Heat exchange assembly and water cooling plate

Abstract

The application relates to the technical field of water-cooling plates, and relates to a heat exchange assembly, which comprises a semiconductor refrigerating sheet one, the semiconductor refrigerating sheet one is movably inserted on the surface of a heat exchange cylinder, the surface of the semiconductor refrigerating sheet one is provided with a fixing rod, the surface of the fixing rod is provided with a fixing assembly, and the fixing assembly is used for fixing the semiconductor refrigerating sheet one; the surface of the fixing rod is movably inserted with a limiting assembly, the surface of the heat exchange cylinder is movably inserted with a semiconductor refrigerating sheet two, and the limiting assembly is used for limiting the semiconductor refrigerating sheet two; the surface of the limiting assembly is movably inserted with a control assembly, and the control assembly is used for limiting the limiting assembly; the semiconductor refrigerating sheet one and the semiconductor refrigerating sheet two can be taken out at the same time by adjusting a handle, the whole can not only meet the disassembly of one group of semiconductor refrigerating sheet two, but also facilitate the disassembly of multiple groups of semiconductor refrigerating sheet two.

Description

Technical Field

[0001] This invention relates to the field of water-cooled plates, specifically to a heat exchange component and a water-cooled plate. Background Technology

[0002] Water-cooled plates, also known as water-cooled radiators or liquid-cooled plates, use water or other media (such as antifreeze or ethanol) to lower the temperature of equipment, enabling it to operate more efficiently.

[0003] In the prior art, a heat exchange component is provided, which includes a spiral feed vane and a semiconductor cooling plate. The circulating water after absorbing heat flows into the heat exchange cylinder through a connecting pipe. During the flow, the circulating water passes through the spiral feed vane, so that the circulating water repeatedly comes into contact with the semiconductor cooling plate at various heights. Thus, the heat is repeatedly absorbed from the circulating water through the heat absorption end of the semiconductor cooling plate, thereby improving the heat exchange effect of the water-cooled radiator.

[0004] However, since the thermoelectric cooler is fixed to the surface of the heat exchange cylinder, the overall operation is more complicated when the thermoelectric cooler needs to be replaced due to a problem. If the thermoelectric cooler is installed individually, it needs to be installed and removed one by one; if the thermoelectric cooler is installed as a whole, it increases the heat exchange cost of the water-cooled radiator. Summary of the Invention

[0005] The purpose of this invention is to provide a heat exchange component and a water-cooled plate to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a heat exchange assembly, including a first thermoelectric cooler, which is movably inserted into the surface of a heat exchange cylinder. A fixing rod is provided on the surface of the first thermoelectric cooler, and a fixing component is provided on the surface of the fixing rod to fix the first thermoelectric cooler. A limiting component is movably inserted into the surface of the fixing rod, and a second thermoelectric cooler is movably inserted into the surface of the heat exchange cylinder, with the limiting component limiting the second thermoelectric cooler. A control component is movably inserted into the surface of the limiting component to limit the limiting component.

[0007] Preferably, the fixing assembly includes a positioning shaft, a connecting plate, a limiting plate, a positioning piece, and a rubber belt. The positioning shaft is located on the surface of the fixing rod, the connecting plate is sleeved on the surface of the positioning shaft, the limiting plate is integrally formed on the surface of the connecting plate, the limiting plate has an arc-shaped plate structure, and the limiting plate is movably inserted into the surface of the heat exchange cylinder. The positioning piece has a square plate structure, is located on the surface of the fixing rod, and the rubber belt is located between the positioning piece and the connecting plate.

