Housing and electrical device

Abstract

The invention relates to a housing (1) for an electrical device (20), the housing comprising a housing body (2) which at least partially accommodates a respective electrical component (3) of the electrical device (20), the housing body (2) having at least one bearing point (4) for bearing on a respective plate (5) to which the electrical component (3) is connected, the housing (1) further having at least one temperature sensor (6) for detecting the temperature of the respective plate (5), the respective temperature sensor (6) being arranged in the housing body (2) in the region of the respective bearing point (4). The invention also relates to an electrical device (20) comprising at least one electrical component (3), at least one plate (5) connected to the respective electrical component (3), and at least one such housing (1), the housing body (2) being arranged at the respective bearing point (4) on the respective plate (5). In order to provide an improved electrical device (20), it is proposed in particular that the housing body (2) has a single-pole electrical line (9) to the respective temperature sensor (6).

Description

TECHNICAL FIELD

[0001] The invention relates to a housing for an electrical device, the housing comprising a housing body which at least partially accommodates a respective electrical component of the electrical device, wherein the housing body has at least one bearing point for bearing on a respective board to which the electrical component is connected, wherein the housing further has at least one temperature sensor for detecting the temperature of the respective board, wherein the respective temperature sensor is arranged in the housing body in the region of the respective bearing point.

[0002] The invention also relates to an electrical device comprising at least one electrical component, at least one board to which the respective electrical component is connected, and at least one such housing, wherein the housing body is arranged at the respective bearing point on the respective board. BACKGROUND

[0003] Such devices are used in a large number of electronic and power electronic applications.

[0004] In power electronic applications, temperature information of components or component parts is often required. For this purpose, temperature sensors have to be arranged in the vicinity of the components or component parts, for example in order to calculate the temperature of the components or component parts via a model with the temperature information of the reference temperature sensors.

[0005] Hitherto, the temperature sensors have either been arranged on cooling bodies and thus relatively far from the components or component parts, which has the disadvantage of relatively large inaccuracies, or they have been arranged within the module, for example a power module with power semiconductors, on the circuit carrier present there. The latter has the disadvantage that the temperature sensors are not reliably electrically isolated from the rest of the electronics, and that the electrical isolation has to be implemented by further components, for example optical couplers, if necessary. Furthermore, the temperature sensors take up valuable space on the circuit carrier.

[0006] From US 2020 / 098667 A1 a semiconductor module is known which comprises a terminal housing made of resin for arranging a semiconductor chip; and a cooling section having a refrigerant circulation section through which a refrigerant flows; and a connection section which surrounds the refrigerant circulation section, wherein the refrigerant circulation section is arranged below the terminal housing and the cooling section is arranged at the connection section in direct or indirect close contact with the terminal housing, wherein the terminal housing is provided above the connection section and has a side wall which is provided so as to surround the semiconductor chip when viewed in a top view, wherein a temperature sensor for detecting the temperature of the refrigerant is provided at the side wall. SUMMARY

[0007] It is an object of the invention to provide an improved electrical device which, in particular, overcomes the mentioned disadvantages.

[0008] The solution to this object is achieved by a housing of the type mentioned at the outset in that the housing body has a single-pole electrical line to the respective temperature sensor.

[0009] A further solution to this object is achieved by an electrical device of the type mentioned at the outset in that the electrical device has the proposed housing.

[0010] The housing has a housing body, which can for example have the shape of a cover or a bracket and which can here in particular have a U-shaped cross section. The housing body can also be configured tubular and here have a rectangular cross section, wherein the housing body optionally has only one opening, for example a container.

[0011] The housing body here has at least one bearing point for bearing on a respective plate, to which a respective electrical component is connected. For example, the respective electrical component is arranged on the respective plate. For the example of a cover-shaped or bracket-shaped design of the housing, the respective bearing point in particular contacts the respective plate at the location at which the cover or bracket is located.

