A rotating cathode magnetic field magnetron sputtering device

Abstract

The present invention relates to a magnetron sputtering device, and in particular to a rotating cathode magnetic field magnetron sputtering device. The device comprises a target-substrate fixing frame, a magnetic pole rotating frame and a cam slide rail structure. The target-substrate fixing frame is a ring, an inner layer is provided with a substrate to be plated, an outer layer is provided with a target material, and six working areas are formed in a one-to-one correspondence. A loading electrode is provided at the upper end of the target-substrate fixing frame to form a stable electric field between the target material and the substrate. The magnetic pole rotating frame is coaxially installed with the target-substrate fixing frame through a rolling bearing and a top screw, and the magnetic pole is driven to rotate by a driving pulley. The cam slide rail structure utilizes a cam column on the magnetic pole to move on an annular cam surface, so that the magnetic pole that performs a rotating motion simultaneously performs an up and down linear motion on the slide rail, so that a uniform magnetic field is always on the working surface of the target material, thereby improving the utilization rate of the target material and the sputtering uniformity, improving the quality of the cathode magnetic field, and making the quality of the thin film deposited on the substrate surface better.

Description

Technical Field

[0001] The invention relates to a magnetron sputtering device, in particular to a rotating cathode magnetic field magnetron sputtering device. Background Art

[0002] Nowadays, the rapid development of social science and technology has led to an increasing demand for functional films for a large number of key devices in various industries. Magnetron sputtering technology is a coating technology commonly used in various industries. Magnetron sputtering devices are also one of the important equipment for vacuum coating, but it still has some defects. The magnetron sputtering device currently used uses electrons under the action of an orthogonal electromagnetic field to continuously bombard the surface of the target material, so that the sputtered target particles are deposited on the substrate to form a thin film. However, most of the magnetic field devices used are static, which makes the size of the magnetic field different in the sputtering working area of ​​the target material, which will cause uneven sputtering and etching of the target surface to form a surface profile similar to a "runway". In areas with high plasma density, severe sputtering and etching will also occur, presenting deeper grooves, thereby reducing the utilization rate of the target material and affecting the stability of the sputtering process and the quality of the deposited film. Summary of the invention

[0003] The present invention aims to solve the defects of the prior art and provides a rotating cathode magnetic field magnetron sputtering device, which can improve the sputtering rate of the target material to a certain extent, extend the service life of the target material, and ensure the uniform distribution of the magnetic field on the target surface, thereby meeting the requirements and needs for the magnetron sputtering device under different circumstances.

[0004] To achieve the above-mentioned purpose, the present invention adopts the following technical scheme, including a target material-substrate fixing frame, a magnetic pole rotating frame, a magnetic pole cam sliding mechanism, a target material and a magnet cooling system, all of which are located in a vacuum chamber; the target material-substrate fixing frame is annular and is used to install the target material and the substrate to be plated; a cooling box is placed around the target material; the magnetic pole rotating frame is coaxially installed with the target material-substrate fixing frame through a rolling bearing and a top screw, and drives the magnetic pole to rotate through a driving pulley; the cam slide rail structure moves on the annular cam surface through the cam column on the magnetic pole, so that the magnetic pole performing rotational motion simultaneously performs up and down linear motion on the slide rail, and a cooling box is arranged around the magnet movement area.

[0005] Furthermore, the substrate to be plated is installed inside (one layer) of the target-substrate fixing frame, and the target is installed outside (one layer), and six working areas are formed in a one-to-one correspondence. A loading electrode is installed at the upper end of the target-substrate fixing frame to form a stable electric field between the target material and the substrate, and the target material and the substrate can be replaced through the upper end opening of the vacuum chamber.

[0006] Furthermore, the target material and the substrate are both in the shape of circular arc rings.

[0007] Furthermore, the upper end of the magnetic pole rotating frame is coaxially mounted on the fixed shaft with the target-substrate fixed frame through a rolling bearing, and the lower end is mounted on the hollow rotating shaft through a top screw. The hollow rotating shaft is mounted on the vacuum chamber through a flange bearing and is driven to rotate by a driving pulley. The permanent magnet and yoke combination are mounted on the magnetic pole rotating frame through a slider and a slide rail, and rotate with the rotating frame.

[0008] Furthermore, the magnetic pole cam sliding mechanism includes a cam, a cam column, a slide rail and a slider, wherein the cam is a circular ring with a cam track on its inner arc surface, and the cam is fixed on the vacuum chamber through a cam mounting hole; the cam column is fixed above the magnetic pole combination, connected to the yoke, and connected to the slide rail through a slider, and the slide rail is fixed on the rotating frame. While the magnet makes a circular motion, the cam column will move on the cam track, thereby driving the magnetic pole combination to make an up and down linear motion on the slide rail through the slider, so that the uniform magnetic field generated by the permanent magnet and the yoke is always on the working surface of the target material.