[0008] Preferably, the limiting component includes a plugging rod, an adjusting handle, an auxiliary rod, a limiting cover, and a limiting plate. The plugging rod has a "T"-shaped cylindrical structure and is movably plugged on the surface of the movable slot hole. The movable slot hole is opened on the surface of the fixed rod, and a spring is provided between the surface of the plugging rod and the fixed rod. The spring is sleeved on the surface of the plugging rod. The adjusting handle is arranged on the surface of the plugging rod and has a "匚"-shaped plate structure. The auxiliary rod is arranged at one end of the adjusting handle and has a circular cylindrical structure. The limiting cover is sleeved on the surface of the auxiliary rod, and a positioning lower ring and a positioning upper ring are provided on the surface of the auxiliary rod. The limiting cover is located between the positioning lower ring and the positioning upper ring, and a first spring is provided between the surface of the positioning upper ring and the limiting cover. The first spring is sleeved on the surface of the auxiliary rod. The limiting plate is arranged on the surface of the auxiliary rod, and a handle is provided on the surface of the limiting cover.

[0009] Preferably, a card slot and a guiding slot are opened on the surface of the second semiconductor refrigeration sheet. One end of the limiting cover is located in the card slot, the auxiliary rod is located in the guiding slot, and the limiting plate is located in the limiting card slot. The limiting card slot is opened on the surface of the second semiconductor refrigeration sheet.

[0010] Preferably, the control component includes a plug rod, a guiding inclined surface, a squeezing block, a plastic elastic sheet, and a second spring. The plug rod has a "T"-shaped cylindrical structure and is movably plugged on the surface of the adjusting handle. The guiding inclined surface is opened on the surface of the plug rod and has an annular groove structure with a triangular cross-section. One end of the plug rod is movably plugged in the limiting hole. The limiting hole is opened on the surface of the first semiconductor refrigeration sheet.

[0011] Preferably, the squeezing block is movably plugged on the surface of the adjusting handle and has an "L"-shaped plate structure. A slope matching the guiding inclined surface is opened on the surface of the squeezing block, and the slope contacts the surface of the guiding inclined surface. The plastic elastic sheet is arranged between the surface of the squeezing block and the adjusting handle, and protrusions are provided at the notch of the surface of the squeezing block and the adjusting handle. The protrusions play a role in limiting the squeezing block to prevent the squeezing block from falling off the surface of the adjusting handle. The second spring is arranged between the surface of the adjusting handle and the plug rod and is sleeved on the surface of the plug rod.

[0012] Preferably, waterproof strips are provided on the surfaces of the first semiconductor refrigeration sheet and the second semiconductor refrigeration sheet that contact the heat exchange cylinder.

[0013] A water cooling plate includes the heat exchange component described above.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] The heat exchange assembly proposed in this invention allows for easy disassembly of semiconductor refrigeration element 1 and multiple semiconductor refrigeration elements 2 by simultaneously grasping the adjustment handle, squeezing the clamping block, and pulling upwards. At this time, one end of the insertion rod disengages from the limiting hole, and the entire adjustment handle moves upwards, causing the limiting plate on the surface of the auxiliary rod to be positioned in the limiting slot. The connecting plate and the insertion rod no longer contact each other. Then, the limiting hanging plate is pulled out from the surface of the heat exchange cylinder. By adjusting the adjustment handle, semiconductor refrigeration element 1 and multiple semiconductor refrigeration elements 2 can be removed at the same time. The number of semiconductor refrigeration elements 2 can be set according to actual needs. The assembly not only satisfies the disassembly of a single semiconductor refrigeration element 2, but also facilitates the disassembly of multiple semiconductor refrigeration elements 2 simultaneously. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the present invention;

[0017] Figure 2 This is a schematic diagram of the control component structure of the present invention;

[0018] Figure 3 This is a schematic diagram of the limiting component structure of the present invention;

[0019] Figure 4 This is a schematic diagram of the fixing rod structure of the present invention;

[0020] Figure 5 This is a half-sectional schematic diagram of the structure of the present invention;

[0021] Figure 6 This is a schematic diagram of the connection structure between the fixed rod and the auxiliary rod of the present invention;

[0022] Figure 7 for Figure 5 Enlarged view of point A in the middle;

[0023] Figure 8 This is a schematic diagram of the second structure of the semiconductor cooling chip of the present invention.

