A high-sensitivity tactile sensor and design method

Abstract

The present invention discloses a highly sensitive and range - adjustable tactile sensor and a design method. The tactile sensor is mainly composed of an upper encapsulation layer, an upper support layer, a sensitive layer, a lower support layer, and a lower encapsulation layer stacked in sequence. The sensitive component adopts a "king" - shaped structure. The upper support block array is mainly formed by alternately arranging flexible strip - shaped support blocks and pressing modules, and the lower support block array is mainly formed by uniformly arranging hard strip - shaped support blocks at intervals. The horizontal unit in the middle of the sensitive component is arranged directly below the pressing module, and the horizontal units on both sides of the sensitive component are arranged between the flexible strip - shaped support blocks and the hard strip - shaped support blocks. The method includes designing the size of the sensitive component and the material ratio of the flexible support block, and using the sensitivity and detection range to manufacture a qualified tactile sensor. The present invention adopts a "king" - shaped sensitive structure and adjusts the elastic modulus of the flexible support structure to increase the detection range, and at the same time realizes the high sensitivity and wide range of the tactile sensor.

Description

Technical Field

[0001] The present invention relates to a tactile sensor and a design method in the field of intelligent robots, and in particular to a high-sensitivity tactile sensor and a design method. Background Art

[0002] With the continuous development of robotics, intelligent robots have become a vital component in fields such as manufacturing, service, underwater operations, and the military. Flexible tactile sensors, which provide robots with tactile information such as force, vibration, and contact object characteristics, are key components for enhancing robotic intelligence. As robotic applications and scenarios continue to expand, designing tactile sensors with specific performance tailored to specific application requirements will help further enhance the adaptability and perception capabilities of intelligent robots.

[0003] Traditional flexible tactile sensors have specific sensing and detection capabilities, and these performance metrics are directly related to the detection principle, core structural design, and sensitive materials. Highly sensitive tactile sensors are key to enabling robots to acquire accurate tactile information, but this high sensitivity often comes with a sharp decrease in detection range. Therefore, changes in the robot's application and the performance requirements for the tactile sensor require changes to the core structure or development of new core materials, as well as a re-exploration of optimal solutions. This is an extremely cumbersome redesign process.

[0004] Therefore, current flexible tactile sensors have the following problems: when the tactile sensor has high-sensitivity detection performance, the detection range drops sharply and is difficult to adjust; when designing tactile sensors with specific performance according to application requirements, the core structure or sensitive materials need to be changed, which is a cumbersome process, high design cost and time-consuming. Summary of the Invention

[0005] Based on the problems existing in the above-mentioned background technology, the purpose of the present invention is to provide a highly sensitive and tactile sensor and design method. The present invention is a tactile sensor structure with both high sensitivity and wide-range performance. Without changing the core structure and sensitive materials, the sensitivity and detection range of the tactile sensor can be adjusted to meet the needs of different application scenarios.

[0006] The purpose of the present invention can be achieved by adopting the following technical solutions:

[0007] 1. A highly sensitive tactile sensor:

[0008] It is mainly composed of an upper packaging layer, an upper support layer, a sensitive layer, a lower support layer and a lower packaging layer stacked in sequence, and the sensitive layer is connected to the external wire;

[0009] By changing the material ratio of the upper support layer and the structural form of the sensitive layer, the measurement range and sensitivity of the tactile sensor are improved, thereby broadening the application range of the tactile sensor and enhancing the accuracy of the tactile information obtained when using the tactile sensor to measure an object.

[0010] The sensitive layer is mainly formed by two rows of sensitive element arrays arranged at intervals along the short side direction of the upper encapsulation layer. Each row of sensitive element arrays is arranged along the long side direction of the upper encapsulation layer. The sensitive element array includes a first sensitive component and a second sensitive component. The first sensitive component is a "king" - shaped structure mainly composed of three first longitudinal units arranged at intervals and a first transverse unit connected together. The second sensitive component is a "king" - shaped structure mainly composed of three second longitudinal units arranged at intervals and a second transverse unit connected together. Both the first longitudinal unit and the second longitudinal unit are arranged along the short side direction of the upper encapsulation layer, and both the first transverse unit and the second transverse unit are arranged along the long side direction of the upper encapsulation layer. The first longitudinal unit on one side of the first sensitive component and the second longitudinal unit on one side of the second sensitive component are connected to form the sensitive element array. The first longitudinal unit on the other side of the first sensitive component is connected with an electrode interface, and the second longitudinal unit on the other side of the second sensitive component is connected with a transition electrode.

