Manufacturing process of multilayer LCP circuit

Abstract

The present application provides a manufacturing process for a multilayer LCP circuit. The manufacturing process for the multilayer LCP circuit includes: applying LDS ink on a carrier film to form a first ink layer; performing laser engraving on the first ink layer to form a first circuit groove; performing chemical plating on the first ink layer to form a first circuit layer; applying LCP slurry to the first ink layer and the first circuit layer to form an LCP barrier layer; applying LDS ink on the LCP barrier layer to form a second ink layer; performing laser engraving on the second ink layer to form a second circuit groove; performing chemical plating on the second ink layer to form a second circuit layer; applying LCP slurry to the second ink layer and the second circuit layer to form an LCP barrier layer; repeating the first four steps at least once to form a multilayer circuit tape; die-cutting the multilayer circuit tape to form a multilayer circuit semi-finished product with a via hole; filling the via hole with silver paste to form a conductive part in the via hole. In this way, the quality of the multilayer LCP circuit is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of multilayer LCP circuits, and in particular to a manufacturing process of a multilayer LCP circuit. Background Art

[0002] In recent years, the in-depth and rapid development of the Internet of Things (IoT) in numerous high-tech application fields, such as mobile data communications, industrial automation, and aerospace, has led to increasingly stringent requirements for the high-frequency electromagnetic wave performance of RF circuit components and substrates used in electronic communications equipment. High-frequency electromagnetic waves, as RF circuit components, pose significant technical challenges to the design of general high-frequency, high-speed electromagnetic wave substrates and the design, fabrication, and process engineering of typical high-frequency, high-speed electromagnetic wave signal transmission and control systems.

[0003] Many researchers at home and abroad have conducted relevant research on the creation of multi-layer LCP circuits. Currently, there are two methods for making LCP multi-layer circuits. One is to use a low-melting-point LCP layer as an adhesive layer, stack a low-melting-point LCP layer between two adjacent layers of circuits, and then vacuum-press the stacked multi-layer circuits in a high-temperature pressing machine; or, in the case of an adhesive layer, directly use a high-temperature press to hot-press the multi-layer circuits.

[0004] However, during the high-temperature lamination process, the low-melting-point LCP layer will flow, resulting in uneven thickness of the circuit lamination, affecting the impedance of the circuit and causing impedance discontinuity. In addition, the flow of the low-melting-point LCP layer will cause the circuit to drift more easily, resulting in poor circuit reliability, thus reducing the quality of the multi-layer LCP circuit. Summary of the Invention

[0005] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a multilayer LCP circuit manufacturing process that avoids the problem of uneven circuit thickness caused by the flow of the LCP layer, while avoiding the problem of circuit deviation caused by the flow of the LCP layer, thereby improving the quality of the multilayer LCP circuit.

[0006] The object of the present invention is achieved through the following technical solutions:

[0007] A multilayer LCP circuit manufacturing process is provided, wherein the multilayer LCP circuit is manufactured using a circuit manufacturing device, wherein the circuit manufacturing device includes a carrier coil, a reeling device, and a reeling device, wherein the reeling device and the reeling device are respectively used to unwind and reel the carrier coil, and a manufacturing area is formed between the reeling device and the reeling device;

[0008] The circuit production equipment further includes a production device, a die-cutting device, and a grouting device, wherein the production device, the die-cutting device, and the grouting device are all located in the production area and are sequentially arranged along the conveying direction of the carrier film carrying the coiled material; the number of the production devices is at least three, and at least three of the production devices are sequentially arranged along the conveying direction of the carrier film, and each production device includes an ink scraping mechanism, a laser engraving mechanism, a chemical plating mechanism, and a grease scraping mechanism sequentially arranged along the conveying direction of the carrier film;

[0009] The manufacturing process of the multilayer LCP circuit includes at least the following steps:

[0010] Step S101: Rewinding the carrier coil into the unwinding device and the rewinding device respectively;

[0011] Step S103: applying LDS ink on the carrier film by the doctor blade mechanism to form a first ink layer on the carrier film;

[0012] Step S105: performing a laser engraving operation on the first ink layer by using the laser engraving mechanism to form a first circuit groove on the first ink layer;

[0013] Step S107: performing a chemical plating operation on the first ink layer by a first chemical plating mechanism arranged along the conveying direction of the carrier film to form a first circuit layer in the first circuit groove;

[0014] Step S109: applying LCP slurry to the first ink layer and the first circuit layer by a first scraping mechanism arranged along the conveying direction of the carrier film, so as to form an LCP barrier layer on the first ink layer and the first circuit layer;

[0015] Step S111: coating LDS ink on the LCP barrier layer by a next doctor blade mechanism arranged along the conveying direction of the carrier film, so as to form a second ink layer on the LCP barrier layer;

[0016] Step S113: performing a laser engraving operation on the second ink layer by a next laser engraving mechanism arranged along the conveying direction of the carrier film to form a second circuit groove on the second ink layer;

[0017] Step S115: performing a chemical plating operation on the second ink layer by a next chemical plating mechanism arranged along the conveying direction of the carrier film, so as to form a second circuit layer in the second circuit groove;

[0018] Step S117: applying LCP slurry to the second ink layer and the second circuit layer through a next scraping mechanism arranged along the conveying direction of the carrier film to form an LCP barrier layer on the second ink layer and the second circuit layer;

[0019] Step S119: Repeat steps S111 to S117 at least once to form a multi-layer circuit tape;

[0020] Step S121: die-cutting the multi-layer circuit tape by the die-cutting device to form a multi-layer circuit semi-finished product with conductive holes;

[0021] Step S123: filling the via holes with silver paste using the slurry filling device to form conductive components in the via holes. The conductive components are electrically connected to the first circuit layer and each of the second circuit layers, thereby forming a multi-layer LCP circuit.