[0024] In the diagram: 1. Heat exchange cylinder; 2. Spiral feeder blade; 3. Semiconductor cooling chip 1; 4. Fixing rod; 5. Positioning shaft; 6. Connecting plate; 61. Limiting hanging plate; 7. Positioning piece; 8. Rubber strip; 9. Waterproof strip; 10. Movable slot; 11. Insert rod; 12. Adjustment handle; 13. Auxiliary rod; 14. Limiting cover; 15. Lower positioning ring; 16. Upper positioning ring; 17. Spring 1; 18. Handle; 19. Limiting plate; 20. Limiting slot; 21. Semiconductor cooling chip 2; 22. Slot; 23. Guide groove; 24. Insert rod; 25. Guide slope; 26. Grip block; 27. Plastic elastic sheet; 28. Spring 2; 29. ​​Finger groove; 30. Limiting hole. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the present invention clear and complete, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of the present invention, and are merely illustrative of the embodiments of the present invention. They are not intended to limit the embodiments of the present invention. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] Example 1

[0027] Please see Figures 1-8 This invention provides a technical solution: a heat exchange assembly, including a first thermoelectric cooler 3, which is movably inserted into the surface of a heat exchange cylinder 1. A fixing rod 4 is provided on the surface of the first thermoelectric cooler 3, and a fixing component is provided on the surface of the fixing rod 4 to fix the first thermoelectric cooler 3. A limiting component is movably inserted into the surface of the fixing rod 4. A second thermoelectric cooler 21 is movably inserted into the surface of the heat exchange cylinder 1, and the limiting component limits the second thermoelectric cooler 21. A control component is movably inserted into the surface of the limiting component to limit the limiting component. While holding the adjustment handle 12... Squeeze the clamping block 26 and pull upwards. At this time, one end of the insertion rod 24 disengages from the limiting hole 30. Move the handle 12 upwards to move the limiting plate 19 on the surface of the auxiliary rod 13 into the limiting slot 20. The connecting plate 6 and the insertion rod 11 will no longer be in contact. Then pull the limiting hanging plate 61 out from the surface of the heat exchange cylinder 1. The semiconductor refrigeration chip 3 and multiple sets of semiconductor refrigeration chips 21 can be removed at the same time by moving the handle 12. The number of semiconductor refrigeration chips 21 can be set according to actual needs. The whole system not only satisfies the disassembly of a certain set of semiconductor refrigeration chips 21, but also facilitates the disassembly of multiple sets of semiconductor refrigeration chips 21 at the same time.

