Mirror seat, lens assembly and camera module

Abstract

The application discloses a lens holder, a lens assembly and a camera module. The lens holder comprises a body, a top surface, a bottom surface opposite to the top surface, and a lens mounting hole penetrating from the top surface to the bottom surface; a support part extending and protruding from the edge of the bottom surface of the body in the direction from the top surface of the body to the bottom surface of the body; the support part surrounds the lens mounting hole, and at least one side wall of the support part is provided with a avoiding slot for accommodating an electronic component. The lens assembly comprises a lens and the lens holder, and the lens is mounted in the lens mounting hole of the lens holder. The camera module comprises a circuit board and the lens assembly, the circuit board is provided with at least one electronic component on the surface, and the support part of the lens assembly is fixed to the circuit board. The embodiment of the application can not only reduce the size and realize the miniaturization of the camera module without reducing the area of the photosensitive chip and the number of electronic components, but also prevent light leakage.

Description

Technical Field

[0001] This application relates to the field of optical element technology, and in particular to lens mounts, lens assemblies and camera modules. Background Technology

[0002] With the widespread adoption of smart devices, camera modules used in these devices have experienced rapid development and progress, with miniaturization becoming a key trend. However, to meet the ever-increasing demands of users for photography, camera modules are increasingly featuring larger pixels and larger image sensor areas, making miniaturization difficult without reducing the image sensor area and the number of electronic components.

[0003] Application content

[0004] This application aims to at least solve one of the technical problems existing in the prior art. To this end, embodiments of this application propose a lens mount, lens assembly, and camera module to reduce size and achieve miniaturization of the camera module without reducing the area of ​​the photosensitive chip and the number of electronic components, while preventing light leakage.

[0005] A lens mount according to a first aspect of this application includes: a body having a top surface, a bottom surface opposite to the top surface, and a lens mounting hole extending from the top surface to the bottom surface; and a support portion extending and protruding from the edge of the bottom surface of the body along a direction from the top surface of the body to the bottom surface of the body; wherein the support portion surrounds the lens mounting hole, and at least one side wall of the support portion has a clearance groove for accommodating electronic components.

[0006] According to one embodiment of this application, the clearance groove is formed on the inner side wall of the support or the outer side wall of the support.

[0007] According to one embodiment of this application, the wall thickness of the portion of the support with the clearance groove is no greater than 0.1 mm.

[0008] According to one embodiment of this application, the projection of the clearance groove on the horizontal plane covers the projection of the electronic component on the horizontal plane.

[0009] According to one embodiment of this application, the volume of the clearance groove is larger than the volume of the electronic component.

[0010] A lens assembly according to a second aspect of this application includes: a lens; and a lens mount as described in any of the first aspects; wherein the lens is mounted in the lens mounting hole of the lens mount.

[0011] A camera module according to a third aspect of this application includes: a circuit board; and the lens assembly described in the second aspect; wherein at least one of the electronic components is mounted on the surface of the circuit board, and the support portion of the lens assembly is fixed to the circuit board.

[0012] According to one embodiment of this application, the clearance groove is formed on the inner sidewall of the support portion, and the distance between the edge of the circuit board and the outer edge of the electronic component is adapted to the wall thickness of the support portion at the clearance groove.

[0013] According to one embodiment of this application, the clearance groove is formed on the outer side wall of the support portion, and the edge of the circuit board is flush with the outer edge of the electronic component.

[0014] According to one embodiment of this application, the number of electronic components is multiple, and the upper surface of the electronic components and the surface of the circuit board located between two adjacent electronic components are adhesive coating areas.

[0015] The lens mount, lens assembly, and camera module provided in this application embodiment utilize a recessed groove on the side wall of the support portion of the lens mount to accommodate electronic components. After the lens mount is fixed to the circuit board, the electronic components mounted on the circuit board can be embedded in the support portion. Therefore, the horizontal dimension of the lens mount only needs to ensure that the space enclosed by the inner side wall of the support portion can accommodate the photosensitive chip, eliminating the need to reserve installation space for the electronic components and significantly reducing the horizontal dimension of the lens mount. Furthermore, the lens mount can be fixedly connected to the circuit board using the inner wall of the recessed groove and the portion of the support portion without the recessed groove. This eliminates the need for the circuit board to reserve an adhesive application area around the electronic components, indirectly reducing the size of the camera module. Additionally, to facilitate installation and avoid damage to the electronic components, the recessed groove is typically slightly larger than the electronic components. This means that after the electronic components are embedded in the recessed groove, a certain gap exists between the electronic components and the inner wall of the recessed groove. If the lens mount is fixed to the circuit board with adhesive, this gap may not be completely filled with adhesive, posing a risk of light leakage. Compared to accommodating electronic components by creating through holes in the sidewalls of the support portion, the clearance groove in this embodiment does not penetrate the sidewalls of the support portion. In other words, the wall thickness of the portion of the support portion with the clearance groove is greater than zero. Therefore, this part of the support portion can block light, preventing light leakage through the gap between the electronic components and the clearance groove. In summary, this embodiment not only reduces the size and miniaturizes the camera module without reducing the area of ​​the photosensitive chip and the number of electronic components, but also prevents light leakage.

