A multifunctional and high-efficiency semiconductor vacuum coating and testing equipment

Abstract

The present invention discloses a multifunctional and high-efficiency semiconductor vacuum coating and detection equipment, which includes a first vacuum chamber, a second vacuum chamber and a third vacuum chamber that are connected in sequence through vacuum pipelines; a connecting rod is movably installed in a movable window formed on the top of the first vacuum chamber, and a sample stage is installed at the end of the connecting rod. The first vacuum chamber also has: a sealing component, when the connecting rod moves in the movable window, the sealing component can always keep the pressure in the first vacuum chamber stable; a moving component, which can control the movement of the sample stage in the first vacuum chamber through the connecting rod; a vacuum sample transfer rod, which is arranged on the side of the first vacuum chamber; the present invention can solve the problem that traditional coating equipment is only responsible for coating and cannot analyze and detect the thin film formed on the semiconductor surface, and the coating equipment rotates the sample in situ and cannot be changed according to the position of the evaporation source, which affects the uniformity of the thin film forming on the surface of the semiconductor substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor vacuum coating, and in particular to a multifunctional and high-efficiency semiconductor vacuum coating and detection device. Background Art

[0002] Evaporation refers to a process in which a certain heating evaporation method is used under vacuum conditions to evaporate the coating material (or flotation material) and vaporize it, so that the particles fly to the surface of the substrate and condense into a film.

[0003] Vacuum coating / thin film deposition is an important step in the semiconductor chip manufacturing process. Depending on the different coating materials used, common coating equipment includes inorganic coating equipment and organic coating equipment. Traditional coating equipment is only responsible for coating and cannot analyze and detect the thin film formed on the semiconductor surface. It has a single function. In addition, the coating equipment on the market rotates the sample in situ and cannot change according to the position of the evaporation source, which affects the uniformity of the thin film formation on the surface of the semiconductor substrate. Summary of the Invention

[0004] In order to overcome the above shortcomings, the object of the present invention is to provide a multifunctional and high-efficiency semiconductor vacuum coating and testing equipment.

[0005] In order to achieve the above object, the technical solution adopted by the present invention includes a first vacuum chamber, a second vacuum chamber and a third vacuum chamber connected in sequence by vacuum pipelines;

[0006] Wherein, a high-resolution morphology detection device is provided in the second vacuum chamber, and an electrical signal detection device is provided in the third vacuum chamber;

[0007] A movable window is formed on the top of the first vacuum chamber, a connecting rod is movably installed in the movable window, a sample stage is installed on the portion of the connecting rod located in the first vacuum chamber, an evaporation source group is provided at the bottom of the first vacuum chamber, and the first vacuum chamber further comprises:

[0008] a sealing assembly, disposed on the movable window and extending to the outside of the first vacuum chamber, wherein the sealing assembly is capable of always maintaining a stable pressure in the first vacuum chamber when the connecting rod moves in the movable window;

[0009] a moving assembly, disposed on the first vacuum chamber, capable of controlling the movement of the sample stage within the first vacuum chamber via the connecting rod;

[0010] The vacuum sample transfer rod is arranged at the side of the first vacuum chamber and is used to selectively take the sample on the sample stage and place it on the morphology detection device or the electrical signal detection device through the vacuum pipeline.

[0011] The present application sets up a first vacuum chamber, a second vacuum chamber and a third vacuum chamber connected by a vacuum pipeline, so that after the film is formed on the surface of the substrate, the substrate is always in a vacuum state when it is transported to the second vacuum chamber and the third vacuum chamber for testing through a vacuum sample transfer rod, avoiding external contamination of the film on the surface of the substrate and causing inaccurate test results, and has practicality; at the same time, when evaporating raw materials, the three-dimensional position of the sample stage can be adjusted by controlling the operation of the moving component, thereby further improving the uniformity of the film forming on the surface of the substrate.

[0012] In the preferred technical solution of the above-mentioned semiconductor vacuum coating and testing equipment, the sealing component includes:

[0013] a bellows, which is sealed on the movable window;

[0014] A fixing seat is arranged on the top of the bellows and is used to seal the bellows.

