Overtemperature detection device and projector system

Abstract

The present invention relates to an overtemperature detection device and a projector system, wherein a first temperature sensing module senses the internal temperature inside a light source module and outputs first temperature information based on the internal temperature, a second temperature sensing module senses the temperatures of multiple points outside the light source module and outputs second temperature information based on the temperatures of the points, and then a processing module determines whether the operating temperature of the projector equipment exceeds a safe temperature based on the first temperature information and each second temperature information. In this way, by combining the detection results of the temperature inside the light source module and the temperatures of multiple points outside the light source module, the influence of the ambient temperature on the determination result can be eliminated, thereby improving the accuracy of the determination result.

Description

Technical Field

[0001] The present invention relates to the technical field of projector control, and in particular to an over-temperature detection device and a projector system. Background Art

[0002] The projector consists of a light source module, a light engine, and a projection lens. Usually, a temperature sensor is installed inside the light source module. If the internal temperature exceeds a certain value, it is considered that the laser tube inside the light source module has exceeded the normal operating temperature. At this time, an alarm will be issued, and the power supply of the light source module will be cut off, and the projection will stop.

[0003] However, the temperature sensor is usually set at a certain distance from the laser tube. Due to the influence of the projector's geographical area and local climatic conditions, the internal temperature collected by the temperature sensor cannot truly reflect the temperature near the laser tube. For example, in areas with higher temperatures, even if the power is not turned on for projection, the temperature of the machine itself will exceed the preset value. Therefore, it is not accurate to use the test parameters of the internal temperature sensor as the basis for alarm.

[0004] One solution is to use cooling equipment with high temperature control accuracy and large cooling capacity to maintain the temperature inside the light source module and the temperature around the laser tube. However, this increases the cost of the cooling equipment. Another possible solution is to use the temperature around the laser tube as a reference standard. However, placing a temperature sensor around the laser tube takes up space inside the light source module, affecting the placement of optical components. The increased space occupied also leads to increased equipment costs. Moreover, due to the proximity of the laser beam, there is a possibility that the laser beam will damage the temperature sensor. Summary of the Invention

[0005] Based on this, it is necessary to provide a projector over-temperature detection device that can solve the misjudgment of the operating temperature of the laser tube in the projector caused by the influence of ambient temperature.

[0006] An overtemperature detection device, comprising:

[0007] a first temperature sensing module, configured to sense an internal temperature within the light source module and output first temperature information according to the internal temperature;

[0008] a second temperature sensing module, configured to sense the temperatures of a plurality of locations outside the light source module and output second temperature information according to the temperatures of the locations;

[0009] The processing module is connected to the first temperature sensing module and the second temperature sensing module respectively, and is used to determine whether the working temperature of the projector device exceeds a safe temperature according to the first temperature information and each second temperature information.

[0010] In one embodiment, the processing module is configured to:

[0011] determining whether the internal temperature of the light source module is abnormal according to the first temperature information;

[0012] determining whether the temperature of each of the location points is abnormal according to each of the second temperature information;

[0013] If the internal temperature is normal, and the temperature of at most one of the location points is abnormal or the temperatures of at least four of the location points are abnormal, it is determined that the operating temperature does not exceed the safety temperature.

[0014] In one embodiment, the processing module is further configured to:

[0015] determining whether the first temperature sensing module is abnormal according to the first temperature information;

[0016] If the first temperature sensing module operates abnormally and the temperature of at least one of the locations is abnormal, it is determined that the operating temperature exceeds the safety temperature.

[0017] In one embodiment, the processing module is further configured to:

[0018] If the temperatures of at least two of the locations are abnormal, it is determined that the operating temperature exceeds the safety temperature.

[0019] In one embodiment, the second temperature sensing module includes:

[0020] A plurality of sensing units are respectively connected to the processing modules, each of the sensing units is used to sense the temperature of each of the position points in a one-to-one correspondence, and each of the sensing units includes one of a temperature switch and a temperature sensor.

[0021] In one embodiment, the second temperature sensing module includes at least one temperature switch and at least one temperature sensor, the second temperature information includes a temperature value, at least one temperature sensor is connected to the processing module through the temperature switch, the temperature sensor is used to sense the temperature of a first position point and output the temperature value of the first position point, at least one temperature switch is used to sense the temperature of a second position point and output the temperature value to the processing module according to the temperature of the second position point; wherein the first position point and the second position point are any two of the multiple position points.

