Wafer automatic conveying equipment for semiconductor industry

Abstract

The application discloses a wafer automatic conveying equipment for the semiconductor industry, and relates to the technical field of conveying equipment.The step-by-step feeding mode is adopted, the single wafer body is exposed to the upper side position of the stacking table in the single feeding process, the wafer body located at the uppermost side is pushed out in the pushing mode, and is dropped into the supporting structure in the dropping mode, and the wafer body is preliminarily positioned through a plurality of side stop levers.When the wafer body is clamped, adsorbed and fixed, the bidirectional symmetrical contact mode is adopted to clamp the wafer body, the force on the two side surfaces of the wafer body is in a relatively balanced state, the problem that the wafer body is damaged is avoided, finally, the wafer body is adsorbed and fixed through the suction cup body by using the principle of negative pressure adsorption, and the wafer body is evenly laid in the dropping position or the grabbing position in the distribution disc through the rotating mode.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of conveying equipment, in particular to a wafer automatic conveying equipment for semiconductor industry. BACKGROUND

[0002] The wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits in the semiconductor industry, and the wafer is obtained through four parts of silicon wafer preparation, chip design, chip testing and chip packaging. The silicon wafer is obtained through cutting, grinding, polishing and cleaning of a silicon crystal bar. Subsequently, in the etching, cleaning, oxidation, photolithography and ion implantation steps in the chip design and chip testing, an automatic transmission mode is mostly adopted. Referring to the method and device for wafer automatic batch and conveying in CN105097624A, the final purpose is to speed up the production efficiency.

[0003] The wafer is divided into 4-inch, 5-inch, 6-inch, 8-inch and other specifications according to its diameter, and the thickness is mostly below 0.8mm. The wafer has a brittle and hard characteristic. Therefore, in the actual wafer conveying process, if the clamping mechanism of the wafer is unbalanced, for example, when a suction cup is used to adsorb the wafer, the suction cup needs to be directly attached to the wafer, and the wafer is in a semi-suspended state relative to the suction cup. The wafer is not completely laid on the suction cup. If the force of the suction cup contacting the wafer is unbalanced at this time, two problems will occur. First, the suction cup cannot firmly adsorb the wafer, resulting in the wafer falling off during the conveying process. Second, the force of the suction cup contacting the wafer is too large, directly pressing against the wafer. The force generated by the contact will be directly transmitted to the wafer, causing the wafer to crack, micro-crack, delamination and other defects, directly affecting the overall mechanical properties, and being not conducive to the subsequent scribing process.

[0004] In view of the above technical problems, the present application provides a solution. SUMMARY

[0005] The present application aims to provide a wafer automatic conveying equipment for semiconductor industry, which is used to solve the problem that in the current wafer processing process, the automatic conveying step, because the wafer itself has a brittle and hard characteristic, when the external force is unbalanced during the conveying of the wafer, it will directly affect the mechanical properties of the wafer, causing cracking, micro-cracking, delamination and other defects.

[0006] The purpose of the application can be realized by the following technical scheme: including a distribution table, a vertical wall support welded outside the distribution table and a terminal grabbing structure, a distribution conveying structure is arranged in the distribution table, a lifting structure is arranged on the vertical wall support, a rotating table is arranged on the outer wall of one side of the vertical wall support, an L-shaped rotating frame is arranged on the vertical wall support, a pushing structure is arranged on the L-shaped rotating frame, a material supporting structure is arranged on the rotating table, a plurality of wafer bodies are stacked in the lifting structure in the vertical direction, the distribution conveying structure comprises a distribution disc, a driving gear and a first stepping motor, a plurality of material openings are formed in the distribution disc, the diameters of the plurality of material openings are matched with the wafer bodies, and the plurality of material openings are arranged in a circular array around the center point of the distribution disc, a material falling position and a grabbing position are arranged in the plurality of material openings, and the material falling position and the grabbing position are matched with the material supporting structure and the terminal grabbing structure respectively.

