Micro-segment based laser cutting method and laser cutting method, control device

Abstract

The application provides a laser cutting method based on micro segments, which is applied to cutting of micro segments on a workpiece to be cut by a laser cutting head and comprises the following steps: positions of micro segments, a deceleration section and an acceleration section on the workpiece to be cut are acquired, wherein the deceleration section is characterized by a first preset distance from a starting point of the micro segments, and an end point of the deceleration section is the starting point of the micro segments; accelerations of the deceleration section and the acceleration section are determined; when the laser cutting head moves to the starting point of the deceleration section at a current cutting speed, the laser cutting head is controlled to enter a deceleration cutting mode; when the laser cutting head moves to the starting point of the micro segments at the first cutting speed, the laser cutting head is controlled to enter a micro segment cutting mode; and when the laser cutting head moves to the starting point of the acceleration section at the first cutting speed, the laser cutting head is controlled to enter an acceleration cutting mode.

Description

Technical Field

[0001] This invention relates to the field of laser cutting, and more particularly to a laser cutting method based on micro-segments, as well as a laser cutting method and control device. Background Technology

[0002] In the field of laser processing, the thermal stress on materials can cause warping during processing; furthermore, cut parts may warp if they cannot fall through the gaps in the support bars or be supported by them. Due to these risks, users must constantly monitor the machine during processing, increasing labor costs for the factory. Current common solutions result in lower processing efficiency and poorer processing quality.

[0003] The current common method to solve the problem of material warping is to add micro-segments along the machining path of the part. Specifically, when machining the micro-segments of the part, no laser is used, so that the part is not completely cut off, thus avoiding the part falling off and warping.

[0004] However, the above solutions have three major limitations. First, they burn the cutting surface, forming a crack that affects the cutting effect of the parts. Second, when cutting thick plates, the material needs to be re-drilled at the end of the micro-connector, which affects the processing efficiency. Third, after using the micro-connector, it is difficult to manually break the micro-connector later, and it often requires the use of argon arc welding or grinding with a grinding wheel, which is time-consuming and labor-intensive. Summary of the Invention

[0005] This invention provides a laser cutting method based on micro-connections, as well as a laser cutting method, control device, electronic device, and storage medium to solve the problems of workpiece warping and difficulty in disconnection at micro-connections.

[0006] According to a first aspect of the present invention, a laser cutting method based on micro-segments is provided, applied to the cutting of micro-segments on a workpiece by a laser cutting head, comprising:

[0007] The positions of the micro-connecting segment, deceleration segment, and acceleration segment on the workpiece to be cut are obtained, wherein the deceleration segment is characterized by a first preset distance before the starting point of the micro-connecting segment, and the ending point of the deceleration segment is the starting point of the micro-connecting segment; the acceleration segment is characterized by a second preset distance after the ending point of the micro-connecting segment, and the starting point of the acceleration segment is the ending point of the micro-connecting segment.

[0008] Determine the acceleration of the deceleration phase and the acceleration phase;

[0009] When the laser cutting head moves to the starting point of the deceleration section at the current cutting speed, the laser cutting head is controlled to enter the deceleration cutting mode; wherein, the deceleration cutting mode is used to reduce the current cutting speed to a first cutting speed during the cutting of the deceleration section;

[0010] When the laser cutting head moves to the starting point of the micro-connection segment at the first cutting speed, the laser cutting head is controlled to enter the micro-connection cutting mode; wherein, the micro-connection cutting mode is used to cut the micro-connection segment at the first cutting speed at all times;

[0011] When the laser cutting head moves to the starting point of the acceleration section at the first cutting speed, the laser cutting head is controlled to enter the acceleration cutting mode; wherein, the acceleration cutting mode is used to accelerate the first cutting speed to the second cutting speed during the cutting of the acceleration section.

[0012] Optionally, determining the acceleration of the deceleration phase includes:

[0013] Determine the current cutting speed of the laser cutting head;

[0014] The acceleration of the deceleration phase is determined based on the current cutting speed, the first cutting speed, and the first preset distance.

