Electronic device and dual-band flat panel array antenna module thereof

Abstract

The present application provides an electronic device and a dual-band flat panel array antenna module thereof. The dual-band flat panel array antenna module includes an insulating carrier substrate, a shared conductive metal layer, a shared ground metal layer, a peripheral wraparound shielding structure, a plurality of first-band antenna structures, and a plurality of second-band antenna structures. The peripheral wraparound shielding structure is electrically connected between the shared conductive metal layer and the shared ground metal layer. Each first-band antenna structure includes a first radiator, two first metal pieces, two first feed-in pieces, and two first inner wraparound shielding components. Each second-band antenna structure includes a second radiator, two second metal pieces, two second feed-in pieces, and two second inner wraparound shielding components. In this way, the isolation between the first-band antenna structures and the second-band antenna structures is improved, so that the antenna modal of the dual-band flat panel array antenna module is purified, and the antenna characteristics of the dual-band flat panel array antenna module are improved.

Description

Technical Field

[0001] This invention relates to an antenna module, and more particularly to a dual-frequency planar array antenna module and an electronic device using the dual-frequency planar array antenna module. Background Technology

[0002] In the existing technology, most planar antennas adopt a stacked antenna structure. However, planar antennas with a stacked antenna structure still have room for improvement. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide an electronic device and its dual-frequency planar array antenna module in response to the shortcomings of the prior art.

[0004] To address the aforementioned technical problems, one technical solution adopted by this invention is to provide a dual-band planar array antenna module, comprising: an insulating support substrate, a shared conductive metal layer, a shared grounding metal layer, an outer surrounding shielding structure, multiple first-band antenna structures, and multiple second-band antenna structures. The shared conductive metal layer is disposed inside the insulating support substrate and has multiple first through-holes and multiple second through-holes. The shared grounding metal layer is disposed at the bottom end of the insulating support substrate. The outer surrounding shielding structure is electrically connected between the shared conductive metal layer and the shared grounding metal layer. Each first-band antenna structure includes a first radiator, two first metal parts, two first feed elements, and two first inner surrounding shielding components. The first radiator is disposed on the insulating support substrate, the two first metal parts are disposed on the insulating support substrate and adjacent to the first radiator, the two first feed elements penetrate the insulating support substrate and are electrically connected to the two first metal parts respectively, and the two first inner surrounding shielding components are disposed inside the insulating support substrate and surround the two first feed elements respectively. Each second-band antenna structure includes a second radiator, two second metal parts, two second feed elements, and two second inner surrounding shielding assemblies. The second radiator is disposed on an insulating support substrate. The two second metal parts are disposed on the insulating support substrate and adjacent to the second radiator. The two second feed elements penetrate the insulating support substrate and are electrically connected to the two second metal parts respectively. The two second inner surrounding shielding assemblies are disposed inside the insulating support substrate and surround the two second feed elements respectively. Each first feed element is disposed between a corresponding first metal part and a shared ground metal layer and is separated from the shared ground metal layer by a first insulating ring. Similarly, each second feed element is disposed between a corresponding second metal part and a shared ground metal layer and is separated from the shared ground metal layer by a second insulating ring. Each first inner surrounding shielding assembly includes a first annular connector and multiple first inner shielding connectors. The first annular connector is electrically connected to the shared conductive metal layer and surrounds the corresponding first feed element. The multiple first inner shielding connectors are electrically connected between the first annular connector and the shared ground metal layer and surround the corresponding first feed element. Each second inner shielding component includes a second annular connector and multiple second inner shielding connectors. The second annular connector is electrically connected to a shared conductive metal layer and surrounds a corresponding second feed element. The multiple second inner shielding connectors are electrically connected between the second annular connector and a shared ground metal layer and surround a corresponding second feed element. In each first-band antenna structure, the two first feed elements and the multiple first inner shielding connectors simultaneously penetrate through corresponding first through-openings. Similarly, in each second-band antenna structure, the two second feed elements and the multiple second inner shielding connectors simultaneously penetrate through corresponding second through-openings.

