Optical fiber array assembly and method of manufacture

Abstract

This invention relates to the field of fiber optic array technology, and provides a fiber optic array assembly and its manufacturing method. The assembly includes a trench 22 adjacent to a fixing stage 23, and located below the cover plate 1 and the fixed array optical fibers 3 after the cover plate 1 is closed. Structural adhesive 4 is injected from the interface perpendicular to the extension direction of the array optical fibers 3 on the cover plate 1 relative to the fixing stage 23, and after overflowing into the trench 22, it completes the fixing effect between the cover plate 1 and the fixing stage 23. This invention effectively isolates the coupling adhesive from flowing to and near the fiber end face by processing an adhesive-separating groove on the substrate.

Description

[Technical Field]

[0001] This invention relates to the field of fiber optic array technology, and in particular to a fiber optic array component and its manufacturing method. [Background Technology]

[0002] Optical waveguide chips serve as an integrated solution for multi-channel optical devices, such as multi-channel beam splitters, wavelength division multiplexers / demultiplexers based on arrayed waveguide gratings, and 4- or 8-channel optical waveguide transceiver assemblies. In multi-channel optical waveguide chip packaging, fiber arrays, as a type of fiber optic component, are typically used as the signal interface for the waveguide chip's input / output, and are widely applied in optical waveguide device packaging.

[0003] In recent years, optoelectronic integration technology based on silicon waveguides has developed rapidly. Unlike previous planar optical splitters and wavelength division multiplexing / demultiplexer chips, silicon optical waveguide chips mostly adopt cantilever waveguide structures on the coupling end face. The waveguide end face is 5 to 30 μm away from the chip substrate in the horizontal direction and has a 100 μm etching step in the vertical direction.

[0004] Traditional fiber optic array end faces are fabricated by bonding and fixing the fiber, substrate, and cover plate together, followed by grinding and polishing. When coupling conventional fiber optic arrays to chips, the end face adhesive serves both as a structural bond and as a refractive index match.

[0005] Due to the horizontal spacing of 5–30 μm, conventional fiber arrays cannot be used for coupling and packaging silicon waveguide chips. Furthermore, considering the refractive index requirements of the waveguide end face, this type of silicon photonic chip coupling and packaging requires two types of adhesives: one for fiber bonding and the other for matching the refractive index of the coupling end face. The bonding adhesive must not penetrate into the coupling end face.

[0006] Therefore, overcoming the shortcomings of the existing technology is an urgent problem to be solved in this technical field. [Summary of the Invention]

[0007] The technical problem to be solved by this invention is that the end face of traditional fiber optic array components is made by bonding and fixing the fiber, substrate and cover plate and then grinding and polishing them. The corresponding structure is prone to glue penetration.

[0008] This invention provides a fiber optic array assembly, including a cover plate 1, a substrate 2, array optical fibers 3, and structural adhesive 4. The cover plate 1 has V-grooves 11 engraved on it, and the number and spacing of the V-grooves 11 are consistent with the channel spacing of the optical waveguide chip. The substrate 2 is provided with grooves 22 and a fixing stage 23 for the fiber optic array. Specifically:

[0009] The fiber core end face of the array fiber 3 is coupled to the end face of the cover plate 1, and the cover plate 1 covers the fixing platform 23 of the fiber array.

[0010] The groove 22 is adjacent to the fixing platform 23, and after the cover plate 1 is closed, it is located below the cover plate 1 and the fixed array optical fiber 3.

[0011] The structural adhesive 4 is injected from the interface between the relatively fixed platform 23 and the cover plate 1 at a point perpendicular to the extension direction of the relatively arrayed optical fiber 3. After overflowing into the groove 22, the structural adhesive 4 completes the fixing effect between the cover plate 1 and the fixed platform 23.

[0012] Preferably, the cover plate 1 covers the fixing platform 23 of the fiber optic array, specifically including:

[0013] The edge of the cover plate 1 that is flush with the end face of the optical fiber protrudes 5 to 30 μm from the edge of the substrate 2, wherein the 5 to 30 μm is determined according to the etching width of the end face of the optical waveguide chip.