[0015] Optionally, determining the acceleration of the deceleration phase further includes:

[0016] When the acceleration of the deceleration phase is greater than the preset acceleration, the laser cutting head is controlled to decelerate to the end of the deceleration phase at the preset acceleration.

[0017] When the acceleration of the deceleration phase is below the preset acceleration, the laser cutting head is controlled to move to the end of the deceleration phase at that acceleration.

[0018] Optionally, before obtaining the positions of the micro-connecting segments, deceleration segments, and acceleration segments on the workpiece to be cut, the method further includes:

[0019] The laser cutting head is controlled to cut the workpiece at the current cutting speed, and it is determined whether the micro-connection exists on the current cutting trajectory of the workpiece. If it does, the position of the micro-connection is obtained; if not, the workpiece is cut at the current cutting speed.

[0020] Optionally, before controlling the laser cutting head to cut the workpiece at the current cutting speed and determining whether the micro-connection exists on the current cutting trajectory of the workpiece, the method further includes:

[0021] The position of the micro-connecting segment is determined based on the length and thickness of the workpiece to be cut;

[0022] Based on the position of the micro-connector, the positions of the acceleration segment and the deceleration segment are determined.

[0023] Optionally, the parameters of the laser cutting mode include: cutting speed, cutting length, filtering frequency band, light output frequency, and duty cycle; the parameters of the micro-connection cutting mode also include: root retention ratio and speed ratio.

[0024] According to a second aspect of the present invention, a laser cutting method is provided, the method comprising:

[0025] Obtain the positions of all micro-connections on the workpiece to be cut;

[0026] In real time, it is determined whether there are micro-connections on the current cutting trajectory of the workpiece to be cut; if so, the corresponding micro-connections are cut using the first aspect and the optional laser cutting method based on micro-connections; if not, cutting continues with the current cutting trajectory; and this step is repeated until the cutting of the workpiece to be cut is completed.

[0027] According to a third aspect of the present invention, a laser cutting control device based on micro-segments is provided, comprising: a first acquisition module, an acceleration determination module, a deceleration cutting module, a micro-segment cutting module, and an acceleration cutting module;

[0028] The first acquisition module is used to acquire the positions of the micro-connection segment, the deceleration segment, and the acceleration segment on the workpiece to be cut, wherein the deceleration segment is characterized by a first preset distance before the starting point of the micro-connection segment, and the ending point of the deceleration segment is the starting point of the micro-connection segment; the acceleration segment is characterized by a second preset distance after the ending point of the micro-connection segment, and the starting point of the acceleration segment is the ending point of the micro-connection segment.

[0029] The acceleration determination module is used to determine the acceleration of the deceleration phase and the acceleration phase;

[0030] The deceleration cutting module is used to control the laser cutting head to enter a deceleration cutting mode when the laser cutting head moves to the starting point of the deceleration section at the current cutting speed; wherein, the deceleration cutting mode is used to reduce the current cutting speed to a first cutting speed during the cutting of the deceleration section;

[0031] The micro-connected cutting module is used to control the laser cutting head to enter the micro-connected cutting mode when the laser cutting head moves to the starting point of the micro-connected segment at the first cutting speed; wherein, the micro-connected cutting mode is used to cut the micro-connected segment at the first cutting speed at all times;

[0032] The accelerated cutting module is used to control the laser cutting head to enter the accelerated cutting mode when the laser cutting head moves to the starting point of the accelerated section at the first cutting speed; wherein, the accelerated cutting mode is used to accelerate the first cutting speed to the second cutting speed during the cutting of the accelerated section.

[0033] According to a fourth aspect of the present invention, a laser cutting control system is provided, comprising: a second acquisition module, a judgment control module, and a laser cutting control device based on micro-segments as described in the third aspect; wherein:

[0034] The second acquisition module is used to acquire the positions of all micro-connecting segments on the workpiece to be cut;

[0035] The judgment and control module is used to determine in real time whether the micro-segment exists on the current cutting trajectory of the workpiece to be cut; if so, it controls the micro-segment-based laser cutting control device to perform micro-segment-based laser cutting; if not, it continues to cut along the current cutting trajectory.