[0016] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this application, nor is it intended to limit the scope of this application. Other features of this application will become readily apparent from the following description. Attached Figure Description

[0017] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings. The drawings are provided for a better understanding of the invention and are not intended to limit the scope of the application. In the drawings:

[0018] Figure 1 This is a longitudinal sectional view of the mirror mount according to this application;

[0019] Figure 2 This is a bottom view of the mirror mount according to this application;

[0020] Figure 3 This is a three-dimensional schematic diagram of the mirror mount according to this application;

[0021] Figure 4 This is a longitudinal sectional view of the camera module according to this application;

[0022] Figure 5 This is a bottom view of the camera module (without circuit board) according to this application;

[0023] Figure 6 This is a three-dimensional schematic diagram of the camera module according to this application;

[0024] Figure 7 This is an exploded view of the camera module according to this application;

[0025] Figure 8 This is an installation diagram of the camera module according to this application;

[0026] Figure 9 This is a front view schematic diagram of the camera module according to this application;

[0027] Figure 10 This is a front view schematic diagram of the camera module according to this application; and

[0028] Figure 11 This is a top view of the circuit board according to this application.

[0029] Figure label:

[0030] 100. Lens mount; 110. Body; 111. Lens mounting hole; 112. Top surface of the body;

[0031] 113. Bottom surface of the main body; 120. Support part; 121. Clearance groove; 200. Lens;

[0032] 300. Circuit board; 301. Adhesive coating area; 310. Electronic components;

[0033] 320, photosensitive chip; 400, filter. Detailed Implementation

[0034] In the description of the embodiments of this application, it should be noted that the terms "longitudinal," "lateral," "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or state relationship based on the orientation or state relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0035] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0036] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0037] The following description, in conjunction with the accompanying drawings, illustrates exemplary embodiments of this application, including various details to aid understanding. These should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of this application. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0038] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0039] Combination Figures 1 to 3 As shown, this application embodiment provides a lens mount 100, which includes a body 110 and a support portion 120. The body 110 has a top surface, a bottom surface opposite to the top surface, and a lens mounting hole 111 extending from the top surface to the bottom surface. The support portion 120 extends and protrudes from the edge of the bottom surface 113 of the body along a direction from the top surface 112 to the bottom surface 113. The support portion 120 surrounds the lens mounting hole 111, and at least one sidewall of the support portion 120 has a clearance groove 121 for accommodating electronic components. As an example, the electronic components may be, but are not limited to, resistors, capacitors, inductors, diodes, or transistors.

[0040] like Figure 7 and Figure 8 As shown, the following describes the mounting method of the mirror mount 100 on the circuit board 300 in the embodiment of this application: wherein the surface of the circuit board 300 includes a first mounting area and a second mounting area surrounding the first mounting area, the photosensitive chip 320 is mounted in the first mounting area, and the electronic component 310 is mounted in the second mounting area.

[0041] When the fixed lens mount is 100: (e.g.) Figure 11 As shown, firstly, an adhesive such as thermosetting adhesive is applied to the portion of the second mounting area of ​​the circuit board 300 where the electronic component 310 is not mounted. Next, thermosetting adhesive is also applied to the upper surface of the electronic component 310. Then, the lens mounting hole 111 of the lens mount 100 is aligned with the photosensitive chip 320, and the clearance groove 121 of the lens mount 100 is aligned with the corresponding electronic component 310. The lens mount 100 is then gradually moved closer to the circuit board 300 until the bottom surface of the support portion 120 is flush against the surface of the circuit board 300. Finally, the lens mount 100 and the circuit board 300 are baked. After baking, the inner wall of the clearance groove 121 is bonded to the electronic component 310 with thermosetting adhesive, and the portion of the support portion 120 without the clearance groove 121 is directly bonded to the surface of the circuit board 300 with thermosetting adhesive. Thus, the lens mount 100 is firmly fixed to the circuit board 300. It should be noted that, in addition to adhesive bonding (i.e., applying adhesive glue) for fixed connection, the mirror mount 100 and the circuit board 300 can also be fixedly connected by other methods such as hot melt connection and welding.