[0007] Further arrangement: the lifting structure comprises two stacking plates, two second stepping motors and a screw rod, the two stacking plates are arranged in mirror symmetry on the vertical wall support, and the stacking plates are slidingly connected to the upper surface position of the vertical wall support, threaded positioning blocks are installed on the center points of the lower surfaces of the two stacking plates, the screw rod is threadedly connected with the two threaded positioning blocks, and the screw thread tapping directions of the two threaded positioning blocks are opposite.

[0008] Further arrangement: cavities are formed in the middle sections of the interiors of the two stacking plates, a plurality of synchronous roller shafts are installed in the cavities in the vertical direction, synchronous belts are arranged on the exteriors of the plurality of synchronous roller shafts, two supporting blocks are symmetrically arranged and installed on the upper surface position of the stacking plate along the synchronous roller shafts, the synchronous roller shaft located on the upper side is rotatably connected to the supporting block, the second stepping motor is installed on the upper surface position of the stacking plate, and the output end of the second stepping motor is fixedly connected with the synchronous roller shaft located on the upper side through the supporting block.

[0009] Further arrangement: a lower material supporting block is installed on the synchronous belt, the inner walls of the two stacking plates are arc-shaped, a plurality of inner top position columns are installed on the inner walls in the vertical direction, the circumferential outer wall of the inner top position column, the inner curved surface of the lower material supporting block and the outer contour surface of the wafer body are in contact, two limiting lever rods are symmetrically arranged on the upper surfaces of the two stacking plates, and the upward stroke of the lower material supporting block by the second stepping motor is the thickness of the wafer body.

[0010] Further arrangement: the pushing structure comprises a second linear motor, an upper material supporting block and a six-star disc, the second linear motor moves horizontally on the L-shaped rotating frame in the direction close to the rotating table, the second linear motor is fixedly connected with the upper material supporting block, one corner position of the six-star disc is connected with the upper material supporting block, and the center point of the six-star disc and the center point of the wafer body are on the same vertical axis.

[0011] Further arrangement: the upper top block lower surface and the lower surface of the wafer body located on the upper side are in the same horizontal plane.

[0012] Further arrangement: a third stepper motor is installed on the middle section of the rotating table, the output shaft of the third stepper motor is connected with the vertical wall support, the material supporting structure includes a mounting plate, an air pump, a suction disc body, and a mounting sleeve installed on the center point position of the upper surface of the mounting plate, a first electric telescopic cylinder is installed in the mounting sleeve, the transmission shaft of the first electric telescopic cylinder extends upward through the mounting sleeve, and the transmission shaft of the first electric telescopic cylinder is connected with the center point of the suction disc body, the suction disc body is matched with the six-star disc, a first linear motor is installed on the center point position of the lower surface of the mounting plate, and the mounting plate moves horizontally through the first linear motor.

[0013] Further arrangement: the mounting plate is symmetrically arranged with connecting blocks on the upper surface along the moving direction, movable frames are rotatably installed on the two connecting blocks, lower material supporting rods are rotatably installed on the upper ends of the movable frames, and torsion springs are installed on the middle section positions of the movable frames, one end of the torsion spring is installed on the mounting plate.

[0014] Further arrangement: second electric telescopic cylinders are installed on the two end positions of the upper surface of the rotating table, sliding blocks are installed on the end positions of the transmission shafts of the second electric telescopic cylinders, the sliding blocks are slidingly connected on the rotating table, the advancing direction of the sliding blocks is perpendicular to the advancing direction of the second linear motor, a plurality of vertical side stop rods are installed on the upper surface of the sliding block, and the plurality of side stop rods are in contact with the outer contour surface of the wafer body.