[0036] According to a fifth aspect of the present invention, an electronic device is provided, comprising a memory and a processor.

[0037] The memory is used to store code;

[0038] The processor is configured to execute code in the memory to implement the first aspect and its optional micro-segment-based laser cutting method or to implement the laser cutting method of the second aspect.

[0039] According to a sixth aspect of the invention, a storage medium is provided having a program stored thereon, which, when executed by a processor, implements the first aspect and its optional micro-segment-based laser cutting method or implements the laser cutting method of the second aspect.

[0040] The laser cutting method and control device based on micro-segments provided by this invention gradually change the cutting speed of the micro-segments by adding acceleration and deceleration sections before and after the micro-segments. This avoids the material warping that can occur when switching directly from the current cutting speed to the micro-segment cutting speed. Furthermore, this invention uses a micro-segment cutting mode to cut the micro-segments, eliminating the need for re-drilling when the micro-segment ends. This allows for manual separation of parts by tapping, improving efficiency.

[0041] Furthermore, in a preferred embodiment, by predicting the acceleration of the deceleration phase, the laser cutting head decelerates to the end of the deceleration phase at an acceleration below the preset acceleration, thereby reducing the burn area of ​​the cutting surface, further preventing material from warping during the cutting process, and ensuring the continuity and safety of the cutting. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a flowchart illustrating a laser cutting method based on micro-segments according to an embodiment of the present invention. Figure 1 ;

[0044] Figure 2 This is a flowchart illustrating a laser cutting method based on micro-segments according to an embodiment of the present invention. Figure 2 ;

[0045] Figure 3 This is a flowchart illustrating a laser cutting method based on micro-segments according to an embodiment of the present invention. Figure 3 ;

[0046] Figure 4 This is a flowchart illustrating a laser cutting method based on micro-segments according to an embodiment of the present invention. Figure 4 ;

[0047] Figure 5 This is a flowchart illustrating a laser cutting method based on micro-segments according to an embodiment of the present invention. Figure 5 ;

[0048] Figure 6 This is a schematic diagram of the cutting speed in a laser cutting method based on micro-connected segments according to an embodiment of the present invention;

[0049] Figure 7 This is a schematic diagram of the structure of a laser cutting control device based on micro-segments in one embodiment of the present invention;

[0050] Figure 8 This is a schematic diagram of the structure of a laser cutting control system in one embodiment of the present invention;

[0051] Figure 9 This is a schematic diagram of the structure of an electronic device according to an embodiment of the present invention. Detailed Implementation

[0052] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0053] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0054] The technical solution of the present invention will be described in detail below with reference to specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0055] Prior to this application, the applicant conducted extensive research on laser cutting methods based on micro-segments and found that: in existing application scenarios, such as in the field of laser processing, the material is subject to thermal stress, causing it to warp during the cutting process. Furthermore, if the cut workpiece cannot fall through the gaps in the support bars or be supported by them, warping will also occur. To avoid these risks, users must constantly monitor the machine during processing, increasing labor costs and reducing processing efficiency.

[0056] Furthermore, in the application scenarios of existing technologies, the cutting of micro-connections does not involve laser cutting when processing the micro-connections of the workpiece to be cut, so that the micro-connections of the parts are not completely severed, thereby preventing the parts from falling off or lifting.

[0057] In the above solutions, when cutting thick plates, the material needs to be re-drilled at the end of the micro-connection, which affects processing efficiency. Furthermore, it is difficult to manually break the micro-connection afterwards, and it often requires the use of argon arc welding or grinding with a grinding wheel, which is time-consuming and labor-intensive.

[0058] In view of this, the present invention proposes a new laser cutting method based on micro-connected segments. The method adopts a micro-connected cutting mode for cutting micro-connected segments, which enables rapid disconnection of micro-connected segments. Furthermore, acceleration and deceleration sections are set before and after the micro-connected segments to further reduce the warping phenomenon of the workpiece.