[0014] The 5-30μm protrusion is obtained during the manufacturing process by aligning the edge of the substrate 2 with the edge of the cover plate 1, sinking it, pressing the array optical fiber 3, and then moving the substrate backward by 5-30μm using a fine-tuning frame.

[0015] Preferably, the trench 22 includes a first step 221 and a second step 222, specifically:

[0016] One side of the first step 221 is the first side surface of the substrate 2, and the first side surface is the same side as the end face of the array optical fiber 3; wherein, the upper surface of the first step 221 is recessed by a first distance relative to the upper surface of the substrate 2.

[0017] The second step 222 is located between the first end step 221 and the fixed platform 23, and the upper surface of the second step 222 is sunk a second distance relative to the upper surface of the substrate 2.

[0018] The second distance is greater than the first distance, thus forming a trench structure.

[0019] Preferably, the first distance is 0.15mm ± 0.03mm; the second distance is 0.3mm ± 0.03mm; the width of the first end step 221 is 0.2mm ± 0.03mm; and the width of the second step 222 is 0.2mm ± 0.03mm.

[0020] Preferably, the fixed platform 23 is provided with a set of damping grooves 231 perpendicular to the fiber array layout direction, which are used to match the damping of the adhesive flow that forms the gap between the optical fibers by injecting structural adhesive 4 and the damping of the adhesive flow that forms the gap after the optical fibers are covered on the V-shaped groove 11 of the cover plate 1.

[0021] Preferably, the damping groove 231 includes the following specific characteristics in terms of groove type, number of grooves, and groove spacing:

[0022] By adjusting one or more parameters of the groove type, number of grooves, and groove spacing, during the test, the difference between the first velocity of the structural adhesive 4 overflowing from the gap between the optical fibers into the groove 22 and the second velocity of the structural adhesive 4 overflowing from the gap formed after the optical fibers are covered on the V-groove 11 of the cover plate 1 into the groove 22 is less than a preset value.

[0023] Secondly, the present invention provides a method for manufacturing an optical fiber array, the method comprising:

[0024] Place the cover plate 1 with the V-groove 11 engraved on the fabrication table, and place the part of the array fiber 3 with the coating removed into the V-groove 11. The end face of the array fiber 3 is flush with the edge of the cantilever waveguide coupling cover plate.

[0025] The substrate 2 is placed above the array optical fiber 3; wherein, after the edge of the substrate 2 is aligned with the edge of the cover plate 1, it is lowered to press the array optical fiber 3.

[0026] Structural adhesive 4 is added at the coupling point between the cover plate 1 and the tail of the array optical fiber 3. The adhesive is observed to penetrate along the optical fiber. When it penetrates to the groove 22 of the substrate 2, the structural adhesive 4 is cured.

[0027] Preferably, after the edge of the substrate 2 is aligned with the edge of the cover plate 1 and then recessed to press the array optical fiber 3, the substrate 2 further includes:

[0028] The substrate is moved backward by 5 to 30 μm using a fine-tuning fixture. The distance of 5 to 30 μm is determined based on the etching width of the optical waveguide chip end face.

[0029] Preferably, after the cover plate 1 and the substrate 2 are fixed, the whole thing is rotated 180°, and protective adhesive 5 is added to the array optical fiber 3 at the tail of the substrate 2 so that the array optical fiber 3 is bonded and fixed to the substrate 2 and forms protection.

[0030] Preferably, when the structural adhesive 4 is to be penetrated into the trench 22 of the substrate 2, curing the adhesive specifically includes:

[0031] Observe the overflow surface of the adhesive deposited at the trench 22. When the overflow surface reaches the preset height line in the trench 22, the structural adhesive 4 is cured.

[0032] The preset height line is obtained through pre-testing and is used to characterize that the gap between the cover plate 1 and the substrate 2 for covering the area of ​​the array optical fiber 3 is effectively filled by the structural adhesive 4.