[0028] Example 2

[0029] On the basis of the first embodiment, the fixing component includes a positioning shaft 5, a connecting plate 6, a limiting hanging plate 61, a positioning piece 7, and a rubber band 8. The positioning shaft 5 is provided on the surface of the fixing rod 4. The connecting plate 6 is sleeved on the surface of the positioning shaft 5. The limiting hanging plate 61 is integrally formed on the surface of the connecting plate 6. The limiting hanging plate 61 is in an arc-shaped plate structure, and the limiting hanging plate 61 is movably inserted on the surface of the heat exchange cylinder 1. The positioning piece 7 is in a square plate structure, and the positioning piece 7 is provided on the surface of the fixing rod 4. The rubber band 8 is provided between the positioning piece 7 and the connecting plate 6. The limiting component includes a plugging rod 11, an adjusting handle 12, an auxiliary rod 13, a limiting cover 14, and a limiting plate 19. The plugging rod 11 is in a "T"-shaped cylinder structure. The plugging rod 11 is movably inserted on the surface of the movable slot hole 10. The movable slot hole 10 is opened on the surface of the fixing rod 4, and a spring is provided between the plugging rod 11 and the surface of the fixing rod 4. The spring is sleeved on the surface of the plugging rod 11. The adjusting handle 12 is provided on the surface of the plugging rod 11. The adjusting handle 12 is in a "匚"-shaped plate structure. The auxiliary rod 13 is provided at one end of the adjusting handle 12. The auxiliary rod 13 is in a circular cylinder structure. The limiting cover 14 is sleeved on the surface of the auxiliary rod 13, and a positioning lower ring 15 and a positioning upper ring 16 are provided on the surface of the auxiliary rod 13. The limiting cover 9 is located between the positioning lower ring 15 and the positioning upper ring 16. A first spring 17 is provided between the positioning upper ring 16 and the surface of the limiting cover 14. The first spring 17 is sleeved on the surface of the auxiliary rod 13. The limiting plate 19 is provided on the surface of the auxiliary rod 13, and a handle 18 is provided on the surface of the limiting cover 14. The whole semiconductor refrigeration chip 3 is integrally inserted on the surface of the heat exchange cylinder 1. Rotate the connecting plate 6 so that one end of the limiting hanging plate 61 is movably inserted on the surface of the heat exchange cylinder 1. Under the action of the rubber band 8, the limiting hanging plate 61 will not easily fall off from the surface of the heat exchange cylinder 1, and at this time, one end of the plugging rod 11 contacts the surface of the connecting plate 6 under the action of the spring, and one end of the inserting rod 24 is inserted into the limiting hole 30. At the same time, the semiconductor refrigeration chip 21 is inserted on the surface of the heat exchange cylinder 1. Move the limiting cover 14 through the handle 18. The limiting cover 14 moves between the positioning lower ring 15 and the positioning upper ring 16. Under the action of the first spring 17, one end of the limiting cover 14 is inserted into the card slot 22 on the surface of the semiconductor refrigeration chip 21, completing the installation and disassembly of the semiconductor refrigeration chip 21.

[0030] Embodiment Three

[0031] Based on Embodiment 2, the surface of the second semiconductor cooling chip 21 is provided with a slot 22 and a guide groove 23. One end of the limiting cover 14 is located in the slot 22, the auxiliary rod 13 is located in the guide groove 23, and the limiting plate 19 is located in the limiting slot 20. The limiting slot 20 is opened on the surface of the second semiconductor cooling chip 21. The control component includes a plug rod 24, a guide slope 25, a pinch block 26, a plastic elastic sheet 27, and a second spring 28. The plug rod 24 has a "T"-shaped column structure and is movably inserted into the surface of the adjustment handle 12. The guide slope 25 is opened on the surface of the plug rod 24. The guide slope 25 is an annular groove structure with a triangular cross-section, and one end of the insertion rod 24 is movably inserted into the limiting hole 30. The limiting hole 30 is opened on the surface of the semiconductor cooling chip 3. The clamping block 26 is movably inserted into the surface of the adjustment handle 12. The clamping block 26 has an "L"-shaped plate structure, and the surface of the clamping block 26 has a slope that matches the guide slope 25. The slope is in contact with the surface of the guide slope 25. The plastic elastic sheet 27 is disposed between the surfaces of the clamping block 26 and the adjustment handle 12, and the grooves on the surfaces of the clamping block 26 and the adjustment handle 12 are provided with protrusions. The blocks and protrusions limit the clamping block 26, preventing it from detaching from the surface of the adjusting handle 12. A second spring 28 is positioned between the surfaces of the adjusting handle 12 and the insertion rod 24, sleeved on the surface of the insertion rod 24. When the adjusting handle 12 is gripped and the clamping block 26 is squeezed, it is pulled upwards. The clamping block 26 presses against the guide slope 25, causing the insertion rod 24 to move as a whole. At this point, one end of the insertion rod 24 disengages from the limiting hole 30. The overall upward movement of the adjusting handle 12 causes the limiting plate 19 on the surface of the auxiliary rod 13 to be positioned within the limiting slot 20. Furthermore, the movement of the adjusting handle 12... As the movable plug rod 11 moves, the connecting plate 6 and the plug rod 11 no longer contact each other. Then, the limiting hanging plate 61 is pulled out from the surface of the heat exchange cylinder 1. The semiconductor refrigeration chip 3 and multiple sets of semiconductor refrigeration chips 21 can be removed simultaneously by adjusting the handle 12. The number of semiconductor refrigeration chips 21 is set according to actual needs. The whole system not only satisfies the disassembly of a certain set of semiconductor refrigeration chips 21, but also facilitates the disassembly of multiple sets of semiconductor refrigeration chips 21 at the same time. The grooves on the surface of the pinch block 26 and the adjusting handle 12 are provided with protrusions to prevent the pinch block 26 from falling off the surface of the adjusting handle 12.

