Printed wiring board and method for preventing soldering of gold fingers

Abstract

The application provides a printed circuit board and a manufacturing method of gold finger anti-tinning thereof. The manufacturing method of gold finger anti-tinning of the printed circuit board comprises the following steps: forming a gold finger area on a substrate; performing a milling processing operation on the substrate to form a milling area on the substrate, wherein the milling area is away from the gold finger area, and the milling area is arranged adjacent to the gold finger area; performing a high-temperature adhesive pasting operation on the substrate, so that the high-temperature adhesive is arranged through the milling area and is bent and pasted on the inner wall of the gold finger area and the milling area on both sides of the substrate; performing a baking operation on the substrate after the adhesive pasting; and performing a flattening and adhesive pressing operation on the substrate after the baking. The manufacturing method of gold finger anti-tinning of the printed circuit board can reliably paste the high-temperature adhesive on both sides of the gold finger area, so that the probability of the high-temperature adhesive being blown up during tin spraying is reduced, the high-temperature adhesive reliably protects the gold finger area during tin spraying, and the scrap rate of the printed circuit board is greatly reduced.

Description

Technical Field

[0001] This invention relates to the technical field of printed circuit boards, and in particular to a method for manufacturing a printed circuit board and a method for preventing solder adhesion to the gold fingers. Background Technology

[0002] Printed circuit boards, also known as printed circuit boards, are important electronic components. They serve as the support for electronic components and the carrier for the electrical interconnection of these components.

[0003] With the continuous development of printed circuit boards (PCBs), they are gradually evolving towards higher density, higher precision, smaller apertures, finer wires, finer spacing, higher reliability, multilayer construction, high-speed transmission, lighter weight, and thinner profiles. Among these, PCBs with gold fingers are becoming increasingly widespread. Gold fingers are electrical interfaces that connect to the motherboard via contact between the gold fingers and spring contacts within the slot, enabling interconnection between the external PCB and the motherboard. Pin headers, on the other hand, are connectors widely used in PCBs for electronics, electrical appliances, and instruments. Their function is to act as a bridge between blocked or isolated circuits, facilitating the transmission of current or signals.

[0004] Tin plating, one of the many processes in PCB manufacturing, addresses the issue that copper is easily oxidized in the air, causing PCB pads to lose conductivity or reducing solderability. Applying tin to the copper surface effectively isolates it from the air, maintaining the PCB's conductivity and solderability.

[0005] In the traditional manufacturing process of printed circuit boards (PCBs), the gold fingers are typically finished before surface treatments such as tin plating. However, due to limitations in the PCB layout and the angle of the tin plating nozzle (i.e., the PCB layout and the tin plating nozzle are not parallel), high-temperature adhesive is blown up during the tin plating process, making it easy for the gold fingers to become tinned. This results in a high scrap rate for PCBs. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method for manufacturing a printed circuit board with a low scrap rate and a method for preventing solder adhesion to the gold fingers.

[0007] The objective of this invention is achieved through the following technical solution:

[0008] A method for manufacturing anti-soldering agents for gold fingers of a printed circuit board includes:

[0009] A gold finger area is formed on the substrate;

[0010] The substrate is subjected to a milling operation to form a milling void area on the substrate, wherein the milling void area avoids the gold finger area and is disposed adjacent to the gold finger area.

[0011] A high-temperature adhesive is applied to the substrate, which is then passed through the slotted area and bent to cover the gold finger area and the inner peripheral wall of the slotted area on both sides of the substrate.

[0012] The substrate after adhesive application is then baked.

[0013] The baked substrate is then leveled and glued.

[0014] The substrate after lamination is then subjected to a tin-plating operation.

[0015] In one embodiment, the empty area includes a rectangular window.

[0016] In one embodiment, the gong void area is arranged parallel to the gold finger area.

[0017] In one embodiment, the gold finger area includes a plurality of gold fingers arranged side by side, and the extension direction of each gold finger is perpendicular to the extension direction of the slot area.

[0018] In one embodiment, the void area is provided adjacent to the end of each gold finger adjacent to the non-molded area of ​​the substrate.

[0019] In one embodiment, the two ends of the gong void area extend to positions corresponding to the two sides of the gold finger area.

[0020] In one embodiment, the step of leveling and applying adhesive to the baked substrate specifically includes:

[0021] The baked substrate is leveled and glued using a leveling machine.

