Film thickness measuring device
By using a nano-micro-power stage and an electric rotating sample stage in the film thickness measurement device, combined with a coarse and fine adjustment mechanism and an ultra-precision flat plate transmission, the stability problems of probe displacement and force control are solved, and nanometer-level detection accuracy and stability are achieved.
Patent Information
- Application Number
- CN202210247607.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-03-14
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2042-03-14
AI Technical Summary
During the detection process of existing film thickness measurement devices, the stability of probe displacement control and force control and the stability of the sample stage are difficult to ensure, which affects the accuracy and stability of the detection.
A nano-micro power stage and an electric rotating sample stage are set relative to each other, combined with coarse and fine adjustment mechanisms. The downward pressure distance and force of the probe are controlled by force sensors and displacement sensors, and the sample stage is driven to move by a mobile scanning stage to ensure the stability of the probe displacement and force control. An ultra-precision flat plate and synchronous belt drive mechanism are used to reduce the impact of motor vibration.
The pressure accuracy of the probe is stable at the mg level, the displacement detection accuracy is at the nm level, and the up and down jump of the sample stage during movement is at the nm level, meeting the detection accuracy and stability at the nanoscale.
Smart Images

Figure CN116026271B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of detection instruments, in particular to a film thickness measuring device. Background Art
[0002] The film thickness measuring device is a detection instrument that can be used to complete the characterization of material surface morphology and thickness measurement. It is mainly used to detect the surface profile of microelectronic devices, semiconductors, batteries, high-brightness light-emitting diodes and components in the field of materials science.
[0003] Film thickness measurement devices typically consist of a probe and a stylus, which is clamped and mounted on the probe. As the stylus slides across the surface being measured, the tiny peaks and valleys on the surface cause the stylus to move up and down along them, meaning the stylus can telescope relative to the probe. The motion of the stylus reflects the contours of the surface being measured.
[0004] Accurately measuring the relative motion value of the probe plays an important role in the overall detection result. Therefore, how to ensure the stability of the probe displacement control and force control during the detection process, as well as the stability of the sample stage, is a technical problem that technicians in this field need to solve. Summary of the Invention
[0005] Therefore, the object of the present invention is to provide a film thickness measuring device to ensure the stability of probe displacement control and force control, as well as the stability of the sample stage during the detection process.
[0006] The present invention provides a film thickness measuring device, comprising: a vibration-damping platform, a measuring device body;
[0007] The measuring device body is arranged on the vibration-damping table, and the measuring device body includes a base, a vertical microscope, a nano-micro power table, an electric rotating sample table, a mobile scanning table, and an XY electric table;
[0008] The vertical microscope, the nanometer micro-power stage, and the XY electric stage are all installed on the base, the mobile scanning stage is arranged on the XY electric stage, the electric rotating sample stage is arranged on the mobile scanning stage, and the nanometer micro-power stage is arranged opposite to the electric rotating sample stage;
[0009] The nanometer micro-power stage is connected to a probe, the vertical microscope is used to observe the sample on the electric rotating sample stage, and the nanometer micro-power stage is used to control the pressing distance and force of the probe;
[0010] The XY electric stage is used to drive the electric rotating sample stage to move to the sample placement position in the initial stage of the test. The electric rotating sample stage is used to place and rotate the sample. The mobile scanning stage is used to cooperate with the nano-micro power to drive the electric rotating sample stage to move during the scanning process after the position of the sample test is determined and the scanning path is planned.
[0011] As an optional embodiment, the nano-micro power stage includes a coarse adjustment mechanism and a fine adjustment mechanism. The coarse adjustment mechanism is used to preliminarily adjust the needle tip of the probe to the position of the sample on the electric rotating sample stage. The fine adjustment mechanism includes a force sensor and a displacement sensor. The fine adjustment mechanism is used to control the needle tip to continue to move downward and contact the sample through the force sensor and the displacement sensor after the coarse adjustment mechanism adjusts the needle tip to a certain position. The force sensor is used to control the force with which the needle tip contacts the sample, and the displacement sensor is used to adjust the up and down movement of the needle tip according to the feedback of the force to maintain a constant pressure.
[0012] As an optional implementation, the coarse adjustment mechanism is driven by piezoelectric ceramics or a motor.
