Heat dissipation device and cabinet equipment

Abstract

The application provides a heat dissipation device and cabinet equipment. The heat dissipation device comprises a heat dissipation body and a porous heat dissipation piece. The heat dissipation body is provided with a cooling medium flow channel, a cooling medium inlet and a cooling medium outlet. The cooling medium inlet and the cooling medium outlet are communicated with the cooling medium flow channel. The porous heat dissipation piece is located in the cooling medium flow channel. The porous heat dissipation piece is provided with a first outer surface and a second outer surface. The first outer surface and the second outer surface are located on two sides of the porous heat dissipation piece. The porous heat dissipation piece is provided with a medium channel penetrating through the first outer surface and the second outer surface, and the medium channel is communicated with the cooling medium flow channel. In this way, the cooling medium is quickly and evenly distributed into the porous structure through the medium channel of the porous heat dissipation piece to occur phase change, the heat exchange contact area of the cooling medium is increased, the heat exchange effect is strengthened, the heat exchange performance of the heat dissipation device is significantly improved, and better heat exchange effect is achieved in a smaller equipment volume.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and more specifically, to a heat dissipation device and cabinet equipment. Background Technology

[0002] In related technologies, data center rack equipment generates a lot of heat when it is working, and the heat dissipation efficiency of traditional rack equipment is low, which affects the working efficiency of the rack equipment. Summary of the Invention

[0003] The present invention provides a heat dissipation device to improve at least one of the above-mentioned problems.

[0004] The embodiments of the present invention achieve the above objectives through the following technical solutions.

[0005] In a first aspect, embodiments of the present invention provide a heat dissipation device. The heat dissipation device includes a heat dissipation body and a porous heat dissipation component. The heat dissipation body has a cooling medium flow channel, a cooling medium inlet, and a cooling medium outlet. The cooling medium inlet and the cooling medium outlet are connected to the cooling medium flow channel. The porous heat dissipation component is located within the cooling medium flow channel. The porous heat dissipation component has a first outer surface and a second outer surface. The first outer surface and the second outer surface are located on opposite sides of the porous heat dissipation component. The porous heat dissipation component has a medium channel penetrating the first outer surface and the second outer surface, and the medium channel is connected to the cooling medium flow channel.

[0006] In some embodiments, the first outer surface and the second outer surface are located on opposite sides of the porous heat sink.

[0007] In some embodiments, each porous heat sink further has a third outer surface connected between the first and second outer surfaces. The third outer surface is provided with a medium flow channel that communicates with a cooling medium flow channel.

[0008] In some embodiments, the cooling medium flow channel includes an inlet flow channel, an outlet flow channel, and multiple sub-flow channels. Each sub-flow channel is connected between the inlet flow channel and the outlet flow channel. Multiple porous heat sinks are provided, with each sub-flow channel having a porous heat sink, and the medium channel of each porous heat sink being connected to the corresponding sub-flow channel.

[0009] In some implementations, the medium channel includes multiple sub-channels arranged at intervals. Each sub-channel is connected to a corresponding sub-channel.

[0010] In some embodiments, the heat dissipation body further includes multiple flow guiding structures. Each sub-channel is connected to one end of the inlet channel and has the flow guiding structure provided, and each flow guiding structure includes multiple flow guiding protrusions arranged at intervals. A liquid distribution port is formed between two adjacent flow guiding protrusions and is connected to the medium channel.

[0011] In some embodiments, the heat dissipation body also includes multiple flow guide bumps located in the inlet flow channel and arranged in a matrix.

[0012] In some embodiments, the heat dissipation device further includes a flow-deflecting structure. The flow-deflecting structure is disposed within the cooling medium flow channel and located between the heat dissipation body and the porous heat sink.

[0013] In some embodiments, the turbulence structure includes multiple needle-like protrusions arranged in an array.

[0014] Secondly, embodiments of the present invention also provide a server rack device. The server rack device includes a frame and a heat dissipation device according to any of the above embodiments. The heat dissipation device is connected to the frame.