[0022] In one embodiment, the chemical plating mechanism of each of the manufacturing devices includes a chemical solution pool and a pressure roller. The pressure roller of the chemical plating mechanism of each of the manufacturing devices is rotatably set in the corresponding chemical solution pool. The carrier film is wrapped around the pressure roller of the chemical plating mechanism of each of the manufacturing devices so that the carrier film enters the chemical solution pool of each of the manufacturing devices for chemical plating.

[0023] In one embodiment, each of the medicine pools contains a copper ion solution or a gold ion solution.

[0024] In one embodiment, each of the liquid medicine pools is also filled with a palladium catalyst.

[0025] In one embodiment, each of the scraping mechanisms includes a scraping assembly and an ink baking and curing assembly. Each of the scraping assemblies and the corresponding ink baking and curing assembly are arranged in sequence along the conveying direction of the carrier film. Each of the scraping assemblies is used to scrape the LDS ink onto the carrier film or the corresponding LCP barrier layer, and each of the ink baking and curing assemblies is used to cure the corresponding first ink layer or the corresponding second ink layer.

[0026] In one embodiment, step S103 includes:

[0027] scraping LDS ink on the carrier film by a scraping assembly to form a first ink viscosity layer on the carrier film;

[0028] The first ink viscous layer is baked by the corresponding ink baking and curing component, so that the first ink viscous layer is cured to form a first ink layer.

[0029] In one embodiment, step S113 includes:

[0030] Squeeze LDS ink onto the LCP barrier layer through another scraping assembly to form a second ink viscosity layer on the resin layer;

[0031] The second ink viscosity layer is baked by the corresponding ink baking and curing component, so that the second ink viscosity layer is cured to form a second ink layer.

[0032] In one embodiment, the chemical plating mechanism includes a silver paste scraping assembly and a silver paste baking and curing assembly, and the silver paste scraping assembly and the silver paste baking and curing assembly are sequentially arranged along the conveying direction of the carrier film;

[0033] The step S125 includes:

[0034] Scrape the silver paste into the conducting hole by the silver paste scraping assembly;

[0035] The silver paste in the via hole is baked by the silver paste baking and curing assembly, so that the silver paste in the via hole is solidified to form a conductive member.

[0036] In one embodiment, in the step S123 , there are multiple vias.

[0037] In one embodiment, the carrier film is a PPS film.

[0038] Compared with the prior art, the present invention has at least the following advantages:

[0039] The LCP barrier layer, the first ink layer, and each second ink layer are obtained by scraping. After curing the LCP barrier layer, the first ink layer, and each second ink layer, baking is required. The baking temperature is lower than the hot pressing temperature of the hot press, and the temperature of the laser engraving is also lower than the hot pressing temperature of the hot press. This reduces the fluidity of each LCP barrier layer in subsequent steps, making the thickness of the circuit more uniform, suppressing the impact on the circuit impedance, and thus suppressing the discontinuity of the impedance. In addition, since the LCP barrier layer, the first ink layer, and each second ink layer are attached to the corresponding parts by scraping the slurry, the scraping force is smaller than the pressing force of the hot press, which suppresses the drift of the LCP barrier layer, the first ink layer, and each second ink layer, that is, suppresses the drift of the circuit. In this way, the uniformity of the circuit thickness is improved, while suppressing the drift of the circuit, thereby improving the quality of the multi-layer LCP circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0041] Figure 11. A flowchart of a process for manufacturing a multilayer LCP circuit according to an embodiment of the present invention;

[0042] Figure 2 A schematic diagram of a partial structure of a circuit fabrication device according to an embodiment;

[0043] Figure 3 for Figure 2 Another partial structural diagram of the circuit production equipment shown;

[0044] Figure 4 for Figure 2 Another partial structural diagram of the circuit production equipment shown;

[0045] Figure 5 for Figure 2 Another partial structural diagram of the circuit production equipment shown;

[0046] Figure 6 for Figure 2 Another partial structural diagram of the circuit production equipment shown;

[0047] Figure 7 for Figure 2 Another partial structural diagram of the circuit production equipment shown;

[0048] Figure 8 for Figure 2 Another partial structural diagram of the circuit production equipment shown;

[0049] Figure 9 for Figure 2 Another partial structural diagram of the circuit production equipment shown;

[0050] Figure 10 for Figure 2 The multi-layer circuit semi-finished product manufactured by the circuit manufacturing equipment shown;

[0051] Figure 11 for Figure 2 Another partial structural diagram of the circuit production equipment shown;

[0052] Figure 12 for Figure 2 The multilayer LCP circuit is manufactured using the circuit manufacturing equipment shown. DETAILED DESCRIPTION

