Wafer platform with three-point height adjustment parallelism

Abstract

The application discloses a wafer platform with three-point height adjustment parallelism, which comprises a platform body, a leveling bottom plate and a plurality of adjusting mechanisms arranged inside the leveling bottom plate and the platform body; the plurality of adjusting mechanisms are uniformly distributed along the circumference of the platform body; a plurality of suction cups and jacking holes are arranged on the top of the platform body, and the suction cups and the jacking holes are arranged at intervals; a tension spring is arranged between two adjacent adjusting mechanisms, one end of the tension spring is arranged at the bottom of the platform body, and the other end of the tension spring is arranged at the top of the leveling bottom plate; the plurality of adjusting mechanisms are used for adjusting the levelness of the platform body; the three adjusting mechanisms are used for height adjustment of different positions of the platform body, so that the platform can be more accurately adjusted to the required state; meanwhile, the leveling bottom plate and the platform body are fixed through the tension spring, so that the first ball, the second ball or the third ball is prevented from being separated from the corresponding slot, and the adjusting precision is high, and the safety is reliable.

Description

Technical Field

[0001] This invention relates to the field of wafer platform adjustment, and more specifically, to a wafer platform with three-point height adjustment for parallelism. Background Technology

[0002] Currently, in semiconductor wafer metrology, there are often situations where the required plane angle of the product on the testing platform cannot be met, and in most cases, manual operation is used to achieve horizontal placement. Manual operation cannot meet the actual production speed and requirements in terms of adjusting the plane angle of the testing platform, the adjustment speed, and the product placement speed. A fully automated plane angle adjustment technology is needed that can precisely adjust the product to the appropriate plane angle, offering high speed, high efficiency, high precision, and high quality. This platform is designed as a parallel motion multi-axis system, capable of tilting motion. This platform provides ultra-high precision in a miniaturized form, and the combination of non-contact components forms a frictionless motion platform, providing optimal performance, quality, and lifespan. Currently, plane angle adjustment is mostly achieved manually.

[0003] Existing technology requires manual placement of the product onto the testing platform before adjusting the knobs to adjust the platform to the appropriate orientation. This method is time-consuming, slow, inefficient, and human visual inspection or measurement can lead to inaccurate plane angle adjustment and inconsistent performance with repeated adjustments, meaning that the ideal plane angle cannot be obtained. Summary of the Invention

[0004] To address at least one of the aforementioned technical problems, this invention proposes a wafer platform with three-point height adjustment for parallelism.

[0005] The first aspect of the present invention provides a wafer platform for three-point height adjustment parallelism, comprising: a platform body, a leveling base plate, and a plurality of adjustment mechanisms disposed inside the leveling base plate and the platform body;

[0006] Multiple adjustment mechanisms are evenly distributed along the circumference of the platform body;

[0007] The top of the platform body is provided with several suction cups and lifting holes, and the suction cups and lifting holes are arranged at intervals.

[0008] A tension spring is provided between two adjacent adjustment mechanisms. One end of the tension spring is located at the bottom of the platform body, and the other end of the tension spring is located at the top of the leveling base plate.

[0009] The multiple adjustment mechanisms are used to adjust the levelness of the platform body.

[0010] In a preferred embodiment of the present invention, there are three adjustment mechanisms, which are fixedly installed on the top of the leveling base plate. The angle between two adjacent adjustment mechanisms is 120 degrees. The three adjustment mechanisms are a first adjustment mechanism, a second adjustment mechanism, and a third adjustment mechanism.

[0011] In a preferred embodiment of the present invention, a rotating mechanism is provided at the center of the leveling base plate, a lifting platform is provided at the top of the rotating mechanism, a pin is provided at the top of the lifting platform, the position of the pin corresponds one-to-one with the position of the lifting hole, and a cam follower is provided on the outside of the lifting platform.

[0012] In a preferred embodiment of the present invention, a plurality of support plates are provided on the outer side of the rotating mechanism, a connecting block is provided on the top of the support plate, a guide groove is provided on the connecting block, and the cam follower is configured in the guide groove, wherein the height of one end of the guide groove is greater than the height of the other end of the guide groove.

[0013] In a preferred embodiment of the present invention, a driven wheel is provided at the bottom of the rotating mechanism, a motor is provided at the top of the leveling base plate, a driving wheel is connected to the shaft end of the motor, and the driving wheel and the driven wheel are connected by a belt.