[0033] Compared with the prior art, the beneficial effects of the embodiments of the present invention are as follows:

[0034] This invention effectively isolates the coupling adhesive from flowing to and near the fiber end face by processing a separator groove on the substrate. In the preferred embodiment of this invention, the fiber array does not undergo cold processing such as grinding and polishing, and the distance between the fiber end face and the substrate can be precisely controlled, which facilitates subsequent coupling alignment.

[0035] In a preferred embodiment of the present invention, the damping characteristics of the area involving the filling of structural adhesive are further improved, resulting in better filling effect of the structural adhesive and ultimately better stability of the fiber array. [Attached Image Description]

[0036] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of a fiber optic array component structure provided in an embodiment of the present invention;

[0038] Figure 2 This is a schematic diagram of the end face of a fiber optic array assembly provided in an embodiment of the present invention;

[0039] Figure 3 This is a schematic diagram of a cover plate provided in an embodiment of the present invention;

[0040] Figure 4 This is a schematic diagram of a fiber optic array component structure provided in an embodiment of the present invention;

[0041] Figure 5 This is a schematic diagram of a slit structure provided in an embodiment of the present invention;

[0042] Figure 6 This is a schematic diagram of a damping groove structure provided in an embodiment of the present invention;

[0043] Figure 7 This is a schematic diagram of a damping groove structure provided in an embodiment of the present invention;

[0044] Figure 8 This is a schematic diagram of a method for manufacturing a fiber optic array component according to an embodiment of the present invention;

[0045] Figure 9 This is a process state diagram of the fabrication of a fiber optic array component provided in an embodiment of the present invention;

[0046] in:

[0047] 1: Cover plate; 2: Substrate;

[0048] 3: Optical fiber; 4: UV adhesive;

[0049] 5: Protective adhesive;

[0050] 11: V-groove;

[0051] 22; 23;

[0052] 221: First set of steps; 222: Second set of steps; 223: Third set of steps;

[0053] 231: Damping groove.

Detailed Implementation Methods

[0054] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0055] In the description of this invention, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and do not require that this invention must be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0056] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0057] Example 1:

[0058] Embodiment 1 of the present invention provides an optical fiber array assembly, such as... Figures 1-3 As shown, the structure includes a cover plate 1, a substrate 2, an array of optical fibers 3, and structural adhesive 4. The cover plate 1 has V-grooves 11 engraved on it. The number and spacing of the V-grooves 11 are consistent with the channel spacing of the optical waveguide chip. The substrate 2 has grooves 22 and a fixing platform 23 for the optical fiber array. Specifically:

[0059] The fiber core end face of the array fiber 3 is coupled to the end face of the cover plate 1, and the cover plate 1 covers the fixing platform 23 of the fiber array.

[0060] The groove 22 is adjacent to the fixing platform 23, and after the cover plate 1 is closed, it is located below the cover plate 1 and the fixed array optical fiber 3.

[0061] The structural adhesive 4 is injected from the interface between the relatively fixed platform 23 and the cover plate 1 at a point perpendicular to the extension direction of the relatively arrayed optical fiber 3. After overflowing into the groove 22, the structural adhesive 4 completes the fixing effect between the cover plate 1 and the fixed platform 23.

[0062] In this embodiment of the invention, by processing a separator groove on the substrate, the coupling adhesive can be effectively isolated from flowing to and near the fiber end face; wherein, the fiber array does not undergo cold processing such as grinding and polishing, and the distance between the fiber end face and the substrate can be precisely controlled, which facilitates subsequent coupling alignment.

[0063] In conjunction with embodiments of the present invention, a preferred implementation structure for the trench 22 is also provided, specifically, as follows: Figure 4 As shown, the trench 22 includes a first step 221 and a second step 222, specifically:

[0064] One side of the first step 221 is the first side surface of the substrate 2 (i.e. Figure 4 The left side of the first step 221 presented in the image is located on the first side surface of the substrate 2 (the left side surface), and the first side surface is on the same side as the end surface where the array optical fiber 3 is disposed; wherein, the upper surface of the first step 221 is recessed relative to the upper surface of the substrate 2 by a first distance, in Figure 4 The first distance is labeled as d1;

[0065] The second step 222 is located between the first end step 221 and the fixed platform 23. The upper surface of the second step 222 is recessed by a second distance relative to the upper surface of the substrate 2. Figure 4 The import distance is labeled as d2;

[0066] The second distance is greater than the first distance, thus forming a trench structure.

