Composite mesh for electronic product structural parts and production method

Abstract

The present invention discloses a composite mesh for electronic product structural parts and a production method. The composite mesh for electronic product structural parts comprises a first mesh and a second mesh. The first mesh serves as a base material to support hardness. The second mesh is hot-melt bonded to the surface of the first mesh by hot-melt adhesive powder. The surface of the second mesh has a hydrophobic and oleophobic layer. The mesh number of the first mesh is smaller than the mesh number of the second mesh. The composite mesh for electronic product structural parts uses hot-melt adhesive powder to bond the first mesh and the second mesh into one. This not only greatly improves production efficiency, saves manpower, and reduces production costs, but also has a simple process, facilitates subsequent assembly on electronic product structural parts, and is suitable for wide promotion and application.

Description

Technical Field

[0001] The invention relates to a composite mesh, in particular to a composite mesh for electronic product structural parts and a production method. Background Art

[0002] 3C products are a collective term for computer, communication, and consumer electronics products, also known as "information appliances." Examples include computers, tablets, mobile phones, and digital audio players. The rapid development and penetration of 3C products into households is based on the rapid advancement of integrated circuits and the internet.

[0003] As we all know, mesh materials are used in the electronic components of 3C products. For example, the speakers or receivers of mobile phones, tablets, or computers require two layers of mesh to be fixed at the openings to ensure that they are waterproof, dustproof, and oil-proof while ensuring air permeability and sound transmission. Currently, most of the existing composite mesh used in electronic product components is fixed with double-sided tape. That is, the mesh on both sides is first bonded with double-sided tape, and then the two layers of mesh are bonded to the electronic product components with double-sided tape. Obviously, this method has the disadvantages of being inconvenient to operate and time-consuming and labor-intensive. Summary of the Invention

[0004] The purpose of the present invention is to provide a composite mesh for electronic product structural parts and a production method to solve the problem in the prior art that the mesh for electronic product structural parts is fixed by double-sided adhesive, which is inconvenient to operate and time-consuming and labor-intensive.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] A composite mesh for electronic product structural parts includes a first mesh and a second mesh. The first mesh serves as a base material to provide hardness support. The second mesh is hot-melt-bonded to the surface of the first mesh by hot-melt adhesive powder. The surface of the second mesh has a hydrophobic and oleophobic layer. The mesh number of the first mesh is smaller than that of the second mesh.

[0007] Furthermore, the first mesh is made of polyester monofilament mesh, the mesh number of the first mesh is 58-175 mesh, the pore size is 120-285μm, the opening rate is 34%-52%, the wire diameter is 67-145μm, the air permeability is 5400-8300L / ㎡s, and the thickness is 65-255μm.

[0008] Furthermore, the mesh number of the first mesh is 58, the pore size is 285 μm, the open porosity is 40%, the wire diameter is 145 μm, the air permeability is 8200 L / ㎡s, and the thickness is 255 μm.

[0009] Furthermore, the mesh number of the first mesh is 175 meshes, the pore size is 105 μm, the open porosity is 52%, the wire diameter is 40 μm, the air permeability is 8275 L / ㎡s, and the thickness is 65 μm.

[0010] Furthermore, the mesh number of the first mesh is 135 meshes, the pore size is 120 μm, the open porosity is 41%, the wire diameter is 67 μm, the air permeability is 6300 L / ㎡s, and the thickness is 105 μm.

[0011] Furthermore, the second mesh is made of polyester monofilament mesh, the mesh number of the second mesh is 305-530 meshes, the pore size is 20-55μm, the opening rate is 10%-40%, the wire diameter is 25-40μm, the air permeability is 750-4700L / ㎡s, and the thickness is 40-70μm.

[0012] Furthermore, the second mesh has a mesh number of 305, a pore size of 53 μm, an open porosity of 40%, a wire diameter of 31 μm, an air permeability of 4700 L / ㎡s, and a thickness of 50 μm.

[0013] Furthermore, the second mesh has a mesh number of 530, a pore size of 23 μm, an open porosity of 27%, a wire diameter of 24 μm, an air permeability of 2100 L / ㎡s, and a thickness of 44 μm.

