Grain transfer apparatus, die bonder and grain transfer method

Abstract

This application provides a die transfer apparatus, a die bonder, and a die transfer method. The die transfer apparatus includes: a substrate with a first side having multiple mounting slots suitable for mounting a die; a feeding assembly disposed on the first side of the substrate, capable of releasing a die towards the substrate, the die having a magnetic layer; and an auxiliary plate disposed between the substrate and the feeding assembly, the first side of the auxiliary plate facing the substrate and the second side of the auxiliary plate facing the feeding assembly. The auxiliary plate has multiple through-holes extending along its thickness direction, at least a portion of which correspond to the positions of the mounting slots. The auxiliary plate is antimagnetic, capable of applying a countermagnetic force to the die with the magnetic layer. This die transfer apparatus can achieve rapid die transfer, improving the accuracy, reliability, and yield of die transfer.

Description

Technical Field

[0001] This application relates to the field of grain transfer technology, and more specifically, to a grain transfer apparatus, a die bonder containing the grain transfer apparatus, and a grain transfer method according to the grain transfer apparatus. Background Technology

[0002] In the production process of Mini-LED and Micro-LED displays, mass transfer of chips is required. In existing technologies, pre-layout and pre-alignment of chips are required before mass transfer, which results in slow transfer speed, low yield, poor accuracy, and difficulty in compatibility with the production of products with different chip pitches, making it difficult to achieve batch introduction of chips for transfer production. Summary of the Invention

[0003] One objective of this application is to provide a new technology solution for a die transfer device that can at least solve one of the problems of slow die transfer speed, low yield, poor accuracy, and poor compatibility in the prior art.

[0004] Another object of this application is to provide a die bonder including the above-described die transfer device.

[0005] Another object of this application is to provide a grain transfer method according to the above-described grain transfer apparatus.

[0006] According to a first aspect of this application, a die transfer device is provided, comprising: a substrate having a plurality of mounting grooves on a first side suitable for mounting a die; a feeding assembly disposed on the first side of the substrate, the feeding assembly being capable of releasing the die toward the side of the substrate, the die having a magnetic layer disposed thereon; and an auxiliary plate disposed between the substrate and the feeding assembly, the auxiliary plate having a first side facing the substrate and a second side facing the feeding assembly, the auxiliary plate having a plurality of through holes extending along its thickness direction, at least a portion of the through holes being positioned corresponding to the positions of the mounting grooves, wherein the auxiliary plate is antimagnetic and capable of applying an antimagnetic force to the die having the magnetic layer disposed thereon.

[0007] Optionally, the substrate and the auxiliary plate are stacked together, and the orthographic projection of the through hole on the first side surface of the substrate at least covers the opening of the mounting groove.

[0008] Optionally, the cross-section of the through hole and the opening of the mounting groove are both rectangular, and the length and width of the cross-section of the through hole are greater than the length and width of the opening of the mounting groove.

[0009] Optionally, the length and width of the cross-section of the through hole are each more than 15% larger than the length and width of the opening of the mounting groove.

[0010] Optionally, the through holes and the mounting grooves are arranged in a matrix, with the position of each through hole corresponding to the position of the mounting groove.

[0011] Optionally, the auxiliary plate is a pyrolytic graphite plate.

[0012] Optionally, the feeding assembly includes: a transfer film disposed on the second side of the auxiliary plate, the first side of the transfer film facing the substrate and having a plurality of the grains adhered thereto; and a laser generator disposed on the second side of the transfer film, the laser generator being capable of generating laser light and projecting it onto a predetermined area of ​​the transfer film, so that the transfer film releases the grains within the predetermined area.

[0013] Optionally, the die transfer device further includes a drive member connected to the substrate to drive the substrate to vibrate.

[0014] According to a second aspect of this application, a die bonder is provided, comprising: a housing having a vacuum chamber; and a grain transfer device as described in any of the above embodiments, wherein the grain transfer device is disposed in the vacuum chamber.

[0015] According to a third aspect of this application, a method for transferring a die according to any of the die transfer apparatuses described in the above embodiments is provided, comprising the following steps: placing the auxiliary plate above the substrate and aligning the through hole with the mounting groove; placing the feeding assembly above the auxiliary plate and controlling the feeding assembly to release the die, wherein the die passes through the through hole and enters the mounting groove under the action of gravity and the countermagnetic force generated by the auxiliary plate; and separating the auxiliary plate from the substrate.