[0032] A water-cooled plate, including the aforementioned heat exchange assembly.

[0033] In actual use, the first thermoelectric cooler 3 is inserted into the surface of the heat exchange cylinder 1. The connecting plate 6 is rotated so that one end of the limiting plate 61 is inserted into the surface of the heat exchange cylinder 1. Under the action of the rubber band 8, the limiting plate 61 will not easily detach from the surface of the heat exchange cylinder 1. At this time, one end of the insertion rod 11 contacts the surface of the connecting plate 6 under the action of the spring, and one end of the insertion rod 24 is inserted into the limiting hole 30. Simultaneously, the second thermoelectric cooler 21 is inserted into the surface of the heat exchange cylinder 1. The limiting cover 14 is moved by the handle 18, moving between the lower positioning ring 15 and the upper positioning ring 16. Under the action of the spring 17, one end of the limiting cover 14 is inserted into the slot 22 on the surface of the second thermoelectric cooler 21, completing the installation and removal of the second thermoelectric cooler 21. Furthermore, when it is necessary to remove both the first thermoelectric cooler 3 and the second thermoelectric cooler 21 simultaneously, the adjustment handle 12 is held. Simultaneously, the clamping block 26 is squeezed and pulled upwards. The clamping block 26 presses against the guide slope 25, causing the insertion rod 24 to move as a whole. At this time, one end of the insertion rod 24 disengages from the limiting hole 30. The adjusting handle 12 moves upwards, causing the limiting plate 19 on the surface of the auxiliary rod 13 to be located in the limiting slot 20. The moving of the adjusting handle 12 also causes the insertion rod 11 to move. The connecting plate 6 and the insertion rod 11 no longer contact each other. Then, the limiting hanging plate 61 is pulled out from the surface of the heat exchange cylinder 1. The semiconductor refrigeration chip 3 and multiple sets of semiconductor refrigeration chips 21 can be removed simultaneously by adjusting the handle 12. The number of semiconductor refrigeration chips 21 is set according to actual needs. The whole system not only satisfies the disassembly of a certain set of semiconductor refrigeration chips 21, but also facilitates the disassembly of multiple sets of semiconductor refrigeration chips 21 at the same time. The grooves on the surfaces of the clamping block 26 and the adjusting handle 12 are provided with protrusions to prevent the clamping block 26 from falling off the surface of the adjusting handle 12.

