Printed circuit board and method for manufacturing the same

Abstract

The application discloses a printed circuit board and a preparation method thereof. The preparation method of the printed circuit board comprises the following steps: obtaining a to-be-processed board piece; etching the to-be-processed board piece to prepare a plurality of gold finger lines and a plurality of electric gold lead lines, wherein each electric gold lead line is connected with a corner of the top end of the corresponding gold finger line; covering the to-be-processed board piece with a first protective film and exposing the plurality of gold finger lines, and gold plating the plurality of gold finger lines to form a plurality of gold fingers; etching the to-be-processed board piece after the plurality of gold fingers are formed to remove the plurality of electric gold lead lines, and preparing the printed circuit board. Through the above method, the application can reduce the generation of the gold suspension phenomenon or reduce the size of the gold suspension, thereby reducing the quality hidden danger caused by the gold finger suspension, improving the reliability and quality of the printed circuit board.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of printed circuit board manufacturing method, and particularly relates to a printed circuit board and a manufacturing method thereof. BACKGROUND

[0002] PCB (Printed Circuit Board), also known as printed wiring board or printed circuit board manufacturing method, is an important electronic component widely used, is a support body of electronic components, and is also a carrier of electrical connection of electronic components.

[0003] With the functional integration of electronic products, the structure of the printed circuit board tends to be more dense, and the long and short gold finger design is also more and more, and after the conventional off-board etching lead design process of the printed circuit board, the top end of the gold finger often has a suspended gold phenomenon due to etching, when the size of the suspended gold at the top end of the gold finger is too large, the top end of the suspended gold is easy to fall off or be raised when the gold finger is plugged in and pulled out, which is easy to pull out the raised gold finger, and affects the quality of the printed circuit board. SUMMARY

[0004] The application provides a printed circuit board and a manufacturing method thereof to solve the problem of suspended gold at the top end of the gold finger in the prior art.

[0005] To solve the above technical problems, the application provides a printed circuit board manufacturing method, which comprises: obtaining a to-be-processed board piece; preparing a plurality of gold finger lines and a plurality of electric gold leads on the to-be-processed board piece, wherein each electric gold lead is connected to a corner of the top end of the corresponding gold finger line; covering the to-be-processed board piece with a first protective film, and exposing the plurality of gold finger lines; and gold plating the plurality of gold finger lines to form a plurality of gold fingers; etching the to-be-processed board piece after the plurality of gold fingers are formed to remove the plurality of electric gold leads, and obtaining a printed circuit board.

[0006] The step of etching the to-be-processed board piece after the plurality of gold fingers are formed to remove the plurality of electric gold leads, and obtaining a printed circuit board comprises: covering the to-be-processed board piece after the plurality of gold fingers are formed with a second protective film, and exposing the plurality of electric gold leads; and etching the to-be-processed board piece to remove the plurality of electric gold leads, and obtaining a printed circuit board.

[0007] The step of preparing the plurality of gold finger lines and the plurality of electric gold leads on the plate to be processed comprises: sequentially performing film pasting, exposure and development on the plate to be processed to prepare a plurality of gold finger line patterns and a plurality of electric gold lead patterns on the plate to be processed; and etching the plate to be processed based on the plurality of gold finger line patterns and the plurality of electric gold lead patterns to obtain the plurality of gold finger lines and the plurality of electric gold leads; wherein each electric gold lead comprises at least two sub-leads and a main lead, one end of each sub-lead is connected to the corresponding main lead, and the other end of each sub-lead is connected to a corner of the top end of the corresponding gold finger line.

[0008] The step of preparing the plurality of gold finger lines and the plurality of electric gold leads on the plate to be processed further comprises: performing film pasting, exposure and development on the plate to be processed, and exposing the connection between each sub-lead and the corresponding main lead of each electric gold lead; and etching the connection between each sub-lead and the corresponding main lead of each electric gold lead so that the width of the sub-lead at the connection is within a first preset range.

[0009] The connection between each sub-lead and the corresponding main lead of each electric gold lead comprises a circle with a diameter within a preset diameter range.

[0010] The included angle between each electric gold lead and the corresponding gold finger line at the connection is within a range of 20-50 degrees.

