Display panel and display device

Abstract

A display panel and a display device. The display panel includes a display substrate and a flexible circuit board; the display substrate includes a display area and a bonding area located on one side of the display area, and the flexible circuit board is connected to the bonding area; the bonding area includes a bending area, and the bending area is configured to bend the flexible circuit board to the backlight side surface of the display area; in a direction away from the display substrate, the flexible circuit board sequentially includes a bonding portion, a bending portion, and a connecting portion; the bonding portion is configured to be bonded and connected to the bonding area, the bending portion is configured to bend the connecting portion to the back surface of the bonding portion by bending, and the bending portion forms a bending area of the flexible circuit board after bending; a second adhesive layer is filled in the bending area of the flexible circuit board, and the second adhesive layer is configured to fix the bending state of the flexible circuit board.

Description

Technical Field

[0001] This application relates to, but is not limited to, display technologies, and particularly to a display panel and a display device. Background Art

[0002] During the production of a display device, a display substrate is connected to a flexible printed circuit (FPC). The flexible printed circuit bends along with the bending area of the display substrate to the back of the display screen. In some technologies, the flexible printed circuit is bent to reduce the space occupied by the flexible printed circuit.

[0003] The inventors of this application have found through research that the bent flexible printed circuit is prone to delamination. Summary of the Invention

[0004] The following is an overview of the subject matter described in detail in this application. This overview is not intended to limit the scope of protection of the claims.

[0005] Embodiments of the present disclosure provide a display panel and a display device to solve the problem that the bent flexible printed circuit is prone to delamination.

[0006] On the one hand, embodiments of the present disclosure provide a display panel, including a display substrate and a flexible printed circuit; the display substrate includes a display area and a bonding area on one side of the display area, and the flexible printed circuit is connected to the bonding area; the bonding area includes a bending area, and the bending area is configured to bend the flexible printed circuit to the backlight side surface of the display area; in the direction away from the display substrate, the flexible printed circuit sequentially includes a bonding portion, a bending portion, and a connecting portion; the bonding portion is configured to be bonded to the bonding area, the bending portion is configured to bend the connecting portion to the back of the bonding portion by bending, and the bending portion forms a bending area of the flexible printed circuit after bending; a second bonding layer is filled in the bending area of the flexible printed circuit, and the second bonding layer is configured to fix the bending state of the flexible printed circuit.

[0007] In an exemplary embodiment, the second bonding layer is an ultraviolet glue.

[0008] In an exemplary embodiment, in the direction away from the display panel, the flexible printed circuit includes a first cover film, a conductive layer, a substrate, and a second cover film stacked in sequence; the orthographic projection of the first cover film on the substrate is located at the bending portion and the connecting portion, and the orthographic projection of the second cover film on the substrate is located at the bonding portion and the connecting portion.

[0009] In an exemplary embodiment, the thickness of the substrate is greater than or equal to 5 microns and less than or equal to 9 microns.

[0010] In an exemplary embodiment, the first covering film located at the bending portion includes a hollow window structure, and the window contains an ink layer.

[0011] In an exemplary embodiment, the window structure includes at least one strip-shaped window, the extension direction of each strip-shaped window is the same as the extension direction of the bending portion, and the length of each strip-shaped window is the same as the length of the bending portion.

[0012] In an exemplary embodiment, the window structure includes a plurality of windows arranged at intervals, and patterns of the plurality of windows are the same or different.

[0013] In an exemplary embodiment, the plurality of windows are arranged in at least one row along an extension direction of the bending portion.

[0014] In an exemplary embodiment, the binding area includes a routing area, a bending area and a composite circuit area which are sequentially arranged along a direction away from the display area, and the bending area is bent so that the composite circuit area adheres to the backlight side surface of the display area; the binding portion is configured to be bound and connected with the composite circuit area; the composite circuit area includes a driving chip area and a binding pin area which are sequentially arranged along a direction away from the display area, the integrated circuit is bound and connected to the driving chip area, and the flexible circuit board is bound and connected to the binding pin area; an integrated circuit tape is arranged on a side of the integrated circuit away from the display substrate, the orthographic projection of the integrated circuit tape on the display substrate covers the orthographic projection of the integrated circuit on the display substrate, and the flexible circuit board is fixed on the integrated circuit tape after bending.

[0015] In an exemplary embodiment, the display panel also includes a connector and an adapter circuit board; the connecting portion is configured to be connected to the connector, and the connector is configured to connect the flexible circuit board and the adapter circuit board; the orthographic projection of the connector on the display panel does not overlap with the orthographic projection of the wiring area on the display panel; or, the orthographic projection of the connector on the display panel overlaps with the orthographic projection of the wiring area on the display panel, and a protective band is arranged between the connector and the display substrate.

[0016] In an exemplary embodiment, the display panel includes a first border, a second border, a third border, and a fourth border. The first border and the fourth border are disposed opposite to each other, and the second border and the third border are disposed opposite to each other. The composite circuit region is disposed near the fourth border, and the extending direction of the flexible circuit board is parallel to the fourth border. The positive projection of the connector on the display panel does not overlap with the positive projection of the wiring region on the display panel, including: the connector is located on a side of the flexible circuit board close to the second border; or the connector is located on a side of the flexible circuit board close to the third border.

[0017] In an exemplary embodiment, the positive projection of the adapter circuit board on the plane where the display panel is located is outside the range of the display panel; or the positive projection of the adapter circuit board on the plane where the display panel is located is within the range of the display panel.

[0018] In an exemplary embodiment, the display panel includes a first border, a second border, a third border, and a fourth border. The first border and the fourth border are disposed opposite to each other, and the second border and the third border are disposed opposite to each other. The composite circuit region is disposed near the fourth border, and the extending direction of the flexible circuit board is parallel to the fourth border. The positive projection of the connector on the display panel does not overlap with the positive projection of the wiring region on the display panel, including: the connector is located on a side of the flexible circuit board close to the fourth border, and the positive projection of the connector on the plane where the display panel is located is outside the range of the display panel.

[0019] In an exemplary embodiment, in a direction perpendicular to the display panel, on the backlight side surface of the display substrate, there are a back film layer, a heat dissipation layer disposed on a side of the back film layer away from the display substrate, and a spacer layer disposed on a side of the heat dissipation layer away from the display substrate; the flexible circuit board is fixed on a side of the spacer layer away from the display substrate through a first adhesive layer.

[0020] On the other hand, an embodiment of the present disclosure provides a display device including the display panel as described above.

[0021] For the display panel provided by the embodiment of the present disclosure, by providing a second adhesive layer to fill the bending region of the flexible circuit board, the contact area between the second adhesive layer and the bending region of the flexible circuit board is increased, and the problem that the flexible circuit board is prone to delamination after bending is solved.

[0022] Other features and advantages of the present disclosure will be set forth in the following description, and in part will be obvious from the description, or may be learned by practice of the present disclosure. Other advantages of the present disclosure may be realized and obtained by the solutions described in the description and the drawings.

[0023] Other aspects will be apparent upon reading and understanding the drawings and the detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings are used to provide an understanding of the technical solutions of the present disclosure, and constitute a part of the description. Together with the embodiments of the present disclosure, they are used to explain the technical solutions of the present disclosure, and do not constitute a limitation on the technical solutions of the present disclosure.

[0025] Figure 1 It is a schematic structural diagram of a display panel;

[0026] Figure 2 It is a schematic structural diagram of a display substrate;

[0027] Figure 3 It is Figure 2 a side view of the display substrate in

[0028] Figure 4 It is a schematic plan view of a display area in a display substrate;

[0029] Figure 5 It is a schematic equivalent circuit diagram of a pixel driving circuit;

[0030] Figure 6 It is a schematic cross-sectional structure diagram of a display panel and a battery;

[0031] Figure 7 It is a schematic cross-sectional structure diagram of a display panel and a battery after bending a flexible circuit board;

[0032] Figure 8 It is a top view of a flexible circuit board in an exemplary embodiment;

[0033] Figure 9 It is a side view of a flexible circuit board in another exemplary embodiment;

[0034] Figure 10 It is a side view of a flexible circuit board in another exemplary embodiment;

[0035] Figure 11 It is Figure 10 a top view of the flexible circuit board in

[0036] Figure 12 It is a top view of forming a window structure on a first cover film at a bending portion in an exemplary embodiment;

[0037] Figure 13 A top view of forming a window structure on a first covering film of a bent portion in another exemplary embodiment;

[0038] Figure 14 A top view of forming a window structure on a first covering film of a bent portion in another exemplary embodiment;

[0039] Figure 15 A top view of forming a window structure on a first covering film of a bent portion in another exemplary embodiment;

[0040] Figure 16 A top view of forming a window structure on a first covering film of a bent portion in another exemplary embodiment;

[0041] Figure 17 A top view of forming a window structure on a first covering film of a bent portion in another exemplary embodiment;

[0042] Figure 18 A top view of forming a window structure on a first covering film of a bent portion in another exemplary embodiment;

[0043] Figure 19 is a cross-sectional view of a first bonding layer in some technologies;