[0022] In one embodiment, the temperature at which the substrate after adhesive is applied is baked is 120°C to 150°C.

[0023] In one embodiment, the baking time for the substrate after adhesive application is 15 min to 20 min.

[0024] A printed circuit board is manufactured using the anti-soldering manufacturing method for gold fingers of a printed circuit board as described in any of the above embodiments.

[0025] Compared with the prior art, the present invention has at least the following advantages:

[0026] 1. The above-mentioned method for manufacturing anti-soldering for gold fingers of printed circuit boards involves first performing a router operation on the substrate to form a router void area on the substrate. The router void area avoids the gold finger area and is set adjacent to the gold finger area to facilitate better subsequent adhesive application and improve the efficiency of subsequent printed circuit board forming.

[0027] 2. The process involves applying high-temperature adhesive to the substrate, which is then passed through and bent into the router slots to adhere to the gold finger areas on both sides of the substrate and the inner walls of the slots. This ensures reliable coverage of the gold finger areas on both sides of the substrate. The substrate is then baked to cure the adhesive. After baking, the substrate is leveled and pressed to ensure reliable adhesion of the adhesive to the gold finger areas on both sides. Finally, the substrate is tin-plated. Because the high-temperature adhesive reliably covers the gold finger areas on both sides of the substrate, the chance of it being blown away during tin-plating is reduced. Thus, the high-temperature adhesive reliably protects the gold finger areas during tin-plating, significantly reducing the scrap rate of the printed circuit board. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 A flowchart illustrating a method for manufacturing a method to prevent solder adhesion to the gold fingers of a printed circuit board according to one embodiment;

[0030] Figure 2 For printed circuit boards Figure 1 The flowchart shown is a schematic diagram of the manufacturing process to prevent solder adhesion to the gold fingers.

[0031] Figure 3 for Figure 2 A partially enlarged schematic diagram of the printed circuit board shown.

[0032] Figure 4 for Figure 3 Another enlarged schematic diagram of a portion of the printed circuit board shown.

[0033] Figure 5 The printed circuit board used in another embodiment adopts Figure 1 The flowchart shown is a schematic diagram of the process for manufacturing anti-soldering agents for gold fingers. Detailed Implementation

[0034] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0035] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0037] This application provides a method for manufacturing a solder-resistant coating for gold fingers on a printed circuit board, comprising some or all of the following steps: forming gold finger areas on a substrate; performing a routing operation on the substrate to form routing voids in the substrate, wherein the routing voids avoid the gold finger areas and are disposed adjacent to the gold finger areas; applying high-temperature adhesive to the substrate, wherein the high-temperature adhesive passes through the routing voids and bends to cover the gold finger areas and the inner peripheral walls of the routing voids on both sides of the substrate; baking the substrate after applying the adhesive; leveling and pressing the baked substrate; and tin-spraying the substrate after pressing the adhesive.

[0038] The aforementioned method for manufacturing anti-soldering for gold fingers on printed circuit boards involves first performing a routing process on the substrate to create routing voids that avoid the gold finger areas and are positioned adjacent to them for better subsequent adhesive application. This also improves the efficiency of subsequent printed circuit board forming. A high-temperature adhesive is then applied to the substrate, passing through the routing voids and bending to cover the gold finger areas on both sides of the substrate and the inner walls of the routing voids. This ensures reliable coverage of the gold finger areas on both sides of the substrate. The substrate is then baked to cure the adhesive. Next, the baked substrate is leveled and pressed to ensure reliable adhesion of the adhesive to the gold finger areas on both sides. Finally, the substrate is tin-plated. Because the high-temperature adhesive reliably covers the gold finger areas on both sides of the substrate, the chance of the adhesive being blown off during tin-plating is reduced. Thus, the high-temperature adhesive reliably protects the gold finger areas during tin-plating, significantly reducing the scrap rate of the printed circuit board.

[0039] To better understand the technical solution and beneficial effects of this application, the following detailed description is provided in conjunction with specific embodiments:

[0040] like Figure 1 As shown, an embodiment of a method for manufacturing a solder resist agent for the gold fingers of a printed circuit board is used in the manufacture of a printed circuit board. Further, the manufacturing method includes some or all of the following steps:

[0041] S101, a gold finger area is formed on the substrate.