[0011] The step of covering the plate to be processed with a first protective film, exposing the plurality of gold finger lines, and plating gold on the plurality of gold finger lines to form the plurality of gold fingers comprises: covering the plate to be processed with the first protective film and exposing the plurality of gold finger lines and the connection between each gold finger line and the corresponding electric gold lead; and plating gold on the plurality of gold finger lines and the connection between each gold finger line and the corresponding electric gold lead to form the plurality of gold fingers.

[0012] The step of covering the plate to be processed with a first protective film, exposing the plurality of gold finger lines, and plating gold on the plurality of gold finger lines to form the plurality of gold fingers further comprises: covering other positions of the plate to be processed except the plurality of gold finger lines and the connection between each gold finger line and the corresponding electric gold lead with anti-plating oil; plating gold on the plurality of gold finger lines and the connection between each gold finger line and the corresponding electric gold lead; and removing the anti-plating oil.

[0013] The step of etching the plate to be processed after the plurality of gold fingers are formed to remove the plurality of electric gold leads to obtain the printed circuit board further comprises: printing ink on the plate to be processed to perform solder mask on the plate to be processed.

[0014] To solve the above technical problems, the present application also provides a printed circuit board prepared by the preparation method of any one of the printed circuit boards.

[0015] The preparation method of the printed circuit board has the beneficial effects that, different from the prior art, the preparation method of the printed circuit board reduces the size of the connection between the electric gold lead and the gold finger line, and further reduces the generation of the suspended gold or reduces the size of the suspended gold in the process of etching the electric gold lead, thereby reducing the quality hidden danger caused by the suspended gold of the gold finger, and improving the reliability and quality of the printed circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a flowchart of an embodiment of the preparation method of the printed circuit board of the present application;

[0017] Figure 2 is a flowchart of another embodiment of the preparation method of the printed circuit board of the present application;

[0018] Figure 3 is Figure 2 is a structural schematic diagram of an embodiment of the preparation method of the printed circuit board of the present application after the step S22 of the embodiment of the prepared board piece;

[0019] Figure 4 is a structural schematic diagram of an embodiment of the printed circuit board of the present application. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0021] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship, movement condition, etc. between the components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly.

[0022] In addition, if the description of "first", "second" and the like is involved in the embodiments of the present application, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included at least one of the features. In addition, the technical solutions of various embodiments can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor in the protection scope required by the present application.

[0023] Please refer to Figure 1 , Figure 1 is a flowchart of an embodiment of the preparation method of the printed circuit board of the present application.

[0024] Step S11: obtaining a to-be-processed board piece.

[0025] First, the to-be-processed board piece is obtained, which is a board piece that needs to be prepared into a golden finger. The golden finger is composed of many golden conductive pads, and is called "golden finger" because of its gold-plated surface and the arrangement of conductive pads like fingers. All signals between various computer hardware, such as between memory bars and memory slots, and between graphics cards and graphics card slots, are transmitted through golden fingers.

[0026] The to-be-processed board piece can include a single-layer board or a multi-layer board. When the to-be-processed board piece is a multi-layer board, it can be obtained by laminating an inner core board, a prepreg and a conductive layer, and then sequentially performing drilling, copper sinking and full-board electroplating.

[0027] Step S12: preparing a plurality of golden finger lines and a plurality of electric gold leads on the to-be-processed board piece, wherein each electric gold lead is connected to a corner of the top end of the corresponding golden finger line.

[0028] After obtaining the to-be-processed board piece, a plurality of golden finger lines and a plurality of electric gold leads are prepared on the to-be-processed board piece.

[0029] In a specific application scenario, dry film can be attached to the positions corresponding to the plurality of golden finger lines and the plurality of electric gold leads of the to-be-processed board piece, and then the to-be-processed board piece is etched to prepare the plurality of golden finger lines and the plurality of electric gold leads.

[0030] In another specific application scenario, the conductive layer of the to-be-processed board piece can be controlled based on a preset depth control line. Specifically, the positions of the conductive layer except for the positions of the plurality of golden finger lines and the plurality of electric gold leads are controlled in depth, so as to prepare the plurality of golden finger lines and the plurality of electric gold leads on the to-be-processed board piece. In another specific application scenario, the conductive layer of the to-be-processed board piece can be controlled based on a preset depth control line. Specifically, the positions of the conductive layer except for the positions of the plurality of golden finger lines and the plurality of electric gold leads are controlled in depth, so as to prepare the plurality of golden finger lines and the plurality of electric gold leads on the to-be-processed board piece.

