A co-lay part inspection method, apparatus, device, medium

Abstract

The application discloses a co-lay part inspection method, device, equipment and medium, and relates to the technical field of PCB design. The method comprises the following steps: acquiring a co-lay part list in a schematic diagram document and a corresponding PCB design document respectively to obtain a first part document and a second part document; performing comparison and verification on the first part document and the second part document, deleting co-lay part information that is consistent in comparison from the first part document and the second part document to obtain a first target part document and a second target part document; and generating a co-lay part inspection result based on the first target part document and the second target part document. In this way, the co-lay part can be inspected, the situation of inspection failure caused by human error and oversight or misjudgment can be avoided, and the time cost of manual inspection can be reduced.

Description

Technical Field

[0001] This invention relates to the field of PCB design technology, and in particular to a method, apparatus, equipment, and medium for inspecting co-lay components. Background Technology

[0002] The main control board contains tens of thousands of components. In the latest platform design, the number of co-lay parts can reach 500. The traditional approach is for the EE engineer to manually compile a list of parts that need to be co-laid, and then the layout engineer to check each of the tens of thousands of parts on the main control board against the list to see if they are co-laid. The requirement for checking co-lay parts is that the schematic and PCB design must be completely consistent, that is, the quantity and co-lay part number must be completely consistent. The above one-way output check is not only time-consuming, but also can only guarantee that the PCB design includes the schematic co-lay. It cannot rule out that the PCB design has more co-lay parts than the schematic design requires, and it is easy to miss or misread due to human error.

[0003] In summary, how to quickly check whether the co-lay components in the schematic diagram are consistent with those in the PCB design, and output information on the co-lay components that are inconsistent between the schematic diagram and the PCB design, thereby reducing the workload of hardware engineers and improving the efficiency and accuracy of the inspection, is a technical problem that needs to be solved in this field. Summary of the Invention

[0004] In view of this, the purpose of this invention is to provide a method, apparatus, device, and medium for inspecting co-lay components, capable of quickly checking whether co-lay components in the schematic diagram and PCB design drawings are consistent, and outputting information on co-lay components that are inconsistent between the schematic diagram and PCB design drawings, thereby reducing the workload of hardware engineers and improving the efficiency and accuracy of the inspection. The specific solution is as follows:

[0005] Firstly, this application discloses a method for inspecting co-lay parts, including:

[0006] Obtain the co-lay component lists from the schematic document and the corresponding PCB design document respectively to obtain the first component document and the second component document; wherein, the first component document is the schematic co-lay component document and the second component document is the PCB design co-lay component document;

[0007] The first part document and the second part document are compared and verified, and the co-lay part information that matches in the comparison is deleted to obtain the first target part document and the second target part document.

[0008] Generate co-lay part inspection results based on the first target part document and the second target part document.

[0009] Optionally, obtaining the co-lay component lists from the schematic document and the corresponding PCB design document to obtain the first component document and the second component document includes:

[0010] Scan the schematic document, extract the first co-lay part information carrying the target part attributes, and generate the first part document from the first co-lay part information in text format.

[0011] Execute the preset co-lay component inspection command, export the second co-lay component information from the PCB design document, and save the second component information in different worksheets; generate the second component document based on the second component information.

[0012] Optionally, before scanning the schematic document, the method further includes:

[0013] Select the target part to be co-layed from the schematic document, add attributes to the target part to obtain the first co-lay part.

[0014] Optionally, executing the preset co-lay component inspection command and exporting the second co-lay component information from the PCB design document includes:

[0015] Execute the preset co-lay component inspection command to export the component name and corresponding center coordinates of the second co-lay component in the PCB design document.

[0016] Optionally, the step of saving the second part information in different worksheets and generating a second part document based on the second part information includes:

[0017] Select the target worksheet, and set the center coordinates of the second co-lay part in the target worksheet as the reference coordinates. Query the worksheets other than the target worksheet for coordinates that are the same as the reference coordinates, and record the tag number corresponding to the coordinates.

[0018] The reference numbers are concatenated to generate a second part document.