[0015] During the conveying process of the plurality of wafer bodies, the following steps are included:

[0016] Step one: the wafer bodies are stacked in the middle part of the two stacking plates in the vertical direction, and the single wafer body is moved in the direction from top to bottom through the lifting structure;

[0017] Step two: the wafer body located on the uppermost position of the two stacking plates is pushed to the upper side position of the lower material supporting rod in the material supporting structure by the pushing structure, and the wafer body is adsorbed and fixed by the suction disc body in the material supporting structure;

[0018] Step three: the rotating table rotates 180° in the clockwise or counterclockwise direction, so that the center point position of the material supporting structure is aligned with the dropping position on the distributing disc, the suction disc body in the material supporting structure releases the wafer body, and the wafer body falls into the dropping position on the distributing disc;

[0019] Step four: the rotating table rotates 180° again in the clockwise or counterclockwise direction until the rotating table and the material supporting structure return to the initial position, the first stepping motor in the material distributing table drives the material distributing disc to rotate, so that the wafer body placed in the material distributing disc is located directly below the grabbing structure of the terminal grabbing structure, and the wafer body located in the grabbing position is grabbed by the grabbing structure of the terminal grabbing structure.

[0020] The present application has the following advantages:

[0021] 1、The present application places multiple wafer bodies into two stacking plates, and the lifting structure lifts the stacked wafer bodies by a certain distance, and the lifting distance is equal to the thickness of the wafer body, so that the single wafer body is exposed to the upper surface of the stacking plate, and finally the exposed wafer body is pushed out of the next step by the pushing structure. In the batch wafer body conveying process, single wafer conveying can be performed, and the wafer body is dropped into the next step in the dropping mode. The above process is not affected by external force;

[0022] 2、When the wafer body is clamped and fixed in the rotating table, the position of the wafer body is first preliminarily positioned, mainly by two second electric telescopic cylinders and a first electric telescopic cylinder to position the position of the wafer body, and finally the six-star disc cooperates with the suction disc body to complete the clamping and positioning of the wafer body, so that the suction disc body can fully contact the lower surface of the wafer body, and the suction and fixation of the wafer body are completed. The whole process adopts a bidirectional symmetrical contact mode to complete the clamping of the wafer body, so that the force on the two side surfaces of the wafer body is in a relatively balanced state, so that the wafer body is not affected by external force and defects are not generated. Finally, the single wafer body is placed in the dropping position or the grabbing position of the material distributing disc. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0024] Figure 1 A structure diagram of a wafer automatic conveying equipment for the semiconductor industry is provided.

[0025] Figure 2 A sectional view of a material distributing table component in a wafer automatic conveying equipment for the semiconductor industry is provided.

[0026] Figure 3A structure diagram of a vertical wall support component in a wafer automatic conveying equipment for the semiconductor industry is provided in the present application.

[0027] Figure 4 A structure diagram of a material stacking plate component in a wafer automatic conveying equipment for the semiconductor industry is provided in the present application.

[0028] Figure 5 A structure diagram of an L-shaped rotating frame component in a wafer automatic conveying equipment for the semiconductor industry is provided in the present application.

[0029] Figure 6 A sectional view of a material stacking plate component in a wafer automatic conveying equipment for the semiconductor industry is provided in the present application.

[0030] Figure 7 A partial sectional view of a rotating table component in a wafer automatic conveying equipment for the semiconductor industry is provided in the present application.

[0031] Figure 8 A structure diagram of a mounting plate component in a wafer automatic conveying equipment for the semiconductor industry is provided in the present application.

[0032] Figure 9 A sectional view of a wafer body component in a wafer automatic conveying equipment for the semiconductor industry is provided in the present application.

[0033] In the figure: 1, a material distribution table; 2, a material distribution disc; 3, a driving gear; 4, a terminal material grabbing structure; 5, a first linear motor; 6, a vertical wall support; 7, a material stacking plate; 8, a rotating table; 9, a first stepping motor; 10, an L-shaped rotating frame; 11, a second linear motor; 12, a wafer body; 13, an air pump; 14, a second electric telescopic cylinder; 15, a limiting lever; 16, a threaded positioning block; 17, a screw rod; 18, a six-star disc; 19, an upper material lifting block; 20, a second stepping motor; 21, a supporting block; 22, a synchronous roller; 23, a synchronous belt; 24, a lower material lifting block; 25, an inner lifting column; 26, a third stepping motor; 27, a side stop lever; 28, a sliding block; 29, a lower material lifting rod; 30, a suction disc body; 31, a first electric telescopic cylinder; 32, a mounting sleeve; 33, a movable frame; 34, a connecting block; 35, a mounting plate; 36, a curved spring. DETAILED DESCRIPTION

