Electrostatic protection structure, circuit board assembly and display device

Abstract

The present invention discloses an electrostatic protection structure, a circuit board assembly, and a display device. The electrostatic protection structure includes a driver chip, a cover tape, and a protective member. The cover tape is used to electrically connect to the electromagnetic layer of the circuit board, and the electromagnetic layer is configured to provide electromagnetic shielding. The protective member is arranged on one side of the thickness of the cover tape and cooperates with the cover tape to form a receiving groove for accommodating the driver chip. The protective member is a metal member and is electrically insulated from the driver chip. The protective member includes a first protective portion, which is arranged around the driver chip, and at least a portion of the first protective portion is arranged relative to the driver chip in the radial direction of the first protective portion. According to the electrostatic protection structure of the present invention, it can play an electrostatic shielding role for the driver chip, improve the anti-static ability of the display device, and avoid the display device from having NG in the ESD electrostatic test.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to an electrostatic protection structure, a circuit board assembly and a display device. Background Art

[0002] Display devices are increasingly used in our daily lives, meeting diverse needs for entertainment, social interaction, and business. Consequently, the pace of display device updates and development is accelerating. For example, mobile phones have become an indispensable communication tool. As phone usage increases, battery life becomes increasingly important. To reduce power consumption, ADFR and low-frequency LTPS technologies are often used to lower the screen refresh rate in certain scenarios, thereby reducing power consumption and extending battery life.

[0003] In the related art, new display devices require new electrostatic protection structures. However, new display devices may fail ESD (Electro-Static Discharge) electrostatic tests during use, affecting the anti-static capability and use effect of the entire display device. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes an electrostatic protection structure that can provide electrostatic shielding for the driver chip, thereby improving the anti-static capability of the display device and preventing the display device from failing an ESD test.

[0005] The present invention also provides a circuit board assembly having the above electrostatic protection structure.

[0006] The present invention also provides a display device having the circuit board assembly.

[0007] According to the first aspect of the present invention, the electrostatic protection structure of the embodiment includes: a driver chip; a cover tape, the cover tape is used to be electrically connected to the electromagnetic layer of the circuit board, and the electromagnetic layer is configured to provide electromagnetic shielding; a protective member, the protective member is arranged on the thickness side of the cover tape and cooperates with the cover tape to form an accommodating groove for accommodating the driver chip, the protective member is a metal member and is electrically insulated from the driver chip, and the protective member includes a first protective portion, the first protective portion is arranged around the driver chip, and at least a portion of the first protective portion is arranged opposite to the driver chip in the radial direction of the first protective portion.

[0008] According to the electrostatic protection structure of an embodiment of the present invention, a protective part is provided on the thickness side of the cover tape, and the first protective part is a metal part and is provided around the driver chip, so that the first protective part plays an electrostatic shielding role for the driver chip, and the protective part can protect the driver chip, reduce the impact of the electrostatic field on the driver chip, and improve the anti-static ability of the electrostatic protection structure, thereby improving the anti-static ability of the module (such as a circuit board assembly, a display device), so as to avoid the impact of the electrostatic test on the module, avoid the situation that the module appears in the electrostatic test, so that the module meets the test specification requirements of the electrostatic field and solves the product pain points.

[0009] In some embodiments, the depth of the receiving groove is equal to the thickness of the driving chip.

[0010] In some embodiments, the first protective portion satisfies at least one of the following conditions: Condition A1: the radial width of the first protective portion is d, d≥0.7mm; Condition A2: the thickness of the first protective portion is t, 0.02mm≤t≤0.08mm; Condition A3: the radial distance between the first protective portion and the driving chip is x, 0.3mm≤x≤0.7mm.

[0011] In some embodiments, the protective member further includes a second protective portion, which is disposed between the cover tape and the first protective portion and defines the accommodating groove together with the first protective portion, and the thickness of the second protective portion is less than that of the first protective portion.

[0012] In some embodiments, the protective member is a copper member.

[0013] In some embodiments, the cover tape includes: a conductive layer, which is used to be electrically connected to the electromagnetic layer; a first insulating layer and a second insulating layer, the first insulating layer and the second insulating layer are respectively arranged on both sides of the thickness of the conductive layer, and the protective member is arranged on the side of the second insulating layer away from the conductive layer.

[0014] In some embodiments, a portion of a surface of the conductive layer facing the second insulating layer is exposed outside the second insulating layer and is used for electrical connection with the electromagnetic layer.

[0015] In some embodiments, the thickness of the second insulating layer is greater than the thickness of the first insulating layer.