[0022] In one embodiment, the processing module is further configured to:

[0023] If the temperature value is received and is greater than the temperature threshold within a preset time period, the temperature at the first location is determined to be abnormal; if the temperature value is not received within the preset time period, the temperature at the second location is determined to be abnormal.

[0024] In one embodiment, the second temperature sensing module includes a temperature sensor, the second temperature information includes a temperature value, the temperature sensor is used to sense the temperature of the location point and output the temperature value to the processing module, and the processing module is further used to determine that the temperature of the location point is abnormal if the temperature value exceeds a temperature threshold within a preset time period.

[0025] In one embodiment, the second temperature sensing module includes a temperature switch, the second temperature information includes a current value, the temperature switch is used to sense the temperature of the location point and output the current value to the processing module, and the processing module is further used to determine that the temperature of the location point is abnormal if the current value is zero within a preset time period.

[0026] A projector system, characterized by comprising the over-temperature detection device; and

[0027] The projector device is connected to the processing module and is used to receive the determination result. If the determination result is that the operating temperature exceeds the safety temperature, the projector device enters a shutdown mode.

[0028] The above-mentioned over-temperature detection device senses the internal temperature inside the light source module through the first temperature sensing module and outputs first temperature information based on the internal temperature, and the second temperature sensing module senses the temperature of multiple position points outside the light source module and outputs second temperature information based on the temperature of the position points. Then, the processing module determines whether the operating temperature of the projector equipment exceeds the safe temperature based on the first temperature information and each second temperature information. In this way, by combining the detection results of the temperature inside the light source module and the temperature of multiple position points outside the light source module, the influence of the ambient temperature on the judgment result can be eliminated, thereby improving the accuracy of the judgment result. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 is a structural block diagram of an over-temperature detection device according to an embodiment;

[0031] Figure 2is a structural block diagram of an over-temperature detection device according to another embodiment;

[0032] Figure 3 is a structural block diagram of an over-temperature detection device according to another embodiment;

[0033] Figure 4 is a structural block diagram of an over-temperature detection device according to another embodiment;

[0034] Figure 5 is a structural block diagram of an over-temperature detection device according to another embodiment;

[0035] Figure 6 is a structural block diagram of an over-temperature detection device according to another embodiment;

[0036] Figure 7 is a structural block diagram of an over-temperature detection device according to another embodiment;

[0037] Figure 8 is a structural block diagram of an over-temperature detection device according to another embodiment;

[0038] Figure 9 is a structural schematic diagram of a light source module according to an embodiment;

[0039] Figure 10 is a structural block diagram of an over-temperature detection device according to another embodiment;

[0040] Figure 11 is a structural block diagram of an over-temperature detection device according to another embodiment;

[0041] Figure 12 is a structural block diagram of an over-temperature detection device according to another embodiment;

[0042] Figure 13 is a structural block diagram of an over-temperature detection device according to another embodiment;

[0043] Figure 14 is a structural block diagram of an over-temperature detection device according to another embodiment;

[0044] Figure 15 is a structural block diagram of an over-temperature detection device according to another embodiment;

[0045] Figure 16 FIG. 4 is a structural block diagram of an over-temperature detection device according to another embodiment. DETAILED DESCRIPTION

[0046] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings provide embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0048] It is understood that the terms "first," "second," etc., used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, without departing from the scope of this application, first temperature information may be referred to as second temperature information, and similarly, second temperature information may be referred to as first temperature information. Both first temperature information and second temperature information are temperature information, but they are not the same temperature information.

[0049] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if there is transmission of electrical signals or data between the connected circuits, modules, units, etc.

[0050] As used herein, the singular forms "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include," "comprising," "having," and the like specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Furthermore, the term "and / or" as used in this specification includes any and all combinations of the relevant listed items.

[0051] Figure 1 FIG. 1 is a structural block diagram of an over-temperature detection device according to an embodiment of the present invention. Figure 1 As shown, the over-temperature detection device includes a first temperature sensing module 100, a second temperature sensing module 200 and a processing module 300. The first temperature sensing module 100 is used to sense the internal temperature inside the light source module and output first temperature information according to the internal temperature; the second temperature sensing module 200 is used to sense the temperature of multiple position points outside the light source module and output second temperature information according to the temperature of the position points; the processing module 300 is connected to the first temperature sensing module 100 and the second temperature sensing module 200 respectively, and is used to determine whether the operating temperature of the projector equipment exceeds the safe temperature based on the first temperature information and each second temperature information.