[0034] The technical solutions of the present application will be described clearly and completely below in conjunction with the embodiments. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0035] Embodiment 1

[0036] Wafer, in the literal sense, its essence is a circular silicon wafer, in the production of wafer processing, in order to improve production efficiency, so the current wafer feeding mode is optimized and improved, as follows:

[0037] Referring to Figures 1-9 , a kind of wafer automatic conveying equipment for semiconductor industry in the embodiment, including distribution table 1, welded in the distribution table 1 outside vertical wall support 6 and terminal grabbing structure 4, distribution table 1 is provided with distribution conveying structure, vertical wall support 6 is provided with lifting structure, and vertical wall support 6 one side outer wall is provided with rotating table 8, vertical wall support 6 is provided with L type rotating frame 10, L type rotating frame 10 is provided with pusher structure, rotating table 8 is provided with supporting structure, lifting structure is sequentially stacked with multiple wafer bodies 12 in vertical direction, distribution conveying structure includes distribution disc 2, driving gear 3 and first stepper motor 9, distribution disc 2 is provided with multiple material ports, the diameter of multiple material ports is matched with wafer body 12, and multiple material ports are arranged in annular array along the center point of distribution disc 2, multiple material ports are provided with dropping position and grabbing position, dropping position and grabbing position are matched with supporting structure and terminal grabbing structure 4 respectively.

[0038] Multiple wafer bodies 12 in conveying process, specifically including the following steps:

[0039] Step one: wafer body 12 is stacked in the middle part of two stacking plates 7 along the vertical direction, single wafer body 12 is moved in lifting structure from top to bottom direction successively;

[0040] Step two: wafer body 12 located in the uppermost position of two stacking plates 7 is pushed to the upper side position of the lower supporting rod 29 in supporting structure by pusher structure, and wafer body 12 is adsorbed and fixed by suction disc body 30 in supporting structure;

[0041] Step three: rotating table 8 rotates 180 ° along clockwise or counterclockwise direction, so that the center point position of supporting structure is aligned with dropping position on distribution disc 2, suction disc body 30 in supporting structure releases wafer body 12, wafer body 12 falls into dropping position on distribution disc 2;

[0042] Step four: rotating table 8 rotates 180 ° again along clockwise or counterclockwise direction, until rotating table 8 and supporting structure return to initial position, first stepper motor 9 in distribution table 1 drives distribution disc 2 to rotate, so that wafer body 12 placed in distribution disc 2 is located in the position directly below grabbing structure in terminal grabbing structure 4, and wafer body 12 located in grabbing position in terminal grabbing structure 4 is grabbed by grabbing structure.

[0043] Working principle: when the wafer body 12 is transported and fed, first, a plurality of wafer bodies 12 are stacked in the lifting structure in turn, the single wafer body 12 is moved upward in the manner of step one, and the exposed wafer body 12 is pushed to the material supporting structure by the pushing structure, until the single wafer body 12 is moved to the material supporting structure, the wafer body 12 is clamped, adsorbed and fixed by the material supporting structure, finally, the wafer body 12 fixed by the material supporting structure is put into the dropping position on the material distribution disc 2 according to steps three and four;

[0044] When the first stepping motor 9 is started, the material distribution disc 2 can be rotated one by one to make the wafer body 12 in one dropping position be grabbed by the terminal grabbing structure 4, then the empty dropping position is rotated to the initial position again, until the wafer body 12 grabbed by the material supporting structure is put into the dropping position on the rotating table 8, and the transmission and feeding process is carried out in this way.

