Heat dissipation method and device of controller, computer device and storage medium

Abstract

The application relates to the computer technical field, in particular to a heat dissipation method and device of a controller, computer equipment and a storage medium. The method comprises the following steps: obtaining a to-be-heat-dissipated area in a first cavity; determining a target heat dissipation air duct corresponding to the to-be-heat-dissipated area in a second cavity according to the to-be-heat-dissipated area, and determining a target heat dissipation device corresponding to the target heat dissipation air duct from candidate heat dissipation devices; and controlling the target heat dissipation device to perform air supply based on the target heat dissipation air duct, so as to realize heat dissipation of the to-be-heat-dissipated area. The application can effectively and pertinently dissipate heat of a heat generation area of the controller.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of computers, in particular to a heat dissipation method and device of a controller, a computer device and a storage medium. BACKGROUND

[0002] With the rise of automatic driving technology, vehicle-mounted controllers gradually change from distributed to centralized, and central computing platforms with large computing power and domain controllers gradually become the development trend and mainstream. Multiple chips in the vehicle-mounted controller are concentrated together, which generates a large amount of heat, and therefore the heat dissipation requirement is gradually improved.

[0003] The existing heat dissipation schemes are water-cooled heat dissipation schemes and air-cooled heat dissipation schemes. The water-cooled heat dissipation scheme needs to provide a circulating water pump, and the water circulation loop of the vehicle-mounted controller needs to be strictly sealed, which still has a risk of water leakage, has low safety and poor practicability, and therefore the air-cooled scheme is introduced. For the air-cooled heat dissipation scheme using a fan module for heat dissipation, multiple fan modules are added in the vehicle-mounted controller, and all the added fan modules are simultaneously controlled to work when heat dissipation of the vehicle-mounted controller is needed, which results in large heat dissipation power consumption and low service life of the fan modules. Therefore, it is necessary to improve the existing air-cooled heat dissipation scheme. SUMMARY

[0004] Therefore, it is necessary to provide a heat dissipation method and device of a controller, a computer device and a storage medium, which can use corresponding heat dissipation equipment for targeted and effective heat dissipation of a heat generation area of the controller, reduce heat dissipation power consumption, and thereby improve the service life of the heat dissipation equipment.

[0005] In a first aspect, the present application provides a heat dissipation method of a controller, the controller comprising a first cavity and a second cavity, a chip being arranged in the first cavity, and a candidate heat dissipation equipment being arranged in the second cavity, the first cavity being adjacent to the second cavity and independent of the second cavity, and the method comprising:

[0006] obtaining a to-be-cooled region in the first cavity;

[0007] determining, according to the to-be-cooled region, a target heat dissipation air duct corresponding to the to-be-cooled region in the second cavity, and determining a target heat dissipation equipment corresponding to the target heat dissipation air duct from the candidate heat dissipation equipment;

[0008] controlling the target heat dissipation equipment to perform air supply based on the target heat dissipation air duct, so as to realize heat dissipation of the to-be-cooled region.

[0009] In one of the embodiments, the determining, according to the to-be-cooled region, of the target heat dissipation air duct corresponding to the to-be-cooled region in the second cavity comprises:

[0010] determining a heat distribution trajectory corresponding to the to-be-cooled region;

[0011] obtaining at least one first candidate air duct according to the air supply direction of the candidate heat dissipation device and the position of each heat dissipation hole;

[0012] determining a target heat dissipation air duct corresponding to the region to be cooled according to the similarity between the first candidate heat dissipation air duct and the heat distribution trajectory.

[0013] In one embodiment, determining a target heat dissipation air duct corresponding to the region to be cooled according to the similarity between the first candidate heat dissipation air duct and the heat distribution trajectory comprises:

[0014] determining the first candidate heat dissipation air duct with the highest similarity to the heat distribution trajectory as a second candidate heat dissipation air duct;

[0015] determining at least one vector adjustment heat dissipation device from the candidate heat dissipation device according to the heat distribution trajectory, the second candidate heat dissipation air duct, and the offset therebetween;

[0016] adjusting the second candidate heat dissipation air duct by changing the air direction and / or air volume of the vector adjustment heat dissipation device to obtain a target heat dissipation air duct corresponding to the region to be cooled.

[0017] In one embodiment, obtaining the region to be cooled in the first cavity comprises:

[0018] determining a chip to be cooled from the chips according to the temperature warning value and the current temperature of each chip in the first cavity;

[0019] determining the region to be cooled in the first cavity according to the installation position of the chip to be cooled.

[0020] In one embodiment, controlling the target heat dissipation device to supply air based on the target heat dissipation air duct to achieve heat dissipation of the region to be cooled comprises:

[0021] obtaining the real-time temperature of the region to be cooled during the process of controlling the target heat dissipation device to supply air based on the target heat dissipation air duct;

[0022] determining a target air supply intensity of the target heat dissipation device based on the temperature difference between the real-time temperature of the region to be cooled and the target temperature value;

[0023] controlling the target heat dissipation device to operate at the target air supply intensity until the real-time temperature of the region to be cooled drops to the target temperature value.

[0024] In one embodiment, the method further comprises:

[0025] If the real-time temperature of the region to be cooled does not decrease to the target temperature value within the preset time period, the auxiliary cooling device is controlled to operate to assist the target cooling device in cooling the region to be cooled, wherein the auxiliary cooling device is a cooling device other than the target cooling device among the candidate cooling devices.

[0026] In a second aspect, the application further provides a cooling device of a controller, the controller comprising a first cavity and a second cavity, a chip being arranged in the first cavity, and a candidate cooling device being arranged in the second cavity, the first cavity being adjacent to the second cavity and independent of the second cavity, and the cooling device comprising:

[0027] an acquisition module configured to acquire a region to be cooled in the first cavity;

[0028] a duct selection module configured to determine, according to the region to be cooled, a target cooling duct corresponding to the region to be cooled in the second cavity, and determine, from the candidate cooling devices, a target cooling device corresponding to the target cooling duct;

[0029] a cooling module configured to control the target cooling device to perform air supply based on the target cooling duct to cool the region to be cooled.