[0012] The housing body is configured such that it at least partially accommodates the respective electrical component of the electrical device. For example, the housing body is configured as a cover or a cover, which at least partially covers the respective electrical component. The housing body can also be configured as a housing frame. In particular, the housing body and the respective plate completely surround the respective electrical component at least in a plane running through the respective electrical component, the housing body and the respective plate. As mentioned, the housing body can also be configured as a container, into which the respective electrical component is introduced, such that the respective electrical component is largely surrounded by the housing body or together with the respective plate.

[0013] Furthermore, the housing has at least one temperature sensor, by means of which the temperature of the respective plate can be respectively determined or measured. The respective temperature sensor is therefore preferably in thermal contact with the respective plate. The respective temperature sensor can for example be configured as a Peltier element or a thermistor or an NTC resistor (NTC: Negative Temperature Coefficient).

[0014] Furthermore, the corresponding temperature sensor is arranged within the housing body in the area of ​​the corresponding support point. For examples of a bracket-shaped or U-shaped housing body, the arrangement of the corresponding temperature sensor within the housing body means that the corresponding temperature sensor is integrated into one of the two arms of the bracket or U-shape. More generally, the arrangement of the corresponding temperature sensor within the housing body can be understood, for example, as the housing body having a geometry with walls or supports, and the corresponding temperature sensor being mounted in one of the walls or supports of the housing body, or integrated into one of the supports or walls.

[0015] The arrangement of the corresponding temperature sensor in the area of ​​the corresponding support point can be achieved, for example, by having the temperature sensor directly contact the corresponding support point or the corresponding plate, or by placing it directly adjacent to it. Alternatively, this arrangement can also be achieved by placing the temperature sensor adjacent to the corresponding support point. This is possible, for example, when the housing body has dimensions in the range of centimeters or decimeters and the distance between the temperature sensor and the corresponding support point is in the range of millimeters, particularly a few millimeters, a tenth of a millimeter, or a hundredth of a millimeter.

[0016] By placing appropriate temperature sensors at or near the corresponding support points, and further at or near the corresponding plates, more precise temperature determination of the corresponding plates, and consequently of the corresponding electrical components, can be achieved. This is important to prevent overheating of the corresponding electrical components, thereby extending the service life of the corresponding electrical components and, consequently, the electrical equipment.

[0017] Based on the design of the corresponding temperature sensor and the area between the corresponding temperature sensor and the corresponding board, reliable electrical isolation or insulation between the corresponding temperature sensor and the other electronic devices of the electrical equipment can also be achieved by relatively simple means.

[0018] Each housing body has a single-pole electrical line leading to the corresponding temperature sensor. This specifically means that the corresponding temperature sensor has a first terminal line implemented via the corresponding single-pole electrical line. Preferably, the corresponding temperature sensor is in electrical contact with the corresponding plate, such that the second terminal line is implemented via the corresponding plate (and, if necessary, a ground or other line connected to the corresponding plate). The first and second terminal lines can together form the signal line of the corresponding temperature sensor. Here, the corresponding temperature sensor can directly contact the corresponding plate, or a conductive material, such as solder, can be disposed between the corresponding temperature sensor and the corresponding plate. The conductive material is preferably also a good thermal conductor, i.e., a material having a thermal conductivity of at least 40 W / (m·K), preferably greater than 200 W / (m·K) or 400 W / (m·K).

[0019] The design of the application is preferably used in an electrical device in which the respective temperature sensor does not need to be electrically isolated or insulated from the respective board or the respective electrical component. The design of the application has the advantage that the respective temperature sensor is arranged in a space-saving manner and in a very close or direct thermal contact at the respective board or the respective electrical component.

[0020] By the aspect mentioned later, a relatively precise temperature detection of the respective board or the respective electrical component is possible.

[0021] In an advantageous design of the application, the housing preferably has an electrically insulating material at least in the region of the respective bearing point.

