Package structure and manufacturing method thereof
By embedding conductive powder shielding film on electronic components within the shielding area of the packaging substrate and then using laser focusing to form a conductive shielding shell, the problem of electromagnetic shielding in system-level packaging is solved, achieving effective protection and electromagnetic shielding of embedded electronic components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- AVARY HLDG (SHENZHEN) CO LTD
- Filing Date
- 2021-10-21
- Publication Date
- 2026-05-19
AI Technical Summary
Existing technologies have failed to effectively solve the electromagnetic shielding problem of functional chips in system-in-package (SIPP).
A shielding film containing conductive powder is placed on the embedded electronic components within the shielding area of the packaging substrate, and the conductive powder is aggregated by laser irradiation to form a conductive shielding shell, thereby achieving electromagnetic shielding for the embedded electronic components.
It achieves effective electromagnetic shielding for embedded electronic components, improving operational reliability and stability. It is also simple to operate, highly applicable, and the shielding range can be adjusted as needed.
Smart Images
Figure CN116017964B_ABST
Abstract
Description
Technical Field
[0001] This application relates to a packaging structure and a method for manufacturing the packaging structure. Background Technology
[0002] System-in-Package (SIP) integrates multiple functional chips, including processors and memory chips, into a single package to achieve a basic and complete function. However, some functional chips require electromagnetic shielding, and current technology does not provide an electromagnetic shielding solution for embedded functional chips. Summary of the Invention
[0003] To address the problems in the background art, this application provides a method for manufacturing a packaging structure.
[0004] In addition, this application also provides a packaging structure.
[0005] A method for manufacturing a packaging structure includes the following steps: providing a packaging substrate, the packaging substrate including a first substrate layer, an inner circuit layer, and embedded electronic components, the inner circuit layer being disposed on the first substrate layer, and the embedded electronic components being disposed on the inner circuit layer; covering the periphery of the embedded electronic components with a shielding film, the shielding film including conductive powder; irradiating the shielding film with a laser, causing at least a portion of the conductive powder to aggregate and form a conductive shielding shell, thereby obtaining the packaging structure.
[0006] Furthermore, the packaging substrate includes a shielding area and a non-shielding area other than the shielding area. Some of the embedded electronic components are disposed in the shielding area, and another part of the embedded electronic components are disposed in the non-shielding area. The manufacturing method further includes the step of: irradiating the shielding film in the shielding area with a laser to cause the conductive powder in the shielding area to aggregate to form a conductive shielding shell.
[0007] Further, the method for manufacturing the packaging substrate includes: providing an inner copper-clad substrate, the inner copper-clad substrate including a first substrate layer and an inner copper foil layer disposed on the substrate layer; etching the inner copper foil layer to form the inner circuit layer; disposing a first solder resist layer on the inner circuit layer, the first solder resist layer having a first opening, a portion of the inner circuit layer being exposed at the bottom of the inner opening, and disposing the embedded electronic component within the inner opening, the embedded electronic component being electrically connected to the inner circuit layer, thereby obtaining the packaging substrate.
[0008] Furthermore, the method includes the step of: disposing a circuit board on the conductive shielding shell, the circuit board including a second substrate layer, an outer circuit layer and a conductor, the second substrate layer being disposed on the conductive shielding shell, the outer circuit layer being disposed on the second substrate layer, the conductor penetrating the second substrate layer, and the conductor electrically connecting the outer circuit layer and the conductive shielding shell.
[0009] Furthermore, before setting the circuit board on the conductive shielding shell, the method further includes the step of setting a metal layer on the conductive shielding shell.
[0010] Further, the method includes the steps of: forming an outer copper-clad substrate on the metal layer, the outer copper-clad substrate comprising a second substrate layer and an outer copper foil layer, the second substrate layer being disposed between the outer copper foil layer and the metal layer; forming an opening on the outer copper-clad substrate, the opening penetrating the second substrate layer and the outer copper foil layer, with a portion of the metal layer exposed at the bottom of the opening; forming the conductor within the opening; and etching the outer copper foil layer to form the outer circuit layer.
[0011] Furthermore, the method includes the steps of: providing an outer solder resist layer on the outer circuit layer, the outer solder resist layer having an outer window, a portion of the outer circuit layer being exposed at the bottom of the outer window, and providing exposed electronic components within the outer window.