[0030] In one of the embodiments, the duct selection module comprises:

[0031] a trajectory determination sub-module configured to determine a heat distribution trajectory corresponding to the region to be cooled;

[0032] a generation sub-module configured to obtain at least one first candidate cooling duct according to the air supply direction of the candidate cooling device and the position of each cooling hole;

[0033] a similarity comparison sub-module configured to determine the target cooling duct corresponding to the region to be cooled according to the similarity between the first candidate cooling duct and the heat distribution trajectory.

[0034] In a third aspect, the application further provides a computer device, which comprises a memory and a processor, the memory storing a computer program, and the processor implementing the following steps when executing the computer program:

[0035] acquiring a region to be cooled in the first cavity;

[0036] determining, according to the region to be cooled, a target cooling duct corresponding to the region to be cooled in the second cavity, and determining, from the candidate cooling devices, a target cooling device corresponding to the target cooling duct;

[0037] controlling the target cooling device to perform air supply based on the target cooling duct to cool the region to be cooled.

[0038] In a fourth aspect, the present application further provides a computer readable storage medium, which stores a computer program, and the computer program is executed by a processor to implement the following steps:

[0039] obtaining a region to be cooled in the first cavity;

[0040] determining a target cooling air duct corresponding to the region to be cooled in the second cavity according to the region to be cooled, and determining a target cooling device corresponding to the target cooling air duct from the candidate cooling devices;

[0041] controlling the target cooling device to perform air supply based on the target cooling air duct, so as to cool the region to be cooled.

[0042] The cooling method, device, computer equipment and storage medium of the controller disclosed above place the chip of the controller and the candidate cooling devices in different cavities respectively, and the first cavity and the second cavity are adjacent and can conduct heat to each other, so that the heat generated by the chip can be conducted into the second cavity, and the candidate cooling devices cool the heat in the second cavity, that is, indirectly cool the first cavity. Further, the second cavity is provided with a plurality of different candidate cooling devices, and the different candidate cooling devices can form different air supply channels in the second cavity. The airflow in the air supply channel has the characteristics of high speed and high pressure compared with the airflow in other regions in the second cavity, that is, the air supply channel has the effect of targeted cooling. Therefore, after the region to be cooled in the first cavity is determined, the target air supply channel corresponding to the region to be cooled is determined in the second cavity, so that the region to be cooled can be cooled by the target air supply channel, the targeted cooling is improved, the power consumption is reduced, and the service life of the cooling device is improved. In addition, compared with the prior art, the chip and the cooling device are separated in different cavities, which avoids the direct blowing of hot air on the chip and avoids the adverse effects on the chip when the cooling device is damaged (overhauled). BRIEF DESCRIPTION OF DRAWINGS

[0043] Figure 1 FIG. 1 is a schematic diagram of the internal structure of a controller in an embodiment;

[0044] Figure 2 FIG. 3 is a flowchart of a cooling method of the controller in an embodiment;

[0045] Figure 3 FIG. 5 is a schematic diagram of a cooling air duct in the second cavity in an embodiment;

[0046] Figure 4 FIG. 7 is a flowchart of determining a target cooling air duct in an embodiment;

[0047] Figure 5 FIG. 9 is a flowchart of adjusting a second candidate cooling air duct in an embodiment;

[0048] Figure 6 This is a schematic diagram of the process of controlling the target heat dissipation device to dissipate heat in one embodiment;

[0049] Figure 7 This is a schematic diagram of the controller architecture in one embodiment;

[0050] Figure 8 This is a flowchart illustrating the heat dissipation method of the controller in another embodiment;

[0051] Figure 9 This is a structural block diagram of the heat dissipation device of the controller in one embodiment;

[0052] Figure 10 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0054] This application provides a method for heat dissipation of a controller. The method is executed by a computer device, which may be a terminal, server, cloud platform, etc. It is understood that the controller has a corresponding heat dissipation device, and the computer device controls the heat dissipation device to execute the heat dissipation method of the controller in order to achieve the effect of heat dissipation of the controller.

[0055] Optionally, the controller in this embodiment can be an in-vehicle controller in the field of autonomous driving, such as a domain controller; a domain controller refers to a controller that divides various electronic control units in a car into different domains based on regions and centrally controls them.

[0056] Furthermore, such as Figure 1 As shown, the controller in this embodiment includes a first cavity and a second cavity. A chip 120 is disposed in the first cavity, and a candidate heat dissipation device is disposed in the second cavity. The first cavity and the second cavity are adjacent to each other but independent. Specifically, in this embodiment, the first cavity and the second cavity are separated by a heat dissipation partition 100. Optionally, the internal cavities of the first cavity and the second cavity are arranged opposite each other with the same volume. The direction of their relative arrangement can be vertical or horizontal. When arranged vertically, the first cavity is the lower cavity, and the second cavity is the upper cavity. The heat dissipation partition 100 can be made of aluminum, which has a strong structure, good heat dissipation performance, and is durable.

[0057] Furthermore, the first cavity is used to house the domain controller motherboard (Printed Circuit Board, PCB). One or more intelligent driving / intelligent cockpit chips (System-on-a-Chip, SoC), along with supporting functional safety microcontroller units (MCUs), peripheral circuits, etc., are placed on the PCB motherboard 110. Each chip 120 is equipped with a heat dissipation protrusion 130, the other end of which is connected to a heat dissipation partition 100. The heat dissipation protrusion 130 assists in heat dissipation of the chip 120. The heat from the chip 120 is transferred to the heat dissipation partition 100 via the heat dissipation protrusion 130, and then transferred to the second cavity via the heat dissipation partition 100. Therefore, by using the candidate heat dissipation device within the second cavity to dissipate heat, the heat dissipated by the chip 120 can be indirectly removed. To further improve the heat dissipation effect of the heat dissipation partition 100, in this embodiment, the heat dissipation partition 100 is also equipped with heat dissipation fins 140. Optionally, the heat dissipation fins 140 are opposite to the heat dissipation protrusions 130, used to centrally dissipate the heat from the heat dissipation protrusions 130.