[0022] Here, a material is considered to be electrically insulating which has an electrical conductivity σ in the order of magnitude of less than 10 -8 S / m, in particular 10 -16 S / m. In particular, the housing body is made entirely of an electrically insulating material, for example of a plastic or an electrically insulating ceramic. For example, the respective temperature sensor can be extrusion-coated by the plastic that makes up the housing body, wherein for this purpose preferably a thermoplastic is used. Alternatively, it is also possible to use a housing body which has an electrically insulating material at least in the region of the respective bearing point and / or additionally in the region of the respective temperature sensor. In this option, the housing body can also have a partially electrically conductive material, for example steel.

[0023] By the housing body having an electrically insulating material, the electrical isolation or insulation of the respective temperature sensor from the remaining electronics of the electrical device is simply achieved.

[0024] In a further advantageous design of the application, the respective temperature sensor is arranged in a respective cavity of the housing body. Thus, the respective cavity is integrated into the housing body and can be configured, for example, as a shaft. Here, the respective cavity or shaft can be open towards the side of the respective bearing point or open towards the opposite side, so that the respective cavity or shaft, although open, is closed towards the respective bearing surface. In particular, when the housing body has a wall or a strut, the respective cavity is preferably arranged in one of the walls or struts. This means that the respective cavity is completely or at least mostly surrounded by the respective wall or the respective strut. Accordingly, the respective cavity can be closed or, for example, have an opening pointing towards the respective board. The respective temperature sensor can be inserted or glued into the respective cavity, for example.

[0025] By this design of the housing body, a space-saving mounting of the respective temperature sensor is achieved, as well as an arrangement of the respective temperature sensor at or near the respective board or the respective electrical component.

[0026] In particular when the respective cavity opens toward the respective plate, a material of good thermal conductivity, i.e. for example a thermal paste, a respective adhesive or a plastic, can be arranged between the respective temperature sensor and the bearing point or the respective plate. Such a material of good thermal conductivity is preferably electrically insulating here, for example a respective ceramic or a material filled with a respective ceramic, mica or a thermal pad. A material having a thermal conductivity of at least 40 W / (m K), preferably more than 200 W / (m K) or 400 W / (m K) is considered to be a good thermal conductor here.

[0027] In a further advantageous design of the application, the housing body has at least two protrusions for fixing the respective temperature sensor in the respective cavity here. The respective temperature sensor is positioned and fixed within the housing body by the protrusions, wherein at the same time a thermal decoupling from the housing body is achieved, which increases the accuracy of the temperature detection of the respective plate and thus of the respective electrical component.

[0028] Alternatively or additionally, the housing body can have a material of relatively poor thermal conductivity, in particular in the region around the respective temperature sensor, however, not between the respective temperature sensor and the respective bearing point. A material is considered to be of relatively poor thermal conductivity here which has a thermal conductivity of less than 0.5 W / (m K), in particular less than 0.2 W / (m K) at room temperature.

[0029] In an alternative advantageous design of the application, the respective temperature sensor is completely surrounded by the housing body. This can be achieved, for example, by the respective temperature sensor being pressed in by the plastic forming the housing body. The housing preferably has an electrically insulating material, in particular in the region of the respective bearing point, whereby a reliable electrical separation or insulation of the respective temperature sensor from the respective plate or the respective electrical component can be achieved.

[0030] The housing body preferably has only a small thickness between the respective temperature sensor and the bearing point. This can be the case, for example, when the housing body has dimensions in the centimeter or decimeter range and the respective temperature sensor is at a distance of a few millimeters, in particular a few tenths of a millimeter or a few hundredths of a millimeter, from the respective bearing point.

[0031] Alternatively or additionally, a material of good thermal conductivity, for example a thermal paste, a respective adhesive or a plastic, can be arranged between the respective temperature sensor and the bearing point or the respective plate. The material of good thermal conductivity is preferably electrically insulating here, for example a respective ceramic or a material filled with a respective ceramic, mica or a thermal pad.