[0045] Embodiment two

[0046] As described in the transmission mode of embodiment one, because the thickness of the wafer body is mostly below 0.8mm, it has the characteristics of brittleness and hardness, so in the wafer body processing process and the feeding step, when the wafer body is clamped and fixed, such as the suction cup adsorption structure, when the suction cup contacts the wafer body and the force of the suction cup acting on the wafer body is unbalanced, the wafer body will have crack and other defect problems, so the fixing process is improved as follows:

[0047] Reference Figure 1 , Figure 3 , Figure 7 and Figure 8, the third stepper motor 26 is installed on the middle position of the rotating table 8, the output shaft of the third stepper motor 26 is connected with the vertical wall support 6, the material supporting structure includes a mounting plate 35, an air pump 13, a suction disc body 30 and a mounting sleeve 32 installed on the center point position of the upper surface of the mounting plate 35, a first electric telescopic cylinder 31 is installed in the mounting sleeve 32, the transmission shaft of the first electric telescopic cylinder 31 extends upwardly through the mounting sleeve 32, and the transmission shaft of the first electric telescopic cylinder 31 is connected with the center point of the suction disc body 30, the suction disc body 30 is matched with the six-star disc 18, a first linear motor 5 is installed on the center point position of the lower surface of the mounting plate 35, and the mounting plate 35 moves horizontally through the first linear motor 5, the connecting blocks 34 are symmetrically arranged on the upper surface of the mounting plate 35 along the moving direction of the mounting plate 35, the movable frames 33 are rotatably installed on the two connecting blocks 34, the lower material supporting rods 29 are rotatably installed on the upper ends of the movable frames 33, a torsion spring 36 is installed on the middle position of the movable frame 33, one end of the torsion spring 36 is installed on the mounting plate 35, second electric telescopic cylinders 14 are installed on the two end positions of the upper surface of the rotating table 8, sliding blocks 28 are installed on the end positions of the transmission shafts of the second electric telescopic cylinders 14, the sliding blocks 28 are slidingly connected on the rotating table 8, the advancing directions of the sliding blocks 28 are perpendicular to the advancing direction of the second linear motor 11, and a plurality of vertical side stop rods 27 are installed on the upper surface of the sliding block 28 and are in contact with the outer contour surface of the wafer body 12.

[0048] Working principle: when the wafer body 12 is pushed into the suction disc body 30, first, the position of the suction disc body 30 is lower than the lower material supporting rods 29, the wafer body 12 first contacts the lower material supporting rods 29, so that the wafer body 12 slowly slides onto the two lower material supporting rods 29, in this process, first, the two second electric telescopic cylinders 14 are started, so that the side stop rods 27 on the two sliding blocks 28 slowly approach the wafer body 12, thereby slowly moving the initial position of the wafer body 12;

[0049] Then, the first linear motor 5 is started to drive the whole mounting plate 35 to move, the center points of the six-star disc 18, the wafer body 12 and the suction disc body 30 are on the same vertical axis, so the six-star disc 18 and the suction disc on the suction disc body 30 are matched and positioned with each other;

[0050] Finally, the first electric telescopic cylinder 31 is started to hold the wafer body 12 and slowly move it upward until it is close to the six-star disc 18. At this time, the wafer body 12 is pressed by the chuck body 30 and the six-star disc 18 on the upper and lower sides respectively. The chuck body 30 and the six-star disc 18 press the wafer body 12 at the same position points, and the pressure on each position point is relative. Therefore, the wafer body 12 bears the same pressure on the upper and lower sides, and the forces on the two sides are in a relative balance state, so that the chuck on the chuck body 30 is fully adsorbed on the wafer body 12. The air pump 13 is started to complete the adsorption and fixation of the wafer body 12 by the chuck on the chuck body 30.

[0051] Subsequently, the second linear motor 11 drives the six-star disc 18 to reset, and the third stepper motor 26 is started to drive the rotating table 8 to rotate 180°. At this time, the wafer body 12 is located on the dropping position on the distribution disc 2. The air pump 13 is started again to separate the chuck on the chuck body 30 from the wafer body 12. The wafer body 12 falls into the dropping position. Then, the third stepper motor 26 is started again to drive the rotating table 8 to rotate reversely by 180°, so that the whole rotating table 8 returns to the original position.