[0031] In the embodiment, each of the electric gold leads is connected to a corner of the top end of the corresponding gold finger line, that is, one electric gold lead is connected to a corner of the top end of the corresponding gold finger line, so that the size of the connection between the electric gold lead and the gold finger line is reduced by connecting the corner, and the phenomenon of suspended gold is further reduced or the size of the suspended gold is reduced in the subsequent etching process of the electric gold lead.

[0032] Step S13: covering the to-be-processed board with a first protective film, exposing the plurality of gold finger lines, and plating gold on the plurality of gold finger lines to form the plurality of gold fingers.

[0033] After the plurality of gold finger lines and the plurality of electric gold leads are prepared, the to-be-processed board is covered with a first protective film, the plurality of gold finger lines are exposed, and the plurality of gold finger lines are plated with gold to form the plurality of gold fingers.

[0034] In the embodiment, the first protective film can be a plating-resistant film, which is covered on the to-be-processed board except the gold finger lines to prevent the positions other than the gold fingers from being plated with gold, so that the plating process can accurately plate gold on the gold finger lines to form the gold fingers.

[0035] In one specific application scenario, the electric gold lead is connected to the gold finger line and can be in communication with the board edge line of the to-be-processed board to conduct current and complete plating. In another specific application scenario, the electric gold lead is connected to the gold finger line and can also protrude outward to directly conduct current through the protruding part of the lead to complete the plating step.

[0036] The gold plating in this step can include electroplating gold, electroplating nickel, or electroplating other non-active metals to avoid oxidation of the gold finger line and improve the reliability and stability of the gold finger.

[0037] Step S14: etching the to-be-processed board after the plurality of gold fingers are formed to remove the plurality of electric gold leads to obtain a printed circuit board.

[0038] After the gold plating is completed, the electric gold lead no longer has an actual function, and the to-be-processed board after the plurality of gold fingers are formed is etched to remove the plurality of electric gold leads to obtain a printed circuit board.

[0039] In this step, the electrical gold lead of the present embodiment is connected to the corner of the gold finger line, and the connection size is small, so that the negative etching of the gold finger line can be reduced in the etching process, and the phenomenon of suspended gold or the size of the suspended gold can be reduced. Even if the gold finger of the present embodiment has the phenomenon of suspended gold, the suspended gold only occurs at the corner of the gold finger, and the size of the suspended gold is small, which has little effect on the stability of the top of the gold finger, and can avoid the phenomenon of falling or warping of the top of the gold finger, thereby improving the reliability and stability of the gold finger, and further improving the quality of the printed circuit board.

[0040] Through the above steps, the preparation method of the printed circuit board of the present embodiment reduces the size of the connection between the electrical gold lead and the gold finger line by preparing a plurality of gold finger lines and a plurality of electrical gold leads connected to the corner of the top of the gold finger line on the to-be-processed board, thereby further reducing the phenomenon of suspended gold or the size of the suspended gold in the subsequent etching process of the electrical gold lead, thereby reducing the quality risk caused by the suspended gold of the gold finger, and improving the reliability and quality of the printed circuit board.

[0041] Please refer to Figure 2 , Figure 2 is a flowchart of another embodiment of the preparation method of the printed circuit board of the present application.

[0042] Step S21: obtaining a to-be-processed board.

[0043] This step is the same as step S11 of the foregoing embodiment, please refer to the foregoing description, which will not be repeated here.

[0044] Step S22: sequentially performing film pasting, exposure, and development on the to-be-processed board to prepare a plurality of gold finger line patterns and a plurality of electrical gold lead patterns on the to-be-processed board, etching the to-be-processed board based on the plurality of gold finger line patterns and the plurality of electrical gold lead patterns to obtain a plurality of gold finger lines and a plurality of electrical gold leads.