[0011] The upper support layer is mainly formed by two rows of upper support block arrays arranged at intervals along the short side direction of the upper encapsulation layer. Each row of upper support block arrays is arranged along the long side direction of the upper encapsulation layer. The upper support block array is mainly formed by alternately arranging flexible strip - shaped support blocks and pressing modules along the long side direction of the upper encapsulation layer. Both the flexible strip - shaped support blocks and the pressing modules are arranged along the short side direction of the upper encapsulation layer. Flexible square support blocks are provided at both ends of the flexible strip - shaped support block on one side of the upper support block array.

[0012] The lower support layer is mainly formed by two rows of lower support block arrays arranged at intervals along the short side direction of the upper encapsulation layer. Each row of lower support block arrays is arranged along the long side direction of the upper encapsulation layer. The lower support block array is mainly formed by a number of hard strip - shaped support blocks evenly arranged at intervals along the long side direction of the upper encapsulation layer. Each hard strip - shaped support block is arranged along the short side direction of the upper encapsulation layer. A hard block - shaped support block is connected to the hard strip - shaped support block on one side of the lower support block array, and hard square support blocks are provided at both ends of the hard strip - shaped support block on the other side of the lower support block array.

[0013] The first horizontal unit in the middle of the first sensitive component and the second horizontal unit in the middle of the second sensitive component are both arranged directly below the pressing module. The first horizontal units on both sides of the first sensitive component and the second horizontal units on both sides of the second sensitive component are both arranged directly below the flexible strip-shaped support block. The first horizontal units on both sides of the first sensitive component and the second horizontal units on both sides of the second sensitive component are both arranged directly above the rigid strip-shaped support block. The flexible square support block and the rigid square support block are arranged in the same position and are aligned. The flexible square support block and the rigid square support block are respectively arranged directly above and below the transition electrode. One side of the lower encapsulation layer is provided with a flange. The electrode interface and the flange in the lower encapsulation layer are respectively arranged directly above and below the rigid block-shaped support block. The electrode interface is used to connect an external wire.

[0014] The lower end face of the pressing module is a columnar curved surface, and the remaining end faces of the pressing module except the lower end face are all flat surfaces; the flexible strip-shaped support block, the flexible square support block, the rigid block-shaped support block, the rigid strip-shaped support block and the rigid square support block are all cuboid structures.

[0015] As Figure 2 shown, the upper support layer includes x pressing modules, y flexible strip-shaped support blocks and 3z flexible square support blocks; as Figure 3 shown, the sensitive layer includes two electrode interfaces, x sensitive components, and z transition electrodes. The electrode interface is used to connect an external circuit. The resistance of the sensitive component increases extremely when stretched and decreases when pressed. The transition electrode is used to connect the sensitive components in different rows; as Figure 4 shown, the lower support layer includes y rigid strip-shaped support blocks and 3z rigid square support blocks.

[0016] As Figure 5-Figure 7 shown, both sides of the "king" - shaped sensitive component are clamped up and down by the flexible strip-shaped support block and the rigid strip-shaped support block, and the pressing module is arranged directly above the middle of the "king" - shaped sensitive component. When an external pressure is applied to the tactile sensor, the flexible strip-shaped support block and the rigid strip-shaped support block will squeeze both sides of the "king" - shaped sensitive component, and compressive strain will be generated on both sides of the "king" - shaped sensitive component. The pressing module will squeeze the middle area of the "king" - shaped sensitive component, and compressive strain will be generated in the middle area of the "king" - shaped sensitive component. Both sides of the "king" - shaped sensitive component are subjected to two-way extrusion, while the middle area is subjected to one-way extrusion. Therefore, tensile strain will be generated in other areas of the "king" - shaped sensitive component.

