A method for preparing a hexagonal wire bundle electrode

By preparing tow electrodes with hexagonal structures, the problem of inconsistent electrode spacing is solved, and more accurate local corrosion characterization and more efficient electrochemical measurements are achieved.

CN116046662BActive Publication Date: 2025-08-29CHINA UNIV OF PETROLEUM (EAST CHINA)
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Patent Information

Application Number
CN202211681954.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-12-26
Publication Date
2025-08-29
Estimated Expiration
2042-12-26

AI Technical Summary

Technical Problem

In the prior art, squarely arranged tow electrodes cannot guarantee the consistency of the spacing between each electrode, which affects the accuracy of characterization of local corrosion.

Method used

Using a hexagonal structure tow electrode preparation method, the test electrode is inserted into a metal tube, and the liquid epoxy resin sealing is injected through a double-layer mold and a polyvinyl chloride PVC tube to form a geometrically symmetrical honeycomb-like hexagonal structure to ensure that the spacing between any two adjacent electrodes is the same.

Benefits of technology

The strict consistency of electrode spacing is achieved, the accuracy of local corrosion characterization and the reliability of measurement results are improved, the testing time is shortened, and the error is reduced.

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Abstract

The embodiments of this specification disclose a method for preparing a hexagonal wire bundle electrode. The method comprises inserting N test electrodes into corresponding N metal tubes from one end; inserting N connecting wires into corresponding N metal tubes from the other end and fixedly connecting them to the N test electrodes; placing the double-layer mold into a polyvinyl chloride (PVC) tube, and injecting liquid epoxy resin to seal the sample after fixing the relative positions of the double-layer mold and the polyvinyl chloride (PVC) tube; and exposing the N test electrodes after the liquid epoxy resin cures, thereby obtaining a geometrically symmetrical wire bundle electrode with a honeycomb-like hexagonal structure, wherein the spacing between any two test electrodes is the same, thereby achieving the preparation of a geometrically symmetrical wire bundle electrode with a honeycomb-like hexagonal structure in which the spacing between each electrode is the same.
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Description

Technical Field

[0001] This specification relates to electrochemical testing, and in particular to a method for preparing a hexagonal wire bundle electrode. Background Art

[0002] Wire beam electrode technology lies between micro-area electrochemistry and macro-electrochemistry, capable of measuring the heterogeneity of electrochemical corrosion processes on electrode surfaces. It typically consists of a series of regularly arranged, insulated electrode wires. Wire beam electrodes can both couple together to provide statistical average information for large-area electrodes and measure localized electrochemical information on independent, microelectrode surfaces, characterizing electrochemical heterogeneity on the electrode surface. This makes them suitable for various localized corrosion studies.

[0003] Conventional wire beam electrode arrangements are all square electrode arrangements, which cannot guarantee the consistency of the spacing between each electrode, and to some extent affects the characterization of local corrosion.

[0004] Based on this, a preparation scheme for hexagonal wire bundle electrodes that can more accurately characterize local corrosion is needed. Summary of the Invention

[0005] The embodiments of this specification provide a method for preparing a wire bundle electrode with a hexagonal structure to solve the following technical problem: a wire bundle electrode with a hexagonal structure that can more accurately characterize local corrosion.

[0006] To solve the above technical problems, one or more embodiments of this specification are implemented as follows:

[0007] An embodiment of the present specification provides a method for preparing a wire bundle electrode with a hexagonal structure, comprising: inserting N test electrodes from one end into corresponding N metal tubes, wherein the metal tube is fixed in a double-layer mold comprising N holes arranged in a honeycomb hexagonal shape, the holes comprising upper and lower ends with different diameters, the lower end having the same diameter as the test electrode, and the upper end having the same diameter as the outer diameter of the metal tube; inserting N connecting wires from the other end into the corresponding N metal tubes, and fixedly connected to the N test electrodes; placing the double-layer mold into a polyvinyl chloride (PVC) tube, and injecting liquid epoxy resin to seal the sample after fixing the relative positions of the double-layer mold and the polyvinyl chloride (PVC) tube; after the liquid epoxy resin is cured, the N test electrodes are exposed to obtain a geometrically symmetrical wire bundle electrode with a honeycomb hexagonal structure, wherein the spacing between any two adjacent test electrodes is the same.