[0013] As an optional implementation, the force sensor adopts any one of a capacitive sensor, a LVDT sensor, and a laser interferometer sensor, and the displacement sensor adopts any one of a capacitive sensor, a LVDT sensor, and a laser interferometer sensor.
[0014] As an optional embodiment, the mobile scanning platform includes a transmission mechanism, a guide mechanism, a table, and a leveling mechanism. The transmission mechanism is arranged on the guide mechanism, the table is arranged on the transmission mechanism, the electric rotating sample stage is arranged on the table, and the leveling mechanism is arranged at the bottom of the table.
[0015] As an optional embodiment, the transmission mechanism includes a driving wheel, a driven wheel, a pressure plate, a synchronous belt, and a sliding plate. The synchronous belt is arranged between the driving wheel and the driven wheel, and the pressure plate is used to fix the sliding plate on the synchronous belt.
[0016] As an optional embodiment, the guiding mechanism includes an ultra-precision flat plate, a friction plate, a side plate, and a base plate, the ultra-precision flat plate is arranged on the base plate, the side plates are arranged on both sides of the base plate, the friction plate is arranged on the ultra-precision flat plate, and the sliding plate can slide on the ultra-precision flat plate.
[0017] As an optional embodiment, the ultra-precision flat plate is a flat plate whose sliding surface reaches nanometer-level precision.
[0018] As an optional embodiment, the vertical microscope is provided with an electric focusing structure for vertical up and down movement and a manual adjustment structure for angular rotation.
[0019] As an optional implementation manner, wherein the base is a marble base, and the film thickness measuring device further includes a protective cover, and the protective cover is mounted outside the measuring device body.
[0020] According to the film thickness measuring device provided by the present invention, the nanometer micro-power stage and the electric rotating sample stage are arranged relative to each other, and the nanometer micro-power stage is connected to the probe. The downward pressing distance and force of the probe are controlled by the nanometer micro-power stage, which can effectively ensure the stability of the probe displacement control and force control during the detection process, so that the pressure accuracy of the probe is stabilized at the mg level, and the displacement detection accuracy of the probe is stabilized at the nm level. In addition, after the position of the sample test is determined and the scanning path is planned, the electric rotating sample stage is driven to move by the mobile scanning stage during the scanning process, which can ensure the stability of the sample stage, so that the up and down jumping of the sample stage during the movement is at the nm level, and ultimately can meet the nanometer scale detection accuracy and stability.
[0021] Additional aspects and advantages of the present invention will be set forth in part in the following description and, in part, will be obvious from the following description, or may be learned through embodiments of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The above and / or additional aspects and advantages of the embodiments of the present invention will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, in which:
[0023] Figure 1 1 is a schematic structural diagram of a film thickness measuring device provided by one embodiment of the present invention;
[0024] Figure 2 1 is a schematic structural diagram of a film thickness measuring device (excluding a protective cover) provided in one embodiment of the present invention;
[0025] Figure 3 yes Figure 2 Enlarged view of the middle circle A;
[0026] Figure 4 It is a structural diagram of the nano-micro power stage;
[0027] Figure 5 It is a structural diagram of the mobile scanning platform;
[0028] Figure 6 It is a structural diagram of the transmission mechanism;
[0029] Figure 7 It is a structural diagram of the guide mechanism. DETAILED DESCRIPTION
[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.
[0031] See also Figures 1 to 7 A film thickness measuring device provided by an embodiment of the present invention includes: a vibration-damping platform 10, a protective cover 20, a measuring device body 30, and a control device.
[0032] The protective cover 20 is sleeved on the measuring device body 30. The control device can be a computer, which is installed with software for controlling the film thickness measuring device. The software can be conventional software and will not be described in detail here.
[0033] The measuring device body 30 is disposed on the vibration-damping platform 10 , and includes a base 31 , a vertical microscope 32 , a nano-micro power stage 33 , an electric rotating sample stage 34 , a mobile scanning stage 35 , an XY electric stage 36 , and an auxiliary microscope 37 .
[0034] The vibration-isolating platform 10 is mainly used to isolate the influence caused by ground vibration; the protective cover 20 mainly plays the role of isolating and protecting the measuring device body 30.
[0035] Specifically, the base 31 is a marble base. The base 31 can be a gantry or other forms, mainly supporting other components, and needs to ensure a certain flatness.