[0017] As Figure 8 、 Figure 9 and Figure 11 shown, the middle and both ends of the "king" - shaped sensitive component have relatively large lengths l1, l3, and the remaining parts have a relatively small length l2. This structural form is used to divide the total resistance of the "king" - shaped sensitive component into three parts R1两端 , R 3中间 , R 2其余 , because the lengths at both ends of the sensitive component are longer than that in the middle and the cross-sectional area is larger, there is the following relationship R2 >> R1, R2 >> R3 when the resistivity is the same. Therefore, when the two ends and the middle of the sensitive component are pressed, the total resistance of the sensitive component will decrease slightly, while when the rest of the sensitive component is stretched, the total resistance of the sensitive component will increase sharply, thereby achieving an improvement in sensitivity; when l2 is further reduced, the initial resistance of R2 and its proportion relative to the total resistance will also increase further, and the change in the total resistance caused by the stretching of this part of the structure will also be more obvious, thereby achieving an improvement in the sensitivity of the sensitive component.

[0018] As Figure 10 shown, the lower end face of the pressing module is a cylindrical curved surface. When the tactile sensor is pressed, this end face contacts the "king" - shaped sensitive component, reducing the area of the region where the "king" - shaped sensitive component generates compressive strain.

[0019] As Figure 11 shown, when the tactile sensor is pressed, the flexible strip - shaped support block and the flexible square - shaped support block will be compressed and flattened, while the sizes of the rigid strip - shaped support block and the rigid square - shaped support block hardly change. Therefore, the downward displacement of the pressing module depends on the elastic modulus of the flexible strip - shaped support block and the flexible square - shaped support block. When the same external load is applied, when the elastic modulus of the flexible strip - shaped support block and the flexible square - shaped support block is large, the downward displacement of the pressing module is small, the strain generated in the stretching regions F1 and F2 of the sensitive component is small, and the resistance change is small, that is, the sensitivity of the tactile sensor is low; when the elastic modulus of the flexible strip - shaped support block and the flexible square - shaped support block is small, the downward displacement of the pressing module is large, the strain generated in the stretching regions F1 and F2 of the sensitive component is large, and the resistance change is large, that is, the sensitivity of the tactile sensor is high. And the downward displacement of the pressing module is limited, and it can move downward at most by a displacement equal to the thickness of the lower support layer. At this time, the force of the external load is the maximum detection range of the tactile sensor. Therefore, if the elastic modulus of the flexible strip - shaped support block and the flexible square - shaped support block is increased, the maximum detection range of the tactile sensor can be increased; in addition, the sensitivity can be improved by adjusting the structural parameters of the "king" - shaped sensitive component, and high sensitivity and wide range of the tactile sensor can be achieved simultaneously.

[0020] The upper encapsulation layer is a flexible film, which can effectively cover the internal layer structure of the tactile sensor; the sensitive components in the sensitive layer are mainly composed of composite sensitive materials; the lower support layer includes rigid support blocks with multiple sensitive structures and electrode interfaces; the lower encapsulation layer and the upper encapsulation layer can cover the upper support layer, the sensitive layer and the rigid support blocks of the sensitive structures on the lower encapsulation layer, and serve as the base of the electrode interfaces on the lower encapsulation layer.

[0021] When an external pressure is applied to the tactile sensor, the downward displacement causes the pressing module and the flexible support block of the sensitive structure to press on the sensitive component. Compressive deformation occurs at the positions where the sensitive component contacts the pressing module and the flexible support block, and tensile deformation occurs at the remaining non-contact positions. When the same pressure is applied, the magnitude of the downward displacement of the pressing module can be controlled by adjusting the elastic modulus of the flexible support block of the sensitive structure, thereby controlling the deformation magnitude of the sensitive component and changing the bearing capacity of the tactile sensor. The present invention proposes a "king" - shaped sensitive component, which can increase the tensile strain of the sensitive structure when the tactile sensor is pressed, reduce the area of the pressed area, thereby increasing the sensitivity of the tactile sensor; improve the stiffness of the support structure and achieve adjustable range.

[0022] The beneficial effects of the present invention are as follows:

[0023] 1. The present invention adopts a "king" - shaped sensitive structure, which increases the tensile deformation of the sensitive structure and the cross - sectional area of the pressed area of the sensitive structure, improves the increase value of the resistance caused by tensile deformation of the sensitive structure, reduces the decrease value of the resistance caused by compressive deformation, thereby realizing the improvement of the sensitivity of the tactile sensor. In addition, the elastic modulus of the flexible support structure can be adjusted to increase the detection range, and at the same time, high sensitivity and wide range are achieved.

