the adhesive layer 503 is an insulating adhesive to prevent the electromagnetic shielding film 400 from directly connecting to the devices on the FPC, thus preventing short circuits. In some embodiments, the adhesive layer 503 can be an insulating thermally conductive adhesive. When the electromagnetic shielding film 400 covers the circuit board assembly 300, the heat on the circuit board assembly 300 can be conducted to the metal layer 502 through the thermally conductive adhesive. The metal layer 502 has a high thermal conductivity, which can improve the heat dissipation effect of the circuit board assembly 300. In particular, the electromagnetic shielding layer increases the heat dissipation area by covering the substrate 100 and the circuit board assembly 300, allowing the heat from the circuit board to be quickly dissipated.

[0057] The circuit board assembly 300 includes a flexible circuit board 210, which is bonded to the substrate 100 via a flip-chip film 220. The flexible circuit board 210 has a copper leakage area 500 connected to the ground wire. The electromagnetic shielding film 400 extends from the substrate 100 through the flip-chip film 220 to the flexible circuit board 210, and the electromagnetic shielding film 400 is electrically connected to the copper leakage area 500.

[0058] It is understood that the circuit board assembly 300 can be a flexible circuit board 210 (FPC, Flexible Printed Circuit) or a printed circuit board (PCB, Printed Circuit Board). In this embodiment, a flexible circuit board 210 is used as an example.

[0059] The flexible circuit board 210 includes a device area D2 and a bonding area D3 bonded to the substrate 100; wherein, the device area D2 can be provided with various electronic components, such as resistors, capacitors, transistors, etc.; the chip-on-film (COF) 220 includes a carrier film and a chip IC disposed on the carrier film, one end of the carrier film is bonded to the substrate 100, and the other end is bonded to the bonding area D3 of the flexible circuit board 210.

[0060] The FPC also includes a connector 250 located at its second end. The FPC is electrically connected to the PCB on the display device via the connector 250, and the sensor 200 transmits the collected fingerprint information to the PCB on the display device via the FPC. It is understood that, in this embodiment, the connector 250 can be a board-to-board (BTB) connector. A lead area 260 can also be provided between the device area D2 and the connector 250. In this embodiment, the shape of the lead area 260 is not limited; it can be a long strip or a bent long strip.

[0061] In this embodiment, the shape of the electromagnetic shielding film 400 is adapted to the shape of the substrate 100 and the flexible circuit board 210. In some embodiments, the electromagnetic shielding film 400 may also extend to the lead area 260 on the flexible circuit board 210. This is not limited in this application and can be configured as needed.

[0062] It is understood that the fingerprint module includes a data reading circuit and a gate driving circuit 270. In different embodiments, the data reading circuit and the gate driving circuit 270 are integrated on the same IC or distributed on different ICs. In this application, an example is provided where the gate driving circuit 270 is located on the right side frame of the substrate 100, and the data reading circuit is located on the lower side frame of the substrate 100. Figure 6 As shown, the electromagnetic shielding film 400 also covers the gate driving circuit 270, realizing electrostatic protection and electromagnetic shielding on the gate driving circuit 270.

[0063] In this embodiment, the chip on the circuit board assembly 300 can be a data read chip, a gate chip, or an integrated chip of the data chip and the gate chip; this application does not limit this. It is understood that this embodiment does not limit the connection position of the connector 250; the connector 250 can be located at one end opposite the bonding region D3, or it can be located on either side of the device region D2.

[0064] In this embodiment, the copper leakage area 500 can be provided as copper foil on the flexible circuit board 210. Alternatively, in other embodiments, it can be implemented using copper potting or copper plating. For example, multiple copper potting grooves can be provided on the flexible circuit board 210, and metallic copper can be filled into these grooves. The copper potting method uses the unused space on the upper surface of the circuit board as a reference plane and connects it to the grounding wire. This embodiment does not limit the location or method of the copper leakage area 500.

[0065] Optionally, such as Figure 6 As shown, the electromagnetic shielding film 400 at least covers the bonding area D3, and the copper drain area 500 includes a first copper drain area 230 disposed at the location of the bonding area D3. By covering the flip-chip film 220, electromagnetic shielding and electrostatic discharge can be performed on the driver IC thereon, preventing any impact on the driver IC. By extending to the location of the bonding area D3 on the flexible circuit board 210, an electrical connection can be achieved with the copper drain area 500 at the location of the bonding area D3, thus grounding the electromagnetic shielding film 400.