[0042] As can be seen from the above, since the side wall of the support portion 120 of the mirror mount 100 in this embodiment of the application is provided with a clearance groove 121 for accommodating electronic components 310, therefore, as Figure 4As shown, after the lens mount 100 is fixed to the circuit board 300, the electronic components 310 mounted on the circuit board 300 are embedded in the support portion 120. Therefore, the horizontal dimension of the lens mount 100 only needs to ensure that the space formed by the inner wall of the support portion 120 can accommodate the photosensitive chip 320, without needing to reserve installation space for the electronic components 310, thus significantly reducing the horizontal dimension of the lens mount 100. Furthermore, the lens mount 100 can also be fixedly connected to the circuit board 300 by means of the inner wall of the clearance groove 121 and the portion of the support portion 120 without the clearance groove 121. Therefore, the circuit board 300 does not need to reserve an adhesive application area around the electronic components 310, thereby indirectly reducing the size of the camera module. Furthermore, to facilitate installation and avoid damage to the electronic component 310, the size of the clearance groove 121 is usually slightly larger than the size of the electronic component 310. This means that after the electronic component 310 is embedded in the clearance groove 121, there is a certain gap between the electronic component 310 and the inner wall of the clearance groove 121. If the mirror mount 100 is fixedly connected to the circuit board 300 with adhesive, this gap may not be completely filled with adhesive, posing a risk of light leakage. Compared to accommodating the electronic component 310 by opening a through hole in the side wall of the support portion 120, since the clearance groove 121 in this embodiment does not penetrate the side wall of the support portion 120, meaning the wall thickness of the portion of the support portion 120 with the clearance groove 121 is greater than zero, this portion of the support portion 120 can block light, preventing light leakage through the gap between the electronic component 310 and the clearance groove 121. As can be seen, the lens mount 100 in this embodiment can not only reduce the size and achieve miniaturization of the camera module without reducing the area of ​​the photosensitive chip 320 and the number of electronic components 310, but also prevent light leakage.

[0043] The clearance groove 121 can be positioned in several ways on the side wall of the support 120: the first type, as shown in the figure to... Figure 3 , Figure 9 As shown, the clearance groove 121 is formed on the inner sidewall of the support portion 120, and in this case, the space formed by the inner sidewall of the support portion 120 communicates with the clearance groove 121. The second type, as... Figure 10As shown, the clearance groove 121 is formed on the outer wall of the support portion 120. In this case, the space formed by the inner wall of the support portion 120 and the clearance groove 121 are separated by the remaining side wall of the support portion 120 at the clearance groove 121. In the third case, clearance grooves 121 are formed on both the inner and outer walls of the support portion 120. That is, the space formed by the inner wall of the support portion 120 is only connected to a portion of the clearance grooves 121. Compared to the second method, if the first method is adopted, after the mirror mount 100 is fixed to the circuit board 300, the side of the electronic component 310 facing away from the photosensitive chip 320 is protected by the support portion 120, thereby preventing damage to the electronic component 310 due to external impact. It should be noted that "the inner wall of the support portion 120" generally refers to the side of the support portion 120 facing the photosensitive chip 320, and "the outer wall of the support portion 120" generally refers to the side of the support portion 120 facing away from the photosensitive chip 320.

[0044] Since the mirror mount 100 can be fixedly connected to the circuit board 300 by means of the inner wall of the clearance groove 121 and the part of the support 120 without the clearance groove 121, the circuit board 300 does not need to reserve a glue application area around the electronic component 310. Therefore, the wall thickness d of the part of the support 120 with the clearance groove 121 can be no more than 0.1mm, thereby further reducing the size of the mirror mount 100 in the horizontal direction.

[0045] The projection of the clearance groove 121 onto the horizontal plane covers the projection of the electronic component 310 onto the horizontal plane. In other words, after the mirror mount 100 is fixed to the circuit board 300, all electronic components 310 are embedded in the support portion 120 of the mirror mount 100. The advantage of this arrangement is that, while keeping the horizontal projection areas of the photosensitive chip 320, electronic components 310, and mirror mount 100 unchanged, the contact area between the support portion 120 and the circuit board 300 and the electronic components 310 can be increased, thus improving the stability of the support portion 120 on the circuit board 300. It should be noted that in this embodiment, the "horizontal plane" refers to the plane parallel to the surface of the circuit board 300 when the circuit board 300 is placed horizontally after the mirror mount 100 is fixed to it.