[0067] In this embodiment of the invention, examples of associated parameters for the corresponding trenches are also provided. It should be noted that the parameter ranges given below are merely a set of data for one example scenario to which this invention applies, and should not be used to limit the size of various similar scenarios to which the technical solution of this invention can be applied. Specifically, the first distance is 0.15mm ± 0.03mm; the second distance is 0.3mm ± 0.03mm; the width of the first end step 221 is 0.2mm ± 0.03mm; and the width of the second step 222 is 0.2mm ± 0.03mm.

[0068] In actual implementation, structural adhesive 4 is through Figure 1 The middle cover plate 1 is squeezed in from the right side and passes through Figure 5The gap 6 between the optical fibers, and the gap 7 formed after the optical fibers are covered on the V-groove 11 of the cover plate 1, overflow into the groove 22. Therefore, in order to reduce the amount of overflow and ensure the effectiveness of the corresponding structural adhesive filling, there is also a preferred implementation method in conjunction with the embodiments of the present invention, such as... Figure 6 As shown, the fixed platform 23 is provided with a set of damping grooves 231 perpendicular to the fiber array layout direction. These grooves are used to match the damping of the adhesive flow when the structural adhesive 4 is injected to form gaps between the optical fibers, and the damping of the adhesive flow when the V-shaped groove 11 on the cover plate 1 is covered with optical fibers to form gaps. In the actual implementation, the corresponding groove shape may not necessarily be made as shown. Figure 6 The through-type pattern shown, in order to achieve better results, is actually only in the preferred solution. Figure 5 The layout shown depicts damping grooves created in the gaps between the optical fibers, i.e., in the optimal solution, such as... Figure 6 The damping groove shown has a segmented effect, with... Figure 5 For example, it can be divided into at least 5 segments.

[0069] The damping groove 231 includes the groove type, number of grooves, and groove spacing, specifically:

[0070] By adjusting one or more parameters of the groove type, number of grooves, and groove spacing, during the test, the difference between the first velocity of the structural adhesive 4 overflowing from the gap between the optical fibers into the groove 22 and the second velocity of the structural adhesive 4 overflowing from the gap formed after the optical fibers are covered on the V-groove 11 of the cover plate 1 into the groove 22 is less than a preset value. This second preset value ensures that the time difference between the overflow of adhesive from the gaps 6 and 7 is less than approximately 1 second. Figure 6 The diagram shown is only a top view of the damping groove 231 in one state. In other cases, the side view of the corresponding damping groove 231 can be as follows: Figure 7 As shown, isosceles triangular grooves, right-angled triangular grooves, rectangular grooves, elliptical grooves, etc., can also be organic combinations of the above-mentioned groove types in actual implementation, which will not be elaborated on here.

[0071] In the preferred embodiment of the damping groove provided above by the present invention, the damping characteristics of the area involving the filling of structural adhesive are further improved, resulting in better filling effect of the structural adhesive and ultimately better stability of the fiber array. Furthermore, in practice, to further reduce the impact of the damping groove on the fixing effect of the cover plate 1, the damping groove 231 is usually concentrated on the side close to the groove 22.

[0072] As one of the preferred embodiments of the present invention, a protective adhesive 5 is also included, such as... Figure 1 Therefore, the protective adhesive 5 covers the substrate 2 to protect the optical fiber array located on the substrate 2 but not under the cover plate 1.

[0073] Example 2:

[0074] This invention also provides a method for manufacturing a fiber optic array assembly, which can be used to manufacture the tube array assembly as described in Example 1, such as... Figure 8 As shown, the method includes:

[0075] In step 201, the cover plate 1 with the V-groove 11 is placed on the fabrication stage, and the part of the array fiber 3 with the coating removed is placed in the V-groove 11. The end face of the array fiber 3 is flush with the edge of the cantilever waveguide coupling cover plate.

