Substrate and manufacturing method thereof, display panel

Abstract

The application discloses a substrate, a manufacturing method thereof and a display panel. The manufacturing method of the substrate comprises the following steps: providing a substrate; the substrate comprises a first surface and a second surface arranged oppositely, and the first surface is provided with at least one first protruding structure; coating a flowable film layer on the first surface of the substrate; performing a patterning treatment on the flowable film layer to form a plurality of first through holes penetrating through the flowable film layer and corresponding to each first protruding structure; and performing a flow leveling treatment on the flowable film layer to form a planarized planar layer. The application can effectively improve the planarization degree of the planar layer, thereby improving the flatness of the substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a substrate, a manufacturing method thereof and a display panel. BACKGROUND

[0002] In recent years, organic light-emitting diode (OLED) display screens have been widely concerned and applied due to their high contrast, wide viewing angle, and advantages such as being able to be bent, and are a new type of flat panel display technology after liquid crystal flat panel display, and have gradually entered the application market of smart phones, large-screen televisions and the like.

[0003] Generally, the organic light-emitting layer in the OLED display panel is formed by a solution process (such as an inkjet printing process), and the light-emitting efficiency of the organic light-emitting layer is greatly affected by the flatness of the terrain. Due to the different pixel design patterns, the surface of the array layer will have different terrains. However, the planarization degree of the planar layer between the array layer and the organic light-emitting layer is often insufficient, which greatly affects the light-emitting efficiency of the organic light-emitting layer. SUMMARY

[0004] The present application provides a substrate, a manufacturing method thereof and a display panel, which can effectively improve the planarization degree of the planar layer, thereby improving the flatness of the substrate.

[0005] The present application provides a manufacturing method of a substrate, comprising the following steps:

[0006] A substrate is provided; the substrate comprises a first surface and a second surface arranged oppositely, and the first surface has at least one first protruding structure;

[0007] A flowable film layer is uniformly coated on the first surface of the substrate;

[0008] The flowable film layer is patterned to form a plurality of first through holes penetrating through the flowable film layer and corresponding to each first protruding structure; and

[0009] The flowable film layer is subjected to a planarization process to form a planarized planar layer.

[0010] Optionally, the plurality of first through holes are arranged in at least one column along the extension direction of the first protruding structure.

[0011] Optionally, the projection of the plurality of first through holes in the direction perpendicular to the substrate is completely covered by the projection of the corresponding first protruding structure in the direction perpendicular to the substrate.

[0012] Optionally, the first surface further has at least one second protruding structure, and a height of the second protruding structure is less than a height of the first protruding structure; after the patternization treatment on the flowable film layer, the flowable film layer completely covers the second protruding structure.

[0013] Optionally, the first surface further has at least one second protruding structure, and a height of the second protruding structure is less than a height of the first protruding structure; the manufacturing method further comprises the following steps:

[0014] forming a plurality of second through holes penetrating through the flowable film layer and arranged corresponding to each of the second protruding structures.

[0015] Optionally, a diameter of the second through hole is less than a diameter of the first through hole.

[0016] a projection of the plurality of second through holes in a direction perpendicular to the substrate substrate is completely covered by a projection of the corresponding second protruding structure in the direction perpendicular to the substrate substrate.

[0017] Optionally, the first surface further has at least one third protruding structure, and a height of the third protruding structure is less than a height of the second protruding structure; after the patternization treatment on the flowable film layer, the flowable film layer completely covers the third protruding structure.

[0018] The application further provides a substrate manufactured by the manufacturing method, the substrate comprising the substrate substrate and the planar layer on the first surface of the substrate substrate.

[0019] Optionally, the substrate substrate comprises a substrate layer and a thin film transistor array layer on the substrate layer; the first surface is located on a side of the thin film transistor array layer away from the substrate layer, and the second surface is located on a side of the substrate layer away from the thin film transistor array layer.

[0020] The application further provides a display panel comprising a light-emitting functional layer and the substrate described above; the light-emitting functional layer is located on the planar layer.