[0012] An encapsulation structure includes an encapsulation substrate and a conductive shielding shell. The encapsulation substrate includes a first substrate layer, an inner circuit layer, and embedded electronic components. The inner circuit layer is disposed on the first substrate layer, the embedded electronic components are disposed on the inner circuit layer, and the conductive shielding shell covers the embedded electronic components.
[0013] Furthermore, the packaging structure also includes a circuit board, which includes a second substrate layer, an outer circuit layer, and a conductor. The second substrate layer is disposed on the conductive shielding shell, the outer circuit layer is disposed on the second substrate layer, and the conductor penetrates the second substrate layer and electrically connects the outer circuit layer and the conductive shielding shell.
[0014] Furthermore, the packaging structure also includes exposed electronic components disposed on the outer circuit layer.
[0015] Compared with the prior art, the packaging structure manufacturing method provided in this application sets a shielding film containing conductive powder on the embedded electronic components in the shielding area, and then uses laser to irradiate the shielding film to make the conductive powder aggregate to form a conductive shielding shell. The conductive shielding shell can be used for electromagnetic shielding of embedded electronic components. The process is simple to operate and has strong applicability. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the inner copper-clad substrate provided in an embodiment of this application.
[0017] Figure 2 For etching Figure 1 The diagram shown is a schematic of the first inner copper foil layer after the first inner circuit layer.
[0018] Figure 3 for Figure 2 The diagram shows a first inner solder mask layer after it has been applied to the first inner circuit layer.
[0019] Figure 4 This is a schematic diagram of the packaging substrate provided in an embodiment of this application.
[0020] Figure 5 for Figure 4 The diagram shows a shielding film on the packaging substrate.
[0021] Figure 6 For laser irradiation Figure 4 The diagram shown illustrates the partial shielding film used to form a conductive shielding shell.
[0022] Figure 7 for Figure 6 The diagram shows a conductive shielding shell with a metal layer installed.
[0023] Figure 8 for Figure 7 The diagram shows a first outer copper-clad substrate disposed on the metal layer.
[0024] Figure 9 for Figure 8 The diagram shows the first outer copper-clad substrate after the first opening is provided.
[0025] Figure 10 for Figure 9 The diagram shows the first conductor installed inside the first opening.
[0026] Figure 11 For etching Figure 10 The diagram shown is a schematic of the first outer copper foil layer, which is the first outer circuit layer.
[0027] Figure 12 for Figure 11 The diagram shows a first outer solder mask layer installed on the first outer circuit layer.
[0028] Figure 13 This is a schematic diagram of the packaging structure provided in an embodiment of this application.
[0029] Explanation of main component symbols
[0030] Packaging structure 100
[0031] Packaging substrate 10
[0032] First substrate layer 11
[0033] First inner circuit layer 12
[0034] Second inner circuit layer 13
[0035] Embedded electronic components 14
[0036] Inner copper-clad substrate 20
[0037] First inner copper foil layer 21
[0038] Second inner copper foil layer 22
[0039] First inner weld shield 23
[0040] First inner window 231
[0041] Second inner weld shield 24
[0042] Second inner window 241
[0043] Shielding film 30
[0044] Conductive shielding shell 31
[0045] Metal layer 40
[0046] First outer copper-clad substrate 51
[0047] Second substrate layer 511
[0048] First outer copper foil layer 512
[0049] First opening 513
[0050] Second outer copper-clad substrate 52
[0051] Third substrate layer 521
[0052] Second outer copper foil layer 522
[0053] Second opening 523
[0054] First conductor 61
[0055] Second conductor 62
[0056] First outer circuit layer 71
[0057] Second outer circuit layer 72
[0058] First outer weld shield 81
[0059] First outer window 811
[0060] Second outer weld shield 82
[0061] Second outer window 821
[0062] First exposed electronic component 91
[0063] Second exposed electronic component 92
[0064] Thickness direction H
[0065] Shielding area P
[0066] Unshielded area F
[0067] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation
[0068] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.
[0069] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or may also exist in an intervening component. When a component is considered to be "set on" another component, it can be directly set on the other component or may also exist in an intervening component.