[0016] According to an embodiment of the second aspect of the present invention, a circuit board assembly includes: a circuit board, the circuit board includes an electromagnetic layer, the electromagnetic layer is configured to provide electromagnetic shielding; an electrostatic protection structure, the electrostatic protection structure is the electrostatic protection structure according to the embodiment of the first aspect of the present invention, the electrostatic protection structure is arranged on the circuit board, and the cover tape is electrically connected to the electromagnetic layer.

[0017] The circuit board assembly according to the embodiment of the present invention improves the anti-static capability of the circuit board assembly by adopting the above-mentioned electrostatic protection structure.

[0018] A display device according to an embodiment of a third aspect of the present invention includes a display panel and a circuit board assembly according to an embodiment of the second aspect of the present invention, wherein the driving chip is connected to the display panel via the circuit board.

[0019] The display device according to the embodiment of the present invention adopts the above-mentioned circuit board assembly, thereby improving the anti-static capability of the display device and avoiding the NG situation of the display device in the ESD static test.

[0020] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:

[0022] Figure 1 is a schematic diagram of a cover tape and a protective member according to an embodiment of the present invention;

[0023] Figure 2 yes Figure 1 Sectional view along line AA;

[0024] Figure 3 is a cross-sectional view of a cover tape and a protective member according to another embodiment of the present invention;

[0025] Figure 4 is a schematic diagram of a display device according to an embodiment of the present invention;

[0026] Figure 5 yes Figure 4 Another schematic diagram of the display device shown in .

[0027] Reference numerals:

[0028] Display device 300, display panel 201,

[0029] Circuit board assembly 200, circuit board 101, first circuit board 1011, second circuit board 1012,

[0030] Electrostatic protection structure 100, receiving tank 10,

[0031] Driver chip 1,

[0032] Cover tape 2, conductive layer 21, first insulating layer 22, second insulating layer 23,

[0033] Protective element 3 , first protective portion 31 , and second protective portion 32 . DETAILED DESCRIPTION

[0034] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0035] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but those skilled in the art will appreciate the applicability of other processes and / or the use of other materials.

[0036] Hereinafter, an electrostatic protection structure 100 according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[0037] like Figure 1-Figure 2 and Figure 4 As shown, the electrostatic protection structure 100 includes a driver chip 1, a cover tape 2 and a protective member 3. The cover tape 2 is used to electrically connect to the electromagnetic layer (EMI surface) of the circuit board 101 to achieve the grounding function (EMI grounding) of the circuit board 101. The electromagnetic layer is configured to provide electromagnetic shielding so that the circuit in the circuit board 101 can shield electromagnetic interference and ensure the stability of signal transmission; the protective member 3 is arranged on the thickness side of the cover tape 2 and the protective member 3 cooperates with the cover tape 2 to form a receiving groove 10 for receiving the driver chip 1. At least part of the driver chip 1 is arranged in the receiving groove 10. The protective member 3 is a metal member and the protective member 3 is electrically insulated from the driver chip 1 to avoid short circuit of the driver chip 1.

[0038] This application does not impose any specific restrictions on the specific method of electrically insulating the protective member 3 from the driver chip 1; illustratively, the protective member 3 is spaced apart from the driver chip 1 to achieve electrical insulation between the two, or the protective member 3 is spaced apart from the driver chip 1 and an insulating member is provided between the protective member 3 and the driver chip 1 to achieve electrical insulation between the protective member 3 and the driver chip 1.

[0039] The protective member 3 includes a first protective portion 31, which is disposed around the driver chip 1, forming an annular structure. Since the first protective portion 31 is a metal member, at least a portion of the first protective portion 31 is disposed radially opposite the driver chip 1. Therefore, in a longitudinal cross-section of the first protective portion 31, at least a portion of the orthographic projection of the driver chip 1 overlaps with the orthographic projection of the first protective portion 31. This allows the first protective portion 31 to provide an electrostatic shield for the driver chip 1, preventing interference from the electrostatic field on the driver chip 1 and reducing the impact of the electrostatic field on the driver chip 1. This improves the antistatic capability of the electrostatic protection structure 100, thereby improving the antistatic capability of the display device 300 and preventing the display device 300 from being affected by ESD testing. Furthermore, the first protective portion 31 is also electrically insulated from the driver chip 1. Therefore, the inner peripheral wall of the first protective portion 31 can be spaced apart from the outer peripheral wall of the driver chip 1. This facilitates the placement of the driver chip 1 in the receiving slot 10 and prevents damage to the driver chip 1 by the first protective portion 31 when the first protective portion 31 and the driver chip 1 are engaged.