[0021] The substrate and the manufacturing method thereof and the display panel provided by the present application are characterized in that the through hole processing is performed on the flowable film layer above the first protruding structure with high terrain, and a plurality of first through holes are formed corresponding to the first protruding structure, the flowability of the flowable film layer and the diffraction principle of light are utilized to effectively increase the flowability of the position of the plurality of first through holes; after the flowable film layer is subjected to the flow processing, the flat layer formed above the first protruding structure is thin, and the surface height of the flat layer above the first protruding structure is equivalent to the surface height of the flat layer at other positions, the planarization degree of the flat layer is effectively improved, thereby effectively improving the surface flatness of the substrate, and further facilitating the formation of the film layer with high flatness on the surface of the substrate. BRIEF DESCRIPTION OF DRAWINGS

[0022] The technical scheme and other beneficial effects of the present application will be apparent from the following detailed description of the specific embodiments of the present application in combination with the accompanying drawings.

[0023] Figure 1 It is a schematic view of the cross-sectional structure of an exemplary substrate.

[0024] Figure 2 It is Figure 1 It is a top view of the substrate provided by the present application.

[0025] Figure 3 It is a manufacturing method of a substrate provided by the first embodiment of the present application.

[0026] Figure 4 It is a schematic view of the cross-sectional structure of the substrate and the first through hole position of the flowable film layer after the patterning processing provided by the first embodiment of the present application.

[0027] Figure 5 It is a top view of the flowable film layer after the patterning processing and the first protruding structure provided by the first embodiment of the present application.

[0028] Figure 6 It is a schematic view of the cross-sectional structure of the substrate provided by the first embodiment of the present application.

[0029] Figure 7 It is a manufacturing method of a substrate provided by the second embodiment of the present application.

[0030] Figure 8 It is a schematic view of the cross-sectional structure of the substrate and the first through hole position of the flowable film layer after the patterning processing provided by the second embodiment of the present application.

[0031] Figure 9 It is a top view of the flowable film layer after the patterning processing, the first protruding structure and the second protruding structure provided by the second embodiment of the present application.

[0032] Figure 10A cross-sectional structure schematic diagram of a substrate provided for Embodiment Two of the present application.

[0033] Figure 11 A cross-sectional structure schematic diagram of a substrate provided for Embodiment Three of the present application.

[0034] Figure 12 A top view schematic diagram of a patterned flowable film layer, a first protruding structure and a second protruding structure provided for Embodiment Three of the present application.

[0035] Figure 13 A cross-sectional structure schematic diagram of a substrate provided for Embodiment Four of the present application.

[0036] Figure 14 A top view schematic diagram of a patterned flowable film layer, a first protruding structure, a second protruding structure and a third protruding structure provided for Embodiment Four of the present application.

[0037] Figure 15 A cross-sectional structure schematic diagram of a substrate provided for Embodiment Four of the present application.

[0038] Figure 16 A cross-sectional structure schematic diagram of a substrate provided for Embodiment Five of the present application.

[0039] Figure 17 A cross-sectional structure schematic diagram of a display panel provided for Embodiment Six of the present application. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without any creative work, fall within the protection scope of the present application.

[0041] In the description of the present application, it needs to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.

[0042] In the present application, unless otherwise explicitly specified and limited, "on" or "under" of a first feature to a second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, "on", "above" and "over" of the first feature to the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the first feature is higher in horizontal height than the second feature. "Under", "below" and "underneath" of the first feature to the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the first feature is lower in horizontal height than the second feature.

[0043] The following disclosure provides many different embodiments or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and arrangements of specific examples are described in the following. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to numbers and / or letters in different examples, and such repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art can realize the application of other processes and / or the use of other materials.

[0044] As Figure 1 An exemplary cross-sectional structure diagram of a substrate is provided, which includes a substrate substrate (such as an array substrate) 1' and a planar layer 2' covering the substrate substrate 1', due to the different pixel design patterns of the display panel, the surface of the substrate substrate 1' will appear different terrains, for example, the terrain of the first film layer 3' is higher than that of the second film layer 4'. As Figure 1 andFigure 2 As shown, the planar layer 2' is usually made by a coating and leveling process. After the planar layer 2' is coated, the planar layer 2' above the first film layer 3' with higher topography is still relatively high, and the planar layer 2' above the second film layer 4' with lower topography is still relatively low, resulting in insufficient planarization of the entire planar layer 2', which greatly affects the light-emitting efficiency of the organic light-emitting layer formed above the planar layer 2'.

[0045] To solve the above technical problems, the present application improves the forming process of the existing planar layer, and provides a substrate and a manufacturing method thereof, and a display panel. For details, please refer to the following description of several embodiments.