[0019] Optionally, the step of comparing and verifying the first part document and the second part document, and deleting the co-lay part information that matches in the comparison between the first part document and the second part document, includes:

[0020] The information on the first and second co-lay parts is stored separately in the same target table. The duplicate co-lay parts information in the first and second co-lay parts information is deleted using the duplicate deletion instruction.

[0021] Optionally, generating co-lay part inspection results based on the first target part document and the second target part document includes:

[0022] Extract the remaining co-lay part information from the first target part document and the second target part document respectively, and generate the co-lay part inspection result based on the remaining co-lay part information.

[0023] Secondly, this application discloses a co-lay parts inspection device, comprising:

[0024] The document acquisition module is used to acquire the list of co-lay parts in the schematic document and the corresponding PCB design document respectively, so as to obtain the first part document and the second part document; wherein, the first part document is the schematic co-lay part document and the second part document is the PCB design co-lay part document.

[0025] The information verification module is used to compare and verify the first part document and the second part document, and delete the co-lay part information that matches the comparison in the first part document and the second part document to obtain the first target part document and the second target part document.

[0026] The parts inspection module is used to generate co-lay parts inspection results based on the first target parts document and the second target parts document.

[0027] Thirdly, this application discloses an electronic device, including:

[0028] Memory, used to store computer programs;

[0029] A processor is used to execute the computer program to implement the steps of the aforementioned disclosed co-lay part inspection method.

[0030] Fourthly, this application discloses a computer-readable storage medium for storing a computer program; wherein, when the computer program is executed by a processor, it implements the steps of the aforementioned disclosed co-lay part inspection method.

[0031] Therefore, this application discloses a method for inspecting co-lay components, comprising: obtaining a list of co-lay components from a schematic diagram document and a corresponding PCB design document, respectively, to obtain a first component document and a second component document; wherein, the first component document is a schematic diagram co-lay component document, and the second component document is a PCB design co-lay component document; comparing and verifying the first component document and the second component document, deleting co-lay component information that matches the comparison in the first component document and the second component document, to obtain a first target component document and a second target component document; and generating a co-lay component inspection result based on the first target component document and the second target component document. As can be seen, by separately obtaining the co-lay component list corresponding to the schematic document and the co-lay component list corresponding to the PCB design document, and comparing and verifying the obtained component lists, the comparison instructions in the table are used to obtain the component information that matches between the two component lists. The matching component information indicates that the component corresponding to the component information meets the current inspection requirements. The matching component information in the two component lists is removed, and the remaining component information is organized into two component documents. The component information contained in these component documents is the component information corresponding to the component that does not meet the inspection requirements. Thus, the inspection of co-lay components can be completed in the above way, avoiding inspection errors caused by human error such as omission or misreading, and reducing the time cost of manual inspection. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0033] Figure 1 This is a flowchart of a co-lay part inspection method disclosed in this application;

[0034] Figure 2 This is a schematic diagram of obtaining part information in a schematic document disclosed in this application;

[0035] Figure 3 This is a schematic diagram showing the result of extracting part information from a schematic document disclosed in this application.

[0036] Figure 4 This application discloses a flowchart of a specific method for inspecting co-lay parts.

[0037] Figure 5 This is a schematic diagram of a document part information comparison process disclosed in this application;

[0038] Figure 6 This is a schematic diagram illustrating the comparison results of part information in a document disclosed in this application.

[0039] Figure 7 This is a schematic diagram of the structure of a co-lay parts inspection device disclosed in this application;

[0040] Figure 8 This is a structural diagram of an electronic device disclosed in this application. Detailed Implementation

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0042] The main control board contains tens of thousands of components. In the latest platform design, the number of co-lay parts can reach 500. The traditional approach is for the EE engineer to manually compile a list of parts that need to be co-laid, and then the layout engineer to check each of the tens of thousands of parts on the main control board against the list to see if they are co-laid. The requirement for checking co-lay parts is that the schematic and PCB design must be completely consistent, that is, the quantity and co-lay part number must be completely consistent. The above one-way output check is not only time-consuming, but also can only guarantee that the PCB design includes the schematic co-lay. It cannot rule out that the PCB design has more co-lay parts than the schematic design requires, and it is easy to miss or misread due to human error.