[0042] See also Figure 2 and Figure 3 In this embodiment, a gold finger region 14 is formed on the edge of the substrate 10 adjacent to the non-molded region 12. Specifically, the substrate 10 includes a plurality of substrate units 10a, which are arranged in a rectangular array. The gold finger region includes a plurality of gold finger unit regions, which are correspondingly disposed on the plurality of substrate units. The substrate units located in the same row have non-molded regions formed on the same side edge.

[0043] S103, the substrate is subjected to a serger processing operation to form a serger cavity in the substrate.

[0044] In this embodiment, the substrate 10 undergoes a milling operation to form a milling void 13. This milling void avoids the gold finger area and is located adjacent to it to prevent it from affecting the conductivity of the gold finger area or the circuitry within the substrate. Specifically, the milling void extends through the substrate.

[0045] S105, apply high-temperature adhesive to the substrate, so that the high-temperature adhesive passes through the slotted area and is bent to cover the gold finger area and the inner peripheral wall of the slotted area on both sides of the substrate.

[0046] In this embodiment, a high-temperature adhesive 20 is applied to the substrate 10. The high-temperature adhesive passes through the recessed area and is bent to adhere to the gold finger areas on both sides of the substrate and the inner peripheral wall of the recessed area. Specifically, one end of the high-temperature adhesive adheres to the gold finger area on the first side of the substrate, and the other end adheres to the gold finger area on the second side of the substrate. The high-temperature adhesive passes through the recessed area and is bent, ensuring reliable adhesion to the gold finger areas on both sides of the substrate. Furthermore, the high-temperature adhesive has a U-shaped cross-section, allowing it to better penetrate and adhere to the inner peripheral wall of the recessed area, and ensuring that both ends of the high-temperature adhesive better adhere to the gold finger areas on both sides of the substrate.

[0047] S107, The substrate after adhesive application is baked.

[0048] In this embodiment, the substrate after adhesive application is baked to cure the high-temperature adhesive.

[0049] S109, perform a leveling and adhesive bonding operation on the baked substrate.

[0050] In this embodiment, the baked substrate is leveled and glued to ensure that the high-temperature adhesive is reliably attached to the gold finger areas on both sides of the substrate.

[0051] S111, perform a tin-spraying operation on the substrate after lamination.

[0052] In this embodiment, the substrate after adhesive bonding is subjected to tin plating. The high-temperature adhesive passes through the router hole and bends to adhere to the gold finger areas on both sides of the substrate and the inner peripheral wall of the router hole. Specifically, one end of the high-temperature adhesive adheres to the gold finger area on the first side of the substrate, and the other end adheres to the gold finger area on the second side. The high-temperature adhesive passes through the router hole and is curved, reliably covering the gold finger areas on both sides of the substrate. This reduces the chance of the high-temperature adhesive being blown off during tin plating. Thus, the high-temperature adhesive reliably protects the gold finger areas during tin plating, significantly reducing the scrap rate of the printed circuit board. Specifically, the steps for tin plating the substrate after adhesive bonding are as follows: Tin plating is performed on the substrate after adhesive bonding, and the air outlet direction of the tin plating is parallel to the position where the high-temperature adhesive is applied. This greatly reduces wind resistance and the risk of the high-temperature adhesive being blown off, thereby better protecting the gold fingers during the tin plating operation.

[0053] The above-mentioned method for manufacturing anti-soldering for gold fingers of printed circuit boards involves first performing a routing operation on the substrate to form a routing void area on the substrate. The routing void area avoids the gold finger area and is positioned adjacent to the gold finger area to facilitate better subsequent adhesive application and improve the efficiency of subsequent printed circuit board forming. The high-temperature adhesive is applied to the substrate through a router hole, bending and covering the gold finger areas on both sides of the substrate and the inner wall of the router hole. This ensures reliable coverage of the gold finger areas on both sides of the substrate. The substrate is then baked. Because the router hole is located near the gold finger areas, the airflow during baking can quickly act on the surface of the high-temperature adhesive, allowing for rapid curing and improving curing efficiency while reducing energy consumption. After baking, the substrate is leveled and pressed to ensure reliable adhesion of the high-temperature adhesive to the gold finger areas on both sides. Finally, the substrate is tin-plated. The reliable coverage of the gold finger areas on both sides of the substrate reduces the chance of the high-temperature adhesive being blown away during tin-plating. Thus, the high-temperature adhesive reliably protects the gold finger areas during tin-plating, significantly reducing the scrap rate of the printed circuit board.