[0036] The vertical microscope 32, nano-micro power stage 33, XY electric stage 36, and auxiliary microscope 37 are all installed on the base 31, the mobile scanning stage 35 is arranged on the XY electric stage 36, the electric rotating sample stage 34 is arranged on the mobile scanning stage 35, and the nano-micro power stage 33 and the electric rotating sample stage 34 are arranged opposite to each other.
[0037] The nano-micro power stage 33 is connected to the probe 301, and the vertical microscope 32 is used to observe the sample on the electric rotating sample stage 34. It has an electric focusing function. During the observation process, the XY electric stage 36 and the electric rotating sample stage 34 can be controlled by a computer to move the sample, and the control computer can realize the planning of the scanning path.
[0038] The auxiliary microscope 37 is used to observe the needle tip of the probe 301 and the sample on the electric rotating sample stage 34, and also has an electric focusing function.
[0039] The auxiliary microscope 37 is provided with an electric focusing structure for vertical movement and a manual adjustment structure for angular rotation to ensure accurate observation of the needle tip of the probe 301 connected to the nano-micro power stage 33 and the sample on the electric rotating sample stage 34.
[0040] The vertical microscope 32 is provided with an electric focusing structure for vertical up and down movement and a manual adjustment structure for angular rotation, so as to ensure that the microstructure of the sample on the electric rotating sample stage 34 can be clearly observed.
[0041] Specifically, the cursors in the camera images of the auxiliary microscope 37 and the vertical microscope 32 can control the XY motorized stage 36 to move the sample to the point on the sample structure that the user wishes to observe or scan. The cursor can be used to calibrate the probe tip according to the varying sample thicknesses. In practice, the cursor calibration function can be selected on the microscope interface. Clicking the position of the probe tip when it contacts the sample will cause the cursor to move to that position, completing the cursor calibration.
[0042] The nano-micro power stage 33 is used to control the pressing distance and force of the probe 301 .
[0043] The XY electric stage 36 is used to drive the electric rotating sample stage 34 to the placement position in the initial stage of the test. The electric rotating sample stage 34 is used to place and rotate the sample. The mobile scanning stage 35 is used to cooperate with the nano-micro power stage 33 to drive the electric rotating sample stage 34 to move during the scanning process after the position of the sample test is determined and the scanning path is planned.
[0044] It should be noted that the XY motorized stage 36 and the motorized rotating sample stage 34 are used to move the sample in and out and locate the sample. The mobile scanning stage 35 is used to move the sample during the scanning process after the XY motorized stage 36 and the motorized rotating sample stage 34 have located the sample test location and planned the scanning path. During this time, the XY motorized stage 36 and the motorized rotating sample stage 34 are stationary.
[0045] Specifically, the nano-micro power stage 33 includes a coarse adjustment mechanism 331 and a fine adjustment mechanism 332. The coarse adjustment mechanism 331 is used to preliminarily adjust the needle tip of the probe 301 to the position of the sample on the electric rotating sample stage 34. The fine adjustment mechanism 332 includes a force sensor and a displacement sensor. The fine adjustment mechanism 332 is used to control the needle tip to continue to move downward and contact the sample through the force sensor and the displacement sensor after the coarse adjustment mechanism 331 adjusts the needle tip to a certain position. The force sensor is used to control the force with which the needle tip contacts the sample, and the displacement sensor is used to adjust the up and down movement of the needle tip according to the feedback of the force to maintain a constant pressure at the mg level.
[0046] The coarse adjustment mechanism 331 can be driven by piezoelectric ceramics or a motor. The force sensor controls the force applied by the needle tip to the sample and can be stabilized at mg or higher. It can be a capacitive sensor, LVDT sensor, or laser interferometer. The displacement sensor can be a capacitive sensor, LVDT sensor, or laser interferometer.
[0047] Through the cooperation of the coarse adjustment mechanism 331 and the fine adjustment mechanism 332 , the pressure accuracy of the probe 301 can be stabilized at mg level, and the displacement detection accuracy of the probe 301 can be stabilized at nm level.
[0048] Specifically, the mobile scanning platform 35 includes a transmission mechanism 351, a guide mechanism 352, a table 353, and a leveling mechanism 354. The transmission mechanism 351 is arranged on the guide mechanism 352, the table 353 is arranged on the transmission mechanism 351, the electric rotating sample stage 34 is arranged on the table 353, and the leveling mechanism 354 is arranged at the bottom of the table 353.