[0043] To address this, this application discloses a co-lay component inspection scheme that can quickly check whether co-lay components in the schematic diagram are consistent with those in the PCB design drawing, and output information on co-lay components that are inconsistent between the schematic diagram and the PCB design drawing. This reduces the workload of hardware engineers and improves the efficiency and accuracy of the inspection.

[0044] Reference Figure 1 As shown, this embodiment of the invention discloses a method for inspecting co-lay parts, including:

[0045] Step S11: Obtain the list of co-lay parts from the schematic document and the corresponding PCB design document respectively to obtain the first part document and the second part document; wherein, the first part document is the schematic co-lay part document and the second part document is the PCB design co-lay part document.

[0046] In this embodiment, the schematic document is scanned to extract the first co-lay component information carrying the target component attributes, and the first co-lay component information is used to generate a first component document in text format. It can be understood that by triggering the export co-lay document command, the background can automatically scan the entire schematic document, extract all component names with the "CL" attribute, and present them as a first component document in txt format. Specifically, the CL attribute is the target component attribute. Co-lay refers to the design of stacking two or more components on pads during PCB design, but only one type is actually used in the final board. Simply put, a group of signal lines uses different components to achieve different functions or modes. Co-lay components are components in the same location in the PCB design that perform different functions.

[0047] In this embodiment, a preset co-lay component inspection command is executed to export the second co-lay component information from the PCB design document, and the second component information is saved in different worksheets; a second component document is generated based on the second component information. It can be understood that clicking the button to initiate the preset co-lay component inspection command via the human-computer interaction interface performs the corresponding operation to obtain the second component document.

[0048] In this embodiment, before scanning the schematic document, the target part to be co-laid is selected from the schematic document, and attributes are added to the target part to obtain the first co-lay part. It can be understood that the Cadence language is developed twice, creating the following three modules sequentially: a component selection module, a co-lay attribute addition module, and a co-lay document export module. Specifically, clicking the "Component Selection" module will automatically invoke the relevant skills, and then select the component to be co-laid in the schematic, as follows. Figure 2 As shown, PC339, PC341, and PC343 will be selected by the box. Then, click the "Add Co-lay Attribute" module, and the software will automatically add the "CL" attribute to the selected parts. The attribute value is the concatenation of the part reference designator, such as "PC339-PC341-PC343". After all co-lay attributes of the schematic are added, click the "Export Co-lay Document" module, and the following will be generated in the root directory of the schematic: Figure 3 The document shown is “sch_co-lay.txt”, which is also the first part document. This first part document specifically contains the page number of the part to be co-laid and the name of the co-lay part with the CL attribute. For example, the part information of the part to be co-laid designed in the current schematic is: R1-R3 on page 25, C123-C122 on page 30, PC229-PC341-PC343 on page 34, PR12-PR43 on page 120, etc.

[0049] Step S12: Compare and verify the first part document and the second part document, and delete the co-lay part information that matches the comparison in the first part document and the second part document to obtain the first target part document and the second target part document.

[0050] In this embodiment, the acquired first part document and second part document are compared and verified. The comparison is made to see if the part information of the co-lay part to be co-laid and the co-lay part that has been PCB designed in the two documents are consistent. If they are consistent, it means that the co-lay part to be co-laid in the schematic diagram has been PCB designed. If they are inconsistent, there are two situations. The first situation is that the co-lay part to be co-laid in the schematic diagram cannot be found in the second part document. That is, the part information of the co-lay part to be co-laid appears in the first part document but not in the second part document. In this case, it means that the PCB design document corresponding to the second part document has not been PCB designed for the co-lay part to be co-laid. The second situation is that the co-lay part designed in the PCB cannot be found in the first part document. The part information of the co-lay part designed in the PCB design document appears in the second part document but not in the first part document. In this case, it means that the schematic diagram document corresponding to the first part document is missing part information of the designed co-lay part, such as the schematic diagram page number where the part is located and the part name. Next, the identical part information generated after the comparison and verification is deleted from both part documents to obtain a first target part document and a second target part document that do not contain identical part information. A fixed attribute is quickly added to the components that need co-laying using the skill language, and then all components with this attribute can be identified through a traversal search method.