[0016] According to the die transfer apparatus of this application, an auxiliary plate with through holes is provided between the substrate and the feeding assembly. The auxiliary plate applies a counter-magnetic force to the die with a magnetic layer, thereby screening the die when the feeding assembly releases it. This allows the die corresponding to the through hole to pass through and enter the corresponding mounting slot, achieving rapid die transfer. This eliminates the die pre-arrangement process, saving production time and improving production efficiency. Simultaneously, the magnetic interaction between the auxiliary plate's magnetism and the die's magnetic layer further improves the accuracy and reliability of die transfer, thereby increasing the yield.

[0017] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0019] Figure 1 This is a perspective view of the substrate of a die transfer apparatus according to an embodiment of this application;

[0020] Figure 2 This is a perspective view of an auxiliary plate of a die transfer apparatus according to an embodiment of this application;

[0021] Figure 3 This is a schematic diagram of a die transfer apparatus according to an embodiment of this application, showing the substrate and auxiliary plate working together to transfer the die.

[0022] Figure 4 This is a schematic diagram of a grain transfer apparatus according to an embodiment of this application;

[0023] Figure 5 This is a schematic diagram of the housing of a grain transfer device according to an embodiment of this application;

[0024] Figure 6 This is a flowchart of a mass transfer process performed by a die bonder according to an embodiment of this application.

[0025] Figure Labels

[0026] Grain transfer device 100;

[0027] Substrate 10; Mounting slot 11;

[0028] Feeding assembly 20; transfer film 21; laser generator 22;

[0029] Auxiliary plate 30; Through hole 31;

[0030] Casing 200; Vacuum chamber 201;

[0031] Grain size 300. Detailed Implementation

[0032] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0033] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.

[0034] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0035] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0036] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0037] The die transfer apparatus 100 according to an embodiment of this application will now be described in detail with reference to the accompanying drawings.

[0038] like Figures 1 to 5 As shown, the die transfer apparatus 100 according to an embodiment of this application includes: a substrate 10, a feeding assembly 20, and an auxiliary plate 30.

[0039] Specifically, the first side of the substrate 10 has a plurality of mounting grooves 11 suitable for mounting the die 300. The feeding assembly 20 is disposed on the first side of the substrate 10. The feeding assembly 20 can release the die 300 on the side facing the substrate 10. The die 300 is provided with a magnetic layer. The auxiliary plate 30 is disposed between the substrate 10 and the feeding assembly 20. The first side of the auxiliary plate 30 faces the substrate 10, and the second side of the auxiliary plate 30 faces the feeding assembly 20. The auxiliary plate 30 is provided with a plurality of through holes 31 extending along its thickness direction. The positions of at least a portion of the through holes 31 correspond to the positions of the mounting grooves 11. The auxiliary plate 30 is antimagnetic and can apply an antimagnetic force to the die 300 provided with the magnetic layer.

[0040] In other words, the die transfer apparatus 100 according to the embodiments of this application mainly consists of a substrate 10, a feeding assembly 20, and an auxiliary plate 30. The die transfer apparatus 100 can transfer a die 300 from the feeding assembly 20 onto the substrate 10. Optionally, the die 300 can be a light-emitting diode die, specifically including Mini-LED dies and / or Micro-LED dies, wherein the size of the Mini-LED die is 50μm to 200μm, and the size of the Micro-LED die is less than 50μm. That is to say, the die transfer apparatus 100 of this embodiment can be applied to dies 300 with a size of less than or equal to 200μm, realizing the rapid transfer of small-sized dies 300.

[0041] The substrate 10 is the carrier of the chip 300. The substrate 10 can be a PCB board or a glass board. Conductive lines can be etched on the substrate. After the chip 300 is installed on the substrate, the substrate is powered on, so that the current can flow along the conductive lines to the chip 300 and form a circuit, making the chip emit light.

[0042] The first side of the substrate 10 may have a plurality of mounting slots 11. The mounting slots 11 may be configured to be suitable for mounting the die 300 in shape and size. After the transfer is completed, a portion of the die 300 may extend into the mounting slot 11. The arrangement of the mounting slots 11 on the substrate 10 may be set according to the arrangement requirements of the die 300 on the substrate 10.