[0009] Furthermore, both the target material and the magnet are equipped with cooling devices. On the outside of the target material-substrate fixing frame, a target material cooling box is installed on the fixing frame through the mounting hole. The water inlet pipe of the cooling box is connected to the outside through the hollow fixed shaft, and the water outlet pipe is connected to the outside through the hollow rotating shaft (thereby realizing the circulation of cooling water and achieving the effect of cooling the target material). The magnet cooling box is located on the periphery of the rotating motion of the magnet and is installed on the vacuum chamber through the mounting hole; the water inlet and outlet pipes of the magnet cooling box are connected to the outside through the connecting hole of the vacuum chamber.

[0010] Compared with the prior art, the present invention has beneficial effects.

[0011] The present invention utilizes a rotating mechanism to drive the magnetic pole combination to rotate, and utilizes a cam mechanism to enable the magnetic pole combination to move up and down while rotating. Under the cooperation of the magnet and the magnetic yoke, a uniform and stable magnetic field will be generated in the space. Through the rotating movement, each target surface can have the same uniform magnetic field, so that the target material is fully utilized, and the sputtering rate of the target material and the quality of substrate film deposition are improved. In addition, this magnetron sputtering device uses a magnetic pole rotating mechanism to obtain six working areas, which can improve the working efficiency of thin film sputtering. Thereby better meeting the working requirements and needs of various functional thin film sputtering. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. The protection scope of the present invention is not limited to the following description.

[0013] Figure 1 This is a diagram of the internal structure of a rotating cathode magnetic field magnetron sputtering device of the present invention.

[0014] Figure 2 It is a structural diagram of a rotating cathode magnetic field-cam slide rail motion mechanism of a rotating cathode magnetic field magnetron sputtering device of the present invention.

[0015] Figure 3 It is an overall external view of a rotating cathode magnetic field magnetron sputtering device of the present invention.

[0016] Figure 4 It is a top view of a rotating cathode magnetic field magnetron sputtering device of the present invention.

[0017] In the figure, 1 is a permanent magnet cooling box, 2 is a circular cam, 3 is a target cooling box, 4 is a target-substrate fixing frame, 5 is a rolling bearing, 6 is a vacuum chamber, 7 is a flange coupling, 8 is a hollow fixed shaft, 9 is a water inlet channel of the target cooling box, 10 is a magnet rotating frame, 11 is a cam column, 12 is a loading electrode, 13 is a yoke, 14 is a substrate, 15 is a permanent magnet, 16 is a linear slider, 17 is a target, 18 is a hexagonal screw 2, 19 is a flange bearing, and 20 is a driving pulley , 21 is a hollow rotating shaft, 22 is a water outlet channel of a target cooling box, 23 is a fixed end of a permanent magnet cooling box, 24 is a water outlet channel of a permanent magnet cooling box, 25 is a flange coupling fixing hole, 26 is a linear slide rail, 27 is an inner hexagonal screw one, 28 is a cam mounting end, 29 is an inner hexagonal screw three, 30 is a hinge, 31 is an upper end cover plate, 32 is a vacuum hole, 33 is a water inlet channel of a permanent magnet cooling box, 34 is a grounding hole, 35 is a target-substrate inlet and outlet, and 36 is a cam mounting hole. DETAILED DESCRIPTION

[0018] The invention discloses a rotating cathode magnetic field magnetron sputtering device, comprising a permanent magnet rotating mechanism, a magnetic pole cam sliding mechanism, a target material-substrate fixing device, a target material-substrate and a magnet cooling system.

[0019] The entire structural device is located in a vacuum chamber, and the permanent magnet rotating mechanism includes a magnetic pole combination, a magnet rotating frame, a rolling bearing, a flange bearing, a driving pulley and a hollow rotating shaft, which is driven by an external driving device so that the magnetic pole combination follows the rotating frame to perform circular motion.

[0020] There is also a cooling box outside the magnetic pole rotating frame, which is divided into four parts and arranged in a circle in the area where the magnet rotates. It is installed on the vacuum chamber and plays a role in cooling the magnetic pole combination. The magnetic pole cam sliding mechanism includes a cam, a cam column, and a linear slide rail combination. The cam is a circular ring with a cam column motion track on the internal cylindrical surface. The cam is installed on the vacuum chamber. The cam column and the magnetic pole combination are installed together and move up and down through the linear slide rail combination.