[0015] In the preferred technical solution of the above-mentioned semiconductor vacuum coating and testing equipment, the moving component includes:

[0016] The first driving cylinder is arranged on the top of the first vacuum chamber, and the extended shaft end of the first driving cylinder can be selectively connected to the sealing component.

[0017] In the preferred technical solution of the above-mentioned semiconductor vacuum coating and testing equipment, the moving component further includes:

[0018] The second driving cylinder is provided on the vacuum chamber and is used for driving the first driving cylinder and the sealing component to move vertically synchronously.

[0019] In the preferred technical solution of the above-mentioned semiconductor vacuum coating and testing equipment, a driving motor is installed on the top surface of the fixing seat, and the driving motor is used to drive the connecting rod to rotate.

[0020] In the preferred technical solution of the above-mentioned semiconductor vacuum coating and testing equipment, a temperature control component is provided on the vacuum pipeline, and the temperature control component is used to control the rapid heating or cooling of the substrate.

[0021] This application sets up a temperature control component to quickly cool down or heat up the thin film on the surface of the substrate according to different experimental requirements, thereby achieving efficient temperature control and meeting the temperature diversity of the samples to be tested. At the same time, it can ensure that the substrate can be efficiently connected between various devices and is practical.

[0022] In the preferred technical solution of the aforementioned semiconductor vacuum coating and testing equipment, a vacuum gate valve is provided on the vacuum pipeline. This arrangement allows for the separation of the first and second vacuum chambers, and the separation of the second and third vacuum chambers, thereby reducing the possibility of vapor in the first vacuum chamber entering the second and third vacuum chambers through the vacuum pipeline, and improving the accuracy of the data obtained from thin film testing.

[0023] In the preferred technical solution of the above-mentioned semiconductor vacuum coating and detection equipment, a sensor component is provided in the first vacuum chamber, and the sensor component can detect the low-resolution morphology of the sample and the pressure and temperature in the first vacuum chamber.

[0024] In the preferred technical solution of the above-mentioned semiconductor vacuum coating and detection equipment, the evaporation source group is located outside the sensor assembly.

[0025] In the preferred technical solution of the above-mentioned semiconductor vacuum coating and testing equipment, an elastic stainless steel wire is installed in the bellows.

[0026] The beneficial effect of the present invention is that, when the semiconductor substrate is evaporated, the three-dimensional position of the sample stage can be adjusted by controlling the operation of the moving component, thereby improving the uniformity of the thin film forming on the substrate surface. After the thin film is formed on the substrate surface, when the substrate is transported to the second vacuum chamber and the third vacuum chamber for testing through the vacuum sample transfer rod, the entire chamber body is always in a vacuum state, avoiding external contamination of the thin film on the substrate surface and causing inaccurate test results, which is practical. By setting a temperature control component, the thin film on the substrate surface can be quickly cooled or heated according to different experimental requirements, thereby achieving efficient temperature control, meeting the temperature diversity of the samples to be tested, and ensuring that the substrate can be efficiently connected between various devices, which is practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is the front view of the present invention;

[0028] Figure 2 is a cross-sectional view of the present invention;

[0029] Figure 3 is a schematic diagram of the sensor assembly and evaporation source group;

[0030] In the figure: first vacuum chamber 1, second vacuum chamber 2, third vacuum chamber 3, vacuum pipeline 4, organic evaporation source 51, inorganic evaporation source 52, sensor assembly 6, vacuum sample transfer rod 7, movable window 8, connecting rod 9, sample stage 11, bellows 12, fixing seat 13, first driving cylinder 14, second driving cylinder 15, driving motor 16, temperature control assembly 17. DETAILED DESCRIPTION

