A planar link structure chip clamping device

The chip clamping device, which combines a planar linkage structure and a spring, solves the problem of line contact damage when tweezers hold chips, achieving stable and reliable surface contact and adjustable clamping force to adapt to different component sizes.

CN116093008BActive Publication Date: 2025-12-23SOUTH WEST INST OF TECHN PHYSICS
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Patent Information

Application Number
CN202211484790.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-11-24
Publication Date
2025-12-23
Estimated Expiration
2042-11-24

AI Technical Summary

Technical Problem

Existing tweezers often cause damage to chips due to their wire contact method, and the clamping force is greatly affected by the user's skill level, making it difficult to control stably.

Method used

The chip clamping device adopts a planar linkage structure, which uses a combination of parallelogram linkage structure and spring to achieve parallel surface contact of the clamping head. The clamping force is controlled by adjusting screws, and the clamping head is opened and closed by button operation.

Benefits of technology

It achieves stable surface contact, reduces the risk of chip damage, the clamping force is affected by the spring tension, adapts to different component sizes, the clamping force is adjustable, and the structure is compact and reliable.

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Abstract

The invention provides a kind of plane link structure chip clamping device, including device shell, replaceable clamping head, plane link structure, button, spring and adjusting screw.The device uses the plane link structure of parallelogram, can make the clamping part of clamping head always be in parallel posture, the contact area when contacting component is surface contact, can reduce contact pressure;The clamping force of component is only affected by the tension degree of spring, and the clamping force is stable, and the chip will not be damaged due to the poor proficiency of user;By adjusting screw, the tension degree of spring can be changed, and the clamping force of clamping head can be changed;Different structures of clamping head can be replaced according to different component sizes, and the device has the characteristics of compact structure, reliability, strong component specification adaptability and the like.
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Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor devices, and particularly relates to a chip clamping device with a planar linkage structure. BACKGROUND

[0002] In the process of semiconductor chip manufacturing and packaging, clamping and transferring of various components are always involved. The commonly used clamping and transferring methods include tweezers clamping and vacuum adsorption. Among them, tweezers clamping is the most common form adopted by technicians due to its simplicity and convenience. However, when clamping components, especially fragile chips, the tweezers often make line contact with the side of the components, rather than parallel contact, as shown in FIG. 1, and since the clamping force is controlled by humans, it is greatly affected by the proficiency of the personnel, so the components are often damaged. Figure 1 SUMMARY

[0003] (I) Technical problem to be solved

[0004] The present application proposes a chip clamping device with a planar linkage structure to solve the technical problem of changing the line contact mode of the existing tweezers clamping and avoiding damage to components.

[0005] (II) Technical solution

[0006] In order to solve the above technical problems, the present application proposes a chip clamping device with a planar linkage structure, which comprises a device housing, a clamping head, a planar linkage structure, a button, a spring and an adjusting screw. The clamping head with parallel clamping parts is arranged at the front end of the device housing, a plurality of planar linkage structures are fixed on the inner wall of the front end of the device housing, the rear end of the clamping head is connected with the front end vertex of the planar linkage structure, and the planar linkage structure keeps the two clamping parts of the clamping head in a parallel state. The adjusting screw is fixed at the rear end of the device housing, the spring is arranged inside the device housing, the front and rear ends of the spring are connected with the planar linkage structure and the adjusting screw through a pull rod, so that the spring is always in a tension state and provides clamping force for the clamping head through the planar linkage structure. The button is installed on the side wall of the device housing, the front end of the button extends into the interior of the device housing, and the button can press and tension the pull rod connected between the spring and the planar linkage structure. When the button is pressed, the pull rod pushes the planar linkage structure forward, so that the planar linkage structure deforms and compresses, driving the two clamping parts of the clamping head to open, and the reset force of the button upward is increased by the tension force of the spring. When the button is released, the button is automatically lifted upward and reset under the action of the spring, the tensioned spring pulls the planar linkage structure backward, driving the two clamping parts of the clamping head to close, and clamping the components.

[0007] ​Further, the planar linkage structure is a parallelogram, the planar linkage structure is fixed on the inner wall of the front end of the device shell through the side, and the front end of the spring is connected with the bottom side of the planar linkage structure through the pull rod.

[0008] (III) Beneficial Effects

[0009] The planar linkage structure chip clamping device provided by the application comprises a device shell, a replaceable clamping head, a planar linkage structure, a button, a spring and an adjusting screw. The device adopts the planar linkage structure of a parallelogram, so that the clamping part of the clamping head is always in a parallel posture, the contact area when contacting the component is surface contact, and the contact pressure can be reduced. The clamping force of the component is only affected by the tension degree of the spring, the clamping force is stable, and the chip will not be damaged due to poor proficiency of the user. The tension degree of the spring can be changed through the adjusting screw, so that the clamping force of the clamping head can be changed. Different clamping heads with different structures can be replaced according to the sizes of different components, and the device has the characteristics of compact structure, reliability, strong component specification adaptability and the like. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 A schematic view of the existing tweezers clamping component mode is shown in the figure.