[0049] The transmission mechanism 351 specifically includes a driving wheel 3511, a driven wheel 3512, a pressure plate 3513, a synchronous belt 3514, and a sliding plate 3515. The synchronous belt 3514 is arranged between the driving wheel 3511 and the driven wheel 3512, and the pressure plate 3513 is used to fix the sliding plate 3515 on the synchronous belt 3514.
[0050] The guide mechanism 352 specifically includes an ultra-precision flat plate 3521, a friction plate 3522, a side plate 3523, and a base plate 3524. The ultra-precision flat plate 3521 is arranged on the base plate 3524, the side plates 3523 are arranged on both sides of the base plate 3524, the friction plate 3522 is arranged on the ultra-precision flat plate 3521, and the sliding plate 3515 can slide on the ultra-precision flat plate 3521.
[0051] Specifically, ultra-precision plate 3521 features a sliding surface with nanometer-level precision and a low coefficient of friction, and can be made of glass. The ultra-precision plate 3521 can be secured to the base plate 3524 using various methods, including side mounting, front compression, and adhesive bonding, as needed. Friction plate 3522 utilizes a mechanical sliding track, ensuring oil-free lubrication and a wear-resistant, anti-stick, and non-marking material. The contact between friction plate 3522 and the ultra-precision plate 3521 and side plates 3523 can be point or surface contact; however, the flatness of all sliding surfaces must be maintained. Side plates 3523 can be made of common metal.
[0052] Since the ultra-precision plate 3521 is a plate with a sliding surface that achieves nanometer-level precision, and at the same time, the transmission of the transmission mechanism 351 is achieved by means of a synchronous belt, the influence of motor vibration on the transmission mechanism is isolated, and the problem of um-level jumps of the sample stage caused by the periodicity of the screw transmission and the vibration of the power source in the traditional structure is well solved. The mobile scanning stage 35 with the above structure can make the up and down jumps of the sample stage at the nm level during the movement process.
[0053] The usage process of the above-mentioned film thickness measuring device is as follows:
[0054] 1. Open the delivery port of the protective cover 20 and use the software in the control device to control the XY electric stage 36 to move the electric rotary sample stage 34 to the sample placement position;
[0055] 2. Place the sample on the motorized rotating sample stage 34;
[0056] 3. Close the delivery port of the protective cover 20 and use software to control the XY electric stage 36 to move the electric rotary sample stage 34 to the sample loading position;
[0057] 4. Observe the camera interface of the vertical microscope 32 and use the software to control the XY motorized stage 36 to move to the center of the vertical camera. The user uses the software to control the vertical camera to focus to a clear position based on the image on the camera interface. Observe the scanning situation in real time to determine whether the test position is correct and whether the probe has overshot when pressed down.
[0058] 5. Move the cursor in the vertical camera interface to control the precise movement of the XY motorized stage 36 and select the correction reference point and alignment point;
[0059] 6. Move the cursor in the vertical camera interface to select the sample scanning starting point, draw a scanning line segment or multiple scanning points; move the scanning stage 35 to standby at the scanning starting point; the nano-micro power stage 33 to standby at the origin;
[0060] 7. Click the scan function in the software;
[0061] 8. The nano-micro-power stage 33 controls the needle tip to press down to contact the sample at a certain pressure;
[0062] 9. The mobile scanning platform 35 completes the scanning action in sequence along the scanning line segment or path;
[0063] 10. During the scanning process, the camera interface can be switched to an auxiliary microscope 37 to observe the scanning process and determine whether it is necessary to switch modes and change scanning points;
[0064] 11. Move the scanning platform 35 to complete the scanning action;
[0065] 12. The nanometer micro-power stage 33 controls the needle tip to lift to the origin position;
[0066] 13. Move the scanning platform 35 back to the scanning starting point;
[0067] 14. The software data analysis interface is processed to obtain relevant data, and the data and picture formats can be selected for saving;
[0068] 15. Use software to control the XY electric stage 36 to move the electric rotary sample stage 34 to the sample placement position, open the delivery port of the protective cover 20, and remove the sample;
[0069] 16. Place the sample in the sample box;
[0070] 17. Close the delivery port of the protective cover 20 and use software to control the film thickness measuring device to return to its initial position;
[0071] 18. The scanning process is complete.