[0076] In step 202, the substrate 2 is placed above the array optical fiber 3; wherein, after the edge of the substrate 2 is aligned with the edge of the cover plate 1, it is lowered to press the array optical fiber 3.

[0077] In step 203, structural adhesive 4 is added at the coupling point between the cover plate 1 and the tail of the array optical fiber 3. The adhesive is observed to penetrate along the optical fiber. When it penetrates to the groove 22 of the substrate 2, the structural adhesive 4 is cured.

[0078] The fiber array manufactured in this embodiment of the invention can effectively isolate the coupling adhesive from flowing to the fiber end face and vicinity by processing adhesive grooves on the substrate; wherein, the fiber array does not undergo cold processing such as grinding and polishing, and the distance between the fiber end face and the substrate can be precisely controlled, which facilitates subsequent coupling alignment.

[0079] In one embodiment of the invention, based on a possible implementation, a set of parameter values ​​is also provided. After the edge of the substrate 2 is aligned with the edge of the cover plate 1 and then recessed to press the array optical fiber 3, the following is also included:

[0080] Move the substrate backward by 5–30 μm using the fine-tuning fixture (e.g., Figure 9 As shown in the figure, the corresponding part is marked as d3), where 5 to 30 μm is determined according to the etching width of the end face of the optical waveguide chip.

[0081] Furthermore, after the cover plate 1 and the base plate 2 are fixed, the entire assembly is rotated 180° (i.e., from...). Figure 9 The state shown is reversed to Figure 1 (As shown in the diagram), protective adhesive 5 is added to the array optical fiber 3 at the tail of the substrate 2 to bond and fix the array optical fiber 3 to the substrate 2 and form a protective layer.

[0082] Furthermore, when the structural adhesive 4 is to be penetrated into the trench 22 of the substrate 2, curing the adhesive specifically includes:

[0083] Observe the overflow surface of the adhesive deposited at the trench 22. When the overflow surface reaches the preset height line in the trench 22, the structural adhesive 4 is cured. The preset height line is obtained through pre-testing and is used to characterize that the gap between the cover plate 1 and the substrate 2 for covering the area of ​​the array optical fiber 3 is effectively filled by the structural adhesive 4.

[0084] It should be noted that the embodiments of the present invention are based on the technical solutions of the same inventive concept as Embodiment 1. Therefore, the extension of the relevant technical content involved in Embodiment 1 is also applicable to the embodiments of the present invention.

[0085] Example 3:

[0086] This invention will illustrate a complete solution of one form in Embodiment 1 using specific application examples and corresponding parameter values. A schematic diagram of the entire component is shown below. Figure 1 As shown, the components include a cover plate 1, a substrate 2, an optical fiber 3, a UV structural adhesive 4, and a protective adhesive 5. It should be noted that the corresponding numbers in the embodiments of the present invention are the same as the structural numbers in Embodiment 1. Therefore, when the corresponding numbers are the same as in Embodiment 1, the adjustment in the description is the specific description method or equivalent description method of the corresponding structural objects in Embodiment 1 in the embodiments of the present invention. Figure 2 This is a schematic diagram of the fiber optic array end face.

[0087] The fiber array is used for end-face coupling of the cantilever waveguide coupler of the silicon photonic chip. The cantilever waveguide end-face of the silicon photonic chip has a horizontal distance of 5 to 30 μm from the chip substrate and an etched step of 100 to 150 μm in the vertical direction.

[0088] The cover plate 1 is a key component in this invention. It has V-shaped grooves 11 engraved on it. The number of V-shaped grooves and the spacing between them are consistent with the channel spacing of the optical waveguide chip.

[0089] The substrate 2 is a key component in this invention. The substrate is 0.7–1 mm thick, and steps of varying depths are machined on its end faces to isolate the adhesive and prevent it from seeping into the silicon photonic chip cantilever waveguide during end-face coupling. The first step 221 of the substrate is recessed by 0.15 mm and does not contact the optical fiber; it isolates the adhesive during end-face coupling. The second step 222 of the substrate is 0.2 mm wide and 0.3 mm deep, serving to guide the adhesive from the coupling end faces. The third step 223 of the substrate has a height difference of 0.1 mm (in...). Figure 4 The part marked d4 is used to place fiber optic cable 3.