[0044] Figure 20 is a schematic cross-sectional structure diagram of a display panel in an exemplary embodiment;

[0045] Figure 21 A schematic diagram of a top view structure of a display panel before the flexible circuit board is bent;

[0046] Figure 22 For the general Figure 21 A schematic diagram of the top view of the display panel after the flexible circuit board is bent;

[0047] Figure 23 A schematic diagram of a cross-sectional structure of a display panel with a switching circuit board;

[0048] Figure 24 is a schematic diagram of a top view of a display panel in an exemplary embodiment;

[0049] Figure 25 is a schematic diagram of a top view of a display panel in another exemplary embodiment;

[0050] Figure 26 is a schematic diagram of a top view of a display panel in another exemplary embodiment;

[0051] Figure 27 is a schematic diagram of a top view of a display panel in another exemplary embodiment;

[0052] Figure 28 is a schematic diagram of a top view of a display panel in another exemplary embodiment;

[0053] Figure 29 is a schematic cross-sectional structure diagram of another display panel with a transfer circuit board;

[0054] Figure 30 is a schematic cross-sectional structure diagram of a flexible circuit board with a protective tape in an exemplary embodiment;

[0055] Figure 31 is a schematic diagram of a cross-sectional structure of a display panel after being bent in an exemplary embodiment;

[0056] Figure 32 is a schematic diagram of a cross-sectional structure of a display panel after being bent in another exemplary embodiment;

[0057] Figure 33 is a schematic cross-sectional structural diagram of a display panel after a protective tape is attached to a display substrate in an exemplary embodiment;

[0058] Figure 34 is a schematic diagram of a cross-sectional structure of a cut substrate in an exemplary embodiment;

[0059] Figure 35 is a schematic diagram of a cross-sectional structure of a substrate after the second conductive layer on the second surface of the substrate is removed in an exemplary embodiment;

[0060] Figure 36 is a schematic diagram of a cross-sectional structure of a substrate after a second covering film is formed on a second surface of the substrate in an exemplary embodiment;

[0061] Figure 37 is a schematic diagram of a cross-sectional structure of a substrate after a first covering film is formed on a first surface of the substrate in an exemplary embodiment;

[0062] Figure 38 It is a schematic diagram of the cross-sectional structure of a substrate after an ink layer is formed at an opening of a first covering film in an exemplary embodiment.

[0063] Reference numerals:

[0064] 10-display substrate; 20-back film layer; 30-heat dissipation layer;

[0065] 40-spacer layer; 50-battery; 60-protective adhesive layer;

[0066] 100-display area; 200-binding area; 210-wiring area;

[0067] 220-bending area; 230-composite circuit area; 240-integrated circuit;

[0068] 241 - Integrated circuit tape; 250 - Flexible circuit board; 251 - First adhesive layer;

[0069] 252 - Second adhesive layer; 260 - Connector; 261 - Reinforcement;

[0070] 262 - Protective tape; 270 - Adapter circuit board; 301 - Bonding part;

[0071] 302 - Bending part; 303 - Connecting part; 310 - Substrate;

[0072] 311 - Conductive layer; 312 - First cover film; 313 - Second cover film;

[0073] 314 - Ink layer; 401 - Base material layer; 402 - First adhesive layer

[0074] 403 - Second adhesive layer; 511 - First conductive layer; 512 - Second conductive layer;

[0075] 513 - Bump. Detailed implementation manners

[0076] The present disclosure describes multiple embodiments, but the description is exemplary rather than restrictive, and it will be obvious to those of ordinary skill in the art that there can be more embodiments and implementation solutions within the scope of the embodiments described in the present disclosure. Although many possible feature combinations are shown in the drawings and discussed in the detailed implementation manners, many other combination ways of the disclosed features are also possible. Unless specifically restricted, any feature or element of any embodiment can be combined with any other feature or element in any other embodiment, or can replace any other feature or element in any other embodiment.

[0077] The present disclosure includes and contemplates combinations with features and elements known to those of ordinary skill in the art. The embodiments, features, and elements already disclosed in the present disclosure can also be combined with any conventional features or elements to form unique invention solutions defined by the claims. Any feature or element of any embodiment can also be combined with features or elements from other invention solutions to form another unique invention solution defined by the claims. Therefore, it should be understood that any feature shown and / or discussed in the present disclosure can be implemented alone or in any suitable combination. Therefore, the embodiments are not subject to other restrictions except those made according to the appended claims and their equivalent replacements. In addition, various modifications and changes can be made within the scope of protection of the appended claims.

[0078] In addition, when describing representative embodiments, the specification may have presented the method and / or process as a specific sequence of steps. However, to the extent that the method or process does not depend on the specific order of the steps described herein, the method or process should not be limited to the specific order of steps described. As will be understood by those of ordinary skill in the art, other step orders are possible. Therefore, the specific order of steps set forth in the specification should not be construed as a limitation on the claims. In addition, the claims directed to the method and / or process should not be limited to performing their steps in the order written, as those skilled in the art can readily understand that these orders can vary and still remain within the spirit and scope of the embodiments of the present disclosure.

[0079] In the drawings, in order to be clear sometimes, the sizes of one or more constituent elements, the thicknesses of layers, or regions are exaggerated. Therefore, one aspect of the present disclosure is not necessarily limited to such dimensions, and the shapes and sizes of one or more components in the drawings do not reflect the true proportions. In addition, the drawings schematically show ideal examples, and one aspect of the present disclosure is not limited to the shapes or numerical values shown in the drawings.

[0080] The ordinal numbers such as "first", "second", "third", etc. in this specification are set to avoid confusion of constituent elements and are not for limiting in terms of quantity. "A plurality of" in the present disclosure means two or more quantities.

[0081] In this specification, for convenience, terms indicating orientation or positional relationship such as "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are used to describe the positional relationship of constituent elements with reference to the drawings, which are only for facilitating the description of this specification and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the present disclosure. The positional relationship of the constituent elements changes appropriately according to the direction of the described constituent elements. Therefore, it is not limited to the terms described in the specification and can be appropriately replaced according to the circumstances.

[0082] In this specification, unless otherwise clearly specified and defined, the terms "mounted", "connected", and "coupled" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate member, or the communication inside two elements. For those of ordinary skill in the art, the meanings of the above terms in the present disclosure can be understood according to the circumstances.

[0083] In this specification, "electrically connected" includes a case where constituent elements are connected together through an element having a certain electrical effect. The "element having a certain electrical effect" is not particularly limited as long as it can transmit an electrical signal between the constituent elements to be connected. Examples of the "element having a certain electrical effect" include not only electrodes and wirings, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements having various functions.

[0084] In this specification, "parallel" means a state where the angle formed by two straight lines is -10° or more and 10° or less. Therefore, it also includes a state where the angle is -5° or more and 5° or less. In addition, "perpendicular" means a state where the angle formed by two straight lines is 80° or more and 100° or less. Therefore, it also includes a state where the angle is 85° or more and 95° or less.

[0085] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0086] Figure 1 It is a schematic structural diagram of a display panel. As Figure 1As shown, the display panel may include a timing controller, a data driver, a scan driver, a light-emitting driver, and a pixel array. The timing controller is respectively connected to the data driver, the scan driver, and the light-emitting driver. The data driver is respectively connected to a plurality of data signal lines (D1 to Dn). The scan driver is respectively connected to a plurality of scan signal lines (S1 to Sm). The light-emitting driver is respectively connected to a plurality of light-emitting signal lines (E1 to Eo). The pixel array may include a plurality of sub-pixels Pxij, where i and j may be natural numbers. At least one sub-pixel Pxij may include a circuit unit and a light-emitting unit connected to the circuit unit. The circuit unit may at least include a pixel driving circuit. The pixel driving circuit is respectively connected to the scan signal line, the data signal line, and the light-emitting signal line. In an exemplary embodiment, the timing controller may provide a gray value and a control signal suitable for the specification of the data driver to the data driver, may provide a clock signal, a scan start signal, etc. suitable for the specification of the scan driver to the scan driver, and may provide a clock signal, an emission stop signal, etc. suitable for the specification of the light-emitting driver to the light-emitting driver. The data driver may use the gray value and the control signal received from the timing controller to generate data voltages to be provided to the data signal lines D1, D2, D3, ……, and Dn. For example, the data driver may sample the gray value using a clock signal and apply the data voltages corresponding to the gray value to the data signal lines D1 to Dn in pixel row units, where n may be a natural number. The scan driver may generate scan signals to be provided to the scan signal lines S1, S2, S3, ……, and Sm by receiving a clock signal, a scan start signal, etc. from the timing controller. For example, the scan driver may sequentially provide scan signals having conductive level pulses to the scan signal lines S1 to Sm. For example, the scan driver may be configured in the form of a shift register and may generate scan signals in such a way that the scan start signal provided in the form of a conductive level pulse is sequentially transmitted to the next-stage circuit under the control of a clock signal, where m may be a natural number. The light-emitting driver may generate emission signals to be provided to the light-emitting signal lines E1, E2, E3, ……, and Eo by receiving a clock signal, an emission stop signal, etc. from the timing controller. For example, the light-emitting driver may sequentially provide emission signals having cut-off level pulses to the light-emitting signal lines E1 to Eo. For example, the light-emitting driver may be configured in the form of a shift register and may generate emission signals in such a way that the emission stop signal provided in the form of a cut-off level pulse is sequentially transmitted to the next-stage circuit under the control of a clock signal, where o may be a natural number.