[0015] In the heat dissipation device and cabinet equipment provided by the embodiments of the present invention, a cooling medium channel, a cooling medium inlet, and a cooling medium outlet are provided in the heat dissipation body, with the cooling medium inlet and outlet connected to the cooling medium channel. Furthermore, a porous heat sink is located within the cooling medium channel. The cooling medium in the cooling medium channel quickly enters the porous structure of the porous heat sink through the medium channel, which extends through the first and second outer surfaces on both sides of the porous heat sink. In this way, the cooling medium can be fully and evenly distributed within the porous heat sink to undergo a phase change. The porous structure of the porous heat sink increases the heat exchange contact area of ​​the cooling medium, which is beneficial for the evaporation and heat absorption of the cooling medium to dissipate heat from the heat sink body, thereby enhancing the heat exchange effect and significantly improving the heat exchange performance of the heat dissipation device, achieving better heat exchange results in a smaller equipment volume. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 A schematic diagram of the heat dissipation device provided in an embodiment of the present invention is shown.

[0018] Figure 2 It shows Figure 1 A schematic diagram showing the structural breakdown of the heat dissipation device.

[0019] Figure 3 It shows Figure 1 A schematic diagram of part of the heat dissipation device.

[0020] Figure 4 It shows Figure 2 A schematic diagram of the structure of the first substrate.

[0021] Figure 5 An enlarged schematic diagram of point V is shown.

[0022] Figure 6 It shows Figure 2 A schematic diagram of the structure of the second substrate.

[0023] Figure 7 It shows Figure 2 A schematic diagram of the structure of a multi-hole heat sink.

[0024] Figure 8 A schematic diagram showing the structural disassembly of a heat dissipation device provided in another embodiment of the present invention is shown.

[0025] Figure 9 It shows Figure 8 A schematic diagram of the structure of the second substrate.

[0026] Figure 10 It shows Figure 8 A schematic diagram of the structure of a multi-hole heat sink. Detailed Implementation

[0027] To enable those skilled in the art to better understand the present invention, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0029] Please see Figure 1 This invention proposes a heat dissipation device 10, which can have various applications. For example, the heat dissipation device 10 can be applied to server rack equipment, serving as the shell of the rack equipment to dissipate heat from components such as servers inside. Alternatively, it can be applied to a generator compartment, serving as the shell to maintain a constant internal temperature. Furthermore, it can be used to house heat-generating electronic components (such as chips) for heat dissipation. In some embodiments, the application of the heat dissipation device 10 to a server rack equipment is used as an example for explanation; other applications requiring the heat dissipation device 10 can be referred to the embodiments.

[0030] Please see Figure 1and Figure 2 The heat dissipation device 10 may include a heat dissipation body 100 and a porous heat dissipation component 200. The heat dissipation body 100 is provided with a cooling medium flow channel 101, a cooling medium inlet 102, and a cooling medium outlet 103, with the cooling medium inlet 102 and outlet 103 connected to the cooling medium flow channel 101. The porous heat dissipation component 200 is located within the cooling medium flow channel 101. Thus, compared to traditional heat dissipation devices, the porous structure of the porous heat dissipation component 200 increases the heat exchange contact area of ​​the cooling medium, which is beneficial for the evaporation and heat absorption of the cooling medium to remove heat from the heat dissipation body 100, thereby enhancing the heat exchange effect, significantly improving the heat exchange performance of the heat dissipation device 10, and achieving better heat exchange effect in a smaller volume.

[0031] In some embodiments, the cooling medium can be a liquid with a large latent heat of vaporization, for example, trifluorochloromethane or difluorochloromethane.

[0032] In this embodiment, the heat dissipation body 100 may include a first substrate 110 and a second substrate 120. The first substrate 110 and the second substrate 120 are stacked opposite each other to form a closed cooling medium flow channel 101, and the cooling medium inlet 102 and the cooling medium outlet 103 may be disposed on the second substrate 120. It is understood that, depending on the design of the cooling medium flow channel 101, the cooling medium inlet 102 and the cooling medium outlet 103 may also be disposed on the first substrate 110. The first substrate 110 and the second substrate 120 may be connected by soldering; or, the first substrate 110 and the second substrate 120 may be connected by screws.

