Wafer cleaning line and wafer cleaning method

Abstract

The present invention discloses a wafer cleaning line and a wafer cleaning method, comprising a frame, on which a loading station, a first workstation, a second workstation, a third workstation, a fourth workstation and a unloading station are sequentially arranged along the X direction, a first electrostatic adsorption mechanism is arranged between the loading station and the first workstation, a second electrostatic adsorption mechanism is arranged between the fourth workstation and the unloading station, a cleaning agent spraying mechanism is arranged on one side of the first workstation, a cleaning brush mechanism is arranged on one side of the second workstation, a blower mechanism is arranged on one side of the third workstation, a dust sticking mechanism is arranged on the fourth workstation, and a transfer mechanism is also arranged on the frame, and the transfer mechanism is used to transfer the wafer between two adjacent workstations. Advantages: It can efficiently complete the double-sided cleaning of the wafer, so that the surface cleanliness of the wafer is high, and the utilization of the wafer is guaranteed.

Description

Technical Field

[0001] The present invention relates to the field of wafer cleaning equipment, in particular to a wafer cleaning line and a wafer cleaning method. Background Art

[0002] In the production and coating process of DFB laser, a large number of strips are required as auxiliary materials. Since the coating process has strict control over dust or debris on the strip products, it is necessary to control dust or debris in the strip production process, especially in the raw materials (bare wafers). In actual incoming materials, since the surface of bare wafers contains dust or organic matter, the existing cleaning standards of the industry standard cleaning machine are used to clean the strips dust-free to the required cleaning standard level. Manual cleaning is required to meet the requirements of end customers. In addition, the thickness of the bare wafer is about 110um, which is very easy to break in the standard cleaning machine or manual cleaning process.

[0003] In view of this, it is necessary to provide a wafer cleaning line and a wafer cleaning method. Summary of the invention

[0004] The present invention provides a wafer cleaning line and a wafer cleaning method, which effectively solve the problems of low cleaning efficiency and low wafer cleaning yield of the existing line wafers.

[0005] The technical solution adopted by the present invention is: a wafer cleaning line, including a frame, on which a loading station, a first workstation, a second workstation, a third workstation, a fourth workstation and an unloading station are arranged in sequence along the X direction, a first electrostatic adsorption mechanism is arranged between the loading station and the first workstation, a second electrostatic adsorption mechanism is arranged between the fourth workstation and the unloading station, a cleaning agent spraying mechanism is arranged on one side of the first workstation, a cleaning brush mechanism is arranged on one side of the second workstation, a blower mechanism is arranged on one side of the third workstation, and a dust sticking mechanism is arranged on the fourth workstation. A transfer mechanism is also arranged on the frame, and the transfer mechanism is used to transfer wafers between two adjacent workstations.

[0006] Furthermore, the transfer mechanism includes a No. 1 linear module arranged along the X direction, a No. 2 cylinder arranged on the No. 1 linear module along the Z axis with the output end facing upward, a No. 1 connecting plate fixedly arranged at the output end of the No. 2 cylinder along the X axis, a number of No. 3 cylinders arranged on the connecting plate along the Y axis and at equal intervals, and a number of suction cup assemblies respectively arranged at the output ends of the No. 3 cylinders.

[0007] Furthermore, the suction cup assembly includes a connecting section fixedly connected to the output end of the No. 3 cylinder, an arc section integrally formed with the connecting section, and a plurality of No. 1 suction cups arranged at the smooth end, and the plurality of No. 1 suction cups are evenly arranged on the arc section.

[0008] Furthermore, the loading station, unloading station, first workstation, second workstation, third workstation and fourth workstation have the same structure, the loading station includes a fixed No. 1 tooling, a fixed seat on the fixed No. 1 tooling, a number of lifting guide pillars slidably arranged on the No. 1 tooling along the circumferential direction of the fixed seat, a No. 2 connecting plate connecting the lower ends of the number of lifting guide pillars and a No. 4 cylinder for driving the No. 2 connecting plate to lift and lower, the arc segment can extend between the outer side of the fixed seat and the lifting guide pillar, the lifting guide pillar includes a No. 1 column fixedly connected to the No. 2 connecting plate and slidably connected to the No. 1 tooling, and a No. 2 column coaxially arranged at the upper end of the No. 1 column, the upper end of the No. 2 column is provided with an arc vertex angle, the diameter of the No. 2 column is smaller than the diameter of the No. 1 column, so that the No. 2 column and the No. 1 column form a step for placing wafers, and the fixed seat is provided with a vacuum adsorption hole.