[0046] Embodiment one

[0047] As shown, the manufacturing method of the substrate 100 provided by the present application includes steps S301 to S304. Figures 3 to 6 As shown, the manufacturing method of the substrate 100 provided by the present application includes steps S301 to S304.

[0048] S301: providing a substrate substrate; the substrate substrate includes oppositely arranged first and second surfaces, and the first surface has at least one first protruding structure.

[0049] As shown, the substrate substrate 1 includes oppositely arranged first and second surfaces 2 and 3, and the first surface 2 has at least one first protruding structure 4. Figure 4 As shown, the substrate substrate 1 includes oppositely arranged first and second surfaces 2 and 3, and the first surface 2 has at least one first protruding structure 4. Figure 4 Only one first protruding structure 4 is shown in the figure, but it is not limited thereto.

[0050] Specifically, the substrate substrate 1 can be an array substrate in a display panel or a counter substrate oppositely arranged with the array substrate, but is not limited thereto.

[0051] S302: coating a flowable film layer on the first surface of the substrate substrate.

[0052] Specifically, the material of the flowable film layer is an organic material with certain leveling property.

[0053] S303: patterning the flowable film layer to form a plurality of first through holes penetrating the flowable film layer and corresponding to each first protruding structure.

[0054] As shown in the figures, Figure 4 and Figure 5 As shown, a plurality of first through holes 6 penetrate the flowable film layer 5 and are arranged corresponding to each first protruding structure 4.

[0055] Specifically, the plurality of first through holes 6 are arranged in at least one column along the extension direction of the first protruding structure 4. Figure 5This illustration only shows the case where multiple first through holes 6 are arranged in a single row along the extension direction of the first protruding structure 4, but it is not limited to this. When multiple first through holes 6 are arranged in multiple rows, any two adjacent rows of first through holes 6 can be arranged side by side or staggered.

[0056] Specifically, the projections of the multiple first through holes 6 in the direction perpendicular to the substrate 1 are completely covered by the projections of the corresponding first protrusion structures 4 in the direction perpendicular to the substrate 1.

[0057] Specifically, the diameters of the multiple first through holes 6 can be the same, or they can be arranged in a pattern of alternating large and small holes.

[0058] Specifically, the cross-sectional shape of the first through hole 6 includes any one or more of square, circular and rhomboid shapes, but is not limited to these.

[0059] S304: Leveling treatment is applied to the levelable film layer to form a flattened layer.

[0060] The prepared substrate 100 is as follows Figure 6 As shown, the planarization layer 7 covers the first surface 2, and the side of the planarization layer 7 away from the substrate 1 is flat.

[0061] Specifically, after leveling the levelable film layer 5, it can also be cured to stabilize the structure of the planarization layer 7. It can be understood that the planarization layer 7 is the structure obtained after leveling and curing the levelable film layer 5.

[0062] Because the leveling film layer 5 has multiple first through holes 6 corresponding to the first raised structure 4 with higher elevation, the leveling properties of the leveling film layer 5 and the principle of light diffraction are effectively increased at the locations of the multiple first through holes 6. After the leveling film layer 5 is leveled, the multiple first through holes 6 can be filled by the leveling film layer 5, making the flat layer 7 formed above the first raised structure 4 thinner, and making the surface height of the flat layer 7 above the first raised structure 4 comparable to the surface height of the flat layer 7 at other locations, effectively improving the flatness of the flat layer 7.

[0063] It should be noted that the surface height of the flat layer 7 mentioned in this application refers to the distance between the side of the flat layer 7 away from the second surface 3 and the second surface 3, and the height of the first protrusion structure 4 mentioned below refers to the distance between the side of the first protrusion structure 4 away from the second surface 3 and the second surface 3.

[0064] Understandably, the final planarization layer does not contain the first through-hole structure. Therefore, the first through-hole penetrating the levelable film layer is different from the connecting hole penetrating the planarization layer and used to connect the upper and lower layers. Of course, since the diameter of the connecting hole is larger than that of the first through-hole, the levelable film layer is insufficient to cover the connecting hole during leveling. Therefore, the connecting hole can be formed in the same process as the first through-hole. Alternatively, to avoid the connecting hole being covered by the levelable film layer during leveling, the contact hole can be formed after the planarization layer is formed.