[0066] It is understood that, in the embodiments of this application, the first copper drain area 230 may be located within the bonding area D3, or within the device area D2. Of course, it may also be located at the boundary between the bonding area D3 and the device area D2; this application is not limited in this respect. The first copper drain area 230 may be disposed along the length extension direction of the bonding area D3.

[0067] Optionally, such as Figure 7-8 As shown, the electromagnetic shielding film 400 at least covers the device region D2 and the bonding region D3. The copper leakage region 500 includes a second copper leakage region 240 disposed at the location of the device region D2. The second copper leakage region 240 is disposed around the edge of the device region D2 and has a certain length. The entire device region D2 and the flip-chip film 220 are covered by the electromagnetic shielding film 400, which can shield the device region D2 and the driver IC from interference by external electromagnetic waves, and prevent external electrostatic discharge from damaging the electronic components and driver IC in the device region D2.

[0068] In this embodiment, the length of the second copper drain area 240 is not limited. The second copper drain area 240 can be located at an edge position, or it can be a closed region surrounding the device region D2 to further shield external EMI interference and further improve the electrostatic discharge effect. For example, the second copper drain area 240 is arranged around the four edges of the device region D2, or, as... Figure 7 As shown, the second copper leakage area 240 is continuously disposed along the three edges outside the bonding area D3, as follows: Figure 8 As shown, the second copper leakage area 240 extends along the edge opposite to the bonding area D3.

[0069] It is understood that in this embodiment, the first copper leakage area 230 and the second copper leakage area 240 only refer to the edge region of the electromagnetic shielding film 400 on the flexible circuit board 210. In other embodiments, the copper leakage area 500 can be set in any space on the flexible circuit board 210. The copper leakage area 500 at other locations can be connected to the first copper leakage area 230 or the second copper leakage area 240 to reduce grounding impedance and improve electrostatic discharge effect. In addition, in this embodiment, a gap area is provided between the first copper leakage area 230, the second copper leakage area 240 and the electronic components in the device area D2. When ESD occurs, the static electricity cannot be released directly towards the electronic components, but can only be released towards the edge of the flexible circuit board 210 to prevent electrostatic damage to the electronic components.

[0070] In one embodiment of this application, such as Figure 9-10As shown, the electromagnetic shielding film 400 covers a portion of the copper leakage area 500. The electromagnetic shielding film 400 is electrically connected to the copper leakage area 500 via silver paste 280. The silver paste 280 extends from the surface of the electromagnetic shielding film 400 to the copper leakage area 500 via its end face. In this embodiment, the conductive silver paste 280 is formed at the edge of the electromagnetic shielding film 400. Conductivity is achieved through the contact of the conductive silver paste 280 with the end face of the electromagnetic shielding film 400. In this embodiment, the conductive silver paste 280 extends along the edge direction of the electromagnetic shielding film 400 to improve the electrical connection effect.

[0071] In the embodiments of this application, such as Figure 11-12 As shown, the copper leakage area 500 is provided with conductive protrusions 290. These conductive protrusions 290 are used to pierce the electromagnetic shielding film 400 to achieve electrical connection with it. Through the area where the conductive protrusions 290 overlap with the electromagnetic shielding film 400 at the copper leakage area 500, electrical connection can be achieved by pressing down on the electromagnetic shielding film 400 to pierce it. The structure is simple and easy to install.

[0072] In this embodiment, the cross-sectional shape of the conductive protrusion 290 is not limited; the cross-sectional shape of the conductive protrusion 290 can be triangular or trapezoidal. Multiple conductive protrusions 290 can be provided in the copper leakage area 500, and these protrusions can be arranged in a multi-row, multi-column array on the copper leakage area 500. Each row of multiple conductive protrusions 290 can be arranged along the extension direction of the copper leakage area 500, and each column of multiple conductive protrusions 290 can be arranged along the width direction of the copper leakage area 500. By providing conductive protrusions 290, the electrical connection between the electromagnetic shielding film 400 and the copper leakage area 500, as well as the electrostatic discharge effect, can be improved.