[0032] Here, the thermally conductive material can be considered as part of the housing body or separate from the housing body, whereby the above-mentioned design variant is realized by means of the respective cavity and the thermally conductive material is arranged in the cavity between the respective temperature sensor and the respective board.

[0033] In a further advantageous design variant of the application, the housing further has a plurality of connection pins, wherein the housing body has a plurality of recesses for accommodating a respective one of the connection pins, wherein the respective two adjacent recesses have the same spacing from one another, and wherein the respective temperature sensor is arranged in one of the recesses and is electrically connected to at least one of the connection pins.

[0034] Here, the respective recesses can in particular be configured as the respective above-explained cavities. By the respective two adjacent recesses having the same spacing from one another, the recesses can be arranged according to a grid. Preferably, the grid size is 2 mm to 5 mm, in particular 3.8 mm, so that the two adjacent recesses have a spacing from one another corresponding to the grid size. Here, the housing body can also have two or more rows of such recesses, wherein the grid size is preferably observed within the respective row, however, not necessarily from the edge of one row to the adjacent edge of the other row.

[0035] The respective recesses can all or only partially each have a connection pin arranged in the respective recess. The individual pins can be used, for example, to contact the respective board, in particular configured as a circuit carrier for a power module or for a processor, so that a supply voltage, a ground and / or a signal line can be guided to the respective board via the connection pin. The connection pins can be integrated into the housing body, for example, or inserted or bonded into the recesses, or extruded in plastic.

[0036] The respective temperature sensor is arranged in one of the recesses and is electrically connected to the connection pin arranged in the respective recess. This can be simply realized for the above-explained design variant with a unipolar electrical line to the respective temperature sensor. The respective temperature sensor can be configured such that one of its terminals constitutes a connection pin of the housing or the housing body, and the respective temperature sensor is in the vicinity of the connection face or the respective support point to the respective board in the housing body.

[0037] The explained design variant of the grid-like housing body and the explained integration of the respective temperature sensor into the grid-like housing body is a relatively inexpensive variant, since such housing bodies are manufactured in large numbers and are accordingly readily and inexpensively available.

[0038] For example, the respective temperature sensor can be introduced into the housing very cheaply by means of the same method as the other connection pins. In particular in the case of soldered terminals, the terminal pins of a wired temperature sensor can be used directly. However, the terminals can also be provided with any other terminal form, for example for press-in technology, ultrasonic or laser soldering, spring contacts or other terminal forms.

[0039] In a further advantageous design of the application, the respective temperature sensor is formed in one piece with at least one connection pin. This can be achieved, for example, in that the respective temperature sensor already has at least one respective connection pin, which is introduced together with the rest of the temperature sensor into the respective recess. Thereby, an especially low-cost installation and manufacture of the housing, and thus of the electrical device, can be achieved.

[0040] In a further advantageous design of the application, the respective board is configured as a circuit carrier or as a cooling body.

[0041] For example, a DGB substrate (directly bonded copper) or an IMS (insulated metal substrate) or a base plate on which a DGB substrate or an IMS is arranged is used as a circuit carrier. The base plate can be metallic, for example made of copper, or have an alloy, for example, here.

[0042] Alternatively, the respective board can be configured as a cooling body, which preferably has a rather flat upper side and a lower side arranged opposite the upper side, the lower side having cooling ribs or cooling pins.

[0043] In both design variants, the respective board is usually in thermal connection with the hottest point of the electrical device during operation, since the respective electrical component is connected with the respective board.

[0044] By arranging the respective temperature sensor at or very close to or directly in thermal contact with the respective board or the respective electrical component, the temperature of the respective temperature sensor can be determined reliably and precisely.