[0005] To address the aforementioned technical problems, another technical solution adopted by the present invention is to provide a dual-band planar array antenna module, comprising: an insulating carrier substrate, a shared conductive metal layer, a shared ground metal layer, an outer surrounding shielding structure, multiple first-band antenna structures, and multiple second-band antenna structures. The shared conductive metal layer is disposed inside the insulating carrier substrate. The shared ground metal layer is disposed at the bottom end of the insulating carrier substrate. The outer surrounding shielding structure is electrically connected between the shared conductive metal layer and the shared ground metal layer. Each first-band antenna structure includes a first radiator disposed on the insulating carrier substrate, two first metal parts adjacent to the first radiator, two first feed elements electrically connected to the two first metal parts, and two first inner surrounding shielding components surrounding the two first feed elements. Each second-band antenna structure includes a second radiator disposed on the insulating carrier substrate, two second metal parts adjacent to the second radiator, two second feed elements electrically connected to the two second metal parts, and two second inner surrounding shielding components surrounding the two second feed elements.

[0006] To address the aforementioned technical problems, another technical solution adopted by the present invention is to provide an electronic device that uses a dual-band planar array antenna module. The dual-band planar array antenna module comprises: an insulating substrate, a shared conductive metal layer, a shared grounding metal layer, an outer surrounding shielding structure, multiple first-band antenna structures, and multiple second-band antenna structures. The shared conductive metal layer is disposed inside the insulating substrate. The shared grounding metal layer is disposed at the bottom end of the insulating substrate. The outer surrounding shielding structure is electrically connected between the shared conductive metal layer and the shared grounding metal layer. Each first-band antenna structure includes a first radiator disposed on the insulating substrate, two first metal parts adjacent to the first radiator, two first feed elements electrically connected to the two first metal parts, and two first inner surrounding shielding components surrounding the two first feed elements. Each second-band antenna structure includes a second radiator disposed on the insulating substrate, two second metal parts adjacent to the second radiator, two second feed elements electrically connected to the two second metal parts, and two second inner surrounding shielding components surrounding the two second feed elements.

[0007] One of the beneficial effects of the present invention is that the electronic device and its dual-band planar array antenna module provided by the present invention can improve the isolation between the first-band antenna structure and the second-band antenna structure through the technical solutions of "a shared conductive metal layer disposed inside an insulating support substrate", "a shared ground metal layer disposed on the bottom end of the insulating support substrate", "an outer surrounding shielding structure electrically connected between the shared conductive metal layer and the shared ground metal layer", "each first-band antenna structure includes a first radiator disposed on an insulating support substrate, two first metal parts adjacent to the first radiator, two first feed parts electrically connected to the two first metal parts respectively, and two first inner surrounding shielding components respectively surrounding the two first feed parts", and "each second-band antenna structure includes a second radiator disposed on an insulating support substrate, two second metal parts adjacent to the second radiator, two second feed parts electrically connected to the two second metal parts respectively, and two second inner surrounding shielding components respectively surrounding the two second feed parts", thereby making the antenna modes of the dual-band planar array antenna module cleaner and improving the antenna characteristics of the dual-band planar array antenna module.

[0008] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0009] Figure 1 This is a three-dimensional schematic diagram of a dual-frequency planar array antenna module according to the first embodiment of the present invention.

[0010] Figure 2 This is a top view schematic diagram of the dual-frequency planar array antenna module according to the first embodiment of the present invention.

[0011] Figure 3 This is another three-dimensional schematic diagram of the dual-frequency planar array antenna module according to the first embodiment of the present invention.

[0012] Figure 4 This is a partial three-dimensional schematic diagram of the dual-frequency planar array antenna module according to the first embodiment of the present invention.

[0013] Figure 5 This is a partial top view of the dual-frequency planar array antenna module according to the first embodiment of the present invention.

[0014] Figure 6 This is a partial three-dimensional schematic diagram of the dual-frequency planar array antenna module after the insulating carrier substrate has been removed, according to the first embodiment of the present invention.

[0015] Figure 7This is a partial top view of the dual-frequency planar array antenna module after the insulating carrier substrate has been removed, according to the first embodiment of the present invention.

[0016] Figure 8 This is a partial three-dimensional schematic diagram of the dual-frequency planar array antenna module of the first embodiment of the present invention after removing the insulating carrier substrate and the shared conductive metal layer.

[0017] Figure 9 This is a partial top view of the dual-frequency planar array antenna module of the first embodiment of the present invention after the insulating carrier substrate and the shared conductive metal layer have been removed.

[0018] Figure 10 This is a three-dimensional schematic diagram of a dual-frequency planar array antenna module according to a second embodiment of the present invention.

[0019] Figure 11 This is another three-dimensional schematic diagram of the dual-frequency planar array antenna module according to the second embodiment of the present invention.

