A glue filling method with a simple structure optimizer

Abstract

The application discloses a kind of simple structure optimizers of gluing and glue filling method, comprising the following steps: S1, heat dissipation fin is installed in the four edge frame notch position in the interior of optimizer box body by positioning column, single-component glue is coated on the end face of four edge frame, and PCBA board is positioned and bonded on four edge frame by hot melt column;S2, after PCBA board installation is completed, double-component glue is filled from the first time in glue filling port, and fills the single space in four edge frame interior;S3, after the first time glue filling is completely solidified, secondly glue filling is carried out from the front of box body, until double-component glue is immersed in overflow groove;S4, after the second glue filling is completely solidified, install face cover, complete assembly.The application is fixed by the adhesion of single-component glue and hot melt column, and PCBA board is stabilized by double action, and double-component glue surface guarantees that PCBA board electronic component can have enough heat dissipation when working, electronic component is placed in sealed protection environment, and the situation that electronic component is polluted and damaged when being installed in the field is avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of photovoltaic optimizer, in particular to a glue pouring method of an optimizer with a simple structure. BACKGROUND

[0002] The photovoltaic optimizer can optimize the output power of each photovoltaic component, independently performs the maximum power point for each photovoltaic component, and is finally the key equipment in the photovoltaic power generation optimization system. It has the functions of maximum energy collection and conversion, data collection and communication, and is suitable for application in different scale grid-connected photovoltaic power generation systems.

[0003] The patent for invention with publication number CN106231809 A discloses a PCBA board and a glue pouring method. The glue pouring layer is arranged on both sides of the PCBA board to protect the circuit board and play a waterproof and dustproof role. For the optimizer installed in the outdoor environment and the structural reason, the glue pouring method in the prior art is difficult to ensure the stability of the PCBA board during subsequent assembly in the process of pouring glue in the interior of the optimizer, which affects the production and assembly efficiency. SUMMARY

[0004] In order to solve the above technical problems, a glue pouring method of an optimizer with a simple structure is provided.

[0005] In order to achieve the above purpose, the present application discloses a glue pouring method of an optimizer with a simple structure, comprising the following steps:

[0006] S1, mounting the heat dissipation fin through the positioning column in the four-edge frame notch position inside the optimizer box body, coating the single-component glue on the four-edge frame end face, and positioning and bonding the PCBA board on the four-edge frame through the hot melt column;

[0007] S2, after the PCBA board is installed, the double-component glue is poured from the glue pouring port for the first time to fill the single space inside the four-edge frame;

[0008] S3, after the first pouring is completely solidified, the second pouring is carried out from the front of the box body until the double-component glue is immersed in the glue overflow groove;

[0009] S4, after the second pouring is completely solidified, the installation face cover is installed to complete the assembly.

[0010] Further, the amount of single-component glue used in S1 is not less than 0.9ml.

[0011] Further, the single-component glue comprises 3-5% of ethylene vinyl oxime silane and methyl ethyl ketone oxime.

[0012] Further, the amount of double-component glue used in S2 is not less than 16.2ml. Further, the single-component glue comprises 3-5% of ethylene vinyl oxime silane and methyl ethyl ketone oxime.

[0013] Further, the two-component glue is composed of A component and B component, the A component includes 40-60% of polydimethylsiloxane and 25-50% of aluminum hydroxide, and the B component includes 20-40% of tetraethoxysilane.

[0014] Further, the glue pouring port and the groove in the S2 are located inside the four-side frame, and the glue pouring port is arranged at the side of the fixed heat dissipation fin.

[0015] Compared with the prior art, the present application has the beneficial effects that: the present application discloses a glue pouring method with a simple structure optimizer, through the adhesion of the single-component glue and the fixation of the hot melt column, the PCBA board is stabilized by double effects, and the double-component glue surface ensures that the electronic elements of the PCBA board can be sufficiently cooled during work, so that the electronic elements are placed in a sealed protection environment, the pollution and damage of the electronic elements during installation in the wild are avoided, the stability of the PCBA board during assembly is ensured, and the work efficiency and product quality are improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] The present application will be further described in detail below in combination with the drawings and specific embodiments.

[0017] Figure 1 The present application is a process flow chart.

[0018] Figure 2 The present application is an internal structure diagram of the optimizer before installation of the PCBA board.

[0019] Figure 3 The present application is an internal structure diagram of the optimizer after installation of the PCBA board.

[0020] Figure 4 The present application is a cross-sectional view of the optimizer.