[0087] Figure 2 It is a schematic structural diagram of a display substrate, showing the state of the bonding area before bending. Figure 3 is Figure 2 a side view of the display substrate in [reference numeral], showing the bent state of the bonding area after bending. As Figure 2and Figure 3 As shown, in a plane parallel to the display substrate, the display substrate may at least include a display area 100, a bonding area 200 located on one side of the display area 100, and a border area 300 located on the other sides of the display area 100. In an exemplary embodiment, the display area 100 may be a flat area including a plurality of sub-pixels Pxij that form a pixel array. The plurality of sub-pixels Pxij are configured to display dynamic pictures or still images, and the display area 100 may be referred to as an active area (AA). In an exemplary embodiment, the display substrate may be deformable, such as curling, bending, folding, or rolling up.

[0088] In an exemplary embodiment, the bonding area 200 may include a wiring area 210, a bending area 220, and a composite circuit area 230 arranged in sequence along a direction away from the display area 100. The wiring area 210 may be connected to the display area 100 and may at least include a plurality of data transmission lines configured to connect to the data signal lines in the display area. The bending area 220 may be connected to the wiring area 210 and may include a composite insulating layer provided with grooves, configured to bend and attach the bonding area to the back surface of the display area 100 by bending, so that the bonding area 200 may overlap the display area 100 in a direction perpendicular to the plane of the display area. The composite circuit area 230 may at least include a driver chip area and a bonding pin area. An integrated circuit (IC) 240 may be bonded and connected to the driver chip area, and a flexible circuit board 250 may be bonded and connected to the bonding pin area.

[0089] In an exemplary embodiment, the integrated circuit 240 may be bonded and connected to the driver chip area through an anisotropic conductive film or other means. The integrated circuit 240 may generate driving signals required to drive the sub-pixels and may provide the driving signals to the sub-pixels in the display area 100. For example, the driving signal may be a data signal for driving the light-emitting brightness of the sub-pixels. In an exemplary embodiment, the bonding pin area may include a plurality of pins (PINs), and the flexible circuit board 250 may be bonded and connected to the plurality of pins.

[0090] Figure 4 It is a schematic diagram of the planar structure of the display area in a display substrate. As Figure 4As shown, the display substrate may include a plurality of pixel units P arranged in a matrix. At least one pixel unit P may include a first sub-pixel P1 that emits light of a first color, a second sub-pixel P2 that emits light of a second color, and a third sub-pixel P3 that emits light of a third color. Each sub-pixel may include a circuit unit and a light-emitting unit. The circuit unit may at least include a pixel driving circuit. The pixel driving circuit is respectively connected to a scanning signal line, a data signal line, and a light-emitting signal line. The pixel driving circuit is configured to receive a data voltage transmitted by the data signal line under the control of the scanning signal line and the light-emitting signal line, and output a corresponding current to the light-emitting unit. The light-emitting units in each sub-pixel are respectively connected to the pixel driving circuit of the corresponding sub-pixel, and the light-emitting unit is configured to emit light of a corresponding brightness in response to the current output by the connected pixel driving circuit.

[0091] In an exemplary embodiment, the first sub-pixel P1 may be a red sub-pixel (R) that emits red light, the second sub-pixel P2 may be a blue sub-pixel (B) that emits blue light, and the third sub-pixel P3 may be a green sub-pixel (G) that emits green light. In an exemplary embodiment, the shape of the sub-pixel may be rectangular, rhombic, pentagonal, or hexagonal. The three sub-pixels may be arranged in a horizontal side-by-side, vertical side-by-side, or triangular formation, etc. The present disclosure does not limit this here.

[0092] In an exemplary embodiment, the pixel unit may include four sub-pixels. For example, the four sub-pixels may include a red sub-pixel, a green sub-pixel, a blue sub-pixel, and a white sub-pixel (W) that emits white light. Another example is that the four sub-pixels may include a red sub-pixel, a blue sub-pixel, and two green sub-pixels. In an exemplary embodiment, the four sub-pixels may be arranged in a horizontal side-by-side, vertical side-by-side, square, or diamond shape, etc. The present disclosure does not limit this here.

[0093] Figure 5 It is an equivalent circuit diagram of a pixel driving circuit. In an exemplary embodiment, the pixel driving circuit may be a 3T1C, 4T1C, 5T1C, 5T2C, 6T1C, 7T1C, or 8T1C structure. As Figure 5 shown, the pixel driving circuit may include seven transistors (a first transistor T1 to a seventh transistor T7) and one storage capacitor C. The pixel driving circuit is respectively connected to six signal lines (a data signal line D, a first scanning signal line S1, a second scanning signal line S2, a light-emitting signal line E, an initial signal line INIT, and a first power supply line VDD).

[0094] In an exemplary embodiment, the pixel driving circuit may include a first node N1, a second node N2, and a third node N3. Among them, the first node N1 is respectively connected to the first pole of the third transistor T3, the second pole of the fourth transistor T4, and the second pole of the fifth transistor T5. The second node N2 is respectively connected to the second pole of the first transistor, the first pole of the second transistor T2, the gate electrode of the third transistor T3, and the second end of the storage capacitor C. The third node N3 is respectively connected to the second pole of the second transistor T2, the second pole of the third transistor T3, and the first pole of the sixth transistor T6.

[0095] In an exemplary embodiment, the first end of the storage capacitor C is connected to the first power supply line VDD, and the second end of the storage capacitor C is connected to the second node N2, that is, the second end of the storage capacitor C is connected to the gate electrode of the third transistor T3.

[0096] The gate electrode of the first transistor T1 is connected to the second scan signal line S2. The first pole of the first transistor T1 is connected to the initial signal line INIT. The second pole of the first transistor is connected to the second node N2. When a conductive level scan signal is applied to the second scan signal line S2, the first transistor T1 transfers the initial voltage to the gate electrode of the third transistor T3 to initialize the charge amount on the gate electrode of the third transistor T3.

[0097] The gate electrode of the second transistor T2 is connected to the first scan signal line S1. The first pole of the second transistor T2 is connected to the second node N2. The second pole of the second transistor T2 is connected to the third node N3. When a conductive level scan signal is applied to the first scan signal line S1, the second transistor T2 connects the gate electrode of the third transistor T3 to the second pole.

[0098] The gate electrode of the third transistor T3 is connected to the second node N2, that is, the gate electrode of the third transistor T3 is connected to the second end of the storage capacitor C. The first pole of the third transistor T3 is connected to the first node N1. The second pole of the third transistor T3 is connected to the third node N3. The third transistor T3 can be called a driving transistor. The third transistor T3 determines the amount of driving current flowing between the first power supply line VDD and the second power supply line VSS according to the potential difference between its gate electrode and the first pole.

[0099] The gate electrode of the fourth transistor T4 is connected to the first scan signal line S1. The first pole of the fourth transistor T4 is connected to the data signal line D. The second pole of the fourth transistor T4 is connected to the first node N1. The fourth transistor T4 can be called a switching transistor, a scanning transistor, etc. When a conductive level scan signal is applied to the first scan signal line S1, the fourth transistor T4 inputs the data voltage of the data signal line D into the pixel driving circuit.

[0100] The gate electrode of the fifth transistor T5 is connected to the light-emitting signal line E, the first pole of the fifth transistor T5 is connected to the first power supply line VDD, and the second pole of the fifth transistor T5 is connected to the first node N1. The gate electrode of the sixth transistor T6 is connected to the light-emitting signal line E, the first pole of the sixth transistor T6 is connected to the third node N3, and the second pole of the sixth transistor T6 is connected to the first pole of the light-emitting unit EL. The fifth transistor T5 and the sixth transistor T6 may be referred to as light-emitting transistors. When a conductive-level light-emitting signal is applied to the light-emitting signal line E, the fifth transistor T5 and the sixth transistor T6 cause the light-emitting unit EL to emit light by forming a drive current path between the first power supply line VDD and the second power supply line VSS.

[0101] The gate electrode of the seventh transistor T7 is connected to the second scan signal line S2, the first pole of the seventh transistor T7 is connected to the initial signal line INIT, and the second pole of the seventh transistor T7 is connected to the first pole of the light-emitting unit EL. When a conductive-level scan signal is applied to the second scan signal line S2, the seventh transistor T7 transfers an initial voltage to the first pole of the light-emitting unit EL to initialize the amount of charge accumulated in the first pole of the light-emitting unit EL or to release the amount of charge accumulated in the first pole of the light-emitting unit EL.