[0053] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0054] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0055] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0056] The present application provides a circuit fabrication device for fabricating multilayer LCP circuits. The circuit fabrication device includes a carrier coil, a reeling device, and a reeling device. The reeling device and the reeling device are respectively used to unwind and reel the carrier coil, with a fabrication area formed between the reeling device and the reeling device. Furthermore, the circuit fabrication device also includes a fabrication device, a die-cutting device, and a grouting device. The fabrication device, the die-cutting device, and the grouting device are all located within the fabrication area and are sequentially arranged along the transport direction of a carrier film carrying the carrier coil. The number of fabrication devices is at least three, and at least three fabrication devices are sequentially arranged along the transport direction of the carrier film. Each fabrication device includes an ink scraping mechanism, a laser engraving mechanism, a chemical plating mechanism, and a grease scraping mechanism, which are sequentially arranged along the transport direction of the carrier film.

[0057] The present application also provides a process for manufacturing a multilayer LCP circuit, which comprises at least the following steps:

[0058] Step S101: Rewinding the carrier coil into an unwinding device and a rewinding device respectively;

[0059] Step S103: coating LDS ink on the carrier film by a doctor blade mechanism to form a first ink layer on the carrier film;

[0060] Step S105: performing a laser engraving operation on the first ink layer by a laser engraving mechanism to form a first circuit groove on the first ink layer;

[0061] Step S107: performing a chemical plating operation on the first ink layer by a first chemical plating mechanism arranged along the conveying direction of the carrier film to form a first circuit layer in the first circuit groove;

[0062] Step S109: applying LCP slurry to the first ink layer and the first circuit layer by a first scraping device arranged along the conveying direction of the carrier film to form an LCP barrier layer on the first ink layer and the first circuit layer;

[0063] Step S111: coating LDS ink on the LCP barrier layer by a next doctor blade mechanism arranged along the conveying direction of the carrier film to form a second ink layer on the LCP barrier layer;

[0064] Step S113: performing a laser engraving operation on the second ink layer by a next laser engraving mechanism arranged along the conveying direction of the carrier film to form a second circuit groove on the second ink layer;

[0065] Step S115: performing a chemical plating operation on the second ink layer by a next chemical plating mechanism arranged along the conveying direction of the carrier film to form a second circuit layer in the second circuit groove;

[0066] Step S117: applying LCP slurry to the second ink layer and the second circuit layer through a next scraping mechanism arranged along the conveying direction of the carrier film to form an LCP barrier layer on the second ink layer and the second circuit layer;

[0067] Step S119: Repeat steps S111 to S117 at least once to form a multi-layer circuit tape;

[0068] Step S121: die-cutting the multi-layer circuit tape by a die-cutting device to form a multi-layer circuit semi-finished product with conductive holes;

[0069] Step S123: filling the via holes with silver paste using a slurry filling device to form conductive members in the via holes. The conductive members are electrically connected to the first circuit layer and each second circuit layer, thereby forming a multi-layer LCP circuit.

[0070] The above-mentioned circuit production equipment and the production process of multi-layer LCP circuits obtain the LCP barrier layer, the first ink layer and each second ink layer by scraping. When curing the LCP barrier layer, the first ink layer and each second ink layer, baking is required. The baking temperature is lower than the hot pressing temperature of the hot press, and the temperature of the laser engraving is also lower than the hot pressing temperature of the hot press, which reduces the fluidity of each LCP barrier layer in the subsequent steps, making the thickness of the circuit more uniform, suppressing the impact on the circuit impedance, and thus suppressing the discontinuity of the impedance. In addition, since the LCP barrier layer, the first ink layer and each second ink layer are attached to the corresponding parts by scraping the slurry, the scraping force is smaller than the pressing force of the hot press, which suppresses the drift of the LCP barrier layer, the first ink layer and each second ink layer, that is, suppresses the drift of the circuit. In this way, the uniformity of the circuit thickness is improved, while suppressing the drift of the circuit, thereby improving the quality of the multi-layer LCP circuit.

[0071] To better understand the technical solutions and beneficial effects of the present application, the present application is further described in detail below with reference to specific embodiments:

[0072] like Figure 2 As shown, a circuit production device of an embodiment includes a carrier roll 100, a reeling device 200 and a reeling device 300. The reeling device 200 and the reeling device 300 are respectively used to unwind and reel the carrier roll 100, that is, the carrier roll 100 is sleeved on the unwinding roller of the unwinding device 200, and one end of the carrier film 110 of the carrier roll 100 is pulled onto the reeling device 300 so that one end of the carrier film 110 is wound on the reeling roller of the reeling device 300, so that the unwinding roller is used to unwind the unmade carrier film 110, and the reeling roller is used to reel in the waste carrier film 110. Arrow A is the moving direction of the carrier film 110.