[0009] Furthermore, the cleaning agent spraying mechanism includes a No. 2 linear module arranged along the Y-axis and a spray head arranged at the output end of the No. 2 linear module.

[0010] Furthermore, the cleaning brush mechanism includes a No. 8 linear module arranged along the Y-axis, a No. 8 cylinder arranged at the output end of the No. 8 linear module along the Z-axis, and a brush fixedly arranged at the output end of the No. 8 cylinder.

[0011] Furthermore, the hair dryer mechanism includes a No. 7 linear module arranged along the Y-axis, a No. 4 connecting plate arranged at the output end of the No. 7 module, and a hair dryer head arranged on the No. 4 connecting plate.

[0012] Furthermore, the dust-sticking mechanism includes a No. 5 linear module arranged along the Y-axis, a No. 5 cylinder arranged along the Z-axis with the output end facing downward at the output end of the No. 5 linear module, a connecting piece fixedly arranged at the output end of the No. 5 cylinder, and a roller rollingly arranged on the connecting piece, and the length of the roller is not less than the diameter of the wafer.

[0013] Furthermore, the cleaning agent spraying mechanism, cleaning brush mechanism, blowing mechanism, dust sticking mechanism and transfer mechanism are located on the same side, and the loading station, the first work station, the second work station, the third work station, the fourth work station and the unloading station are all inclined away from the transfer mechanism.

[0014] A wafer cleaning method for a wafer cleaning line comprises the following steps:

[0015] S1. Place the wafer in the loading station, and then the transfer mechanism transfers the wafer from the loading station to the second station. The specific actions are: the No. 3 cylinder drives the suction cup assembly to move, so that the suction cup assembly adsorbs the wafer, and the No. 2 cylinder drives the No. 1 connecting plate to rise, and then the No. 1 linear module drives the No. 2 cylinder to drive the No. 1 connecting plate to move along the X direction, so that the suction cup assembly moves a unit distance. In the process of the suction cup assembly moving along the X direction, the first electrostatic adsorption mechanism performs the first static removal on the wafer surface, and then the No. 2 cylinder drives the No. 1 connecting plate to move down, and the wafer is placed on the second station.

[0016] S2. After the wafer is placed on the second workstation, the cleaning agent spraying mechanism sprays the cleaning liquid on the wafer. The specific actions are: the No. 2 linear module drives the spray head to move to one side of the wafer. When it moves to the upper side of the wafer, the cleaning liquid is sprayed onto the upper surface of the wafer. Then the transfer mechanism moves the wafer from the second workstation to the third workstation, and at the same time moves the new wafer from the loading station to the first workstation.

[0017] S3. After the wafer is placed on the second workstation, the cleaning brush mechanism brushes the surface of the wafer. The specific actions are as follows: the No. 8 cylinder drives the brush to move to the same extension surface as the surface of the wafer, and then the No. 8 linear module drives the No. 8 cylinder to move to one side of the wafer, so that the brush cleans the surface of the wafer, and then the transfer mechanism moves the wafer from the second workstation to the third workstation, and at the same time moves the new wafer from the loading station to the first workstation and from the first workstation to the second workstation.

[0018] S4. After the wafer is placed on the third station, the blower mechanism blows on the surface of the wafer. The specific actions are: the No. 7 linear module drives the No. 4 connecting plate to move toward one side of the wafer, and uses the blower head to dry the surface of the wafer. Then the transfer mechanism transfers the wafer from the third station to the fourth station, and transfers the new wafer from the loading station to the first station, from the first station to the second station, and from the second station to the third station.

[0019] S5. After the wafer is placed on the fourth station, the dust sticking mechanism rolls and sticks to the surface of the wafer. The specific actions are as follows: the No. 5 cylinder drives the connecting part to move downward, so that the roller can roll along the upper surface of the wafer. Then the No. 5 linear module drives the No. 5 cylinder to move to one side of the wafer, so that the roller rolls along the upper surface of the wafer. Then the transfer mechanism transfers the wafer from the fourth station to the unloading station. During the transfer process, the second electrostatic adsorption mechanism performs secondary static removal on the upper surface of the wafer. At the same time, the transfer mechanism transfers the new wafer from the loading station to the first station, from the first station to the second station, from the second station to the third station, and from the third station to the fourth station.