[0021] The target-substrate fixing device comprises a flange coupling, a hollow fixed shaft, a target-substrate fixing frame, a mounting screw and a loading electrode. The hollow fixed shaft is mounted on the vacuum chamber through the flange coupling. The target-substrate fixing frame is mounted on the fixed shaft through the screw. The substrate is placed inside the target-substrate fixing frame. A total of six substrates can be placed inside the target-substrate fixing frame and are connected together through the wires in the connecting groove. Six targets are installed on the outer layer of the target-substrate fixing frame. They correspond to the six substrates one by one and are also connected together through the wires in the connecting groove. A cooling water tank is also installed on the outer periphery of the six targets to cool the targets through water circulation. A loading electrode is also installed on the upper end of the target-substrate fixing frame. Voltage is applied to the target and the substrate through the wire connection. The substrate is grounded so that a stable electric field is generated in the area between the target and the substrate.

[0022] Example 1: Figure 1-2 As shown, the rotating cathode magnetic field magnetron sputtering device includes three major parts, all of which are placed in the vacuum chamber 6.

[0023] The first is the target-substrate fixing structure inside the magnetron sputtering device, which is composed of the following components: target cooling box 3, target-substrate fixing frame 4, hexagonal screw 27, loading electrode 12, flange coupling 7, hollow fixed shaft 8, substrate 14, target 17. Among them, the target cooling box 3 is installed on the fixed target-substrate fixing frame 4, contacts with the target material for cooling, and the target cooling box water inlet channel 9 is connected to the outside through the middle channel of the hollow fixed shaft 8, and the target cooling box water outlet channel 22 is connected to the outside through the middle channel of the hollow rotating shaft 21. The target-substrate fixing frame 4 is installed on the hollow fixed shaft 8 using the hexagonal screw 27, and the hollow fixed shaft 8 is installed on the flange coupling 7 using the hexagonal screw 27, and then the flange coupling 7 is fixed to the vacuum chamber through the flange coupling fixing hole 25. The target 17 and the substrate 14 are placed inside the target-substrate holder 4, and correspond to each other one by one, with a total of six groups. The loading electrode 12 is installed at the upper end of the target-substrate holder 4, and provides a stable electric field for magnetron sputtering by loading voltage.

[0024] The second is the magnetic pole rotation structure of the magnetron sputtering device, which is composed of the following components: permanent magnet cooling box 1, rolling bearing 5, magnet rotating frame 10, yoke 13, permanent magnet 15, hexagon socket screw 18, flange bearing 19, drive pulley 20, hollow rotating shaft 21. Among them, the upper end of the magnet rotating frame 10 is connected to the rolling bearing 5 and fixed on the hollow fixed shaft 8, and the lower end is fixed on the hollow rotating shaft 21 through the hexagonal screw 18. The hollow rotating shaft 21 is installed on the vacuum chamber 6 using the flange bearing 19, and then a driving pulley 20 is installed on the hollow rotating shaft 21, which can be driven by an external driving device to rotate the magnet rotating frame 10. The yoke 13 and the permanent magnet 15 are installed on the magnet rotating frame 10 to follow its rotational movement, and there is a permanent magnet cooling box 1 in the peripheral area where the magnet rotates, which is installed on the vacuum chamber 6 through the permanent magnet cooling box fixed end 23, so that it can play a cooling role when the magnet moves.

[0025] The third is the cam linear motion structure of the magnetron sputtering device, which is composed of the following components: annular cam 2, cam column 11, linear slider 16, and linear slide rail 26. Among them, while the magnet rotating frame 10 drives the magnetic pole combination to rotate, the cam column 11 installed on the upper end of the magnetic pole combination will move on the cam track of the inner cylindrical surface of the annular cam 2, thereby carrying the magnetic pole combination through the linear slider 16 to make up and down reciprocating motion on the linear slide rail 26, and the annular cam 2 is installed on the vacuum chamber through the cam mounting end 28.

[0026] Example 2: Figure 3-4 As shown, the entire rotating cathode magnetic field magnetron sputtering device is cylindrical, with an upper end cover 31 at the upper end portion, which is connected to the vacuum chamber 6 through a hinge 30, and the upper end surface of the vacuum chamber 6 has a vacuum hole 32 and a grounding hole 34, and the upper end interior of the vacuum chamber 6 is a two-layer structure, the lower layer has six target-substrate inlets and outlets 35 relative to the position of the target 17 and the substrate 14, through which the target 17 and the substrate 14 can be installed and removed, and the upper end cover 31 installed in the upper layer can be closed and opened.