[0102] In an exemplary embodiment, the light-emitting unit EL may be an OLED, including a stacked first pole (anode), an organic light-emitting layer, and a second pole (cathode), or may be a QLED, including a stacked first pole (anode), a quantum dot light-emitting layer, and a second pole (cathode).

[0103] In an exemplary embodiment, the second pole of the light-emitting unit EL is connected to the second power supply line VSS, the signal of the second power supply line VSS is a continuously provided low-level signal, and the signal of the first power supply line VDD is a continuously provided high-level signal.

[0104] In an exemplary embodiment, the first transistor T1 to the seventh transistor T7 may be P-type transistors, or may be N-type transistors. Using transistors of the same type in the pixel driving circuit can simplify the process flow, reduce the process difficulty of the display panel, and improve the yield of the product. In some possible implementation manners, the first transistor T1 to the seventh transistor T7 may include P-type transistors and N-type transistors.

[0105] In an exemplary embodiment, the first transistor T1 to the seventh transistor T7 may be formed of a low-temperature polycrystalline silicon thin-film transistor, or may be formed of an oxide thin-film transistor, or may be formed of a combination of a low-temperature polycrystalline silicon thin-film transistor and an oxide thin-film transistor. The active layer of the low-temperature polycrystalline silicon thin-film transistor is made of low-temperature polycrystalline silicon (LTPS), and the active layer of the oxide thin-film transistor is made of an oxide semiconductor (Oxide). The low-temperature polycrystalline silicon thin-film transistor has advantages such as high mobility and fast charging, and the oxide thin-film transistor has advantages such as low leakage current. Integrating the low-temperature polycrystalline silicon thin-film transistor and the oxide thin-film transistor on a display substrate to form a low-temperature polycrystalline oxide (LTPO) display substrate can utilize the advantages of both, enable low-frequency driving, reduce power consumption, and improve display quality.

[0106] Taking the example that all seven transistors are P-type transistors, the operation process of the pixel driving circuit may include:

[0107] In the first stage A1, which is called the reset stage, the signal of the second scan signal line S2 is a low-level signal, and the signals of the first scan signal line S1 and the light-emitting signal line E are high-level signals. The low-level signal of the second scan signal line S2 turns on the first transistor T1 and the seventh transistor T7. The conduction of the first transistor T1 provides the initial voltage of the initial signal line INIT to the second node N2, initializes the storage capacitor C, and clears the original data voltage in the storage capacitor. The conduction of the seventh transistor T7 provides the initial voltage of the initial signal line INIT to the first electrode of the OLED, initializes (resets) the first electrode of the OLED, and clears the pre-stored voltage inside it, completing the initialization. The high-level signals of the first scan signal line S1 and the light-emitting signal line E turn off the second transistor T2, the fourth transistor T4, the fifth transistor T5, and the sixth transistor T6. In this stage, the OLED does not emit light.

[0108] The second stage A2, which is called the data writing stage or the threshold compensation stage, has a low-level signal on the first scan signal line S1, high-level signals on the second scan signal line S2 and the light-emitting signal line E, and the data signal line D outputs a data voltage. During this stage, since the second end of the storage capacitor C is at a low level, the third transistor T3 is turned on. The low-level signal on the first scan signal line S1 turns on the second transistor T2 and the fourth transistor T4. The conduction of the second transistor T2 and the fourth transistor T4 causes the data voltage output by the data signal line D to be supplied to the second node N2 through the first node N1, the turned-on third transistor T3, the third node N3, and the turned-on second transistor T2, and the difference between the data voltage output by the data signal line D and the threshold voltage of the third transistor T3 is charged into the storage capacitor C. The voltage at the second end (the second node N2) of the storage capacitor C is Vd - |Vth|, where Vd is the data voltage output by the data signal line D and Vth is the threshold voltage of the third transistor T3. The high-level signal on the second scan signal line S2 turns off the first transistor T1 and the seventh transistor T7. The high-level signal on the light-emitting signal line E turns off the fifth transistor T5 and the sixth transistor T6.

[0109] The third stage A3, which is called the light-emitting stage, has a low-level signal on the light-emitting signal line E and high-level signals on the first scan signal line S1 and the second scan signal line S2. The low-level signal on the light-emitting signal line E turns on the fifth transistor T5 and the sixth transistor T6, and the power supply voltage output by the first power supply line VDD provides a driving voltage to the first electrode of the OLED through the turned-on fifth transistor T5, the third transistor T3, and the sixth transistor T6, driving the OLED to emit light.

[0110] During the driving process of the pixel driving circuit, the driving current flowing through the third transistor T3 (the driving transistor) is determined by the voltage difference between its gate electrode and the first electrode. Since the voltage at the second node N2 is Vdata - |Vth|, the driving current of the third transistor T3 is:

[0111] I = K * (Vgs - Vth) 2 = K * [(Vdd - Vd + |Vth|) - Vth] 2 = K * (Vdd - Vd) 2

[0112] Where I is the driving current flowing through the third transistor T3, which is also the driving current for driving the OLED, K is a constant, Vgs is the voltage difference between the gate electrode and the first electrode of the third transistor T3, Vth is the threshold voltage of the third transistor T3, Vd is the data voltage output by the data signal line D, and Vdd is the power supply voltage output by the first power supply line VDD.

[0113] With the development of technology, the functions of electronic products such as mobile phones and tablet computers are becoming increasingly powerful, and users have higher and higher requirements for battery life. Figure 6 FIG. Figure 6 is a schematic cross-sectional structure diagram of a display panel and a battery, showing the state after the bonding area is bent. As Figure 6 shown, in a plane parallel to the display panel, the display panel may at least include a display area 100 and a bonding area 200 located on one side of the display area 100. The bonding area 200 may at least include a wiring area 210, a bending area 220, and a composite circuit area 230 arranged in sequence along the direction away from the display area 100. The wiring area 210 may be connected to the display area 100, the bending area 220 may be connected to the wiring area 210, the composite circuit area 230 may be connected to the bending area 220, and the bending area 220 may make the composite circuit area 230 fit to the back of the display area 100 by bending. The composite circuit area 230 may overlap with the display area 100 in a direction perpendicular to the plane of the display area. By setting the bending area 220 to bend the display substrate 10, the border width of the display panel can be reduced. The composite circuit area 230 may at least include a driving chip area and a bonding pin area. The integrated circuit 240 is bonded and connected to the driving chip area, and the flexible circuit board 250 is bonded and connected to the bonding pin area. The battery 50 is disposed on the back of the display area 100. Since the flexible circuit board 250 occupies part of the space, the size of the battery 50 in a plane parallel to the display panel is limited. In some technologies, to increase the space of the battery 50, the flexible circuit board 250 is bent, and one end of the flexible circuit board 250 close to the battery 50 is bent toward the side of the bending area 220 to reduce the planar size occupied by the flexible circuit board 250 and provide more space for the overall machine battery assembly. Figure 7 FIG. Figure 7 is a schematic cross-sectional structure diagram of a display panel and a battery after the flexible circuit board is bent. As Figure 7 shown, after the flexible circuit board 250 is bent, in a plane parallel to the display panel, the size of the battery 50 increases by d, thereby increasing the battery capacity and improving the battery life performance.

[0114] After the flexible circuit board 250 is bent, the second adhesive layer 252 is used to bond and fix the bent area of the flexible circuit board 250. The inventors of the present application have found through research that compared with the width of the second adhesive layer 252, the length of the bent area of the flexible circuit board 250 is too long, which will make it highly probable that the bent area of the flexible circuit board 250 will come unglued. In this unglued state, the user's touch or press operation on the display panel is likely to cause the circuit of the display panel to break, resulting in poor display. It can be seen that the bonding and fixing strength of the bent area of the flexible circuit board 250 has a great impact on the reliability of the product.

[0115] An embodiment of the present disclosure provides a display panel, including a display substrate and a flexible circuit board; the display substrate includes a display area and a bonding area located on one side of the display area, and the flexible circuit board is connected to the bonding area; the bonding area includes a bending area, and the bending area is configured to bend the flexible circuit board to the backlight side surface of the display area; in a direction away from the display substrate, the flexible circuit board sequentially includes a bonding portion, a bending portion, and a connecting portion; the bonding portion is configured to be bonded and connected to the bonding area, the bending portion is configured to bend the connecting portion to the back of the bonding portion by bending, and the bending portion forms a bending area of the flexible circuit board after bending; a second adhesive layer is filled in the bending area of the flexible circuit board, and the second adhesive layer is configured to fix the bending state of the flexible circuit board.

[0116] In the display panel provided by the embodiment of the present disclosure, by setting the second adhesive layer to fill the bending area of the flexible circuit board, the contact area between the second adhesive layer and the bending area of the flexible circuit board is increased, and the problem that the flexible circuit board is prone to delamination after bending is solved.

[0117] In an exemplary embodiment, the second adhesive layer is an ultraviolet adhesive.

[0118] In an exemplary embodiment, in a direction away from the display panel, the flexible circuit board includes a first cover film, a conductive layer, a substrate, and a second cover film stacked in sequence; the orthographic projection of the first cover film on the substrate is located at the bending portion and the connecting portion, and the orthographic projection of the second cover film on the substrate is located at the bonding portion and the connecting portion.