[0020] S6. Place the wafer with one cleaned side back into the loading station with the uncleaned side facing upward, and then repeat steps S1-S4.

[0021] The beneficial effects of the invention are as follows: the double-sided cleaning of the wafer can be completed efficiently, so that the surface cleanliness of the wafer is high and the utilization of the wafer is guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 An overall schematic diagram of a wafer cleaning line provided in an embodiment of the present application.

[0023] Figure 2 An overall schematic diagram of a wafer cleaning line provided in an embodiment of the present application.

[0024] Figure 3 A schematic diagram of a loading station of a wafer cleaning line provided in an embodiment of the present application.

[0025] Figure 4 A schematic diagram of a lifting guide column of a loading station of a wafer cleaning line provided in an embodiment of the present application.

[0026] Figure 5 A schematic diagram of a transfer mechanism of a wafer cleaning line provided in an embodiment of the present application.

[0027] Figure 6 A schematic diagram of a suction cup assembly of a transfer mechanism of a wafer cleaning line provided in an embodiment of the present application.

[0028] The markings in the figure are: 1. Loading station; 2. First station; 3. Second station; 4. Third station; 5. Fourth station; 6. Unloading station; 7. First electrostatic adsorption mechanism; 8. Second electrostatic adsorption mechanism; 9. Cleaning agent spraying mechanism; 10. Cleaning brush mechanism; 11. Blowing mechanism; 12. Dust sticking mechanism; 13. Transfer mechanism; 131. No. 1 linear module; 132. No. 2 cylinder; 133. No. 1 connecting plate; 134. No. 3 cylinder; 135. Suction cup assembly; 351. Connecting section; 352. Arc section; 353. No. 1 suction cup; 10 1. No. 1 tooling; 102. Fixed seat; 103. Lifting guide column; 104. No. 2 connecting plate; 105. No. 4 cylinder; 031. No. 1 column; 032. No. 2 column; 033. Arc vertex angle; 034. Step; 91. No. 2 linear module; 92. Sprinkler head; 1001. No. 8 linear module; 1002. No. 8 cylinder; 1003. Brush; 111. No. 7 linear module; 112. No. 4 connecting plate; 113. Blowing head; 121. No. 5 linear module; 122. No. 5 cylinder; 123. Connector; 124. Roller. DETAILED DESCRIPTION

[0029] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0030] like Figure 1 and Figure 2 As shown, a wafer cleaning line provided in an embodiment of the present application comprises a frame, on which a loading station 1, a first workstation 2, a second workstation 3, a third workstation 4, a fourth workstation 5 and an unloading station 6 are sequentially arranged along the X direction, a first electrostatic adsorption mechanism 7 is arranged between the loading station 1 and the first workstation 2, a second electrostatic adsorption mechanism 8 is arranged between the fourth workstation 5 and the unloading station 6, a cleaning agent spraying mechanism 9 is correspondingly arranged on one side of the first workstation 2, a cleaning brush mechanism 10 is correspondingly arranged on one side of the second workstation 3, a blower mechanism 11 is correspondingly arranged on one side of the third workstation 4, a dust sticking mechanism 12 is correspondingly arranged on the fourth workstation 5, and a transfer mechanism 13 is also arranged on the frame, and the transfer mechanism 13 is used to transfer the wafer between two adjacent workstations.