[0051] Step S13: Generate co-lay part inspection results based on the first target part document and the second target part document.

[0052] In this embodiment, an inspection result document is generated based on the first target part document and the second target part document. Specifically, the part information used to characterize non-compliance with inspection requirements in the first and second target documents is extracted and organized accordingly, and the co-lay part inspection results are output in tabular form.

[0053] Therefore, this application discloses a method for inspecting co-lay components, comprising: obtaining a list of co-lay components from a schematic diagram document and a corresponding PCB design document, respectively, to obtain a first component document and a second component document; wherein, the first component document is a schematic diagram co-lay component document, and the second component document is a PCB design co-lay component document; comparing and verifying the first component document and the second component document, deleting co-lay component information that matches the comparison in the first component document and the second component document, to obtain a first target component document and a second target component document; and generating a co-lay component inspection result based on the first target component document and the second target component document. As can be seen, by separately obtaining the co-lay component list corresponding to the schematic document and the co-lay component list corresponding to the PCB design document, and comparing and verifying the obtained component lists, the comparison instructions in the table are used to obtain the component information that matches between the two component lists. The matching component information indicates that the component corresponding to the component information meets the current inspection requirements. The matching component information in the two component lists is removed, and the remaining component information is organized into two component documents. The component information contained in these component documents is the component information corresponding to the component that does not meet the inspection requirements. Thus, the inspection of co-lay components can be completed in the above way, avoiding inspection errors caused by human error such as omission or misreading, and reducing the time cost of manual inspection.

[0054] Reference Figure 4 As shown, this embodiment of the invention discloses a specific method for inspecting co-lay parts. Compared with the previous embodiment, this embodiment further explains and optimizes the technical solution. Specifically:

[0055] Step S21: Obtain the list of co-lay parts in the schematic document to obtain the first part document.

[0056] For a more detailed description of the processing steps in step S21, please refer to the aforementioned disclosed embodiments; they will not be repeated here.

[0057] Step S22: Execute the preset co-lay component inspection command to export the component name and corresponding center coordinates of the second co-lay component in the PCB design document.

[0058] In this embodiment, a preset co-lay component check instruction is executed. Specifically, the co-lay check module is clicked to begin the component information acquisition operation from the PCB design document. It should be noted that the implementation steps of the co-lay check module in the background are as follows: the names and center coordinates of all components in the PCB design document are exported and stored in different sheets. In other words, by exporting the component information of all components contained in the PCB design document, the names of the components and the center coordinates of the components are exported and stored in different sheets to obtain the component information of all components.

[0059] Step S23: Select the target worksheet and set the center coordinates of the second co-lay part in the target worksheet as the reference coordinates. Query the worksheets other than the target worksheet for coordinates that are the same as the reference coordinates and record the corresponding tag number. Concatenate the tag numbers to generate the second part document.

[0060] In this embodiment, using the center coordinates of a component in one sheet as a reference target, the VLOOKUP command is used to find the exact same coordinates in another sheet, and the corresponding tag number is recorded. This process is repeated to compare the coordinates of all components. It can be understood that by comparing the same coordinates in different sheets, the information of all components with the same center coordinates is determined. This allows the identification of the co-lay components designed in the PCB design document. By exporting the center coordinates of all components on the PCB, since the co-lay components have the same center coordinates, the VLOOKUP command can be used to obtain the tag numbers and corresponding coordinates with the same coordinates. Specifically, the tag numbers of co-lay components with the same center coordinates are recorded and saved to generate a second component document. Specifically, the tag numbers with the same coordinates in the PCB design document are concatenated with "-", and the document name of the second component document is recorded as "pcb_co-lay.txt". It should be noted that the component name of the co-lay component is the tag number.

[0061] Step S24: Store the first co-lay part information and the second co-lay part information separately in the same target table, and use the delete duplicate item instruction to delete the same co-lay part information in the first co-lay part information and the second co-lay part information.