[0059] The specific details of the solution of this invention are as follows:

[0060] Please refer to Figure 1This invention provides a laser cutting method based on micro-connected segments, applied to the cutting of micro-connected segments on a workpiece by a laser cutting head, comprising:

[0061] S1: Obtain the positions of the micro-connecting segments, deceleration segments, and acceleration segments on the workpiece to be cut;

[0062] S2: Determine the acceleration of the deceleration phase and the acceleration phase;

[0063] S3: When the laser cutting head moves to the starting point of the deceleration section at the current cutting speed, control the laser cutting head to enter the deceleration cutting mode;

[0064] S4: When the laser cutting head moves to the starting point of the micro-connection segment at the first cutting speed, control the laser cutting head to enter the micro-connection cutting mode;

[0065] S5: When the laser cutting head moves to the starting point of the acceleration section at the first cutting speed, control the laser cutting head to enter the accelerated cutting mode.

[0066] The deceleration segment is characterized by a first preset distance before the starting point of the micro-connection segment, and the ending point of the deceleration segment is the starting point of the micro-connection segment; the acceleration segment is characterized by a second preset distance after the ending point of the micro-connection segment, and the starting point of the acceleration segment is the ending point of the micro-connection segment.

[0067] Regarding the cutting modes, specifically, the deceleration cutting mode is used to reduce the current cutting speed to a first cutting speed during the cutting of the deceleration segment; the micro-connection cutting mode is used to always cut the micro-connection segment at the first cutting speed; and the acceleration cutting mode is used to accelerate the first cutting speed to a second cutting speed during the cutting of the acceleration segment.

[0068] In a preferred embodiment, the micro-connection segment, deceleration segment, and acceleration segment are obtained by determining deceleration marks, micro-connection marks, and acceleration marks on the workpiece to be cut before the cutting begins. The laser can identify the marks to obtain the position information of the micro-connection segment, deceleration segment, and acceleration segment.

[0069] In other preferred embodiments, the parameters of the laser cutting mode include: cutting speed, cutting length, filtering frequency band, light emission frequency, and duty cycle; the parameters of the micro-connection cutting mode also include: root retention ratio and speed ratio.

[0070] In one example, the workpiece to be cut includes carbon steel or stainless steel.

[0071] Of course, this invention is not limited thereto, and other materials of the workpiece to be cut are all within the protection scope of this invention.

[0072] Regarding the parameters of the laser cutting mode, in one embodiment, for carbon steel with a thickness of 20mm, the normal cutting speed is 1.0m / min, the length of the micro-connection segment is 2mm, the root retention ratio is 75%, the speed ratio is 95%, the acceleration segment length is 3mm, and the deceleration segment length is 3mm.

[0073] In another embodiment, for carbon steel with a thickness of 16mm, the normal cutting speed is 1.2m / min, the length of the micro-connection segment is 2mm, the root retention ratio is 70%, the speed ratio is 95%, the acceleration segment length is 3mm, and the deceleration segment length is 3mm.

[0074] In other embodiments, for stainless steel with a thickness of 20mm, the normal cutting speed is 1.7m / min, the length of the micro-connection segment is 2mm, the root retention ratio is 55%, the speed ratio is 95%, the acceleration segment length is 3mm, and the deceleration segment length is 3mm.

[0075] In other embodiments, for stainless steel with a thickness of 16mm, the normal cutting speed is 2.0m / min, the length of the micro-connection segment is 2mm, the root retention ratio is 55%, the speed ratio is 95%, the acceleration segment length is 3mm, and the deceleration segment length is 3mm.

[0076] In other embodiments, for stainless steel with a thickness of 10mm, the normal cutting speed is 6.5m / min, the length of the micro-connection segment is 2mm, the root retention ratio is 50%, the speed ratio is 95%, the acceleration segment length is 3mm, and the deceleration segment length is 3mm.

[0077] Regarding cutting speed, please refer to [link / reference]. Figure 6 , Figure 6 This is a schematic diagram of the cutting speed, where the X-axis represents the cutting trajectory length and the Y-axis represents the cutting speed. Specifically, as shown in the figure, the current cutting speed is equal to the second cutting speed, and the second cutting speed is always greater than the first cutting speed.

