A carbon membrane plate production process

By drilling positioning holes and adding a cleaning step to the second-generation carbon film board during the production process, the problem of multi-process errors was solved, and the processing accuracy and efficiency of the carbon film board were improved.

CN116113163BActive Publication Date: 2026-03-27HANGZHOU BAOLIN PRINTING CIRCUIT
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-03-10
Publication Date
2026-03-27

AI Technical Summary

Technical Problem

The existing carbon film tin-plated printed circuit board manufacturing process does not have a positioning reference datum on the substrate, which may cause errors between multiple processing steps and affect product quality.

Method used

Positioning holes are drilled on the second-generation board as positioning references, and a cleaning step is added between multi-level printing processes. The processing accuracy and efficiency are improved by using a nickel plating mechanism.

Benefits of technology

By using positioning holes, processing errors between multiple processes are reduced, improving the production quality of carbon film plates. Furthermore, the nickel plating mechanism enhances nickel plating efficiency, ensuring both processing precision and efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to the technical field of circuit boards, in particular to a carbon film plate production process, which comprises the following processing steps: S1: pretreatment: cutting a first generation plate according to the size of a design single plate from a whole material, and cleaning the first generation plate; S2: etching and film removing after line printing: printing lines on the cleaned first generation plate, checking the yield after the printing is completed, etching and removing the film to form a second generation plate after the first generation plate is qualified; S3: forming positioning holes: forming a third generation plate by punching at least two positioning holes on the second generation plate, and cleaning after the third generation plate is sandblasted; S4: multistage printing: forming a fourth generation plate by sequentially printing green oil, solder mask, characters and carbon film on the third generation plate; and S5: slotting after stamping the fourth generation plate, and then performing a function test after cleaning; the application has the effect that the positioning holes can be used as a reference datum for positioning by being arranged on the second generation plate, the processing error between multiple processes is reduced, and the production quality of the carbon film plate is improved.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board, in particular to a carbon film plate production process. BACKGROUND

[0002] Printed circuit is a conductive pattern printed on an insulating substrate according to a predetermined design, which is a printed wiring board, a printed component or a combination of both. The printed wiring board is a conductive pattern on an insulating substrate that provides electrical connection between components. The printed wiring board used in today's digital audio and video home appliance products and game products generally uses single-sided (carbon film) board, double-sided (carbon paste hole, silver paste hole, metal hole board) board.

[0003] The patent document with application number 201811065334.1 discloses a carbon film tin spraying printed circuit board preparation process, which comprises the following steps: pretreatment: before soldering and carbon film printing, the copper plate substrate is mechanically brushed and cleaned by a mechanical brushing and cleaning machine; preparing a printing screen: using a 220-mesh acrylic screen, coating 30um thick sealing screen glue; printing solder resist: printing ink on the printing screen; then printing the printing screen with printing ink on the copper plate substrate; after printing the copper plate substrate, the solder resist characters; curing and baking: the copper plate substrate is put into a seven-temperature-zone circulating hot air curing machine for curing; tin spraying: tin spraying is performed on the copper plate substrate, and cooling is performed after tin spraying.

[0004] According to the related technology in the above, the inventors believe that the designed carbon film tin spraying printed circuit board preparation process prints a primary layer of circuit on the substrate plate, and before performing operations such as solder resist printing, solder resist characters and tin spraying, a positioning reference datum is not set on the copper plate substrate, which may cause errors in processing between multiple processes and affect the quality of the carbon film plate product. SUMMARY

[0005] In order to improve the quality of the carbon film plate product, the present application provides a carbon film plate production process.

[0006] The carbon film plate production process provided by the present application adopts the following technical solution:

[0007] A carbon film plate production process comprises the following processing steps:

[0008] S1: pretreatment: cutting a whole material according to the design single board size to form a first generation plate, and cleaning the first generation plate:

[0009] S2: after line printing, etching and removing the film: after cleaning, the first generation plate is printed with lines, the yield is checked after printing, and the second generation plate is formed by etching and removing the film after passing the inspection;

[0010] S3: positioning hole forming: at least two positioning holes are punched on the second generation plate to form a third generation plate, and the third generation plate is cleaned after sanding.

[0011] S4: Multi-stage printing: green oil printing, solder mask printing, character printing and carbon film printing are sequentially performed on the third generation board to form a fourth generation board;

[0012] S5: After the fourth generation board is punched and grooved, it is cleaned and then functionally tested.