[0090] When the substrate 2 is positioned, after its end face is aligned with the end face of the cover plate 1, it needs to be moved backward. The backward movement distance is consistent with the horizontal etching width of the silicon photonic chip, ensuring that the axial distance between the fiber end face and the chip waveguide end face is appropriate when the fiber array is coupled and bonded to the chip. It cannot be greater than the etching width; otherwise, it may easily hit the chip end face waveguide during subsequent coupling alignment, leading to chip damage.

[0091] The end face of the optical fiber 3 needs to be processed to be neat, and the coating layer of the optical fiber placed in the V-groove 11 needs to be stripped.

[0092] The UV adhesive 4 is used to bond and fix the cover plate 1 and the substrate 2 after the optical fiber 3 is placed in the V-groove 11 in the cover plate 1.

[0093] Example 4:

[0094] This embodiment of the invention demonstrates the production process of the method in Embodiment 2 within the scenario of Embodiment 3. The steps are as follows:

[0095] 1) The fiber optic array described in this invention needs to be fabricated using equipment such as a high-definition imaging system and a fine-tuning rig;

[0096] 2) Prepare fiber optic cable 3 by flattening the port used for coupling, usually by grinding or laser cutting, and remove the coating layer at the coupling end;

[0097] 2) Place the cover plate with the V-groove 1-1 on the fabrication table, and place the stripped portion of the optical fiber 3 into the V-groove 1-1, with the end face of the optical fiber 3 flush with the edge of the cover plate. Figure 3 and Figure 4 As shown.

[0098] 3) Place substrate 1 above optical fiber 3. Under the high-definition imaging system, align the edge of substrate 2 with the substrate, such as... Figure 5 As shown. Move the substrate backward by 5-30 μm using the fine-tuning fixture, the specific value being consistent with the etching width of the chip end face. Then lower the substrate 2 to press the optical fiber 3 firmly. Add a small amount of UV adhesive 4 to the optical fiber 3 at the tail of the cover plate 1, and observe the adhesive penetrating along the optical fiber under the imaging system. Once it has penetrated to the second step 2-2 of the substrate, cure the UV adhesive.

[0099] 4) After the cover plate 1 and the substrate 2 are fixed, flip the fiber array and add protective glue 5 to the fiber 3 at the tail of the substrate 2 so that the fiber 3 is bonded and fixed to the substrate 3 and forms protection.

[0100] The key to the structure and fabrication of the entire fiber optic array lies in the size design of substrate 2. The fiber optic array 3 is arranged using a cover plate with V-grooves. A special substrate structure is designed to block the adhesive from two aspects. This effectively prevents adhesive from flowing to the fiber end faces during the bonding and fixing of the cover plate, substrate, and fibers. When the fiber optic array is coupled and bonded to the chip, the adhesive is guided into the adhesive-resistant area of ​​the second step of the substrate.

[0101] This fiber array structure ensures that the fiber end face and the chip waveguide end face are in an empty adhesive state when the silicon photonic chip is coupled, and then a suitable low-refractive-index adhesive is added.

[0102] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An optical fiber array assembly, comprising: Including cover plate (1), base plate (2), array optical fiber (3) and structural glue (4), the cover plate (1) is engraved with V-shaped groove (11), the number and V-shaped groove spacing of V-shaped groove (11) are consistent with the channel spacing of optical waveguide chip, the base plate (2) is provided with groove (22) and the fixed platform (23) of optical fiber array, specifically: The core end face of array optical fiber (3) is coupled with the end face of cover plate (1), and the cover plate (1) is covered on the fixed platform (23) of optical fiber array; The groove (22) is adjacent to the fixed platform (23), and after covering the cover plate (1), it is located below the cover plate (1) and the fixed array optical fiber (3); The structural glue (4) is injected from the interface perpendicular to the extension direction of the array optical fiber (3) on the opposite fixed platform (23) and cover plate (1), and after overflowing into the groove (22), the fixing effect of the structural glue (4) between the cover plate (1) and the fixed platform (23) is completed; The groove (22) includes first step (221) and second step (222), specifically: One side of the first step (221) is the first side of the base plate (2), and the first side and the end face where the array optical fiber (3) is arranged are on the same side; Wherein, the upper surface of the first step (221) is sunken by a first distance relative to the upper surface of the base plate (2); The second step (222) is located between the first step (221) and the fixed platform (23), and the upper surface of the second step (222) is sunken by a second distance relative to the upper surface of the base plate (2); Wherein, the second distance is greater than the first distance to form a groove structure.