[0058] In one embodiment, such as Figure 2 As shown, a heat dissipation method for a controller includes the following steps:

[0059] S201, Obtain the area to be cooled within the first cavity.

[0060] The heat dissipation area within the first cavity refers to the area corresponding to the chip that needs to be cooled.

[0061] Understandably, the controller chip is a thin wafer made of silicon material. A single chip consists of hundreds of microcircuits connected together. It is small in size and covered with microcircuits that generate pulse currents. During computer use, the controller's continuous high-load operation and computational processing can cause the chip to generate a lot of heat, posing a safety hazard. Furthermore, different chips may have different heat resistance levels. Therefore, different chips may have different temperature warning values. The chip mentioned above that needs to be cooled is the one whose temperature exceeds the warning value.

[0062] In one possible implementation, obtaining the heat dissipation area within the first cavity can be achieved by: determining the chip to be cooled from among the chips based on the temperature warning value and the current temperature of each chip within the first cavity; and determining the heat dissipation area within the first cavity based on the installation position of the chip to be cooled.

[0063] The temperature warning value can be a single value calculated based on the historical heat dissipation data of each chip to ensure that each chip is in a healthy operating state; optionally, the temperature warning value for each chip can be different.

[0064] Specifically, for any chip, when the real-time temperature of the chip is greater than or equal to the temperature warning value, it is determined that the chip is a chip to be cooled; then, taking the mounting position of the chip to be cooled as the center, a region in the first cavity is determined as the cooling region corresponding to the chip to be cooled.

[0065] Further, in the case where the chips to be cooled are multiple, the cooling region corresponding to each chip to be cooled is taken as the cooling region to be cooled in the first cavity. S202, according to the cooling region to be cooled, a target cooling air duct corresponding to the cooling region to be cooled is determined in the second cavity, and a target cooling device corresponding to the target cooling air duct is determined from the candidate cooling devices.

[0066] Among them, the candidate cooling device in the second cavity can be a device with the function of accelerating the flow of air, such as a fan module; further, a plurality of cooling holes are provided on the shell of the second cavity, and a valve can be provided in the cooling hole, so that the cooling hole can be in a conductive or cut-off state.

[0067] It can be understood that the function of the fan module is to introduce external air into the second cavity, and the function of the cooling hole is to guide the air in the second cavity out and ventilate to achieve the effect of air cooling. Further, according to the installation position of each fan module in the second cavity and the opening position of each cooling hole, a plurality of cooling air ducts can be formed; for example, as shown in Figure 3 , the first fan module F1 passes through the first cooling hole S2 to form the cooling air duct L1; the second fan module F2 passes through the first cooling hole S1 to form the cooling air duct L2, and so on.

[0068] In one implementation, each fan module (air inlet) and cooling hole (air outlet) in the embodiment can be arranged in the same two-dimensional plane; in another implementation, the fan module (air inlet) and the cooling hole (air outlet) can be located in different two-dimensional planes.

[0069] It can be understood that different cooling air ducts pass through different cooling fins 140 to carry away the heat of different cooling bosses 130, which is equivalent to indirectly passing through the chip 120 corresponding to the cooling boss 130, so that the cooling effect of different cooling air ducts on each chip on the PCB is different. For any cooling air duct, the cooling effect of the chip indirectly passing through the cooling air duct is more concentrated and better. That is, there is a high-pressure and high-speed airflow in the cooling air duct, and the cooling effect is better; the area outside the cooling air duct in the second cavity is relatively low in pressure and low in speed, and the cooling effect of the low-pressure and low-speed airflow is weaker than that of the high-pressure and high-speed airflow.

[0070] Specifically, after the region to be cooled is determined, a cooling air duct that is adapted to the region to be cooled (i.e., a cooling air duct that indirectly passes through the region to be cooled) is selected from the cooling air ducts that can be formed in the second cavity as a target cooling air duct, and in this case, the candidate cooling device used to form the target cooling air duct is the target cooling device.

[0071] S203, the target cooling device is controlled to perform air supply based on the target cooling air duct to cool the region to be cooled.

[0072] Specifically, the target cooling device is controlled to perform air supply based on the target cooling air duct at a preset air supply intensity to cool the region to be cooled.

[0073] The above cooling method for the controller places the chip and the candidate cooling device in different cavities, and the first cavity and the second cavity are adjacent and can conduct heat to each other, so that the heat emitted by the chip can be conducted into the second cavity, and the candidate cooling device cools the heat in the second cavity, i.e., indirectly cools the first cavity. Further, the second cavity is provided with a plurality of different candidate cooling devices, and the different candidate cooling devices can form different air supply channels in the second cavity. The airflow in the air supply channel has the characteristics of high speed and high pressure compared with the airflow in other regions in the second cavity, i.e., the air supply channel has the effect of targeted cooling. Therefore, after the region to be cooled in the first cavity is determined, the target air supply channel corresponding to the region to be cooled is determined in the second cavity, and the region to be cooled can be cooled by the target air supply channel, thereby improving the targeting of cooling, reducing the power consumption of cooling, and prolonging the service life of the cooling device. In addition, compared with the prior art, the chip and the cooling device are separated in different cavities, which avoids the direct blowing of hot air on the chip and avoids the adverse effects of the cooling device damage (repair) on the chip.