[0065] It should be noted that when the height of the first protrusion is within the planarization range of the planarization layer, the first through hole does not need to be provided when forming the planarization layer, that is, the planarization layer can be formed using conventional methods. However, when the height of the first protrusion exceeds the planarization range of the planarization layer, the manufacturing method provided in the embodiments of this application is required to form the planarization layer.

[0066] In other words, the embodiments of this application are applicable to cases where the height of the first protrusion structure is relatively high, specifically applicable to cases where existing planarization layers cannot achieve a planarization effect on substrates with the first protrusion structure.

[0067] In this embodiment, the leveling film layer 5 is perforated above the first raised structure 4, which has a higher elevation, to form a plurality of first through holes 6 corresponding to the first raised structure 4. By utilizing the leveling properties of the leveling film layer 5 and the principle of light diffraction, the leveling properties at the positions of the plurality of first through holes 6 are effectively increased. After the leveling treatment of the leveling film layer 5, the flat layer 7 formed above the first raised structure 4 is thinner, and the surface height of the flat layer 7 above the first raised structure 4 is comparable to the surface height of the flat layer 7 at other positions, which effectively improves the flatness of the flat layer 7, thereby effectively improving the surface flatness of the substrate 100, which is conducive to forming a film layer with high flatness on the surface of the substrate 100.

[0068] Example 2

[0069] like Figures 7 to 10 As shown, this application also provides a method for manufacturing a substrate 101, the method including steps S701 to S704.

[0070] S701: Provide a substrate; the substrate includes a first surface and a second surface disposed opposite to each other, the first surface having at least one first protrusion structure and at least one second protrusion structure, and the height of the second protrusion structure is less than the height of the first protrusion structure.

[0071] like Figure 8 As shown, the substrate 1 includes a first surface 2 and a second surface 3 disposed opposite to each other. The first surface 2 has at least one first protrusion structure 4 and at least one second protrusion structure 8, and the height of the second protrusion structure 8 is less than the height of the first protrusion structure 4.Figure 8 Only one first protruding structure 4 and one second protruding structure 8 are shown, but not limited thereto.

[0072] It should be noted that the height of the second protruding structure 8 described in the present application refers to the distance between the side of the second protruding structure 8 away from the second surface 3 and the second surface 3.

[0073] S702: uniformly coating a flowable film layer on the first surface of the substrate substrate.

[0074] Specifically, the material of the flowable film layer is an organic material, which has certain flowability.

[0075] S703: patterning the flowable film layer to form a plurality of first through holes penetrating the flowable film layer and corresponding to each first protruding structure.

[0076] As shown in Figure 8 and Figure 9 , the plurality of first through holes 6 penetrates the flowable film layer 5 and is arranged corresponding to each first protruding structure 4.

[0077] Specifically, the plurality of first through holes 6 is arranged in at least one column along the extension direction of the first protruding structure 4. Figure 9 Only the case where the plurality of first through holes 6 is arranged in a single column along the extension direction of the first protruding structure 4 is shown, but not limited thereto. When the plurality of first through holes 6 is arranged in multiple columns, any two adjacent columns of first through holes 6 can be arranged side by side or staggered.

[0078] Specifically, the projection of the plurality of first through holes 6 in the direction perpendicular to the substrate substrate 1 is completely covered by the projection of the corresponding first protruding structure 4 in the direction perpendicular to the substrate substrate 1.

[0079] Specifically, as shown in Figure 9 , after the flowable film layer 5 is patterned, the flowable film layer 5 completely covers the second protruding structure 8. It can be understood that the present application only corresponds to the first protruding structure 4 with the highest height to arrange the first through hole 6 penetrating the flowable film layer 5. For example, when the first surface 2 also has other protruding structures, and the heights of these protruding structures are smaller than the height of the first protruding structure 4 and different from the height of the second protruding structure 8, only the first through hole 6 penetrating the flowable film layer 5 is arranged corresponding to the first protruding structure 4 with the highest height.

[0080] Specifically, the aperture of the plurality of first through holes 6 can be the same, or can be arranged in size intervals.

[0081] Specifically, the cross-sectional shape of the first through hole 6 includes any one or more of a square, a circle, and a rhombus, but not limited thereto.

[0082] S704: Perform a planarization treatment on the flowable film layer to form a planarized planar layer.

