A microseismic resistant structure for semiconductor plants

By using a sand layer to absorb vibration waves and a support plate separation structure in a semiconductor factory, combined with telescopic rods, buffer springs and seismic isolation components, the impact of micro-vibrations on equipment is resolved, achieving stable operation of the equipment and stability of the production environment.

CN116065870BActive Publication Date: 2025-09-23CLP UNIVERSAL (BEIJING) CONSTR ENG CO LTD
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Patent Information

Application Number
CN202310195117.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-02-27
Publication Date
2025-09-23
Estimated Expiration
2043-02-27

AI Technical Summary

Technical Problem

Micro-vibrations in semiconductor factories can easily cause equipment deviations, affecting production quality. Existing technologies make it difficult to effectively reduce the impact of micro-vibrations on equipment.

Method used

A sand layer between the foundation and the support plate is used to absorb vibration waves, and the structure is separated by a sand layer between the support plate and the foundation. Telescopic rods, buffer springs and seismic isolation components are combined to reduce vibration transmission. Sensors and control components are used to adjust the structural frame to absorb external vibrations.

Benefits of technology

It effectively reduces the impact of micro-vibration on supporting equipment, prevents equipment resonance, and improves the stability of the production environment and the firmness of the equipment.

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Abstract

This application discloses a microseismic resistant structure for a semiconductor plant, belonging to the field of building structures. The structure comprises a foundation and a structural frame disposed on the foundation. The foundation is provided with a support plate, and a limit block is disposed on the side wall of the support plate near the foundation. The foundation is provided with a limit groove for engaging with the limit block. A sand layer is disposed between the support plate and the foundation, and a support assembly for supporting equipment is disposed on the support plate. This application is effective in reducing the impact of vibration within the plant on semiconductor production.
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Citation Information

Patent Citations

  • Steel structure building with shock absorption and seismic resistance functions

    CN113982136A

  • House anti-seismic structure

    CN213898357U