[0078] In other examples, the second cutting speed is greater than or less than the current cutting speed, and the second cutting speed is always greater than the first cutting speed.

[0079] Of course, the present invention is not limited thereto, and the second cutting speed is set according to the material and thickness of the workpiece to be cut.

[0080] In the above scheme, by adding acceleration and deceleration sections before and after the micro-connecting segments, the cutting speed of the micro-connecting segments changes gradually, avoiding the direct switching from the current cutting speed to the micro-connecting segment cutting speed, which would cause the material to warp during the cutting process. Furthermore, the present invention uses a micro-connecting cutting mode to cut the micro-connecting segments, achieving the effect that no re-drilling is required when the micro-connecting segment ends, further enabling the parts to be separated manually by tapping, thus improving efficiency.

[0081] In a preferred embodiment, please refer to Figure 2 Step S2 includes:

[0082] S21: Determine the current cutting speed of the laser cutting head;

[0083] S22: Determine the acceleration of the deceleration phase based on the current cutting speed, the first cutting speed, and the first preset distance.

[0084] In another preferred embodiment, please refer to Figure 3 Step S2 also includes:

[0085] S23: When the acceleration of the deceleration section is greater than the preset acceleration, control the laser cutting head to decelerate to the end of the deceleration section at the preset acceleration;

[0086] S24: When the acceleration of the deceleration section is below the preset acceleration, control the laser cutting head to move to the end of the deceleration section at that acceleration.

[0087] In one embodiment, parameters of the laser cutting mode, such as the filter frequency band, are controlled so that the acceleration of the deceleration phase is always limited below the preset acceleration.

[0088] In one embodiment, the current cutting speed of the laser cutting head is obtained according to a speed prediction algorithm. The preset acceleration includes the maximum acceleration of the machine tool. Specifically, during the laser cutting process, when the laser cutting head is about to move to the deceleration section, the actual speed (i.e., the current cutting speed) at the starting point of the deceleration section is predicted in advance. Based on the actual speed, the target speed (i.e., the first cutting speed), and the set distance (i.e., the first preset distance), the acceleration required for deceleration (i.e., the acceleration of the deceleration section) is calculated.

[0089] In addition, it is necessary to determine whether the acceleration of the deceleration phase exceeds the machine tool's maximum acceleration. If it does, the shortest distance that the laser cutting head can decelerate to the target speed is calculated, and the starting position of the deceleration phase is replanned. When the laser cutting head reaches the starting point of the deceleration phase, it is controlled to use that acceleration to perform deceleration.

[0090] After passing through the deceleration phase and reducing the speed to the target speed (i.e., the first cutting speed), the laser cutting head moves to the micro-connecting segment. Based on the parameters of the micro-connecting cutting mode set by the user, the required light output frequency and duty cycle for cutting the micro-connecting segment are calculated, and light is emitted using this frequency and duty cycle for cutting.

[0091] After passing through the micro-connection segment, when the motion reaches the acceleration distance (i.e. acceleration segment), the laser cutting head is first controlled to restore the duty cycle and frequency during normal cutting. Then, based on the distance of the acceleration segment and the target speed (i.e., the first cutting speed), the acceleration required for the acceleration segment is calculated, and the acceleration process is executed.

[0092] Regarding the adjustment of the emission frequency and duty cycle, in a specific embodiment, a time slice comparison algorithm is used to send an instruction to the bus system to adjust the duty cycle and emission frequency in advance before the laser cutting head moves to the micro-connection segment. After a delay, the bus system executes the adjustment of the duty cycle and frequency to achieve the effect of changing the laser parameters exactly at the starting point of the micro-connection segment.

[0093] In the above scheme, by predicting the acceleration of the deceleration section, the laser cutting head decelerates to the end of the deceleration section at an acceleration below the preset acceleration, thereby reducing the burn area of ​​the cutting surface, further avoiding material warping during the cutting process, and ensuring the continuity and safety of the cutting.