[0119] In an exemplary embodiment, the thickness of the substrate is greater than or equal to 5 microns and less than or equal to 9 microns.

[0120] In an exemplary embodiment, the thickness of the substrate is 7.5 microns.

[0121] In an exemplary embodiment, the first cover film located at the bending portion includes a hollowed-out window structure, and an ink layer is inside the window.

[0122] In an exemplary embodiment, the window structure includes at least one strip-shaped window, the extending direction of each strip-shaped window is the same as the extending direction of the bending portion, and the length of each strip-shaped window is the same as the length of the bending portion.

[0123] In an exemplary embodiment, the window structure includes a plurality of windows arranged at intervals, and the patterns of the plurality of windows are the same or different.

[0124] In an exemplary embodiment, the plurality of windows are arranged in at least one row along the extending direction of the bending portion.

[0125] In an exemplary embodiment, the bonding region includes a wiring region, the bending region, and a composite circuit region that are sequentially arranged along a direction away from the display region. The bending region bends to make the composite circuit region fit onto the backlight side surface of the display region; the bonding portion is arranged to be bonded and connected to the composite circuit region; the composite circuit region includes a driving chip region and a bonding pin region that are sequentially arranged along a direction away from the display region. An integrated circuit is bonded and connected to the driving chip region, and a flexible circuit board is bonded and connected to the bonding pin region; an integrated circuit tape is arranged on a side of the integrated circuit away from the display substrate, and a positive projection of the integrated circuit tape on the display substrate covers a positive projection of the integrated circuit on the display substrate. The flexible circuit board is fixed to the integrated circuit tape after being bent.

[0126] In an exemplary embodiment, the display panel further includes a connector and an adapter circuit board. The connection portion is arranged to be connected to the connector, and the connector is arranged to connect the flexible circuit board and the adapter circuit board; a positive projection of the connector on the display panel does not overlap with a positive projection of the wiring region on the display panel; or, a positive projection of the connector on the display panel overlaps with a positive projection of the wiring region on the display panel, and a protective tape is arranged between the connector and the display substrate.

[0127] In this exemplary embodiment, by setting that a positive projection of the connector on the display panel does not overlap with a positive projection of the wiring region on the display panel, or by arranging a protective tape between the connector and the display substrate and using the protective tape to protect the display substrate, the connector will not press on the wiring on the display substrate when being stressed, thus solving the problem that the flexible circuit board is likely to press and damage the wiring on the display substrate after being bent.

[0128] In an exemplary embodiment, the connector can be a board-to-board (BTB) connector, and the present disclosure does not limit this.

[0129] In an exemplary embodiment, the display panel includes a first frame, a second frame, a third frame, and a fourth frame. The first frame and the fourth frame are oppositely arranged, and the second frame and the third frame are oppositely arranged; the composite circuit region is arranged close to the fourth frame, and an extending direction of the flexible circuit board is parallel to the fourth frame; a positive projection of the connector on the display panel does not overlap with a positive projection of the wiring region on the display panel, including: the connector is located on a side of the flexible circuit board close to the second frame; or, the connector is located on a side of the flexible circuit board close to the third frame.

[0130] In an exemplary embodiment, the orthographic projection of the adapter circuit board on the plane where the display panel is located is outside the range of the display panel; or, the orthographic projection of the adapter circuit board on the plane where the display panel is located is within the range of the display panel.

[0131] In an exemplary embodiment, the display panel includes a first border, a second border, a third border, and a fourth border. The first border and the fourth border are oppositely arranged, and the second border and the third border are oppositely arranged; the composite circuit area is disposed close to the fourth border, and the extending direction of the flexible circuit board is parallel to the fourth border; the orthographic projection of the connector on the display panel and the orthographic projection of the routing area on the display panel do not overlap, including: the connector is located on the side of the flexible circuit board close to the fourth border, and the orthographic projection of the connector on the plane where the display panel is located is outside the range of the display panel.

[0132] In an exemplary embodiment, in the direction perpendicular to the display panel, on the backlight side surface of the display substrate, there are a back film layer, a heat dissipation layer disposed on the side of the back film layer away from the display substrate, and a spacer layer disposed on the side of the heat dissipation layer away from the display substrate; the flexible circuit board is fixed to the side of the spacer layer away from the display substrate through a first adhesive layer.

[0133] In an exemplary embodiment, the orthographic projection of the first adhesive layer on the display panel and the orthographic projection of the second adhesive layer on the display panel overlap.

[0134] Figure 8 It is a top view of the flexible circuit board in an exemplary embodiment. As Figure 8 shown, in the plane of the display panel and in the direction away from the display panel, the flexible circuit board 250 sequentially includes a bonding portion 301, a bending portion 302, and a connecting portion 303. The bonding portion 301 is configured to be bonded and connected to the display panel, the connecting portion 303 is configured to be connected to the connector 260, and the bending portion 302 can bend the connecting portion 303 to the back of the bonding portion 301 in a bending manner. The bending portion 302 forms a bending area of the flexible circuit board 250 after bending. As Figure 8 shown, the width of the bending portion 302 can be d, and the length of the bending portion 302 can be s. In Figure 8 , the length of the bending portion 302 can be equal to the length of the flexible circuit board 250.

[0135] In an exemplary embodiment, the width d of the bending portion 302 can be approximately 6 mm, and the length s of the bending portion 302 can be approximately 130 mm.

[0136] Figure 9A side view of a flexible circuit board in yet another exemplary embodiment. As Figure 9 shown, in the plane of the display panel and in the direction away from the display substrate, the flexible circuit board 250 sequentially includes a bonding portion 301, a bending portion 302, and a connecting portion 303. In the direction perpendicular to the display panel, the flexible circuit board 250 includes a substrate 310. The substrate 310 includes a first side surface and a second side surface that are oppositely disposed. Before the flexible circuit board 250 is bent, the first side surface faces the display panel. A conductive layer 311 is disposed on the first side surface of the substrate 310, a first cover film 312 is disposed on the side of the conductive layer 311 away from the substrate 310, and a second cover film 313 is disposed on the second side surface of the substrate 310. The first cover film 312 exposes the surface of the conductive layer 311 located at the bonding portion 301, and the second cover film 313 exposes the surface of the substrate 310 located at the bending portion 302. In an exemplary embodiment, the material of the substrate 310 may be polyimide (PI), and the material of the conductive layer 311 may be metallic copper (Cu). The present disclosure does not limit this.

[0137] In an exemplary embodiment, in the Figure 9 shown cross-sectional structure, the thickness of the substrate 310 may be approximately 7.5 micrometers. The inventors of the present application have found through research that the overall thickness of the flexible circuit board 250 is relatively thick, and the rebound force generated after bending is relatively large, resulting in easy delamination of the bending area of the flexible circuit board 250. By reducing the thickness of the substrate 310 to about 7.5 micrometers, the rebound force of the bending area of the flexible circuit board 250 can be reduced without affecting the performance of the flexible circuit board 250. In an exemplary embodiment, after the thickness of the substrate 310 is reduced to about 7.5 micrometers, the rebound force of the flexible circuit board 250 in the bending area is reduced from 15 N to about 8 N, effectively reducing the risk of delamination. With the progress of technology, the thickness of the substrate 310 can be further reduced. The present disclosure does not limit this.

[0138] Figure 10 A side view of a flexible circuit board in yet another exemplary embodiment. Figure 10 Differing from Figure 9 is that Figure 10 the structure of the first cover film 312 at the bending portion 302 is different. As Figure 10 shown, the first cover film 312 only covers the connecting portion 303, the first cover film 312 at the bending portion 302 is removed, and an ink layer 314 is formed at the bending portion 302. Compared with the first cover film 312, the thickness of the ink layer 314 is smaller, and the thickness at the bending portion 302 is smaller, which helps to reduce the rebound force of the bending area of the flexible circuit board 250. In an exemplary embodiment, the thickness of the ink layer 314 is about 15 micrometers. The present disclosure does not limit this.

[0139] In other embodiments, the first covering film 312 located at the bending portion 302 may be retained, a windowing structure may be formed on the first covering film 312 located at the bending portion 302, the first covering film 312 within the windowing is removed, and an ink layer 314 pattern is formed within the windowing, which can also play a role in reducing the resilience of the bending area of the flexible circuit board 250. The present disclosure places no limitation thereon.

[0140] Next, Figures 11 to 18 the pattern of the windowing structure of the flexible circuit board 250 will be described.

[0141] Figure 11 FIG. Figure 10 is a top view of the flexible circuit board in the [description not clear]. As Figure 11 shown, the first covering film 312 located at the bending portion 302 may be removed, a windowing structure is formed throughout the bending portion 302, and the ink layer 314 is filled in this windowing structure, greatly reducing the thickness of the bending portion 302. In an exemplary embodiment, the area of the ink layer 314 is s*d = 6*130 = 780 square millimeters.