[0031] In actual use, the wafer is placed in the loading station 1, and then the transfer mechanism 13 transfers the wafer from the loading station 1 to the second station 3. During the transfer process, the first electrostatic adsorption mechanism 7 performs the first static removal on the wafer surface. When the wafer is placed on the first station 2, the cleaning agent spraying mechanism 9 sprays the cleaning liquid on the wafer, and then the transfer mechanism 13 moves the wafer from the second station 3 to the third station 4, and at the same time moves the new wafer from the loading station 1 to the first station 2. When the wafer is placed on the second station 3, the cleaning brush mechanism 10 brushes the wafer surface, and the transfer mechanism 13 moves the wafer from the second station 3 to the third station 4, and at the same time moves the new wafer from the loading station 1 to the first station 2 and from the first station 2 to the second station 3. After the wafer is placed on the third station 4, the blowing mechanism 11 blows on the surface of the wafer, and then the transfer mechanism 13 transfers the wafer from the third station 4 to the fourth station 5, and transfers the new wafer from the loading station 1 to the first station 2, from the first station 2 to the second station 3, and from the second station 3 to the third station 4. After the wafer is placed on the fourth station 5, the dust sticking mechanism 12 rolls and sticks on the surface of the wafer, and then the transfer mechanism 13 transfers the wafer from the fourth station 5 to the unloading station 6. During the transfer process, the second electrostatic adsorption mechanism 8 performs secondary static removal on the upper surface of the wafer, and at the same time, the transfer mechanism 13 transfers the new wafer from the loading station 1 to the first station 2, from the first station 2 to the second station 3, from the second station 3 to the third station 4, and from the third station 4 to the fourth station 5. The wafer with one side cleaned is placed back to the loading station 1 again, so that the uncleaned side faces up and is cleaned.

[0032] In the above design, double-sided cleaning of the wafer can be completed efficiently, so that the surface cleanliness of the wafer is high and the utilization of the wafer is guaranteed.

[0033] Specifically: Figure 5As shown, the transfer mechanism 13 includes a No. 1 linear module 131 arranged along the X direction, a No. 2 cylinder 132 arranged on the No. 1 linear module 131 along the Z axis with the output end facing upward, a No. 1 connecting plate 133 fixedly arranged at the output end of the No. 2 cylinder 132 along the X axis, a number of No. 3 cylinders 134 arranged on the connecting plate along the Y axis and at equal intervals, and a number of suction cup assemblies 135 respectively arranged at the output ends of the No. 3 cylinders 134.

[0034] In actual use, the No. 3 cylinder 134 drives the suction cup assembly 135 to move, so that after the suction cup assembly 135 adsorbs the wafer, the No. 2 cylinder 132 drives the No. 1 connecting plate 133 to rise, and then the No. 1 linear module 131 drives the No. 2 cylinder 132 to drive the No. 1 connecting plate 133 to move along the X direction, so that each suction cup assembly 135 moves a unit distance, and then the No. 2 cylinder 132 drives the No. 1 connecting plate 133 to move downward to place the wafer at the next processing station.

[0035] In the above design, the structural design and specific implementation of the transfer mechanism 13 can effectively realize the transfer of wafers.

[0036] Specifically: Figure 6 As shown, the suction cup assembly 135 includes a connecting section 351 fixedly connected to the output end of the No. 3 cylinder 134, an arc section 352 integrally formed with the connecting section 351, and a plurality of No. 1 suction cups 353 arranged at the smooth end, and the plurality of No. 1 suction cups 353 are evenly arranged on the arc section 352.

[0037] In actual use, the arc segment 352 follows the connecting segment 351 to move to the outside of the fixing seat 102, and then the first suction cup 353 is lifted or lowered to adsorb or detach from the wafer.

[0038] In the above design, the structural design and specific implementation method of the suction cup assembly 135 can ensure that the No. 1 suction cup 353 sticks to the waste part during wafer processing, ensuring that the used part of the wafer is cleaner.

[0039] Specifically: Figure 3 and Figure 4As shown, the loading station 1, the unloading station 8, the first workstation 2, the second workstation 3, the third workstation 4 and the fourth workstation 5 have the same structure. The loading station 1 includes a fixed No. 1 tool 101, a fixed seat 102 fixedly set on the No. 1 tool 101, a plurality of lifting guide pillars 103 circumferentially slidingly set on the No. 1 tool 101 along the fixed seat 102, a No. 2 connecting plate 104 connecting the lower ends of the plurality of lifting guide pillars 103, and a No. 4 cylinder 105 for driving the No. 2 connecting plate 104 to move up and down. The arc segment 352 can extend into the fixed seat 102. Between the outer side of the fixed seat 102 and the lifting guide column 103, the lifting guide column 103 includes a No. 1 column 031 fixedly connected to the No. 2 connecting plate 104 and slidably connected to the No. 1 tooling 101, and a No. 2 column 032 coaxially arranged on the upper end of the No. 1 column 031, and an arc vertex angle 033 is arranged on the upper end of the No. 2 column 032. The diameter of the No. 2 column 032 is smaller than the diameter of the No. 1 column 031, so that the No. 2 column 032 and the No. 1 column 031 form a step 034 for placing a wafer, and a vacuum adsorption hole is arranged on the fixed seat 102.