[0074] As shown in Figure 4 , the embodiment provides an optional way of determining a target cooling air duct corresponding to a region to be cooled in a second cavity according to the region to be cooled, i.e., a way of refining S202. The specific implementation process can include:

[0075] S401, a heat distribution trajectory corresponding to the region to be cooled is determined.

[0076] Optionally, the heat distribution trajectory is formed based on the connection lines between the regions to be cooled, and the heat distribution trajectory can pass through the center points or edge lines of the regions to be cooled. For example, the heat distribution trajectory corresponding to the cooling air duct L1 is the region to be cooled A1 and the region to be cooled A4, and the heat distribution trajectory corresponding to the cooling air duct L2 is the region to be cooled A2 and the region to be cooled A3.

[0077] S402, obtain at least one first candidate air duct according to the air supply direction of the candidate heat dissipation device and the position of each heat dissipation hole.

[0078] In an implementation manner, the first candidate heat dissipation air duct can be a combination mode between each candidate heat dissipation device and each heat dissipation hole in theory, for example, 3 candidate heat dissipation devices and 2 heat dissipation holes, forming 6 first candidate heat dissipation air ducts in total; in another implementation manner, the first candidate heat dissipation air duct can be a heat dissipation air duct with effective heat dissipation effect obtained according to historical heat dissipation data, for example, 3 candidate heat dissipation devices and 2 heat dissipation holes, forming 6 first candidate heat dissipation air ducts in total, and after heat dissipation effectiveness screening, 5 first candidate heat dissipation air ducts are obtained. Correspondingly, the path of each first candidate heat dissipation air duct can also be obtained based on theoretical value fitting calculation, or can also be generated according to actual heat dissipation effect feedback.

[0079] S403, determine a target heat dissipation air duct corresponding to the to-be-cooled region according to the similarity between the first candidate heat dissipation air duct and the heat distribution trajectory.

[0080] In a specific embodiment, determining the target heat dissipation air duct corresponding to the to-be-cooled region can specifically include the following process:

[0081] S501, determine the first candidate heat dissipation air duct with the highest heat distribution trajectory similarity as a second candidate heat dissipation air duct.

[0082] The second candidate heat dissipation air duct refers to the heat dissipation air duct closest to the heat distribution trajectory selected from the first candidate heat dissipation air duct.

[0083] Optionally, in the embodiment, the plane where the first candidate heat dissipation air duct is located can be parallel to the plane where the heat distribution trajectory is located; when calculating the similarity between the heat distribution trajectory and any first candidate heat dissipation air duct, the position and number of the to-be-cooled region corresponding to the first candidate heat dissipation air duct are calculated first; in an implementation manner, the first candidate heat dissipation air duct passing through the to-be-cooled region where the chip (core chip) with higher priority is located can be taken as the first candidate heat dissipation air duct with the highest similarity; in another implementation manner, the first candidate heat dissipation air duct passing through the to-be-cooled region with the largest number can be taken as the first candidate heat dissipation air duct with the highest similarity.

[0084] S502, determine at least one vector adjustment heat dissipation device from the candidate heat dissipation device according to the heat distribution trajectory, the second candidate heat dissipation air duct and the offset therebetween.

[0085] The offset between the heat distribution trajectory and the second candidate heat dissipation air duct can be obtained by aggregating a plurality of sub-offsets.

[0086] Specifically, each sub-deviation corresponds to a heat dissipation area on the heat distribution trajectory; correspondingly, for any heat dissipation area on the heat distribution trajectory, the area corresponding to that heat dissipation area on the second candidate heat dissipation duct is used as the reference area. Taking the example that the plane (xy plane) where the first candidate heat dissipation duct is located is parallel to the plane (xy plane) where the heat distribution trajectory is located, the sub-deviation can be calculated by calculating the deviation between the heat dissipation area and its corresponding reference area in the (xy plane).

[0087] It is understood that a vector-adjustable heat dissipation device refers to a candidate heat dissipation device, excluding those associated with the second candidate heat dissipation duct, that is capable of adjusting the second candidate heat dissipation duct. Specifically, this vector-adjustable heat dissipation device provides vector airflow, which can adjust the second candidate heat dissipation duct to varying degrees based on airflow strength and direction. Specifically, it can adjust the airflow direction towards the heat distribution trajectory based on the heat distribution trajectory and its offset from the second candidate heat dissipation duct, with a relatively small offset value.

[0088] Specifically, when selecting a vector-adjustable heat dissipation device, the influence of each candidate heat dissipation device on the second candidate heat dissipation duct can be calculated based on the positional relationship between each candidate heat dissipation device and the second candidate heat dissipation duct. The candidate heat dissipation device with the greatest influence is then selected as the vector-adjustable heat dissipation device. For example, Figure 3 The heat dissipation devices F3', F3”, F3”', F4', F4”, F4”' in the heat dissipation ducts F1 and F2 are vector adjustment heat dissipation devices.

[0089] S503 adjusts the second candidate heat dissipation airflow by changing the vector adjustment airflow direction and / or airflow force of the heat dissipation device, thereby obtaining the target heat dissipation airflow corresponding to the area to be cooled.

[0090] Specifically, by changing the airflow direction and / or force of the vector-adjustable heat dissipation device, the second candidate heat dissipation airflow is adjusted to different degrees until the similarity between the second candidate heat dissipation airflow and the heat distribution trajectory reaches the target similarity value. At this point, the adjusted second candidate heat dissipation airflow can be used as the target heat dissipation airflow corresponding to the area to be cooled. In this case, the target heat dissipation device corresponding to the target heat dissipation airflow includes the candidate heat dissipation device corresponding to the second candidate heat dissipation airflow and the vector-adjustable heat dissipation device.