[0052] Among them, the first temperature sensing module 100 may include a temperature sensor arranged inside the light source module, and the first temperature information may be the temperature value output by the temperature sensor; the first temperature sensing module 100 may also include a temperature switch, and the first temperature information may be a current value. When the temperature does not exceed the set temperature, the contacts of the temperature switch are closed and a current value other than 0 is output to the outside; when the temperature exceeds the set temperature, the contacts are disconnected, and the current value received by the processing module 300 is 0.

[0053] The second temperature sensing module 200 may include multiple sensing units, each of which may include a temperature sensor or a temperature switch, to respectively sense the temperature of multiple locations and obtain second temperature information representing the temperature conditions at each location. The second temperature sensing module 200 may include multiple temperature sensors, in which case the second temperature information is a temperature value; or the second temperature sensing module may include multiple temperature switches, in which case the second temperature information is a current value; or the second temperature sensing module may include both a temperature sensor and a temperature switch, in which case the second temperature information may be a temperature value or a current value.

[0054] The overtemperature detection device of the embodiment of the present invention can eliminate the influence of the ambient temperature on the determination result by combining the detection results of the temperature inside the light source module and the temperatures at multiple locations outside the light source module, thereby improving the accuracy of the determination result.

[0055] In one embodiment, the number of location points may be at least four, and the distance between each location point may be greater than a distance threshold.

[0056] The number of location points can be set as needed. For example, to improve detection accuracy, as many location points as possible can be set. Setting the distance between each location point to be greater than the distance threshold can increase the sensing range and prevent the influence of unclear temperature differences in adjacent areas on the judgment result, thereby improving detection accuracy.

[0057] In one embodiment, the processing module 300 can be used to determine whether the internal temperature of the light source module is abnormal based on the first temperature information; and determine whether the temperature of each position point is abnormal based on each second temperature information; if the internal temperature is normal, and the temperature of at most one position point is abnormal or the temperature of at least four position points is abnormal, it is determined that the operating temperature does not exceed the safe temperature.

[0058] In one embodiment, the first temperature information may be a temperature value, the first temperature sensing module 100 may include a temperature sensor, and the processing module 300 may determine whether the internal temperature of the light source module is abnormal based on the temperature value. For example, if the temperature value within a preset time exceeds a set temperature threshold, the internal temperature of the light source module is determined to be abnormal.

[0059] In one embodiment, the first temperature information may be a current value, the first temperature sensing module 100 may include a temperature switch, and the processing module 300 may determine whether the internal temperature of the light source module is abnormal based on the current value output by the temperature switch. For example, if the current value within a preset time period is 0, it is determined that the internal temperature of the light source module is abnormal.

[0060] It can be understood that if the internal temperature is normal and the temperature of at most one location point is abnormal, this may be a situation of local high temperature in the light source module. Since a cooling device is provided in the light source module, the local temperature will return to normal after the cooling device has worked for a period of time. Therefore, it can be determined that the working temperature of the projector equipment has not exceeded the safe temperature; when the internal temperature is normal and the temperatures of at least four locations point are abnormal, it indicates that the second temperature information sensed by the second temperature sensing module 200 is affected by the external ambient temperature, and the first temperature information sensed by the first temperature sensing module 100 can be used to reflect the working temperature of the projector equipment, that is, the working temperature has not exceeded the safe temperature at this time.

[0061] Specifically, within a preset time period, if the internal temperature is normal and the temperature of at most one location is abnormal, it is determined that the operating temperature does not exceed the safe temperature.

[0062] Specifically, the preset time length may be no more than 1 minute, or no more than 5 minutes, or no more than 10 minutes. The specific preset time length may be selected according to actual needs, and is generally determined based on the cooling efficiency of the light source module.

[0063] Specifically, if the internal temperature is normal and the temperature at most one location is abnormal, the operating temperature is determined to be within the safe range. In one embodiment, if the temperature at one location is abnormal, the processing module is further configured to obtain temperature data for the location with the abnormal temperature within a first preset time range. If the temperatures at these locations within the first preset time range remain abnormal, or if the temperature data at these locations is on an upward trend, the operating temperature is determined to be above the safe range, and an abnormality alarm may be issued.