[0073] In this embodiment, multiple copper leakage areas 500 can be provided on the flexible circuit board 210 in the available positions. In addition to the first copper leakage area 230 or the second copper leakage area 240 connected to the edge of the electromagnetic shielding film 400 in this embodiment, multiple copper leakage areas 500 can also be provided on the flexible circuit board 210 in the non-edge area of ​​the electromagnetic shielding film 400. The first copper leakage area 230 or the second copper leakage area 240 can be electrically connected by using conductive silver paste 280, and the multiple copper leakage areas 500 in the non-edge area of ​​the electromagnetic shielding film 400 can be electrically connected by using conductive protrusions 290 to improve the electrostatic discharge effect.

[0074] Based on the same inventive concept, this application provides a display device including a fingerprint module as described above. The display device can be any product or component with fingerprint recognition functionality, such as a liquid crystal panel, electronic paper, OLED (Organic Light-Emitting Diode) panel, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, wearable device, etc.

[0075] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0076] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0077] Unless otherwise defined, the technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for descriptive purposes only and is not intended to limit the invention. Terms such as “set” appearing herein can refer to either a component being directly attached to another component or a component being attached to another component via an intermediary. A feature described in one embodiment herein may be applied, alone or in combination with other features, to another embodiment, unless that feature is not applicable in that other embodiment or is otherwise stated.

[0078] The present invention has been described through the above embodiments; however, it should be understood that the above embodiments are for illustrative purposes only and are not intended to limit the present invention to the described embodiments. Those skilled in the art will understand that many variations and modifications can be made based on the teachings of the present invention, and all such variations and modifications fall within the scope of protection claimed by the present invention.

Claims

1. A fingerprint module, characterized in that, include: A substrate, wherein a sensor is disposed on one side surface of the substrate, the sensor including a recognition area for recognizing fingerprints; A circuit board assembly, which is electrically connected to the sensor device; An electromagnetic shielding film covers a portion of the surface of the substrate on the side where the sensor is mounted and a portion of the circuit board, and the electromagnetic shielding film surrounds but does not cover the identification area. The electromagnetic shielding film is electrically connected to the grounding wire on the circuit board assembly. The circuit board assembly includes a flexible circuit board, on which a copper leakage area connected to the grounding wire is provided, and the electromagnetic shielding film extends from the substrate through a flip-chip film to the flexible circuit board. The flexible circuit board includes a device area and a bonding area bonded to the substrate. The copper leakage area includes a second copper leakage area disposed at the location of the device area. The second copper leakage area is disposed around the edge of the device area and has a certain length.

2. The fingerprint module according to claim 1, characterized in that, The sensor includes a thin-film transistor layer, a photosensitive device layer, and a light adjustment layer stacked on the substrate. The light adjustment layer is used to adjust the light incident on the photosensitive device layer. The recognition area is located within the range of the light adjustment layer. The electromagnetic shielding film covers the areas on the substrate other than the identification area.

3. The fingerprint module according to claim 2, characterized in that, The orthographic projection of the recognition area on the substrate is located within the orthographic projection range of the light adjustment layer on the substrate; The electromagnetic shielding film covers a portion of the light adjustment layer.

4. The fingerprint module according to claim 2, characterized in that, The orthographic projection of the photosensitive device in the photosensitive device layer onto the substrate does not overlap with the orthographic projection of the thin-film transistor in the thin-film transistor layer onto the substrate; The orthogonal projection of the light adjustment layer on the substrate at least covers the orthogonal projections of the photosensitive device and the thin-film transistor on the substrate.

5. The fingerprint module according to claim 1, characterized in that, The electromagnetic shielding film includes an insulating layer, a metal layer, and an adhesive layer stacked together. The electromagnetic shielding film is fixedly disposed on the substrate and the circuit board assembly through the adhesive layer.

6. The fingerprint module according to claim 1, characterized in that, The flexible circuit board is bonded to the substrate via a flip-chip film.

7. The fingerprint module according to claim 6, characterized in that, The electromagnetic shielding film at least covers the bonding area, and the copper leakage area includes a first copper leakage area disposed at the location of the bonding area.

8. The fingerprint module according to claim 6, characterized in that, The electromagnetic shielding film covers a portion of the copper leakage area. The electromagnetic shielding film is electrically connected to the copper leakage area via silver paste, which extends from the surface of the electromagnetic shielding film through its end face to the copper leakage area.

9. The fingerprint module according to claim 6, characterized in that, The copper leakage area is provided with conductive protrusions, which are used to achieve electrical connection with the electromagnetic shielding film when the electromagnetic shielding film is pierced.

10. A display device, characterized in that, Includes the fingerprint module as described in any one of claims 1-9.

Images