[0040] It can be seen that the protective part 3 can protect the driver chip 1 and prevent the display device 300 from having NG problems in the ESD electrostatic test. For example, the display device 300 may have display problems such as screen flickering, abnormal display, bright and dark lines, or black spots, thereby improving the anti-static ability of products using the display device 300 and the user's use effect.

[0041] For example, in Figure 1-Figure 2 In the example, taking the thickness direction of the cover tape 2 as the up and down direction as an example, the protective member 3 is located on the lower side of the cover tape 2, and the protective member 3 includes a first protective portion 31. The first protective portion 31 is arranged around the driver chip 1, so that the first protective member 3 is formed into a ring shape. The first protective member 3 and the cover tape 2 cooperate to form a receiving groove 10. The first protective portion 31 can define the peripheral side wall of the receiving groove 10, and the cover tape 2 defines the bottom wall of the receiving groove 10. The receiving groove 10 accommodates the driver chip 1.

[0042] In addition, the electrostatic protection structure 100 is a structure in which a protective part 3 is added to the cover tape 2. The electrostatic shielding effect on the driver chip 1 can be achieved without changing the structure, material, and process of the cover tape 2. It also meets the specification requirements of the display device 300 in the ESD electrostatic test, reduces the design cost, and the assembly of the display device 300 is simple, which has good feasibility.

[0043] According to the electrostatic protection structure 100 of an embodiment of the present invention, a protective part 3 is provided on the thickness side of the cover tape 2, and the first protective part 31 is a metal part and is provided around the driver chip 1, so that the first protective part 31 plays an electrostatic shielding role for the driver chip 1, and the protective part 3 can protect the driver chip 1, reduce the influence of the electrostatic field on the driver chip 1, and improve the anti-static ability of the electrostatic protection structure 100, thereby improving the anti-static ability of the module (such as the circuit board assembly 200, the display device 300), so as to avoid the influence of the ESD electrostatic test on the module, avoid the NG situation of the module in the ESD electrostatic test, so that the module meets the test specification requirements of the ESD electrostatic field and solves the product pain points.

[0044] In some embodiments, the depth of the accommodating groove 10 is equal to the thickness of the driver chip 1, so that the accommodating groove 10 has sufficient depth to accommodate the entire driver chip 1, which is beneficial to further reduce the impact of the electrostatic field on the driver chip 1, and at the same time can reduce the thickness of the display device 300, which is beneficial to the thinness of the display device 300.

[0045] In other embodiments, the depth of the receiving groove 10 is slightly greater than the thickness of the driver chip 1 , so that the processing accuracy of the electrostatic protection structure 100 can be reduced, the applicability of the electrostatic protection structure 100 can be improved, and the production cost can be reduced.

[0046] In some embodiments, as Figures 1-4 As shown, the first protective portion 31 satisfies at least one of the following conditions: Condition A1: The radial width of the first protective portion 31 is d, d ≥ 0.7 mm, so that the first protective portion 31 has an appropriate radial width, so as to save the material of the first protective portion 31 while ensuring that the first protective portion 31 has sufficient shielding ability for the driver chip 1, and at the same time facilitate the processing of the first protective portion 31; Condition A2: The thickness of the first protective portion 31 is t, 0.02 mm ≤ t ≤ 0.08 mm, so that the first protective portion 31 has an appropriate thickness, so as to ensure that the first protective portion 31 has sufficient shielding ability for the driver chip 1, and at the same time avoid the first protective portion 31 being too thin to reduce the first protective portion 31's shielding ability for the driver chip 1. The electrostatic shielding capability of the driving chip 1 is improved to avoid the first protective part 31 being too thick and increasing the thickness of the display device 300, so as to take into account both the electrostatic protection capability and the lightweight design of the display device 300; Condition A3: The radial distance between the first protective part 31 and the driving chip 1 is x, 0.3mm≤x≤0.7mm, so that there is a suitable radial distance between the first protective part 31 and the driving chip 1, which is convenient for the installation of the first protective part 3 and the electrical insulation setting between the first protective part 31 and the driving chip 1, while ensuring that the first protective part 31 and the driving chip 1 are compactly arranged, which is beneficial to reducing the space occupied by the first protective part 31 and is beneficial to the arrangement of other components of the display device 300.