[0054] See also Figure 2 and Figure 3 In one embodiment, the recess 13 includes a rectangular window, making the recess easy to process and shape.

[0055] In one embodiment, the slotted area is arranged parallel to the gold finger area, so that the slotted area is better aligned with the gold finger area, so that the high-temperature adhesive can better penetrate and bend to cover the inner peripheral walls of the gold finger area and the slotted area on both sides of the substrate.

[0056] See also Figure 2 and Figure 3 In one embodiment, the gold finger area 14 includes a plurality of gold fingers 142 arranged side by side, and the extension direction of each gold finger is perpendicular to the extension direction of the slot area, so that the high temperature adhesive can better penetrate and bend to cover the inner peripheral walls of the gold finger area and the slot area on both sides of the substrate.

[0057] See also Figure 2 and Figure 3 In one embodiment, the recessed area is located near the end of each gold finger adjacent to the non-molding area of ​​the substrate, which allows the high-temperature adhesive to better penetrate and bend to cover the gold finger area and the inner peripheral wall of the recessed area on both sides of the substrate. This saves on the amount of high-temperature adhesive used and is also beneficial for the subsequent molding process of the printed circuit board. In other words, the edge where the recessed area is formed on the gold finger does not need to be molded again during subsequent molding, such as V-cut processing, thus improving the molding efficiency of the printed circuit board.

[0058] See also Figure 2 and Figure 3 Furthermore, a reserved edge exists between the recessed area and the end of each gold finger adjacent to the non-forming area of ​​the substrate, giving the gold finger area a certain strength and facilitating subsequent printed circuit board forming. Even further, the width of the reserved edge is 0.4mm to 0.6mm, ensuring the gold finger area has a certain strength and facilitating subsequent printed circuit board forming. This approach avoids the problem of the reserved edge being too narrow or too wide, ensuring a suitable width while ensuring good strength of the gold finger area and ease of printed circuit board forming.

[0059] In one embodiment, the two ends of the slotted area extend to positions corresponding to the two sides of the gold finger area, that is, the two ends of the slotted area extend to positions corresponding to the two sides of the gold finger area, so that the high-temperature adhesive is inserted through the slotted area, and the two ends of the high-temperature adhesive can respectively cover the surface of the gold finger area on both sides of the substrate.

[0060] However, because the solder joint area is located adjacent to the gold finger area, during the soldering process, it inevitably affects the solder joint area and generates turbulent airflow. This turbulent airflow acts on the high-temperature adhesive attached to the edge of the gold finger, which may cause slight edge lifting of the high-temperature adhesive. Therefore, it is not possible to effectively reduce the chance of the high-temperature adhesive being blown up during soldering. To better reduce the chance of the high-temperature adhesive being blown up, such as... Figure 4 As shown, the recessed area 13 further includes a recessed area body 132, a first extended recessed area 134, and a second extended recessed area 136. The two ends of the recessed area body are connected to the first extended recessed area and the second extended recessed area, respectively. The first extended recessed area extends beyond one side of the gold finger area, and the second extended recessed area extends beyond the other side of the gold finger area, so that the two ends of the recessed area extend beyond the two sides of the gold finger area. This makes the high-temperature adhesive attached to the edge of the gold finger less susceptible to slight edge lifting due to disturbed airflow. At the same time, it allows the high-temperature adhesive to better penetrate the recessed area and better adhere to the surface of the gold finger area on both sides of the substrate.

[0061] Furthermore, the steps of applying high-temperature adhesive to the substrate include: firstly, applying high-temperature adhesive to the gold finger area of ​​the substrate; secondly, applying a first high-temperature adhesive reinforcing strip and a second high-temperature adhesive reinforcing strip to the edges of the high-temperature adhesive on both sides of the gold finger area, i.e., the first high-temperature adhesive reinforcing strip is bonded to the high-temperature adhesive on one side of the gold finger area for edge sealing, and the second high-temperature adhesive reinforcing strip is bonded to the high-temperature adhesive on the other side of the gold finger area for edge sealing, so that the high-temperature adhesive applied to the edge of the gold finger is not easily affected by disturbed airflow and does not have a slight edge lifting.