[0045] After obtaining the to-be-processed board, sequentially perform film pasting, exposure, and development on the to-be-processed board to prepare a plurality of gold finger line patterns and a plurality of electrical gold lead patterns on the to-be-processed board; then etch the to-be-processed board to obtain a plurality of gold finger lines based on the plurality of gold finger line patterns, and a plurality of electrical gold leads based on the plurality of electrical gold lead patterns. The other conductive lines on the to-be-processed board can also be prepared together with the electrical gold leads and the gold finger lines, specifically, the gold finger line patterns, the electrical gold lead patterns, and the conductive line patterns can be formed on the to-be-processed board by adjusting the specific area of exposure and development, and then etching to obtain the gold finger lines, the electrical gold leads, and the conductive lines. The specific direction of the conductive lines of the to-be-processed board can be set based on the actual processing requirements of the to-be-processed board, which is not limited here.

[0046] In a specific application scenario, the entire board to be processed can first be laminated with a film. Then, based on the corresponding positions of multiple gold finger circuit patterns and electroplated lead patterns, the board to be processed is exposed and developed to create multiple gold finger circuit patterns and electroplated lead patterns on the board. Next, the board is etched to remove excess conductive layer, forming multiple gold finger circuits and multiple electroplated lead patterns.

[0047] In a specific application scenario, while the board to be processed is being coated, exposed, and developed, the connection between the sub-leads of each electroplated lead and the corresponding main lead is also exposed. This allows the width of the sub-lead at the connection to be within a first preset range after etching.

[0048] In general, the width of the connection between the sub-lead and the corresponding main lead of each electroplated metal lead is larger than the width of the sub-lead or the main lead. In the subsequent etching process of removing the electroplated metal lead, incomplete etching may occur. Therefore, in this embodiment, when preparing the electroplated metal lead, the connection between the sub-lead and the corresponding main lead of each electroplated metal lead is exposed, so that it can be removed during the etching process of lead preparation. This reduces the width of the connection between the sub-lead and the corresponding main lead, making it easier to be etched cleanly in the subsequent etching process of removing the electroplated metal lead. This avoids short circuits, board burn-out, and other situations that may be caused by incomplete etching, thereby improving the reliability and safety of the printed circuit board.

[0049] The first preset range of the width of the sub-lead at the connection can be set based on the concentration of the etching solution and the material of the electroplated gold lead, such as 0.3-0.5 mm, etc. The specific setting is based on the actual situation and is not limited here.

[0050] The width of the sub-lead outside the connection point can be within a second preset range, which can be slightly larger than the first preset range. Within this second preset range, the sub-lead width is prevented from being too large, resulting in excessive residual copper during subsequent etching and affecting the printed circuit board performance. Conversely, the sub-lead width is prevented from being too small, which could cause board burn-out. The second preset range can be set based on the etching solution concentration and the material of the electroplated gold lead, for example, 0.3-0.6 mm. The specific setting is based on actual conditions and is not limited here.

[0051] In a specific application scenario, the connection between the sub-lead and the corresponding main lead of each electroplated lead is circular, and the diameter of the circle is within a preset diameter range. This circular shape within the preset diameter range avoids both excessive etching, which would result in the sub-lead and the corresponding main lead being too narrow, causing board burn-out, and insufficient etching, which would make it difficult to completely remove the electroplated lead in subsequent lead etching.

[0052] The preset diameter range can be 1 / 6 to 1 / 3 of the width of the corresponding main lead, specifically 1 / 6, 1 / 5, 1 / 4 or 1 / 3 of the width of the corresponding main lead; the preset diameter range can also be 0.05-0.20 mm, etc., and the specific setting is based on the actual situation and is not limited here.

[0053] The electroplating lead in this embodiment includes at least two sub-leads and a main lead. One end of each of the at least two sub-leads is connected to a corresponding main lead, and the other end of each sub-lead is connected to the corner of the top of each of the at least two gold finger lines. In this embodiment, the number of sub-leads in a single electroplating lead can be 2, 3, or 4, etc., each connected to a corresponding number of gold finger lines. This allows the gold plating process of at least two gold finger lines to share a single electroplating lead, thereby saving wiring space, increasing the wiring space and density of conductive lines, and achieving high density in printed circuit boards. Furthermore, the method of sharing electroplating leads in this embodiment can also reduce the width and number of electroplating leads, thereby reducing the consumption of precious metal gold salts for gold plating and correspondingly reducing material costs.