[0073] like Figures 2 to 11 As shown, a production area is formed between the unwinding device 200 and the rewinding device 300. The circuit production equipment also includes a production device 400, a die-cutting device 500, and a grouting device 600. The production device 400, die-cutting device 500, and grouting device 600 are all located in the production area and are arranged sequentially along the transport direction of the carrier film 110 that supports the web 100. There are at least three production devices 400, and at least three production devices 400 are arranged sequentially along the transport direction of the carrier film 110. In this embodiment, the direction indicated by arrow A is the direction of travel of the carrier film 110. Each production device 400 is used to sequentially form an ink layer 120, a circuit layer 130, and an LCP barrier layer 140 on the carrier film 110. The ink layer 120, circuit layer 130, and LCP barrier layer 140 are stacked sequentially in a direction away from the carrier film 110 to form a composite layer. At least three fabrication devices 400 are sequentially arranged along the transport direction of the carrier film 110 , so that multiple composite layers are sequentially stacked on the carrier film 110 to form a multi-layer circuit tape.

[0074] like Figures 2 to 5 As shown, further, each manufacturing device 400 includes an ink scraping mechanism 410, a laser engraving mechanism 420, a chemical plating mechanism 430 and a grease scraping mechanism 440 which are sequentially arranged along the transport direction of the carrier film 110. Figure 2 As shown, the scraping mechanism 410 of the first manufacturing device 400 in the conveying direction of the carrier film 110 is used to scrape the LDS ink onto the carrier film 110 to form a first ink layer 120; Figure 3As shown, the laser engraving mechanism 420 of the first production device 400 in the conveying direction of the carrier film 110 is used to perform an engraving operation on the first ink layer 120 to form a first circuit groove 121 on the first ink layer 120; Figure 4 and Figure 5 As shown, the chemical plating mechanism 430 of the first manufacturing device 400 in the conveying direction of the carrier film 110 is used to perform chemical plating operation on the first ink layer 120 to form the first circuit layer 130 in the first circuit groove 121. Figure 5 As shown, the scraping mechanism 440 of the first manufacturing device 400 in the conveying direction of the carrier film 110 is used to scrape the LCP slurry onto the first ink layer 120 and the first circuit layer 130 to form the LCP barrier layer 140 on the first ink layer 120 and the first circuit layer 130;

[0075] like Figure 6 As shown, further, the scraping mechanism 410 of the second manufacturing device 400 in the conveying direction of the carrier film 110 is used to scrape the LDS ink onto the LCP barrier layer 140 to form the second ink layer 120; Figure 7 As shown, the laser engraving mechanism 420 of the second manufacturing device 400 in the conveying direction of the carrier film 110 is used to perform a laser engraving operation on the second ink layer 120 to form a second circuit groove 121 on the second ink layer 120; the chemical plating mechanism 430 of the second manufacturing device 400 in the conveying direction of the carrier film 110 is used to perform a chemical plating operation on the second ink layer 120 to form a second circuit layer 130 in the second circuit groove 121; Figure 8 As shown, the scraping mechanism 440 of the second production device 400 in the conveying direction of the carrier film 110 is used to scrape the LCP slurry onto the second ink layer 120 and the second circuit layer 130 to form an LCP barrier layer 140 on the second ink layer 120 and the second circuit layer 130; the remaining production devices 400 in the conveying direction of the carrier film 110 repeat the above-mentioned production in sequence to form a multi-layer circuit tape on the carrier film 110.

[0076] The aforementioned circuit fabrication equipment forms the LCP barrier layer 140, the first ink layer 120, and each second ink layer 120 by doctor blade coating. After curing, the LCP barrier layer 140, the first ink layer 120, and each second ink layer 120 require baking. This baking temperature is lower than the hot pressing temperature of the hot press, and the laser engraving temperature is also lower than the hot pressing temperature of the hot press. This reduces the fluidity of each LCP barrier layer 140 in subsequent steps, resulting in more uniform circuit thickness and suppressing the impact on circuit impedance, thereby reducing impedance discontinuity. Furthermore, because the LCP barrier layer 140, the first ink layer 120, and each second ink layer 120 are all attached to the corresponding locations by doctor blade coating, the doctor blade application force is smaller than the pressing force of the hot press, which suppresses the drift of the LCP barrier layer 140, the first ink layer 120, and each second ink layer 120, and thus the drift of the circuit. This improves the uniformity of circuit thickness and suppresses circuit drift, thereby improving the quality of the multilayer LCP circuit.

[0077] In one embodiment, the manufacturing process of the multilayer LCP circuit includes at least the following steps:

[0078] Step S101: Figure 2 As shown, the carrier roll 100 is respectively reeled in the unwinding device 200 and the rewinding device 300 .

[0079] like Figure 2 As shown, in this embodiment, the carrier web 100 is first sleeved onto the unwinding roller of the unwinding device 200. Then, one end of the carrier web 100 is pulled to the rewinding device 300 and wound onto the rewinding roller of the rewinding device 300. In this way, the unwinding device 200 and the rewinding device 300 release and rewind the carrier film 110 in a production area formed between the unwinding device 200 and the rewinding device 300, respectively. That is, the unwinding device 200 releases unfinished carrier film 110, while the rewinding device 300 rewinds the waste carrier film 110 that has been die-cut. The direction indicated by arrow A is the direction of movement of the carrier film 110.

[0080] Step S103: Figure 2 As shown, LDS ink is coated on the carrier film 110 by a first scraper mechanism 410 arranged along the conveying direction of the carrier film 110 to form a first ink layer 120 on the carrier film 110 .