[0062] In this embodiment, the obtained schematic page and the corresponding co-lay device name are stored in the following locations respectively. Figure 5Columns A and B, as shown, contain the co-lay component reference numbers and corresponding coordinates from the PCB design document obtained in step D. Figure 5 As shown in columns C and D, using the "Remove Duplicates" command below the table data, we can delete the identical information in columns B and C. The remaining information in column B then represents co-lay designs in the schematic that exceed the PCB requirements, while the remaining information in column C represents co-lay designs in the PCB that do not conform to the schematic requirements. For example, the data in the table shows that R1-R3, C123-C122, and PR12-PR43 in columns B and C are identical part names in both columns. Similarly, we should delete the identical part names in columns A (representing schematic page numbers 25, 30, and 120) and in column D (x1, y1), (x2, y2), and (x5, y5), as well as in columns B and C. It is important to note that the first and second part lists in both the schematic and PCB design documents must be recorded in the same format. By storing both part lists in a table and then using the table data to remove duplicates, we can obtain the inspection results.

[0063] Step S25: Extract the remaining co-lay part information from the first target part document and the second target part document respectively, and generate the co-lay part inspection result based on the remaining co-lay part information.

[0064] In this embodiment, the remaining part information is extracted from two target documents. Specifically, by opening the PCB design software, clicking the pre-embedded "colay check" module, and then clicking "colay check" again, a dialog box for the next level of human-computer interaction will be displayed. Follow the steps of selecting the storage path for the second part document, clicking "check," and then clicking "export." After the operation is completed, the information is extracted. Figure 5 Extract the remaining information in column B and the corresponding information in column A, then extract the remaining information in column C and the corresponding information in column D. This will yield the following: Figure 6 The inspection results include: the reference designators and coordinates of PCB design documents that do not meet the schematic co-lay design requirements, as well as the reference designators and corresponding schematic page numbers of the co-lays required in the schematic that are not designed in the PCB.

[0065] Therefore, by further developing the Cadence language, the co-lay component lists from the schematic and PCB design documents can be automatically obtained. These lists can then be copied to different columns in a table. Using the table's data function to remove duplicates, it's possible to quickly and accurately check whether the co-lay components in the schematic and PCB design documents completely correspond. Furthermore, it can also retrieve the reference designators and coordinates of co-lays in the PCB design document that do not meet the schematic requirements, as well as the reference designators and corresponding schematic page numbers for co-lays that are not designed in the PCB. This facilitates EE engineers and layout engineers in correcting and comparing the schematic and PCB designs.

[0066] Reference Figure 7 As shown, an embodiment of the present invention discloses a co-lay parts inspection device, comprising:

[0067] The document acquisition module 11 is used to acquire the list of co-lay parts in the schematic document and the corresponding PCB design document respectively, so as to obtain the first part document and the second part document; wherein, the first part document is the schematic co-lay part document and the second part document is the PCB design co-lay part document.

[0068] The information verification module 12 is used to compare and verify the first part document and the second part document, and delete the co-lay part information that matches the comparison in the first part document and the second part document to obtain the first target part document and the second target part document.

[0069] The parts inspection module 13 is used to generate co-lay parts inspection results based on the first target parts document and the second target parts document.