[0013] According to the above technical scheme, the material is taken from the warehouse according to the production plan, and then a plurality of first generation boards are obtained by cutting and blanking the whole material according to the designed single board size. The first generation board is cleaned, and then transferred to the next station for line printing. After the line printing is completed, the line printing condition is checked. If it is unqualified, the line printing is performed again until it is qualified. Then, an etching film removing process is performed to form a second generation board. At least two positioning holes are punched on the second generation board to form a third generation board. The periphery of the positioning hole on the third generation board is abraded and then cleaned. The cleaned third generation board is sequentially subjected to green oil printing, solder mask printing, character printing and carbon film printing to form a fourth generation board. The fourth generation board is punched and grooved, and then cleaned and functionally tested. If the functional test is qualified, it is packaged and stored in the warehouse. The designed carbon film board production process can use the positioning hole as a reference datum for positioning, reduce the error that may be generated between multiple processes, and thus improve the quality of the carbon film board.

[0014] In a specific implementation, the S1 step includes:

[0015] S11: blanking: the whole material is blanked according to the designed single board size to form a first generation board;

[0016] S12: nickel plating: the first generation board is subjected to nickel plating treatment to form a nickel plated board;

[0017] S13: cleaning: the nickel plated board is cleaned.

[0018] According to the above technical scheme, the designed S1 step can produce a nickel plated carbon film board.

[0019] In a specific implementation, the S4 step includes:

[0020] S41: green oil printing;

[0021] S42: cleaning;

[0022] S43: solder mask printing;

[0023] S44: cleaning;

[0024] S45: carbon film printing to form a fourth generation board.

[0025] By adopting the technical scheme, the S4 step is designed, a cleaning step is added after green oil printing and before carbon film printing, the influence between adjacent processes is reduced, and the product quality of the carbon film plate is improved.

[0026] In one specific implementation, the S12 step uses a nickel plating mechanism to assist nickel plating, and the nickel plating mechanism includes a nickel plating tank, a mounting rod, and a transposition assembly.

[0027] The mounting rod is horizontally arranged, and both ends of the long side of the mounting rod are connected with a containing tank for placing a generation plate.

[0028] The transposition assembly is installed on the nickel plating tank and is used to exchange the positions of the two containing tanks.

[0029] By adopting the technical scheme, the nickel-containing solution is added to the nickel plating tank, then a generation plate is filled in one containing tank, then the transposition assembly is used to move the containing tank filled with the generation plate into the nickel-containing solution in the nickel plating tank for nickel plating, at this time, the other containing tank is in the external environment, and the worker fills the generation plate in the other containing tank, after the generation plate in the nickel plating tank is plated with nickel, the positions of the two containing tanks are exchanged by the transposition assembly, the generation plate plated with nickel is taken out and refilled with a generation plate; the designed nickel plating mechanism facilitates the storage of the nickel plating solution through the nickel plating tank, facilitates the installation of the two containing tanks through the mounting rod, and facilitates the exchange of the positions of the two containing tanks through the transposition assembly, so that the worker can fill the generation plate in the other containing tank while the generation plate in one containing tank is plated with nickel, thereby improving the nickel plating efficiency of the generation plate.

[0030] In one specific implementation, the transposition assembly includes a forward-reverse motor, a lifting screw, a limiting cylinder, and a one-way control member.

[0031] The forward-reverse motor is axially vertically arranged, and the forward-reverse motor is connected with the nickel plating tank.

[0032] The lifting screw is coaxially connected with the output shaft of the forward-reverse motor, and the lifting screw is threadedly connected with the mounting rod.

[0033] The limiting cylinder is connected with the nickel plating tank, the limiting cylinder is sleeved on the lifting screw, a guide groove for the mounting rod to pass through is vertically formed in the limiting cylinder, and when the containing tank is located above the nickel plating tank, the mounting rod is located above the limiting cylinder.

[0034] The one-way control member is installed on the limiting cylinder and is used to make the mounting rod pass through the guide groove in one direction.

