Method of decorating the base

Abstract

The invention relates to a method for decorating a substrate (1), comprising the following steps in succession: providing a substrate (1); depositing a sacrificial material layer (2) on the surface of the substrate (1); structuring the sacrificial material layer (2) to create a plurality of cavities (4) in the sacrificial material layer (2) to form a decorative or technical pattern (12); removing the sacrificial material layer (2) except at locations where the pattern (12) is provided.

Description

Technical Field

[0001] The present invention relates to a method for decorating a substrate. In particular, the present invention relates to a method capable of producing a matt or satin finish on a polished substrate, in particular a dial of a watch, and more generally on any external element of a timepiece, such as a bezel, a middle, a back, a link of a bracelet or a crystal. The invention is also applicable to any type of jewellery, in particular bracelets. Background Art

[0002] A technique currently used to make some areas of a substrate, such as a watch dial, have a visual appearance different from the rest of the substrate surface is to expose these areas, for example, to the action of a laser beam and then metallize these areas. The metallization operation is difficult to implement, especially because the areas to be metallized by means of laser beam etching usually have small dimensions, and it is therefore difficult to accurately deposit a metallization layer on these areas. In fact, the metallization layer sometimes exceeds the size of the substrate area treated with the aid of a laser beam on which these metallizations have been deposited, and encroaches on adjacent areas. On the contrary, the metallization layer may sometimes not completely cover the substrate area that should be metallized, so that these areas are still visible under the metallization layer. In both cases, the final appearance of the substrate treated in this way is not satisfactory, and the unignorable parts of these substrates should be discarded. Another disadvantage of this technology is that the substrate is changed by the laser etching operation. Summary of the invention

[0003] The present invention aims to overcome the above-mentioned problems and others by providing a method which is particularly capable of accurately decorating a substrate.

[0004] To this end, the present invention relates to a method for decorating a substrate, comprising the following steps in succession:

[0005] - providing a substrate;

[0006] - depositing at least one layer of sacrificial material on the substrate surface;

[0007] - structuring the layer of sacrificial material to create a plurality of cavities in this layer of sacrificial material to form a decorative or technical pattern;

[0008] - Removing the sacrificial material layer except where the pattern is provided.

[0009] According to a particular embodiment of the invention, the hollows have different depths.

[0010] According to another particular embodiment of the invention, at least some of the voids created in the sacrificial material layer pass through the sacrificial material layer as far as the substrate.

[0011] According to yet another particular embodiment of the invention, the layer of sacrificial material is deposited on the surface of the substrate by physical vapor deposition, by chemical vapor deposition or, when the substrate is conductive, by electroplating.

[0012] According to a further specific embodiment of the invention, the sacrificial material layer is produced by means of one or more metallic materials or oxides, nitrides, carbides or carboxinitrides of this or these metallic materials.

[0013] According to yet another specific embodiment of the present invention, the metallic material is selected from the group consisting of chromium, zirconium, titanium and aluminum.

[0014] According to yet another specific embodiment of the invention, the layer of sacrificial material has a thickness between 100 nm and 10 μm.

[0015] According to yet another specific embodiment of the invention, the layer of sacrificial material has a thickness between 500 nm and 2 μm.

[0016] According to yet another particular embodiment of the invention, the holes in the layer of sacrificial material are created by wet or dry chemical etching, by laser ablation or by photolithography.

[0017] According to a further particular embodiment of the invention, the wet or dry chemical etching affects the entire surface of the sacrificial material layer or is performed through openings in a mask which is arranged on the sacrificial material layer and whose contours correspond to the decorative or technical pattern which should be present in the sacrificial material layer.

[0018] According to another particular embodiment of the invention, the photolithography method consists in creating holes in the sacrificial material layer directly by ablation with the aid of a laser beam or by means of light radiation through openings in a mask which is arranged on the sacrificial material layer and whose contours correspond to the decorative or technical pattern that should be present in the sacrificial material layer.