[0047] Optionally, when the first protective portion 31 meets condition A1, the radial width d of the first protective portion 31 can be 0.7 mm, 0.8 mm, 0.9 mm, 0.1 mm, or 0.11 mm, etc.; when the first protective portion 31 meets condition A2, the thickness t of the first protective portion 31 can be 0.02 mm, 0.04 mm, 0.05 mm, 0.07 mm, or 0.08 mm, etc.; when the first protective portion 31 meets condition A3, the radial distance x between the first protective portion 31 and the driver chip 1 can be 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, or 0.7 mm, etc.

[0048] In some embodiments, as Figure 3 As shown, the protective member 3 also includes a second protective portion 32, which is arranged between the cover tape 2 and the first protective portion 31, and the second protective portion 32 and the first protective portion 31 jointly define a receiving groove 10 to accommodate the driver chip 1, which is beneficial to further improve the electrostatic shielding ability and protection of the protective member 3 on the driver chip 1, thereby improving the anti-static ability of the electrostatic protection structure 100 and the display device 300, ensuring the stability of the display device 300 in the ESD electrostatic test, so as to avoid the NG situation of the display device 300.

[0049] The thickness of the second protective portion 32 is smaller than that of the first protective portion 31 , so as to reduce the impact on the thickness of the display device 300 while ensuring that the protective member 3 has sufficient electrostatic shielding capability, which is conducive to making the display device 300 lighter and thinner.

[0050] Optionally, the first protection portion 31 and the second protection portion 32 are an integrated piece.

[0051] For example, in Figure 3 In the example, taking the thickness direction of the cover tape 2 as the up and down direction as an example, the protective member 3 is arranged on the lower side of the cover tape 2, and the protective member 3 includes a first protective portion 31 and a second protective portion 32. The first protective portion 31 is formed into a ring shape, and the first protective portion 31 is arranged around the driver chip 1, and the first protective portion 31 and the driver chip 1 are arranged opposite to each other in the radial direction, and the second protective portion 32 is located between the first protective portion 31 and the cover tape 2. The second protective portion 32 and the first protective portion 31 are an integral part, and the second protective portion 32 is located on the upper side of the first protective portion 31, and the second protective portion 32 covers the upper side of the driver chip 1, so that the first protective portion 31 and the second protective portion 32 jointly define the accommodating groove 10 to accommodate the driver chip 1, the first protective portion 31 defines the peripheral side wall of the accommodating groove 10, and the second protective portion 31 defines the bottom wall of the accommodating groove 10, to ensure that the protective member 3 has sufficient electrostatic shielding capability and protection for the driver chip 1.

[0052] In some embodiments, the protective member 3 is a copper member (such as copper foil, etc.), so that the protective member 3 has an electrostatic shielding effect while reducing the production cost of the protective member 3.

[0053] Optionally, the material of the protective member 3 is not limited thereto, and may be, for example, silver. Of course, the protective member 3 may be constructed to include a variety of materials, such as zinc-iron alloy.

[0054] In some embodiments, as Figure 2 As shown, the cover tape 2 includes a conductive layer 21, a first insulating layer 22 and a second insulating layer 23. The conductive layer 21 is used to electrically connect with the electromagnetic layer to achieve the grounding effect (EMI grounding) of the circuit board 101, improve the stability of the display device 300 during use and improve the quality of the display device 300; the first insulating layer 22 and the second insulating layer 23 are respectively arranged on both sides of the thickness of the conductive layer 21 to achieve insulation of the area of ​​the conductive layer 21 covered by the first insulating layer 22 and the second insulating layer 23, to avoid electrical contact between the conductive layer 21 and other components (such as the protective member 3, etc.), and the protective member 3 is arranged on the side of the second insulating layer 23 away from the conductive layer 21, so that the conductive layer 21 is insulated from the protective member 3 and the driving chip 1, thereby ensuring the normal operation of the electrostatic protection structure 100.

[0055] Optionally, when the protective member 3 includes a first protective portion 31 but not a second protective portion 32, the second insulating layer 23 can define the bottom wall of the accommodating groove 10; and when the protective member 3 includes a first protective portion 31 and a second protective portion 32, the second protective portion 32 can define the bottom wall of the accommodating groove 10, and the second protective portion 32 can separate the accommodating groove 10 from the second insulating layer 23.

[0056] Optionally, in the width direction of the cover tape 2 ( Figure 2 In the front-to-back direction), the edges on both sides of the width of the protective member 3 and the edges on both sides of the width of the second insulating layer 23 are respectively arranged flush, so that the protective member 3 can make full use of the layout area provided by the second insulating layer 23, and on the premise of ensuring the insulation between the conductive layer 21 and the protective member 3, it is convenient for the protective member 3 to provide a suitable accommodating groove 10.