[0070] Please see Figures 1 to 13 This application provides a method for manufacturing a packaging structure 100, including the following steps:
[0071] S1: Please see Figure 4 A packaging substrate 10 is provided, the packaging substrate 10 including a first substrate layer 11, a first inner circuit layer 12, a second inner circuit layer 13, and embedded electronic components 14. The first inner circuit layer 12 and the second inner circuit layer 13 are respectively disposed on two opposite surfaces of the first substrate layer 11, and the embedded electronic components 14 are disposed on the first inner circuit layer 12 and electrically connected to the first inner circuit layer 12. The packaging substrate 10 has a thickness direction H, and along a direction perpendicular to the thickness H, the packaging substrate 10 is divided into a shielded area P and a non-shielded area F excluding the shielded area P. Part of the embedded electronic components 14 are disposed in the shielded area P, and another part of the embedded electronic components 14 are disposed in the non-shielded area F.
[0072] In this embodiment, please refer to Figures 1 to 4The manufacturing method of the packaging substrate 10 in step S1 includes:
[0073] S10: Please refer to Figure 1 An inner copper-clad substrate 20 is provided, the inner copper-clad substrate 20 includes a first inner copper foil layer 21, a second inner copper foil layer 22 and a first substrate layer 11, the first inner copper foil layer 21 and the second inner copper foil layer 22 are respectively disposed on two opposite surfaces of the first substrate layer 11.
[0074] S11: Please refer to Figure 2 The first inner copper foil layer 21 is etched to form the first inner circuit layer 12, and the second inner copper foil layer 22 is etched to form the second inner circuit layer 13.
[0075] S12: Please refer to Figure 3 A first inner solder resist layer 23 is provided on the first inner circuit layer 12, and a second inner solder resist layer 24 is provided on the second inner circuit layer 13. The first inner solder resist layer 23 has a first inner opening 231, and the second inner solder resist layer 24 has a second inner opening 241.
[0076] S13: Please see Figure 4 The embedded electronic component 14 is disposed within the first inner window 231 to obtain the packaging substrate 10.
[0077] S2: Please see Figure 5 A shielding film 30 is wrapped around the periphery of the embedded electronic component 14. The shielding film 30 extends into the shielded area P and the unshielded area F to cover the first inner solder resist layer 23. The shielding film 30 is made of an adhesive and conductive powder. The adhesive includes at least one of urethane and epoxy resin, and the conductive powder includes at least one of iron powder, copper powder, carbon powder, nickel powder, and magnesium powder.
[0078] S3: Please see Figure 6 A portion of the shielding film 30 within the shielding area P is irradiated by a laser, causing the conductive powder within that portion of the shielding film 30 to aggregate and form a conductive shielding shell 31. The conductive shielding shell 31 covers a portion of the embedded electronic components 14 within the shielding area P, thereby achieving electromagnetic shielding of the embedded electronic components 14 within the shielding area P and improving the reliability and stability of the operation of the embedded electronic components 14. At the same time, the shielding film 30 within the unshielded area F, which is not irradiated by the laser, can play a protective role for the embedded electronic components 14.
[0079] S4: Please see Figure 7A metal layer 40 is disposed on the conductive shielding shell 31. The metal layer 40 includes a nickel layer (not shown) and a copper layer (not shown), and the metal layer 40 is electrically connected to the conductive shielding shell 31. The nickel layer is disposed on the conductive shielding shell 31, and the copper layer is disposed on the nickel layer. The thickness of the copper layer is 3 micrometers to 10 micrometers, and the thickness of the nickel layer is 2 micrometers to 4 micrometers. In other embodiments of this application, the copper layer is disposed on the conductive shielding shell 31, and the nickel layer is disposed on the copper layer.
[0080] S5: Please see Figure 8 A first outer copper-clad substrate 51 is disposed on the metal layer 40. The first outer copper-clad substrate 51 includes a second substrate layer 511 and a first outer copper foil layer 512. The second substrate layer 511 is disposed between the first outer copper foil layer 512 and the metal layer 40. A second outer copper-clad substrate 52 is disposed on the second inner solder resist layer 24. The second outer copper-clad substrate 52 includes a third substrate layer 521 and a second outer copper foil layer 522. The third substrate layer 521 is disposed between the second outer copper foil layer 522 and the second inner circuit layer 13.