[0020] Figure 12 The functional block diagram of an electronic device using a dual-frequency planar array antenna module according to the third embodiment of the present invention is shown. Detailed Implementation

[0021] The following specific embodiments illustrate the implementation of the "electronic device and its dual-frequency planar array antenna module" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, it should be stated in advance that the accompanying drawings of this invention are for simple illustration only and are not depictions based on actual dimensions. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention. In addition, the term "or" used herein may include, depending on the actual situation, any combination of any one or more of the associated listed items.

[0022] Cooperate Figures 1 to 12As shown, the present invention provides a dual-band planar array antenna module M and an electronic device P using the dual-band planar array antenna module M. The dual-band planar array antenna module M includes an insulating carrier substrate 1, a shared conductive metal layer 2, a shared ground metal layer 3, an outer surrounding shielding structure 4, multiple first-band antenna structures 5, and multiple second-band antenna structures 6. Furthermore, the shared conductive metal layer 2 is disposed inside the insulating carrier substrate 1, the shared ground metal layer 3 is disposed on the bottom end of the insulating carrier substrate 1, and the outer surrounding shielding structure 4 is electrically connected between the shared conductive metal layer 2 and the shared ground metal layer 3. Additionally, each first-band antenna structure 5 includes a first radiator 51 disposed on the insulating carrier substrate 1, two first metal parts 52 adjacent to the first radiator 51, two first feed members 53 electrically connected to the two first metal parts 52 respectively, and two first inner surrounding shielding components surrounding the two first feed members 53 respectively. Furthermore, each second-band antenna structure 6 includes a second radiator 61 disposed on an insulating support substrate 1, two second metal parts 62 adjacent to the second radiator 61, two second feed members 63 electrically connected to the two second metal parts 62 respectively, and two second inner surrounding shielding components surrounding the two second feed members 63 respectively. Thus, the present invention, through the use of the outer surrounding shielding structure 4, multiple first inner surrounding shielding components, and multiple second inner surrounding shielding components, improves the isolation between the first-band antenna structure 5 and the second-band antenna structure 6, thereby clearing the antenna modes of the dual-band planar array antenna module M and improving the antenna characteristics of the dual-band planar array antenna module M.

[0023] [First Embodiment]

[0024] See Figures 1 to 9 As shown, the first embodiment of the present invention provides a dual-band planar array antenna module M, which includes: an insulating carrier substrate 1, a shared conductive metal layer 2, a shared grounding metal layer 3, an outer surrounding shielding structure 4, a plurality of first-band antenna structures 5, and a plurality of second-band antenna structures 6. For example, the dual-band planar array antenna module M can be applied to the 5G millimeter-wave band (e.g., the dual-band planar array antenna module M can operate between 28GHz and 39GHz). However, the above-described example is only one possible embodiment and is not intended to limit the present invention.

[0025] First, cooperate Figure 1 , Figure 2 , Figure 3 , Figure 6 and Figure 7As shown, a shared conductive metal layer 2 is disposed inside the insulating support substrate 1, and the shared conductive metal layer 2 has multiple first through-holes 201 and multiple second through-holes 202. Additionally, a shared grounding metal layer 3 is disposed on the bottom end of the insulating support substrate 1, and is electrically connected between the shared conductive metal layer 2 and the shared grounding metal layer 3 by an external shielding structure 4. For example, the insulating support substrate 1 has multiple first notches 1001 and multiple second notches 1002. The multiple first notches 1001 are recessed inward from a first side end of the insulating support substrate 1 and respectively correspond to multiple second-band antenna structures 6, and the multiple second notches 1002 are recessed inward from a second side end of the insulating support substrate 1 and respectively correspond to multiple first-band antenna structures 5. Furthermore, the multiple first-band antenna structures 5 are located near the first side end of the insulating support substrate 1 and arranged in a straight line, and the multiple second-band antenna structures 6 are located near the second side end of the insulating support substrate 1 and arranged in a straight line, and the multiple first-band antenna structures 5 and the multiple second-band antenna structures 6 are arranged alternately and interleaved (e.g., ...). Figure 2 (As shown). Furthermore, the outer shielding structure 4 includes a plurality of outer shielding connectors 41 that are separated from each other and arranged in a circle. The plurality of outer shielding connectors 41 surround a plurality of first-band antenna structures 5 and a plurality of second-band antenna structures 6, and each outer shielding connector 41 is electrically connected between a shared conductive metal layer 2 and a shared ground metal layer 3. However, the examples given above are only one possible embodiment and are not intended to limit the present invention.