[0052] Example Three

[0053] In Example One, the batch of wafer bodies are stacked together. In order to cooperate with the clamping and adsorption fixation process of the wafer body in Example Two, the following improvement scheme is proposed for the feeding mode in the example:

[0054] With reference to Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figure 6 and Figure 9The lifting structure comprises two stacking plates 7, two second stepping motors 20 and a screw rod 17. The two stacking plates 7 are symmetrically arranged on the vertical wall support 6 and are slidingly connected to the upper surface of the vertical wall support 6. Threaded positioning blocks 16 are installed at the center points of the lower surfaces of the two stacking plates 7. The screw rod 17 is threadedly connected to the two threaded positioning blocks 16. The screw threads of the two threaded positioning blocks 16 are opposite to each other. Cavities are formed in the middle sections of the two stacking plates 7. A plurality of synchronous roller shafts 22 are sequentially and vertically arranged in the cavities. The synchronous roller shafts 22 are externally provided with synchronous belts 23. Two support blocks 21 are symmetrically arranged on the upper surface of the stacking plate 7 along the synchronous roller shafts 22. The synchronous roller shaft 22 located at the upper side is rotatably connected to the support block 21. The second stepping motor 20 is installed on the upper surface of the stacking plate 7. The output end of the second stepping motor 20 is fixedly connected to the synchronous roller shaft 22 located at the upper side through the support block 21. The synchronous belt 23 is provided with a lower material supporting block 24. The inner walls of the two stacking plates 7 are arc-shaped. A plurality of inner top pillars 25 are vertically arranged on the inner walls of the two stacking plates 7. The circumferential outer wall of the inner top pillar 25 and the inner curved surface of the lower material supporting block 24 are in contact with the outer profile surface of the wafer body 12. Two limiting levers 15 are symmetrically arranged on the upper surface of the two stacking plates 7. The upward moving distance of the lower material supporting block 24 by the second stepping motor 20 is equal to the thickness of the wafer body 12.

[0055] The pushing structure comprises a second linear motor 11, an upper material supporting block 19 and a six-star disc 18. The second linear motor 11 moves horizontally on the L-shaped rotating frame 10 towards the rotating table 8 and is fixedly connected to the upper material supporting block 19. The six-star disc 18 is connected to the upper material supporting block 19 at an angle. The center point of the six-star disc 18 and the center point of the wafer body 12 are on the same vertical axis. The lower surface of the upper material supporting block 19 and the lower surface of the wafer body 12 located at the upper side are on the same horizontal plane.

[0056] Working principle: Rotate the screw rod 17. Drive the two stacking plates 7 to move towards each other or away from each other through the threaded positioning blocks 16, so that the inner walls of the stacking plates 7 match the diameter of the wafer body 12. Then, move the limiting levers 15 and the L-shaped rotating frame 10. Stack a plurality of wafer bodies 12 on the two stacking plates 7 in sequence and restore the limiting levers 15 and the L-shaped rotating frame 10 to the original position.

[0057] The wafer body 12 located at the lowermost side is supported by the two lower material supporting blocks 24.

[0058] When conveying, start the second stepping motor 20 to move the plurality of wafer bodies 12 upwards one by one. The moving distance is equal to the thickness of the wafer body 12.

[0059] Until the uppermost wafer body 12 contacts the limiting lever 15, at this time the upper ejector block 19 and the six-star disc 18 contact the side position and the upper surface position of the wafer body 12 respectively, in this state, the second stepper motor 20 is paused, and the second linear motor 11 is started, and the wafer body 12 in the uppermost position is pushed out to the position of the suction disc body 30 by the upper ejector block 19;

[0060] After the above process is completed, the second linear motor 11 drives the upper ejector block 19 and the six-star disc 18 to return to the initial position, and the second stepper motor 20 is started again, and the wafer body 12 is pushed out to the upper side position of the stacking plate 7 in the from bottom to top manner.

[0061] In summary: when the wafer body is clamped and fixed in the rotating table, the position of the wafer body is first preliminarily positioned, mainly through the two second electric telescopic cylinders and the first electric telescopic cylinder to position the position of the wafer body, and finally the six-star disc cooperates with the suction disc body to complete the clamping and positioning of the wafer body, so that the suction disc body can fully contact the lower surface of the wafer body, and the adsorption and fixation of the wafer body is completed, the whole process adopts the bidirectional symmetrical contact mode to complete the clamping of the wafer body, and the force on the two side surfaces of the wafer body is in a relatively balanced state, so that the wafer body is not affected by external force and defects are not generated on the wafer body, and finally the single wafer body is sequentially placed into the dropping position or the grabbing position in the distributing disc.