[0062] like Figure 5As shown, it can be understood that in other embodiments, the recessed area is not limited to a rectangular window. Further, the bare area 13 also includes a first beveled window 135, which communicates with the first extended bare area 134. The extension direction of the first beveled window forms an angle with the extension direction of the first extended bare area, making the high-temperature adhesive attached to the edge of the gold finger less susceptible to slight edge lifting due to disturbed airflow. Simultaneously, it allows the high-temperature adhesive to better penetrate the recessed area and better adhere to the surfaces of the gold finger areas on both sides of the substrate. Furthermore, during the formation of the recessed area, it facilitates the subsequent formation of the adjacent edges of the gold fingers and the bevels of the adjacent gold fingers on the printed circuit board. In this embodiment, the extension direction of the first beveled window matches the angle of one of the bevels of the printed circuit board, improving the forming efficiency of the printed circuit board. Even further, the angle between the extension direction of the first beveled window and the extension direction of the first extended bare area is 30° to 60°.

[0063] like Figure 5 As shown, the bare void area 13 further includes a second beveled window 137, which communicates with the second extended bare void area. The extension direction of the second beveled window forms an angle with the extension direction of the second extended bare void area. This prevents the high-temperature adhesive attached to the edge of the gold fingers from being slightly lifted due to disturbed airflow. Simultaneously, it allows the high-temperature adhesive to better penetrate the void area and better adhere to the surfaces of the gold finger areas on both sides of the substrate. Furthermore, during the molding of the void area, it facilitates the subsequent molding of the adjacent edges of the gold fingers and the beveled angles of the adjacent gold fingers on the printed circuit board. In this embodiment, the extension direction of the second beveled window matches the angle of another bevel on the printed circuit board, improving the molding efficiency of the printed circuit board. Even further, the angle between the extension direction of the second beveled window and the extension direction of the second extended bare void area is 120° to 150°.

[0064] In one embodiment, the step of leveling and applying adhesive to the baked substrate specifically involves using a leveling machine to level and apply adhesive to the baked substrate, thereby improving the efficiency of leveling and applying adhesive to the substrate.

[0065] In one embodiment, the baking temperature of the substrate after adhesive application is 120°C to 150°C. Because the substrate is formed in a recessed area, the hot airflow can quickly act on the area where the high-temperature adhesive is applied, which improves the baking efficiency of the substrate and reduces the required baking temperature. In this embodiment, the baking temperature of the substrate after adhesive application is 130°C.

[0066] In one embodiment, the baking time for the substrate after adhesive application is 15-20 minutes. Because the hot airflow from the molding cavity allows for rapid application of the high-temperature adhesive to the substrate's bonding area, this improves baking efficiency and shortens baking time. In this embodiment, the baking time for the substrate after adhesive application is 18 minutes, resulting in a shorter required baking time.

[0067] Furthermore, the extension directions of both ends of the high-temperature adhesive are parallel to the extension direction of each gold finger, allowing the high-temperature adhesive to better adhere to the gold finger areas and the inner peripheral walls of the recessed areas on both sides of the substrate. In this embodiment, gold finger areas are provided on both sides of the substrate, and each gold finger area includes multiple gold fingers arranged side by side, with varying lengths. Even further, both ends of the high-temperature adhesive extend beyond the predetermined length of the longest gold finger in the gold finger areas on both sides of the substrate. In this embodiment, the predetermined length is 1mm to 4mm, allowing the two ends of the high-temperature adhesive to better adhere to the gold finger areas on both sides of the substrate, reducing the impact of edge lifting of the high-temperature adhesive on the gold finger areas on both sides of the substrate. This provides better protection for the gold finger areas on both sides of the substrate.

[0068] This application also provides a printed circuit board, manufactured using the method for preventing solder adhesion to the gold fingers of a printed circuit board as described in any of the above embodiments. Further, the method for preventing solder adhesion to the gold fingers of a printed circuit board includes: forming gold finger areas on a substrate; performing a routing operation on the substrate to form routing voids in the substrate, wherein the routing voids avoid the gold finger areas and are disposed adjacent to the gold finger areas; applying high-temperature adhesive to the substrate, causing the high-temperature adhesive to pass through the routing voids and bend to cover the gold finger areas and the inner peripheral walls of the routing voids on both sides of the substrate; baking the substrate after adhesive application; leveling and pressing the baked substrate; and performing a solder spraying operation on the pressed substrate.