[0094] For other preferred embodiments, please refer to Figure 4 Before step S1, the following are included:

[0095] S01: Determine the position of the micro-connecting segment based on the length and thickness of the workpiece to be cut;

[0096] S02: Based on the position of the micro-connector, determine the positions of the acceleration segment and the deceleration segment.

[0097] S03: Control the laser cutting head to cut the workpiece to be cut at the current cutting speed, and determine whether the micro-connection exists on the current cutting trajectory of the workpiece to be cut; if yes, obtain the position of the micro-connection; if no, continue to cut the workpiece to be cut at the current cutting speed.

[0098] Please refer to Figure 5 This invention provides a laser cutting method, the method comprising:

[0099] S6: Obtain the positions of all micro-connections on the workpiece to be cut;

[0100] S7: In real time, determine whether there are micro-connections on the current cutting trajectory of the workpiece to be cut; if so, use the laser cutting method based on micro-connections described above to cut the corresponding micro-connections; if not, continue cutting with the current cutting trajectory; and repeat this step until the cutting of the workpiece to be cut is completed.

[0101] In a preferred embodiment, the workpiece to be cut has at least one micro-connection segment. For example, when the workpiece to be cut is a ring, there is only one micro-connection segment.

[0102] Please refer to Figure 7 The present invention also provides a laser cutting control device 8 based on micro-segments, including: a first acquisition module 801, an acceleration determination module 802, a deceleration cutting module 803, a micro-segment cutting module 804, and an acceleration cutting module 805;

[0103] The first acquisition module 801 is used to acquire the positions of the micro-connection segment, the deceleration segment, and the acceleration segment on the workpiece to be cut, wherein the deceleration segment is characterized by a first preset distance before the starting point of the micro-connection segment, and the ending point of the deceleration segment is the starting point of the micro-connection segment; the acceleration segment is characterized by a second preset distance after the ending point of the micro-connection segment, and the starting point of the acceleration segment is the ending point of the micro-connection segment.

[0104] As one specific implementation, the positions of the micro-connecting segments, deceleration segments, and acceleration segments on the workpiece to be cut are obtained in the following manner:

[0105] The position of the micro-connecting segment is determined based on the length and thickness of the workpiece to be cut;

[0106] Based on the position of the micro-connector, the positions of the acceleration segment and the deceleration segment are determined;

[0107] The laser cutting head is controlled to cut the workpiece at the current cutting speed, and it is determined whether the micro-connection exists on the current cutting trajectory of the workpiece. If it does, the position of the micro-connection is obtained; if not, the workpiece is cut at the current cutting speed.

[0108] The acceleration determination module 802 is used to determine the acceleration of the deceleration segment and the acceleration segment.

[0109] As one specific implementation, the acceleration of the deceleration phase is determined in the following way:

[0110] Determine the current cutting speed of the laser cutting head;

[0111] Based on the current cutting speed, the first cutting speed, and the first preset distance, the acceleration of the deceleration phase is determined;

[0112] When the acceleration of the deceleration phase is greater than the preset acceleration, the laser cutting head is controlled to decelerate to the end of the deceleration phase at the preset acceleration.

[0113] When the acceleration of the deceleration phase is below the preset acceleration, the laser cutting head is controlled to move to the end of the deceleration phase at that acceleration.

[0114] The deceleration cutting module 803 is used to control the laser cutting head to enter the deceleration cutting mode when the laser cutting head moves to the starting point of the deceleration section at the current cutting speed; wherein, the deceleration cutting mode is used to reduce the current cutting speed to a first cutting speed during the cutting of the deceleration section.

[0115] The micro-connected cutting module 804 is used to control the laser cutting head to enter the micro-connected cutting mode when the laser cutting head moves to the starting point of the micro-connected segment at the first cutting speed; wherein, the micro-connected cutting mode is used to cut the micro-connected segment at the first cutting speed at all times.