[0019] According to a further particular embodiment of the invention, at least one additional finishing layer is deposited on the sacrificial material layer after structuring of the sacrificial material layer to create cavities therein and before removing the sacrificial material layer over the entire surface of the substrate except where the pattern is provided.

[0020] According to a further particular embodiment of the invention, the additional finishing layer is produced by means of one or more metallic materials or oxides, nitrides, carbides or carboxinitrides of these metallic materials.

[0021] According to yet another particular embodiment of the invention, the metal material used to produce the additional finishing layer is selected from the group consisting of chromium, zirconium, gold, titanium and aluminum.

[0022] According to yet another particular embodiment of the invention, after structuring of the sacrificial material layer and possible deposition of an additional finishing layer, the following steps are performed:

[0023] - depositing a photosensitive resin layer on the layer of sacrificial material which may be coated with an additional finishing layer;

[0024] - exposing the photosensitive resin layer directly to the action of a laser beam or selectively to optical radiation at locations corresponding to the decorative or technical pattern that should be present in the layer of sacrificial material;

[0025] - removing the photosensitive resin layer and the underlying sacrificial material layer which may be covered by an additional finishing layer at locations where the photosensitive resin layer was not exposed;

[0026] - Removing the remaining photosensitive resin layer at the location where the sacrificial material layer should remain.

[0027] According to yet another particular embodiment of the invention, the substrate is a watch case or an external element of an article of jewellery.

[0028] According to yet another particular embodiment of the invention, the substrate is a bridge, a plate, a bezel, a case middle, a crystal, a dial, a back or a bracelet link.

[0029] According to yet another particular embodiment of the invention, the substrate has a polished appearance.

[0030] Thanks to these characteristics, the invention provides a method particularly capable of decorating a substrate without modifying or changing the surface condition of such substrate. It should be understood in particular that, taking into account the fact that the method according to the invention consists in structuring the decorative or technical pattern not directly in the substrate but in a layer of material deposited on such substrate, it is independent of the nature of the material (sometimes extremely hard) of which the substrate is made, and that a wide range of materials can be used to make this layer in which the pattern is formed on the surface of the substrate. Moreover, this pattern has a matte to satin appearance that stands out clearly from the rest of the substrate surface, quite particularly when the substrate has a polished surface condition, through the aggregation of multiple reflections of ambient light in the cavities that form the pattern. It should also be pointed out that, whatever the mode of implementation considered, the method according to the invention makes it possible to overcome the problems of positioning accuracy that are often encountered when it is desired to decorate substrates such as watch dials or watch crystals. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Other features and advantages of the invention will become more apparent from the following detailed description of an embodiment of the decorating method according to the invention, which example is provided for illustrative and non-limiting purposes only, with reference to the accompanying drawings, in which:

[0032] - Figure 1is a cross-sectional view of a substrate having a layer of sacrificial material deposited on a surface of the substrate;

[0033] - Figure 2 Illustration of creating voids in a sacrificial material layer by immersing a substrate in a chemical etching bath;

[0034] - Figure 3 is similar to Figure 1 A view illustrating the step of structuring a layer of sacrificial material to create a plurality of cavities in such layer of sacrificial material to form a decorative or technical pattern;

[0035] - Figure 4 is similar to Figure 3 , which illustrates the step of depositing an additional finishing layer on the sacrificial material layer after structuring of the sacrificial material layer;

[0036] - Figure 5 is similar to Figure 4 A view illustrating the step of depositing a photosensitive resin layer on the additional finishing layer;

[0037] - Figure 6 is similar to Figure 5 , which illustrates the removal of the photosensitive resin layer in areas where the photosensitive resin layer is not exposed;

[0038] - Figure 7 is similar to Figure 6 A view illustrating the step of removing the sacrificial material layer and the finishing layer in the region where the photosensitive resin layer is not exposed;