[0081] like Figure 2As shown, in this embodiment, the LDS material is a modified plastic containing an organometallic complex. Laser irradiation releases particles from the organometallic complex. LDS ink is applied to the carrier film 110 by a doctor blade mechanism 410 of a first fabrication device 400 positioned along the conveying direction of the carrier film 110. Specifically, the doctor blade mechanism 410 applies the LDS ink to the carrier film 110. As the unwinding device 200 and the rewinding device 300 rotate, i.e., as the carrier film 110 moves, the doctor blade mechanism 410 uniformly spreads the LDS ink onto the carrier film 110, forming a first ink layer 120 on the carrier film 110. The first ink layer 120 is then cured by baking. The cured first ink layer 120 releases particles upon laser irradiation, resulting in a groove structure formed in the first ink layer 120 after irradiation. In one embodiment, the baking temperature for the first ink layer 120 is between 40°C and 60°C. Furthermore, the baking temperature for the first ink layer 120 is 50°C.

[0082] Step S105: Figure 3 As shown, a laser engraving mechanism 420 of a first manufacturing device 400 arranged along the conveying direction of the carrier film 110 performs a laser engraving operation on the first ink layer 120 to form a first circuit groove 121 on the first ink layer 120 .

[0083] like Figure 3 As shown, in this embodiment, both the unwinding device 200 and the rewinding device 300 stop rotating, halting the carrier film 110 and allowing the corresponding laser engraving mechanism 420 to laser engrave the first ink layer 120. The unwinding device 200 and the rewinding device 300 continue rotating after laser engraving is complete. Because the first ink layer 120 is coated with LDS ink, laser engraving forms first circuit grooves 121. The rough walls of the first circuit grooves 121 facilitate metal ion adhesion, thereby ensuring proper electroless plating.

[0084] Step S107: Figure 4 and Figure 5 As shown, the first ink layer 120 is chemically plated by the chemical plating mechanism 430 of the first manufacturing device 400 arranged along the conveying direction of the carrier film 110 to form the first circuit layer 130 in the first circuit groove 121.

[0085] like Figure 4 and Figure 5As shown, in this embodiment, gold, copper, or an existing conductive material is plated by the chemical plating mechanism 430 of the first fabrication device 400, which is arranged along the conveying direction of the carrier film 110. The unwinding device 200 and the rewinding device 300 rotate in coordination, so that the carrier film 110 having the first wiring groove 121 is moved into the corresponding chemical plating mechanism 430. Then, the unwinding device 200 and the rewinding device 300 stop rotating, allowing the first wiring groove 121 to be fully chemically plated in the corresponding chemical plating mechanism 430. After the first wiring layer 130 is formed in the first wiring groove 121, the unwinding device 200 and the rewinding device 300 continue to rotate to move the carrier film 110 processed in this step into the next step.

[0086] Step S109: Figure 5 As shown, the LCP slurry is applied to the first ink layer 120 and the first circuit layer 130 by a first scraping mechanism 440 arranged along the conveying direction of the carrier film 110 to form an LCP barrier layer 140 on the first ink layer 120 and the first circuit layer 130 .

[0087] like Figure 5 As shown, in this embodiment, the unwinding device 200 and the rewinding device 300 both rotate, and the corresponding scraping mechanism 440 applies LCP slurry to the first ink layer 120 and the first circuit layer 130. As the unwinding device 200 and the rewinding device 300 rotate, the corresponding scraping mechanism 440 evenly scrapes the LCP slurry onto the first ink layer 120 and the first circuit layer 130, thereby forming an LCP barrier layer 140 on the first ink layer 120 and the first circuit layer 130. The LCP barrier layer 140 is then baked to solidify the LCP barrier layer 140. The LCP barrier layer 140 is used to protect the first circuit layer 130 from contact with foreign matter. In this embodiment, the LCP barrier layer 140 also serves as a carrier layer for the next ink layer 120 to be formed. In one embodiment, the temperature for baking the LCP barrier layer 130 is between 40°C and 60°C. Furthermore, the temperature for baking the LCP barrier layer 130 is 50°C.

[0088] Step S111: Figure 6 As shown, the LDS ink is coated on the LCP barrier layer 140 by a next doctor blade mechanism 410 arranged along the conveying direction of the carrier film 110 to form a second ink layer 120 on the LCP barrier layer 140 .

[0089] like Figure 6As shown, in this embodiment, the corresponding scraping mechanism 410 applies the LDS ink to the LCP barrier layer 140. As the unwinding device 200 and the rewinding device 300 rotate, the corresponding scraping mechanism 410 evenly scrapes the LDS ink onto the LCP barrier layer 140 to form a second ink layer 120 on the LCP barrier layer 140. In one embodiment, the temperature for baking the second ink layer 120 is 40° C. to 60° C. Further, the temperature for baking the second ink layer 120 is 50° C.

[0090] Step S113: Figure 7 As shown, the second ink layer 120 is laser engraved by a next laser engraving mechanism 420 arranged along the conveying direction of the carrier film 110 to form a second circuit groove 121 on the second ink layer 120 .