[0008] At least one of the above technical solutions adopted in one or more embodiments of this specification can achieve the following beneficial effects: inserting N test electrodes into corresponding N metal tubes from one end, wherein the metal tubes are fixed in a double-layer mold comprising N holes arranged in a honeycomb hexagonal shape, wherein the holes comprise upper and lower ends with different diameters, wherein the diameter of the lower end is the same as the diameter of the test electrode, and the diameter of the upper end is the same as the outer diameter of the metal tube; inserting N connecting wires into corresponding N metal tubes from the other end, and fixedly connecting them to the N test electrodes; placing the double-layer mold in a polyvinyl chloride container. A double-layer mold is placed in a polyvinyl chloride PVC tube, and after fixing the relative positions of the double-layer mold and the polyvinyl chloride PVC tube, liquid epoxy resin is injected to seal the sample; after the liquid epoxy resin is cured, the N test electrodes are exposed to obtain a wire bundle electrode with a geometrically symmetrical honeycomb hexagonal structure, wherein the spacing between any two adjacent test electrodes is the same, thereby achieving the preparation of a geometrically symmetrical honeycomb hexagonal structure wire bundle electrode with the same spacing between each electrode, ensuring that the spacing between each electrode is strictly consistent, and the prepared wire bundle electrode can more accurately reconstruct the surface corrosion conditions of the actual material when used. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the embodiments of this specification or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0010] Reference numerals:

[0011] 1 - test electrode; 2 - metal tube; 3 - double-layer mold; 4 - connecting wire; 5 - nut; 6 - bolt; 7 - epoxy resin.

[0012] Figure 1a A schematic flow chart of a method for preparing a hexagonal wire bundle electrode provided in an embodiment of the present application;

[0013] Figure 1b A schematic diagram of a specific preparation of a wire bundle electrode provided in an embodiment of the present application;

[0014] Figure 2a A schematic diagram of a mold for a wire bundle electrode provided in an embodiment of the present application;

[0015] Figure 2b A schematic cross-sectional view of a mold for a wire bundle electrode provided in an embodiment of the present application;

[0016] Figure 3A schematic diagram of a bottom cross-section of a wire bundle electrode provided in an embodiment of the present application;

[0017] Figure 4 A schematic diagram of the electrode material ratio of a test electrode provided in an embodiment of the present application;

[0018] Figure 5a A schematic diagram of a measurement sub-area of ​​a wire beam electrode provided in an embodiment of the present application;

[0019] Figure 5b A schematic diagram of an electrode in a measurement sub-area of ​​a wire bundle electrode provided in an embodiment of the present application;

[0020] Figure 5c A schematic diagram of the electric dipole potential of a measurement sub-area of ​​a wire bundle electrode provided in an embodiment of the present application.

[0021] Figure 5d Schematic diagram of the electric dipole potential of the entire area of ​​a wire bundle electrode provided in an embodiment of the present application DETAILED DESCRIPTION

[0022] In order to help those skilled in the art better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this specification, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0023] As shown in FIG1 , FIG1 is a schematic flow chart of a method for preparing a hexagonal wire bundle electrode provided in an embodiment of this specification, comprising:

[0024] S101: Insert N test electrodes from one end into corresponding N metal tubes, wherein the metal tubes are fixed in a double-layer mold having N holes arranged in a honeycomb-like hexagonal pattern, wherein the holes have upper and lower ends of different diameters, the lower end having the same diameter as the test electrode, and the upper end having the same diameter as the outer diameter of the metal tube. N is a natural number greater than 1.

[0025] In one embodiment, the double-layer mold is obtained by fixing two single-layer molds by bolts and nuts, wherein each single-layer mold contains N holes arranged in a honeycomb hexagonal shape.

[0026] For example, 91 connecting copper tubes can be prepared, and the inner diameter of the copper tubes is consistent with the diameter of the electrode wire. Prepare four 50cm long 25P DuPont wires as test leads, two fixed molds with 91 holes, where the 91 holes are arranged in a honeycomb hexagonal pattern, with a spacing of 0.1cm between each hole, see Figure 2a The diameter of the hole is divided into two sections. The lower end is consistent with the diameter of the test electrode, and the upper end is consistent with the outer diameter of the connecting copper tube. Figure 2b Prepare three M3×20mm plastic bolts and matching nuts to connect the two molds.

[0027] S103 , inserting N connecting wires into the corresponding N metal tubes from the other ends, and fixedly connecting them to the N test electrodes.

[0028] Specifically, insert one end of the test lead through the mold and into the connecting copper tube halfway down, with the copper tube on the side with the larger diameter hole in the mold. Insert the test electrode halfway down the copper tube and crimp it with a crimping pliers to securely connect the single electrode to the test lead.

[0029] S105, placing the double-layer mold into a polyvinyl chloride (PVC) tube, and injecting liquid epoxy resin to seal the sample after fixing the relative positions of the double-layer mold and the polyvinyl chloride (PVC) tube.