[0043] The feeding assembly 20 can be disposed on one side of the substrate 10 and spaced apart from the substrate 10. For ease of explanation, the side of the substrate 10 on which the feeding assembly 20 is disposed can be defined as the first side of the substrate 10. The feeding assembly 20 can release the die 300 toward the first side of the substrate 10 to achieve feeding.

[0044] Additionally, an auxiliary plate 30 is provided on the first side of the substrate 10, and the auxiliary plate 30 is located between the substrate 10 and the feeding assembly 20. The auxiliary plate 30 can be arranged approximately parallel to the substrate 10, the first side of the auxiliary plate 30 can be opposite to the first side of the substrate 10, and the second side of the auxiliary plate 30 can face the feeding assembly 20. The auxiliary plate 30 has a plurality of through holes 31 extending through itself, and the through holes 31 extend along its own thickness direction. That is, the through holes 31 penetrate through the first and second sides of the auxiliary plate 30. Some or all of the plurality of through holes 31 can correspond to the position of the mounting groove 11, so that the die 300 can pass through the through holes 31 and enter the mounting groove 11.

[0045] In addition, the auxiliary plate 30 may be antimagnetic, and a magnetic layer may be provided on the grain 300. The auxiliary plate 30 can apply a repulsive antimagnetic force to the magnetic layer on the grain 300.

[0046] Optionally, a magnetic layer can be disposed at the bottom of the grain 300, and the magnetic layer approaches the auxiliary plate 30 when the grain 300 moves toward the auxiliary plate 30. The auxiliary plate 30 can apply a counter-magnetic force to the grain 300, repelling the magnetic layer on the grain 300.

[0047] Optionally, the die transfer device 100 may also include a magnetic field generator. The magnetic layer on the die 300 may lose its magnetism under high temperature and vibration conditions. The magnetic field generator can apply an external magnetic field to the magnetic layer on the die 300 to remagnetize the lost magnetic layer.

[0048] The specific process of transferring the die using the die transfer device 100 in this embodiment will be described in detail below.

[0049] The first side of the substrate 10 can be the upper side of the substrate 10. The auxiliary plate 30 can be disposed above the substrate 10, and the feeding assembly 20 can release the die 300 above the auxiliary plate 30. Among the released dies 300, the dies 300 corresponding to the through holes 31 on the auxiliary plate 30 can fall downwards under their own gravity and pass through the through holes 31 into the corresponding mounting groove 11. The dies 300 corresponding to the solid structures on the auxiliary plate 30 are subjected to the anti-magnetic force of the auxiliary plate 30. The anti-magnetic force can cancel out the gravity of the dies 300, causing the dies 300 to suspend above the auxiliary plate 30. In addition, under the action of the anti-magnetic force and gravity, the dies 300 can also move toward the position corresponding to the through holes 31, thereby entering the corresponding mounting groove 11 through the through holes 31.

[0050] It should be noted that the auxiliary plate 30 can be reused. After the die transfer is completed, the auxiliary plate 30 can be separated from the substrate 10. The substrate 10 containing the die 300 can be used for subsequent processing operations, and the auxiliary plate 30 can be used for the next die transfer, thereby reducing production costs.

[0051] Therefore, according to the die transfer device 100 provided in this embodiment, by providing an auxiliary plate 30 with through holes 31 between the substrate 10 and the feeding assembly 20, the auxiliary plate 30 can apply a counter-magnetic force to the die 300 with a magnetic layer. This allows the die 300 to be screened when the feeding assembly 20 releases it, enabling the die 300 corresponding to the through hole 31 to pass through the through hole 31 and enter the corresponding mounting groove 11. This achieves rapid die transfer, eliminating the need for pre-arrangement of the die 300, saving production time and improving production efficiency. Simultaneously, the magnetic interaction between the magnetism of the auxiliary plate 30 and the magnetic layer of the die 300 further improves the accuracy and reliability of die transfer, thereby increasing the yield.

[0052] Furthermore, since at least a portion of the multiple through holes 31 on the auxiliary plate 30 corresponds to the mounting grooves 11, the auxiliary plate 30 can be designed to be compatible with various substrates 10. The spacing between adjacent mounting grooves 11 on various substrates 10 can be different. By setting the through holes 31 on the auxiliary plate 30 to correspond to mounting grooves 11 with different spacing distances, the same auxiliary plate 30 can be used on different substrates 10, thereby enabling it to be used to produce products with different die pitches and improving the applicability of the die transfer device 100.