[0142] Figure 12 FIG. Figure 12 is a top view of forming a windowing structure on the first covering film at the bending portion in an exemplary embodiment. As Figure 12 shown, a plurality of diamond-shaped windows may be formed on the first covering film 312 located at the bending portion 302. The plurality of diamond-shaped windows may be arranged in sequence along the extending direction of the bending portion 302. The first covering film 312 within the windows is removed, and the ink layer 314 is formed within the windows by coating an ink material. Using the spaced-apart ink layer 314 to make the first covering film 312 form a discontinuous structure can reduce the internal stress accumulated in the first covering film 312, thereby reducing the resilience of the bending area of the flexible circuit board 250.

[0143] Figure 13 FIG. Figure 13 is different from Figure 12 in the shape of the windows. Figure 13 In [[reference not clear]], a plurality of rectangular windows may be formed on the first covering film 312 located at the bending portion 302. The plurality of rectangular windows may be arranged in sequence along the extending direction of the bending portion 302. The first covering film 312 within the windows is removed, and the ink layer 314 is formed within the windows by coating an ink material. Other structures and effects may be referred to the description of [[reference not clear]], and will not be elaborated herein. Figure 21 herein.

[0144] Figure 14 FIG. Figure 14 is different from Figure 12 in the shape of the windows.Figure 14 A plurality of parallelogram-shaped openings can be formed in the first cover film 312 at the bending portion 302. The plurality of parallelogram-shaped openings can be arranged in sequence along the extending direction of the bending portion 302. The first cover film 312 within the openings is removed, and an ink layer 314 is formed by coating an ink material within the openings. Other structures and effects can be referred to the description of Figure 12 , and will not be elaborated herein. In other embodiments, the shape and size of the openings can be set as needed. For example, the shape of the openings can be circular, oval, square, and other polygonal and irregular shapes. The present disclosure does not limit this.

[0145] Figure 15 FIG. is a top view of a window structure formed on the first cover film at the bending portion in yet another exemplary embodiment. As Figure 15 shown, two strip-shaped openings can be formed in the first cover film 312 at the bending portion 302. The extending direction of each strip-shaped opening can be the same as the extending direction of the bending portion 302, and the length of each strip-shaped opening can be the same as the length of the bending portion 302. The first cover film 312 within the openings is removed, and an ink layer 314 is formed by coating an ink material within the openings. The first cover film 312 is located between the two strip-shaped openings. The discontinuous structure of the first cover film 312 is formed by using the ink layer 314 arranged at intervals, thereby reducing the internal stress accumulated in the first cover film 312, and thus reducing the rebound force of the bending area of the flexible circuit board 250. By setting the extending direction and length of the strip-shaped openings to be the same as those of the bending portion 302, it is also convenient to bend the bending portion 302. In other embodiments, a plurality of strip-shaped openings can be formed in the first cover film 312 at the bending portion 302 as needed. The present disclosure does not limit this.

[0146] Figure 16 FIG. is a top view of a window structure formed on the first cover film at the bending portion in yet another exemplary embodiment. Figure 16 Differences from Figure 15 lie in the number and position of the strip-shaped openings. Figure 16 There is one strip-shaped opening provided in , and the orthographic projection of the strip-shaped opening on the bending portion 302 is within the orthographic projection of the first cover film 312 on the bending portion 302, which can reduce the number of openings and simplify the manufacturing process. Other structures and effects can be referred to the description of Figure 15 , and will not be elaborated herein.

[0147] Figure 17 FIG. is a top view of a window structure formed on the first cover film at the bending portion in yet another exemplary embodiment. As Figure 17As shown, two rows of window structures can be formed on the first covering film 312 located at the bending portion 302. Each row of window structures includes a plurality of windows arranged at intervals. The windows in different rows can be arranged correspondingly. The extending direction of each row of window structures can be the same as the extending direction of the bending portion 302. The first covering film 312 within the windows is removed, and an ink layer 314 is formed by coating an ink material within the windows. The first covering film 312 can be located between the windows in adjacent rows and between adjacent windows in the same row. In other embodiments, multiple rows of window structures can be formed on the first covering film 312 located at the bending portion 302, and the windows in different rows can be arranged staggeredly. The present disclosure places no limitation thereon. By using the ink layers 314 arranged at intervals to make the first covering film 312 form a discontinuous structure, the internal stress accumulated in the first covering film 312 is reduced, thereby reducing the resilience force of the bending area of the flexible circuit board 250. By setting the extending direction and length of the strip-shaped windows to be the same as those of the bending portion 302, it is also convenient to bend the bending portion 302.

[0148] Figure 18 It is a top view of forming a window structure on the first covering film at the bending portion in yet another exemplary embodiment. Figure 18 And Figure 17 The difference is that Figure 18 a single row of window structures is set, and the orthographic projection of the window structure on the bending portion 302 can be within the orthographic projection of the first covering film 312 on the bending portion 302. Other structures and effects can be referred to the description of Figure 17 and will not be elaborated herein.

[0149] In practical applications, any shape and number of windows can be set on the first covering film at the bending portion as needed. Any one or more of the shape combinations such as Figures 11 to 18 can be adopted, or other shape designs can be adopted. The present disclosure places no limitation thereon.

[0150] Figure 19 It is a cross-sectional view of the first adhesive layer in some technologies. In the exemplary embodiment, the first adhesive layer 251 includes a base material layer 401 and a first adhesive layer 402 and a second adhesive layer 403 located on opposite two surfaces of the base material layer 401. The base material layer 401 can be polyethylene terephthalate (PET), and the first adhesive layer 402 and the second adhesive layer 403 can be pressure-sensitive double-sided adhesives. In the exemplary embodiment, the thickness d1 of the base material layer 401 can be 550 microns, and the thicknesses d2 of the first adhesive layer 402 and d3 of the second adhesive layer 403 can both be 25 microns. Figure 19In the first adhesive layer 251 of the first adhesive layer 402 and the second adhesive layer 403 are in contact with the bent portion 302, and the bent area of the flexible circuit board 250 is fixed by the first adhesive layer 402 and the second adhesive layer 403.

[0151] Figure 20 FIG. is a schematic cross-sectional structure diagram of a display panel in an exemplary embodiment, showing the state of the flexible circuit board 250 after being bent. Figure 20 In the figure, the connector 260 and the adapter circuit board 270 are omitted. Figure 20 In the figure, the material of the first adhesive layer 251 is ultraviolet glue. Since the ultraviolet glue has fluidity, the first adhesive layer 251 can fill the bent area of the flexible circuit board 250 after curing. Compared with Figure 19 the structure of the PET pressure-sensitive adhesive in the figure, the first adhesive layer 251 made of ultraviolet glue material increases the contact area of the curved surface part with the bent area of the flexible circuit board 250, and the contact area is larger. Moreover, the viscosity of the ultraviolet glue is greater, which can increase the adhesive force of the bent area of the flexible circuit board 250. According to the research of the inventors of the present application, under the condition that other conditions are the same, the contact area between the ultraviolet glue and the bent area of the flexible circuit board 250 is about Figure 19 1.6 times the contact area between the PET pressure-sensitive adhesive and the bent area of the flexible circuit board 250 in the figure.

[0152] The flexible circuit board 250 can be connected to the adapter circuit board (i.e., the adapter FPC) through a connector. The display panel is carried with the adapter circuit board when leaving the factory. When assembling the whole machine using the display panel subsequently, the adapter circuit board will be removed, and the flexible circuit board 250 will be connected to the main board of the whole machine of the display device.

[0153] Figure 21 FIG. is a top view structural diagram of a display panel before bending the flexible circuit board. Figure 22 For Figure 21 the top view structural diagram of the display panel after bending the flexible circuit board in the figure. As Figure 21 and Figure 22As shown, the display panel can be rectangular, and the flexible circuit board 250 is disposed near the lower border of the display panel. Before bending the flexible circuit board 250, the connector 260 and the adapter circuit board 270 are located on the back side of the display area 100. After bending the flexible circuit board 250, the adapter circuit board 270 is located outside the display area 100, and the connector 260 is located at a position near the lower border of the display area 100. Since data lines are arranged at this position of the display panel, when the connector 260 is stressed, the reinforcement member 261 easily presses the display panel, causing the data lines to break. The electrical signals from the integrated circuit 240 cannot reach the display area through the data lines, resulting in poor display. For example, during the processes of removing the adapter circuit board 270, attaching a protective bracket to the display panel, and connecting the flexible circuit board 250 to the main board of the whole machine, the connector 260 easily squeezes the display panel under stress, leading to poor display. The inventors of the present application counted the process of removing the adapter circuit board 270. A total of 50 adapter circuit boards 270 of display panels were removed. Among them, the number of display panels with broken data lines at the connector 260 was 5, and the proportion of defective ones was about 10%. It can be seen that the adapter circuit board 270 easily damages the data lines of the display panel, causing poor display.