[0030] After the single electrode and test lead are securely connected, the mold can be placed into the cut PVC tube. One end of the tube is sealed with sealing tape and the tube wall is coated with petroleum jelly to facilitate mold removal. After securing the relative position of the mold and the PVC tube, the prepared epoxy resin liquid is injected into the PVC tube to seal the sample.

[0031] S107 , after the liquid epoxy resin is cured, the N test electrodes are exposed to obtain a wire bundle electrode with a geometrically symmetrical honeycomb-like hexagonal structure, wherein the spacing between any two adjacent test electrodes is the same.

[0032] After the epoxy resin dries, tear off the sealing tape at one end of the PVC tube to expose the test electrode. Then, use different grades of sandpaper to grind and polish the wire beam electrode. The bottom view of the polished wire beam electrode is shown in the figure. Figure 3 .

[0033] The method comprises inserting N test electrodes into corresponding N metal tubes from one end, wherein the metal tubes are fixed in a double-layer mold comprising N holes arranged in a honeycomb hexagonal shape, wherein the holes comprise upper and lower ends of different diameters, wherein the diameter of the lower end is the same as the diameter of the test electrode, and the diameter of the upper end is the same as the outer diameter of the metal tube; inserting N connecting wires into the corresponding N metal tubes from the other end and fixedly connected to the N test electrodes; placing the double-layer mold in a polyvinyl chloride (PVC) tube, and injecting liquid epoxy resin to seal the sample after fixing the relative position of the double-layer mold and the polyvinyl chloride (PVC) tube; after the liquid epoxy resin is cured, exposing the N test electrodes, and obtaining a geometrically symmetrical honeycomb hexagonal wire bundle electrode, wherein the spacing between any two adjacent test electrodes is the same, thereby achieving the preparation of a geometrically symmetrical honeycomb hexagonal wire bundle electrode with the same spacing between each electrode, ensuring that the spacing between each electrode is strictly consistent, and the prepared wire bundle electrode can more accurately reconstruct the surface corrosion conditions of the actual material when used.

[0034] In one embodiment, the test electrode is composed of aluminum-zinc alloy wire, and the aluminum-zinc alloy wire includes aluminum-rich phase alloy wire and zinc-rich phase alloy wire, which is used to proportion and test the local material distribution characteristics of the aluminum-zinc alloy plate.

[0035] Furthermore, the ratio of the aluminum-rich alloy wire to the zinc-rich alloy wire is 4:1, and there is at least one test electrode composed of an aluminum-rich alloy wire between any two test electrodes composed of zinc-rich alloy wires.

[0036] like Figure 4 As shown, Figure 4 A schematic diagram of the electrode material ratio provided in an embodiment of the present application. Among them, the black mark is the test electrode of the zinc-rich phase alloy wire, and the gray mark is the test electrode of the aluminum-rich phase alloy wire. From the microstructure of the aluminum-zinc alloy coating, it presents a six-sector network-like two-phase structure, and the area ratio of the aluminum-rich phase to the zinc-rich phase is about 4:1. This configuration actually reconstructs the phase interface of the aluminum-zinc alloy coating, thereby measuring the electrochemical heterogeneity characteristics of the interphase region. By matching the configuration of the test electrode to the phase interface of the tested material, the test results can be made more accurate.

[0037] In one embodiment, before placing the double-layer mold into the polyvinyl chloride (PVC) tube, the connection between a single test electrode and the connecting wire can be tested for continuity, and adjacent test electrodes can be tested for short circuits. This ensures that each electrode is conductive and that adjacent test electrodes are not short-circuited, thereby preventing unusable faulty electrodes from forming in the prepared wire bundle electrode.

[0038] In one embodiment, the N holes arranged in a honeycomb-like hexagonal pattern have the same spacing, which is 0.1 to 0.15 cm. In this way, the spacing between the electrodes in the prepared wire bundle electrode is maintained at a relatively reasonable distance, thereby improving the accuracy of the measurement results.

[0039] In one embodiment, after the wire beam electrode is divided into six sub-regions, the wire beam electrode is formed by overlapping the boundaries of the six congruent sub-regions. In each sub-region, adjacent test electrodes form an equilateral triangle. This equilateral triangle sub-region can be used to reflect the local electrochemical information of the entire wire beam electrode, and due to the consistency of the spacing, the measured local electrochemical information also ensures consistency in measurement time. By measuring only the electrochemical distribution information of the sub-region, the measurement speed is improved, and the measured local electrochemical information also ensures consistency in measurement time. Due to the consistency of spacing, a single sub-region can represent the entire region to a certain extent. In previous wire beam electrode coupling tests, there would be a certain time difference from measuring the first electrode wire to the last electrode wire. Measuring only the sub-region can not only improve the test efficiency, but also shorten the test interval, so that the entire test process is close to the same time, reduce the test error, and ensure the consistency of the test time.