[0064] It can be understood that when the internal temperature is normal and only one position point has an abnormal temperature, in order to further determine whether this situation will affect the normal operation of the projector equipment, the temperature data of the position point with the abnormal temperature within the first preset time range can be continuously obtained from the current moment. If the temperature of the position point is still abnormal within the first preset time range, or the temperature of the position point is on an upward trend, it indicates that there may be light beam deviation, circuit board overload or cooling module failure, etc. In order to ensure the normal operation of the projector equipment, it can be determined that the operating temperature exceeds the safe temperature at this time, and an abnormal alarm can be issued at the same time.

[0065] Specifically, if the internal temperature is normal and the temperatures at at least four locations are abnormal, the processing module may be further configured to obtain and determine whether a warning condition has been triggered based on the internal temperature and / or the temperature of the location at which the temperature is abnormal within a second preset time range. If the warning condition is triggered, it is determined that the operating temperature has exceeded the safe temperature. The warning condition may be at least one of the following: the internal temperature does not remain normal within the second preset time range, the temperature of the location at which the temperature is abnormal continues to rise within the second preset time range, and the temperature of the location at which the temperature is abnormal decreases within the second preset time range. The specific warning condition may also be set based on actual needs, for example, it may be determined based on the cooling efficiency of the light source module.

[0066] In one embodiment, the processing module is further configured to determine whether the first temperature sensing module is abnormal based on the first temperature information; if the first temperature sensing module is operating abnormally and the temperature of at least one location point is abnormal, it is determined that the operating temperature exceeds the safe temperature.

[0067] It is understandable that when the first temperature sensing module 100 is malfunctioning and the temperature of at least one location is abnormal, it is possible that a fault has occurred in the laser tube. For example, a beam deviation has caused damage to the second temperature sensing module 200, or an abnormal current drive has caused the laser tube to operate at an excessively high current for a long time. Therefore, to ensure the safe use of the projector equipment, it can be determined that the operating temperature exceeds the safe temperature.

[0068] In one embodiment, the processing module 300 may determine whether the first temperature sensing module 100 is normal based on the first temperature information. For example, if the first temperature information shows irregular and large fluctuations, the first temperature sensing module 100 may be determined to be abnormal.

[0069] In one embodiment, the processing module is further configured to determine that the operating temperature exceeds the safe temperature if the temperatures of at least two locations are abnormal and the internal temperature is abnormal.

[0070] It can be understood that if the temperatures of at least two locations are abnormal and the internal temperature is abnormal, in order to ensure safe use of the projector equipment, it is determined that the operating temperature exceeds the safe temperature.

[0071] It should be noted that, in some cases, an abnormality occurs in the first temperature sensing module inside the light source module, which may mean that the detection data of the first temperature sensing module cannot be used, for example, the first temperature sensing module is disconnected, the detection data is abnormal, there is a lot of communication noise, etc. At this time, the first temperature sensing module inside the light source module is equivalent to being lost or not set, so it relies on other temperature detection means. Therefore, if the temperature of at least two position points is abnormal, and the internal temperature is abnormal, it is determined that the operating temperature exceeds the safe temperature. In one embodiment, the second temperature sensing module includes a plurality of sensing units, and the sensing units are respectively connected to the processing module, and each sensing unit is used to sense the temperature of each position point one by one, and each sensing unit includes one of a temperature switch and a temperature sensor.

[0072] In one embodiment, the sensing units are disposed on the same outer side of the light source module housing and are configured to sense the temperatures of multiple locations on the outer side of the light source module housing.

[0073] It can be understood that the structural diagram of the light source module can be as follows Figure 9 As shown, the housing may include multiple sides, and each sensing unit is arranged on the same outer side of the light source module housing, so as to sense the temperature of multiple position points on the outer side of the light source module housing (the circular filled area in the figure). In this way, multiple positions of the side can be covered to determine the temperature conditions of each position of the side, and each sensing unit is generally connected to the processing module 300 through a line. By sensing the temperature of the position points on the same side, the wiring of the sensing unit and the processing module 300 can be facilitated.

[0074] In one embodiment, the number of sensing units may be at least four.

[0075] In one embodiment, the second temperature sensing module 200 includes at least one temperature switch 201 and at least one temperature sensor 202, the second temperature information includes a temperature value, at least one temperature sensor 202 is connected to the processing module through the temperature switch, the temperature sensor is used to sense the temperature of the first position point and output the temperature value of the first position point, at least one temperature switch 201 is used to sense the temperature of the second position point and output the temperature value to the processing module 300 according to the temperature of the second position point; wherein the first position point and the second position point are any two of the multiple position points.