[0039] - Figure 8 is similar to Figure 7 , which illustrates the removal of the residual photosensitive resin layer that has been exposed at the location where the sacrificial material layer has been structured and should remain to form a decorative pattern;

[0040] - Fig. 9 schematically illustrates a substrate coated with a layer of sacrificial material on which a first photosensitive resin layer is deposited;

[0041] - Fig.10 Illustration of a photosensitive resin layer selectively exposed to create voids;

[0042] - Fig.11 Illustrate development of the photosensitive resin layer so that first areas that were not exposed to light are removed and only second areas that were exposed to light remain;

[0043] - Fig.12 Illustrate a situation in which a sacrificial material layer is covered with at least one additional finishing layer after the voids intended to form a pattern have been created in the sacrificial material layer;

[0044] - Fig.13 is similar to Fig.12 , which illustrates the deposition of a second photosensitive resin layer on the additional finishing layer, wherein it is possible to distinguish between first areas that have not been exposed and second areas that have been exposed directly by means of a laser beam or through a mask and that correspond to the pattern that should be formed in the sacrificial material layer;

[0045] - Fig.14 is similar to Fig.13 , which illustrates the development of a photosensitive resin layer after it has been exposed directly by means of a laser beam or through a mask, removing first areas that have not been exposed and leaving only second areas that have been exposed to light and correspond to the desired pattern;

[0046] - Fig.15 is similar to Fig.14 , which illustrates the removal of portions of the photosensitive resin layer that have been exposed to light. DETAILED DESCRIPTION

[0047] The invention is based on the general inventive concept of producing a decorative or technical pattern on a substrate surface without modifying or changing the surface condition of the substrate. To this end, the invention proposes depositing a so-called sacrificial material layer on the substrate surface, in which a number of sufficiently deep cavities will be produced according to a layout corresponding to the shape of the desired decorative or technical pattern. One or more additional finishing layers can be applied to finish the surface condition and adjust the color of the underlying sacrificial material layer, and these clusters of cavities will form the desired pattern perceptible to the naked eye through the effect of multiple reflections of incident ambient light penetrating into these cavities. Furthermore, depending on the number and depth of these cavities, the desired pattern will have a matte or satin appearance in order to clearly stand out from the surrounding surface of the substrate structured with the pattern, in particular when the substrate has a polished surface condition.

[0048] Cross-sectional view of the substrate Figure 1 , which is indicated in its entirety by the general reference numeral 1. Preferably, but not necessarily, this substrate 1 has a polished surface condition. This substrate 1 may consist of any type of watchmaking component, such as, but not limited to, a bridge, a plate, a bezel, a case center, a mirror, a dial, a bottom cover or a strap connection. It may also consist of a jewellery item, such as a bracelet, a ring or a locket. More generally, a substrate in the present patent application is to be understood as any support capable of implementing the method according to the invention.

[0049] According to the present invention and Figure 1As shown in the figure, the substrate is covered by a sacrificial material layer 2. This sacrificial material layer 2 is made of a metal material preferably selected from chromium, chromium nitride, chromium oxynitride, zirconium, zirconium nitride and zirconium oxynitride. This sacrificial material layer 2 has a thickness generally between 100nm and 10μm, preferably between 500nm and 2μm. Of course, the thickness of the sacrificial material layer 2 can exceed these values. The sacrificial material layer 2 can also be obtained from at least two different metal materials or a combination of oxides, nitrides, carbides or carbonitride oxides of these metal materials.

[0050] The layer 2 of sacrificial material is deposited on the surface of the substrate 1 by any suitable technique, such as physical vapor deposition, chemical vapor deposition or, when the substrate 1 is conductive, by electroplating.

[0051] After depositing a sacrificial material layer 2 on the surface of the substrate 1 , the sacrificial material layer 2 is structured to create a plurality of cavities 4 therein.