[0040] In actual use, the No. 4 cylinder 105 drives the No. 2 connecting plate 104 to rise to step 034 above the upper surface of the fixing seat 102. When the wafer is placed on step 034, the No. 4 cylinder 105 drives the No. 2 connecting plate 104 to move downward, so that the wafer is placed on the fixing seat 102, and then the fixing seat 102 adsorbs the wafer.

[0041] In the above design, the design of the step 034 and the arc top angle 033 facilitates the convenient and quick reception of the wafer transferred by the suction cup. The vacuum adsorption holes set on the fixing seat 102 can ensure that the wafer remains stable during the dust removal process, and is not prone to wafer breakage, thereby ensuring smooth dust removal.

[0042] Specifically: Figure 2 As shown, the cleaning agent spraying mechanism 9 includes a second linear module 91 arranged along the Y axis and a spray head 92 arranged at the output end of the second linear module 91 .

[0043] In actual use, the second linear module 91 drives the spray head 92 to move toward one side of the wafer, and when it moves to the upper side of the wafer, the cleaning liquid is sprayed onto the upper surface of the wafer.

[0044] In the above design, the cleaning liquid is attached to the surface of the wafer to effectively reduce the difficulty of cleaning.

[0045] Specifically: Figure 2 As shown, the cleaning brush mechanism 10 includes a No. 8 linear module 1001 arranged along the Y-axis, a No. 8 cylinder 1002 arranged at the output end of the No. 8 linear module 1001 along the Z-axis, and a brush 1003 fixedly arranged at the output end of the No. 8 cylinder 1002.

[0046] In actual use, after the wafer sprayed with cleaning liquid is transferred to the third workstation 4 by the transfer mechanism 13 and fixed, the No. 8 cylinder 1002 drives the brush 1003 to move to the same extension surface as the surface of the wafer, and then the No. 8 linear module 1001 drives the No. 8 cylinder 1002 to move to one side of the wafer, so that the brush 1003 cleans the surface of the wafer.

[0047] In the above design, the structural design and specific implementation of the cleaning brush can effectively separate most of the dust on the surface of the wafer from adhering to the wafer.

[0048] Specifically: Figure 2 As shown, the hair blowing mechanism 11 includes a seventh linear module 111 arranged along the Y axis, a fourth connecting plate 112 arranged at the output end of the seventh module, and a hair blowing head 113 arranged on the fourth connecting plate 112 .

[0049] In actual use, the seventh linear module 111 drives the fourth connecting plate 112 to move toward one side of the wafer, and the blowing head 113 is used to dry the surface of the wafer.

[0050] In the above design, the structural design and specific implementation of the air blowing mechanism 11 can completely separate the cleaning liquid on the wafer surface from the wafer, ensuring that the cleaning liquid does not remain on the wafer surface.

[0051] Specifically: Figure 2 As shown, the dust sticking mechanism 12 includes a No. 5 linear module 121 arranged along the Y-axis, a No. 5 cylinder 122 arranged along the Z-axis with the output end facing downward at the output end of the No. 5 linear module 121, a connecting piece 123 fixedly arranged at the output end of the No. 5 cylinder 122, and a roller 124 rollingly arranged on the connecting piece 123, and the length of the roller 124 is not less than the diameter of the wafer.

[0052] In actual use, the No. 5 cylinder 122 drives the connecting piece 123 to move downward, so that the roller 124 can roll along the upper surface of the wafer, and then the No. 5 linear module 121 drives the No. 5 cylinder 122 to move to one side of the wafer, so that the roller 124 rolls along the upper surface of the wafer.

[0053] In the above design, the structural design and specific implementation of the dust sticking mechanism 12 can effectively adsorb the dust on the surface of the wafer.