[0014] In a preferred embodiment of the present invention, the first adjustment mechanism includes a first linear slide rail and a first horizontal slider connected to the first linear slide rail. A first vertical slider is provided on one side of the first linear slide rail, a first wedge is provided on one side of the first vertical slider, and a first groove is provided on the top of the first wedge.

[0015] In a preferred embodiment of the present invention, the second adjustment mechanism includes a second linear slide rail and a second horizontal slider connected to the second linear slide rail. A second vertical slider is provided on one side of the second linear slide rail, a second wedge is provided on one side of the second vertical slider, and a second groove is provided on the top of the second wedge.

[0016] In a preferred embodiment of the present invention, the third adjustment mechanism includes a third linear slide rail and a third horizontal slider connected to the third linear slide rail. A third vertical slider is provided on one side of the third linear slide rail, and a third wedge is provided on one side of the third vertical slider. A third groove is provided on the top of the third wedge.

[0017] In a preferred embodiment of the present invention, a first support block, a second support block and a third support block are provided circumferentially at the bottom of the platform body. The bottom of the first support block is provided with a V-shaped groove, the bottom of the second support block is provided with a semi-circular groove, and the bottom of the third support block is a planar structure. The first groove, the second groove and the third groove correspond to the positions of the first support block, the second support block and the third support block, respectively.

[0018] In a preferred embodiment of the present invention, a first sphere is disposed between the first slot and the first support block, a second sphere is disposed between the second slot and the second support block, and a third sphere is disposed between the third slot and the third support block.

[0019] The technical solution of the present invention has the following advantages compared with the prior art:

[0020] This invention uses three adjustment mechanisms to adjust the height of the platform body at different positions, enabling more precise adjustment to the desired state. Simultaneously, the leveling base plate is fixed to the platform body by tension springs to prevent the first, second, or third spheres from dislodging from their corresponding slots. This ensures high adjustment accuracy and safety. Furthermore, the product is placed on the platform via the lifting and lowering of the ejector pin mechanism, and a negative pressure suction cup firmly adheres the product to the top of the platform. This eliminates the need for manual placement of the product onto the testing platform. The tilting platform is ideal for high-precision applications such as wafer inspection, fiber optic positioning, optical positioning, flat panel screen inspection, maskless lithography, and ultra-light LED manufacturing, offering high flexibility in use. Attached Figure Description

[0021] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, some of the drawings in the following description are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the three-dimensional structure of the wafer platform according to an embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of the distribution of the adjustment mechanism according to an embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the bottom structure of the adjustable base plate according to an embodiment of the present invention;

[0025] Figure 4 This is a schematic diagram of the bottom structure of the platform body in an embodiment of the present invention.

[0026] In the diagram, 1. Platform body, 101. First support block, 102. First sphere, 103. Second support block, 104. Second sphere, 105. Third support block, 106. Third sphere, 2. First adjustment mechanism, 201. First horizontal slider, 202. First vertical slider, 203. First wedge, 204. First slot, 3. Tension spring, 4. Leveling base plate, 5. Second adjustment mechanism, 501. Second horizontal slider, 502. Second vertical slider, 503. Second wedge, 504. Second slot, 6. Third adjustment mechanism, 601. Third slot, 7. Suction cup, 8. Lifting hole, 9. Adsorption valve, 10. Rotation mechanism, 1001. Support plate, 11. Connecting block, 12. Lifting platform, 13. Cam follower, 14. Motor, 15. Ejector pin, 16. Driven wheel, 17. Driving wheel. Detailed Implementation

[0027] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0028] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0029] Example 1

[0030] See Figure 1-4 As shown, this invention proposes a wafer platform with three-point height adjustment for parallelism, comprising: a platform body 1, a leveling base plate 4, and multiple adjustment mechanisms disposed on the inner side of the leveling base plate 4 and the platform body 1; the multiple adjustment mechanisms are evenly distributed along the circumference of the platform body 1; the top of the platform body 1 is provided with a plurality of suction cups 7 and lifting holes 8, the suction cups 7 and lifting holes 8 being spaced apart; a tension spring 3 is disposed between two adjacent adjustment mechanisms, one end of the tension spring 3 being disposed at the bottom of the platform body 1, and the other end of the tension spring 3 being disposed at the top of the leveling base plate 4; the multiple adjustment mechanisms are used to adjust the levelness of the platform body 1.