[0052] The structuring of the cavities 4 in the sacrificial material layer 2 can be performed by any suitable technique. Figure 2 As shown in FIG, a substrate 1 coated with a sacrificial material layer 2 is immersed in a chemical etching bath 6, some areas of the sacrificial material layer 2 being masked as appropriate to be protected from the action of the bath 6. In this way, the surface of the sacrificial material layer 2 is exposed to the corrosive action of the bath 6. Since this chemical etching is not completely uniform and its effect depends in particular on the time that the substrate 1 remains in the bath 6, the cavities 4 formed in the sacrificial material layer 2 do not all have the same depth.

[0053] like Figure 3 As shown in FIG. 6 , once the substrate 1 is taken out from the chemical etching bath 6 , voids 4 with different depths are formed on the entire surface of the sacrificial material layer 2 exposed to the chemical etching, some of which may even penetrate the sacrificial material layer 2 to the substrate 1 .

[0054] According to another embodiment of the invention, not represented, instead of wet etching of the sacrificial material layer 2 , it is possible to carry out dry etching of this sacrificial material layer 2 by placing the substrate 1 in a corrosive gaseous atmosphere to create the cavity 4 .

[0055] According to a further embodiment of the invention which is not represented, instead of chemical etching of the sacrificial material layer 2 , it is also possible to structure such a sacrificial material layer 2 by ablation by means of a laser beam.

[0056] After the structuring of the cavities 4 in the sacrificial material layer 2, the sacrificial material layer 2 can preferably, but not necessarily, be Figure 42 is coated with at least one additional finishing layer 8. The additional finishing layer 8 can be deposited, for example, by physical or chemical vapor deposition. The additional finishing layer 8 can be made of the same material as the sacrificial material layer 2. The additional finishing layer 8 is made by means of any metallic material, metallic material oxinitride or alloy of metallic materials; it can in particular be made of gold, chromium, zirconium, titanium or aluminum. This at least one additional finishing layer 8 is intended to finish the surface condition and adjust the color of the underlying sacrificial material layer 2.

[0057] like Figure 5 As shown in , after the deposition of the additional finishing layer 8, a photosensitive resin layer 10 is deposited on this additional finishing layer 8. Thereafter, this photosensitive resin layer 10 is selectively exposed by means of optical radiation at locations corresponding to the decorative or technical pattern 12 that should be present in the sacrificial material layer 2. In the photosensitive resin layer 10, first areas 10A that have not been exposed to the optical radiation and second areas 10B that have been exposed to the optical radiation and correspond to the desired pattern 12 can thus be distinguished. The photosensitive resin layer 10 can be selectively exposed, for example, directly by means of a laser beam (whose movement is controlled by a computer) or by means of optical radiation (for example ultraviolet rays) transmitted through a mask, the openings of which correspond to the areas of the sacrificial material layer 2 that must remain in order to create the decorative or technical pattern 12 that should be present on the surface of the substrate 1.

[0058] After the selective exposure of the photosensitive resin layer 10, this photosensitive resin layer 10 is developed to remove the first areas 10A that have not been exposed to the ultraviolet radiation and only the second areas 10B that have been exposed to light and correspond to the desired pattern 12 remain (see Figure 6 ).

[0059] Then, if Figure 7 As shown in FIG. 1 , the portions of the sacrificial material layer 2 and the additional finishing layer 8 that are not covered by the photosensitive resin layer 10 are removed until the substrate 1 is exposed again.

[0060] at last( Figure 8 ), and then remove the second area 10B of the photosensitive resin layer 10 that has been exposed to the ultraviolet radiation.

[0061] The hollows 4 formed in the region of the sacrificial material layer 2 remaining on the surface of the substrate 1 do not all have the same depth, so that the decorative or technical pattern 12 formed by the network of hollows 4 has a matte or satin appearance that stands out clearly from the rest of the surface of the substrate 1, in particular when the substrate has a polished surface condition, through the effect of multiple reflections of incident light penetrating these hollows 4. In fact, the decorative or technical pattern 12 formed by the combination of hollows 4 has a matte or satin appearance, depending on the depth of these hollows 4, which forms a clear visual contrast with the brightness of the rest of the surface of the substrate 1 not covered by the sacrificial material layer 2.