[0040] like Figure 5a and Figure 5b shown. Figure 5a The entire wire bundle electrode is divided into 6 congruent equilateral triangle sub-areas (or fan-shaped areas), and the lines connecting the test electrodes in each sub-area form the three sides of the equilateral triangle. Figure 5b This is a schematic diagram of a sub-area, in which each equilateral triangle can be used to test local electrochemical information. The measured local dipole potential spatial distribution of the wire bundle electrode is shown as follows: Figure 5c As shown, the global electrochemical information of the wire bundle electrode can be characterized based on the measured local electrochemical information. The electrochemical information may include information such as galvanic potential or current.

[0041] The specific testing process is as follows:

[0042] a. Clean the polished test surface of the wire beam electrode with alcohol and place it in the test container. The wire beam electrode test surface cannot contact the container wall.

[0043] b. Insert the male connector of the wire bundle electrode test lead into the female connector of the test equipment, and also connect the reference electrode and counter electrode to the test equipment.

[0044] c. Prepare the corresponding reaction solution according to the experimental requirements and place the corrosion solution into the test container. The reaction solution should completely immerse the wire bundle electrode. Place the reference electrode and counter electrode into the test container.

[0045] d. According to the test requirements, test the local electrochemical information of different parts of the wire beam electrode. Considering the consistency in time, test one-sixth sector ( Figure 5a 、 5b ), that is, the galvanic corrosion between different electrodes can be seen, and the anode area and cathode area can be determined. The anode area is the area where corrosion may have occurred, and the cathode area is the normal area. For example, the spatial distribution of the galvanic potential of the wire bundle electrode ( Figure 5c ), in this diagram, the area corresponding to electrode 66 is the anode area. The darker the area, the greater the possibility of corrosion. Figure 5c and Figure 5d The right scale in the diagram is the couple potential.

[0046] Furthermore, based on Figure 5c The electrochemical information of a sub-region measured in the experiment is assigned symmetrically to the other five sub-regions that are identical to it, thus obtaining the following: Figure 5d Global electrochemical information is shown.

[0047] Furthermore, when assigning electrochemical information from subregions to the global domain, overlapping boundaries within each subregion can be smoothed. For example, for any electrode within the boundary formed by electrodes 46-47-48-49-50-51, its corresponding value can be interpolated based on the values ​​of the adjacent electrodes to obtain a smoothed electrochemical value.

[0048] For example, the electrochemical information for electrode 48 can be interpolated based on the electrochemical information of adjacent electrodes 38, 37, 49, 47, 59, and 58. Electrode 37's electrochemical information can be derived based on the congruent information of electrode 66, and electrode 38's electrochemical information can be derived based on the congruent information of electrode 75. This interpolation results in a smoother overall image of the bundled electrodes.

[0049] In one embodiment, in the sub-area, every seven test electrodes form a hexagon. Figure 4 For example, such a division method can include at least one test electrode of aluminum-rich alloy wire in each honeycomb-like hexagon, so that each hexagon can be used as a smaller local area for testing local information in the sub-area.

[0050] To make the solution of this application clearer, taking the metal tube as a copper tube as an example, a more specific process description of the preparation method is given below:

[0051] a. Prepare 91 aluminum-zinc alloy wires with a length of 2 cm and a diameter of 0.2 cm, including 73 aluminum-rich phase alloy wires (single aluminum-rich dendritic phase structure) and 18 zinc-rich phase alloy wires (single zinc-rich interdendritic phase structure) for proportioning and testing the local material distribution characteristics of aluminum-zinc alloy plates.

[0052] Prepare 91 connecting copper tubes with an inner diameter that matches the diameter of the electrode wire. Prepare four 50cm long 25P DuPont cables as test leads. Prepare two fixed molds with 91 holes arranged in a honeycomb-like hexagonal pattern, with a spacing of 0.1cm between each hole. The hole diameters are divided into two sections: the lower end matches the diameter of the test electrode, and the upper end matches the outer diameter of the connecting copper tube. Prepare three M3×20mm plastic bolts and matching nuts to connect the two molds.