[0027] The working process is as follows:

[0028] First, the substrate 14 of the workpiece to be coated is placed through the upper port onto the target-substrate fixing frame 4 in the magnetron sputtering device, on which there are six installation positions, and the target can also be replaced, then the upper cover plate 31 is closed, and the vacuum hole 32 is used to make the entire interior of the device a vacuum area and filled with Ar particles, and at the same time, the loading electrode 12 is used to load voltage on the target 17, the substrate 14 is grounded through the grounding hole 34, and the six targets 17 and the six substrates 14 are connected together, so that a stable electric field is formed in the annular area between the target 17 and the substrate 14, and the target cooling box 3 realizes the circulation of cooling water through the target cooling box water inlet channel 9 and the target cooling box water outlet channel 22, thereby cooling the target, and then the driving pulley 20 drives the magnet to rotate through an external driving device. The rotating frame 10 rotates, and the permanent magnets 15 and the yoke 13 on the magnet rotating frame 10 cooperate with each other to form a magnetic field. During the rotation process, a magnetic field will be provided for the six working targets 17. At the same time, the cam column 11 at the upper end of the magnetic pole combination will move on the annular cam 2, thereby carrying the magnetic pole combination to make up and down linear motion on the linear slide rail 26, so that the magnetic field generated by the magnetic pole combination also moves up and down, and the magnetic field of magnetron sputtering on the target surface becomes a dynamic magnetic field, so that the uniform magnetic field always moves in the working area of ​​the target surface. At the same time, there is a permanent magnet cooling box 1 on the periphery of the rotating area of ​​the magnet rotating frame 3, which realizes the circulation of cooling water through the permanent magnet cooling box water inlet channel 33 and the permanent magnet cooling box water outlet channel 24, thereby cooling the rotating magnetic pole combination to ensure the stability of magnetron sputtering. After a period of time, when the substrates 14 in the six working areas have completed magnetron sputtering coating, the loading electrode 12 can stop applying voltage, then turn off the external rotation drive device, and then open the upper cover plate 31 of the target material-substrate inlet and outlet 35, take out the coated workpiece substrate 14, and complete the entire sputtering process.

[0029] It can be understood that the above specific description of the present invention is only used to illustrate the present invention and is not limited to the technical solutions described in the embodiments of the present invention. Those skilled in the art should understand that the present invention can still be modified or replaced by equivalents to achieve the same technical effects; as long as the use requirements are met, they are within the protection scope of the present invention.

Claims

1. A rotating cathode magnetic field magnetron sputtering device, comprising a target-substrate fixing frame, a magnetic pole rotating frame, a magnetic pole cam sliding mechanism, a target and a magnet cooling system, all of which are located in a vacuum chamber; characterized in that: The target-substrate fixing frame is annular and is used to install the target and the substrate to be plated; A cooling box is placed around the target; The magnetic pole rotating frame is coaxially mounted with the target-substrate fixing frame through rolling bearings and top screws, and drives the magnetic pole to rotate through a driving pulley; The cam slide rail structure moves the cam column on the magnetic pole on the annular cam surface, so that the magnetic pole that performs the rotational motion simultaneously performs the up and down linear motion on the slide rail, and there is a cooling box outside the magnet movement area; The substrate to be plated is installed inside the target-substrate fixing frame, and the target is installed outside, and six working areas are formed one by one. A loading electrode is installed on the upper end of the target-substrate fixing frame to form a stable electric field between the target and the substrate, and the target and the substrate can be replaced through the upper end opening of the vacuum chamber; The magnetic pole cam sliding mechanism comprises a cam, a cam column, a slide rail and a slider, wherein the cam is a circular ring, a cam track is provided on the inner arc surface thereof, and the cam is fixed on the vacuum chamber through a cam mounting hole; the cam column is fixed above the magnetic pole combination, connected with the magnetic yoke, and connected with the slide rail through a slider, and the slide rail is fixed on the rotating frame, and while the magnet makes a circular motion, the cam column will move on the cam track, thereby driving the magnetic pole combination to make a linear motion up and down on the slide rail through the slider, so that the uniform magnetic field generated by the permanent magnet and the magnetic yoke is always on the working surface of the target material; Both the target material and the magnet are equipped with cooling devices. The target material cooling box is installed on the fixing frame through the mounting hole outside the target material-substrate fixing frame. The water inlet pipe of the cooling box is connected with the outside through the hollow fixed shaft, and the water outlet pipe is connected with the outside through the hollow rotating shaft. The magnet cooling box is located at the periphery of the rotating motion of the magnet and is installed on the vacuum chamber through the mounting hole; the water inlet and outlet pipes of the magnet cooling box are connected with the outside through the connecting hole of the vacuum chamber.

2. The rotating cathode magnetic field magnetron sputtering device according to claim 1, characterized in that: The target material and the substrate are both in the shape of circular arc rings.

3. The rotating cathode magnetic field magnetron sputtering device according to claim 1, characterized in that: The upper end of the magnetic pole rotating frame is coaxially mounted on the fixed shaft with the target-substrate fixing frame through a rolling bearing, and the lower end is mounted on the hollow rotating shaft through a top screw. The hollow rotating shaft is mounted on the vacuum chamber through a flange bearing and is driven to rotate by a driving pulley. The permanent magnet and the yoke combination are mounted on the magnetic pole rotating frame through a slider and a slide rail, and rotate with the rotating frame.

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