[0062] It should also be noted that preferably, after the surface of the sacrificial material layer 2 has been exposed, for example, to the corrosive action of the bath 6, the voids 4 are structured in the sacrificial material layer 2 to form a network having dimensions greater than the dimensions of the desired final pattern 12. Subsequently, for the correct positioning of the pattern 12 relative to the substrate 1, it is very advantageous to provide a determined margin for the correct coordination of the substrate 1 relative to the mask through which the photosensitive resin layer is exposed.

[0063] exist Figures 9 to 15 Another embodiment of the present invention is illustrated in FIG. Fig. 9 In the present invention, a substrate 1 is coated with a sacrificial material layer 2, on which a first photosensitive resin layer 14 is deposited.

[0064] Afterwards, if Fig.10 As shown in , the photosensitive resin layer 14 is selectively exposed to create the cavity 4. This selective exposure of the photosensitive resin layer 14 can be performed, for example, directly with the aid of a laser beam or through a mask, the openings of which correspond to the areas of the sacrificial material layer 2 that should be retained. In the photosensitive resin layer 14, first areas 14A that have not been exposed to the selective illumination and second areas 14B that have been selectively illuminated and correspond to parts of the sacrificial material layer 2 that should be retained can therefore be distinguished.

[0065] After selective exposure, Fig.11 As shown in the figure, the photosensitive resin layer 14 is developed to remove the first area 14A and only the second area 14B that has been exposed to light remains. Then, the portion of the sacrificial material layer 2 that is not covered by the photosensitive resin layer 14 is removed by chemical etching until the substrate 1 is exposed again. Finally, the second area 14B of the photosensitive resin layer 14 that has been exposed to the selective light is removed again, so that only the portion of the sacrificial material layer 2 in which the cavity 4 has been constructed remains.

[0066] Afterwards, if Fig.12 Schematically shown in FIG. 1 , the substrate 1 is covered with at least one additional finishing layer 16, which itself is as shown in FIG. Fig.13 1 is covered with a second photosensitive resin layer 18. Thereafter, this second photosensitive resin layer 18 is selectively exposed, for example by means of a laser beam or through a mask, the openings of which correspond to the areas of the sacrificial material layer 2 that should remain in order to create a decorative or technical pattern 20 that should be present on the surface of the substrate 1.

[0067] After exposure, a first region 18A which has not been exposed to the selective illumination and a second region 18B which has been selectively illuminated and corresponds to the portion of the sacrificial material layer 2 and the additional finishing layer 8 which should be retained can be distinguished in the photosensitive resin layer 18. Fig.14 As shown in FIG. 1 , the photosensitive resin layer 18 is developed to remove the first regions 18A and only the second regions 18B that have been exposed to light remain.

[0068] Thereafter, the substrate 1 is chemically etched to remove the additional finishing layer 16 and the portion of the sacrificial material layer 2 not covered by the photosensitive resin. Fig.15 As shown in , a substrate 1 is obtained, some areas of which are exposed and have a polished appearance, while other areas of the substrate 1 are covered by a layer of sacrificial material 2 and then coated with an additional finishing layer 16 and cavities 4 are structured therein to form a decorative or technical pattern 20 with a satin or matte appearance.

[0069] Needless to say, the invention is not limited to the embodiment just described and a person skilled in the art may consider various simple modifications and variants without departing from the scope of the invention as defined in the appended claims. In particular, it should be understood that the first layer deposited on the substrate 1 is called a sacrificial material layer 2, because it is intended to be completely removed except for the location of the construction of the decorative or technical pattern 20. This is why this sacrificial material layer 2 is preferably made of a durable and inexpensive material. In addition, it should be noted that the thicker the sacrificial material layer 2, the easier it is to construct the cavity 4. However, it should be ensured that this sacrificial material layer 2 is not too thick, otherwise there is a risk of internal mechanical stresses appearing in the layer that can cause delamination problems. It should also be noted that the substrate 1 is preferably polished and / or opaque.