[0057] Of course, along the thickness direction of the cover tape 2 , the projection of the protective member 3 may be located within the projection range of the second insulating layer 23 .

[0058] In some embodiments, as Figure 2 and Figure 5 As shown, a portion of the surface of the conductive layer 21 facing the second insulating layer 23 is exposed outside the second insulating layer 23, and the above-mentioned portion of the surface of the conductive layer 21 facing the second insulating layer 23 is used to be electrically connected to the electromagnetic layer to achieve the grounding effect of the circuit board 101, which facilitates the assembly of the electrostatic protection structure 100 and the circuit board 100 to a certain extent.

[0059] For example, in Figure 2 In the example, the first insulating layer 22 and the second insulating layer 23 are respectively arranged on both sides of the thickness of the conductive layer 21, the first insulating layer 22 is located on the upper side of the conductive layer 21 and the first insulating layer 22 covers the entire conductive layer 21, the second insulating layer 23 is located on the lower side of the conductive layer 21, and the second insulating layer 23 covers a part of the surface of the lower side of the conductive layer 21, the surface of the conductive layer 21 not covered by the second insulating layer 23 is used to contact the electromagnetic layer to achieve electrical connection, the protective member 3 is provided on the side of the second insulating layer 23 away from the conductive layer 21, and the driving chip 1 is also provided on the side of the second insulating layer 23 away from the conductive layer 21; it can be seen that the surface of the conductive layer 21 for electrical connection with the electromagnetic layer and the driving chip 1 are located on the same side of the thickness of the conductive layer 21, which facilitates the electrical connection between the conductive layer 21 and the electromagnetic layer and the coordination between the driving chip 1 and the circuit board 101.

[0060] In some embodiments, as Figure 2 As shown, the thickness of the second insulating layer 23 is greater than that of the first insulating layer 22, so that the second insulating layer 23 has sufficient thickness to achieve insulation between the conductive layer 21 and the protective member 3 and the driving chip 1, which is convenient for providing a stable setting environment for the setting of the protective member 3. At the same time, while achieving insulation between the conductive layer 21 and other components, the influence of the thickness of the first insulating layer 22 on the thickness of the display device 300 is reduced, which is conducive to the lightweight and thinning of the display device 300.

[0061] Preferably, the thickness of the first insulating layer 22 is 0.01 mm, and the thickness of the second insulating layer 23 is 0.03 mm.

[0062] The circuit board assembly 200 according to the embodiment of the second aspect of the present invention includes a circuit board 101 and an electrostatic protection structure 100. The circuit board 101 includes an electromagnetic layer, which is configured to provide electromagnetic shielding to avoid electromagnetic interference with the circuits within the circuit board 101 and ensure the stability of the signal transmitted by the circuit board 101; the electrostatic protection structure 100 is the electrostatic protection structure 100 according to the embodiment of the first aspect of the present invention mentioned above. The electrostatic protection structure 100 is arranged on the circuit board 101, and the cover tape 2 is electrically connected to the electromagnetic layer.

[0063] The circuit board assembly 200 according to the embodiment of the present invention improves the anti-static capability of the circuit board assembly 200 by adopting the above-mentioned electrostatic protection structure 100 .

[0064] In some embodiments, as Figure 5As shown, the circuit board 101 includes a first circuit board 1011 and a second circuit board 1012. The first circuit board 1011 is provided with a driver chip 1, and the driver chip 1 is electrically connected to the first circuit board 1011. The second circuit board 1012 is a flexible circuit board (FPC, Flexible Printed Circuit). The second circuit board 1012 is electrically connected to the first circuit board 1011. The second circuit board 1012 includes an electromagnetic layer (the electromagnetic layer has an EMI surface), and the electromagnetic layer is provided with at least one window area (the window area can be optionally a copper leakage area). The window area is electrically connected to the conductive layer 21 to achieve electrical connection between the second circuit board 1012 and the conductive layer 21, thereby achieving the grounding function (EMI grounding) of the second circuit board 1012.

[0065] The display device 300 according to the third embodiment of the present invention includes a display panel 201 and a circuit board assembly 200 according to the second embodiment of the present invention. The driving chip 1 is connected to the display panel 201 through the circuit board 101 .

[0066] The display device 300 according to the embodiment of the present invention improves the anti-static capability of the display device 300 by adopting the above-mentioned circuit board assembly 200, thereby preventing the display device 300 from failing in an ESD test.