[0014] Furthermore, the second mesh has a mesh number of 460, a pore size of 25 μm, an open porosity of 20%, a wire diameter of 27 μm, an air permeability of 2750 L / ㎡s, and a thickness of 52 μm.

[0015] A method for producing a composite mesh for electronic product structural parts comprises the following steps:

[0016] 1) performing corona treatment on the surface of the first mesh to make the surface of the first mesh have a higher surface tension to facilitate adsorption of hot melt adhesive powder;

[0017] 2) Apply hot melt adhesive powder with a particle size of 80 to 170 microns evenly on the composite surface of the first mesh.

[0018] 3) The first mesh yarn and the second mesh yarn are pressed and laminated by a roll-to-roll pressing and laminating method.

[0019] The present invention has the beneficial effect of combining a composite mesh for electronic product components and a production method thereof with a first mesh and a second mesh by hot-melt bonding using hot-melt adhesive powder. This not only significantly improves production efficiency, saves labor, and reduces production costs, but also simplifies the process, facilitates subsequent assembly onto electronic product components, and is suitable for widespread application. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a cross-sectional schematic diagram of a composite mesh for electronic product structural parts provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0021] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0022] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the accompanying drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to enable a more thorough and comprehensive understanding of the disclosure of the present invention. It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or there can also be a central component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there can also be a central component. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which the present invention belongs. The terms used in the description of the present invention herein are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the relevant listed items.

[0023] See also Figure 1 As shown, Figure 1 It is a cross-sectional schematic diagram of a composite mesh for electronic product structural parts provided by an embodiment of the present invention.

[0024] Example 1

[0025] A composite mesh for electronic product structural parts includes a first mesh 1 and a second mesh 2. The first mesh 1 serves as a base material to provide hardness support. The second mesh 2 is hot-melt-bonded to the surface of the first mesh 1 by hot-melt adhesive powder 3. The surface of the second mesh 2 has a hydrophobic and oleophobic layer 4. The mesh number of the first mesh 1 is smaller than that of the second mesh 2.

[0026] The first mesh 1 is made of polyester monofilament mesh with a mesh number of 175, a pore size of 105 μm, an open porosity of 52%, a wire diameter of 40 μm, an air permeability of 8275 L / ㎡s, and a thickness of 65 μm.

[0027] The second mesh 2 has a mesh number of 305, a pore size of 53 μm, an open porosity of 40%, a wire diameter of 31 μm, an air permeability of 4700 L / ㎡s, and a thickness of 50 μm.

[0028] Optionally, the mesh number of the first mesh 1 can also be any one of 58 mesh, 74 mesh, 100 mesh or 135 mesh; the pore size can also be any one of 285μm, 220μm, 147μm or 120μm, the open porosity can also be any one of 34%, 40% or 41%, the wire diameter can also be any one of 67μm, 105μm, 120μm or 145μm, the air permeability can also be any one of 5414L / ㎡s, 6300L / ㎡s, 7500L / ㎡s or 8220L / ㎡s, and the thickness can also be any one of 105μm, 120μm, 218μm or 255μm.

[0029] Optionally, the mesh number of the second mesh 2 can also be any one of 355 mesh, 381 mesh, 420 mesh, 460 mesh, 463 mesh, 480 mesh, 508 mesh or 530 mesh; the pore size can also be any one of 18μm, 29μm, 30μm or 38μm, the open porosity can also be any one of 13%, 15%, 20%, 24% or 31%, the wire diameter can also be any one of 24μm, 27μm, 34μm, or 40μm, the air permeability can also be any one of 775L / ㎡s, 1200L / ㎡s, 1900L / ㎡s, 2100L / ㎡s, 3000L / ㎡s or 4500L / ㎡s, and the thickness can also be any one of 44μm, 48μm, 52μm, 60μm or 70μm.

[0030] Example 2

[0031] A composite mesh for electronic product structural parts includes a first mesh 1 and a second mesh 2. The first mesh 1 serves as a base material to provide hardness support. The second mesh 2 is hot-melt-bonded to the surface of the first mesh 1 by hot-melt adhesive powder 3. The surface of the second mesh 2 has a hydrophobic and oleophobic layer 4. The mesh number of the first mesh 1 is smaller than that of the second mesh 2.