[0035] The external power supply provides power for the reversible motor, the output shaft of the reversible motor drives the lifting screw to rotate, the lifting screw and the limiting cylinder cooperate to make the mounting rod move along the opening direction of the guide groove until the mounting rod slides out of the guide groove, at this time the containing box is located above the nickel plating box, the lifting screw continues to rotate, since the mounting rod loses the limiting effect of the guide groove at this time, the mounting rod drives the two containing boxes to rotate around the lifting screw until the two containing boxes complete position exchange, then the output shaft of the reversible motor reverses, under the action of the one-way control piece, the mounting rod moves along the opening direction of the guide groove until one of the containing boxes is in the nickel plating solution in the nickel plating box; the designed transposition assembly is convenient for driving the lifting screw to rotate through the reversible motor, is convenient for driving the mounting rod to rotate through the lifting screw, and realizes the lifting action of the mounting rod by cooperating with the limiting cylinder, and is convenient for realizing the one-way rotation of the mounting rod through the one-way control piece, and then realizes the lifting of the mounting rod.

[0036] In one specific implementation, the one-way control piece includes a spring and a limiting block;

[0037] The limiting cylinder is provided with a containing cavity for accommodating the limiting block, one end of the spring is connected with the bottom wall of the containing cavity, and the other end is connected with the limiting block;

[0038] The limiting block slides along the opening direction of the containing cavity, the top wall of the limiting block is inclinedly arranged, and the side wall of the limiting block is flush with the side wall of the guide groove.

[0039] By adopting the above technical scheme, the designed one-way control piece is convenient for making the mounting rod rotate only in one direction through the spring and the limiting block, and then realizes the lifting of the mounting rod in cooperation with the reversible motor, the lifting screw and the limiting cylinder.

[0040] In one specific implementation, the limiting cylinder is circular in cross-sectional shape, and the limiting block is arc-shaped and matched with the limiting cylinder.

[0041] By adopting the above technical scheme, the designed limiting cylinder which is circular in cross-sectional shape can further facilitate the mounting rod to apply force to the limiting block.

[0042] In one specific implementation, the nickel plating box is provided with a liquid discharge pipe in communication, and the liquid discharge pipe is provided with a control valve.

[0043] By adopting the above technical scheme, the designed liquid discharge pipe and control valve can quickly discharge after the nickel plating solution in the nickel plating box is used up.

[0044] In summary, the present application has at least one of the following beneficial technical effects:

[0045] 1. The designed carbon film plate production process can use the positioning hole as a positioning reference by opening a positioning hole on the second generation plate, reduce the error that may be generated between multiple processes, and thus improve the quality of the carbon film plate product.

[0046] 2. The designed carbon film plate production process can store the nickel plating solution in the nickel plating box, install two containing boxes through the installation rod, and realize the position exchange of the two containing boxes through the transposition assembly, so that the worker can perform the loading work of the first generation plate on the other containing box while plating nickel on the first generation plate in one of the containing boxes, thereby improving the nickel plating efficiency of the first generation plate.

[0047] 3. The designed carbon film plate production process can drive the lifting screw to rotate through the forward and reverse motor, drive the installation rod to rotate through the lifting screw, realize the lifting action of the installation rod through the limiting cylinder, and realize the one-way rotation of the installation rod through the one-way control piece, thereby realizing the lifting of the installation rod. BRIEF DESCRIPTION OF DRAWINGS

[0048] Figure 1 is a two-dimensional structure schematic diagram of the carbon film plate production process of the embodiment of the present application.

[0049] Figure 2 is a three-dimensional structure schematic diagram of Figure 1 .

[0050] Figure 3 is an enlarged view of A in Figure 2 .

[0051] The reference signs are explained as follows: 1, nickel plating box; 2, installation rod; 3, transposition assembly; 31, forward and reverse motor; 32, lifting screw; 33, limiting cylinder; 331, guide groove; 332, containing cavity; 34, one-way control piece; 341, spring; 342, limiting block; 4, containing box; 5, liquid discharge pipe; 6, control valve. DETAILED DESCRIPTION

[0052] The present application will be further described in detail below with reference to the accompanying drawings. Figures 1-3 The present application will be further described in detail below with reference to the accompanying drawings.

[0053] The embodiment of the present application discloses a carbon film plate production process.

[0054] Referring to Figure 1 , a carbon film plate production process includes the following processing steps:

[0055] S1: Pretreatment: forming a first generation plate by cutting according to the designed single plate size from a whole material, and cleaning the first generation plate:

[0056] S11: Cutting: cutting according to the designed single plate size to form a first generation plate;

[0057] S12: Nickel plating: the first generation plate is subjected to nickel plating treatment to form a nickel plated plate;

[0058] S13: Cleaning: the nickel plated plate is cleaned;

[0059] S2: Etching after line printing: the first generation plate after cleaning is subjected to line printing, and after printing, the yield is checked, and after passing, etching is performed to form a second generation plate;

[0060] S3: Positioning hole forming: at least two positioning holes are punched on the second generation plate to form a third generation plate, and after sanding, the third generation plate is cleaned;

[0061] S4: Multi-stage printing: the third generation plate is subjected to green oil printing, solder mask printing, character printing and carbon film printing in sequence to form a fourth generation plate;

[0062] S41: Green oil printing;

[0063] S42: Cleaning;

[0064] S43: Solder mask printing;

[0065] S44: Cleaning;

[0066] S45: Carbon film printing to form a fourth generation plate;

[0067] S5: The fourth generation plate is subjected to stamping and slotting, and after cleaning, functional testing is performed.