[0054] Specifically: Figure 2 As shown, the cleaning agent spraying mechanism 9, the cleaning brush mechanism 10, the blowing mechanism 11, the dust collecting mechanism 12 and the transferring mechanism 13 are located on the same side, and the loading station 1, the first workstation 2, the second workstation 3, the third workstation 4, the fourth workstation 5 and the unloading station 6 are all inclined away from the transferring mechanism 13.

[0055] During actual use, the wafer is cleaned toward the side away from the transfer mechanism 13 when being processed in each workstation, the cleaning liquid sprayed by the cleaning agent spraying mechanism 9 flows toward the inclined side on the wafer surface, the cleaning brush mechanism 10 brushes from the high side of the wafer to the inclined side, and the blowing mechanism 11 blows from the high side to the inclined side.

[0056] In the above design, the inclined setting can ensure that the cleaning liquid on the surface of the wafer is easier to separate from the wafer.

[0057] A wafer cleaning method for a wafer cleaning line comprises the following steps:

[0058] S1. Place the wafer in the loading station 1, and then the transfer mechanism 13 transfers the wafer from the loading station 1 to the second workstation 3. The specific actions are: the No. 3 cylinder 134 drives the suction cup assembly 135 to move, so that the suction cup assembly 135 adsorbs the wafer, and then the No. 2 cylinder 132 drives the No. 1 connecting plate 133 to rise, and then the No. 1 linear module 131 drives the No. 2 cylinder 132 to drive the No. 1 connecting plate 133 to move along the X direction, so that the suction cup assembly 135 moves a unit distance. In the process of the suction cup assembly 135 moving along the X direction, the first electrostatic adsorption mechanism 7 performs the first static removal on the wafer surface, and then the No. 2 cylinder 132 drives the No. 1 connecting plate 133 to move down, and the wafer is placed on the second workstation.

[0059] S2. After the wafer is placed on the second workstation 3, the cleaning agent spraying mechanism 9 sprays the cleaning liquid on the wafer. The specific actions are: the No. 2 linear module 91 drives the spray head 92 to move to one side of the wafer. When it moves to the upper side of the wafer, the cleaning liquid is sprayed onto the upper surface of the wafer. Then the transfer mechanism 13 moves the wafer from the second workstation 3 to the third workstation 4, and at the same time moves the new wafer from the loading station 1 to the first workstation 2.

[0060] S3. After the wafer is placed on the second workstation 3, the cleaning brush mechanism 10 brushes the surface of the wafer. The specific actions are as follows: the No. 8 cylinder 1002 drives the brush 1003 to move to the same extension surface as the surface of the wafer, and then the No. 8 linear module 1001 drives the No. 8 cylinder 1002 to move toward one side of the wafer, so that the brush 1003 cleans the surface of the wafer, and then the transfer mechanism 13 moves the wafer from the second workstation 3 to the third workstation 4, and at the same time moves the new wafer from the loading station 1 to the first workstation 2, and from the first workstation 2 to the second workstation 3.

[0061] S4. After the wafer is placed on the third workstation 4, the blower mechanism 11 blows on the surface of the wafer. The specific actions are: the No. 7 linear module 111 drives the No. 4 connecting plate 112 to move toward one side of the wafer, and the blower head 113 is used to dry the surface of the wafer. Then the transfer mechanism 13 transfers the wafer from the third workstation 4 to the fourth workstation 5, and transfers the new wafer from the loading station 1 to the first workstation 2, from the first workstation 2 to the second workstation 3, and from the second workstation 3 to the third workstation 4.

[0062] S5. After the wafer is placed on the fourth station 5, the dust sticking mechanism 12 rolls and sticks to the surface of the wafer. The specific actions are as follows: the No. 5 cylinder 122 drives the connecting piece 123 to move downward, so that the roller 124 can roll along the upper surface of the wafer. Then the No. 5 linear module 121 drives the No. 5 cylinder 122 to move to one side of the wafer, so that the roller 124 rolls along the upper surface of the wafer. Then the transfer mechanism 13 transfers the wafer from the fourth station 5 to the unloading station 6. During the transfer process, the second electrostatic adsorption mechanism 8 performs secondary static removal on the upper surface of the wafer. At the same time, the transfer mechanism 13 transfers the new wafer from the loading station 1 to the first station 2, from the first station 2 to the second station 3, from the second station 3 to the third station 4, and from the third station 4 to the fourth station 5.