[0091] In this embodiment, at least one vector adjustment heat dissipation device is determined from the candidate heat dissipation devices according to the heat distribution trajectory, the second candidate heat dissipation air duct, and the offset therebetween, the second candidate heat dissipation air duct is adjusted by different amplitudes by changing the wind direction and / or wind power of the vector adjustment heat dissipation device to obtain a target heat dissipation air duct corresponding to the heat dissipation region, and the purpose is to accurately correspond the obtained target heat dissipation air duct with the heat dissipation region, and improve the heat dissipation effect between the target heat dissipation air duct and the heat dissipation region.

[0092] As shown in Figure 6 , the embodiment provides an optional way of controlling the target heat dissipation device to blow air based on the target heat dissipation air duct to achieve heat dissipation of the heat dissipation region, that is, a way of refining S203 is provided. The specific implementation process can include:

[0093] S601, in the process of controlling the target heat dissipation device to blow air based on the target heat dissipation air duct, the real-time temperature of the heat dissipation region is obtained.

[0094] Specifically, each target heat dissipation device works at its respective initial air supply intensity when starting heat dissipation, and the initial air supply intensity of the vector adjustment heat dissipation device in the target heat dissipation device and other heat dissipation devices can be different; during the heat dissipation process, the real-time temperature of the heat dissipation region is determined by obtaining the temperature of each heat dissipation chip.

[0095] S602, based on the temperature difference between the real-time temperature of the heat dissipation region and the target temperature value, the target air supply intensity of the target heat dissipation device is determined.

[0096] The target temperature value refers to the target value that the chip heat dissipation needs to reach; optionally, the target temperature value can be lower than the temperature warning value. It can be understood that the real-time temperature during heat dissipation is higher than the target temperature value, so the temperature difference = real-time temperature-target temperature value.

[0097] Specifically, the target air supply intensity corresponding to the temperature difference can be determined according to the preset adjustment ratio, that is, the greater the temperature difference, the greater the target air supply intensity of each target heat dissipation device; the smaller the temperature difference, the smaller the target air supply intensity of each target heat dissipation device or the preset fixed intensity.

[0098] Further, in order to keep the path of the target heat dissipation air duct unchanged during the intensity adjustment process, the adjustment ratio corresponding to each target heat dissipation device can be different based on different initial air supply intensities; specifically, each adjustment ratio can be set according to an empirical value.

[0099] S603, control the target heat dissipation device to operate at the target air supply intensity until the real-time temperature of the heat dissipation region decreases to the target temperature value.

[0100] Specifically, in the process of adjusting the air supply intensity, the control target heat dissipation device is operated at the target air supply intensity corresponding to the preset adjustment sub-time period in the adjustment sub-time period, and after the end of the adjustment sub-time period, the real-time temperature of each to-be-cooled region is acquired again, and the intensity adjustment of the next adjustment sub-time period is performed.

[0101] Further, if the real-time temperature of the to-be-cooled region does not decrease to the target temperature value within the preset time period, the auxiliary heat dissipation device is controlled to operate to assist the target heat dissipation device to dissipate heat to the to-be-cooled region.

[0102] Among them, the auxiliary heat dissipation device is a heat dissipation device in the candidate heat dissipation device except the target heat dissipation device; the preset time period can be a set of multiple adjustment sub-time periods.

[0103] Specifically, if the real-time temperature of the to-be-cooled region does not decrease to the target temperature value at the time point when the preset time period ends, the corresponding number of auxiliary heat dissipation devices are turned on, and at this time, the heat dissipation path in the second cavity changes from the original target air supply channel to the overall uniform air supply in the cavity.

[0104] In this embodiment, based on the feedback of the real-time temperature, the target air supply intensity of the target heat dissipation air duct is continuously adjusted in the heat dissipation process to reach the corresponding heat dissipation target temperature value, so as to realize effective heat dissipation while maintaining low power consumption in the heat dissipation process; if the target heat dissipation air duct intensity adjustment cannot achieve the expected heat dissipation effect, the overall heat dissipation mode is entered to achieve the heat dissipation effect priority.

[0105] Optionally, the heat dissipation method of the controller can also be executed in the artificial intelligence module configured in the controller; further, the architecture of the controller in this embodiment is as shown in Figure 7 The overall scheme of the controller adopts a layered decoupling architecture design, which is divided into a CPU computing layer, an NPU computing layer and an MCU functional safety layer. Among them, the CPU is responsible for processing device management, device signal flow scheduling, laser radar data preprocessing and other functions, and is also responsible for processing the calculation results reported by NPU and MCU, which are used for fusion decision; NPU processes visual perception algorithm and processes part of laser radar machine learning function; functional safety MCU is responsible for processing and docking with vehicle control unit, and improving the functional safety level of the central centralized domain controller. Further, the above-mentioned CPU, NPU and MCU can be cascaded through Ethernet to realize data intercommunication of each chip; in order to ensure the cross-SoC intercommunication of high-speed data, PCIeSwitch is adopted, and star networking form is used to realize high-speed data intercommunication between CPU and NPU.

[0106] Illustratively, on the basis of the above embodiment, an optional example of a heat dissipation method of a controller is provided. As shown in Figure 8The implementation process includes:

[0107] S801, determining a chip to be cooled from the chips in the first cavity according to the temperature warning value and current temperatures of the chips.

[0108] S802, determining a region to be cooled in the first cavity according to the installation position of the chip to be cooled.

[0109] S803, determining a heat distribution trajectory corresponding to the region to be cooled.

[0110] S804, obtaining at least one first candidate air duct according to the air supply direction of the candidate cooling device and the position of each cooling hole.

[0111] S805, determining a target cooling air duct corresponding to the region to be cooled according to the similarity between the first candidate cooling air duct and the heat distribution trajectory.

[0112] S806, determining a cooling device corresponding to the target cooling air duct in the candidate cooling device as a target cooling device.

[0113] S807, obtaining a real-time temperature of the region to be cooled in the process of controlling the target cooling device to supply air based on the target cooling air duct.