[0116] The accelerated cutting module 805 is used to control the laser cutting head to enter the accelerated cutting mode when the laser cutting head moves to the starting point of the acceleration section at the first cutting speed; wherein,

[0117] The accelerated cutting mode is used to accelerate the first cutting speed to the second cutting speed during the cutting of the accelerated segment.

[0118] Please refer to Figure 8 The present invention also provides a laser cutting control system 9, comprising: a second acquisition

[0119] Module 901, judgment and control module 902, and the laser cutting control device 58 based on micro-segments described above; wherein:

[0120] The second acquisition module 901 is used to acquire the positions of all micro-connections on the workpiece to be cut.

[0121] The judgment and control module 902 is used to judge the current cutting trajectory of the workpiece to be cut in real time.

[0122] If the micro-connected segment exists, then control the micro-connected segment-based laser cutting control device 0 to perform micro-connected segment-based laser cutting; otherwise, continue cutting along the current cutting trajectory.

[0123] As one specific implementation method, the presence of the micro-connection segment on the current cutting trajectory is determined by the following method:

[0124] The system continuously determines whether micro-connections exist on the current cutting trajectory of the workpiece to be cut; if so, then...

[0125] The laser cutting method based on micro-segments described above is used to cut the corresponding micro-segments; if not, 5 continues cutting along the current cutting trajectory; and this step is repeated until the workpiece to be cut is completed.

[0126] Cutting of parts.

[0127] Please refer to Figure 9 An electronic device 10 is provided, comprising:

[0128] Processor 1001; and,

[0129] Memory 1002 is used to store the executable instructions of the processor;

[0130] 0 Wherein, the processor 1001 is configured to perform the above-mentioned actions by executing the executable instructions.

[0131] The method.

[0132] The processor 1001 can communicate with the memory 1002 via the bus 1003.

[0133] This invention also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the methods described above.

[0134] 5. Those skilled in the art will understand that implementing all or part of the steps in the above method embodiments:

[0135] The steps can be implemented using hardware associated with program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it performs the steps included in the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0136] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method of laser cutting based on micro-segments, applied to the cutting of micro-segments on a workpiece to be cut by a laser cutting head, characterized in that, The method comprises: acquiring positions of a micro-continuous section, a deceleration section and an acceleration section on the workpiece to be cut, wherein the deceleration section is characterized by a first preset distance from a start point of the micro-continuous section, and an end point of the deceleration section is the start point of the micro-continuous section; the acceleration section is characterized by a second preset distance from an end point of the micro-continuous section, and a start point of the acceleration section is the end point of the micro-continuous section; determining accelerations of the deceleration section and the acceleration section; when the laser cutting head moves to the start point of the deceleration section at a current cutting speed, controlling the laser cutting head to enter a deceleration cutting mode; wherein the deceleration cutting mode is used to decelerate the current cutting speed to a first cutting speed during cutting of the deceleration section; when the laser cutting head moves to the start point of the micro-continuous section at the first cutting speed, controlling the laser cutting head to enter a micro-continuous cutting mode; wherein the micro-continuous cutting mode is used to cut the micro-continuous section at the first cutting speed all the time; when the laser cutting head moves to the start point of the acceleration section at the first cutting speed, controlling the laser cutting head to enter an acceleration cutting mode; wherein the acceleration cutting mode is used to accelerate the first cutting speed to a second cutting speed during cutting of the acceleration section.

2. The microvia-based laser cutting method of claim 1, wherein, The determination of the acceleration of the deceleration section comprises: determining the current cutting speed of the laser cutting head; determining the acceleration of the deceleration section based on the current cutting speed, a speed ratio and the first preset distance.

3. The microvia-based laser drilling method of claim 1, wherein, The determination of the acceleration of the deceleration section further comprises: when the acceleration of the deceleration section is greater than a preset acceleration, controlling the laser cutting head to move to the end point of the deceleration section at the preset acceleration; when the acceleration of the deceleration section is below the preset acceleration, controlling the laser cutting head to move to the end point of the deceleration section at the acceleration.