[0053] b. Pass one end of the test lead through the mold and into the connecting copper tube halfway to the depth, with the copper tube on the side with the larger diameter hole in the mold. Insert the test electrode halfway into the copper tube and use a crimping pliers to crimp the copper tube tightly, thus achieving a tight connection between the single electrode and the test lead.

[0054] c. Use a digital multimeter to test the conductivity between the wire and a single electrode to ensure continuity between each electrode and the wire.

[0055] d. Insert the 91 connected electrodes into another mold of the same mold size in sequence, and insert the copper tube into the larger diameter side of the mold. Use plastic bolts to tighten the two molds to prevent the position of each electrode from shifting.

[0056] e. Connect four crimp-type DIDC-DB 25 male connectors to the other ends of the test leads and check the connection security.

[0057] f. Use a digital multimeter to test the conductivity of each electrode to ensure that each electrode is conductive. At the same time, test whether there is a short circuit between adjacent electrodes.

[0058] g. Place the tightened mold into the cut PVC tube. Seal one end of the PVC tube with sealing tape and apply Vaseline to the tube wall to facilitate mold removal. After fixing the relative position of the mold and PVC tube, inject the prepared epoxy resin liquid into the PVC tube to seal the sample.

[0059] h. After the epoxy resin dries, tear off the sealing tape on one end of the PVC tube to expose the test electrode. Use different brands of sandpaper to grind and polish the wire bundle electrode.

[0060] The foregoing description of this specification describes specific embodiments. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims can be performed in an order different from that described in the embodiments and still achieve the desired results. Furthermore, the processes depicted in the accompanying drawings do not necessarily require the specific order shown or the sequential order to achieve the desired results. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0061] The foregoing description is merely one or more embodiments of this specification and is not intended to limit this specification. It will be apparent to those skilled in the art that various modifications and variations may be made to one or more embodiments of this specification. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of one or more embodiments of this specification are intended to be within the scope of the claims of this specification.

Claims

1. A method for preparing a hexagonal wire bundle electrode, comprising: Inserting N test electrodes into corresponding N metal tubes from one end, wherein the metal tubes are fixed in a double-layer mold, each layer of the mold containing N holes arranged in a honeycomb hexagonal pattern; Inserting N connecting wires from the other end into the corresponding N metal tubes, and compressing the metal tubes into which the test electrodes and connecting wires have been inserted using a tube-type terminal crimping pliers so that the N connecting wires are fixedly connected to the N test electrodes, with the two ends of the metal tubes respectively inserted into the upper and lower layers of the double-layer mold, wherein the upper end diameter of the upper mold is the same as the diameter of the test electrodes, and the lower end diameter is the same as the outer diameter of the metal tubes; the upper end diameter of the lower mold is the same as the outer diameter of the metal tubes, and the lower end diameter is the same as the diameter of the test electrodes; Putting the double-layer mold into a polyvinyl chloride (PVC) pipe, and after fixing the relative positions of the double-layer mold and the polyvinyl chloride (PVC) pipe, injecting liquid epoxy resin to seal the sample; After the liquid epoxy resin is cured, the N test electrodes are exposed to obtain a wire bundle electrode with a geometrically symmetrical honeycomb-like hexagonal structure, wherein the spacing between any two adjacent test electrodes is the same; Wherein, the test electrode is composed of aluminum-zinc alloy wire, and the aluminum-zinc alloy wire includes aluminum-rich phase alloy wire and zinc-rich phase alloy wire, which is used for proportioning and testing the local material distribution characteristics of the aluminum-zinc alloy plate; The N test electrodes are equally divided into six sub-regions, and the six sub-regions are congruent equilateral triangles. The ratio and arrangement of the aluminum-rich alloy wires and the zinc-rich alloy wires in each sub-region are completely consistent. There is at least one test electrode composed of aluminum-rich alloy wires between any two test electrodes composed of zinc-rich alloy wires. The sub-regions are used to test local electrochemical information, and the global electrochemical information of the wire bundle electrode is characterized by the local electrochemical information in the sub-regions.

2. The method according to claim 1, wherein The double-layer mold is obtained by fixing two single-layer molds by bolts and nuts, wherein each single-layer mold contains N holes arranged in a honeycomb hexagonal shape.

3. The method according to claim 1, wherein Before placing the double-layer mold into the polyvinyl chloride (PVC) pipe, the method further comprises: The connection conductivity between a single test electrode and the connecting wire is tested, and the short circuit between adjacent test electrodes is tested.

4. The method according to claim 1, wherein The N holes arranged in a honeycomb-like hexagonal shape have the same spacing between any adjacent holes, and the spacing is 0.1 to 0.15 cm.

Citation Information

Patent Citations

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