[0070] the term

[0071] 1. Base

[0072] 2. Sacrificial material layer

[0073] 4. Hollow

[0074] 6.bath

[0075] 8. Additional finishing layer

[0076] 10. Photosensitive resin layer

[0077] 10A. First Area

[0078] 10B. Second area

[0079] 12. Pattern

[0080] 14. First photosensitive resin layer

[0081] 14A. First Area

[0082] 14B. Second Area

[0083] 16. Additional finishing layer

[0084] 18. Second photosensitive resin layer

[0085] 18A. First Area

[0086] 18B. Second Area

[0087] 20. Pattern.

Claims

1. A method for decorating a substrate (1), comprising the following steps in succession: - providing a substrate (1); - depositing a layer of sacrificial material (2) on the surface of the substrate (1); - structuring the sacrificial material layer (2) to create a plurality of cavities (4) in the sacrificial material layer (2) to form a decorative or technical pattern (12; 20); - removing the layer of sacrificial material (2) except at the locations where the pattern (12; 20) is provided, in After structuring of the sacrificial material layer (2) to create the cavities (4) therein and before removing the sacrificial material layer (2) over the entire surface of the substrate (1) except at the locations where the pattern (12; 20) is provided, at least one additional finishing layer (8) is deposited on the sacrificial material layer (2) containing the cavities, After structuring of the sacrificial material layer (2) and deposition of the additional finishing layer (8), a photosensitive resin layer (10; 18) is deposited on the sacrificial material layer (2) coated with the additional finishing layer (8).

2. The method for decorating a substrate (1) according to claim 1, characterized in that Follow these steps: - exposing the photosensitive resin layer (10; 18) directly to the action of a laser beam or selectively to optical radiation at locations corresponding to the decorative or technical pattern (12; 20) that should be present in the layer of sacrificial material (2); - removing the photosensitive resin layer (10; 18) and the underlying sacrificial material layer (2) covered by the additional finishing layer (8) at the locations where the photosensitive resin layer (10; 18) is not exposed; - Removing the remaining photosensitive resin layer (10; 18) at the location where the sacrificial material layer (2) should remain.

3. A method for decorating a substrate (1) according to claim 1 or 2, characterised in that The additional finishing layer (8) is produced by means of one or more metallic materials or oxides, nitrides, carbides or oxycarbonitrides of these metallic materials.

4. The method for decorating a substrate (1) according to claim 3, characterized in that The metal material used to make the additional finishing layer (8) is selected from chromium, zirconium, gold, titanium and aluminum.

5. Method for decorating a substrate (1) according to any one of claims 1, 2 and 4, characterised in that The cavities (4) have different depths.

6. The method for decorating a substrate (1) according to claim 3, characterized in that The cavities (4) have different depths.

7. Method for decorating a substrate (1) according to any one of claims 1, 2, 4 and 6, characterised in that At least some of the cavities (4) created in the sacrificial material layer (2) pass through the sacrificial material layer (2) to the substrate (1).

8. The method for decorating a substrate (1) according to claim 3, characterized in that At least some of the cavities (4) created in the sacrificial material layer (2) pass through the sacrificial material layer (2) to the substrate (1).

9. The method for decorating a substrate (1) according to claim 5, characterized in that At least some of the cavities (4) created in the sacrificial material layer (2) pass through the sacrificial material layer (2) to the substrate (1).

10. Method for decorating a substrate (1) according to any one of claims 1, 2, 4, 6, 8 and 9, characterised in that A layer (2) of sacrificial material is deposited on the surface of the substrate (1) by physical vapor deposition, by chemical vapor deposition or, when the substrate (1) is conductive, by electroplating.