[0154] Figure 23 It is a schematic cross-sectional structure diagram of a display panel with an adapter circuit board, showing the state after bending of the bonding area. As Figure 23 shown, the flexible circuit board 250 is connected to the connector 260 and is connected to the adapter circuit board 270 through the connector 260. The adapter 260 is provided with a reinforcement member 261 made of steel sheet material. As Figure 23 shown, in the direction perpendicular to the display panel, the backlight side surface of the display substrate 10 may include a back film layer 20, a heat dissipation layer 30 provided on the side of the back film layer 20 away from the display substrate 10, and a spacer layer 40 provided on the side of the heat dissipation layer 30 away from the display substrate 10.

[0155] In an exemplary embodiment, the back film layer 20 is configured to support the display substrate 10 and can be disposed in the display area 100 and the bonding area 200. The back film layer 20 is provided with a back film opening at a position corresponding to the bending area 220, and the back film layer 20 within the back film opening is removed, exposing the backlight side surface of the display substrate 10, that is, the back film layer 20 of the bonding area 200 is respectively disposed in the wiring area 210 and the composite circuit area 230.

[0156] In an exemplary embodiment, the back film layer 20 can adopt a polymer low-modulus film material, such as flexible film materials such as polyolefin, polyimide, and polyurethane.

[0157] In an exemplary embodiment, the heat dissipation layer 30 is configured to dissipate the heat generated during the operation of the display substrate 10 and may be located only in the display area 100 and the wiring area 210.

[0158] In an exemplary embodiment, the heat dissipation layer 30 may include a first heat dissipation layer (not shown in the figure) and a second heat dissipation layer (not shown in the figure) sequentially arranged in a direction away from the display substrate 10. The first heat dissipation layer may include a grid adhesive layer and a buffer layer. The buffer layer may be made of a foam material, for example. The second heat dissipation layer may include a copper foil layer.

[0159] In an exemplary embodiment, the spacer 40 is configured to be respectively attached to the heat dissipation layer 30 in the wiring area 210 and the back film layer 20 in the composite circuit area 230 and may be located only in the display area 100 and the wiring area 210.

[0160] In an exemplary embodiment, the bending area 220 of the display panel includes a protective adhesive layer 60 provided on the light-emitting side surface of the display substrate 10. The protective adhesive layer 60 may extend from the wiring area 210 to the composite circuit area 230 to cover the display substrate in the bending area 220. As Figure 23 shown, the protective adhesive layer 60 in the composite circuit area 230 may cover a part of the composite circuit area 230; in other embodiments, the protective adhesive layer 60 in the composite circuit area 230 may cover the entire composite circuit area 230. The protective adhesive layer 60 may provide protection for the bending arc area.

[0161] In an exemplary embodiment, a polarizer (not shown in the figure) may also be provided on the light-emitting side surface of the display substrate. The protective adhesive layer 60 in the wiring area 210 may be located on the side of the polarizer away from the display area. Structures such as a cover plate may also be provided on the side of the polarizer away from the display substrate, and the present disclosure does not limit this.

[0162] As Figure 23As shown, after the display panel is bent, the flexible circuit board 250 can be fixed on the side of the spacer layer 40 away from the display substrate 10 through the first adhesive layer 251. After the flexible circuit board 250 is bent, a second adhesive layer 252 can be provided between the opposite side surfaces of the bending area of the flexible circuit board 250 to fix the bending state of the flexible circuit board 250, and the orthographic projection of the second adhesive layer 252 on the display substrate 10 can overlap with the orthographic projection of the first adhesive layer 251 on the display substrate 10. The first adhesive layer 251 and the second adhesive layer 252 can be, for example, pressure sensitive adhesive (PSA). An IC tape 241 can be provided on the side of the integrated circuit 240 away from the display substrate 10, and the orthographic projection of the IC tape 241 on the display substrate 10 can include the orthographic projection of the integrated circuit 240 on the display substrate 10. The IC tape 241 can be a double-sided tape, and after the flexible circuit board 250 is bent, one end of the flexible circuit board 250 can be fixed on the IC tape 241. The bent flexible circuit board 250 can be fixed on the display panel through the second adhesive layer 252 and the IC tape 241 .

[0163] Figure 24 FIG. 1 is a schematic diagram of a top view of a display panel in an exemplary embodiment, illustrating the state of a flexible circuit board after being bent. Figure 24 As shown, the display panel may be rectangular, and the display panel may include a first frame 101, a second frame 102, a third frame 103, and a fourth frame 104, wherein the first frame 101 and the fourth frame 104 are arranged opposite to each other, the second frame 102 and the third frame 103 are arranged opposite to each other, the fourth frame 104 may be the lower frame of the display panel, and the display substrate is bound and connected with the flexible circuit board 250 on one side of the fourth frame 104. The flexible circuit board 250 is arranged near the fourth frame 104, and the extension direction of the flexible circuit board 250 may be parallel to the fourth frame 104. The flexible circuit board 250 is connected to the adapter circuit board 270 through the connector 260, and the connector 260 is located on the side of the flexible circuit board 250 near the second frame 102, and the adapter circuit board 270 is connected to the connector 260, and the adapter circuit board 270 may extend from one side of the second frame 102 to the outside of the display area 100. By arranging the connector 260 on one side of the side frame of the display panel, the connector 260 avoids the wiring area of the data line on the display panel, thereby avoiding the breakage of the data line caused by the connector 260 squeezing the display panel under force and avoiding poor display.

[0164] In other embodiments, the display panel may be in a circular, elliptical, triangular, quadrilateral, or other polygonal shapes, which is not limited in the present disclosure.

[0165] Figure 25FIG. 1 is a schematic diagram of a top view of a display panel in another exemplary embodiment, illustrating a state of a flexible printed circuit board after being bent. Figure 25 and Figure 24 The difference is that the position of the adapter circuit board 270 is different. Figure 25 After the adapter circuit board 270 is connected to the connector 260, the adapter circuit board 270 is located on the back side of the display panel, and the orthographic projection of the adapter circuit board 270 on the display panel is located in the plane of the display panel. This position setting of the adapter circuit board 270 can reduce the plane area occupied by the entire display panel, which is convenient for storage and transportation.

[0166] Figure 26 FIG. 1 is a schematic diagram of a top view of a display panel in another exemplary embodiment, illustrating a state of a flexible printed circuit board after being bent. Figure 26 and Figure 24 The difference lies in the different positions of the connector 260 and the adapter circuit board 270. Figure 26 The middle connector 260 is located on a side of the flexible circuit board 250 close to the third frame 103, and the adapter circuit board 270 extends from one side of the third frame 103 to the outside of the display area 100. Figure 24 The same as in, no further description is given here.

[0167] Figure 27 FIG. 1 is a schematic diagram of a top view of a display panel in another exemplary embodiment, illustrating a state of a flexible printed circuit board after being bent. Figure 27 and Figure 26 The difference is that the position of the adapter circuit board 270 is different. Figure 27 After the adapter circuit board 270 is connected to the connector 260, the adapter circuit board 270 is located on the back side of the display panel, and the orthographic projection of the adapter circuit board 270 on the display panel is located in the plane of the display panel. This position setting of the adapter circuit board 270 can reduce the plane area occupied by the entire display panel, which is convenient for storage and transportation.

[0168] Figure 28 FIG. 1 is a schematic diagram of a top view of a display panel in another exemplary embodiment, illustrating a state of a flexible printed circuit board after being bent. Figure 28 and Figure 24 The difference lies in the different positions of the connector 260 and the adapter circuit board 270. Figure 28The middle connector 260 is located on the side of the flexible circuit board 250 close to the fourth border 104. The connector 260 extends from one side of the fourth border 104 to the outside of the display area 100. The adapter circuit board 270 is connected to the connector 260 and is located outside the display area 100. The orthographic projections of the connector 260 and the adapter circuit board 270 on the plane where the display panel is located are outside the scope of the display panel. By arranging the connector 260 outside the display panel, the connector 260 avoids the wiring area of the data lines on the display panel, preventing the data lines from being broken due to the connector 260 squeezing the display panel under stress and avoiding poor display quality.

[0169] Figure 29 FIG. is a schematic cross-sectional structure diagram of another display panel with an adapter circuit board, showing the state after the binding area is bent. As Figure 29 shown, the orthographic projection of the connector 260 on the display panel is within the scope of the display panel. A protective strip 262 can be arranged between the connector 260 and the display panel. When the connector 260 squeezes the display panel under stress, the protective strip 262 can play a protective role for the display panel to avoid damage to the display panel. The protective strip 262 can be made of a material with a certain buffering effect, such as foam and other materials. As Figure 29 shown, the protective strip 262 can be located between the reinforcing member 261 and the display substrate 10. By arranging the protective strip 262, protection can be provided for the display panel without changing the pin positions and directions of the flexible circuit board 250.

[0170] Next, taking the preparation of the Figure 29 display panel shown as an example, the bending and fixing process of the flexible circuit board will be described.