[0026] In addition, in coordination Figure 4 , Figure 5 , Figure 6 and Figure 8As shown, each first-band antenna structure 5 includes a first radiator 51, two first metal parts 52 (or two other first radiators), two first feed members 53, and two first inner surrounding shielding assemblies. More specifically, the first radiator 51 is disposed on the insulating support substrate 1, and the two first metal parts 52 are disposed on the insulating support substrate 1 and adjacent to the first radiator 51. Furthermore, the two first feed members 53 penetrate the insulating support substrate 1 and are electrically connected to the two first metal parts 52 respectively. Each first feed member 53 is disposed between the corresponding first metal part 52 and the shared ground metal layer 3 and is separated from the shared ground metal layer 3 by a first insulating ring R1. In addition, the two first inner surrounding shielding assemblies are disposed inside the insulating support substrate 1 and surround the two first feed members 53 respectively. Each first inner surrounding shielding assembly includes a first annular connector 54 and a plurality of first inner shielding connectors 55. Furthermore, the first annular connector 54 is electrically connected to the shared conductive metal layer 2 and surrounds the corresponding first feed member 53, and a plurality of first inner shield connectors 55 are electrically connected between the first annular connector 54 and the shared grounding metal layer 3 and surround the corresponding first feed member 53.

[0027] Furthermore, cooperation Figure 4 , Figure 5 , Figure 6 and Figure 8 As shown, each second-band antenna structure 6 includes a second radiator 61, two second metal pieces 62 (or two other second radiators), two second feed members 63, and two second inner surrounding shielding assemblies. More specifically, the second radiator 61 is disposed on the insulating support substrate 1, and the two second metal pieces 62 are disposed on the insulating support substrate 1 and adjacent to the second radiator 61. Additionally, the two second feed members 63 penetrate the insulating support substrate 1 and are electrically connected to the two second metal pieces 62, respectively. Each second feed member 63 is disposed between the corresponding second metal piece 62 and the shared ground metal layer 3 and is separated from the shared ground metal layer 3 by a second insulating ring R2. Furthermore, the two second inner surrounding shielding assemblies are disposed inside the insulating support substrate 1 and surround the two second feed members 63, and each second inner surrounding shielding assembly includes a second annular connector 64 and a plurality of second inner shielding connectors 65. Furthermore, the second annular connector 64 is electrically connected to the shared conductive metal layer 2 and surrounds the corresponding second feeder 63, and a plurality of second inner shield connectors 65 are electrically connected between the second annular connector 64 and the shared grounding metal layer 3 and surround the corresponding second feeder 63.

[0028] For example, such as Figure 6As shown, in each first-band antenna structure 5, two first feed elements 53 and multiple first inner shielding connectors 55 simultaneously penetrate the corresponding first through-hole 201, and in each second-band antenna structure 6, two second feed elements 63 and multiple second inner shielding connectors 65 simultaneously penetrate the corresponding second through-hole 202. Additionally, as... Figure 6 As shown, the shared conductive metal layer 2, the first annular connector 54, and the second annular connector 64 have the same thickness, and an upper surface 2000 of the shared conductive metal layer 2, an upper surface 5400 of the first annular connector 54, and an upper surface 6400 of the second annular connector 64 can be flush with each other. It is worth noting that, in conjunction with… Figure 5 , Figure 7 and Figure 9 As shown, the outlines (or shapes) of the shared conductive metal layer 2, the shared grounding metal layer 3, and the insulating carrier substrate 1 can be the same or different. Furthermore, in conjunction with... Figure 4 and Figure 6 As shown, since both the first inner shielding connector 55 and the second inner shielding connector 65 are disposed inside the insulating carrier substrate 1, the height of the first radiator 51 relative to the shared grounding metal layer 3 is greater than the height of the first inner shielding connector 55 relative to the shared grounding metal layer 3, and the height of the second radiator 61 relative to the shared grounding metal layer 3 is greater than the height of the second inner shielding connector 65 relative to the shared grounding metal layer 3. However, the above-described example is merely one possible embodiment and is not intended to limit the present invention.