[0083] As shown in FIG. 1, the planar layer 7 covers the first surface 2, and the side of the planar layer 7 away from the substrate 1 is flat. Figure 10

[0084] As the flowable film layer 5 is provided with the plurality of first through holes 6 corresponding to the first protruding structure 4 with a higher topography, the planarization of the plurality of first through holes 6 is effectively increased by the planarization of the flowable film layer 5 and the diffraction principle of light. After the planarization treatment on the flowable film layer 5, the plurality of first through holes 6 can be filled by the flowable film layer 5, so that the planar layer 7 formed above the first protruding structure 4 is relatively thin, and the surface height of the planar layer 7 above the first protruding structure 4 is equivalent to the surface height of the planar layer 7 above the second protruding structure 8, effectively improving the planarization degree of the planar layer 7.

[0085] It can be understood that, as the height of the second protruding structure 8 is relatively lower than the height of the first protruding structure 4, the planarization of the flowable film layer 5 above the second protruding structure 8 is stronger, and the flowable film layer 5 can be planarized even without the through hole penetrating the flowable film layer 5 above the second protruding structure 8. That is, in the embodiment of the present application, only the flowable film layer 5 corresponding to the highest position of the first surface 2 is treated by the hole processing.

[0086] Specifically, the planar layer 7 formed does not have the first through hole 6 structure.

[0087] In the embodiment of the present application, the flowable film layer 5 above the first protruding structure 4 with a higher topography is treated by the hole processing to form the plurality of first through holes 6 corresponding to the first protruding structure 4, the planarization of the plurality of first through holes 6 is effectively increased by the planarization of the flowable film layer 5 and the diffraction principle of light, and after the planarization treatment on the flowable film layer 5, the planar layer 7 formed above the first protruding structure 4 is relatively thin, and the surface height of the planar layer 7 above the first protruding structure 4 is equivalent to the surface height of the planar layer 7 above the second protruding structure 8, effectively improving the planarization degree of the planar layer 7, thereby effectively improving the surface flatness of the substrate 101, and further facilitating the formation of a film layer with a high flatness on the surface of the substrate 101.

[0088] Embodiment Three

[0089] The present application also provides a manufacturing method of a substrate, which is different from the above-mentioned embodiment two in that, as shown in FIG. 1 and FIG. 2, the manufacturing method of the substrate 101 further comprises the following steps: Figure 11 and Figure 12

[0090] ​​A plurality of second through holes 9 are formed through the planarization film layer 5 and correspond to each of the second protruding structures 8.

[0091] As shown in Figure 11 and Figure 12 , the plurality of first through holes 6 and the plurality of second through holes 9 are formed through the planarization film layer 5, the plurality of first through holes 6 correspond to the first protruding structures 4, and the plurality of second through holes 9 correspond to the second protruding structures 8.

[0092] It can be understood that the plurality of first through holes 6 can improve the planarization of the planarization film layer 5 above the first protruding structures 4, and the plurality of second through holes 9 can improve the planarization of the planarization film layer 5 above the second protruding structures 8.

[0093] Specifically, the diameter of the second through hole 9 is smaller than the diameter of the first through hole 6.

[0094] Specifically, the projection of the plurality of second through holes 9 in the direction perpendicular to the substrate 1 is completely covered by the projection of the corresponding second protruding structure 8 in the direction perpendicular to the substrate 1.

[0095] Specifically, the cross-sectional shape and arrangement of the plurality of second through holes 9 can be the same as the plurality of first through holes 6.

[0096] The embodiments of the present application perforate the planarization film layer 5 above the first protruding structures 4 and the second protruding structures 8 with different heights, and on the basis of the aforementioned embodiment two, the planarization of the planarization film layer 5 can be further improved, so that the planarization degree of the planarization layer 7 can be further improved.

[0097] It can be understood that in the embodiments of the present application, the planarization film layer 5 above all protruding structures is perforated, which improves the planarization of the planarization film layer 5 corresponding to all high-terrain positions on the first surface 2, and more effectively improves the planarization degree of the planarization layer 7.

[0098] Embodiment four

[0099] As shown in Figures 13 to 15 , the present application further provides a manufacturing method of a substrate 102, which is different from the aforementioned embodiment three in that the first surface 2 further has at least one third protruding structure 10, and the height of the third protruding structure 10 is smaller than the height of the second protruding structure 8. As shown in Figure 14 , after the planarization film layer 5 is patterned, the planarization film layer 5 completely covers the third protruding structure 10.