[0114] S808, determining a target air supply intensity of the target cooling device based on the temperature difference between the real-time temperature of the region to be cooled and the target temperature value.

[0115] S809, controlling the target cooling device to operate at the target air supply intensity until the real-time temperature of the region to be cooled decreases to the target temperature value.

[0116] Specifically, if the real-time temperature of the region to be cooled does not decrease to the target temperature value within a preset time period, the auxiliary cooling device is controlled to operate to assist the target cooling device in cooling the region to be cooled; wherein the auxiliary cooling device is a cooling device in the candidate cooling device other than the target cooling device.

[0117] The specific process of S801-S909 can be referred to the description of the above method embodiments, which has similar implementation principles and technical effects, and will not be repeated here.

[0118] It should be understood that although each step in the flowchart involved in the above embodiments is shown in sequence according to the arrow, these steps are not necessarily executed in the order indicated by the arrow. Unless otherwise specified herein, the execution of these steps is not strictly limited in sequence, and these steps can be executed in other orders. Moreover, at least some of the steps in the flowchart involved in the above embodiments can include multiple steps or multiple stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily sequential, but can be alternately executed with at least some of the other steps or steps or stages in other steps.

[0119] Based on the same inventive concept, the embodiments of the present application also provide a heat dissipation device of a controller for implementing the heat dissipation method of the controller as described above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme described in the above method, so the specific limitations in one or more heat dissipation device embodiments of the controller provided below can refer to the limitations of the heat dissipation method of the controller described above, which will not be repeated here.

[0120] In one embodiment, as shown in Figure 9 A heat dissipation device 1 of a controller is provided, the controller comprising a first cavity and a second cavity, a chip being arranged in the first cavity, and a candidate heat dissipation device being arranged in the second cavity, the first cavity being adjacent to the second cavity and independent of each other, the device comprising: an acquisition module 11, an air duct selection module 12 and a heat dissipation module 13, wherein:

[0121] The acquisition module 11 is configured to acquire a to-be-cooled region in the first cavity;

[0122] The air duct selection module 12 is configured to determine a target heat dissipation air duct corresponding to the to-be-cooled region in the second cavity according to the to-be-cooled region, and determine a target heat dissipation device from the candidate heat dissipation devices;

[0123] The heat dissipation module 13 is configured to control the target heat dissipation device to perform air supply based on the target heat dissipation air duct, so as to realize heat dissipation of the to-be-cooled region.

[0124] In one embodiment, the air duct selection module 12 comprises:

[0125] A trajectory determination sub-module configured to determine a heat distribution trajectory corresponding to the to-be-cooled region;

[0126] A generation sub-module configured to obtain at least one first candidate air duct according to the air supply direction of the candidate heat dissipation device and the position of each heat dissipation hole;

[0127] The similarity comparison submodule is configured to determine the target heat dissipation air duct corresponding to the to-be-cooled region according to the similarity between the first candidate heat dissipation air duct and the heat distribution trajectory.

[0128] In an embodiment, the similarity comparison submodule is further configured to determine the first candidate heat dissipation air duct with the highest similarity to the heat distribution trajectory as the second candidate heat dissipation air duct.

[0129] The at least one vector adjustment heat dissipation device is determined from the candidate heat dissipation devices according to the heat distribution trajectory, the second candidate heat dissipation air duct, and the offset therebetween.

[0130] The target heat dissipation air duct corresponding to the to-be-cooled region is obtained by adjusting the second candidate heat dissipation air duct by changing the wind direction and / or wind force of the vector adjustment heat dissipation device.

[0131] In an embodiment, the acquisition module 11 is further configured to determine the to-be-cooled chip from the chips in the first cavity according to the temperature warning value and the current temperature of each chip in the first cavity.

[0132] The to-be-cooled region in the first cavity is determined according to the installation position of the to-be-cooled chip.

[0133] In an embodiment, the heat dissipation module 13 comprises:

[0134] The detection submodule is configured to acquire the real-time temperature of the to-be-cooled region during the process in which the target heat dissipation device is controlled to perform air supply based on the target heat dissipation air duct.

[0135] The adjustment submodule is configured to determine the target air supply intensity of the target heat dissipation device based on the temperature difference between the real-time temperature of the to-be-cooled region and the target temperature value.

[0136] The control submodule is configured to control the target heat dissipation device to operate at the target air supply intensity until the real-time temperature of the to-be-cooled region decreases to the target temperature value.

[0137] In an embodiment, the device further comprises a mode switching module configured to control the auxiliary heat dissipation device to operate to assist the target heat dissipation device in cooling the to-be-cooled region if the real-time temperature of the to-be-cooled region does not decrease to the target temperature value within a preset time period, wherein the auxiliary heat dissipation device is a heat dissipation device other than the target heat dissipation device in the candidate heat dissipation devices.

[0138] The above modules in the heat dissipation device of the controller can be realized by software, hardware, and combinations thereof, in whole or in part. The above modules can be embedded in or independent of the processor in the computer device in hardware form, or can be stored in the memory in the computer device in software form, so as to be called and executed by the processor to perform the operations corresponding to the above modules.

[0139] In an embodiment, a computer device is provided, which can be a server, and an internal structure diagram of the computer device can be as shown in FIG. 1. Figure 10 The computer device includes a processor, a memory and a network interface connected through a system bus. The processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for running the operating system and the computer program in the non-volatile storage medium. The database of the computer device is configured to store data for controller-based air-cooled heat dissipation control. The network interface of the computer device is configured to communicate with an external terminal through a network connection. The computer program is executed by the processor to implement a controller heat dissipation method.