[0024] 2. The present invention can first improve the compressive resistance of the tactile sensor by increasing the elastic modulus of the flexible support structure to meet the detection range requirements of application needs. Based on this, the structural parameters of the "king" - shaped sensitive structure are designed, and the efficient design of a tactile sensor with specific performance can be achieved without changing the core structure and materials. Brief Description of the Drawings

[0025] Figure 1 is the inclined exploded view of the present invention;

[0026] Figure 2 is the top view of the upper support layer of the present invention;

[0027] Figure 3 is the top view of the sensitive layer of the present invention;

[0028] Figure 4 is the top view of the lower support layer of the present invention;

[0029] Figure 5 is the top view and front view of the present invention;

[0030] Figure 6 is the partial enlarged view of the present invention;

[0031] Figure 7 is Figure 6 the cross - sectional view taken along the line E - E of

[0032] Figure 8 is the top view of the first sensitive component of the present invention;

[0033] Figure 9 is a top view of the second sensitive component of the present invention;

[0034] Figure 10 It is a diagram of the pressing module of the present invention;

[0035] Figure 11 It is a schematic diagram of the working principle of the present invention;

[0036] Figure 12 It is a flow chart of the design method of the present invention;

[0037] In the figure: 1-1, upper packaging layer; 1-2, lower packaging layer; 2, upper support layer; 3, sensitive layer; 4, lower support layer; 5, pressing module; 6, flexible strip-type support block; 7, flexible square-type support block; 8, electrode interface; 9, first sensitive component; 10, second sensitive component; 11, transition electrode; 12, hard block-shaped support block; 13, hard strip-type support block; 14, hard square-type support block. DETAILED DESCRIPTION

[0038] The embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0039] like Figure 1 As shown, it is mainly composed of an upper packaging layer 1-1, an upper support layer 2, a sensitive layer 3, a lower support layer 4 and a lower packaging layer 1-2 which are sequentially stacked by heating and curing. The upper packaging layer 1-1 and the lower packaging layer 1-2 constitute the packaging layer of the tactile sensor, and the sensitive layer 3 is connected to the external wire;

[0040] By changing the material ratio of the upper support layer 2 and the structural form of the sensitive layer 3, the range and sensitivity of the tactile sensor are respectively improved, thereby broadening the application range of the tactile sensor and improving the accuracy of tactile information obtained when measuring objects using the tactile sensor.

[0041] like Figure 3As shown, the sensitive layer 3 is mainly formed by two rows of sensitive element arrays arranged at intervals along the short side direction of the upper packaging layer 1-1, and each row of sensitive element arrays is arranged along the long side direction of the upper packaging layer 1-1. The sensitive element array includes a first sensitive component 9 and a second sensitive component 10 of equal thickness. The first sensitive component 9 is a "W"-shaped structure mainly composed of three horizontally spaced first longitudinal units and a first transverse unit connected, and the first transverse unit is perpendicular to the first longitudinal unit. The second sensitive component 10 is a "W"-shaped structure mainly composed of three horizontally spaced second longitudinal units and a second transverse unit connected, and the second transverse unit is perpendicular to the second longitudinal unit. Unit, and the first longitudinal unit and the second longitudinal unit are both arranged along the short side direction of the upper packaging layer 1-1, and the first transverse unit and the second transverse unit are both arranged along the long side direction of the upper packaging layer 1-1; the first longitudinal unit on one side (i.e., the left side) of the first sensitive component 9 and the second longitudinal unit on one side (i.e., the right side) of the second sensitive component 10 are connected to form a sensitive component array, the first longitudinal unit on the other side (i.e., the right side) of the first sensitive component 9 is connected to the electrode interface 8, and the second longitudinal unit on the other side of the second sensitive component 10 is connected to the transition electrode 11, and the second longitudinal units of the second sensitive components 10 in the two rows of sensitive component arrays are connected through the transition electrode 11.