[0033] The first substrate 110 and the second substrate 120 are generally rectangular plates, but their specific shapes are not limited to these and can be designed and modified according to the application environment and product. For example, when the heat dissipation device is used for cabinet heat dissipation, the plate-shaped heat dissipation body 100 formed by the cooperation of the first substrate 110 and the second substrate 120 is easy to assemble into the cabinet body of the cabinet equipment for assembly and heat dissipation. This not only helps to increase the contact area with air and ensure a constant internal temperature of the cabinet equipment, enabling the cabinet equipment to work normally, but also helps to reduce the space occupied by the heat dissipation device 10, increase the internal space of the cabinet, make the structure of the cabinet equipment more compact, and improve the user experience.

[0034] The first substrate 110 may be provided with a flow channel groove or a protrusion, which is conducive to forming a cooling medium flow channel 101 with the second substrate 120; or, the first substrate 110 may be a flat plate, which is conducive to cooperating with the cooling medium flow channel 101 opened on the second substrate 120, thereby facilitating the formation of a sealed cooling medium flow channel by the heat dissipation body 100.

[0035] The second substrate 120 may be provided with a flow channel groove or a protrusion, which is conducive to forming a cooling medium flow channel 101 with the first substrate 110; or, the second substrate 120 may be a flat plate, which is conducive to cooperating with the cooling medium flow channel 101 opened on the first substrate 110, thereby facilitating the formation of a sealed cooling medium flow channel 101 by the heat dissipation body.

[0036] exist Figure 2 In the embodiment shown, in order to facilitate the processing of the heat dissipation body 100, the second substrate 120 is provided with a flow channel groove, the first substrate 110 is a flat plate, and after the first substrate 110 and the second substrate 120 are stacked and tightly connected, the flow channel groove and the first substrate 110 form a cooling medium flow channel 101. The tight connection between the first substrate 110 and the second substrate 120 is beneficial to improving the sealing performance of the cooling medium flow channel 101.

[0037] The heat dissipation device 10 may further include a sight glass 300. The sight glass 300 can be mounted on the first substrate 110 or the second substrate 120 to observe the content and flow rate of the cooling medium in the cooling medium flow channel 101, so as to adjust the content and flow rate of the cooling medium and ensure the heat dissipation effect of the heat dissipation device 10. In this embodiment, as... Figure 2 and Figure 4 As shown, the first substrate 110 has a mounting hole 115, and the liquid sight glass 300 can be installed at the mounting hole 115 to facilitate observation of the content and flow of the cooling medium in the cooling medium channel 101.

[0038] Please see Figure 3 The heat dissipation body 100 may further include a plurality of flow-guiding bumps 140 disposed in the cooling medium flow channel 101. The plurality of flow-guiding bumps 140 may be arranged in a matrix, making the cooling medium flow 101 more uniform, thereby making the cooling medium evenly distributed in the heat dissipation body 100. The flow-guiding bumps 140 may be disposed on at least one of the first substrate 110 and the second substrate 120. In this embodiment, the flow-guiding bumps 140 may be disposed on the second substrate 120, thereby allowing the cooling medium to fully contact the flow-guiding bumps 140, which is beneficial for the flow-diversion of the flow-guiding bumps 140. In addition, the flow-guiding bumps 140 may be integrally formed on the second substrate 120, thereby reducing the installation steps of the heat dissipation device 10.

[0039] Please refer to the following: Figure 4 and Figure 5 The heat dissipation device 10 may also include a turbulence structure 150, which may be disposed within the cooling medium flow channel 101 and located between the heat dissipation body 100 and the porous heat dissipation component 200. In this way, the cooling medium can be turbulent within the cooling medium flow channel 101, making the temperature of the cooling medium more uniform and improving the temperature uniformity of the heat dissipation device 10.

[0040] The flow-deflecting structure 150 can be disposed on at least one of the first substrate 110 and the second substrate 120. Furthermore, the flow-deflecting structure 150 can be integrally formed with either the first substrate 110 or the second substrate 120, thereby saving the installation steps of the heat dissipation device 10. In this embodiment, the flow-deflecting structure 150 is disposed on the first substrate 110, and the flow-deflecting structure 150 is located within the cooling medium flow channel 101.