[0140] Those skilled in the art can understand that Figure 10 The structure shown in FIG. 1 is only a block diagram of part of the structure related to the scheme of the present application, and does not constitute a limitation on the computer device to which the scheme of the present application is applied. The specific computer device can include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0141] In an embodiment, a computer device is provided, which includes a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the following steps:

[0142] Obtaining a region to be cooled in a first cavity;

[0143] According to the region to be cooled, determining a target cooling air duct corresponding to the region to be cooled in a second cavity, and determining a target cooling device from candidate cooling devices;

[0144] Controlling the target cooling device to perform air supply based on the target cooling air duct, so as to cool the region to be cooled.

[0145] In an embodiment, when the processor executes the computer program to determine a target cooling air duct corresponding to the region to be cooled in the second cavity according to the region to be cooled, the following steps are implemented: determining a heat distribution trajectory corresponding to the region to be cooled; obtaining at least one first candidate air duct according to the air supply direction of the candidate cooling device and the position of each cooling hole; and determining the target cooling air duct corresponding to the region to be cooled according to the similarity between the first candidate cooling air duct and the heat distribution trajectory.

[0146] In one embodiment, when the processor executes the computer program to determine the target heat dissipation air duct based on the similarity between each first candidate heat dissipation air duct and the heat distribution trajectory, the following steps are implemented: determining the first candidate heat dissipation air duct with the highest similarity to the heat distribution trajectory as the second candidate heat dissipation air duct; determining at least one vector adjustment heat dissipation device from the candidate heat dissipation devices according to the heat distribution trajectory, the second candidate heat dissipation air duct, and the offset therebetween; and adjusting the second candidate heat dissipation air duct to obtain the target heat dissipation air duct corresponding to the region to be cooled by changing the wind direction and / or wind force of the vector adjustment heat dissipation device.

[0147] In one embodiment, when the processor executes the computer program to obtain the region to be cooled in the first cavity, the following steps are implemented: determining the chip to be cooled from the chips in the first cavity according to the temperature warning value and the current temperature of each chip; and determining the region to be cooled in the first cavity according to the installation position of the chip to be cooled.

[0148] In one embodiment, when the processor executes the computer program to control the target heat dissipation device to perform air supply based on the target heat dissipation air duct to achieve heat dissipation of the region to be cooled, the following steps are implemented: obtaining the real-time temperature of the region to be cooled during the process of controlling the target heat dissipation device to perform air supply based on the target heat dissipation air duct; determining the target air supply intensity of the target heat dissipation device based on the temperature difference between the real-time temperature of the region to be cooled and the target temperature value; and controlling the target heat dissipation device to operate at the target air supply intensity until the real-time temperature of the region to be cooled decreases to the target temperature value.

[0149] In one embodiment, when the processor executes the computer program, the following steps are further implemented: if the real-time temperature of the region to be cooled does not decrease to the target temperature value within a preset time period, controlling the auxiliary heat dissipation device to operate to assist the target heat dissipation device in heat dissipation of the region to be cooled; wherein the auxiliary heat dissipation device is a heat dissipation device other than the target heat dissipation device in the candidate heat dissipation devices.

[0150] In one embodiment, a computer readable storage medium is provided, which stores a computer program. When the computer program is executed by a processor, the following steps are implemented:

[0151] obtaining the region to be cooled in the first cavity;

[0152] determining the target heat dissipation air duct corresponding to the region to be cooled in the second cavity and determining the target heat dissipation device from the candidate heat dissipation devices according to the region to be cooled;

[0153] controlling the target heat dissipation device to perform air supply based on the target heat dissipation air duct to achieve heat dissipation of the region to be cooled.

[0154] In one embodiment, the computer program determines the target heat dissipation air duct corresponding to the region to be cooled in the second cavity according to the region to be cooled, and the logic is implemented as follows when executed by the processor: determining a heat distribution trajectory corresponding to the region to be cooled; obtaining at least one first candidate air duct according to the air supply direction of the candidate heat dissipation device and the position of each heat dissipation hole; and determining the target heat dissipation air duct corresponding to the region to be cooled according to the similarity between the first candidate heat dissipation air duct and the heat distribution trajectory.

[0155] In one embodiment, the computer program determines the target heat dissipation air duct based on the similarity between the first candidate heat dissipation air duct and the heat distribution trajectory, and the logic is implemented as follows when executed by the processor: determining the first candidate heat dissipation air duct with the highest similarity to the heat distribution trajectory as a second candidate heat dissipation air duct; determining at least one vector adjustment heat dissipation device from the candidate heat dissipation device according to the heat distribution trajectory, the second candidate heat dissipation air duct, and the offset therebetween; and adjusting the second candidate heat dissipation air duct by changing the air direction and / or air volume of the vector adjustment heat dissipation device to obtain the target heat dissipation air duct corresponding to the region to be cooled.

[0156] In one embodiment, the computer program obtains the region to be cooled in the first cavity, and the logic is implemented as follows when executed by the processor: determining the chip to be cooled from the chips in the first cavity according to the temperature warning value and the current temperature of each chip; and determining the region to be cooled in the first cavity according to the installation position of the chip to be cooled.

[0157] In one embodiment, the computer program controls the target heat dissipation device to supply air based on the target heat dissipation air duct to achieve heat dissipation of the region to be cooled, and the logic is implemented as follows when executed by the processor: obtaining the real-time temperature of the region to be cooled during the process of controlling the target heat dissipation device to supply air based on the target heat dissipation air duct; determining the target air supply intensity of the target heat dissipation device based on the temperature difference between the real-time temperature of the region to be cooled and the target temperature value; and controlling the target heat dissipation device to operate at the target air supply intensity until the real-time temperature of the region to be cooled decreases to the target temperature value.

[0158] In one embodiment, the computer program is further implemented as follows when executed by the processor: if the real-time temperature of the region to be cooled does not decrease to the target temperature value within a preset time period, controlling the auxiliary heat dissipation device to operate to assist the target heat dissipation device in cooling the region to be cooled; and wherein the auxiliary heat dissipation device is a heat dissipation device other than the target heat dissipation device in the candidate heat dissipation device.