[0029] For example, when the dual-band planar array antenna module M is used to transmit wireless signals, the wavelength of the operating frequency of the dual-band planar array antenna module M is λ, and the operating frequency of the first band antenna structure 5 is lower than the operating frequency of the second band antenna structure 6. Firstly, as... Figure 5 As shown, the distance between the outer surrounding surface of the insulating support substrate 1 and the first radiator 51 or the first metal member 52 can be between λ / 4 and λ / 2, and the distance between the outer surrounding surface of the insulating support substrate 1 and the second radiator 61 or the second metal member 62 can be between λ / 4 and λ / 2. Furthermore, in conjunction with... Figure 5 and Figure 7 As shown, the distance between the inner surface 2010 of the first through opening 201 and the first radiator 51 or the first metal part 52 can be between λ / 4 and λ / 2, and the distance between the inner surface 2020 of the second through opening 202 and the second radiator 61 or the second metal part 62 can be between λ / 4 and λ / 2. Additionally, as... Figure 7As shown, the distance between the first inner shielding connector 55 and the first feeder 53 can be between λ / 16 and λ / 8, and the distance between the second inner shielding connector 65 and the second feeder 63 can be between λ / 16 and λ / 8. Furthermore, in conjunction with... Figure 7 and Figure 9 As shown, the distance between two adjacent first inner shielding connectors 55 can be between λ / 16 and λ / 8, the distance between two adjacent second inner shielding connectors 65 can be between λ / 16 and λ / 8, and the distance between two adjacent outer shielding connectors 41 can be between λ / 16 and λ / 8. However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0030] Furthermore, in coordination Figure 1 and Figure 3 As shown, the dual-band planar array antenna module M provided in the first embodiment further includes an insulating solder resist layer 7, and the insulating solder resist layer 7 is disposed on the shared ground metal layer 3. For example, multiple antenna solder joints (unlabeled) are exposed by the insulating solder resist layer 7, each first feed member 53 has a first feed portion 530 exposed outside the insulating solder resist layer 7, and each second feed member 63 has a second feed portion 630 exposed outside the insulating solder resist layer 7. However, the examples given above are only one possible embodiment and are not intended to limit the present invention.

[0031] [Second Embodiment]

[0032] See Figure 10 and Figure 11 As shown, the second embodiment of the present invention provides a dual-band planar array antenna module M, which includes: an insulating carrier substrate 1, a shared conductive metal layer 2, a shared grounding metal layer 3, an outer surrounding shielding structure 4, multiple first-band antenna structures 5, and multiple second-band antenna structures 6. Figure 10 and Figure 1 The comparison, and Figure 11 and Figure 3 A comparison reveals that the most significant difference between the second embodiment and the first embodiment of the present invention lies in the fact that, in the second embodiment, the outer surrounding shielding structure 4 includes an outer surrounding shielding layer 42 disposed on an outer surrounding surface of the insulating carrier substrate 1. In other words, the second embodiment replaces the plurality of outer shielding connectors 41 of the first embodiment with an outer surrounding shielding layer 42. Furthermore, the outer surrounding shielding layer 42 surrounds the plurality of first-band antenna structures 5 and the plurality of second-band antenna structures 6, and is electrically connected between the shared conductive metal layer 2 and the shared grounding metal layer 3.

[0033] [Third Embodiment]

[0034] See Figure 12 As shown, the third embodiment of the present invention provides an electronic device P, which uses a dual-band planar array antenna module M, and the dual-band planar array antenna module M can be provided by the first embodiment or the second embodiment. It is worth noting that the electronic device P can also be a portable device.

[0035] [Beneficial Effects of the Examples]

[0036] One of the beneficial effects of the present invention is that the electronic device P and its dual-band planar array antenna module M provided by the present invention can be configured to: "a shared conductive metal layer 2 is disposed inside an insulating support substrate 1", "a shared grounding metal layer 3 is disposed on the bottom end of the insulating support substrate 1", "an outer surrounding shielding structure 4 is electrically connected between the shared conductive metal layer 2 and the shared grounding metal layer 3", and "each first frequency band antenna structure includes a first radiator 51 disposed on the insulating support substrate 1, two first metal parts 52 adjacent to the first radiator 51, two first feed elements 53 electrically connected to the two first metal parts 52 respectively, and two feed elements 53 respectively surrounding the two first radiators 51". The technical solutions “two first inner surrounding shielding components for each first feed element 53” and “each second band antenna structure 6 includes a second radiator 61 disposed on an insulating carrier substrate 1, two second metal parts 62 adjacent to the second radiator 61, two second feed elements 63 electrically connected to the two second metal parts 62 respectively, and two second inner surrounding shielding components surrounding the two second feed elements 63 respectively” are used to improve the isolation between the first band antenna structure 5 and the second band antenna structure 6, thereby making the antenna modes of the dual-band planar array antenna module M cleaner and improving the antenna characteristics of the dual-band planar array antenna module M.

[0037] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of protection of the claims of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the scope of protection of the claims of the present invention.