[0063] S6, placing the wafer with one side cleaned back to the loading station 1 again, with the uncleaned side facing upward, and then repeating steps S1-S4.

[0064] To further explain in detail, it should be understood that the above is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer cleaning line, comprising a rack, characterized in that: A loading station (1), a first workstation (2), a second workstation (3), a third workstation (4), a fourth workstation (5) and an unloading station (6) are sequentially arranged on the frame along the X direction; a first electrostatic adsorption mechanism (7) is arranged between the loading station (1) and the first workstation (2); a second electrostatic adsorption mechanism (8) is arranged between the fourth workstation (5) and the unloading station (6); a cleaning agent spraying mechanism (9) is arranged on one side of the first workstation (2); a cleaning brush mechanism (10) is arranged on one side of the second workstation (3); a blower mechanism (11) is arranged on one side of the third workstation (4); a dust sticking mechanism (12) is arranged on the fourth workstation (5); and a transfer mechanism (13) is also arranged on the frame, and the transfer mechanism (13) is used to transfer wafers between two adjacent workstations; The transfer mechanism (13) comprises a No. 1 linear module (131) arranged along the X direction, a No. 2 cylinder (132) arranged on the No. 1 linear module (131) along the Z axis and with the output end facing upward, a No. 1 connecting plate (133) fixedly arranged at the output end of the No. 2 cylinder (132) along the X axis, a plurality of No. 3 cylinders (134) arranged on the connecting plate at equal intervals along the Y axis, and a plurality of suction cup assemblies (135) respectively arranged at the output ends of the No. 3 cylinders (134); The suction cup assembly (135) comprises a connecting section (351) fixedly connected to the output end of the No. 3 cylinder (134), an arc section (352) integrally formed with the connecting section (351), and a plurality of No. 1 suction cups (353) arranged at the smooth end, wherein the plurality of No. 1 suction cups (353) are evenly arranged on the arc section (352); The loading station (1), unloading station (6), first work station (2), second work station (3), third work station (4) and fourth work station (5) have the same structure. The loading station (1) comprises a fixedly arranged No. 1 tool (101), a fixed seat (102) fixedly arranged on the No. 1 tool (101), a plurality of lifting guide pillars (103) slidably arranged on the No. 1 tool (101) along the circumferential direction of the fixed seat (102), a No. 2 connecting plate (104) connecting the lower ends of the plurality of lifting guide pillars (103), and a No. 4 cylinder (105) for driving the No. 2 connecting plate (104) to move up and down. The arc segment (352) can extend into Between the outer side of the fixed seat (102) and the lifting guide column (103), the lifting guide column (103) comprises a first column (031) fixedly connected to the second connecting plate (104) and slidably connected to the first tooling (101), and a second column (032) coaxially arranged on the upper end of the first column (031), the upper end of the second column (032) is provided with an arc vertex angle (033), the diameter of the second column (032) is smaller than the diameter of the first column (031), so that the second column (032) and the first column (031) form a step (034) for placing a wafer, and the fixed seat (102) is provided with a vacuum adsorption hole; The cleaning agent spraying mechanism (9) comprises a second linear module (91) arranged along the Y axis and a spray head (92) arranged at the output end of the second linear module (91).

2. The wafer cleaning line according to claim 1, characterized in that: The cleaning brush mechanism (10) comprises an eighth linear module (1001) arranged along the Y axis, an eighth cylinder (1002) arranged at the output end of the eighth linear module (1001) along the Z axis, and a brush (1003) fixedly arranged at the output end of the eighth cylinder (1002).

3. The wafer cleaning line according to claim 2, characterized in that: The air blowing mechanism (11) comprises a seventh linear module (111) arranged along the Y axis, a fourth connecting plate (112) arranged at the output end of the seventh module, and a air blowing head (113) arranged on the fourth connecting plate (112).

4. The wafer cleaning line according to claim 3, characterized in that: The dust sticking mechanism (12) comprises a No. 5 linear module (121) arranged along the Y axis, a No. 5 cylinder (122) arranged along the Z axis with the output end facing downward at the output end of the No. 5 linear module (121), a connecting piece (123) fixedly arranged at the output end of the No. 5 cylinder (122), and a roller (124) rollingly arranged on the connecting piece (123), wherein the length of the roller (124) is not less than the diameter of the wafer.