[0100] It can be understood that, in the embodiment of the present application, the flowable film layer 5 above the first protruding structure 4 and the second protruding structure 8 needs to be treated with holes in addition to the third protruding structure 10 with the minimum height. That is, in the embodiment of the present application, the flowable film layer 5 above all the protruding structures except the protruding structure with the minimum height is treated with holes to increase the planarization of the flowable film layer 5 corresponding to the relatively high position of the first surface 2, so as to obtain the planar layer 7 with higher planarization.

[0101] Compared with the second embodiment, the embodiment of the present application is beneficial to further improve the planarization of the flowable film layer 5, so as to obtain the planar layer 7 with higher planarization.

[0102] Embodiment five

[0103] The embodiment of the present application also provides a substrate, which is manufactured by the manufacturing method provided by any one of the preceding embodiments. The structure of the substrate is specifically described by taking the substrate 101 manufactured by the second embodiment as an example.

[0104] As shown in Figure 16 The substrate 101 includes a substrate 1 and a planar layer 7 located on the first surface 2 of the substrate 1.

[0105] In a specific embodiment, the substrate 101 is an array substrate, the substrate 1 includes a substrate layer 11 and a thin film transistor array layer 12 located on the substrate layer 11; the first surface 2 is located on the side of the thin film transistor array layer 12 away from the substrate layer 11, and the second surface 3 is located on the side of the substrate layer 11 away from the thin film transistor array layer 12.

[0106] Specifically, the thin film transistor array layer 12 includes a plurality of thin film transistors and a plurality of connection traces for connecting different thin film transistors; wherein the thin film transistor is generally composed of a plurality of film layers, such as gate, source and drain, and gate insulating layer. Generally, part of the connection traces in the plurality of connection traces can be arranged in the same layer as the gate, for example, part of the connection traces and the gate are located in the first metal layer, and part of the connection traces are arranged in the same layer as the source and drain, for example, part of the connection traces and the source and drain are located in the second metal layer. Of course, in some specific embodiments, part of the connection traces can also be located in the third metal layer.

[0107] In order to reasonably use space and avoid short circuit between different potentials, the patterns, materials and thicknesses of different metal layers can be different, and the connection traces located in different metal layers can also be overlapped. Therefore, the plurality of film layers in the thin film transistor array layer 12 are stacked together to form protruding structures with different heights, and the positions, quantities and heights of the protruding structures are determined by the patterns, materials and thicknesses of the film layers constituting the thin film transistor.

[0108] It is understood that the first protrusion structure, the second protrusion structure and the third protrusion structure in the foregoing embodiments are all components of the thin-film transistor array layer 12.

[0109] Specifically, the thin-film transistors in the thin-film transistor array layer 12 can be either a top-gate structure or a bottom-gate structure, without limitation. Taking the top-gate structure as an example, the thin-film transistor array layer 12 includes an active layer, a gate insulating layer, a gate layer, an interlayer insulating layer, and source / drain electrode layers sequentially formed on the substrate layer 11. Of course, in some embodiments, the thin-film transistor array layer 12 also includes a passivation layer located on the source / drain electrode layers.

[0110] Specifically, any one or more of the first protrusion structure, the second protrusion structure, and the third protrusion structure in the foregoing embodiments can be located in the source / drain electrode layer or in the passivation layer, depending on whether the film layer on the side of the thin film transistor array layer 12 away from the substrate layer 11 is the source / drain electrode layer or the passivation layer.

[0111] Specifically, the substrate provided in the embodiments of this application can be a substrate in a liquid crystal display (LCD) device or a substrate in an OLED display device, and there is no limitation thereto.

[0112] In another specific embodiment, the substrate may be a cell-to-cell substrate that is paired with the array substrate.

[0113] It is understood that the substrate provided in the embodiments of this application can be any substrate including a planarization layer, and is not limited to the array substrate or the cell substrate described above.

[0114] In this embodiment, since the substrate is manufactured using the manufacturing method provided in the aforementioned embodiment, the planarization degree of the planarization layer in the substrate is high, that is, the flatness of the substrate surface is high, which is beneficial to forming a film layer with high flatness on the surface of the substrate.

[0115] Example 6

[0116] like Figure 17 As shown, this application embodiment also provides a display panel 200, which includes a light-emitting functional layer 13 and a substrate 100 (101, 102) as provided in the foregoing embodiment; wherein, the light-emitting functional layer 13 is located on the planarization layer 7.