[0041] The turbulence structure 150 may include a plurality of needle-shaped protrusions 151, which may be arranged in an array so that the plurality of needle-shaped protrusions 151 are regularly arranged in the cooling medium flow channel 101, thereby enhancing the degree of turbulence of the cooling medium.

[0042] In this embodiment, please refer to 3 and 4. Figure 6 The cooling medium flow channel 101 has flow channel grooves provided on the second substrate 120 and is formed in conjunction with the first substrate 110. For the sake of simplicity, the following description will refer directly to the above. Figure 6 The second substrate 120 shown illustrates the cooling medium flow channel 101.

[0043] The cooling medium flow channel 101 includes an inlet flow channel 101a, an outlet flow channel 101b, and multiple sub-flow channels 101c, each sub-flow channel 101c being connected between the inlet flow channel 101a and the outlet flow channel 101b. The cooling medium inlet 102 is connected to the inlet flow channel 101a, and the cooling medium outlet 103 is connected to the outlet flow channel 101b. The cooling medium can flow in from the cooling medium inlet 102, then from the inlet flow channel 101a to the multiple sub-flow channels 101c, then from the multiple sub-flow channels 101c to the outlet flow channel 101b, and finally out from the cooling medium outlet 103. Naturally, the cooling medium flows within the heat dissipation body 100 to remove heat from the heat dissipation body 100, enabling heat exchange in the heat dissipation device 10.

[0044] The inlet channel 101a may be provided with multiple guide bumps 140, which can be arranged in a matrix to allow the cooling medium to flow more evenly to the multiple sub-channels 101c, thereby making the cooling medium more evenly distributed in the multiple sub-channels 101c. In this embodiment, the inlet channel 101a extends along the arrangement direction of the multiple sub-channels 101c (that is, the length direction of the second substrate 120), which is beneficial for the inlet channel 101a to distribute the cooling medium more evenly to the multiple sub-channels 101c.

[0045] Multiple sub-channels 101c can extend along the length of the second substrate 120 and be arranged at intervals along the length of the second substrate 120, so that the multiple sub-channels 101c can be arranged more evenly on the second substrate 120, which is conducive to the uniform distribution of the cooling medium within the heat dissipation body 100, making the temperature of the heat dissipation body 100 more uniform, improving the temperature uniformity performance of the heat dissipation device 10, and facilitating the heat dissipation device 10 to quickly adjust the temperature of the cabinet equipment to a constant value.

[0046] Furthermore, the shape of the sub-channel 101c can be adapted to the shape of the porous heat sink 200, which is beneficial for accommodating the sub-channel 101c while reducing the volume of the heat sink body 100, and thus reducing the volume of the heat sink device 10.

[0047] The outlet flow channel 101b can also extend along the arrangement direction of the multiple sub-flow channels 101c (i.e., the length direction of the second substrate 120), thereby facilitating the connection of the outlet flow channel 101b to the multiple sub-flow channels 101c and to the cooling medium outlet 103. It also cooperates with the multiple sub-flow channels 101c to ensure the orderly arrangement of the cooling medium flow channels 101, saving the path of the cooling medium flow and thus facilitating rapid heat dissipation. In this embodiment, the inlet flow channel 101a and the outlet flow channel 101b surround the multiple sub-flow channels 101c, which is beneficial for arranging a larger number of sub-flow channels 101c within the limited volume of the heat dissipation body 100, maximizing the layout of the sub-flow channels 101c, and increasing heat dissipation efficiency.

[0048] Please see Figure 7 The porous heat sink 200 can be made of a material with a porous structure. For example, it can be made of foamed metal, which refers to a special metal material containing foam pores. Alternatively, it can be made of sintered metal powder, which can be formed by instantly heating various metal powders to a molten state using infrared lasers. The porous structure of the porous heat sink 200 increases the heat exchange contact area of ​​the cooling medium, facilitating the evaporation of the cooling medium in the cooling medium flow channel 101 to absorb and remove heat from the heat sink body 100, thereby enhancing the heat exchange effect, significantly improving the heat exchange performance of the heat dissipation device 10, and achieving better heat exchange results in a smaller equipment volume.