[0032] The first mesh 1 has a mesh number of 175, a pore size of 105 μm, an open porosity of 52%, a wire diameter of 40 μm, an air permeability of 8275 L / ㎡s, and a thickness of 65 μm.

[0033] The mesh number of the second mesh 2 is 530 meshes, the pore size is 23 μm, the open porosity is 27%, the wire diameter is 24 μm, the air permeability is 2100 L / ㎡s, and the thickness is 44 μm.

[0034] Optionally, the mesh number of the first mesh 1 can also be any one of 58 mesh, 74 mesh, 100 mesh or 135 mesh; the pore size can also be any one of 285μm, 220μm, 147μm or 120μm, the open porosity can also be any one of 34%, 40% or 41%, the wire diameter can also be any one of 67μm, 105μm, 120μm or 145μm, the air permeability can also be any one of 5414L / ㎡s, 6300L / ㎡s, 7500L / ㎡s or 8220L / ㎡s, and the thickness can also be any one of 105μm, 120μm, 218μm or 255μm.

[0035] Optionally, the mesh number of the second mesh 2 can also be any one of 355 mesh, 381 mesh, 420 mesh, 460 mesh, 463 mesh, 480 mesh, 508 mesh or 530 mesh; the pore size can also be any one of 18μm, 29μm, 30μm or 38μm, the open porosity can also be any one of 13%, 15%, 20%, 24% or 31%, the wire diameter can also be any one of 24μm, 27μm, 34μm, or 40μm, the air permeability can also be any one of 775L / ㎡s, 1200L / ㎡s, 1900L / ㎡s, 2100L / ㎡s, 3000L / ㎡s or 4500L / ㎡s, and the thickness can also be any one of 44μm, 48μm, 52μm, 60μm or 70μm.

[0036] Example 3

[0037] A composite mesh for electronic product structural parts includes a first mesh 1 and a second mesh 2. The first mesh 1 serves as a base material to provide hardness support. The second mesh 2 is hot-melt-bonded to the surface of the first mesh 1 by hot-melt adhesive powder 3. The surface of the second mesh 2 has a hydrophobic and oleophobic layer 4. The mesh number of the first mesh 1 is smaller than that of the second mesh 2.

[0038] The first mesh 1 has a mesh number of 135, a pore size of 120 μm, an open porosity of 41%, a wire diameter of 67 μm, an air permeability of 6300 L / ㎡s, and a thickness of 105 μm.

[0039] The mesh number of the second mesh is 460 mesh, the pore size is 25 μm, the open porosity is 20%, the wire diameter is 27 μm, the air permeability is 2750 L / ㎡s, and the thickness is 52 μm.

[0040] Optionally, the mesh number of the first mesh 1 can also be any one of 58 mesh, 74 mesh, 100 mesh or 135 mesh; the pore size can also be any one of 285μm, 220μm, 147μm or 120μm, the open porosity can also be any one of 34%, 40% or 41%, the wire diameter can also be any one of 67μm, 105μm, 120μm or 145μm, the air permeability can also be any one of 5414L / ㎡s, 6300L / ㎡s, 7500L / ㎡s or 8220L / ㎡s, and the thickness can also be any one of 105μm, 120μm, 218μm or 255μm.

[0041] Optionally, the mesh number of the second mesh 2 can also be any one of 355 mesh, 381 mesh, 420 mesh, 460 mesh, 463 mesh, 480 mesh, 508 mesh or 530 mesh; the pore size can also be any one of 18μm, 29μm, 30μm or 38μm, the open porosity can also be any one of 13%, 15%, 20%, 24% or 31%, the wire diameter can also be any one of 24μm, 27μm, 34μm, or 40μm, the air permeability can also be any one of 775L / ㎡s, 1200L / ㎡s, 1900L / ㎡s, 2100L / ㎡s, 3000L / ㎡s or 4500L / ㎡s, and the thickness can also be any one of 44μm, 48μm, 52μm, 60μm or 70μm.