[0076] It is understood that in one embodiment, Figure 2 As shown, the second temperature sensing module 200 may include a temperature sensor 202 and a temperature switch 201, wherein the number of the temperature sensors 202 and the temperature switches 201 is the same, and each temperature switch 201 includes a first end and a second end, each first end is connected to each temperature sensor 202 in a one-to-one correspondence, and each second end is connected to the processing module 300; in one embodiment, as Figure 3As shown, the second temperature sensing module 200 may include multiple temperature sensors 202, each temperature sensor 202 is connected to the processing module 300, wherein the number of the second temperature sensors 202 is at least 4; in one embodiment, as shown Figure 4 As shown, the second temperature sensing module 200 may include a plurality of temperature switches 201, each temperature switch 201 is connected to the processing module 300; in one embodiment, as shown in FIG. Figure 5 As shown, the second temperature sensing module 200 may include multiple temperature sensors 201 and at least one temperature switch 201, wherein each temperature switch is connected to a temperature sensor in a one-to-one correspondence, each temperature switch 201 includes a first end and a second end, each first end is connected to a temperature sensor 202 in a one-to-one correspondence, and each second end is connected to the processing module 300. The number of temperature sensors 202 is greater than the number of temperature switches. Except for the temperature sensor 202 connected to the temperature switch 201, the remaining temperature sensors 202 are connected to the processing module 300 respectively; in one embodiment, as shown in FIG. Figure 6 As shown, the second temperature sensing module 200 may include at least one temperature sensor 202 and a plurality of temperature switches 201, wherein the number of temperature sensors 202 is less than the number of temperature switches 201, and at least one temperature switch 201 includes a first end and a second end, each first end is connected to each temperature sensor 202 in a one-to-one correspondence, and each second end is connected to the processing module 300. Except for the temperature switch 201 connected to the temperature sensor 202, the remaining temperature switches 201 are connected to the processing module 300 respectively; in one embodiment, as shown in FIG. Figure 7 As shown, the second temperature sensing module 200 may include at least one temperature sensor 202 and at least one temperature switch 201, each temperature sensor 202 and each temperature switch 201 being connected to the processing module 300. In one embodiment, the second temperature sensing module 200 may include multiple temperature sensors 202 and multiple temperature switches 201, wherein at least one temperature sensor 202 is connected to the processing module via the temperature switch 201, and the remaining temperature switches 201 are connected to the processing module except for the temperature switch 201 connected to the temperature sensor 202. Specifically, when the temperature sensor 202 is connected to the processing module via the temperature switch 201, the temperature switch 201 includes a first end and a second end, wherein the first end is connected to the temperature sensor 202 and the second end is connected to the processing module 300.

[0077] For details, please refer to Figures 2 to 8When the temperature sensor is connected to the processing module via a temperature switch, the second temperature information may include a temperature value. The temperature sensor 202 is used to sense the temperature of a first location and output the temperature value of the first location. The temperature switch 201 is used to sense the temperature of a second location. If the temperature of the second location is less than a set threshold, the temperature value is received and output to the processing module 300. The first location and the second location are any two of the multiple locations.

[0078] The processing module is also used to determine that the temperature of the first position point is abnormal if a temperature value is received and the temperature value is greater than the temperature threshold within a preset time period; if no temperature value is received within the preset time period, the temperature of the second position point is determined to be abnormal. It can be understood that for a single first position point, if the temperature value of the first position point exceeds the temperature threshold within a preset time period, it indicates that the temperature of the first position point exceeds the temperature threshold. At this time, the processing module 300 can determine that the temperature of the first position point is abnormal; if the first temperature value is not received within the preset time period, it indicates that the temperature switch 201 is disconnected and the temperature of the second position point exceeds the set threshold of the temperature switch. At this time, the temperature of the second position point can be determined to be abnormal. The temperature threshold can be 40°C and the set threshold can be 45°C.

[0079] When the temperature sensor is directly connected to the processing module, the second temperature information may include a temperature value. The temperature sensor 202 can sense the temperature value of the location point and send it to the processing module 300. The processing module is also used to determine that the temperature of the location point is abnormal if the temperature value exceeds the temperature threshold within a preset time period.

[0080] When the temperature switch is connected to the processing module but not to the temperature sensor, the second temperature information may include a current value. The temperature switch 201 is used to sense the temperature of the location point and output the current value to the processing module 300. Since when the temperature of the location point sensed by the temperature switch exceeds the set threshold, the contacts of the temperature switch are disconnected and the output current value is 0 at this time, the processing module is also used to determine that the temperature of the location point is abnormal if the current value is 0 within a preset time period.