Claims

1. A dual-frequency planar array antenna module, characterized in that, The dual-frequency planar array antenna module includes: An insulating substrate; A shared conductive metal layer is disposed inside the insulating carrier substrate, and the shared conductive metal layer has a plurality of first through openings and a plurality of second through openings; A shared grounding metal layer is disposed on the bottom end of the insulating bearing substrate; An outer surrounding shielding structure is electrically connected between the shared conductive metal layer and the shared grounding metal layer; Multiple first-band antenna structures are provided. Each first-band antenna structure includes a first radiator, two first metal parts, two first feed elements, and two first inner surrounding shielding components. The first radiator is disposed on the insulating support substrate. The two first metal parts are disposed on the insulating support substrate and adjacent to the first radiator. The two first feed elements penetrate the insulating support substrate and are electrically connected to the two first metal parts respectively. The two first inner surrounding shielding components are disposed inside the insulating support substrate and surround the two first feed elements respectively. Multiple second-band antenna structures are provided. Each second-band antenna structure includes a second radiator, two second metal parts, two second feed elements, and two second inner surrounding shielding components. The second radiator is disposed on the insulating support substrate. The two second metal parts are disposed on the insulating support substrate and adjacent to the second radiator. The two second feed elements penetrate the insulating support substrate and are electrically connected to the two second metal parts respectively. The two second inner surrounding shielding components are disposed inside the insulating support substrate and surround the two second feed elements respectively. Each of the first feed elements is disposed between the corresponding first metal element and the shared grounding metal layer and is separated from the shared grounding metal layer by a first insulating ring, and each of the second feed elements is disposed between the corresponding second metal element and the shared grounding metal layer and is separated from the shared grounding metal layer by a second insulating ring. Each of the first inner surrounding shielding components includes a first annular connector and a plurality of first inner shielding connectors. The first annular connector is electrically connected to the shared conductive metal layer and surrounds the corresponding first feeder. The plurality of first inner shielding connectors are electrically connected between the first annular connector and the shared grounding metal layer and surround the corresponding first feeder. Each of the second inner surrounding shielding components includes a second annular connector and a plurality of second inner shielding connectors. The second annular connector is electrically connected to the shared conductive metal layer and surrounds the corresponding second feeder. The plurality of second inner shielding connectors are electrically connected between the second annular connector and the shared grounding metal layer and surround the corresponding second feeder. In each of the first frequency band antenna structures, the two first feed elements and the multiple first inner shielding connectors simultaneously pass through the corresponding first through opening, and in each of the second frequency band antenna structures, the two second feed elements and the multiple second inner shielding connectors simultaneously pass through the corresponding second through opening. The plurality of first inner shielding connectors are electrically connected to each other through the first annular connector, and the plurality of second inner shielding connectors are electrically connected to each other through the second annular connector.

2. The dual-frequency planar array antenna module according to claim 1, characterized in that, The outer shielding structure includes a plurality of outer shielding connectors that are separated from each other and arranged in a circle. The plurality of outer shielding connectors surround a plurality of first frequency band antenna structures and a plurality of second frequency band antenna structures, and each of the outer shielding connectors is electrically connected between the shared conductive metal layer and the shared grounding metal layer.

3. The dual-frequency planar array antenna module according to claim 1, characterized in that, The outer surrounding shielding structure includes an outer surrounding shielding layer disposed on an outer surrounding surface of the insulating carrier substrate. The outer surrounding shielding layer surrounds a plurality of first frequency band antenna structures and a plurality of second frequency band antenna structures, and the outer surrounding shielding layer is electrically connected between the shared conductive metal layer and the shared ground metal layer.

4. The dual-frequency planar array antenna module according to claim 1, characterized in that, in, The insulating carrier substrate has a plurality of first notches and a plurality of second notches. The plurality of first notches are recessed inward from a first side end of the insulating carrier substrate and respectively correspond to a plurality of second frequency band antenna structures. The plurality of second notches are recessed inward from a second side end of the insulating carrier substrate and respectively correspond to a plurality of first frequency band antenna structures. In this configuration, multiple first-band antenna structures are arranged in a straight line close to the first side end of the insulating support substrate, and multiple second-band antenna structures are arranged in a straight line close to the second side end of the insulating support substrate, with the multiple first-band antenna structures and multiple second-band antenna structures arranged alternately and interleaved. The outline of the shared conductive metal layer is the same as that of the insulating carrier substrate. The shared conductive metal layer, the first annular connector, and the second annular connector have the same thickness, and an upper surface of the shared conductive metal layer, an upper surface of the first annular connector, and an upper surface of the second annular connector are flush with each other. Wherein, the height of the first radiator relative to the shared grounding metal layer is greater than the height of the first inner shielding connector relative to the shared grounding metal layer, and the height of the second radiator relative to the shared grounding metal layer is greater than the height of the second inner shielding connector relative to the shared grounding metal layer.