[0062] The above content is only an example and description of the structure of the present application, and those skilled in the art can make various modifications or supplements or adopt similar ways to replace the described specific embodiments, as long as they do not deviate from the structure of the present application or exceed the scope defined by the present claims, which shall belong to the protection scope of the present application.

[0063] In the description of the present specification, the description of the terms "one embodiment", "example", "specific example" and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are contained in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0064] The preferred embodiments of the application disclosed above are only to facilitate the elucidation of the application. The preferred embodiments do not describe all the details of the application and limit the application to the specific embodiments. Obviously, many modifications and variations can be made in light of the teachings above. The description is chosen and described in order to provide the best illustration of the application and its practical application to those skilled in the art and to enable those skilled in the art to utilize the application in its best mode. The application is only limited by the claims and their full scope and equivalents.

Claims

1. A wafer automatic transfer equipment for semiconductor industry, characterized by, The utility model provides a kind of terminal material grabbing structure, including material distribution table (1), welding in the material distribution table (1) outside vertical wall support (6) and terminal grabbing structure (4), the material distribution table (1) is provided with material distribution conveying structure, the vertical wall support (6) is provided with lifting structure, and vertical wall support (6) one side outer wall is provided with rotating table (8), the vertical wall support (6) is provided with L type rotating frame (10), the L type rotating frame (10) is provided with material pushing structure, the rotating table (8) is provided with material supporting structure, the lifting structure is sequentially stacked with multiple wafer bodies (12) in vertical direction, the material distribution conveying structure includes material distribution disc (2), driving gear (3) and first stepper motor (9), the material distribution disc (2) is provided with multiple material ports, the diameter of multiple material ports is matched between wafer body (12), and multiple material ports are annular array along the center point of material distribution disc (2) and are provided, multiple material ports are provided with material dropping position and grabbing position, the material dropping position and grabbing position are matched between material supporting structure and terminal grabbing structure (4) respectively, the lifting structure includes two material stacking plates (7), two second stepper motors (20) and screw rod (17), two material stacking plates (7) are mirror-symmetrical on vertical wall support (6), and material stacking plate (7) is slidably connected on the surface position of vertical wall support (6), the lower surface center point position of two material stacking plates (7) is equipped with threaded positioning block (16), the screw rod (17) is threadedly connected between two threaded positioning blocks (16), and the thread tapping direction of two threaded positioning blocks (16) is opposite.

2. The wafer automatic transfer equipment for the semiconductor industry according to claim 1, wherein Cavity is provided in the middle segment position of two material stacking plates (7) inside, multiple synchronous roller shafts (22) are sequentially installed in the cavity inside along vertical direction, multiple synchronous roller shafts (22) are provided with synchronous belt (23) outside, two support blocks (21) are symmetrically provided and installed on the surface position of material stacking plate (7) along synchronous roller shaft (22), wherein the synchronous roller shaft (22) on the upper side position is rotatably connected on support block (21), the second stepper motor (20) is installed on the surface position of material stacking plate (7), and the output end of second stepper motor (20) is fixedly connected between support block (21) and the synchronous roller shaft (22) on the upper side position.

3. The wafer automatic transfer equipment for semiconductor industry according to claim 2, wherein Synchronous belt (23) is installed with lower material supporting block (24), the inner wall of two material stacking plates (7) is arc-shaped, and multiple inner top columns (25) are installed on the inner wall along vertical direction, the circumferential outer wall of inner top column (25), the inner curved surface of lower material supporting block (24) and the outer profile of wafer body (12) are contacted, two limit rods (15) are symmetrically provided on the surface of two material stacking plates (7), the upward step distance of lower material supporting block (24) by second stepper motor (20) is the thickness of wafer body (12).