[0081] The preset time period can ensure that the temperature at the location point tends to a steady state.

[0082] Regarding the method of setting the temperature sensor 202 to be connected to the processing module 300 through the temperature switch 201, since the temperature sensor is a metal resistance temperature device and the temperature switch is a hot surface resistance temperature device, their temperature measurement principles are different. Setting the temperature sensor 202 to be indirectly connected to the processing module 300 through the temperature switch 201 can avoid the simultaneous failure of a single type of device. In addition, if the processing module 300 receives a temperature value, it indicates that the contacts of the temperature switch 201 are closed and the temperature of the second position point is less than the set threshold. At this time, the processing module 300 can determine that the temperature of the second position point is normal and can determine the temperature of the first position point based on the relationship between the temperature value and the temperature threshold. Conversely, if the processing module 300 does not receive a temperature value, it indicates that the contacts of the temperature switch 201 are disconnected, indicating that the temperature of the second position point is greater than the set threshold. At this time, it can be determined that the temperature of the second position point is abnormal. This increases the flexibility of the line connection and can realize the abnormality determination of the first position point and the second position point.

[0083] In one embodiment, the overtemperature detection device may further include multiple signal preprocessing modules. The sensing unit is connected to the processing module via the signal preprocessing module 401 . The signal preprocessing module 401 is used to perform noise reduction or amplification processing on the second temperature information.

[0084] by Figure 8 In the embodiment, the second temperature sensing module includes a temperature switch and a temperature sensor. For example, when a signal preprocessing module 401 is provided, the specific structural block diagram of the over-temperature detection device is as follows: Figure 10 It should be understood that Figure 10 The specific structural block diagram of the over-temperature detection device is only schematically listed when the signal pre-processing module 401 is provided between all temperature switches and the processing module. In fact, according to the specific structure of the second temperature sensing module 200, Figures 2 to 8 The over-temperature detection device in the embodiment may be provided with at least one signal pre-processing module 401 .

[0085] The processing module 300 can drive the signal preprocessing module 401 to amplify or reduce noise on the second temperature information based on the temperature value. For example, if the second temperature information received by the processing module 300 has large signal fluctuations due to a large number of errors, the signal preprocessing module 301 can be controlled to reduce noise. If the signal received by the processing module 300 has a large amount of loss, the signal preprocessing module 301 can be controlled to amplify.

[0086] In one embodiment, the signal preprocessing module 401 may include an amplifying unit, a noise reduction unit and a switching unit. The amplifying unit and the noise reduction unit are respectively connected to the processing module 300. The switching unit is respectively connected to the amplifying unit, the noise reduction unit and the temperature switch 201. The switching unit is used to conduct a conductive path between the temperature switch 201 and the amplifying unit or between the temperature switch 201 and the noise reduction unit.

[0087] The amplifying unit is used to amplify the second temperature information, the noise reduction unit is used to reduce the noise of the second temperature information, and the switching unit is used to select whether to turn on the amplifying unit or the noise reduction unit. The amplifying unit may include an operational amplifier.

[0088] In one embodiment, the signal preprocessing module 401 may further include an analog-to-digital conversion unit, which is connected to the amplification unit, the noise reduction unit and the processing module 300 respectively, and is used to perform analog-to-digital conversion on the amplified or noise-reduced second temperature information.

[0089] In one embodiment, Figure 11 As shown, the overtemperature detection device may further include a scheduling module 500, which is connected to the first temperature sensing module 100, the second temperature sensing module 200 and the processing module 300 respectively, and is used to schedule the transmission of the first temperature information and the second temperature information.

[0090] It can be understood that the scheduling module 500 can coordinate the data transmission of the first temperature sensing module 100 and the second temperature sensing module 200 to avoid data congestion and high computing pressure on the processing module 300.

[0091] The scheduling module 500 may also add time stamps to the first temperature information and the second temperature information for subsequent analysis.

[0092] In one embodiment, the over-temperature detection device may further include a data communication module 600, such as Figure 12 As shown, the data communication module 600 is respectively connected to the first temperature sensing module 100, the second temperature sensing module 200, the processing module 300 and the central processing module or power module of the projector device, and is used to transmit the first temperature information and the second temperature information to the processing module 300; the processing module 300 is also used to send the judgment result to the central processing module or power module of the projector device through the data communication module 600 to instruct the projector device to disconnect the power.