[0091] like Figure 7 As shown, in this embodiment, both the unwinding device 200 and the rewinding device 300 stop rotating, halting the movement of the carrier film 110. The corresponding laser engraving mechanism 420 then laser engraves the second ink layer 120, forming second circuit grooves 121 therein. After laser engraving is complete, both the unwinding device 200 and the rewinding device 300 continue rotating. Because the first ink layer 120 is coated with LDS ink, laser engraving forms first circuit grooves 121. The rough walls of the first circuit grooves 121 facilitate metal ion adhesion, thereby ensuring proper electroless plating.

[0092] Step S115: Figure 8 As shown, the second ink layer 120 is subjected to a chemical plating operation by a next chemical plating mechanism 430 arranged along the conveying direction of the carrier film 110 to form a second circuit layer 130 in the second circuit groove 121 .

[0093] like Figure 8 As shown, in this embodiment, gold, copper, or an existing conductive material is plated by the chemical plating mechanism 430 of the next production device 400, which is arranged along the conveying direction of the carrier film 110. The unwinding device 200 and the rewinding device 300 rotate in coordination, so that the carrier film 110 having the second wiring groove 121 is moved into the corresponding chemical plating mechanism 430. Then, the unwinding device 200 and the rewinding device 300 stop rotating, allowing the second wiring groove 121 to be fully chemically plated in the corresponding chemical plating mechanism 430. After the second wiring layer 130 is formed in the second wiring groove 121, the unwinding device 200 and the rewinding device 300 continue to rotate to move the carrier film 110 processed in this step into the next step.

[0094] Step S117: Figure 8As shown, the LCP slurry is applied to the second ink layer 120 and the second circuit layer 130 by a next scraping mechanism 440 disposed along the conveying direction of the carrier film 110, thereby forming an LCP barrier layer 140 on the second ink layer 120 and the second circuit layer 130. In one embodiment, the temperature for baking the LCP barrier layer 130 is 40°C to 60°C. Furthermore, the temperature for baking the LCP barrier layer 130 is 50°C.

[0095] like Figure 8 As shown, in this embodiment, the unwinding device 200 and the rewinding device 300 both rotate, and the corresponding scraping mechanism 440 applies LCP slurry to the first ink layer 120 and the first circuit layer 130. As the unwinding device 200 and the rewinding device 300 rotate, the corresponding scraping mechanism 440 evenly scrapes the LCP slurry onto the second ink layer 120 and the second circuit layer 130, thereby forming an LCP barrier layer 140 on the second ink layer 120 and the second circuit layer 130. The LCP barrier layer 140 is used to prevent the second circuit layer 130 from contacting foreign matter. At the same time, the LCP barrier layer 140 of this embodiment also serves as a carrier layer for the next ink layer 120 to be formed.

[0096] Step S119: Repeat steps S113 to S119 at least once to form a multi-layer circuit tape.

[0097] like Figure 9 As shown, in this embodiment, each fabrication device 400 is used to sequentially form an ink layer 120, a circuit layer 130, and an LCP barrier layer 140 on a carrier film 110. The ink layer 120, circuit layer 130, and LCP barrier layer 140 are stacked in a direction away from the carrier film 110 to form a composite layer. At least three fabrication devices 400 are sequentially arranged along the transport direction of the carrier film 110, so that multiple composite layers are sequentially stacked on the carrier film 110, thereby forming a multi-layer circuit tape.

[0098] Step S121: Figure 9 As shown, the multi-layer circuit tape is die-cut by the die-cutting device 500 to form a multi-layer circuit semi-finished product 700 having a via hole 701 .

[0099] like Figure 9 and Figure 10As shown, in this embodiment, both the unwinding device 200 and the rewinding device 300 have stopped moving. The die-cutting device 500 includes a profile die-cutting mechanism and a punching mechanism. The punching mechanism is located within the profile die-cutting mechanism. The die-cutting device 500 performs a die-cutting operation on the multi-layer circuit tape, causing the profile die-cutting mechanism to die-cut a predetermined profile into the multi-layer circuit tape, and the punching mechanism to punch a via hole 701 into the multi-layer circuit tape. Consequently, the die-cutting device 500 punches out a multi-layer circuit semi-finished product 700 having the via hole 701. After die-cutting is completed, the unwinding device 200 and the rewinding device 300 continue to rotate.

[0100] Step S123: Figure 11 and Figure 12 As shown, the via hole 701 is filled with silver paste by the slurry filling device 600 to form a conductive member in the via hole 701. The conductive member is electrically connected to the first circuit layer 130 and each second circuit layer 130, thereby forming a multi-layer LCP circuit 800.

[0101] like Figure 11 and Figure 12 As shown, in this embodiment, as the unwinding device 200 and the rewinding device 300 rotate, the carrier film 110 drives the multi-layer circuit semi-finished product 700 into the slurry filling device 600. The slurry filling device 600 applies silver paste to the upper surface of the first multi-layer circuit semi-finished product 700. As the unwinding device 200 and the rewinding device 300 rotate, the slurry filling device 600 scrapes the silver paste into the conductive holes 701. The silver paste in the conductive holes 701 is then baked to solidify the silver paste and form conductive components. The conductive components are respectively electrically connected to the first circuit layer and each of the second circuit layers, thereby forming a multi-layer LCP circuit.

[0102] It should be noted that, since the circuit structure is relatively long, the drawings of the present invention only show a section of the circuit structure.