5. The dual-frequency planar array antenna module according to claim 1, characterized in that, The dual-frequency planar array antenna module further includes: An insulating solder resist layer is disposed on the shared grounding metal layer; Each of the first feeders has a first feed portion exposed outside the insulating solder resist layer, and each of the second feeders has a second feed portion exposed outside the insulating solder resist layer; The outer shielding structure includes multiple outer shielding connectors that are separated from each other and arranged in a circle. The multiple outer shielding connectors surround multiple first frequency band antenna structures and multiple second frequency band antenna structures, and each outer shielding connector is electrically connected between the shared conductive metal layer and the shared grounding metal layer. Wherein, the operating frequency of the first frequency band antenna structure is lower than the operating frequency of the second frequency band antenna structure; Wherein, when the dual-frequency planar array antenna module is used to transmit wireless signals, the wavelength of the operating frequency of the dual-frequency planar array antenna module is λ; Wherein, the distance between the outer surrounding surface of the insulating carrier substrate and the first radiator or the first metal component is between λ / 4 and λ / 2, and the distance between the outer surrounding surface of the insulating carrier substrate and the second radiator or the second metal component is between λ / 4 and λ / 2; Wherein, the distance between the inner surface of the first through opening and the first radiator or the first metal part is between λ / 4 and λ / 2, and the distance between the inner surface of the second through opening and the second radiator or the second metal part is between λ / 4 and λ / 2. Wherein, the distance between the first inner shielding connector and the first feeder is between λ / 16 and λ / 8, and the distance between the second inner shielding connector and the second feeder is between λ / 16 and λ / 8; The distance between two adjacent first inner shielding connectors is between λ / 16 and λ / 8, the distance between two adjacent second inner shielding connectors is between λ / 16 and λ / 8, and the distance between two adjacent outer shielding connectors is between λ / 16 and λ / 8.

6. A dual-frequency planar array antenna module, characterized in that, The dual-frequency planar array antenna module includes: An insulating substrate; A shared conductive metal layer is disposed inside the insulating carrier substrate; A shared grounding metal layer is disposed on the bottom end of the insulating bearing substrate; An outer surrounding shielding structure is electrically connected between the shared conductive metal layer and the shared grounding metal layer; Multiple first-band antenna structures, each first-band antenna structure including a first radiator disposed on the insulating carrier substrate, two first metal parts adjacent to the first radiator, two first feed members electrically connected to the two first metal parts respectively, and two first inner surrounding shielding components respectively surrounding the two first feed members; and Multiple second-band antenna structures, each second-band antenna structure including a second radiator disposed on the insulating carrier substrate, two second metal parts adjacent to the second radiator, two second feed members electrically connected to the two second metal parts respectively, and two second inner surrounding shielding components surrounding the two second feed members respectively. Each of the first inner surrounding shielding components includes a first annular connector and a plurality of first inner shielding connectors, and each of the second inner surrounding shielding components includes a second annular connector and a plurality of second inner shielding connectors. The plurality of first inner shielding connectors are electrically connected to each other through the first annular connector, and the plurality of second inner shielding connectors are electrically connected to each other through the second annular connector.

7. The dual-frequency planar array antenna module according to claim 6, characterized in that, in, Each of the first feed elements is disposed between the corresponding first metal element and the shared grounding metal layer and is separated from the shared grounding metal layer by a first insulating ring, and each of the second feed elements is disposed between the corresponding second metal element and the shared grounding metal layer and is separated from the shared grounding metal layer by a second insulating ring. Each of the first inner surrounding shielding components includes a first annular connector and a plurality of first inner shielding connectors. The first annular connector is electrically connected to the shared conductive metal layer and surrounds the corresponding first feeder. The plurality of first inner shielding connectors are electrically connected between the first annular connector and the shared grounding metal layer and surround the corresponding first feeder. Each of the second inner surrounding shielding components includes a second annular connector and a plurality of second inner shielding connectors. The second annular connector is electrically connected to the shared conductive metal layer and surrounds the corresponding second feeder. The plurality of second inner shielding connectors are electrically connected between the second annular connector and the shared grounding metal layer and surround the corresponding second feeder.