[0053] Optionally, the magnetic layer on the grain 300 can be made of a strong magnetic material such as rubidium or boron, and the thickness of the grain 300 can be from 5 μm to 10 μm. The auxiliary plate 30 can be made of a diamagnetic material, which can exhibit diamagnetic properties in a magnetic field and apply a diamagnetic force to the magnetic structure.

[0054] According to one embodiment of this application, the substrate 10 and the auxiliary plate 30 are stacked, and the orthographic projection of the through hole 31 on the first side surface of the substrate 10 at least covers the opening of the mounting groove 11.

[0055] Specifically, the auxiliary plate 30 can be stacked on the surface of the first side of the substrate 10, such that at least part of the through-hole 31 and the mounting groove 11 can communicate. For ease of explanation, the stacking direction of the auxiliary plate 30 and the substrate 10 can be defined as the first direction. The through-hole 31 can penetrate the substrate 10 along the first direction, and the orthogonal projection of the through-hole 31 on the surface of the first side of the substrate 10 can at least cover the opening of the mounting groove 11. The size of the mounting groove 11 can be matched with the size of the die 300. By setting the orthogonal projection of the through-hole 31 on the surface of the first side of the substrate 10 to at least cover the opening of the mounting groove 11, the die 300 can smoothly pass through the through-hole 31 and enter the mounting groove 11.

[0056] For example, the first direction can be vertical, the auxiliary plate 30 can be stacked on the upper surface of the substrate 10, the orthographic projection of the through hole 31 along the vertical direction on the upper surface of the substrate 10 can at least cover the opening of the mounting groove 11, and the area of ​​the orthographic projection of the through hole 31 on the upper surface of the substrate 10 is not less than the area of ​​the opening of the mounting groove 11 on the upper surface of the substrate 10, so that the die 300 passing through the through hole 31 can smoothly enter the mounting groove 11.

[0057] According to some other embodiments of this application, the cross-section of the through hole 31 and the opening of the mounting groove 11 are respectively formed as rectangles, and the length and width of the cross-section of the through hole 31 are greater than the length and width of the opening of the mounting groove 11.

[0058] Specifically, the cross-section of the through hole 31 can be the cross-section of the through hole 31 when the auxiliary plate 30 is cut horizontally. The cross-section of the through hole 31 and the shape of the mounting groove 11 can be the same, both being rectangular. Optionally, the through hole 31 can be a rectangular hole, which can be formed by four sequentially connected rectangular sidewalls, and the mounting groove 11 can be a rectangular groove, which can be formed by four sequentially connected rectangular sidewalls and a rectangular bottom surface.

[0059] Furthermore, the length of the cross-section of the through-hole 31 can be greater than the length of the opening of the mounting groove 11, and the width of the cross-section of the through-hole 31 can be greater than the width of the opening of the mounting groove 11. That is, the rectangle formed by the opening of the mounting groove 11 can be surrounded by the orthographic projection of the rectangle formed by the cross-section of the through-hole 31 onto the first side surface of the substrate 10. The shape and size of the mounting groove 11 can be adapted to the size of the die 300, and the cross-section of the die 300 can also be rectangular. Therefore, the length of the cross-section of the through-hole 31 can be greater than the length of the cross-section of the die 300, and the width of the cross-section of the through-hole 31 can be greater than the width of the cross-section of the die 300, so that the die 300 can pass smoothly through the through-hole 31, avoiding interference with the through-hole 31 that could cause the die 300 to fail to transfer, resulting in a missing die in the upper part of the mounting groove 11 on the substrate 10.

[0060] In some specific embodiments of this application, the length and width of the cross-section of the through hole 31 are more than 15% larger than the length and width of the opening of the mounting groove 11.

[0061] Specifically, the cross-sectional length of the through hole 31 is 15% larger than the length of the opening of the mounting groove 11, and the cross-sectional width of the through hole 31 is 15% larger than the width of the opening of the mounting groove 11. This helps to ensure that the die 300 falls smoothly into the mounting groove 11 through the through hole 31, so that there is a sufficient gap between the die 300 and the inner wall of the through hole 31 during the process of the die 300 passing through the through hole 31, and avoids the die 300 from sticking to the inner wall of the through hole 31.