[0042] like Figure 2 As shown, the upper support layer 2 is mainly formed by two rows of upper support block arrays arranged at intervals along the short side direction of the upper packaging layer 1-1, and each row of upper support block arrays is arranged along the long side direction of the upper packaging layer 1-1. The upper support block array is mainly formed by flexible strip-type support blocks 6 and pressing modules 5 of equal thickness arranged alternately along the long side direction of the upper packaging layer 1-1, and at least one pressing module 5 is arranged between each two adjacent flexible strip-type support blocks 6. The flexible strip-type support blocks 6 and the pressing modules 5 are both arranged along the short side direction of the upper packaging layer 1-1, and the left and right sides of the upper support block array are both flexible strip-type support blocks 6, and flexible square support blocks 7 are provided at both ends of the flexible strip-type support blocks 6 on one side of the upper support block array, and flexible square support blocks 7 are not provided at both ends of the flexible strip-type support blocks 6 on the other side of the upper support block array;

[0043] The left and right sides are two ends of the upper encapsulation layer 1 - 1 along the long side direction, and the front and back sides are two ends of the upper encapsulation layer 1 - 1 along the short side direction.

[0044] like Figure 4As shown, the lower support layer 4 is mainly formed by two rows of lower support block arrays arranged at intervals along the short side direction of the upper packaging layer 1-1, and each row of lower support block arrays is arranged along the long side direction of the upper packaging layer 1-1. The lower support block array is mainly formed by a number of hard strip-type support blocks 13 evenly arranged along the long side direction of the upper packaging layer 1-1, and each hard strip-type support block 13 is arranged along the short side direction of the upper packaging layer 1-1. The hard strip-type support blocks 13 on one side (i.e., the right side) of the lower support block array are connected with hard block-shaped support blocks 12 of the same thickness, and the two ends of the hard strip-type support blocks 13 on the other side (i.e., the left side) of the lower support block array are provided with hard square support blocks 14 of the same thickness. The hard strip-type support blocks 13 in the two rows of lower support block arrays are connected by hard square support blocks 14.

[0045] The first transverse unit in the middle of the first sensitive component 9 and the second transverse unit in the middle of the second sensitive component 10 in the sensitive layer 3 are both arranged directly below the pressing module 5 in the upper supporting layer 2, that is, the middle transverse unit array mainly composed of the first transverse unit in the middle of the first sensitive component 9 and the second transverse unit in the middle of the second sensitive component 10 has the same arrangement position distribution as the pressing module 5 and the arrangement positions are aligned one by one in the vertical direction, the first transverse units on both sides of the first sensitive component 9 and the second transverse units on both sides of the second sensitive component 10 are both arranged directly below the flexible strip support block 6 in the upper supporting layer 2, the first transverse units on both sides of the first sensitive component 9 and the second transverse units on both sides of the second sensitive component 10 are both arranged directly above the hard strip support block 13 in the lower supporting layer 4, that is, the first transverse units on both sides of the first sensitive component 9 are mainly composed of the first transverse units on both sides of the first sensitive component 9. The two side lateral unit arrays composed of the second lateral units on both sides of the unit and the second sensitive component 10, the flexible strip support blocks 6 and the hard strip support blocks 13 have the same arrangement position distribution and are aligned one by one in the vertical direction, the flexible square support blocks 7 and the hard square support blocks 14 have the same arrangement position distribution and are aligned in the vertical direction, the flexible square support blocks 7 and the hard square support blocks 14 are respectively arranged directly above and directly below the transition electrode 11, a flange is provided on one side of the lower packaging layer 1-2, the electrode interface 8 and the flange in the lower packaging layer 1-2 are respectively arranged directly above and directly below the hard block support block 12, that is, the electrode interface 8, the flange of the lower packaging layer 1-2 and the hard block support block 12 have the same arrangement position distribution and are aligned in the vertical direction, and the electrode interface 8 is used to connect external wires.

[0046] like Figure 10 As shown, the lower end face of the pressing module 5 (i.e., the end face close to the sensitive layer 3) is a cylindrical surface, and the other end faces of the pressing module 5 except the lower end face are all flat surfaces; the flexible strip-type support block 6, the flexible square support block 7, the hard block-shaped support block 12, the hard strip-type support block 13 and the hard square support block 14 are all rectangular structures.