2. The fiber array assembly of claim 1, wherein, The cover plate (1) is covered on the fixed platform (23) of optical fiber array, specifically including: The edge of the cover plate (1) is flush with the end face of the optical fiber, and the edge of the base plate (2) is protruded by 5-30 μm, wherein 5-30 μm is determined according to the etching width of the end face of the optical waveguide chip; Wherein, the protruded 5-30 μm is sunken after the edge of the base plate (2) is aligned with the edge of the cover plate (1) in the manufacturing process, and the array optical fiber (3) is pressed, and the base plate is moved back by 5-30 μm through the fine adjustment frame.

3. The fiber array assembly of claim 1, wherein, said first distance is 0.15 mm + 0.03 mm; said second distance is 0.3 mm + 0.03 mm; said first section of step (221) has a width of 0.2 mm + 0.03 mm; said second section of step (222) has a width of 0.2 mm + 0.03 mm.

4. The fiber array assembly of claim 1, wherein, A set of damping grooves (231) perpendicular to the layout direction of the optical fiber array are arranged on the fixed platform (23), which are used to match the glue injection damping of the gap between the optical fibers and the glue injection damping of the gap formed after the optical fibers are covered on the V-shaped groove (11) on the cover plate (1).

5. The fiber array assembly of claim 4, wherein, The groove type, groove number and groove spacing of the damping groove 231, specifically: By adjusting one or more parameters of the groove type, groove number and groove spacing, the first speed of the structural glue (4) overflowing from the gap between the optical fibers to the groove (22) and the second speed of the structural glue (4) overflowing from the gap formed after the optical fibers are covered on the V-shaped groove (11) on the cover plate (1) to the groove (22) are less than a preset value in the test process.

6. A method of making a fiber array assembly, comprising: The method comprises: Place the cover plate (1) engraved with V-shaped groove (11) on the production platform, and place the part of the array optical fiber (3) stripped of the coating layer into the V-shaped groove (11), and the end face of the array optical fiber (3) is flush with the cantilever waveguide coupling cover plate edge; Place the substrate (2) above the array optical fiber (3); wherein the edge of the substrate (2) is aligned with the edge of the cover plate (1) and then sinks, pressing the array optical fiber (3); Add structural glue (4) at the coupling position of the cover plate (1) and the tail of the array optical fiber (3), observe the penetration of the glue along the optical fiber, and solidify the structural glue (4) when it penetrates into the groove (22) of the substrate (2). After the edge of the substrate (2) is aligned with the edge of the cover plate (1) and then sinks, pressing the array optical fiber (3), it further comprises: Move the substrate 5~30μm backward through the fine adjustment frame, wherein 5~30μm is determined according to the etching width of the optical waveguide chip end face.

7. The method of manufacturing a fiber array assembly of claim 6, wherein, After the cover plate (1) and the substrate (2) are fixed, they are turned over 180°, and protective glue (5) is added on the array optical fiber (3) at the tail of the substrate (2), so that the array optical fiber (3) is bonded and fixed with the substrate (2) and forms protection.

8. The method of manufacturing a fiber array assembly of claim 6, wherein, The structural glue (4) is solidified when it penetrates into the groove (22) of the substrate (2), and specifically comprises: Observe the overflowed glue surface deposited in the groove (22), and solidify the structural glue (4) when the overflowed glue surface reaches the preset height line in the groove (22); Wherein, the preset height line is obtained by pre-test, which is used to represent that the gap between the cover plate (1) and the substrate (2) for covering the array optical fiber (3) region is effectively filled with the structural glue (4).

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