[0067] For example, in Figure 5 In the example, the display panel 201 is located on the lower side of the circuit board assembly 200, the driver chip 1 is arranged on the circuit board 101, the protective member 3 surrounds the driver chip 1, and the first protective part 31 of the protective member 3 and the driver chip 1 are arranged radially opposite to each other, and the cover tape 2 is arranged on the upper side of the protective member 3 and the circuit board 101, so that the driver chip 1 is accommodated in the accommodating groove 10 defined by the cover tape 2 and the protective member 3; the cover tape 2 includes a conductive layer 21, a first insulating layer 22 and a second insulating layer 23, and the first insulating layer 22 and the second insulating layer 23 are respectively arranged on both sides of the thickness of the conductive layer 21, and the second insulating layer 23 is located between the protective member 3 and the conductive layer 21, and the part of the surface of the conductive layer 21 not covered by the second insulating layer 23 is opposite to the electromagnetic layer of the second circuit board 1012, and the window area of ​​the electromagnetic layer is electrically connected to the conductive layer 21 to realize the grounding effect of the second circuit board 1012.

[0068] It should be noted that there may be multiple driver chips 1 controlling the display panel 201, and the multiple driver chips 1 are suitable for being provided with the electrostatic protection structure 100 to shield the driver chips 1. Of course, there may also be one driver chip 1.

[0069] Optionally, the display device 300 is a mobile phone, a wearable device, a car computer, a television, etc. Taking a mobile phone as an example, the mobile phone has a flexible display panel, and the electrostatic protection structure 100 is connected to the flexible display panel.

[0070] It is understandable that the display device 300 is not limited thereto, and is applicable to any device having a structure of a display panel 201 and a circuit board 101 and requiring a certain antistatic capability.

[0071] Optionally, the display panel 201 is an OLED display panel, but is not limited thereto.

[0072] In the description of the present invention, it should be understood that the terms "width", "thickness", "up", "down", "front", "back", "left", "right", "inside", "outside", "radial", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, they cannot be understood as limiting the present invention. In addition, features defined as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0073] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0074] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative uses of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0075] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0076] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that: include: a circuit board, the circuit board comprising a first circuit board and a second circuit board, the second circuit board being electrically connected to the first circuit board, the second circuit board comprising an electromagnetic layer, the electromagnetic layer being configured to provide electromagnetic shielding; An electrostatic protection structure, comprising: A driving chip; the driving chip is arranged on the first circuit board; A cover tape, the cover tape is electrically connected to the electromagnetic layer; wherein the cover tape comprises: a conductive layer, a first insulating layer and a second insulating layer, the first insulating layer and the second insulating layer are respectively arranged on both sides of the thickness of the conductive layer, a portion of the surface of the conductive layer facing the second insulating layer is exposed outside the second insulating layer and is used to be electrically connected to the electromagnetic layer; a protective member, the protective member is arranged on the side of the second insulating layer away from the conductive layer, and cooperates with the cover tape to form an accommodating groove for accommodating the driver chip, the protective member is a metal member and is electrically insulated from the driver chip, the protective member comprises a first protective portion, the first protective portion is arranged around the driver chip, and at least a portion of the first protective portion is arranged opposite to the driver chip in the radial direction of the first protective portion.

2. The circuit board assembly according to claim 1, wherein: The depth of the receiving groove is equal to the thickness of the driving chip.

3. The circuit board assembly according to claim 1, wherein: The first protection portion satisfies at least one of the following conditions: Condition A1: The radial width of the first protective portion is d, d ≥ 0.7 mm; Condition A2: The thickness of the first protective portion is t, 0.02 mm ≤ t ≤ 0.08 mm; Condition A3: The radial distance between the first protection portion and the driving chip is x, 0.3 mm ≤ x ≤ 0.7 mm.

4. The circuit board assembly according to claim 1, wherein: The protective member further includes a second protective portion, which is disposed between the cover tape and the first protective portion and defines the accommodating groove together with the first protective portion. The thickness of the second protective portion is smaller than that of the first protective portion.

5. The circuit board assembly according to claim 1, wherein: The protective part is a copper part.

6. The circuit board assembly according to claim 1, wherein: The thickness of the second insulating layer is greater than that of the first insulating layer.

7. A display device, characterized in that: The device comprises a display panel and a circuit board assembly according to any one of claims 1 to 6, wherein the driving chip is connected to the display panel through the circuit board.

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