[0047] like Figure 8 As shown, the first sensitive component 9 has six important structural parameters, and the relationship between the structural parameters is l1≥l2>l3, w3>>w2>w1, the structural parameter w1 is the same as the width w4 of the flexible strip support block 6 and the width w5 of the hard strip support block 13, and the structural parameter l1 is the same as the length l4 of the flexible strip support block 6 and the length l5 of the hard strip support block 13; the second sensitive component 10 is connected to the first sensitive component 9 and has the same six important structural parameters and parameter relationships; the first sensitive component 9 and the second sensitive component 10 constitute the sensitive element of the tactile sensor, and the number of the second sensitive components 10 can be increased according to application requirements to expand the sensing area of ​​the tactile sensor.

[0048] The thickness of the upper encapsulation layer 1-1 and the lower encapsulation layer 1-2 are both 200 μm; the thickness of the upper support layer 2 and the lower support layer 4 are both 300 μm; and the thickness of the sensitive layer 3 is 100 μm.

[0049] A method for designing a tactile sensor includes the following steps:

[0050] Step 1): Figure 12 As shown, the performance index of the tactile sensor is determined as sensitivity S according to the application requirements. I , detection range R I , according to the preset structural dimensions, the first sensitive component 9 and the second sensitive component 10 are respectively manufactured to form a sensitive layer 3, and at the same time, according to the preset material ratio, the flexible strip-shaped support block 6 and the flexible square-shaped support block 7 are respectively manufactured to form the upper support layer 2. In a specific implementation, the structural dimension parameters of the first sensitive component 9 and the second sensitive component 10 are l1, l2, l3, w1, w2, and w3, respectively, and the material ratio of the flexible strip-shaped support block 6 and the flexible square-shaped support block 7 is x:1. The upper encapsulation layer 1-1, the upper support layer 2, the sensitive layer 3, the lower support layer 4, and the lower encapsulation layer 1-2 are assembled to form a tactile sensor;

[0051] Step 2): After the tactile sensor is manufactured, the performance of the tactile sensor is tested to obtain the detection range R0 of the tactile sensor:

[0052] If the detection range R0 of the tactile sensor is less than the preset range threshold R I , it indicates that the tactile sensor is not qualified, and proceed to step 3);

[0053] If the detection range R0 of the tactile sensor is not less than the preset range threshold R I , it indicates that the detection range R0 of the tactile sensor is qualified, and proceed to step 4);

[0054] Step 3): Modify the material ratio of the flexible strip support block 6 and the flexible square support block 7, and re-manufacture the flexible strip support block 6 and the flexible square support block 7 according to the modified material ratio to form a new upper support layer 2. Use the new upper support layer 2 to reassemble to make a new tactile sensor. In the specific implementation, reduce the material ratio of the flexible long support block 6 and the flexible square support block 7, that is, reduce the ratio of polydimethylsiloxane to curing agent, increase the elastic modulus of the two structures, and return to step 2) to re-test the detection range R0 of the tactile sensor;

[0055] Step 4): After the detection range R0 of the tactile sensor meets the requirements, the tactile sensor is subjected to a performance test to obtain the sensitivity S0 of the tactile sensor:

[0056] If the sensitivity S0 of the tactile sensor is less than the preset sensitivity S0 threshold S I , it indicates that the tactile sensor is not qualified, and proceed to step 5);

[0057] If the sensitivity S0 of the tactile sensor is not less than the preset sensitivity S0 threshold S I , it indicates that the design of the tactile sensor is qualified, and the qualified tactile sensor is used to detect the object to be measured to obtain tactile information of the object to be measured.

[0058] Step 5): Modify the structural dimensions of the first sensitive component 9 and the second sensitive component 10, and remake the first sensitive component 9 and the second sensitive component 10 according to the modified structural dimensions and form a new sensitive layer 3, and reassemble them using the new sensitive layer 3 to make a new tactile sensor. In the specific implementation, reduce the structural parameters w2, w3, l2 of the sensitive components 9 and 10, reduce the cross-sectional area and length of the tensile parts F1 and F2 in the sensitive components 9 and 10, thereby increasing the tensile strain of the sensitive components 9 and 10, and improving the sensitivity S0 of the tactile sensor, and return to step 4) to re-detect the sensitivity S0 of the tactile sensor.