[0069] The aforementioned printed circuit board (PCB) first undergoes a routing process to create routing voids in the substrate. These voids are positioned adjacent to the gold finger areas, avoiding them, to facilitate subsequent adhesive application and improve the efficiency of PCB fabrication. A high-temperature adhesive is then applied to the substrate, passing through the routing voids and bending to adhere to the gold finger areas on both sides of the substrate and the inner walls of the voids. This ensures reliable coverage of the gold finger areas on both sides. The substrate is then baked to cure the adhesive. After baking, the substrate is leveled and pressed to reliably adhere the adhesive to the gold finger areas on both sides. Finally, the substrate is tin-plated. Because the high-temperature adhesive reliably covers the gold finger areas on both sides, the chance of it being blown away during tin-plating is reduced. Thus, the high-temperature adhesive reliably protects the gold finger areas during tin-plating, significantly reducing the PCB scrap rate.

[0070] Compared with the prior art, the present invention has at least the following advantages:

[0071] 1. The above-mentioned method for manufacturing anti-soldering for gold fingers of printed circuit boards involves first performing a router operation on the substrate to form a router void area on the substrate. The router void area avoids the gold finger area and is set adjacent to the gold finger area to facilitate better subsequent adhesive application and improve the efficiency of subsequent printed circuit board forming.

[0072] 2. The process involves applying high-temperature adhesive to the substrate, which is then passed through and bent into the router slots to adhere to the gold finger areas on both sides of the substrate and the inner walls of the slots. This ensures reliable coverage of the gold finger areas on both sides of the substrate. The substrate is then baked to cure the adhesive. After baking, the substrate is leveled and pressed to ensure reliable adhesion of the adhesive to the gold finger areas on both sides. Finally, the substrate is tin-plated. Because the high-temperature adhesive reliably covers the gold finger areas on both sides of the substrate, the chance of it being blown away during tin-plating is reduced. Thus, the high-temperature adhesive reliably protects the gold finger areas during tin-plating, significantly reducing the scrap rate of the printed circuit board.

[0073] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for manufacturing anti-soldering agents for gold fingers of a printed circuit board, characterized in that, include: A gold finger area is formed on the substrate; The substrate is subjected to a milling operation to form a milling void area on the substrate, wherein the milling void area avoids the gold finger area and is disposed adjacent to the gold finger area; wherein the milling void area includes a milling void area body, a first extended milling void area and a second extended milling void area, the two ends of the milling void area body are respectively connected to the first extended milling void area and the second extended milling void area, the first extended milling void area extends beyond one side of the gold finger area to a corresponding position, and the second extended milling void area extends beyond the other side of the gold finger area to a corresponding position. A high-temperature adhesive is applied to the substrate, so that the high-temperature adhesive passes through the slotted area and is bent to cover the gold finger area and the inner peripheral wall of the slotted area on both sides of the substrate. The substrate after adhesive application is then baked. The baked substrate is then leveled and glued. The substrate after adhesive bonding is then subjected to a tin-plating operation. The gong void area is arranged parallel to the gold finger area; the gold finger area includes multiple gold fingers arranged side by side, and the extension direction of each gold finger is perpendicular to the extension direction of the gong void area.

2. The manufacturing method for preventing solder adhesion to the gold fingers of a printed circuit board according to claim 1, characterized in that, The empty area includes a rectangular window.

3. The manufacturing method for preventing solder adhesion to the gold fingers of a printed circuit board according to claim 1, characterized in that, The void area is located adjacent to the end of each gold finger near the non-molded area of ​​the substrate.

4. The manufacturing method for preventing solder adhesion to the gold fingers of a printed circuit board according to claim 1, characterized in that, The specific steps for leveling and applying adhesive to the baked substrate are as follows: The baked substrate is leveled and glued using a leveling machine.

5. The manufacturing method for preventing solder adhesion to the gold fingers of a printed circuit board according to claim 1, characterized in that, The temperature for baking the substrate after adhesive application is 120℃~150℃.

6. The manufacturing method for preventing solder adhesion to the gold fingers of a printed circuit board according to claim 1, characterized in that, The baking time for the substrate after adhesive application is 15 min to 20 min.

7. A printed circuit board, characterized in that, It is manufactured using the method for preventing solder adhesion to the gold fingers of a printed circuit board as described in any one of claims 1 to 6.

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