[0070] The document acquisition module 11 is specifically used to scan the schematic document, extract the first co-lay component information carrying the target component attribute, and generate a first component document in text format. It can be understood that by triggering the export co-lay document command, the background can be controlled to automatically scan the entire schematic document, extract all component names with the "CL" attribute, and present them as a first component document in txt format. Specifically, the CL attribute is the target component attribute. Co-lay refers to the design of two or more components with stacked pads in PCB design, but only one type is actually used in the final board. Simply put, a group of signal lines uses different components to achieve different functions or modes. A co-lay component is a component in the PCB design that performs different functions in the same location. A preset co-lay component check command is executed to export the second co-lay component information from the PCB design document and save the second component information in different worksheets; a second component document is generated based on the second component information. It can be understood that by clicking the button to start executing the preset co-lay component check command through the human-computer interaction interface, the corresponding operation is performed to obtain the second component document. Before scanning the schematic document, select the target part to be co-laid from the schematic document and add attributes to the target part to obtain the first co-lay part. It can be understood that the Cadence language is developed twice, creating the following three modules sequentially: a component selection module, a co-lay attribute addition module, and a co-lay document export module. Specifically, clicking the "Component Selection" module will automatically invoke the relevant skills, and then select the components to be co-laid in the schematic, as shown below. Figure 2 As shown, PC339, PC341, and PC343 will be selected by the box. Then, click the "Add Co-lay Attribute" module, and the software will automatically add the "CL" attribute to the selected parts. The attribute value is the concatenation of the part reference designator, such as "PC339-PC341-PC343". After all co-lay attributes of the schematic are added, click the "Export Co-lay Document" module, and the following will be generated in the root directory of the schematic: Figure 3The document shown is “sch_co-lay.txt”, which is also the first part document. This first part document specifically contains the page number of the part to be co-laid and the name of the co-lay part with the CL attribute. For example, the part information of the part to be co-laid designed in the current schematic is: R1-R3 on page 25, C123-C122 on page 30, PC229-PC341-PC343 on page 34, PR12-PR43 on page 120, etc.

[0071] The information verification module 12 is specifically used to compare and verify the acquired first part document and second part document. The comparison is to check whether the part information of the co-lay part to be co-laid and the co-lay part that has been PCB designed in the two documents are consistent. If they are consistent, it indicates that the co-lay part to be co-laid in the schematic diagram has been PCB designed. If they are inconsistent, there are two situations: First, the co-lay part to be co-laid in the schematic diagram cannot be found in the second part document, that is, the part information of the co-lay part to be co-laid appears in the first part document but not in the second part document. In this case, it indicates that the PCB design document corresponding to the second part document has not been PCB designed for the co-lay part to be co-laid. Second, the co-lay part designed in the PCB cannot be found in the first part document, and the part information of the co-lay part designed in the PCB design document appears in the second part document but not in the first part document. In this case, it indicates that the schematic document corresponding to the first part document is missing part information of the designed co-lay part, such as the schematic page number where the part is located and the part name. Next, the identical part information generated after the comparison and verification is deleted from both part documents to obtain a first target part document and a second target part document that do not contain identical part information. A fixed attribute is quickly added to the components that need co-laying using the skill language, and then all components with this attribute can be identified through a traversal search method.

[0072] Therefore, this application discloses obtaining the list of co-lay components from the schematic diagram document and the corresponding PCB design document to obtain a first component document and a second component document; wherein, the first component document is a schematic co-lay component document, and the second component document is a PCB design co-lay component document; the first component document and the second component document are compared and verified, and co-lay component information that matches in the comparison is deleted to obtain a first target component document and a second target component document; a co-lay component inspection result is generated based on the first target component document and the second target component document. As can be seen, by separately obtaining the co-lay component list corresponding to the schematic document and the co-lay component list corresponding to the PCB design document, and comparing and verifying the obtained component lists, the comparison instructions in the table are used to obtain the component information that matches between the two component lists. The matching component information indicates that the component corresponding to the component information meets the current inspection requirements. The matching component information in the two component lists is removed, and the remaining component information is organized into two component documents. The component information contained in these component documents is the component information corresponding to the component that does not meet the inspection requirements. Thus, the inspection of co-lay components can be completed in the above way, avoiding inspection errors caused by human error such as omission or misreading, and reducing the time cost of manual inspection.

[0073] In some specific embodiments, the document acquisition module 11 may specifically include:

[0074] The document generation submodule is used to scan the schematic document, extract the first co-lay part information carrying the target part attributes, and generate the first part document according to the first co-lay part information in text format.

[0075] Execute the preset co-lay component inspection command, export the second co-lay component information from the PCB design document, and save the second component information in different worksheets; generate the second component document based on the second component information.

[0076] In some specific embodiments, the co-lay parts inspection device may specifically include:

[0077] The attribute adding unit is used to select the target part to be co-lay from the schematic document, add attributes to the target part, and obtain the first co-lay part.

[0078] In some specific implementations, the document generation submodule may specifically include:

[0079] The first information acquisition unit is used to execute a preset co-lay component inspection command and export the component name and corresponding center coordinates of the second co-lay component in the PCB design document.