[0054] In one specific application scenario, when there are two sub-leads of the electroplated gold wire, and the two gold fingers to be connected by these two sub-leads are of the same length, the two sub-leads and the main lead can be connected in a "Y" shape, meaning the connection positions of the two sub-leads and their corresponding main leads are the same. In another specific application scenario, when the two gold fingers to be connected by the electroplated gold wire are of different lengths, the connection positions of the two sub-leads and their corresponding main leads can be different. In yet another specific application scenario, when there are multiple sub-leads of the electroplated gold wire, and the multiple gold fingers to be connected by the electroplated gold wire are of different lengths, the connection positions of the multiple sub-leads and their corresponding main leads can be different, and the lengths of the multiple sub-leads can also be different, thus connecting to the top corner of each gold finger circuit to be connected.

[0055] Please see Figure 3 , Figure 3 yes Figure 2 This embodiment shows a schematic diagram of the structure of the workpiece to be processed after step S22. This schematic diagram only illustrates the connection between the electroplating leads and the gold finger circuitry, and does not limit other structures.

[0056] The board to be processed in this embodiment includes electroplating leads 102, gold finger circuits 101, and conductive circuits 103.

[0057] One end of the gold finger circuit 101 is connected to the gold lead 102, and the other end of the gold finger circuit 101 is connected to the conductive circuit 103.

[0058] The electroplating lead 102 includes a main lead 1021 and two sub-leads 1022. The two sub-leads 1022 are respectively connected to the corners of the top ends of the two gold finger circuits 101. This schematic diagram illustrates that the electroplating lead 102 includes two sub-leads 1022, but does not limit the number of sub-leads 1022 in the electroplating lead 102.

[0059] In this embodiment, the electroplated lead 102 may include a main lead 1021 and at least two sub-leads 1022. In other embodiments, the electroplated lead 102 may also include a main lead 1021 and four sub-leads 1022, or the electroplated lead 102 may include a main lead 1021 and two sub-leads 1022, or the electroplated lead 102 may include a main lead 1021 and three sub-leads 1022, etc.

[0060] In step S22, the connection between the sub-lead 1022 and the main lead 1021 is etched away to form a hollow circle 1023. This hollow circle 1023 prevents the connection between the sub-lead 1022 and the main lead 1021 from being difficult to etch cleanly in subsequent etching processes.

[0061] The included angle α between the sub-lead 1022 and the corresponding electroplated lead 102 ranges from 20 to 50 degrees, specifically 20, 30, 45, and 50 degrees. The specific angle can be set based on the specific wiring of the electroplated lead 102. Setting the sub-lead 1022 and the corresponding electroplated lead 102 within this angle range reduces the size of the connection point between them, thereby reducing the occurrence of suspended gold or decreasing the size of the suspended gold during subsequent electroplated lead etching. Here, included angle α is the angle between the extension direction of the sub-lead 1022 and the extension direction of the electroplated lead 102 at the point of connection.

[0062] Step S23: Cover the board to be processed with a first protective film and expose multiple gold finger lines and the connection points between each gold finger line and the corresponding electroplating leads. Then, plate the multiple gold finger lines and the connection points between each gold finger line and the corresponding electroplating leads with gold to form multiple gold fingers.

[0063] After preparing multiple gold finger circuits and multiple electroplated leads, a first protective film is applied to the board to be processed, exposing the multiple gold finger circuits and the connections between each gold finger circuit and its corresponding electroplated lead. Gold plating is then performed on the multiple gold finger circuits and the connections between each gold finger circuit and its corresponding electroplated lead to form multiple gold fingers. The first protective film is then removed after gold plating.

[0064] In this process, when the first protective film is applied, multiple gold finger circuits and the connections between each gold finger circuit and its corresponding electroplating leads are exposed. This involves creating openings in the gold finger circuits and their connections, allowing gold plating to also be applied to these connections during the gold finger plating process. This ensures that during subsequent etching, the connections between the gold finger circuits and their corresponding electroplating leads are not etched by the etching solution, thus preventing the gold finger circuitry itself from being corroded and improving the reliability of the gold finger.

[0065] Please refer to further information. Figure 3 The connection point D between the gold finger circuit and the corresponding electroplated lead is located between the sub-lead 1022 and the gold finger circuit 101, and is close to the sub-lead 1022. The opening range of the connection point D between each gold finger circuit and the corresponding electroplated lead can be 10-20 micrometers. Specifically, it can be 10, 13, 15, 16, 18, or 20 micrometers, etc.