4. The microvia-based laser cutting method of claim 3, wherein, The method further comprises, before the acquisition of the positions of the micro-continuous section, the deceleration section and the acceleration section on the workpiece to be cut: controlling the laser cutting head to cut the workpiece to be cut at the current cutting speed, and determining whether the micro-continuous section exists on a current cutting track of the workpiece to be cut; if yes, acquiring the position of the micro-continuous section, and if no, continuing to cut the workpiece to be cut at the current cutting speed.

5. The microvia-based laser cutting method of claim 4, wherein, The method further comprises, before the control of the laser cutting head to cut the workpiece to be cut at the current cutting speed and the determination of whether the micro-continuous section exists on the current cutting track of the workpiece to be cut: determining the positions of the micro-continuous section based on a length and a thickness of the workpiece to be cut; determining the positions of the acceleration section and the deceleration section based on the position of the micro-continuous section.

6. The microvia-based laser cutting method of claim 5, wherein, The parameters of the laser cutting mode comprise a cutting speed, a cutting length, a filtering frequency band, an output light frequency and a duty cycle; the parameters of the micro-continuous cutting mode further comprise a root-remaining ratio and a speed ratio.

7. A laser cutting method, characterized by, The method comprises: acquiring positions of all micro-continuous sections on the workpiece to be cut; Real-time determining whether there is a micro-continuous section on the current cutting track of the workpiece to be cut; if yes, cutting the corresponding micro-continuous section by the micro-continuous section-based laser cutting method of any one of claims 1-6; if no, continuing to cut at the current cutting track; and repeating the step until the cutting of the workpiece to be cut is completed.

8. A micro-segment based laser cutting control apparatus, characterized by, Comprising: A first acquisition module, an acceleration determination module, a deceleration cutting module, a micro-continuous cutting module, and an acceleration cutting module; The first acquisition module is configured to acquire the positions of a micro-continuous section, a deceleration section, and an acceleration section on a workpiece to be cut, wherein the deceleration section is characterized by a first preset distance from the start point of the micro-continuous section, and the end point of the deceleration section is the start point of the micro-continuous section; the acceleration section is characterized by a second preset distance from the end point of the micro-continuous section, and the start point of the acceleration section is the end point of the micro-continuous section; The acceleration determination module is configured to determine the acceleration of the deceleration section and the acceleration section; The deceleration cutting module is configured to control the laser cutting head to enter a deceleration cutting mode when the laser cutting head moves to the start point of the deceleration section at a current cutting speed; wherein the deceleration cutting mode is configured to decelerate the current cutting speed to a first cutting speed during cutting of the deceleration section; The micro-continuous cutting module is configured to control the laser cutting head to enter a micro-continuous cutting mode when the laser cutting head moves to the start point of the micro-continuous section at the first cutting speed; wherein the micro-continuous cutting mode is configured to always cut the micro-continuous section at the first cutting speed; The acceleration cutting module is configured to control the laser cutting head to enter an acceleration cutting mode when the laser cutting head moves to the start point of the acceleration section at the first cutting speed; wherein the acceleration cutting mode is configured to accelerate the first cutting speed to a second cutting speed during cutting of the acceleration section.

9. A laser cutting control system, characterized by, Comprising: A second acquisition module, a judgment and control module, and the micro-continuous section-based laser cutting control device of claim 8; wherein: The second acquisition module is configured to acquire the positions of all micro-continuous sections on the workpiece to be cut; The judgment and control module is configured to real-time determine whether there is a micro-continuous section on the current cutting track of the workpiece to be cut; if yes, control the micro-continuous section-based laser cutting control device to perform micro-continuous section-based laser cutting; if no, continue to cut at the current cutting track.

10. An electronic device, comprising: Comprising a memory and a processor, The memory is configured to store codes; The processor is configured to execute the codes in the memory to implement the micro-continuous section-based laser cutting method of any one of claims 1-6 or the laser cutting method of claim 7.

11. A storage medium having stored thereon a program, characterized in that The program is executed by the processor to implement the micro-continuous section-based laser cutting method of any one of claims 1-6 or the laser cutting method of claim 7.

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