4. The wafer automatic transfer equipment for semiconductor industry according to claim 3, wherein The pushing structure comprises a second linear motor (11), an upper ejection block (19) and a six-star disc (18), the second linear motor (11) moves horizontally on the L-shaped rotating frame (10) in the direction close to the rotating table (8), and the second linear motor (11) is fixedly connected with the upper ejection block (19), and the six-star disc (18) is connected with the upper ejection block (19) at an angle position, and the center point of the six-star disc (18) is on the same vertical axis as the center point of the wafer body (12).

5. The wafer automatic transfer equipment for the semiconductor industry according to claim 4, wherein The lower surface of the upper ejection block (19) is on the same horizontal plane as the lower surface of the wafer body (12) located on the upper side.

6. The wafer automatic transfer equipment according to claim 5, wherein A third stepping motor (26) is installed on the middle section of the rotating table (8), the output shaft of the third stepping motor (26) is connected with the vertical wall support (6), the material supporting structure comprises a mounting plate (35), an air pump (13), a suction disc body (30) and a mounting sleeve (32) installed on the center point of the upper surface of the mounting plate (35), a first electric telescopic cylinder (31) is installed in the mounting sleeve (32), the transmission shaft of the first electric telescopic cylinder (31) extends upward through the mounting sleeve (32), and the transmission shaft of the first electric telescopic cylinder (31) is connected with the center point of the suction disc body (30), the suction disc body (30) is matched with the six-star disc (18), a first linear motor (5) is installed on the center point of the lower surface of the mounting plate (35), and the mounting plate (35) moves horizontally through the first linear motor (5).

7. The wafer automatic transfer equipment for the semiconductor industry according to claim 6, wherein The mounting plate (35) is symmetrically provided with a connecting block (34) on the upper surface in the moving direction, two connecting blocks (34) are rotatably installed with an active frame (33), the active frame (33) is rotatably installed with a lower material supporting rod (29) at the upper end, and a torsion spring (36) is installed on the middle section of the active frame (33), one end of the torsion spring (36) is installed on the mounting plate (35).

8. The wafer automatic transfer equipment for the semiconductor industry according to claim 7, wherein A second electric telescopic cylinder (14) is installed on the upper surface of the rotating table (8) at both ends, a sliding block (28) is installed at the end of the transmission shaft of the second electric telescopic cylinder (14), the sliding block (28) is slidably connected on the rotating table (8), and the advancing direction of the sliding block (28) is perpendicular to the advancing direction of the second linear motor (11), a plurality of vertical side stop rods (27) are installed on the upper surface of the sliding block (28), and the plurality of side stop rods (27) are in contact with the outer contour surface of the wafer body (12).

9. The wafer handling apparatus for the semiconductor industry as recited in any one of claims 1 to 8, wherein, In the conveying process, the plurality of wafer bodies (12) specifically comprises the following steps: Step one: the wafer bodies (12) are stacked in the middle part of the two stacking plates (7) in the vertical direction, and the single wafer body (12) is moved in the direction from top to bottom through the lifting structure. Step two: the wafer body (12) located at the uppermost position of the two stacking plates (7) is pushed to the upper position of the lower supporting rod (29) in the supporting structure by the pushing structure, and the wafer body (12) is adsorbed and fixed by the suction cup body (30) in the supporting structure; Step three: the rotating table (8) rotates 180° in the clockwise or counterclockwise direction, so that the center point position of the supporting structure is aligned with the dropping position on the distribution disc (2), the suction cup body (30) in the supporting structure releases the wafer body (12), and the wafer body (12) falls into the dropping position on the distribution disc (2); Step four: the rotating table (8) rotates 180° again in the clockwise or counterclockwise direction until the rotating table (8) and the supporting structure return to the initial position, the first stepping motor (9) in the distribution table (1) drives the distribution disc (2) to rotate, so that the wafer body (12) placed in the distribution disc (2) is located directly below the grabbing structure of the terminal grabbing structure (4), and the wafer body (12) located in the grabbing position is grabbed by the grabbing structure of the terminal grabbing structure (4).

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