[0080] In some specific implementations, the document generation submodule may specifically include:

[0081] The second information acquisition unit is used to select a target worksheet, set the center coordinates of the second co-lay part in the target worksheet as the reference coordinates, query coordinates that are the same as the reference coordinates from worksheets other than the target worksheet, and record the tag number corresponding to the coordinates;

[0082] The reference numbers are concatenated to generate a second part document.

[0083] In some specific embodiments, the information verification module 12 may specifically include:

[0084] The information on the first and second co-lay parts is stored separately in the same target table. The duplicate co-lay parts information in the first and second co-lay parts information is deleted using the duplicate deletion instruction.

[0085] In some specific embodiments, the parts inspection module 13 may specifically include:

[0086] Extract the remaining co-lay part information from the first target part document and the second target part document respectively, and generate the co-lay part inspection result based on the remaining co-lay part information.

[0087] Furthermore, embodiments of this application also disclose an electronic device, Figure 8 This is a structural diagram of an electronic device 20 according to an exemplary embodiment. The content of the diagram should not be construed as limiting the scope of this application.

[0088] Figure 8 This is a schematic diagram of the structure of an electronic device 20 provided in an embodiment of this application. Specifically, the electronic device 20 may include: at least one processor 21, at least one memory 22, a power supply 23, a communication interface 24, an input / output interface 25, and a communication bus 26. The memory 22 stores a computer program, which is loaded and executed by the processor 21 to implement the relevant steps in the co-lay part inspection method disclosed in any of the foregoing embodiments. Alternatively, the electronic device 20 in this embodiment may specifically be an electronic computer.

[0089] In this embodiment, the power supply 23 is used to provide operating voltage for each hardware device on the electronic device 20; the communication interface 24 can create a data transmission channel between the electronic device 20 and external devices, and the communication protocol it follows can be any communication protocol applicable to the technical solution of this application, and is not specifically limited here; the input / output interface 25 is used to acquire external input data or output data to the outside world, and its specific interface type can be selected according to specific application needs, and is not specifically limited here.

[0090] The processor 21 may include one or more processing cores, such as a quad-core processor or an octa-core processor. The processor 21 may be implemented using at least one hardware form selected from DSP (Digital Signal Processing), FPGA (Field-Programmable Gate Array), and PLA (Programmable Logic Array). The processor 21 may also include a main processor and a coprocessor. The main processor, also known as a CPU (Central Processing Unit), is used to process data in the wake-up state; the coprocessor is a low-power processor used to process data in the standby state. In some embodiments, the processor 21 may integrate a GPU (Graphics Processing Unit), which is responsible for rendering and drawing the content to be displayed on the screen. In some embodiments, the processor 21 may also include an AI (Artificial Intelligence) processor, which is used to handle computational operations related to machine learning.

[0091] In addition, the memory 22, as a carrier for resource storage, can be a read-only memory, random access memory, disk or optical disk, etc. The resources stored thereon can include operating system 221, computer program 222, etc., and the storage method can be temporary storage or permanent storage.

[0092] The operating system 221 manages and controls the various hardware devices and computer programs 222 on the electronic device 20 to enable the processor 21 to perform calculations and processing on the massive amounts of data 223 in the memory 22. The operating system 221 can be Windows Server, Netware, Unix, Linux, etc. The computer program 222, in addition to including a computer program capable of performing the co-lay component inspection method executed by the electronic device 20 as disclosed in any of the foregoing embodiments, may further include computer programs capable of performing other specific tasks. The data 223 may include data received by the electronic device from external devices, as well as data collected by its own input / output interface 25.

[0093] Furthermore, this application also discloses a computer-readable storage medium for storing a computer program; wherein, when the computer program is executed by a processor, it implements the aforementioned co-lay part inspection method. Specific steps of this method can be found in the corresponding content disclosed in the foregoing embodiments, and will not be repeated here.

[0094] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to in the method section.