[0046] To facilitate installation and avoid damage to the electronic component 310, the volume of the clearance groove 121 is larger than that of the electronic component 310. The projection shape of the clearance groove 121 in the horizontal and / or vertical planes can be, but is not limited to, circular, elliptical, polygonal, or irregular shapes. For example, the clearance groove 121 is a cuboid groove whose projection shape in both the horizontal and vertical planes is rectangular, and at least one of the length, width, and height of the clearance groove 121 is larger than the corresponding dimensional parameters of the electronic component 310. The following description uses a cuboid groove 121, whose length, width, and height are all larger than the corresponding dimensional parameters of the electronic component 310, as an example to illustrate the installation method of the mirror mount 100 on the circuit board 300:

[0047] like Figure 11 As shown, if there are multiple electronic components 310, then the upper surface of the electronic component 310 and the surface of the circuit board 300 located between two adjacent electronic components 310 are adhesive coating areas 301. During installation: First, thermosetting adhesive is applied to the surface of the electronic component 310 and the surface of the circuit board 300 located between adjacent electronic components 310. Since the length, width, and height of the clearance groove 121 are all greater than the corresponding dimensional parameters of the electronic component 310, there is a certain gap between the electronic component 310 and the inner wall of the clearance groove 121 after the electronic component 310 is embedded in the clearance groove 121. Therefore, in order to fill this gap with thermosetting adhesive, the thickness of the thermosetting adhesive applied to the surface of the electronic component 310 must be greater than the distance between the upper surface of the electronic component 310 and the upper surface of the clearance groove 121. For example, if the distance between the upper surface of the electronic component 310 and the upper surface of the clearance groove 121 is 50µm, then a 150µm thick thermosetting adhesive can be applied to the surface of the electronic component 310. Then, align the lens mounting hole 111 of the lens mount 100 with the photosensitive chip 320, and simultaneously align the clearance groove 121 of the lens mount 100 with the corresponding electronic component 310. Gradually move the lens mount 100 closer to the circuit board 300 until the bottom surface of the support portion 120 is flush against the surface of the circuit board 300. During this process, some of the thermosetting adhesive applied to the upper surface of the electronic component 310 flows into the gap between the side wall of the electronic component 310 and the clearance groove 121 under pressure from the upper surface of the clearance groove 121. Finally, bake the lens mount 100 and the circuit board 300. After baking, the inner wall of the clearance groove 121 is bonded to the electronic component 310 with thermosetting adhesive, and the portion of the support portion 120 without the clearance groove 121 is directly bonded to the surface of the circuit board 300 with thermosetting adhesive. Since the clearance groove 121 does not penetrate the side wall of the support portion 120, even if the thermosetting adhesive does not completely fill the gap between the electronic component 310 and the clearance groove 121, the remaining side wall of the support portion 120 at the clearance groove 121 can still block light and prevent light from leaking through the gap.

[0048] In addition, this application embodiment also provides a lens assembly, which includes a lens 200 and the aforementioned lens mount 100, with the lens 200 mounted in the lens mounting hole 111 of the lens mount 100. The lens 200 can be fixed in the lens mounting hole 111 by, but is not limited to, a detachable connection such as a threaded connection or a snap-fit. For example, the inner wall of the lens mounting hole 111 has an internal thread, and the outer wall of the lens 200 has an external thread that engages with the internal thread. By employing the aforementioned lens mount 100, the lens assembly in this application embodiment not only reduces the size of the camera module without reducing the area of ​​the photosensitive chip 320 and the number of electronic components 310, thus achieving miniaturization, but also prevents light leakage.

[0049] The lens assembly also includes a filter 400 disposed opposite to the lens 200, on the side of the lens 200 facing the bottom surface 113 of the body. The filter 400 can be fixed in the lens mounting hole 111 to reduce the overall size of the lens assembly along the optical axis of the lens 200. Alternatively, the filter 400 can be fixed within the space enclosed by the inner wall of the support portion 120. For ease of maintenance and replacement, the filter 400 can also be detachably connected to the lens mount 100 via a threaded connection or a snap-fit.