[0031] According to an embodiment of the present invention, the suction cup 7 is connected to an adsorption valve 9. The negative pressure of the suction cup 7 is adjusted by the adsorption valve 9 to adsorb the product, so that the product is firmly attached to the top of the platform body 1. There are 3 adjustment mechanisms, which are fixedly installed on the top of the leveling base plate 4. The angle between two adjacent adjustment mechanisms is 120 degrees. The three adjustment mechanisms are the first adjustment mechanism 2, the second adjustment mechanism 5 and the third adjustment mechanism 6.

[0032] According to an embodiment of the present invention, a rotating mechanism 10 is provided at the center of the leveling base plate 4, a lifting platform 12 is provided at the top of the rotating mechanism 10, a pin 15 is provided at the top of the lifting platform 12, the position of the pin 15 corresponds one-to-one with the position of the lifting hole 8, and a cam follower 13 is provided on the outside of the lifting platform 12.

[0033] According to an embodiment of the present invention, a plurality of support plates 1001 are provided on the outer side of the rotating mechanism 10, a connecting block 11 is provided on the top of the support plate 1001, a guide groove is provided on the connecting block 11, and a cam follower 13 is provided in the guide groove. The height of one end of the guide groove is greater than the height of the other end of the guide groove.

[0034] According to an embodiment of the present invention, a driven wheel 16 is provided at the bottom of the rotating mechanism 10, a motor 14 is provided at the top of the leveling base plate 4, a driving wheel 17 is connected to the shaft end of the motor 14, and the driving wheel 17 and the driven wheel 16 are connected by a belt.

[0035] In a specific example of the present invention, the first adjustment mechanism 2 includes a first linear slide rail and a first horizontal slider 201 connected to the first linear slide rail. A first vertical slider 202 is provided on one side of the first linear slide rail, and a first wedge 203 is provided on one side of the first vertical slider 202. A first slot 204 is provided on the top of the first wedge 203. The second adjustment mechanism 5 includes a second linear slide rail and a second horizontal slider 501 connected to the second linear slide rail. A second vertical slider 502 is provided on one side of the second linear slide rail, and a second wedge 503 is provided on one side of the second vertical slider 502. A second slot 504 is provided on the top of the second wedge 503. The third adjustment mechanism 6 includes a third linear slide rail and a third horizontal slider connected to the third linear slide rail. A third vertical slider is provided on one side of the third linear slide rail, and a third wedge is provided on one side of the third vertical slider. A third slot 601 is provided on the top of the third wedge.

[0036] Furthermore, the bottom of the platform body 1 is provided with a first support block 101, a second support block 103 and a third support block 105 along the circumferential direction. The bottom of the first support block 101 is provided with a V-shaped groove, the bottom of the second support block 103 is provided with a semi-circular groove, and the bottom of the third support block 105 is a planar structure. The first slot 204, the second slot 504 and the third slot 601 are respectively positioned opposite to the first support block 101, the second support block 103 and the third support block 105. A first sphere 102 is provided between the first slot 204 and the first support block 101, a second sphere 104 is provided between the second slot 504 and the second support block 103, and a third sphere 106 is provided between the third slot 601 and the third support block 105.

[0037] Specifically, the first slot 204, the second slot 504, and the third slot 601 respectively position the first sphere 102, the second sphere 104, and the third sphere 106. The first sphere 102, the second sphere 104, and the third sphere 106 are all steel balls. The first sphere 102 slides along the V-shaped groove, the second sphere 104 is embedded in the semi-circular groove, and the third sphere 106 is attached to the bottom plane of the third support block 105. Through three different cooperation methods, the level of the platform body 1 can be precisely adjusted or the tilt angle and tilt direction of the platform body 1 can be flexibly adjusted.

[0038] In use, this invention first positions the wafer platform using three steel balls. Driven by three adjustment mechanisms, three structurally different support blocks—a first support block 101, a second support block 103, and a third support block 105—are positioned above the steel balls. The first support block 101 has a hemispherical groove below it, providing a fixed point on the product platform. The second support block 103 has a V-shaped groove below it, allowing the steel balls to move a certain distance along the groove. Simultaneously, the V-shaped groove and the hemispherical groove below the first support block 101 provide circumferential positioning, preventing the product platform from rotating circumferentially. The third support block 105 has a flat surface below it, tangential to the steel balls. Three tension springs 3 are installed between the leveling base plate 4 and the platform body 1 to prevent the steel balls from slipping out of the first groove 204, the second groove 504, or the third groove 601 during horizontal adjustment.