[0066] The opening range at the connection between each gold finger circuit and the corresponding electroplated lead affects the length of the subsequent gold plating. The width of the sub-lead and the angle between the sub-lead and the gold finger affect the width of the subsequent gold plating. Therefore, even if gold plating occurs at the connection between the gold finger circuit and the corresponding electroplated lead, the length and width of the gold plating can be controlled during the manufacturing process. This can minimize the size of the gold plating and prevent it from falling off or lifting, which would affect the quality and reliability of the printed circuit board.

[0067] The first protective film may include an anti-plating film or an anti-plating oil. In a specific application scenario, anti-plating oil can be applied to all areas of the board to be processed except for the multiple gold finger lines, and the multiple gold finger lines can be gold-plated to form multiple gold fingers. Finally, the anti-plating oil is removed.

[0068] In a specific application scenario, after removing the first protective film, ink printing can be performed on the workpiece to be processed for solder resist treatment, forming a solder resist layer on the surface of the workpiece to protect it.

[0069] Step S24: Cover the board to be processed with a second protective film after forming multiple gold fingers, and expose multiple electroplated gold leads; and etch the board to be processed to remove the multiple electroplated gold leads, and prepare a printed circuit board.

[0070] After forming multiple gold fingers, a second protective film is applied to the board to be processed, exposing multiple electroplated gold leads. The board is then etched to remove the multiple electroplated gold leads, thus obtaining a printed circuit board. Specifically, the entire board to be processed after forming multiple gold fingers can be covered with a second protective film, and the multiple electroplated gold leads can be exposed by exposure and development. Then, the board is etched to remove the multiple electroplated gold leads, thus obtaining a printed circuit board.

[0071] The second protective film includes an anti-etching film, which is a high-molecular-weight compound that undergoes a polymerization reaction when exposed to a specific light source to form a stable substance that adheres to the board surface, thereby achieving the function of blocking etching.

[0072] After gold plating is completed, the electroplated gold leads no longer serve a practical purpose. The board to be processed after multiple gold fingers are formed is etched to remove the multiple electroplated gold leads and obtain the printed circuit board.

[0073] In other embodiments, multiple electroplated leads can also be removed by mechanical depth control or laser depth control in this step.

[0074] Through the above steps, the printed circuit board fabrication method of this embodiment prepares multiple gold finger lines and multiple electroplated gold leads connected to the corners of the gold finger lines on the board to be processed. This allows the gold plating process of the gold finger lines to share the electroplated gold leads, thereby saving wiring space for the electroplated gold leads and increasing the wiring space for conductive lines. Furthermore, by connecting the electroplated gold leads to the corners, this embodiment reduces the size of the connection between the electroplated gold leads and the gold finger lines. This further reduces the occurrence of gold float phenomena or reduces the size of the gold float during subsequent etching of the electroplated gold leads, thereby reducing the quality risks caused by gold float and improving the reliability and quality of the printed circuit board.

[0075] Please see Figure 4 , Figure 4 This is a schematic diagram of the structure of a printed circuit board according to an embodiment of the present invention.

[0076] The printed circuit board 200 of this embodiment includes a circuit board body 204, a plurality of gold fingers 201, and a plurality of conductive lines 203. The plurality of gold fingers 201 and the plurality of conductive lines 203 are disposed on the circuit board body 204. Each gold finger 201 is connected to a conductive line 203 to realize the conduction function of the gold finger 201.

[0077] The gold finger 201 is provided with a beveled corner 202. The beveled corner 202 is the corner where the gold finger 201 is connected to the electroplating lead during the manufacturing process.

[0078] The printed circuit board 200 of this embodiment can be manufactured by the printed circuit board manufacturing method of any of the above embodiments.

[0079] With the above structure, the gold plating phenomenon on the printed circuit board in this embodiment will only occur at the beveled corners. The size of the beveled corners can be controlled during the manufacturing process, which can reduce the occurrence of gold plating or reduce the size of the gold plating. This avoids the situation where the gold plating falls off or lifts during the use of the printed circuit board, affecting the quality and reliability of the printed circuit board, and improves the reliability and quality of the printed circuit board.