[0062] Optionally, the length and width of the cross-section of the through hole 31 can be 20%, 25%, or 30% larger than the length and width of the opening of the mounting groove 11, respectively, and this application does not impose any restrictions on this.

[0063] According to some optional embodiments of this application, the through holes 31 and the mounting grooves 11 are arranged in a matrix, and the position of each through hole 31 corresponds to the position of the mounting groove 11.

[0064] Specifically, the mounting slots 11 can be arranged in a rectangular array on the substrate 10, and the through holes 31 can be arranged in a rectangular array on the auxiliary plate 30, so that each through hole 31 can correspond to a mounting slot 11, so that each die 300 falling into the through hole 31 can enter the corresponding mounting slot 11, thereby ensuring that after the die transfer is completed, each mounting slot 11 on the substrate 10 contains a die 300.

[0065] Optionally, the through holes 31 on the auxiliary plate 30 can correspond one-to-one with the mounting slots 11 on the substrate 10. That is, the number of through holes 31 on the auxiliary plate 30 is the same as the number of mounting slots 11 on the substrate 10, and their arrangement positions correspond one-to-one. Through a single positioning and installation between the auxiliary plate 30 and the substrate 10, the die 300 can be transferred into all the mounting slots 11 on the substrate 10, which helps to improve the transfer accuracy of the die 300 and improve the transfer efficiency.

[0066] In this embodiment, the through holes 31 are arranged in the same matrix as the mounting grooves 11, and the position of each through hole 31 corresponds to the position of the mounting groove 11. This allows each die 300 corresponding to a through hole 31 among the dies 300 released by the feeding assembly 20 to enter the corresponding mounting groove 11, while the dies 300 not corresponding to a through hole 31 are suspended on the second side of the auxiliary plate 30. This facilitates the removal of excess dies 300 after the transfer is completed, preventing dies 300 from adhering to the surface of the substrate 10.

[0067] According to other embodiments of this application, the auxiliary plate 30 is a pyrolytic graphite plate. Since pyrolytic graphite is diamagnetic, the pyrolytic graphite plate can apply a diamagnetic force to the grains 300 with magnetic layers under the action of a magnetic field, thereby cooperating with the through holes 31 on the pyrolytic graphite plate to guide the falling of the grains 300, so that some of the grains 300 can pass through the through holes 31 into the mounting groove 11 to complete the transfer of the grains, and make the other part of the grains 300 suspend on the pyrolytic graphite plate so that the excess grains can be removed after the transfer is completed.

[0068] In some specific embodiments of this application, the feeding assembly 20 includes a transfer film 21 and a laser generator 22. The transfer film 21 is disposed on the second side of the auxiliary plate 30, with its first side facing the substrate 10 and having a plurality of grains 300 adhered thereto. The laser generator 22 is disposed on the second side of the transfer film 21 and is capable of generating laser light and projecting it onto a predetermined area of ​​the transfer film 21, thereby causing the transfer film 21 to release the grains 300 within the predetermined area.

[0069] Specifically, the feeding assembly 20 in this embodiment can mainly consist of a transfer film 21 and a laser generator 22. The transfer film 21 can be disposed on a first side of the substrate 10, and an auxiliary plate 30 can be located between the transfer film 21 and the substrate 10. The second side of the auxiliary plate 30 can be opposite to the first side of the transfer film 21, and the second side of the transfer film 21 can face away from the auxiliary plate 30. A plurality of grains 300 can be adhered to the first side of the transfer film 21, and the grains 300 can be randomly arranged on the surface of the first side of the transfer film 21. It should be noted that the grains 300 adhered to the transfer film 21 can separate from the transfer film 21 after laser irradiation or heating.

[0070] A laser generator 22 can be provided on the second side of the transfer film 21. The laser generator 22 can generate laser light, and the laser light can be projected onto a predetermined area of ​​the transfer film 21. The grains 300 in the area of ​​the transfer film 21 irradiated by the laser light separate from the transfer film 21 and move toward the auxiliary plate 30 under their own gravity, thereby realizing the release of the grains 300.

[0071] In this embodiment, by cooperating with the laser generator, the transfer film 21 can be irradiated with a laser to release the grains 300 on the transfer film 21. This can quickly achieve material supply and also facilitate the control of the release of the grains 300.