8. The dual-frequency planar array antenna module according to claim 7, characterized in that, in, The insulating carrier substrate has a plurality of first notches and a plurality of second notches. The plurality of first notches are recessed inward from a first side end of the insulating carrier substrate and respectively correspond to a plurality of second frequency band antenna structures. The plurality of second notches are recessed inward from a second side end of the insulating carrier substrate and respectively correspond to a plurality of first frequency band antenna structures. In this configuration, multiple first-band antenna structures are arranged in a straight line close to the first side end of the insulating support substrate, and multiple second-band antenna structures are arranged in a straight line close to the second side end of the insulating support substrate, with the multiple first-band antenna structures and multiple second-band antenna structures arranged alternately and interleaved. The outline of the shared conductive metal layer is the same as that of the insulating carrier substrate. The shared conductive metal layer, the first annular connector, and the second annular connector have the same thickness, and an upper surface of the shared conductive metal layer, an upper surface of the first annular connector, and an upper surface of the second annular connector are flush with each other. Wherein, the height of the first radiator relative to the shared grounding metal layer is greater than the height of the first inner shielding connector relative to the shared grounding metal layer, and the height of the second radiator relative to the shared grounding metal layer is greater than the height of the second inner shielding connector relative to the shared grounding metal layer.

9. An electronic device that uses a dual-frequency planar array antenna module, characterized in that, The dual-frequency planar array antenna module includes: An insulating substrate; A shared conductive metal layer is disposed inside the insulating carrier substrate; A shared grounding metal layer is disposed on the bottom end of the insulating bearing substrate; An outer surrounding shielding structure is electrically connected between the shared conductive metal layer and the shared grounding metal layer; Multiple first-band antenna structures, each first-band antenna structure including a first radiator disposed on the insulating carrier substrate, two first metal parts adjacent to the first radiator, two first feed members electrically connected to the two first metal parts respectively, and two first inner surrounding shielding components respectively surrounding the two first feed members; and Multiple second-band antenna structures, each second-band antenna structure including a second radiator disposed on the insulating carrier substrate, two second metal parts adjacent to the second radiator, two second feed members electrically connected to the two second metal parts respectively, and two second inner surrounding shielding components surrounding the two second feed members respectively. Each of the first inner surrounding shielding components includes a first annular connector and a plurality of first inner shielding connectors, and each of the second inner surrounding shielding components includes a second annular connector and a plurality of second inner shielding connectors. The plurality of first inner shielding connectors are electrically connected to each other through the first annular connector, and the plurality of second inner shielding connectors are electrically connected to each other through the second annular connector.

10. The electronic device according to claim 9, characterized in that, in, Each of the first feed elements is disposed between the corresponding first metal element and the shared grounding metal layer and is separated from the shared grounding metal layer by a first insulating ring, and each of the second feed elements is disposed between the corresponding second metal element and the shared grounding metal layer and is separated from the shared grounding metal layer by a second insulating ring. Each of the first inner surrounding shielding components includes a first annular connector and a plurality of first inner shielding connectors. The first annular connector is electrically connected to the shared conductive metal layer and surrounds the corresponding first feeder. The plurality of first inner shielding connectors are electrically connected between the first annular connector and the shared grounding metal layer and surround the corresponding first feeder. Each of the second inner surrounding shielding components includes a second annular connector and a plurality of second inner shielding connectors. The second annular connector is electrically connected to the shared conductive metal layer and surrounds the corresponding second feeder. The plurality of second inner shielding connectors are electrically connected between the second annular connector and the shared grounding metal layer and surround the corresponding second feeder. The insulating carrier substrate has a plurality of first notches and a plurality of second notches. The plurality of first notches are recessed inward from a first side end of the insulating carrier substrate and respectively correspond to a plurality of second frequency band antenna structures. The plurality of second notches are recessed inward from a second side end of the insulating carrier substrate and respectively correspond to a plurality of first frequency band antenna structures. In this configuration, multiple first-band antenna structures are arranged in a straight line close to the first side end of the insulating support substrate, and multiple second-band antenna structures are arranged in a straight line close to the second side end of the insulating support substrate, with the multiple first-band antenna structures and multiple second-band antenna structures arranged alternately and interleaved. The outline of the shared conductive metal layer is the same as that of the insulating carrier substrate. The shared conductive metal layer, the first annular connector, and the second annular connector have the same thickness, and an upper surface of the shared conductive metal layer, an upper surface of the first annular connector, and an upper surface of the second annular connector are flush with each other. Wherein, the height of the first radiator relative to the shared grounding metal layer is greater than the height of the first inner shielding connector relative to the shared grounding metal layer, and the height of the second radiator relative to the shared grounding metal layer is greater than the height of the second inner shielding connector relative to the shared grounding metal layer.

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