[0103] In the aforementioned multilayer LCP circuit fabrication process, the LCP barrier layer 140, the first ink layer 120, and each second ink layer 120 are obtained by doctor blade coating. After curing the LCP barrier layer 140, the first ink layer 120, and each second ink layer 120, a baking process is required. This baking temperature is lower than the hot pressing temperature of the hot press, and the laser engraving temperature is also lower than the hot pressing temperature of the hot press. This reduces the fluidity of each LCP barrier layer 140 in subsequent steps, making the circuit thickness more uniform, suppressing the impact on the circuit impedance, and thus suppressing impedance discontinuity. Furthermore, because the LCP barrier layer 140, the first ink layer 120, and each second ink layer 120 are all attached to the corresponding locations by doctor blade coating, the doctor blade coating force is smaller than the pressing force of the hot press, which suppresses the drift of the LCP barrier layer 140, the first ink layer 120, and each second ink layer 120, and thus suppresses circuit drift. In this way, the uniformity of the circuit thickness is improved, while the drift of the circuit is suppressed, thereby improving the quality of the multi-layer LCP circuit.

[0104] like Figure 3 As shown, in one embodiment, the chemical plating mechanism 430 of each production device 400 includes a chemical solution pool 431 and a pressure roller 432. The pressure roller 432 of the chemical plating mechanism 430 of each production device 400 is rotatably set in the corresponding chemical solution pool 431, and the carrier film 110 is wound around the pressure roller 432 of the chemical plating mechanism 430 of each production device 400, so that the carrier film 110 enters the chemical solution pool 431 of each production device 400 for chemical plating.

[0105] In one embodiment, each potion pool 431 contains a copper ion solution or a gold ion solution, so that copper or gold is deposited in the first circuit groove 121 or the second circuit groove 121, thereby forming the first circuit layer 130 or the second circuit layer 130. In one embodiment, each potion pool 431 also contains a palladium catalyst.

[0106] In one embodiment, each scraping mechanism 410 includes a scraping assembly and an ink baking and curing assembly. Each scraping assembly and the corresponding ink baking and curing assembly are arranged in sequence along the conveying direction of the carrier film 110. Each scraping assembly is used to scrape the LDS ink onto the carrier film 110 or the corresponding LCP barrier layer 140, and each ink baking and curing assembly is used to cure the corresponding first ink layer 120 or the corresponding second ink layer 120.

[0107] In one embodiment, step S103 includes: scraping LDS ink on the carrier film 110 through an ink scraping component to form a first ink viscosity layer on the carrier film 110; baking the first ink viscosity layer through a corresponding ink baking and curing component to cure the first ink viscosity layer to form a first ink layer 120.

[0108] In one embodiment, step S113 includes: applying LDS ink on the LCP barrier layer 140 by another ink scraping assembly to form a second ink viscosity layer on the resin layer; and baking the second ink viscosity layer by a corresponding ink baking and curing assembly to cure the second ink viscosity layer to form a second ink layer 120.

[0109] In one embodiment, the chemical plating mechanism 430 includes a silver paste scraping assembly and a silver paste baking and curing assembly, which are sequentially arranged along the conveying direction of the carrier film 110. Furthermore, step S125 includes: scraping silver paste into the conductive hole 701 using the silver paste scraping assembly; and baking the silver paste in the conductive hole 701 using the silver paste baking and curing assembly to solidify the silver paste in the conductive hole 701 to form a conductive member, thereby interconnecting the multiple layers of circuits.

[0110] In one embodiment, in step S123 , there are multiple vias 701 .

[0111] In one embodiment, the carrier film 110 is a PPS film, so that the carrier film 110 has a higher load-bearing performance.

[0112] In one embodiment, the temperature for baking the silver paste is 40° C. to 60° C. Further, the temperature for baking the silver paste is 50° C.

[0113] Compared with the prior art, the present invention has at least the following advantages:

[0114] The LCP barrier layer 140, first ink layer 120, and each second ink layer 120 are applied by doctor blading. After curing, the LCP barrier layer 140, first ink layer 120, and each second ink layer 120 require baking. This baking temperature is lower than the hot press temperature, and the laser engraving temperature is also lower than the hot press temperature. This reduces the fluidity of each LCP barrier layer 140 in subsequent steps, resulting in more uniform circuit thickness and minimizing the impact on circuit impedance, thereby suppressing impedance discontinuity. Furthermore, since the LCP barrier layer 140, first ink layer 120, and each second ink layer 120 are all attached to the corresponding locations by doctor blading, the doctor blading force is smaller than the pressing force of the hot press, which prevents drift of the LCP barrier layer 140, first ink layer 120, and each second ink layer 120, and thus circuit drift. This improves circuit thickness uniformity and minimizes circuit drift, thereby improving the quality of multilayer LCP circuits.