[0072] Optionally, the projected area of ​​the laser beam projected onto the transfer film 21 can be smaller than the area of ​​the first side surface of the substrate 10. In this case, the laser generator can move in a direction parallel to the film, sequentially irradiating each area of ​​the film with laser light, thereby gradually releasing the grains 300 on the film and gradually filling the mounting groove 11 on the substrate 10. Setting the laser generator to project a smaller area of ​​laser light onto the transfer film 21 helps to reduce the size of the laser generator, lower the cost of the grain transfer device 100, and also allows for control of the release rate of the grains 300, thus facilitating better control of grain transfer.

[0073] According to some optional embodiments of this application, the projection surface of the laser generated by the laser generator 22 onto the transfer film 21 corresponds to the shape of the substrate 10. For example, the shape of the first side of the substrate 10 can be approximately rectangular, and correspondingly, the projection surface of the laser generated by the laser generator 22 onto the transfer film 21 can be approximately rectangular.

[0074] Therefore, when the laser generator scans the transfer film 21 with a laser, the laser can scan the transfer film 21 uniformly, ensuring that the number of released grains 300 is approximately the same throughout the transfer film 21. This guarantees that each through-hole 31 corresponds to a released grain 300, thereby filling the mounting groove 11 of the substrate 10. This avoids uneven laser irradiation of different parts of the transfer film 21, which would result in different numbers of released grains 300 in different parts of the transfer film 21, leading to empty mounting grooves 11 and reduced yield.

[0075] Optionally, the projection of the laser onto the transfer film 21 can be rectangular, with a length of 20 mm and a width of 10 mm. This allows for rapid release and transfer of the grain 300, while also reducing the size of the laser generator and the cost of the grain transfer device 100, thereby lowering the cost of grain transfer.

[0076] According to other embodiments of this application, the die transfer device 100 further includes a drive member connected to the substrate 10 to drive the substrate 10 to vibrate.

[0077] Specifically, the substrate 10 can vibrate under the drive of the driving component. Since the cross-sectional dimension of the through hole 31 can be larger than the opening size of the mounting groove 11 (wherein the dimension can include length, width, diameter, etc.), the die 300 may not be aligned with the opening of the mounting groove 11 after passing through the through hole 31. This could cause the die 300 to be blocked by the end face near the opening of the mounting groove 11, making it difficult for it to enter the mounting groove 11. In this case, the substrate 10 can be driven to vibrate by the driving component, and with the die 300 receiving a reverse magnetic force, it can be ensured that the die 300 enters the mounting groove 11.

[0078] This application also provides a die bonder, which includes a housing 200 and a die transfer device 100 according to the above embodiment. Wherein, as Figure 5 As shown, the housing 200 has a vacuum chamber 201, and the grain transfer device 100 is disposed in the vacuum chamber 201. That is to say, the transfer of the grain 300 can be carried out in the vacuum chamber 201 to eliminate the influence of the external environment and improve the reliability and controllability of the grain transfer process.

[0079] Since the die transfer device 100 according to the embodiments of the present invention has the above-mentioned technical effects, the die bonder according to the embodiments of the present application also has the corresponding technical effects, that is, it can realize the rapid transfer of the die 300, save production time, improve production efficiency, and at the same time, it can also improve the accuracy and reliability of the die 300 transfer, thereby improving the yield.

[0080] This application also provides a grain transfer method according to the grain transfer apparatus of any one of the above embodiments. Specifically, the grain transfer method includes the following steps:

[0081] Place the auxiliary plate 30 above the base plate 10, and align the through hole 31 with the position of the mounting groove 11;

[0082] The feeding assembly 20 is placed above the auxiliary plate 30, and the feeding assembly 20 is controlled to release the crystal 300. Under the action of gravity and the anti-magnetic force generated by the auxiliary plate 30, the crystal 300 passes through the through hole 31 and enters the mounting groove 11.

[0083] Separate the auxiliary plate 30 from the substrate 10.

[0084] The mass transfer process performed by the die bonder in this embodiment is described in detail below.