[0031] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0032] It should be noted that, in the description of the present invention, terms such as "upper," "lower," "left," "right," "front," and "rear" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. These are merely for ease of description and are not intended to indicate or imply that the device or component described must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0033] Furthermore, it should be noted that, in the description of the present invention, unless otherwise expressly specified or limited, the terms "disposed," "connected," and "connected" should be understood in a broad sense, and may refer to, for example, a fixed connection, a detachable connection, or an integral connection. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0034] like Figures 1 to 3 As shown, a multifunctional high-efficiency semiconductor vacuum coating and detection equipment of the present invention includes a first vacuum chamber 1, a second vacuum chamber 2 and a third vacuum chamber 3 connected in sequence by a vacuum pipeline 4, a high-resolution morphology detection device is installed in the second vacuum chamber 2, and the high-resolution morphology detection device can realize high-resolution morphology detection of the thin film formed on the semiconductor substrate, and an electrical signal detection device is provided in the third vacuum chamber 3, and the electrical signal detection device can detect the electrical performance of the product, and the electrical signal detection device is a probe station. It should be noted that the first vacuum chamber 1, the second vacuum chamber 2 and the third vacuum chamber 3 are all sealed with a switch chamber door (not shown in the drawings) and a vacuum pump (not shown in the drawings), and the three vacuum pumps are used to vacuum the first vacuum chamber 1, the second vacuum chamber 2 and the third vacuum chamber 3 respectively. The present application sets up a first vacuum chamber 1, a second vacuum chamber 2 and a third vacuum chamber 3 connected by a vacuum pipe 4, so that after the film is formed on the surface of the substrate, the substrate is always in a vacuum state when it is transported to the second vacuum chamber 2 and the third vacuum chamber 3 for inspection, avoiding the contamination of the external environment on the film on the surface of the substrate and causing inaccurate detection results, and has practicality.

[0035] In one or more embodiments, vacuum gate valves (not shown) are provided on both vacuum lines 4. This arrangement allows for separation between the first vacuum chamber 1 and the second vacuum chamber 2, and between the second vacuum chamber 2 and the third vacuum chamber 3, thereby reducing the possibility of steam within the first vacuum chamber 1 entering the second vacuum chamber 2 and the third vacuum chamber 3 through the vacuum line 4.

[0036] See also Figure 2 、 Figure 3 An evaporation source group and a sensor assembly 6 are provided at the lower part of the interior of the first vacuum chamber 1. The evaporation source group includes an organic evaporation source 51 and an inorganic evaporation source 52. The sensor assembly 6 includes at least a low-resolution morphology detection sensor, a temperature sensor and a pressure sensor. The low-resolution morphology detection sensor is used to detect the properties of the thin film formed on the surface of the substrate. The temperature sensor and the pressure sensor are used to detect the temperature and pressure in the first vacuum chamber 1, respectively.

[0037] See also Figure 1 、 Figure 2 A vacuum sample transfer rod 7 is provided on the side of the first vacuum chamber 1. The vacuum sample transfer rod 7 is a mature existing technology. Specifically, AMF or AMFW series products can be selected. The vacuum sample transfer rod 7 can clamp the semiconductor substrate so that the substrate can enter the second vacuum chamber 2 or the third vacuum chamber 3 from the first vacuum chamber 1. It can be understood that when the vacuum sample transfer rod 7 controls the movement of the substrate, the first vacuum chamber 1, the second vacuum chamber 2 and the third vacuum chamber 3 always maintain a vacuum state.

[0038] See also Figure 2 A movable window 8 is formed on the top of the first vacuum chamber 1. The movable window 8 is circular and a connecting rod 9 is provided in the movable window 8. One end of the connecting rod 9 extends into the first vacuum chamber 1 through the movable window 8, and a sample stage 11 for clamping the semiconductor substrate is installed at the end. It can be understood that the movable window 8 is large enough to allow the connecting rod 9 to drive the sample stage 11 to move above the predetermined evaporation source.

[0039] See also Figure 2 A sealing assembly and a moving assembly are provided above the first vacuum chamber 1. The sealing assembly is used to keep the first vacuum chamber 1 in a vacuum state at all times when the connecting rod 9 moves. The moving assembly can control the sample stage 11 to move in the first vacuum chamber 1 through the connecting rod 9.

[0040] Specifically, the sealing assembly includes a flexible bellows 12 and a fixed seat 13 disposed on top of the flexible bellows 12. The fixed seat 13 is capable of sealing the top of the bellows 12. The moving assembly includes a first drive cylinder 14 and a second drive cylinder 15. It should be noted that a drive motor 16 is disposed on top of the fixed seat 13 to rotate the connecting rod 9. This arrangement improves the uniformity of thin film formation on the substrate surface and increases the product yield.