[0081] In this embodiment, please refer to Figure 8 The heights of the multiple embedded electronic components 14 are different, which makes the conductive shielding shell 31 and the metal layer 40 stepped, thereby increasing the contact area between the metal layer 40 and the second substrate layer 511 and improving the bonding force between the metal layer 40 and the first outer copper-clad substrate 51.
[0082] S6: Please see Figure 9 A first opening 513 is provided on the first outer copper-clad substrate 51, the first opening 513 penetrates the first outer copper foil layer 512 and the second substrate layer 511, and a portion of the metal layer 40 is exposed at the bottom of the first opening 513. A second opening 523 is provided on the second outer copper-clad substrate 52, the second opening 523 penetrates the second outer copper foil layer 522 and the third substrate layer 521, the second opening 523 is provided corresponding to the second inner window 241, and a portion of the second inner circuit layer 13 is exposed at the bottom of the second opening 523.
[0083] S7: Please see Figure 10 A first conductor 61 is formed by electroplating in the first opening 513. The first conductor 61 is electrically connected to the metal layer 40 and the first outer copper foil layer 512. A second conductor 62 is formed by electroplating in the second opening 523. The second conductor 62 is electrically connected to the second inner circuit layer 13 and the second outer copper foil layer 522.
[0084] S8: Please see Figure 11 The first outer copper foil layer 512 is etched to form the first outer circuit layer 71. The first outer circuit layer 71 and the second substrate layer 511 together form the circuit substrate 70. The first conductor 61 is electrically connected to the first outer circuit layer 71 and the metal layer 40. The second outer copper foil layer 522 is etched to form the second outer circuit layer 72. The second conductor 62 is electrically connected to the second outer circuit layer 72 and the second inner circuit layer 13.
[0085] In this embodiment, the first outer circuit layer 71 has a ground line (not shown), and the first conductor 61 is electrically connected to the metal layer 40 and the ground line. The ground line is used to connect to the reference potential of the encapsulation structure 100, thereby connecting the conductive shielding shell 31 to the reference potential, which is beneficial to better achieve electromagnetic shielding.
[0086] S9: Please see Figure 12 A first outer solder resist layer 81 is provided on the first outer circuit layer 71. The first outer solder resist layer 81 has a plurality of first outer openings 811, and a portion of the first outer circuit layer 71 is exposed at the bottom of the first outer openings 811. A second outer solder resist layer 82 is provided on the second outer circuit layer 72. The second outer solder resist layer 82 has a plurality of second outer openings 821, and a portion of the second outer circuit layer 72 is exposed at the bottom of the second outer openings 821.
[0087] S10: Please refer to Figure 13 A first exposed electronic component 91 is disposed in the first outer window 811 and electrically connected to the first outer circuit layer 71. A second exposed electronic component 92 is disposed in the second outer window 821 and electrically connected to the second outer circuit layer 72, thereby obtaining the packaging structure 100.
[0088] Compared with the prior art, the manufacturing method of the packaging structure 100 provided in this application has the following advantages:
[0089] (i) By setting a shielding film 30 containing conductive powder on the embedded electronic component 14 in the shielding area P, and then irradiating the shielding film 30 with a laser to make the conductive powder aggregate to form a conductive shielding shell 31, the conductive shielding shell 31 can be used for electromagnetic shielding of the embedded electronic component 14. This process is simple to operate and has strong applicability.
[0090] (ii) By adjusting the range of the shielding area P and then irradiating the shielding film 30 in the adjusted shielding area P with a laser, the coverage of the conductive shielding shell 31 can be expanded or reduced, which is beneficial to achieving selective electromagnetic shielding of the embedded electronic components 14.
[0091] (iii) The shielding film 30 in the unshielded portion can be filled between each two adjacent embedded electronic components 14 in the unshielded area F, thereby protecting the embedded electronic components 14 and improving the reliability of the packaging structure 100.
[0092] Please see Figure 13 This application also provides a packaging structure 100, which includes a packaging substrate 10 and a conductive shielding shell 31. The packaging substrate 10 includes a first substrate layer 11, a first inner circuit layer 12, and an embedded electronic component 14. The first inner circuit layer 12 is disposed on the first substrate layer 11, the embedded electronic component 14 is disposed on the first inner circuit layer 12, and the conductive shielding shell 31 covers the embedded electronic component 14.