[0034] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat exchange assembly, comprising a semiconductor refrigeration sheet one (3) which is movably inserted on the surface of a heat exchange cylinder (1), characterized in that: The surface of the semiconductor cooling sheet one (3) is provided with a fixing rod (4), the surface of the fixing rod (4) is provided with a fixing assembly, the fixing assembly fixes the semiconductor cooling sheet one (3); the surface of the fixing rod (4) is movably inserted with a limiting assembly, the surface of the heat exchange cylinder (1) is movably inserted with a semiconductor cooling sheet two (21), and the limiting assembly limits the semiconductor cooling sheet two (21); the surface of the limiting assembly is movably inserted with a control assembly, and the control assembly limits the limiting assembly; The fixing assembly comprises a positioning shaft (5), a connecting plate (6), a limiting hanging plate (61), a positioning sheet (7) and a rubber belt (8), the positioning shaft (5) is arranged on the surface of the fixing rod (4), the connecting plate (6) is sleeved on the surface of the positioning shaft (5), the limiting hanging plate (61) is integrally formed on the surface of the connecting plate (6), the limiting hanging plate (61) is in an arc plate structure, the limiting hanging plate (61) is movably inserted on the surface of the heat exchange cylinder (1), the positioning sheet (7) is in a square plate structure, the positioning sheet (7) is arranged on the surface of the fixing rod (4), and the rubber belt (8) is arranged between the positioning sheet (7) and the connecting plate (6); The limiting assembly comprises an insertion rod (11), a moving handle (12), an auxiliary rod (13), a limiting cover (14) and a limiting plate (19), the insertion rod (11) is in a "T" shaped column structure, the insertion rod (11) is movably inserted on the surface of the movable slot hole (10), the movable slot hole (10) is arranged on the surface of the fixing rod (4), and a spring is arranged between the insertion rod (11) and the surface of the fixing rod (4), the spring is sleeved on the surface of the insertion rod (11), the moving handle (12) is arranged on the surface of the insertion rod (11), the moving handle (12) is in a "Fang" shaped plate structure, the auxiliary rod (13) is arranged at one end of the moving handle (12), the auxiliary rod (13) is in a circular column structure, the limiting cover (14) is sleeved on the surface of the auxiliary rod (13), the surface of the auxiliary rod (13) is provided with a positioning lower ring (15) and a positioning upper ring (16), the limiting cover (14) is located between the positioning lower ring (15) and the positioning upper ring (16), a spring (17) is arranged between the positioning upper ring (16) and the surface of the limiting cover (14), the spring (17) is sleeved on the surface of the auxiliary rod (13), and the limiting plate (19) is arranged on the surface of the auxiliary rod (13); The surface of the semiconductor cooling sheet two (21) is provided with a clamping groove (22) and a guide groove (23), one end of the limiting cover (14) is located in the clamping groove (22), the auxiliary rod (13) is located in the guide groove (23), and the limiting plate (19) is located in a limiting clamping groove (20) arranged on the surface of the semiconductor cooling sheet two (21). The control assembly comprises an insertion rod (24), a guide slope (25), a pinching block (26), a plastic elastic sheet (27) and a spring (28). The insertion rod (24) is in the shape of a "T"-shaped column body structure and is movably inserted into the surface of the adjusting handle (12). The guide slope (25) is arranged on the surface of the insertion rod (24) and is in the shape of a ring groove body structure with a triangular cross section. One end of the insertion rod (24) is movably inserted into a limiting hole (30) arranged on the surface of the semiconductor refrigeration sheet (3). The pinching block (26) is movably inserted into the surface of the adjusting handle (12) and is in the shape of an "L"-shaped plate structure. A slope matched with the guide slope (25) is arranged on the surface of the pinching block (26) and is in contact with the surface of the guide slope (25). The plastic elastic sheet (27) is arranged between the surfaces of the pinching block (26) and the adjusting handle (12). The surfaces of the pinching block (26) and the adjusting handle (12) are both provided with protrusions which limit the pinching block (26) and prevent it from falling off the surface of the adjusting handle (12). The spring (28) is arranged between the surfaces of the adjusting handle (12) and the insertion rod (24) and is sleeved on the surface of the insertion rod (24).

2. A heat exchange assembly according to claim 1, wherein: The surfaces of the semiconductor refrigeration sheet (3) and the semiconductor refrigeration sheet (21) in contact with the heat exchange cylinder (1) are both provided with waterproof strips (9).

3. A water cold plate characterized by: The heat exchange assembly comprises the heat exchange assembly according to any one of claims 1-2. The heat exchange assembly comprises the heat exchange assembly according to any one of claims 1-2.

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