[0072] In summary, according to the film thickness measuring device provided by the present invention, the nano-micro power stage 33 and the electric rotating sample stage 34 are arranged opposite to each other, and the nano-micro power stage 33 is connected to the probe 301. The pressing distance and force of the probe 301 are controlled by the nano-micro power stage 33, which can effectively ensure the stability of the displacement control and force control of the probe 301 during the detection process, so that the pressure accuracy of the probe 301 is stable at the mg level, and the displacement detection accuracy of the probe 301 is stable at the nm level. In addition, after determining the position of the sample test and planning the scanning path, the electric rotating sample stage 34 is driven to move by the mobile scanning stage 35 during the scanning process, which can ensure the stability of the sample stage, so that the up and down jumping of the sample stage during the movement is at the nm level, and finally can meet the nanoscale detection accuracy and stability.
[0073] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
[0074] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.
Claims
1. A film thickness measuring device, characterized in that: include: Vibration-absorbing platform and measuring device body; The measuring device body is arranged on the vibration-damping table, and the measuring device body includes a base, a vertical microscope, a nano-micro power table, an electric rotating sample table, a mobile scanning table, and an XY electric table; The vertical microscope, the nanometer micro-power stage, and the XY electric stage are all installed on the base, the mobile scanning stage is arranged on the XY electric stage, the electric rotating sample stage is arranged on the mobile scanning stage, and the nanometer micro-power stage is arranged opposite to the electric rotating sample stage; The nanometer micro-power stage is connected to a probe, the vertical microscope is used to observe the sample on the electric rotating sample stage, and the nanometer micro-power stage is used to control the pressing distance and force of the probe; The XY electric stage is used to drive the electric rotary sample stage to move to the sample placement position in the initial stage of the test. The electric rotary sample stage is used to place and rotate the sample. The mobile scanning stage is used to cooperate with the nano-micro power stage to drive the electric rotary sample stage to move during the scanning process after the sample test position is determined and the scanning path is planned; The mobile scanning stage includes a transmission mechanism, a guide mechanism, a table, and a leveling mechanism. The transmission mechanism is arranged on the guide mechanism, the table is arranged on the transmission mechanism, the electric rotating sample stage is arranged on the table, and the leveling mechanism is arranged at the bottom of the table; The transmission mechanism includes a driving wheel, a driven wheel, a pressure plate, a synchronous belt, and a sliding plate. The synchronous belt is arranged between the driving wheel and the driven wheel, and the pressure plate is used to fix the sliding plate on the synchronous belt. The guide mechanism includes an ultra-precision flat plate, a friction plate, a side plate, and a base plate. The ultra-precision flat plate is arranged on the base plate, the side plates are arranged on both sides of the base plate, the friction plate is arranged on the ultra-precision flat plate, and the sliding plate can slide on the ultra-precision flat plate. The ultra-precision flat plate is a flat plate whose sliding surface reaches nanometer-level precision.
2. The film thickness measuring device according to claim 1, characterized in that The nano-micro power stage includes a coarse adjustment mechanism and a fine adjustment mechanism. The coarse adjustment mechanism is used to preliminarily adjust the needle tip of the probe to the position of the sample on the electric rotating sample stage. The fine adjustment mechanism includes a force sensor and a displacement sensor. After the coarse adjustment mechanism adjusts the needle tip to a certain position, the fine adjustment mechanism controls the needle tip to continue to move downward and contact the sample through the force sensor and the displacement sensor. The force sensor is used to control the force with which the needle tip contacts the sample, and the displacement sensor is used to adjust the needle tip to move up and down according to the feedback of the force to maintain a constant pressure.
3. The film thickness measuring device according to claim 2, characterized in that The coarse adjustment mechanism is driven by piezoelectric ceramics or a motor.
4. The film thickness measuring device according to claim 2, wherein: The force sensor adopts any one of a capacitance sensor, a LVDT sensor, and a laser interferometer sensor, and the displacement sensor adopts any one of a capacitance sensor, a LVDT sensor, and a laser interferometer sensor.
5. The film thickness measuring device according to claim 1, wherein The vertical microscope is provided with an electric focusing structure for vertical up and down movement and a manual adjustment structure for angle rotation.
6. The film thickness measuring device according to claim 1, characterized in that The base is a marble base, and the film thickness measuring device further comprises a protective cover, which is sleeved outside the measuring device body.
Citation Information
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