[0093] Please see Figure 13 In this embodiment, the packaging structure 100 further includes a circuit board 70, which includes a second substrate layer 511, a first outer circuit layer 71, and a first conductor 61. The second substrate layer 511 is disposed on the conductive shielding shell 31, the first outer circuit layer 71 is disposed on the second substrate layer 511, and the first conductor 61 penetrates the second substrate layer 511, electrically connecting the first outer circuit layer 71 and the conductive shielding shell 31.
[0094] Please see Figure 13 In this embodiment, the packaging structure 100 further includes a first exposed electronic component 91, which is disposed on the first outer circuit layer 71 and electrically connected to the first outer circuit layer 71.
Claims
1. A method for manufacturing a packaging structure, characterized in that, Including the following steps: A packaging substrate is provided, the packaging substrate including a first substrate layer, an inner circuit layer and embedded electronic components, the inner circuit layer being disposed on the first substrate layer, the embedded electronic components being disposed on the inner circuit layer, the packaging substrate including a shielding area and a non-shielding area other than the shielding area, a portion of the embedded electronic components being disposed in the shielding area, and another portion of the embedded electronic components being disposed in the non-shielding area. A shielding film is wrapped around the embedded electronic component, and the shielding film includes conductive powder. The shielding film within the shielding area is irradiated with a laser, causing the conductive powder within the shielding area to aggregate and form a conductive shielding shell, thereby obtaining the encapsulation structure; A metal layer is disposed on the conductive shielding shell; A circuit board is disposed on the conductive shielding shell. The circuit board includes a second substrate layer, an outer circuit layer, and a conductor. The second substrate layer is disposed on the conductive shielding shell, the outer circuit layer is disposed on the second substrate layer, and the conductor penetrates the second substrate layer. The conductor electrically connects the outer circuit layer and the conductive shielding shell.
2. The manufacturing method as described in claim 1, characterized in that, The method for manufacturing the packaging substrate includes: An inner copper-clad substrate is provided, the inner copper-clad substrate including a first substrate layer and an inner copper foil layer disposed on the substrate layer; The inner copper foil layer is etched to form the inner circuit layer; A first solder resist layer is provided on the inner circuit layer, the first solder resist layer having a first opening, and a portion of the inner circuit layer is exposed at the bottom of the inner opening; and An embedded electronic component is disposed within the inner window, and the embedded electronic component is electrically connected to the inner circuit layer to obtain the packaging substrate.
3. The manufacturing method as described in claim 1, characterized in that, It also includes the following steps: An outer copper-clad substrate is disposed on the metal layer. The outer copper-clad substrate includes a second substrate layer and an outer copper foil layer. The second substrate layer is disposed between the outer copper foil layer and the metal layer. An opening is provided on the outer copper-clad substrate, the opening penetrating the second substrate layer and the outer copper foil layer, with a portion of the metal layer exposed at the bottom of the opening; The conductor is disposed within the opening, and The outer copper foil layer is etched to form the outer circuit layer.
4. The manufacturing method as described in claim 3, characterized in that, It also includes the following steps: An outer solder resist layer is provided on the outer circuit layer, the outer solder resist layer having an outer opening, and a portion of the outer circuit layer is exposed at the bottom of the outer opening. Exposed electronic components are installed inside the outer window.
5. A packaging structure manufactured by the manufacturing method of the packaging structure according to any one of claims 1 to 4, characterized in that, The package includes a packaging substrate and a conductive shielding shell. The packaging substrate includes a first substrate layer, an inner circuit layer, and embedded electronic components. The inner circuit layer is disposed on the first substrate layer, the embedded electronic components are disposed on the inner circuit layer, and the conductive shielding shell covers the embedded electronic components.
6. The packaging structure as described in claim 5, characterized in that, The packaging structure further includes a circuit board, which includes a second substrate layer, an outer circuit layer, and a conductor. The second substrate layer is disposed on the conductive shielding shell, the outer circuit layer is disposed on the second substrate layer, and the conductor penetrates the second substrate layer. The conductor electrically connects the outer circuit layer and the conductive shielding shell.
7. The packaging structure as described in claim 6, characterized in that, The packaging structure also includes exposed electronic components, which are disposed on the outer circuit layer.