[0068] Referring to Figure 1 and Figure 2 , the nickel plating mechanism is used to assist nickel plating in the S12 step, the nickel plating mechanism includes a nickel plating tank 1, a mounting rod 2 and a transposition assembly 3, the transposition assembly 3 includes a forward and reverse motor 31, a lifting screw 32, a limiting cylinder 33 and a one-way control member 34, the nickel plating tank 1 is provided with an opening at the top, the shaft of the forward and reverse motor 31 is perpendicular to the plane where the bottom wall of the nickel plating tank 1 is located, and the forward and reverse motor 31 is bolted to one side wall of the nickel plating tank 1. In order to facilitate the discharge of the nickel plating solution in the nickel plating tank 1, a drain pipe 5 is connected to the flange of the nickel plating tank 1, and a control valve 6 is provided on the drain pipe 5.

[0069] Referring to Figure 1 and Figure 2 , the lifting screw 32 is coaxially keyed connected to the output shaft of the forward and reverse motor 31, the limiting cylinder 33 has a circular cross-sectional shape, and the limiting cylinder 33 is coaxially sleeved on the lifting screw 32, the lower end of the limiting cylinder 33 is welded to the nickel plating tank 1, and a guide groove 331 for the mounting rod 2 to pass through is vertically provided on the limiting cylinder 33, the mounting rod 2 is horizontally provided, and the two ends of the mounting rod 2 that pass through the long edges of the guide groove 331 are connected to the containing box 4 for placing the first generation plate, when the containing box 4 is located above the nickel plating tank 1, the mounting rod 2 slides out of the guide groove 331 and is located above the limiting cylinder 33.

[0070] Referring to Figure 2 and Figure 3 In the embodiment, the number of the one-way control members 34 is two groups, and the two groups of the one-way control members 34 are respectively located at opposite sides of the guide groove 331. The one-way control member 34 comprises a spring 341 and a limiting block 342. The limiting cylinder 33 is provided with a containing cavity 332 for accommodating the limiting block 342. One end of the spring 341 is welded to the bottom wall of the containing cavity 332, and the other end is welded to the limiting block 342. The limiting block 342 moves along the axial direction of the limiting cylinder 33 in the containing cavity 332, and the limiting block 342 is in sliding connection with the limiting cylinder 33. The top wall of the limiting block 342 is obliquely arranged, and the side wall of the limiting block 342 is flush with the side wall of the guide groove 331.

[0071] The implementation principle of the carbon film plate production process in the embodiment is as follows: materials are taken from the warehouse according to the production plan, and then a plurality of first generation plates are obtained by cutting and discharging from the whole material according to the designed single plate size. Then, the first generation plates are subjected to nickel plating treatment by a nickel plating mechanism. When nickel plating, a nickel-containing solution is added to the nickel plating box 1, and the first generation plates are filled into a containing box 4. Then, an external power supply provides power for the forward and reverse motor 31, the output shaft of the forward and reverse motor 31 drives the lifting screw 32 to rotate, and the lifting screw 32 and the limiting cylinder 33 cooperate to make the mounting rod 2 move along the opening direction of the guide groove 331 until the mounting rod 2 slides out of the guide groove 331. At this time, the containing box 4 is located above the nickel plating box 1. The lifting screw 32 continues to rotate. Since the mounting rod 2 loses the limiting effect of the guide groove 331 at this time, the mounting rod 2 drives the two containing boxes 4 to rotate around the lifting screw 32 until the two containing boxes 4 complete the position exchange. Then, the output shaft of the forward and reverse motor 31 is reversed. Under the action of the one-way control member 34, the mounting rod 2 moves along the opening direction of the guide groove 331 until one of the containing boxes 4 is in the nickel plating solution in the nickel plating box 1. At this time, the other containing box 4 is in the external environment. The worker fills the containing box 4 with the first generation plates. After the first generation plates in the nickel plating box 1 are plated with nickel, the position exchange assembly 3 is used to realize the position exchange of the two containing boxes 4. The first generation plates plated with nickel are taken out, and the first generation plates are refilled.