[0041] In one embodiment, the first driving cylinder 14 has a first driving cylinder 14, and the extended shaft end of the first driving cylinder 14 can be selectively clamped and connected to the fixed seat 13 through a clamp (not shown in the drawings); by controlling the operation of the first driving cylinder 14, the fixed seat 13, the connecting rod 9 and the sample stage 11 can be synchronously moved along the extended axis direction of the first driving cylinder 14, thereby realizing the movement of the sample stage 11 in the first vacuum chamber 1, and the operation is convenient.

[0042] In other embodiments, the first driving cylinders 14 are provided with a plurality of cylinders and are evenly arranged with the central axis of the first vacuum chamber 1 as the center. The following description is based on the fact that there are three first driving cylinders 14. When the first driving cylinder 14 in the X-axis direction is working, the extended shaft ends of the first driving cylinders 14 on the Y-axis and the Z-axis are not connected to the fixed seat 13. At this time, the fixed seat 13 can drive the connecting rod 9 and the sample stage 11 to move along the X-axis direction. Correspondingly, when the first driving cylinder 14 on the Y-axis is working, the extended shaft ends of the first driving cylinders 14 on the X-axis and the Z-axis are not connected to the fixed seat 13 is connected. When the first driving cylinder 14 on the Z axis is working, the extended shaft ends of the first driving cylinders 14 on the X axis and the Y axis are not connected to the fixed seat 13, so that the sample stage 11 can move independently along the X axis, the Y axis, and the Z axis and move to above the predetermined evaporation source. Compared with traditional vacuum coating equipment, the present application can change the position of the sample stage 11 in the first vacuum chamber 1 so that the sample stage 11 is moved above the predetermined evaporation source, thereby improving the effect of thin film forming on the substrate, improving the yield rate and thin film forming rate of the present application, and having practicality.

[0043] See also Figure 1 、 Figure 2 The moving assembly also includes a second driving cylinder 15 provided on the top of the first vacuum chamber 1. The extending shaft of the second driving cylinder 15 can drive one or more first driving cylinders 14 to move vertically. In this application, the second driving cylinder 15 is provided to push the first driving cylinder 14 to move vertically, thereby realizing the vertical lifting and lowering of the fixed seat 13, the connecting rod 9, and the sample stage 11, thereby realizing the height adjustment of the sample stage 11 in the first vacuum chamber 1 to meet different evaporation requirements.

[0044] In one or more embodiments, a temperature control assembly 17 is provided on the two vacuum lines 4. The temperature control assembly 17 is used to control the rapid heating or cooling of the thin film on the surface of the substrate. The temperature control assembly 17 includes a heating unit and a cooling unit. The heating unit may be composed of heating wires evenly arranged on the vacuum lines 4, and the cooling unit may be composed of a conventional cooling water pipe. The temperature control assembly 17 also includes a temperature sensor, which is used to detect the temperature of the thin film within the area of ​​the temperature control assembly 17. By providing the temperature control assembly 17, the present application can achieve efficient temperature control by rapidly cooling or heating the thin film on the surface of the substrate according to different experimental requirements, thereby meeting the temperature diversity of the samples to be tested, and at the same time ensuring that the substrate can be efficiently connected between various devices, thereby having practicality.

[0045] In one or more embodiments, an elastic stainless steel wire is installed in the bellows 12. This arrangement increases the resilience and service life of the bellows 12.

[0046] The specific implementation process is as follows:

[0047] Open the chamber door, place the frit on the predetermined evaporation source, place the semiconductor substrate on the bottom of the sample table 11, control the three vacuum pumps to evacuate the first vacuum chamber 1, the second vacuum chamber 2 and the third vacuum chamber 3, and close the vacuum gate valve at the same time.

[0048] When the sample stage 11 needs to be adjusted in height, the second driving cylinder 15 is controlled to drive the first driving cylinder 14 to move vertically.