[0095] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in connection with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can implement the described functions using different methods for each specific application, but such implementation should not be considered beyond the scope of this application. The steps of the methods or algorithms described in connection with the embodiments disclosed herein can be implemented directly in hardware, software modules executed by a processor, or a combination of both. Software modules can be located in random access memory (RAM), main memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disks, removable disks, CD-ROMs, or any other form of storage medium known in the art.

[0096] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0097] The foregoing has provided a detailed description of a method, apparatus, device, and medium for inspecting co-lay parts provided by the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A method for inspecting co-lay parts, characterized in that, include: Obtain the co-lay component lists from the schematic document and the corresponding PCB design document respectively to obtain the first component document and the second component document; wherein, the first component document is the schematic co-lay component document and the second component document is the PCB design co-lay component document; The first part document and the second part document are compared and verified, and the co-lay part information that matches in the comparison is deleted to obtain the first target part document and the second target part document. Generate co-lay part inspection results based on the first target part document and the second target part document; The step of obtaining the co-lay component lists from the schematic document and the corresponding PCB design document to obtain the first component document and the second component document includes: Scan the schematic document, extract the first co-lay part information carrying the target part attributes, and generate the first part document from the first co-lay part information in text format. Execute the preset co-lay component inspection command, export the second co-lay component information from the PCB design document, and save the second co-lay component information in different worksheets; generate the second component document based on the second co-lay component information.

2. The method for inspecting co-lay parts according to claim 1, characterized in that, Before scanning the schematic document, the process also includes: Select the target part to be co-layed from the schematic document, add attributes to the target part to obtain the first co-lay part.

3. The method for inspecting co-lay parts according to claim 1, characterized in that, The step of executing the preset co-lay component inspection command and exporting the second co-lay component information from the PCB design document includes: Execute the preset co-lay component inspection command to export the component name and corresponding center coordinates of the second co-lay component in the PCB design document.

4. The method for inspecting co-lay parts according to claim 1, characterized in that, The second co-lay part information is saved in different worksheets; A second part document is generated based on the second co-lay part information, including: Select the target worksheet, and set the center coordinates of the second co-lay part in the target worksheet as the reference coordinates. Query the worksheets other than the target worksheet for coordinates that are the same as the reference coordinates, and record the tag number corresponding to the coordinates. The reference numbers are concatenated to generate a second part document.

5. The method for inspecting co-lay parts according to claim 1, characterized in that, The step of comparing and verifying the first part document and the second part document, and deleting co-lay part information that matches in the comparison between the first part document and the second part document, includes: The information on the first and second co-lay parts is stored separately in the same target table. The duplicate co-lay parts information in the first and second co-lay parts information is deleted using the duplicate deletion instruction.

6. The method for inspecting co-lay parts according to any one of claims 1 to 5, characterized in that, The generation of co-lay part inspection results based on the first target part document and the second target part document includes: Extract the remaining co-lay part information from the first target part document and the second target part document respectively, and generate the co-lay part inspection result based on the remaining co-lay part information.

7. A co-lay parts inspection device, characterized in that, include: The document acquisition module is used to acquire the list of co-lay parts in the schematic document and the corresponding PCB design document respectively, so as to obtain the first part document and the second part document; wherein, the first part document is the schematic co-lay part document and the second part document is the PCB design co-lay part document. The information verification module is used to compare and verify the first part document and the second part document, and delete the co-lay part information that matches the comparison in the first part document and the second part document to obtain the first target part document and the second target part document. The parts inspection module is used to generate co-lay parts inspection results based on the first target parts document and the second target parts document; The document acquisition module includes: The document generation submodule is used to scan the schematic document, extract the first co-lay part information carrying the target part attributes, and generate the first part document according to the first co-lay part information in text format. Execute the preset co-lay component inspection command, export the second co-lay component information from the PCB design document, and save the second co-lay component information in different worksheets; generate the second component document based on the second co-lay component information.

8. An electronic device, characterized in that, include: Memory, used to store computer programs; A processor for executing the computer program to implement the steps of the co-lay part inspection method as described in any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that, Used to store a computer program; wherein, when the computer program is executed by a processor, it implements the steps of the co-lay part inspection method as described in any one of claims 1 to 6.

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