[0072] The nickel-plated plates are cleaned, and the cleaned nickel-plated plates are transferred to the next station for line printing. After line printing, the line printing condition is checked. If it is unqualified, line printing is performed again until it is qualified. Then, a second generation plate is formed by etching and removing the film. Then, at least two positioning holes are punched on the second generation plate to form a third generation plate. The periphery of the positioning holes on the third generation plate is subjected to sanding treatment and then cleaned. The cleaned third generation plate is sequentially subjected to green oil printing, solder mask printing, character printing, and carbon film printing to form a fourth generation plate. The fourth generation plate is punched and grooved after cleaning, and then subjected to a function test. If the function test is qualified, the fourth generation plate is packaged and stored

[0073] The above are all preferred embodiments of the present application, and do not limit the protection scope of the present application, so that: all equivalent changes made according to the structure, shape, principle of the present application should be covered in the protection scope of the present application.

Claims

1. A carbon film plate manufacturing process, characterized in that: The processing steps include the following: S1: Pre-processing: Cutting the material from the whole sheet according to the design single board size to form the first-generation board, and cleaning the first-generation board; S11: Cutting: Cutting the whole material into one-piece boards according to the design board size; S12: Nickel plating: Nickel plating is performed on the first-generation plate to form a nickel-plated plate; In step S12, a nickel plating mechanism is used to assist in nickel plating. The nickel plating mechanism includes a nickel plating box (1), a mounting rod (2), and a switching assembly (3). The mounting rod (2) is set horizontally, and both ends of the long side of the mounting rod (2) are connected to a container (4) for placing the first-generation board; The transposition component (3) is installed on the nickel plating box (1) to interchange the positions of the two receiving boxes (4); The switching component (3) includes a forward and reverse motor (31), a lifting screw (32), a limiting cylinder (33), and a one-way control component (34); The forward and reverse motor (31) is vertically arranged in the axial direction, and the forward and reverse motor (31) is connected to the nickel plating box (1); The lifting screw (32) is coaxially connected to the output shaft of the forward and reverse motor (31), and the lifting screw (32) is threadedly connected to the mounting rod (2); The limiting cylinder (33) is connected to the nickel plating box (1). The limiting cylinder (33) is sleeved on the lifting screw (32). The limiting cylinder (33) has a vertical guide groove (331) for the mounting rod (2) to pass through. When the receiving box (4) is located above the nickel plating box (1), the mounting rod (2) is located above the limiting cylinder (33). The one-way control element (34) is installed on the limiting cylinder (33) to allow the mounting rod (2) to pass through the guide groove (331) in one direction. The one-way control element (34) includes a spring (341) and a limiting block (342); The limiting cylinder (33) has a receiving cavity (332) for accommodating the limiting block (342). One end of the spring (341) is connected to the bottom wall of the receiving cavity (332), and the other end is connected to the limiting block (342). The limiting block (342) slides along the opening direction of the receiving cavity (332), the top wall of the limiting block (342) is inclined, and the side wall of the limiting block (342) is flush with the side wall of the guide groove (331); S13: Cleaning: Clean the nickel-plated plate; S2: Etching and film removal after circuit printing: The first-generation board is printed with circuits after cleaning. After printing is completed, the yield is checked. If it passes the test, etching and film removal are performed to form the second-generation board. S3: Positioning hole forming: Drill at least two positioning holes on the second-generation board to form the third-generation board, and clean it after sanding; S4: Multi-level printing: The third-generation board is formed by sequentially performing green oil printing, solder resist printing, character printing and carbon film printing. S5: The fourth-generation board is stamped and grooved, and then cleaned before functional testing.

2. The carbon film plate production process according to claim 1, characterized in that: The S4 step includes: S41: Green oil printing; S42: Cleaning; S43: solder mask printing; S44: Cleaning; S45: Carbon film printing forms the fourth generation board.

3. The carbon film plate production process according to claim 1, characterized in that: The limiting cylinder (33) has a circular cross-sectional shape, and the limiting block (342) is an arc shape that is adapted to the limiting cylinder (33).

4. The carbon film plate production process according to claim 1, characterized in that: The nickel plating tank (1) is connected to a drain pipe (5), and a control valve (6) is provided on the drain pipe (5).

Citation Information

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