[0159] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer readable storage medium, and when the computer program is executed, the processes of the above-mentioned embodiments of the methods can be included. Any reference to memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (Read-Only Memory, ROM), magnetic tape, floppy disk, flash memory, optical storage, high-density embedded non-volatile memory, resistive memory (ReRAM), magnetoresistive random access memory (Magnetoresistive Random Access Memory, MRAM), ferroelectric memory (Ferroelectric Random Access Memory, FRAM), phase change memory (Phase Change Memory, PCM), graphene memory, etc. Volatile memory can include random access memory (Random Access Memory, RAM) or external cache memory, etc. As an illustration but not limitation, RAM can be in various forms, such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM), etc. The database involved in the embodiments provided in the present application can include at least one of a relational database and a non-relational database. The non-relational database can include a distributed database based on a block chain, etc., without being limited thereto. The processor involved in the embodiments provided in the present application can be a general-purpose processor, a central processing unit, a graphics processing unit, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., without being limited thereto.

[0160] Any combination of the technical features of the above embodiments can be made. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combination of the technical features does not exist contradictory, it should be considered as the scope of the present application.

[0161] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the patent of the present application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A heat dissipation method for a controller, characterized in that, The controller includes a first cavity and a second cavity. A chip is disposed in the first cavity, and a candidate heat dissipation device is disposed in the second cavity. The first cavity and the second cavity are adjacent to each other but independent of each other. The method includes: Obtain the area to be cooled within the first cavity; Determine the heat distribution trajectory corresponding to the area to be cooled; Based on the airflow direction of the candidate heat dissipation devices and the position of each heat dissipation hole, at least one first candidate heat dissipation air duct is obtained; Based on the similarity between the first candidate heat dissipation air duct and the heat distribution trajectory, a target heat dissipation air duct corresponding to the area to be dissipated is determined; A target heat dissipation device corresponding to the target heat dissipation airflow is determined from the candidate heat dissipation devices; wherein, the target heat dissipation device is a candidate heat dissipation device that forms the target heat dissipation airflow. The target heat dissipation device is controlled to deliver air based on the target heat dissipation duct in order to dissipate heat from the area to be cooled.

2. The method according to claim 1, characterized in that, The step of determining the target heat dissipation duct corresponding to the area to be cooled based on the similarity between the first candidate heat dissipation duct and the heat distribution trajectory includes: The first candidate heat dissipation duct with the highest similarity to the heat distribution trajectory is determined as the second candidate heat dissipation duct; Based on the heat distribution trajectory and the second candidate heat dissipation air duct, as well as the offset between the two, at least one vector adjustment heat dissipation device is determined from the candidate heat dissipation devices; By changing the direction and / or force of the airflow of the vector-adjusted heat dissipation device, the second candidate heat dissipation airflow is adjusted to obtain the target heat dissipation airflow corresponding to the area to be dissipated.

3. The method according to claim 1, characterized in that, The step of obtaining the heat dissipation area within the first cavity includes: Based on the temperature warning value and the current temperature of each chip in the first cavity, the chip to be cooled is determined from among the chips. Based on the installation location of the chip to be cooled, the area to be cooled within the first cavity is determined.

4. The method according to claim 3, characterized in that, Determining the heat-dissipating area within the first cavity based on the installation location of the chip to be cooled includes: Centered on the installation location of the chip to be cooled, and with a set length as the radius, the area to be cooled is determined within the first cavity.

5. The method according to claim 1, characterized in that, The control of the target heat dissipation device to deliver air based on the target heat dissipation duct to achieve heat dissipation of the area to be cooled includes: During the process of controlling the target heat dissipation device to deliver air based on the target heat dissipation duct, the real-time temperature of the area to be cooled is obtained. The target airflow intensity of the target heat dissipation device is determined based on the temperature difference between the real-time temperature of the area to be cooled and the target temperature value. The target heat dissipation device is controlled to operate at the target air supply intensity until the real-time temperature of the area to be cooled drops to the target temperature value.

6. The method according to claim 5, characterized in that, The method further includes: If the real-time temperature of the area to be cooled does not drop to the target temperature value within a preset time period, then the auxiliary cooling device is controlled to operate to assist the target cooling device in cooling the area to be cooled; wherein, the auxiliary cooling device is a cooling device other than the target cooling device among the candidate cooling devices.

7. A heat dissipation device for a controller, characterized in that, The controller includes a first cavity and a second cavity. A chip is disposed in the first cavity, and a candidate heat dissipation device is disposed in the second cavity. The first cavity and the second cavity are adjacent to each other but independent of each other. The device includes: An acquisition module is used to acquire the area to be cooled within the first cavity; The air duct selection module is used to determine the heat distribution trajectory corresponding to the area to be cooled; obtain at least one first candidate cooling air duct based on the air delivery direction of the candidate cooling devices and the position of each heat dissipation hole; determine a target cooling air duct corresponding to the area to be cooled based on the similarity between the first candidate cooling air duct and the heat distribution trajectory; and determine a target cooling device corresponding to the target cooling air duct from the candidate cooling devices; wherein, the target cooling device is a candidate cooling device that forms the target cooling air duct. A heat dissipation module is used to control the target heat dissipation device to deliver air based on the target heat dissipation duct in order to dissipate heat from the area to be cooled.

8. The heat dissipation device for the controller according to claim 7, characterized in that, The heat dissipation module includes: The detection submodule is used to acquire the real-time temperature of the area to be cooled during the process of controlling the target heat dissipation device to deliver air based on the target heat dissipation duct. The adjustment submodule is used to determine the target airflow intensity of the target heat dissipation device based on the temperature difference between the real-time temperature of the area to be cooled and the target temperature value. The control submodule is used to control the target heat dissipation equipment to operate at the target air supply intensity until the real-time temperature of the area to be cooled drops to the target temperature value.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 6.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 6.

Images