[0093] The data communication module 600 can be connected to the first temperature sensing module 100 and the second temperature sensing module 200 through the scheduling module 500 to schedule the transmission of the first temperature information and the second temperature information through the scheduling module 500, such as Figure 13 shown.

[0094] In one embodiment, the overtemperature detection device may also include a storage module 700, which is respectively connected to the first temperature sensing module 100, the second temperature sensing module 200 and the processing module 300. The storage module 700 is used to receive and store the first temperature information output by the first temperature sensing module 100 and the second temperature information output by the second temperature sensing module 200, and is also used to store the temperature threshold and the set threshold, and transmit them to the processing module 300.

[0095] The storage module 700 can also be connected to the first temperature sensing module 100 and the second temperature sensing module 200 through the scheduling module 500, such as Figure 13 shown.

[0096] In one embodiment, Figure 14 As shown, the scheduling module 500 can be connected to the first temperature sensing module 100, the signal preprocessing module 401, the data communication module 600 and the storage module 700 respectively, and is used to schedule the transmission of the first temperature information, temperature value and current value to the data communication module 600 and the storage module 700. The data communication module 600 is also used to transmit the first temperature information, temperature value and current value to the processing module 300, and the storage module 700 is also used to store the first temperature information, temperature value and current value.

[0097] In one embodiment, interface modules (not shown) are respectively provided between the scheduling module 500 and the first temperature sensing module 100 and the signal preprocessing module 401 to establish connections through the interface modules.

[0098] An embodiment of the present invention further provides a projector system comprising an overtemperature detection device according to any of the above embodiments and a projector. The projector is connected to a processing module for receiving a determination result. If the determination result indicates that the operating temperature exceeds a safe temperature, the projector enters a shutdown mode. This allows the projector to be shut down promptly when a temperature abnormality occurs, preventing damage to the projector due to excessive temperatures.

[0099] The projector system of the embodiment of the present invention includes the over-temperature detection device of the above embodiment. Its beneficial effects can be referred to the above embodiment of the over-temperature detection device, which will not be described in detail here.

[0100] In one embodiment, the projector device may include a power supply module and a central control module, such as Figure 15As shown, the central control module can be connected to the power module and the processing module, respectively, to receive the processing module's determination result. If the determination result indicates that the operating temperature exceeds the safe range, the central control module controls the power module to stop supplying power to the projector device, thereby causing the projector device to enter shutdown mode. In one embodiment, the processing module and the central control module are the same module, thus integrating temperature determination and projection control, reducing component costs. If the data communication module 600 fails, it can be replaced independently without adjusting the processing module 300.

[0101] In one embodiment, when the data communication module 600 is included, the central control module 800 may be connected to the data communication module 600 to receive the first temperature information, the second temperature information and the determination result.

[0102] The central control module 800 may be a single chip microcomputer (eg, ST series chip, SST series chip, STC series chip, etc.), a CPU, an EROM, or other chips with computing and processing functions.

[0103] In one embodiment, the projector device may include a power module such as Figure 16 As shown, the power module 801 is connected to the processing module and is configured to receive a determination result. If the determination result indicates that the operating temperature exceeds a safe temperature, power to the projector device is stopped, causing the projector device to enter shutdown mode. Directly controlling the power module 801 through the processing module 300 can prevent a safety incident resulting from a failure of the central control module 800 and a power outage to the projector device. The power module 801 can be connected to the processing module via the data communication module 600. In one embodiment, the projector device may further include a central control module connected to the power module to control cooling and lighting of the projector device.

[0104] The power module 801 can be a constant current source or a constant voltage source, and the voltage value can be 24V or 12V.

[0105] Specific, combined Figures 15 and 16 The projector device may also include a light source module (not shown), a light engine (not shown), a cooling module 802 connected to the central control module 800, a light source current control module 803, a light intensity control module 804, and a communication module 805. The cooling module 802 is used to maintain the operating temperature of the laser tube of the light source module, the light source current control module 803 is used to control the current of the laser tube of the light source, the light intensity control module 804 is used to maintain the light intensity of the laser tube and the ratio of the RGB colors, and the communication module 805 is used for data communication between various modules and with other external modules. Typically, the projector device also has an interface module (not shown) connected to the communication module 805 to communicate with the outside world through the interface module.

[0106] The light source current control module 803 may be a control module including a processing chip, or a circuit capable of generating a constant current, etc., to ensure that the current required for the operation of the laser tube is provided.