5. The wafer cleaning line according to claim 4, characterized in that: The cleaning agent spraying mechanism (9), the cleaning brush mechanism (10), the blowing mechanism (11), the dust sticking mechanism (12) and the transfer mechanism (13) are located on the same side, and the loading station (1), the first work station (2), the second work station (3), the third work station (4), the fourth work station (5) and the unloading station (6) are all inclined to the side away from the transfer mechanism (13).

6. A wafer cleaning method for a wafer cleaning line, using the wafer cleaning line according to claim 5, characterized in that: The steps include: S1, placing the wafer in the loading station (1), and then the transfer mechanism (13) transfers the wafer from the loading station (1) to the second workstation (3), and the specific actions are: the No. 3 cylinder (134) drives the suction cup assembly (135) to move, so that the suction cup assembly (135) adsorbs the wafer, and then the No. 2 cylinder (132) drives the No. 1 connecting plate (133) to rise, and then the No. 1 linear module (131) drives the No. 2 cylinder (132) to drive the No. 1 connecting plate (133) to move along the X direction, so that the suction cup assembly (135) moves a unit distance. During the process of the suction cup assembly (135) moving along the X direction, the first electrostatic adsorption mechanism (7) performs the first static elimination on the surface of the wafer, and then the No. 2 cylinder (132) drives the No. 1 connecting plate (133) to move downward, and the wafer is placed in the second workstation; S2. After the wafer is placed on the first workstation (2), the cleaning agent spraying mechanism (9) sprays the cleaning liquid on the wafer. The specific actions are as follows: the second linear module (91) drives the spray head (92) to move toward one side of the wafer. When it moves to the upper side of the wafer, the cleaning liquid is sprayed onto the upper surface of the wafer. Then, the transfer mechanism (13) moves the wafer from the first workstation (2) to the second workstation (3), and at the same time, moves a new wafer from the loading station (1) to the first workstation (2). S3. After the wafer is placed on the second workstation (3), the cleaning brush mechanism (10) brushes the surface of the wafer. The specific actions are as follows: the No. 8 cylinder (1002) drives the brush (1003) to move to the same extension surface as the surface of the wafer, and then the No. 8 linear module (1001) drives the No. 8 cylinder (1002) to move toward one side of the wafer, so that the brush (1003) cleans the surface of the wafer, and then the transfer mechanism (13) moves the wafer from the second workstation (3) to the third workstation (4), and at the same time moves a new wafer from the loading station (1) to the first workstation (2), and from the first workstation (2) to the second workstation (3); S4. After the wafer is placed on the third workstation (4), the blower mechanism (11) blows on the surface of the wafer. The specific actions are as follows: the seventh linear module (111) drives the fourth connecting plate (112) to move toward one side of the wafer, and uses the blower head (113) to blow dry the surface of the wafer. Then, the transfer mechanism (13) transfers the wafer from the third workstation (4) to the fourth workstation (5), and transfers the new wafer from the loading station (1) to the first workstation (2), from the first workstation (2) to the second workstation (3), and from the second workstation (3) to the third workstation (4); S5. After the wafer is placed on the fourth station (5), the dust sticking mechanism (12) rolls and sticks to the surface of the wafer. The specific actions are as follows: the No. 5 cylinder (122) drives the connecting piece (123) to move downward, so that the roller (124) can roll along the upper surface of the wafer. Then, the No. 5 linear module (121) drives the No. 5 cylinder (122) to move toward one side of the wafer, so that the roller (124) rolls along the upper surface of the wafer. Then, the transfer mechanism (13) transfers the wafer from the fourth station (5) to the unloading station (6). During the transfer process, the second electrostatic adsorption mechanism (8) performs secondary static removal on the upper surface of the wafer. At the same time, the transfer mechanism (13) transfers the new wafer from the loading station (1) to the first station (2), from the first station (2) to the second station (3), from the second station (3) to the third station (4), and from the third station (4) to the fourth station (5); S6, placing the wafer with one side cleaned back to the loading station (1) so that the uncleaned side faces upward, and then repeating steps S1-S4.

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