[0039] The driving pulley 17, mounted on the motor 14, drives the driven pulley 16 to rotate via the synchronous belt. The driven pulley 16 drives the support plate 1001 to rotate. When the support plate 1001 is driven to rotate, the cam follower 13 moves along the guide groove, thereby lifting the lifting platform 12 and driving the ejector pin 15 to realize the lifting and lowering of the product on the platform body 1.

[0040] In summary, this invention uses three adjustment mechanisms to adjust the height of the platform body 1 at different positions, enabling more precise adjustment of the platform to the required state. Simultaneously, the leveling base plate 4 is fixed to the platform body 1 by a tension spring 3, preventing the first ball 102, the second ball 104, or the third ball 106 from dislodging from their corresponding slots. This ensures high adjustment accuracy and safety. Furthermore, the product is placed on the platform by the lifting mechanism of the ejector pin 15, and the negative pressure suction cup 7 firmly adheres the product to the top of the platform. This eliminates the need for manual placement of the product onto the testing platform. The tilting platform is ideal for high-precision applications such as wafer inspection, fiber optic positioning, optical positioning, flat panel screen inspection, maskless lithography, and super LED manufacturing, offering high flexibility in use.

[0041] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0042] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to the above embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0043] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A three-point height-adjustable parallelism wafer platform, characterized in that, The utility model relates to a platform, including: Platform body, leveling bottom plate and multiple adjusting mechanisms arranged in the inside of leveling bottom plate and platform body; Multiple adjusting mechanisms are evenly distributed along the circumference of the platform body; The top of the platform body is provided with a plurality of suction cups and jacking holes, and the suction cups and the jacking holes are arranged at intervals; A tension spring is arranged between two adjacent adjusting mechanisms, one end of the tension spring is arranged at the bottom of the platform body, and the other end of the tension spring is arranged at the top of the leveling bottom plate; Multiple adjusting mechanisms are used to adjust the levelness of the platform body; The adjusting mechanism is 3, the adjusting mechanism is fixedly installed on the top of the leveling bottom plate, the angle between two adjacent adjusting mechanisms is 120 degrees, and the three adjusting mechanisms are respectively a first adjusting mechanism, a second adjusting mechanism and a third adjusting mechanism; The first adjusting mechanism comprises a first linear guide rail, a first horizontal sliding block connected with the first linear guide rail, a first vertical sliding block arranged on one side of the first linear guide rail, a first wedge arranged on one side of the first vertical sliding block, and a first notch arranged at the top of the first wedge; The second adjusting mechanism comprises a second linear guide rail, a second horizontal sliding block connected with the second linear guide rail, a second vertical sliding block arranged on one side of the second linear guide rail, a second wedge arranged on one side of the second vertical sliding block, and a second notch arranged at the top of the second wedge; The third adjusting mechanism comprises a third linear guide rail, a third horizontal sliding block connected with the third linear guide rail, a third vertical sliding block arranged on one side of the third linear guide rail, a third wedge arranged on one side of the third vertical sliding block, and a third notch arranged at the top of the third wedge; The bottom of the platform body is provided with a first support block, a second support block and a third support block along the circumference, the bottom of the first support block is provided with a V-shaped groove, the bottom of the second support block is provided with a semicircular groove, and the bottom of the third support block is a plane structure, the first notch, the second notch and the third notch are respectively corresponding to the positions of the first support block, the second support block and the third support block; A first ball is arranged between the first notch and the first support block, a second ball is arranged between the second notch and the second support block, and a third ball is arranged between the third notch and the third support block.

2. The three-point height-adjustable parallelism wafer stage according to claim 1, wherein, A rotating mechanism is arranged at the center position of the leveling bottom plate, a lifting platform is arranged at the top of the rotating mechanism, a jack pin is arranged at the top of the lifting platform, the positions of the jack pins correspond to the positions of the jacking holes one by one, and a cam follower is arranged outside the lifting platform.

3. The three-point height-adjustable parallelism wafer stage according to claim 2, wherein, Multiple support plates are arranged outside the rotating mechanism, a connecting block is arranged at the top of each support plate, a guide groove is arranged on the connecting block, the cam follower is arranged in the guide groove in a matched mode, and the height of one end of the guide groove is greater than the height of the other end of the guide groove.

4. The three-point height-adjustable parallelism wafer stage of claim 2, wherein, A driven wheel is arranged at the bottom of the rotating mechanism, a motor is arranged at the top of the leveling bottom plate, a shaft end of the motor is connected with a driving wheel, and the driving wheel and the driven wheel are connected through a belt.

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