Method and system for testing thermal conductivity of thermal interface material, electronic device
By using a simplified test structure and method, the thermal conductivity of the thermal interface material is obtained using a first thermal test chip and a second thermal test chip, which solves the problems of cumbersome testing and high cost in the existing technology and achieves more efficient and accurate thermal conductivity testing.
CN116087268BActive Publication Date: 2026-06-23SUZHOU RONGQI SENSOR TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SUZHOU RONGQI SENSOR TECH CO LTD
- Filing Date
- 2023-01-19
- Publication Date
- 2026-06-23
Smart Images
Figure CN116087268B_ABST
Abstract
The application discloses a kind of thermal conductivity testing method and testing system of thermal interface material, electronic equipment, it is related to thermal conductivity testing field, for simplifying the testing process of the thermal conductivity of to-be-tested thermal interface material, improve test efficiency.The thermal conductivity testing method of thermal interface material includes: providing pre-prepared device with test structure.Test structure includes first thermal test chip, second thermal test chip and to-be-tested thermal interface material between first thermal test chip and second thermal test chip.To-be-tested thermal interface material is attached with first thermal test chip and second thermal test chip respectively.Heat first thermal test chip, obtain test correlation parameter.According to test correlation parameter, and the specification parameter and thermal conductivity parameter of test structure, the thermal conductivity of to-be-tested thermal interface material is determined.
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