[0171] In an exemplary embodiment, the preparation of the Figure 29 display panel shown can be as Figures 30 to 31 shown, Figures 30 to 31 where the identification of other components is omitted for illustration. As Figure 30 shown, a flexible circuit board 250 with a protective strip 262 can be provided, and the protective strip 262 can be pasted on the reinforcing member 261. After binding and connecting the flexible circuit board 250 to the display substrate, the display panel is bent, and the bent display panel can be as Figure 31 shown. Finally, the flexible circuit board 250 is bent, and the bent display panel can be as Figure 29 shown, with the protective strip 262 located between the reinforcing member 261 and the display substrate. By pasting the protective strip 262 on the flexible circuit board 250 in advance, the operation is simple when the flexible circuit board 250 is bent, and the preparation steps can be saved.

[0172] In an exemplary embodiment, the preparation of the Figure 29The display panel shown can be as Figures 32 to 33 shown, Figures 32 to 33 wherein the identification of other components is omitted for illustration. The flexible circuit board 250 can be bound and connected to the display substrate, and the display panel can be bent. The bent display panel can be as Figure 33 shown. Subsequently, a protective tape 262 is attached to the corresponding position of the display substrate, as Figure 33 shown. Finally, the flexible circuit board 250 is bent, and the reinforced member 261 after bending overlaps with the protective tape 262 at least partially. The protective tape 262 is located between the reinforced member 261 and the display substrate. The display panel after this bending can be as Figure 29 shown. By attaching the protective tape 262 to the corresponding position of the display substrate and bringing the reinforced member 261 of the bent flexible circuit board 250 into contact with the protective tape 262, the attachment position is more flexible, and the size and attachment position of the appropriate protective tape 262 can be selected as needed.

[0173] The preparation process of the flexible circuit board will be exemplarily described below.

[0174] In an exemplary embodiment, the preparation process of the flexible circuit board can be as Figures 34 to 37 shown.

[0175] Step S1, a substrate of appropriate size is cut from the incoming coil. The substrate can include a substrate 310, a first conductive layer 511 on the first surface of the substrate 310, and a second conductive layer 512 on the second surface of the substrate 310. The first surface and the second surface are oppositely arranged. The substrate is divided into three parts: a binding part 301, a bending part 302, and a connecting part 303 as needed, as Figure 34 shown. The materials of the first conductive layer 511 and the second conductive layer 512 can be metal, such as copper.

[0176] Step S2, steps such as exposure, development, and etching are performed on the second surface of the substrate to remove the second conductive layer 512 located in the binding part 301 and the bending part 302, and bumps 513 are formed on the first conductive layer 511 in the binding part 301, as Figure 35 shown.

[0177] Step S3, a second cover film 312 is attached to the second surface of the substrate and patterned, removing the second cover film 312 located in the connecting part 303 and removing part of the second cover film 312 located in the bending part 302, as Figure 36 shown.

[0178] Step S4: Attach the first cover film 311 to the first surface of the substrate and pattern the first cover film 311. Remove the first cover film 311 located at the bonding part 301 and the connecting part 303, and then perform baking to fix the first cover film 311 and the second cover film 312, as Figure 37 shown.

[0179] In other embodiments, the size of the substrate and the removal and retention of relevant film layers can be designed as needed. For example, the second conductive layer 512 located at the connecting part 303 can be removed, the second cover film 312 can be formed at the connecting part 303, and the second cover film 312 located at the bending part 302 can be removed. The present disclosure does not limit this.

[0180] The preparation process of the window opening of the flexible circuit board will be described below.

[0181] In the above step S4, the attached first cover film 311 previously includes a window opening with a preset shape.

[0182] Step S5: Coat ink at the window opening position of the first cover film 311 to form an ink layer 314, as Figure 38 shown. In an exemplary embodiment, the thickness of the ink layer 314 can be set as needed. For example, it can be about 15 micrometers.

[0183] The embodiments of the present disclosure also provide a display device, including the display panel described in any of the above embodiments. The display device can be: an OLED display, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, or any product or component with a display function. The embodiments of the present disclosure are not limited thereto.

[0184] Although the disclosed embodiments of the present invention are as above, the described content is only an embodiment adopted for the convenience of understanding the present invention and is not used to limit the present invention. Any person skilled in the art within the scope of the present invention can make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed by the present invention. However, the scope of patent protection of the present invention shall still be subject to the scope defined by the appended claims.

Claims

1. A display panel, characterized in that, The invention comprises a display substrate and a flexible circuit board; the display substrate comprises a display area and a binding area located on one side of the display area, and the flexible circuit board is connected to the binding area; the binding area comprises a bending area, and the bending area is configured to bend the flexible circuit board to the backlight side surface of the display area; In a direction away from the display substrate, the flexible circuit board includes a binding portion, a bending portion and a connecting portion in sequence; the binding portion is configured to be bound and connected to the binding area, the bending portion is configured to bend the connecting portion to the back side of the binding portion by bending, and the bending portion forms a bending area of the flexible circuit board after being bent; A second adhesive layer is filled in the bending area of the flexible circuit board, and the second adhesive layer is configured to fix the bending state of the flexible circuit board; The binding area includes a routing area, a bending area and a composite circuit area which are sequentially arranged in a direction away from the display area, and the bending area is bent so that the composite circuit area is attached to the backlight side surface of the display area; the binding portion is configured to be bound and connected with the composite circuit area; The composite circuit area includes a driving chip area and a binding pin area which are sequentially arranged in a direction away from the display area, the integrated circuit is bound and connected to the driving chip area, and the flexible circuit board is bound and connected to the binding pin area; an integrated circuit tape is arranged on a side of the integrated circuit away from the display substrate, the orthographic projection of the integrated circuit tape on the display substrate covers the orthographic projection of the integrated circuit on the display substrate, and the flexible circuit board is fixed on the integrated circuit tape after being bent; The display panel further includes a connector and a transfer circuit board; the connecting portion is configured to be connected to the connector, and the connector is configured to connect the flexible circuit board and the transfer circuit board; the orthographic projection of the connector on the display panel does not overlap with the orthographic projection of the routing area on the display panel; Alternatively, an orthographic projection of the connector on the display panel overlaps with an orthographic projection of the wiring area on the display panel, and a protective strip is provided between the connector and the display substrate.

2. The display panel according to claim 1, wherein The second adhesive layer is ultraviolet glue.

3. The display panel according to claim 1, wherein In a direction away from the display panel, the flexible circuit board includes a first covering film, a conductive layer, a substrate and a second covering film stacked in sequence; the orthographic projection of the first covering film on the substrate is located at the bending portion and the connecting portion, and the orthographic projection of the second covering film on the substrate is located at the binding portion and the connecting portion.

4. The display panel according to claim 3, wherein The thickness of the substrate is greater than or equal to 5 micrometers and less than or equal to 9 micrometers.

5. The display panel according to claim 3, characterized in that, The first covering film located at the bending portion includes a hollow window structure, and an ink layer is inside the window.

6. The display panel according to claim 5, wherein The window structure includes at least one strip-shaped window, the extension direction of each strip-shaped window is the same as the extension direction of the bending portion, and the length of each strip-shaped window is the same as the length of the bending portion.

7. The display panel according to claim 5, wherein, The window structure includes a plurality of windows arranged at intervals, and patterns of the plurality of windows are the same or different.

8. The display panel according to claim 7, wherein The plurality of windows are arranged in at least one row along an extension direction of the bending portion.

9. The display panel according to claim 1, wherein The display panel includes a first frame, a second frame, a third frame and a fourth frame, the first frame and the fourth frame are arranged opposite to each other, and the second frame and the third frame are arranged opposite to each other; the composite circuit area is arranged close to the fourth frame, and the extension direction of the flexible circuit board is parallel to the fourth frame; The orthographic projection of the connector on the display panel and the orthographic projection of the wiring area on the display panel do not overlap, including: The connector is located on a side of the flexible circuit board close to the second frame; Alternatively, the connector is located on a side of the flexible circuit board close to the third frame.

10. The display panel according to claim 9, wherein, The orthographic projection of the adapter circuit board on the plane where the display panel is located is outside the range of the display panel; or, the orthographic projection of the adapter circuit board on the plane where the display panel is located is within the range of the display panel.

11. The display panel according to claim 1, wherein The display panel includes a first frame, a second frame, a third frame and a fourth frame, the first frame and the fourth frame are arranged opposite to each other, and the second frame and the third frame are arranged opposite to each other; the composite circuit area is arranged close to the fourth frame, and the extension direction of the flexible circuit board is parallel to the fourth frame; The orthographic projection of the connector on the display panel and the orthographic projection of the wiring area on the display panel do not overlap, including: The connector is located at a side of the flexible circuit board close to the fourth frame, and an orthographic projection of the connector on the plane where the display panel is located is outside the range of the display panel.

12. The display panel according to claim 1, wherein, In a direction perpendicular to the display panel, the backlight side surface of the display substrate includes a back film layer, a heat dissipation layer arranged on a side of the back film layer away from the display substrate, and a spacer layer arranged on a side of the heat dissipation layer away from the display substrate; the flexible circuit board is fixed to the side of the spacer layer away from the display substrate by a first adhesive layer.

13. A display device, characterized in that, The invention comprises the display panel as claimed in any one of claims 1 to 12.

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