11. Method for decorating a substrate (1) according to any one of claims 1, 2, 4, 6, 8 and 9, characterised in that The sacrificial material layer (2) is produced by means of one or more metal materials or oxides, nitrides, carbides or oxycarbonitrides of these metal materials.

12. The method for decorating a substrate (1) according to claim 7, characterized in that The sacrificial material layer (2) is produced by means of one or more metal materials or oxides, nitrides, carbides or oxycarbonitrides of these metal materials.

13. The method for decorating a substrate (1) according to claim 11, characterized in that The metal material used to manufacture the sacrificial material layer (2) is selected from chromium, zirconium, titanium and aluminum.

14. The method for decorating a substrate (1) according to claim 12, characterized in that The metal material used to manufacture the sacrificial material layer (2) is selected from chromium, zirconium, titanium and aluminum.

15. The method for decorating a substrate (1) according to claim 11, characterized in that The sacrificial material layer (2) has a thickness between 100 nm and 10 μm.

16. The method for decorating a substrate (1) according to claim 12, characterized in that The sacrificial material layer (2) has a thickness between 100 nm and 10 μm.

17. The method for decorating a substrate (1) according to claim 13, characterized in that The sacrificial material layer (2) has a thickness between 100 nm and 10 μm.

18. The method for decorating a substrate (1) according to claim 14, characterized in that The sacrificial material layer (2) has a thickness between 100 nm and 10 μm.

19. Method for decorating a substrate (1) according to any one of claims 15 to 18, characterised in that The sacrificial material layer (2) has a thickness between 500 nm and 2 μm.

20. Method for decorating a substrate (1) according to any one of claims 1, 2, 4, 6, 8, 9 and 12 to 18, characterized in that The cavity (4) in the layer of sacrificial material (2) is created by wet or dry chemical etching or by laser ablation or by photolithography.

21. The method for decorating a substrate (1) according to claim 19, characterized in that The cavity (4) in the layer of sacrificial material (2) is created by wet or dry chemical etching or by laser ablation or by photolithography.

22. The method for decorating a substrate (1) according to claim 20, characterized in that Wet or dry chemical etching is performed over the entire surface of the sacrificial material layer (2) or through openings in a mask which is arranged on the sacrificial material layer and whose contour corresponds to the decorative or technical pattern (12; 20) to be present in the sacrificial material layer (2).

23. A method for decorating a substrate (1) according to claim 21, characterised in that Wet or dry chemical etching is performed over the entire surface of the sacrificial material layer (2) or through openings in a mask which is arranged on the sacrificial material layer and whose contour corresponds to the decorative or technical pattern (12; 20) to be present in the sacrificial material layer (2).

24. The method for decorating a substrate (1) according to claim 20, characterized in that The photolithography method consists in creating a cavity (4) in a layer of sacrificial material (2) directly by ablation with a laser beam or by light radiation through openings in a mask which is arranged on the layer of sacrificial material (2) and whose contours correspond to the decorative or technical pattern (12; 20) to be present in the layer of sacrificial material.

25. The method for decorating a substrate (1) according to claim 21, characterized in that The photolithography method consists in creating a cavity (4) in a layer of sacrificial material (2) directly by ablation with a laser beam or by light radiation through openings in a mask which is arranged on the layer of sacrificial material (2) and whose contours correspond to the decorative or technical pattern (12; 20) to be present in the layer of sacrificial material.

26. Method for decorating a substrate (1) according to any one of claims 1, 2, 4, 6, 8, 9, 12 to 18 and 21 to 25, characterised in that The base (1) is the outer element of a watch case or jewelry item.

27. Method for decorating a substrate (1) according to claim 26, characterised in that The base (1) is a bridge, a plate, a bezel, a case center, a mirror, a dial, a bottom cover or a strap connection.

28. Method for decorating a substrate (1) according to claim 26, characterised in that The substrate (1) has a polished and / or opaque appearance.

29. Method for decorating a substrate (1) according to claim 27, characterised in that The substrate (1) has a polished and / or opaque appearance.

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