[0049] When the sample stage 11 needs to be adjusted horizontally, the first driving cylinder 14 in the corresponding direction is controlled to extend the shaft end and connect to the fixed base 13, and the extended shaft ends of the first driving cylinders 14 at other positions are disconnected from the fixed base 13. After that, the first driving cylinder 14 is controlled to work to move the sample stage 11 to above the predetermined evaporation source.

[0050] When the substrate is processed and formed, the driving motor 16 always drives the connecting rod 9 and the sample stage 11 to rotate to improve the uniformity of the film forming on the substrate. After the film on the substrate surface is formed, the evaporation source is controlled to stop working, and the substrate is clamped by manually operating the vacuum sample transfer rod 7, and the substrate is controlled to enter the vacuum pipeline 4 and the temperature is adjusted by the temperature control component 17. After that, the vacuum gate valve is opened so that the substrate clamped by the vacuum sample transfer rod 7 can enter the high-resolution morphology detection device in the second vacuum chamber 2 to achieve further detection of the film on the substrate surface and improve the qualified rate of the obtained product. After the morphology detection is completed, the vacuum sample transfer rod 7 is controlled to clamp the substrate and continue to move forward, and the above operation is repeated so that the substrate can meet the conditions for entering the third vacuum chamber 3. After the substrate is placed on the electrical signal detection device (probe station), the electrical signal detection device can detect the electrical properties of the product and further improve the qualified rate of the obtained product.

[0051] The above embodiments are only for illustrating the technical concept and features of the present invention. Its purpose is to enable people familiar with this technology to understand the content of the present invention and implement it. It cannot be used to limit the scope of protection of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. A multifunctional and high-efficiency semiconductor vacuum coating and testing equipment, characterized in that: comprising a first vacuum chamber, a second vacuum chamber and a third vacuum chamber connected in sequence through vacuum pipelines; Wherein, a high-resolution morphology detection device is provided in the second vacuum chamber, and an electrical signal detection device is provided in the third vacuum chamber; A movable window is formed on the top of the first vacuum chamber, a connecting rod is movably installed in the movable window, a sample stage is installed on the portion of the connecting rod located in the first vacuum chamber, an evaporation source group is provided at the bottom of the first vacuum chamber, and the first vacuum chamber further comprises: A sealing assembly, comprising a bellows and a fixing seat, wherein the bellows is sealingly arranged on the movable window, and the fixing seat is arranged on the top of the bellows for sealing the bellows; A moving assembly includes three first drive cylinders provided on the top of the first vacuum chamber and a second drive cylinder provided on the top of the first vacuum chamber, wherein the extended shaft ends of the three first drive cylinders can selectively clamp the fixed seat, and the second drive cylinder is used to drive the first drive cylinders and the sealing assembly to move vertically synchronously. The moving assembly also includes a drive motor provided on the top surface of the fixed seat, and the drive motor is used to drive the connecting rod to rotate. A vacuum sample transfer rod is provided on the side of the first vacuum chamber and is used to selectively take the substrate on the sample stage and place it on the shape detection device or the electrical signal detection device through a vacuum pipeline; A temperature control component is provided on the vacuum pipeline between the first vacuum chamber and the second vacuum chamber and between the second vacuum chamber and the third vacuum chamber, and includes a heating unit and a cooling unit for rapidly cooling or heating the thin film on the surface of the substrate; The vacuum gate valve is arranged on the vacuum pipeline between the first vacuum chamber and the second vacuum chamber and between the second vacuum chamber and the third vacuum chamber, and is used to control the opening and closing of the vacuum pipeline.

2. The multifunctional, high-efficiency semiconductor vacuum coating and testing equipment according to claim 1, characterized in that: A sensor assembly is provided in the first vacuum chamber, and the sensor assembly can detect the low-resolution morphology of the sample and the pressure and temperature in the first vacuum chamber.

3. The multifunctional, high-efficiency semiconductor vacuum coating and testing equipment according to claim 2, characterized in that: The evaporation source group is located outside the sensor assembly.

4. The multifunctional, high-efficiency semiconductor vacuum coating and testing equipment according to claim 1, characterized in that: An elastic stainless steel wire is installed in the corrugated tube.

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