[0080] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0081] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method of manufacturing a printed circuit board, characterized by, The preparation method of the printed circuit board comprises: obtaining a to-be-processed board piece; preparing a plurality of gold finger lines and a plurality of gold electrical leads on the to-be-processed board piece, wherein each gold electrical lead is connected to a corner of a top end of a corresponding gold finger line, and the corner of the top end of the gold finger line refers to a part where two edges of a fingertip of the gold finger meet; covering the to-be-processed board piece with a first protective film, exposing the plurality of gold finger lines, and gold plating the plurality of gold finger lines to form a plurality of gold fingers; etching the to-be-processed board piece after the plurality of gold fingers are formed to remove the plurality of gold electrical leads, thereby preparing the printed circuit board; wherein each gold electrical lead comprises at least two sub-leads and a main lead, one end of each sub-lead is connected to a corresponding main lead, the other end of each sub-lead is connected to a corner of a top end of a corresponding gold finger line, and the included angle between each gold electrical lead and a corresponding gold finger line at the connection is in a range of 20-50 degrees.

2. The method of manufacturing a printed circuit board according to claim 1, wherein The step of etching the to-be-processed board piece after the plurality of gold fingers are formed to remove the plurality of gold electrical leads, thereby preparing the printed circuit board, comprises: covering the to-be-processed board piece with a second protective film, and exposing the plurality of gold electrical leads; etching the to-be-processed board piece to remove the plurality of gold electrical leads, thereby preparing the printed circuit board.

3. The method of claim 1, wherein the step of applying the conductive paste is performed by screen printing. The step of preparing a plurality of gold finger lines and a plurality of gold electrical leads on the to-be-processed board piece, comprises: sequentially performing film pasting, exposure, and development on the to-be-processed board piece to prepare a plurality of gold finger line patterns and a plurality of gold electrical lead patterns on the to-be-processed board piece; etching the to-be-processed board piece based on the plurality of gold finger line patterns and the plurality of gold electrical lead patterns to obtain the plurality of gold finger lines and the plurality of gold electrical leads.

4. The method of claim 3, wherein the step of applying the solder paste is performed by screen printing. The step of preparing a plurality of gold finger lines and a plurality of gold electrical leads on the to-be-processed board piece, further comprises: performing film pasting, exposure, and development on the to-be-processed board piece to expose the connection between each sub-lead of each gold electrical lead and a corresponding main lead; etching the connection between each sub-lead of each gold electrical lead and a corresponding main lead to make the width of the sub-lead at the connection within a first preset range.

5. The preparation method of the printed circuit board according to claim 4, wherein the connection between each sub-lead of each gold electrical lead and a corresponding main lead comprises a circular shape with a diameter within a preset diameter range.

6. The method of manufacturing a printed circuit board according to claim 1, wherein The step of covering the to-be-processed board piece with a first protective film, exposing the plurality of gold finger lines, and gold plating the plurality of gold finger lines to form a plurality of gold fingers, comprises: covering the to-be-processed board piece with a first protective film, and exposing the plurality of gold finger lines and the connection between each gold finger line and a corresponding gold electrical lead; gold plating the plurality of gold finger lines and the connection between each gold finger line and a corresponding gold electrical lead to form the plurality of gold fingers.

7. The method of claim 6, wherein the step of applying the solder paste is performed by screen printing. The step of covering the to-be-processed board with a first protective film, exposing the plurality of gold-finger lines, and gold-plating the plurality of gold-finger lines to form a plurality of gold fingers further comprises: covering the to-be-processed board with anti-plating oil except for the plurality of gold-finger lines and the connection between each gold-finger line and the corresponding gold wire; gold-plating the plurality of gold-finger lines and the connection between each gold-finger line and the corresponding gold wire; removing the anti-plating oil.

8. The method of manufacturing a printed circuit board according to claim 1, wherein The step of etching the to-be-processed board after the plurality of gold fingers are formed to remove the plurality of gold wires to obtain the printed circuit board further comprises: printing ink on the to-be-processed board to solder mask the to-be-processed board.

9. A printed circuit board, characterized by The printed circuit board is obtained by the method for manufacturing a printed circuit board according to any one of claims 1-8.

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