[0045] In a further advantageous design of the application, the respective electrical component has at least one power module, which is arranged on the respective board or which comprises the respective board. Preferably, the respective board is configured as a circuit carrier here. Preferably, the respective power module comprises one or more power devices, i.e. for example power diodes, thyristors, bidirectional thyristors and transistors, for example power MOSFETs, IGBTs, etc. Furthermore, resistors, for example measuring resistors, can be used as power devices.

[0046] In another advantageous embodiment of the invention, the corresponding electrical component has at least one processor, which is disposed on or includes the corresponding board. Here, the corresponding board is preferably configured as a circuit carrier. For example, the processor can be configured as a central processing unit (CPU) of an electrical device or as a graphics processing unit (GPU), and each has one or more processor cores.

[0047] In another advantageous embodiment of the invention, the corresponding temperature sensor is mounted on the corresponding plate, and / or a thermally conductive material is arranged between the corresponding temperature sensor and the corresponding plate.

[0048] Here, materials with a thermal conductivity of at least 40 W / (m·K), preferably greater than 200 W / (m·K) or 400 W / (m·K), are considered good thermal conductors. As explained above, this design achieves particularly good thermal contact between the temperature sensor and the corresponding plate.

[0049] In another advantageous embodiment of the invention, the electrical equipment is configured as a power converter, controller, computer, smartphone, or device for consumer electronics, building automation, or smart homes, or configured as a household appliance. The power converter and controller are primarily used in industrial environments, such as in manufacturing and automation, where the power converter is also used in electric vehicles (such as electric cars, electric buses, electric trains, etc.) or in energy conversion and distribution. Here, the computer can include personal computers, laptop computers, tablet computers, etc. Attached Figure Description

[0050] The present invention will now be described and explained in more detail with reference to the embodiments shown in the accompanying drawings. The drawings show:

[0051] Figures 1 to 3 First to third examples of housing and device are shown.

[0052] Figures 4 to 5 First and second embodiments of the proposed housing and the proposed device are shown.

[0053] Figure 6 Another embodiment of the proposed electrical device is shown. Detailed Implementation

[0054] Figure 1A first example of a housing 1 and an electrical device 20 is shown, wherein a cross section through a portion of the housing 1 and the electrical device 20 is shown. The housing 1 has a housing body 2, which partially accommodates an electrical component 3 of the electrical device 20, wherein the electrical component 3 is connected with a board 5 of the electrical device 20. The housing body has a support point 4 for bearing on the board 5, wherein the support point 4 is a bearing surface in the context of the example.

[0055] The housing 1 also has a temperature sensor 6 for detecting a temperature of the board 5. Here, the temperature sensor 6 is arranged in the housing body 2 in the region of the support point 4.

[0056] The electrical component 3 and the board 5 are not constituent parts of the housing 1, but constituent parts of the electrical device 20.

[0057] As Figure 1 indicated, the temperature sensor 6 can be placed on the board 5 or touch the board.

[0058] Figure 2 A second example of the electrical device 20 is shown, wherein again a cross section through a portion of the housing 1 and the electrical device 20 is shown. Here, the same reference signs as in Figure 1 the first example denote the same objects.

[0059] The housing body 2 has an electrically insulating material 7 in the region of the respective support point 4. Alternatively or additionally, a well thermally conducting material 15 can be arranged in the region of the respective support point 4, which can be a part of the housing body 2. If the electrically insulating material 7 or the well thermally conducting material 15 is a part of the housing body 2, the temperature sensor is completely surrounded by the housing body 2.

[0060] In a preferred variant, the material arranged in the region of the respective support point 4 between the temperature sensor 6 and the board 5 is both electrically insulating and well thermally conducting.

[0061] Figure 3 A third example of the housing 1 and the electrical device 20 is shown, wherein again a cross section through a portion of the housing 1 and the electrical device 20 is shown.

[0062] The housing has a cavity 8, in which the temperature sensor 6 is arranged. Here, the housing body 2 has two protrusions 19 in the cavity 8, which fix the temperature sensor 6.