[0021] In the figure: 1 is an optimizer box body; 2 is a four-side frame; 3 is a heat dissipation fin; 4 is a glue pouring port; 5 is a PCBA board; and 6 is a glue overflow groove. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0023] The present application discloses a glue pouring method with a simple structure optimizer, as shown in Figure 1 and Figure 4 , including the following steps:

[0024] S1, install the heat dissipation fin 3 in the slot position of the four-side frame 2 inside the optimizer box body 1 through the positioning column, coat the single-component glue on the end face of the four-side frame 2, and position and bond the PCBA board 5 on the four-side frame 2 through the hot melt column 7, form a separate space with the four-side frame 2 inside the optimizer box body 1 and the PCBA board 5, separate the electronic elements on one side of the PCBA board 5 from the other side of the PCBA board 5, the entire four-side frame 2 provides an auxiliary mounting plane for the PCBA board 5, facilitates the subsequent assembly work of the PCBA board 5, and the double effects of the bonding of the single-component glue and the fixing of the hot melt column stabilize the PCBA board;

[0025] S2, after the PCBA board 5 is installed, perform the first glue filling from the glue filling port 4 to fill the separate space inside the four-side frame 2, prevent the single-component glue from leaking when the two-component glue is filled, ensure the sealing of the space where the electronic elements on the PCBA board are located and the heat dissipation effect when the electronic elements work, and fix the heat dissipation fin 3 on the optimizer box body 1;

[0026] S3, after the first glue filling is completely solidified, perform the second glue filling from the front face of the box body until the two-component glue is immersed in the glue overflow groove 6 to seal and protect the circuit on the back face of the PCBA board 5;

[0027] S4, after the second glue filling is completely solidified, install the face cover to complete the assembly, and the two glue fillings are performed in sequence, the important electronic elements of the PCBA board are first placed in the sealed and protected environment after the initial glue filling, which avoids the pollution and damage of the electronic elements when installed in the field environment, and the back face of the PCBA is sealed and covered with glue after the installation is completed.

[0028] The single-component glue includes 3-5% of vinyl oxime-based silane and methyl ethyl ketone oxime, the single-component glue of the Tianshan 1527 type is selected, and the use amount of the single-component glue is 0.9 ml.

[0029] The two-component glue is composed of an A component and a B component, the A component includes 40-60% of polydimethylsiloxane and 25-50% of aluminum hydroxide, the B component includes 20-40% of tetraethoxysilane, the two-component glue of the Tianshan 1533 type is selected, the use amount of the two-component glue is not less than 16.2 ml, the single-component glue prevents the two-component glue from leaking when filled, and ensures the sealing of the space where the electronic elements on the PCBA board are located and the heat dissipation effect when the electronic elements work.

[0030] As Figure 2 and Figure 3As shown, the glue pouring port 4 and the slot are located inside the four-side frame 2, and the glue pouring port 4 is arranged at the side of the fixed fin 3, the structural design in the optimizer box body 1 reduces the use amount of the two-component glue to a certain extent, the PCBA board is fixed through the single-component glue and the hot melt column first, the glue is poured on both sides of the PCBA board to protect the electronic elements on the circuit board, and the stability of subsequent PCBA board assembly is ensured.

[0031] The points to be explained are as follows: firstly, in the description of the present application, it is to be explained that, unless otherwise specified and limited, the terms "mounting", "connecting", "connection" should be understood in a broad sense, which can be mechanical connection or electrical connection, or the communication between the internal elements, or direct connection, "up", "down", "left", "right" and the like are only used to represent the relative positional relationship, when the absolute position of the described object changes, the relative positional relationship can change; secondly, in this text, the relationship terms such as first and second are only used to distinguish one entity from another, and do not necessarily require or imply any actual relationship or order between the entities.

[0032] The above examples are only illustrative of the present application and do not constitute a limitation on the protection scope of the present application, and any design identical or similar to the present application belongs to the protection scope of the present application.

Claims

1. A potting method with a simple structure optimizer, characterized in that, Includes the following steps: S1. Install the heat sink (3) in the slot of the four-sided frame (2) inside the optimizer box (1) through the positioning post, apply single-component adhesive to the end face of the four-sided frame (2), and position and bond the PCBA board (5) to the four-sided frame (2) through the hot melt post (7). S2, After the PCBA board (5) is installed, the two-component glue is first applied through the glue inlet (4) to fill the separate space inside the four-sided frame (2); S3. After the first glue has completely solidified, the second glue is poured from the front of the box until the two-component glue is submerged in the overflow tank (6). S4. After the second application of adhesive has completely solidified, install the top cover to complete the assembly.

2. The potting method with a simplified structure optimizer according to claim 1, characterized in that, The amount of single-component adhesive used in S1 is not less than 0.9 ml.

3. A potting method with a simplified structure optimizer according to claim 2, characterized in that, The one-component adhesive comprises 3-5% vinyl oxime silane and methyl ethyl ketone oxime.

4. A potting method with a simplified structure optimizer according to claim 1, characterized in that, The amount of two-component adhesive used in S2 is not less than 16.2 ml.

5. A potting method with a simplified structure optimizer according to claim 4, characterized in that, The two-component adhesive consists of component A and component B. Component A includes 40-60% polydimethylsiloxane and 25-50% aluminum hydroxide, and component B includes 20-40% tetraethoxysilane.

6. A potting method with a simplified structure optimizer according to claim 1, characterized in that, In S2, the glue-filling port (4) and the slot are located inside the four-sided frame (2), and the glue-filling port (4) is set on the side of the fixed heat sink (3).

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