[0011] Figure 2 A schematic view of the chip clamping device structure of the embodiment of the application is shown in the figure.

[0012] Figure 3 A schematic view of the clamping head parallel clamping component mode in the embodiment of the application is shown in the figure.

[0013] Figure 4 A schematic view of the clamping head open state structure in the embodiment of the application is shown in the figure.

[0014] Figure 5 A schematic view of the structure of the large-size clamping head used in the embodiment of the application is shown in the figure. DETAILED DESCRIPTION

[0015] In order to make the purpose, content and advantages of the application more clear, the specific implementation of the application will be further described in combination with the drawings and embodiments.

[0016] The embodiment of the application provides a planar linkage structure chip clamping device, and the structure is shown in the figure. Figure 2 The whole device appearance and size are similar to those of an ordinary ball pen, and mainly comprise a device shell 5, a replaceable clamping head 2, a planar linkage structure 3, a button 4, a spring 6 and an adjusting screw 7.

[0017] The clamping head 2 with parallel clamping parts is arranged at the front end of the device housing 5, a plurality of parallelogram plane link structures 3 are fixed on the inner wall of the front end of the device housing 5 through the side, the rear end of the clamping head 2 is connected with the front end vertex of the plane link structure 3, and the parallelogram plane link structure 3 can keep the two clamping parts of the clamping head 2 in parallel state at all times, as shown in Figure 3 .

[0018] The adjusting screw 7 is fixed at the rear end of the device housing 5, the spring 6 is arranged in the interior of the device housing 5, the front and rear ends of the spring 6 are connected with the bottom edge of the plane link structure 3 and the adjusting screw 7 through the pull rod respectively, so that the spring 6 is always in tension state, and the plane link structure 3 provides clamping force for the clamping head 2. By changing the length of the adjusting screw 7 in the interior of the device housing 5, the tension degree of the spring 6 can be changed, and then the clamping force of the clamping head 2 is changed.

[0019] The button 4 is installed on the side wall of the device housing 5, the front end of the button 4 extends into the interior of the device housing 5, and the button 4 can press and tension the pull rod connected between the spring 6 and the plane link structure 3. As shown in Figure 4 , when the button 4 is pressed, the pull rod pushes the plane link structure 3 forward, so that the plane link structure 3 is deformed and compressed, and then drives the two clamping parts of the clamping head 2 to open, at this time, the reset force of the button 4 upward is increased by the tension force of the spring 6. When the button 4 is released, the button 4 is automatically lifted upward and reset under the action of the spring 6, the spring 6 in tension pulls the plane link structure 3 backward, and then drives the two clamping parts of the clamping head 2 to close tightly, so that the clamping of the component 1 is realized.

[0020] Since the opening and closing range of the plane link structure 3 is limited, according to the size of the clamped component, the chip clamping device of the application can replace the corresponding specification of the clamping head 2, as shown in Figure 5 .

[0021] The above only describes the preferred embodiments of the application, and it should be pointed out that for ordinary skilled in the art, without departing from the technical principles of the application, a number of improvements and modifications can be made, and these improvements and modifications should be considered as the protection scope of the application.

Claims

1. A planar linkage structure chip clamping device, characterized in that, The chip clamping device comprises a device housing, a clamping head, a planar linkage structure, a button, a spring and an adjusting screw; wherein the clamping head with parallel clamping parts is arranged at the front end of the device housing, a plurality of planar linkage structures are fixed on the inner wall of the front end of the device housing, the rear end of the clamping head is connected with the front end vertex of the planar linkage structure, the planar linkage structure keeps the two clamping parts of the clamping head in parallel state; the adjusting screw is fixed at the rear end of the device housing, the spring is arranged inside the device housing, the front and rear ends of the spring are connected with the planar linkage structure and the adjusting screw through a pull rod, so that the spring is always in tension state and provides clamping force for the clamping head through the planar linkage structure; the button is installed on the side wall of the device housing, the front end of the button extends into the interior of the device housing, and the button can press down and tension the pull rod connected between the spring and the planar linkage structure; when the button is pressed down, the pull rod pushes the planar linkage structure forward, so that the planar linkage structure is deformed and compressed, and the two clamping parts of the clamping head are opened, the reset force of the button upward is increased by the tension force of the spring; when the button is released, the button is automatically lifted upward and reset under the action of the spring, the planar linkage structure is pulled backward by the tensioned spring, the two clamping parts of the clamping head are closed, and the clamping of the components is realized.

2. The chip clamping device according to claim 1, wherein The planar linkage structure is a parallelogram, the planar linkage structure is fixed on the inner wall of the front end of the device housing through the side, and the front end of the spring is connected with the bottom side of the planar linkage structure through the pull rod.

Citation Information

Patent Citations

  • Chip clamping assembly and clamping rotating device

    CN216120262U

  • Universal clamping fixture to maintain laminate flatness during chip join

    US20140239569A1