[0063] Figure 4 A first embodiment of the proposed housing 1 and the proposed electrical device 20 is shown, wherein again a cross section through a portion of the housing 1 and the electrical device 20 is shown.

[0064] The housing body 2 has an electrical line to the temperature sensor 6, wherein the electrical line is configured as a single-pole electrical line 9. In other examples, the electrical line can be configured as a two-pole electrical line 10 or a three-pole electrical line 11.

[0065] In the single-pole variant, the single-pole electrical line 9 provides a first terminal line for the temperature sensor 6, wherein the second terminal line is implemented via the electrical contact of the temperature sensor 6 to the plate 5, the plate 5 and possibly a ground or other lines connected with the respective plate.

[0066] In the two-pole variant, the two-pole electrical line 10 according to a first sub-variant provides two signal lines for the temperature sensor 6. This sub-variant is particularly advantageous if the temperature sensor 6 is electrically isolated or insulated from the plate. According to a second sub-variant, the two-pole electrical line 10 can have one of the two signal lines and a line for supplying the temperature sensor 6 with power. In said second sub-variant, the temperature sensor 6 is preferably in electrical contact with the plate, so that the second terminal line is implemented via the electrical contact of the temperature sensor 6 to the plate 5, the plate 5 and possibly a ground or other lines connected with the respective plate.

[0067] In the three-pole variant, the three-pole electrical line 11 provides two lines for signal lines and a line for supplying the temperature sensor 6 with power. This design is particularly advantageous if the temperature sensor 6 is electrically isolated or insulated from the plate 5.

[0068] Figure 5 A second embodiment of the proposed housing 1 and the proposed device 20 is shown, wherein again a cross section through a part of the housing 1 and the device 20 is shown.

[0069] Here, the second embodiment is an alternative to the first embodiment. The temperature sensors 6 are completely surrounded by the housing body 2, wherein the housing body 2 has a single-pole electrical line 9 to the respective temperature sensor 6. In other examples, the electrical line can be configured as a two-pole electrical line 10 or a three-pole electrical line 11.

[0070] In the single-pole variant, the single-pole electrical line 9 provides a first terminal line for the temperature sensor 6, wherein the second terminal line is implemented via the electrical contact of the temperature sensor 6 to the plate 5, the plate 5 and possibly a ground or other lines connected with the respective plate.

[0071] In a second sub-variant of the bipolar variant, the bipolar electrical line 10 provides one of the two signal lines and a line for supplying the temperature sensor 6 with power. The temperature sensor 6 is in electrical contact with the plate 5, such that the second terminal line is realized via the electrical contact of the temperature sensor 6 with the plate 5, the plate 5 and possibly a ground or other line connected with the respective plate. To this end, the housing body 2 has an electrically conductive material between the temperature sensor 6 and the support point 4 or the plate 5.

[0072] The housing body 2 has only a small thickness 16 between the temperature sensor 6 and the support point 4. This can be the case, for example, if the housing body 2 has dimensions in the range of centimeters or decimeters and has a thickness 16 in the range of millimeters, in particular in the range of a few millimeters, tenths of a millimeter or hundredths of a millimeter.

[0073] Figure 6 A perspective view showing a further embodiment of the proposed electrical device 20 is shown.

[0074] The housing body 2 is configured as a housing frame, which has the shape of a rectangular ring. Here, the housing body 2 is arranged on or fixed to the plate 5, such that the housing body 2 rests on the plate at the support points 4 realized as support surfaces. The plate 5 and the housing body 2 together have the shape of a flat shell, in which the electrical components 3 are arranged. Here, the electrical components 3 are likewise arranged on or fixed to the plate 5 and surrounded by the housing body.