Claims

1. A highly sensitive tactile sensor, characterized in that: It is mainly composed of an upper encapsulation layer (1-1), an upper support layer (2), a sensitive layer (3), a lower support layer (4) and a lower encapsulation layer (1-2) stacked in sequence. The sensitive layer (3) is connected to an external wire; The sensitive layer (3) is mainly formed by arranging two rows of sensitive element arrays at intervals along the short side direction of the upper encapsulation layer (1-1). Each row of sensitive element arrays is arranged along the long side direction of the upper encapsulation layer (1-1). The sensitive element array includes a first sensitive component (9) and a second sensitive component (10). The first sensitive component (9) is a "king" - shaped structure mainly composed of three first longitudinal units arranged at intervals and one first transverse unit connected. The second sensitive component (10) is a "king" - shaped structure mainly composed of three second longitudinal units arranged at intervals and one second transverse unit connected. Both the first longitudinal unit and the second longitudinal unit are arranged along the short side direction of the upper encapsulation layer (1-1), and both the first transverse unit and the second transverse unit are arranged along the long side direction of the upper encapsulation layer (1-1). The first longitudinal unit on one side of the first sensitive component (9) and the second longitudinal unit on one side of the second sensitive component (1) are connected to form a sensitive element array. The first longitudinal unit on the other side of the first sensitive component (9) is connected to an electrode interface (8), and the second longitudinal unit on the other side of the second sensitive component (10) is connected to a transition electrode (11).

2. The high-sensitivity tactile sensor according to claim 1, characterized in that: The upper support layer (2) is mainly formed by arranging two rows of upper support block arrays at intervals along the short side direction of the upper encapsulation layer (1-1). Each row of upper support block arrays is arranged along the long side direction of the upper encapsulation layer (1-1). The upper support block array is mainly formed by alternately arranging flexible strip - shaped support blocks (6) and pressing modules (5) along the long side direction of the upper encapsulation layer (1-1). Both the flexible strip - shaped support blocks (6) and the pressing modules (5) are arranged along the short side direction of the upper encapsulation layer (1-1). And both sides of the upper support block array are flexible strip - shaped support blocks (6). Flexible square support blocks (7) are provided at both ends of the flexible strip - shaped support block (6) on one side of the upper support block array; The lower support layer (4) is mainly formed by arranging two rows of lower support block arrays at intervals along the short side direction of the upper encapsulation layer (1-1). Each row of lower support block arrays is arranged along the long side direction of the upper encapsulation layer (1-1). The lower support block array is mainly formed by evenly arranging a number of hard strip - shaped support blocks (13) along the long side direction of the upper encapsulation layer (1-1). Each hard strip - shaped support block (13) is arranged along the short side direction of the upper encapsulation layer (1-1). The hard strip - shaped support block (13) on one side of the lower support block array is connected to a hard block - shaped support block (12). Hard square support blocks (14) are provided at both ends of the hard strip - shaped support block (13) on the other side of the lower support block array.

3. The high-sensitivity tactile sensor according to claim 2, characterized in that: The first transverse unit in the middle of the first sensitive component (9) and the second transverse unit in the middle of the second sensitive component (10) are both arranged directly below the pressing module (5); the first transverse units on both sides of the first sensitive component (9) and the second transverse units on both sides of the second sensitive component (10) are both arranged directly below the flexible strip-shaped support block (6); the first transverse units on both sides of the first sensitive component (9) and the second transverse units on both sides of the second sensitive component (10) are both arranged directly above the hard strip-shaped support block (13); the flexible square support block (7) and the hard square support block (14) are arranged in the same position and aligned; the flexible square support block (7) and the hard square support block (14) are respectively arranged directly above and directly below the transition electrode (11); a flange is provided on one side of the lower packaging layer (1-2); the electrode interface (8) and the flange in the lower packaging layer (1-2) are respectively arranged directly above and directly below the hard block-shaped support block (12); and the electrode interface (8) is used to connect an external wire.

4. The high-sensitivity tactile sensor according to claim 2, characterized in that: The lower end face of the pressing module (5) is a cylindrical surface, and the other end faces of the pressing module (5) except the lower end face are all planes; the flexible strip-shaped support block (6), the flexible square-shaped support block (7), the hard block-shaped support block (12), the hard strip-shaped support block (13) and the hard square-shaped support block (14) are all rectangular parallelepiped structures.

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