[0042] The production method of the composite mesh for electronic product structural parts comprises the following steps:

[0043] Step 1: Perform corona treatment on the surface of the first mesh 1 to make the surface of the first mesh 1 have a higher surface tension so that the first mesh 1 can evenly adsorb the hot melt adhesive powder particles; the power of the surface corona treatment is 3KW-8KW, and the surface tension parameter can be detected by dyne ink;

[0044] Step 2: evenly apply hot melt adhesive powder with a particle size of 80 to 170 microns on the composite surface of the first mesh 1. The material of the hot melt adhesive powder can be any one of TPU, PES or PA materials or a mixture of several materials according to the softness and hardness requirements of the composite material;

[0045] Step 3: Press and laminate the first mesh 1 and the second mesh 2 by roll-to-roll pressing and laminating; the pressing and laminating temperature is 100℃~140℃, the pressing speed is 10-25 meters per minute, and the laminating pressure is 0.3-0.4Mpa (kgf / cm 2 ).

[0046] The above embodiments merely illustrate the basic principles and features of the present invention. The present invention is not limited to these examples. Various modifications and variations are possible without departing from the spirit and scope of the present invention. Such modifications and variations are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A composite mesh for electronic product structural parts, comprising a first mesh and a second mesh, characterized in that: The first mesh serves as a base material to provide hardness support. The surface of the first mesh is corona treated. The second mesh is hot-melt bonded to the surface of the first mesh by hot-melt adhesive powder. The surface of the second mesh has a hydrophobic and oleophobic layer. The mesh number of the first mesh is smaller than the mesh number of the second mesh. Hot-melt adhesive powder with a particle size of 80 to 170 microns is evenly applied to the bonded surface of the first mesh. The first mesh is made of polyester monofilament mesh, the mesh number of the first mesh is 58-175 mesh, the pore size is 120-285 μm, the porosity is 34%-52%, the wire diameter is 67-145 μm, the air permeability is 5400-8300 L / ㎡s, and the thickness is 65-255 μm. The second mesh is made of polyester monofilament mesh, the mesh number of the second mesh is 305-530 mesh, the pore size is 20-55 μm, the porosity is 10%-40%, the wire diameter is 25-40 μm, the air permeability is 750-4700 L / ㎡s, and the thickness is 40-70 μm.

2. The composite mesh for electronic product structural parts according to claim 1, characterized in that: The first mesh has a mesh count of 58, a pore size of 285 μm, an open porosity of 40%, a wire diameter of 145 μm, an air permeability of 8200 L / ㎡s, and a thickness of 255 μm.

3. The composite mesh for electronic product structural parts according to claim 1, characterized in that: The mesh number of the first mesh is 175 meshes, the opening rate is 52%, the air permeability is 8275 L / ㎡s, and the thickness is 65 μm.

4. The composite mesh for electronic product structural parts according to claim 1, characterized in that: The mesh number of the first mesh is 135 meshes, the pore size is 120 μm, the open porosity is 41%, the wire diameter is 67 μm, the air permeability is 6300 L / ㎡s, and the thickness is 105 μm.

5. The composite mesh for electronic product structural parts according to claim 1, characterized in that: The second mesh has a mesh number of 305, a pore size of 53 μm, an open porosity of 40%, a wire diameter of 31 μm, an air permeability of 4700 L / ㎡s, and a thickness of 50 μm.

6. The composite mesh for electronic product structural parts according to claim 1, characterized in that: The second mesh has a mesh number of 530, a pore size of 23 μm, an opening rate of 27%, an air permeability of 2100 L / ㎡s, and a thickness of 44 μm.

7. The composite mesh for electronic product structural parts according to claim 1, characterized in that: The second mesh has a mesh number of 460, a pore size of 25 μm, an open porosity of 20%, a wire diameter of 27 μm, an air permeability of 2750 L / ㎡s, and a thickness of 52 μm.

8. A method for producing a composite mesh for electronic product structural parts according to any one of claims 1 to 7, characterized in that: It includes the following steps: 1) performing corona treatment on the surface of the first mesh to make the surface of the first mesh have a higher surface tension to facilitate adsorption of hot melt adhesive powder; 2) Apply hot melt adhesive powder with a particle size of 80 to 170 microns evenly on the composite surface of the first mesh. 3) The first mesh yarn and the second mesh yarn are pressed and laminated by a roll-to-roll pressing and laminating method.

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