[0115] The above-described embodiments merely illustrate several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A process for manufacturing a multilayer LCP circuit, characterized in that: The multilayer LCP circuit is produced by a circuit production device, wherein the circuit production device includes a carrier coil, a reeling device, and a reeling device, wherein the reeling device and the reeling device are used to respectively unwind and reel the carrier coil, and a production area is formed between the reeling device and the reeling device; The circuit production equipment further includes a production device, a die-cutting device, and a grouting device, wherein the production device, the die-cutting device, and the grouting device are all located in the production area and are sequentially arranged along the conveying direction of the carrier film carrying the coiled material; the number of the production devices is at least three, and at least three of the production devices are sequentially arranged along the conveying direction of the carrier film, and each production device includes an ink scraping mechanism, a laser engraving mechanism, a chemical plating mechanism, and a grease scraping mechanism sequentially arranged along the conveying direction of the carrier film; The manufacturing process of the multilayer LCP circuit includes at least the following steps: Step S101: Rewinding the carrier coil into the unwinding device and the rewinding device respectively; Step S103: applying LDS ink on the carrier film by the doctor blade mechanism to form a first ink layer on the carrier film; Step S105: performing a laser engraving operation on the first ink layer by using the laser engraving mechanism to form a first circuit groove on the first ink layer; Step S107: performing a chemical plating operation on the first ink layer by a first chemical plating mechanism arranged along the conveying direction of the carrier film to form a first circuit layer in the first circuit groove; Step S109: applying LCP slurry to the first ink layer and the first circuit layer by a first scraping mechanism arranged along the conveying direction of the carrier film, so as to form an LCP barrier layer on the first ink layer and the first circuit layer; Step S111: coating LDS ink on the LCP barrier layer by a next doctor blade mechanism arranged along the conveying direction of the carrier film, so as to form a second ink layer on the LCP barrier layer; Step S113: performing a laser engraving operation on the second ink layer by a next laser engraving mechanism arranged along the conveying direction of the carrier film to form a second circuit groove on the second ink layer; Step S115: performing a chemical plating operation on the second ink layer by a next chemical plating mechanism arranged along the conveying direction of the carrier film, so as to form a second circuit layer in the second circuit groove; Step S117: applying LCP slurry to the second ink layer and the second circuit layer through a next scraping mechanism arranged along the conveying direction of the carrier film to form an LCP barrier layer on the second ink layer and the second circuit layer; Step S119: Repeat steps S111 to S117 at least once to form a multi-layer circuit tape; Step S121: die-cutting the multi-layer circuit tape by the die-cutting device to form a multi-layer circuit semi-finished product with conductive holes; Step S123: filling the via holes with silver paste using the slurry filling device to form conductive components in the via holes. The conductive components are electrically connected to the first circuit layer and each of the second circuit layers, thereby forming a multi-layer LCP circuit.

2. The process for manufacturing a multilayer LCP circuit according to claim 1, wherein: The chemical plating mechanism of each of the above-mentioned production devices includes a chemical solution pool and a pressure roller. The pressure roller of the chemical plating mechanism of each of the above-mentioned production devices is rotatably set in the corresponding chemical solution pool. The above-mentioned carrier film is wrapped around the pressure roller of the chemical plating mechanism of each of the above-mentioned production devices so that the above-mentioned carrier film enters the chemical solution pool of each of the above-mentioned production devices for chemical plating.

3. The process for manufacturing a multilayer LCP circuit according to claim 2, wherein: Each of the medicine pools is filled with copper ion solution or gold ion solution.

4. The process for manufacturing a multilayer LCP circuit according to claim 3, wherein: Each of the medicine pools is also filled with a palladium catalyst.

5. The process for manufacturing a multi-layer LCP circuit according to claim 1, wherein: Each of the scraping mechanisms includes a scraping assembly and an ink baking and curing assembly. Each of the scraping assemblies and the corresponding ink baking and curing assembly are arranged in sequence along the conveying direction of the carrier film. Each of the scraping assemblies is used to scrape the LDS ink onto the carrier film or the corresponding LCP barrier layer, and each of the ink baking and curing assemblies is used to cure the corresponding first ink layer or the corresponding second ink layer.

6. The process for manufacturing a multilayer LCP circuit according to claim 5, characterized in that: The step S103 includes: scraping LDS ink on the carrier film by a scraping assembly to form a first ink viscosity layer on the carrier film; The first ink viscous layer is baked by the corresponding ink baking and curing component, so that the first ink viscous layer is cured to form a first ink layer.

7. The process for manufacturing a multi-layer LCP circuit according to claim 5, characterized in that: The step S113 includes: Squeeze LDS ink onto the LCP barrier layer using another scraping assembly to form a second ink viscosity layer on the resin layer; The second ink viscosity layer is baked by the corresponding ink baking and curing component, so that the second ink viscosity layer is cured to form a second ink layer.

8. The process for manufacturing a multi-layer LCP circuit according to claim 1, wherein: The chemical plating mechanism includes a silver paste scraping assembly and a silver paste baking and curing assembly, and the silver paste scraping assembly and the silver paste baking and curing assembly are sequentially arranged along the conveying direction of the carrier film; The step S123 includes: Scrape the silver paste into the conducting hole by the silver paste scraping assembly; The silver paste in the via hole is baked by the silver paste baking and curing assembly, so that the silver paste in the via hole is solidified to form a conductive member.

9. The process for manufacturing a multi-layer LCP circuit according to claim 1, wherein: In the step S123 , the number of the vias is multiple.

10. The process for manufacturing a multi-layer LCP circuit according to claim 1, wherein: The carrier film is a PPS film.

Images