[0050] like Figures 4 to 10 As shown in the figure, this application embodiment also provides a camera module, which includes a circuit board 300 and the aforementioned lens assembly; wherein, at least one electronic component 310 is mounted on the surface of the circuit board 300, and the support portion 120 of the lens assembly is fixed to the circuit board 300. By employing the aforementioned lens assembly, the camera module in this application embodiment can not only reduce its size and achieve miniaturization of the camera module without reducing the area of ​​the photosensitive chip 320 and the number of electronic components 310, but also prevent light leakage.

[0051] Since the mirror mount 100 can be fixedly connected to the circuit board 300 by means of the inner wall of the clearance groove 121 and the part of the support 120 where the clearance groove 121 is not provided, the circuit board 300 does not need to reserve a glue application area around the electronic component 310. Therefore, the circuit board 300 can further reduce its horizontal dimensions according to the location of the clearance groove 121. Specifically:

[0052] If the clearance groove 121 is formed on the inner sidewall of the support portion 120, that is, the remaining sidewall of the support portion 120 at the clearance groove 121 is located on the side of the electronic component 310 facing away from the photosensitive chip 320, then in this case, the circuit board 300 only needs to reserve an area for supporting the support portion 120 on the side of the electronic component 310 facing away from the photosensitive chip 320. To further reduce the size of the circuit board 300, the distance between the edge of the circuit board 300 and the outer edge of the electronic component 310 is adapted to the wall thickness of the support portion 120 at the clearance groove 121. For example, when the wall thickness of the support portion 120 at the clearance groove 121 is 0.1 mm, the distance between the edge of the circuit board 300 and the outer edge of the electronic component 310 is also 0.1 mm. Calculations show that, compared to the case where the circuit board 300 requires an additional 0.3mm adhesive application area on the side of the electronic component 310 facing away from the photosensitive chip 320, the embodiment of this application can reduce the area of ​​the circuit board 300 by 16.4%. Of course, when the wall thickness of the support portion 120 at the clearance groove 121 is less than 0.1mm, for example, 0.05mm, the distance between the edge of the circuit board 300 and the outer edge of the electronic component 310 is also reduced to 0.05mm.

[0053] If the clearance groove 121 is formed on the outer side wall of the support portion 120, that is, the remaining side wall of the support portion 120 at the clearance groove 121 is located on the side of the electronic component 310 facing the photosensitive chip 320, then in this case, the circuit board 300 does not need to reserve an area for supporting the support portion 120 on the side of the electronic component 310 facing away from the photosensitive chip 320. In order to further reduce the size of the circuit board 300, the edge of the circuit board 300 is flush with the outer edge of the electronic component 310. That is, the distance between the edge of the circuit board 300 and the outer edge of the electronic component 310 is zero.

[0054] The specific embodiments described above do not constitute a limitation on the scope of protection of this application. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A mirror base, characterized in that, include: The body has a top surface, a bottom surface opposite to the top surface, and a lens mounting hole extending from the top surface to the bottom surface; as well as The support portion extends and protrudes from the edge of the bottom surface of the body along the direction from the top surface of the body to the bottom surface of the body; The support portion surrounds the lens mounting hole, and the inner wall of the support portion has a clearance groove for accommodating electronic components. The space formed by the inner wall of the support portion is connected to the clearance groove, and the wall thickness of the portion of the support portion with the clearance groove is greater than zero.

2. The mirror mount according to claim 1, wherein, The wall thickness of the portion of the support with the clearance groove is no more than 0.1 mm.

3. The mirror mount according to claim 1 or 2, wherein, The projection of the clearance groove on the horizontal plane covers the projection of the electronic component on the horizontal plane.

4. The mirror mount according to claim 3, wherein, The volume of the clearance groove is larger than the volume of the electronic component.

5. A lens assembly, characterized in that, The lens assembly includes: Lens; and The mirror mount as described in any one of claims 1 to 4; The lens is mounted in the lens mounting hole of the lens mount.

6. A camera module, characterized in that, The camera module includes: Circuit boards; and The lens assembly as described in claim 5; At least one of the electronic components is mounted on the surface of the circuit board, and the support portion of the lens assembly is fixed to the circuit board.

7. The camera module according to claim 6, wherein, The clearance groove is formed on the inner sidewall of the support portion, and the distance between the edge of the circuit board and the outer edge of the electronic component is adapted to the wall thickness of the support portion at the clearance groove.

8. The camera module according to claim 6, wherein, The clearance groove is formed on the outer side wall of the support, and the edge of the circuit board is flush with the outer edge of the electronic component.

9. The camera module according to claim 6, wherein, The number of electronic components is multiple, and the upper surface of the electronic components and the surface of the circuit board located between two adjacent electronic components are adhesive coating areas.

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