[0117] Specifically, the display panel 200 is an OLED display panel, and the corresponding substrate 100 (101, 102) is an array substrate.

[0118] Specifically, the light-emitting functional layer 13 includes a first electrode layer, an organic light-emitting layer, and a second electrode layer which are sequentially stacked on the planar layer 7. The organic light-emitting layer can include only the light-emitting layer, or can further include at least one of a hole transport layer, an electron transport layer, a hole injection layer, and an electron injection layer in addition to the light-emitting layer.

[0119] In an embodiment, the first electrode layer is an anode layer, and the second electrode layer is a cathode layer, but is not limited thereto.

[0120] In the embodiments, the planar layer in the substrate 100 (101, 102) has a high planarization degree because the substrate 100 (101, 102) is manufactured by the manufacturing method provided in the foregoing embodiments. Therefore, the topography of the light-emitting layer in the organic light-emitting layer formed above the planar layer is more planar, which is beneficial to uniform light emission of the light-emitting layer, thereby effectively improving the light-emitting efficiency of the light-emitting layer, and further effectively improving the display effect of the display panel 200.

[0121] In the foregoing embodiments, each embodiment is described with emphasis on different aspects. For the parts not described in detail in an embodiment, reference can be made to the related description of other embodiments.

[0122] The substrate and the manufacturing method thereof, and the display panel provided in the embodiments are described in detail above. The principles and the implementation manners of the present application are described by applying specific examples in the present document. The above description of the embodiments is only used to help understand the technical solutions and the core ideas of the present application. Those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced equivalently. The modifications or the replacements do not cause the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments.

Claims

1. A method of fabricating a substrate, the method comprising: The method comprises the following steps: providing a substrate; the substrate comprises a first surface and a second surface arranged oppositely, the first surface has at least one first protruding structure and at least one second protruding structure, and the height of the second protruding structure is less than the height of the first protruding structure; coating a flowable film layer on the first surface of the substrate; patterning the flowable film layer to form a plurality of first through holes penetrating the flowable film layer and corresponding to each first protruding structure, and a plurality of second through holes penetrating the flowable film layer and corresponding to each second protruding structure; the aperture of the second through hole is less than the aperture of the first through hole; and flowing and curing the flowable film layer to form a planarized planar layer; wherein after the flowing treatment of the flowable film layer, the plurality of first through holes and the plurality of second through holes are filled with the flowable film layer.

2. The method of manufacturing a substrate according to claim 1, wherein The plurality of first through holes are arranged in at least one column along the extension direction of the first protruding structure.

3. The method of manufacturing a substrate according to claim 1, wherein The projection of the plurality of first through holes in the direction perpendicular to the substrate is completely covered by the projection of the corresponding first protruding structure in the direction perpendicular to the substrate.

4. The method of manufacturing a substrate according to claim 1, wherein The projection of the plurality of second through holes in the direction perpendicular to the substrate is completely covered by the projection of the corresponding second protruding structure in the direction perpendicular to the substrate.

5. The method of manufacturing a substrate according to claim 1, wherein The first surface further has at least one third protruding structure, and the height of the third protruding structure is less than the height of the second protruding structure; after the patterning treatment of the flowable film layer, the flowable film layer completely covers the third protruding structure.

6. A substrate, characterized by, The substrate is made by the manufacturing method of any one of claims 1 to 5, and comprises the substrate and the planar layer on the first surface of the substrate.

7. The substrate of claim 6, wherein The substrate comprises a substrate layer and a thin film transistor array layer on the substrate layer; the first surface is located on the side of the thin film transistor array layer away from the substrate layer, and the second surface is located on the side of the substrate layer away from the thin film transistor array layer.

8. A display panel, characterized by, The substrate comprises a substrate layer and a thin film transistor array layer on the substrate layer; the first surface is located on the side of the thin film transistor array layer away from the substrate layer, and the second surface is located on the side of the substrate layer away from the thin film transistor array layer. The substrate comprises a substrate layer and a thin film transistor array layer on the substrate layer; the first surface is located on the side of the thin film transistor array layer away from the substrate layer, and the second surface is located on the side of the substrate layer away from the thin film transistor array layer. The substrate comprises a substrate layer and a thin film transistor array layer on the substrate layer; the first surface is located on the side of the thin film transistor array layer away from the substrate layer, and the second surface is located on the side of the substrate layer away from the thin film transistor array layer.

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