[0075] The housing body 2 has a plurality of recesses 13, into which the connection pins 12 can be respectively introduced. Here, two adjacent recesses 13 have the same spacing 14 from one another. The recesses 13 are held according to a grid arrangement within two shown rows of recesses 13, but not between a pair of recesses 13, in which one recess 13 belongs to one row and the other recess 13 belongs to the other row.

[0076] The temperature sensor 6 is arranged in one of the recesses 13 and is electrically connected with the connection pin 12 arranged in said recess 13. To this end, the housing body 2 respectively has a unipolar electrical line 9 (not shown) to the respective temperature sensor 6. The temperature sensor 6 is preferably configured in one piece with the connection pin 12, such that the connection pin 12 configures said unipolar electrical line 9.

[0077] Here, the recesses 13 can be configured, for example, as cavities 8 as explained above and can in particular have a protrusion 19 for fixing the respective temperature sensor 6.

Claims

1. A housing (1) for an electrical device (20), comprising: - a housing body (2) which at least partially accommodates a respective electrical component (3) of the electrical device (20), wherein the housing body (2) has at least one bearing point (4) for bearing on a respective board (5) to which the electrical component (3) is connected; - at least one temperature sensor (6) for detecting the temperature of the respective board (5), wherein the respective temperature sensor (6) is arranged in the housing body (2) in the region of the respective bearing point (4), characterized in that the housing body (2) has a single-pole electrical line (9) to the respective temperature sensor (6) such that a first terminal line of the temperature sensor is realized by the single-pole electrical line (9) and a second terminal line of the temperature sensor is realized by the board.

2. The housing (1) according to claim 1, wherein The housing body (2) has an electrically insulating material (7).

3. The housing (1) according to claim 2, wherein The housing body (2) has an electrically insulating material (7) at least in the region of the respective bearing point (4).

4. The housing (1) according to any one of claims 1-3, wherein The respective temperature sensor (6) is arranged in a respective cavity (8) of the housing body (2).

5. The housing (1) according to claim 4, wherein The housing body (2) has at least two protrusions (19) for fixing the respective temperature sensor (6) in the respective cavity (8).

6. The housing (1) according to any one of claims 1-3, wherein The respective temperature sensor (6) is completely surrounded by the housing body (2).

7. The housing (1) according to any one of claims 1-3, further having a plurality of connection pins (12), wherein, The housing body (2) has a plurality of recesses (13) for accommodating a respective connection pin of the connection pins, wherein two adjacent recesses (13) each have the same spacing (14) from one another, and wherein the respective temperature sensor (6) is arranged in one of the recesses (13) and is electrically connected to at least one of the connection pins (12).

8. The housing (1) according to claim 7, wherein The respective temperature sensor (6) is configured in one piece with at least one connection pin (12).

9. An electrical device (20), comprising: - at least one electrical component (3), - at least one board (5) which is connected to the respective electrical component (3), - at least one housing (1) according to any one of the preceding claims, wherein the housing body (2) is arranged at the respective bearing point (4) on the respective board (5), wherein the housing body (2) has a single-pole electrical line (9) to the respective temperature sensor (6).

10. The electrical device (20) of claim 9, wherein, The respective board (5) is configured as a circuit carrier or a cooling body.

11. The electrical device (20) according to claim 9 or 10, wherein The respective electrical component (3) has at least one power module which is arranged on the respective board (5) or which comprises the respective board (5).

12. The electrical device (20) according to claim 9 or 10, wherein The respective electrical component (3) has at least one processor which is arranged on the respective board (5) or which comprises the respective board (5).

13. The electrical device (20) according to claim 9 or 10, wherein The respective temperature sensor (6) is arranged on the respective board (5) and / or Wherein, between the respective temperature sensor (6) and the respective plate (5) a material (15) with good thermal conductivity is arranged.

14. The electrical device (20) according to claim 9 or 10, wherein The electrical device (20) is configured as a power converter, a controller, a computer, a smartphone or a device for consumer electronics, building automation or smart home, or as a household appliance.

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