[0107] Light intensity control module 804 can be connected to a light intensity sensor module (not shown) and, based on the sensor's test data, determine the corresponding laser tube's luminous intensity. This luminous intensity is then sent to central control module 800. Central control module 800 determines the operating current of each laser tube based on the laser tube's luminous intensity and controls light source current control module 803 to generate the corresponding operating current for each laser tube. Light intensity control module 805 can include a control module for a processing chip or other circuit structure that can be used to control a light intensity sensor.

[0108] The cooling module 802 may include a circulating water cooler, a semiconductor refrigeration plate or other cooling devices to cool the laser tube and maintain the temperature of the laser tube stable.

[0109] Throughout this specification, references to terms such as "some embodiments," "other embodiments," and "desired embodiments" indicate that a particular feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. Although these terms are used interchangeably throughout this specification, they do not necessarily refer to the same embodiment or example.

[0110] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0111] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. An over-temperature detection device, characterized in that: Applicable to projector equipment, including: a first temperature sensing module, configured to sense an internal temperature within the light source module and output first temperature information according to the internal temperature; a second temperature sensing module, configured to sense the temperatures of a plurality of locations outside the light source module and output second temperature information according to the temperatures of the locations; a processing module, connected to the first temperature sensing module and the second temperature sensing module respectively, for determining whether the operating temperature of the projector device exceeds a safe temperature based on the first temperature information and the second temperature information; The second temperature sensing module includes multiple temperature switches, and the second temperature information includes a current value. The temperature switch is used to sense the temperature of the location point and output the current value to the processing module. The processing module is also used to determine that the temperature of the location point is abnormal if the current value is zero within a preset time period.

2. The over-temperature detection device according to claim 1, characterized in that: The processing module is used for: determining whether the internal temperature of the light source module is abnormal according to the first temperature information; determining whether the temperature of each of the location points is abnormal according to each of the second temperature information; If the internal temperature is normal, and the temperature of at most one of the location points is abnormal or the temperatures of at least four of the location points are abnormal, it is determined that the operating temperature does not exceed the safety temperature.

3. The over-temperature detection device according to claim 2, characterized in that: The processing module is further configured to: determining whether the first temperature sensing module is abnormal according to the first temperature information; If the first temperature sensing module operates abnormally and the temperature of at least one of the locations is abnormal, it is determined that the operating temperature exceeds the safety temperature.

4. The over-temperature detection device according to claim 2, characterized in that: The processing module is also used to: If the temperatures of at least two of the location points are abnormal and the internal temperature is abnormal, it is determined that the operating temperature exceeds the safety temperature.

5. The over-temperature detection device according to claim 2, characterized in that: The second temperature sensing module includes: A plurality of sensing units are respectively connected to the processing modules, each of the sensing units is used to sense the temperature of each of the position points in a one-to-one correspondence, and each of the sensing units includes one of a temperature switch and a temperature sensor.

6. The over-temperature detection device according to claim 5, characterized in that: The second temperature sensing module includes at least one temperature switch and at least one temperature sensor. The second temperature information includes a temperature value. At least one temperature sensor is connected to the processing module through the temperature switch. The temperature sensor is used to sense the temperature of a first position point and output the temperature value of the first position point. At least one temperature switch is used to sense the temperature of a second position point and output the temperature value to the processing module according to the temperature of the second position point; wherein the first position point and the second position point are any two of the multiple position points.

7. The over-temperature detection device according to claim 6, characterized in that: The processing module is further configured to: If the temperature value is received and is greater than the temperature threshold within a preset time period, the temperature at the first location is determined to be abnormal; if the temperature value is not received within the preset time period, the temperature at the second location is determined to be abnormal.

8. The over-temperature detection device according to claim 5, characterized in that: The second temperature sensing module includes multiple temperature sensors, and the second temperature information includes a temperature value. The temperature sensor is used to sense the temperature of the location point and output the temperature value to the processing module. The processing module is also used to determine that the temperature of the location point is abnormal if the temperature value exceeds a temperature threshold within a preset time period.

9. The over-temperature detection device according to claim 1, characterized in that: The first temperature information is a temperature value. The first temperature sensing module includes a temperature sensor. The processing module determines whether the internal temperature of the light source module is abnormal according to the temperature value.

10. A projector system, characterized in that: An over-temperature detection device comprising the over-temperature detection device according to any one of claims 1 to 9; and The projector device is connected to the processing module and is used to receive the determination result. If the determination result is that the operating temperature exceeds the safety temperature, the projector device enters a shutdown mode.

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