[0085] like Figure 6As shown, firstly, the auxiliary plate 30 and the substrate 10 can be positioned in the vacuum chamber 201. The auxiliary plate 30 is placed above the substrate 10, and the through hole 31 on the auxiliary plate 30 is aligned with the mounting groove 11 on the substrate 10, which is the positioning and fixing step of the target substrate 10 and the pyrolytic graphite plate. Next, the feeding assembly 20 can be placed above the auxiliary plate 30, and the transfer film 21 in the feeding assembly 20 is positioned and fixed in the vacuum chamber 201. The laser generator 22 of the feeding assembly 20 is also calibrated, which is the positioning and laser system calibration step of the transfer film 21. Then, the vacuum chamber 201 can be evacuated, which is the chamber evacuation step. Subsequently, the laser generator 22 of the feeding assembly 20 can be activated to irradiate the transfer film 21, controlling the transfer film 21 of the feeding assembly 20 to release the grains. 300. A portion of the released grains 300 can enter the mounting groove 11 of the substrate 10 under the action of the auxiliary plate 30, while the other portion can float on the surface of the auxiliary plate 30, i.e., grain transfer and fixing steps are performed; then, the substrate 10 and the auxiliary plate 30 can be removed from the vacuum chamber 201, i.e., target substrate 10 and graphite plate unloading are performed; then, the grains 300 contained in the mounting groove 11 of the substrate 10 can be reflow soldered to fix the grains 300 on the substrate 10, i.e., reflow soldering step is performed; subsequently, the auxiliary plate 30 can be separated from the substrate 10, and the auxiliary plate 30 can be removed from the substrate 10, i.e., pyrolytic graphite plate disassembly is performed; finally, the excess grains 300 can be cleaned, i.e., material removal and cleaning step is performed.

[0086] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A grain transfer device, characterized by, The application relates to a wafer transfer device, comprising: a substrate, a first side of the substrate being provided with a plurality of mounting slots suitable for mounting wafer grains; a supply assembly arranged on the first side of the substrate, the supply assembly being capable of releasing the wafer grains towards the side of the substrate, the wafer grains being provided with a magnetic layer; an auxiliary plate arranged between the substrate and the supply assembly, a first side of the auxiliary plate facing the substrate, a second side of the auxiliary plate facing the supply assembly, the auxiliary plate being provided with a plurality of through holes penetrating in the thickness direction of the auxiliary plate, at least a part of the through holes corresponding to the positions of the mounting slots in position; the substrate and the auxiliary plate are arranged in a stack, the through holes covering the openings of the mounting slots in the orthographic projection of the first side surface of the substrate; the supply assembly comprises a transfer film and a laser generator, the transfer film being arranged on the second side of the auxiliary plate, a first side of the transfer film facing the substrate and being adhered with a plurality of the wafer grains, the laser generator being arranged on the second side of the transfer film, the laser generator being capable of generating laser and projecting the laser to a predetermined area of the transfer film, so that the transfer film releases the wafer grains in the predetermined area; a driving member connected with the substrate to drive the substrate to vibrate; wherein the auxiliary plate has diamagnetism, is capable of exerting diamagnetic force on the wafer grains provided with the magnetic layer, and the diamagnetic force can offset the gravity of the wafer grains, so that the wafer grains are suspended above the auxiliary plate.

2. The grain transfer device of claim 1, wherein The cross section of the through hole and the opening of the mounting slot are respectively formed in a rectangular shape, and the length and width of the cross section of the through hole are greater than the length and width of the opening of the mounting slot.

3. The grain transfer apparatus of claim 2, wherein, The length and width of the cross section of the through hole are greater than the length and width of the opening of the mounting slot by more than 15%.

4. The grain transfer apparatus of claim 1, wherein The through holes and the mounting slots are respectively arranged in a matrix, and the position of each through hole respectively corresponds to the position of the mounting slot.

5. The grain transfer apparatus of claim 1, wherein The auxiliary plate is a pyrolytic graphite plate.

6. A die bonder, characterized by comprising: The application relates to a wafer transfer device, comprising: a housing provided with a vacuum chamber; the wafer transfer device according to any one of claims 1-5 is arranged in the vacuum chamber.

7. A method of transferring grains according to the grain transfer apparatus of any one of claims 1 to 5, characterized by, The application relates to a wafer transfer method, comprising the following steps: arranging the auxiliary plate above the substrate and making the positions of the through holes correspond to the positions of the mounting slots; arranging the supply assembly above the auxiliary plate and controlling the supply assembly to release the wafer grains, the wafer grains penetrating from the through holes into the mounting slots under the action of gravity and the diamagnetic force generated by the auxiliary plate; separating the auxiliary plate from the substrate.

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