[0049] The porous heat sink 200 can generally be a rectangular plate structure. The porous heat sink 200 can have a first outer surface 201 and a second outer surface 202, which can be located on opposite sides of the porous heat sink 200. In this embodiment, the first outer surface 201 and the second outer surface 202 can be located on opposite sides of the porous heat sink 200. In other embodiments, the first outer surface 201 and the second outer surface 202 can also be two surfaces connected to each other on the porous heat sink 200. For example, the first outer surface 201 and the second outer surface 202 can be two surfaces spaced apart. The first outer surface 201 and the second outer surface 202 can be in contact with the cooling medium.

[0050] In this embodiment, the porous heat sink 200 may be provided with a medium channel 204 that penetrates the first outer surface 201 and the second outer surface 202. When the porous heat sink 200 is placed in the cooling medium flow channel 101, the medium channel 204 can be connected to the cooling medium flow channel 101, so that the cooling medium can flow from the cooling medium flow channel 101 to the medium channel 204, thereby facilitating the contact between the cooling medium and the porous heat sink 200 to conduct heat exchange. This allows the heat dissipation device 10 to control the surface temperature under high heat flux density within a relatively reasonable temperature range, solving the heat dissipation problem under high heat flux density in a small volume, improving the temperature uniformity of the heat dissipation device 10, and thus improving the heat dissipation efficiency of the heat dissipation device 10, thereby improving the working efficiency of the cabinet equipment.

[0051] The first outer surface 201 and the second outer surface 202 are located on opposite sides of the porous heat sink 200. For example, the first outer surface and the second outer surface 202 can be the end faces of the two ends of the porous heat sink 200 along the width direction, and the medium channel 204 can extend along the width direction of the porous heat sink 200. In this way, the cooling medium can flow from the cooling medium flow channel 101 to the medium channel 204, and the cooling medium can be more fully and uniformly distributed into the porous structure of the porous heat sink 200 to undergo phase change through the medium channel 204.

[0052] Depending on the number of sub-channels 101c, there can be multiple porous heat sinks 200. Each sub-channel 101c can be equipped with a porous heat sink 200, and the medium channel 204 of each porous heat sink 200 can be connected to the corresponding sub-channel 101c. In this way, the cooling medium can flow from the sub-channel 101c into the medium channel 204, and then be evenly distributed throughout the porous structure of the porous heat sink 200, thereby increasing the contact area between the cooling medium and the porous heat sink 200. This facilitates rapid heat exchange between the cooling medium and the heat sink body 100, thus improving the heat dissipation capacity of the heat dissipation device 10. It also facilitates the flow of the cooling medium within the heat sink body 100, allowing the cooling medium to carry away heat.

[0053] The medium channel 204 may include multiple sub-channels 204a, which are arranged at intervals, and each sub-channel 204a is connected to a corresponding sub-channel 101c. Thus, each sub-channel 101c is connected to multiple sub-channels 204a, allowing cooling to flow from the sub-channel 101c to the multiple sub-channels 204a, and then be rapidly and evenly distributed into the porous structure of the porous heat sink 200. This increases the contact area between the cooling medium and the porous heat sink 200, improving the heat exchange efficiency of the porous heat sink 200. Furthermore, due to the large number of sub-channels 204a, it facilitates the flow of the cooling medium from the inlet channel 101a to the outlet channel 101b, and out through the cooling medium outlet 103, thereby rapidly removing heat from the heat dissipation device 10.

[0054] The porous heat sink 200 may also have a third outer surface 203, which can be connected between the first outer surface 201 and the second outer surface 202, and can contact the cooling medium. The third outer surface 203 is provided with a medium guide channel 205, which can extend along the width direction of the porous heat sink 200; or, the medium guide channel 205 can extend along the width direction of the porous heat sink 200 and can be connected to the cooling medium flow channel 101. In this way, the medium guide channel 205 can also guide the cooling medium located in the inlet flow channel 101a to the outlet flow channel 101b, thereby improving the fluidity of the cooling medium and further facilitating the rapid and uniform distribution of the cooling medium into the porous structure of the porous heat sink 200.

[0055] Please refer to it again. Figure 6 The heat dissipation body 100 may also include multiple flow guiding structures 130. Each sub-channel 101c may have a flow guiding structure 130 at one end connected to the inlet channel 101a. For example, multiple flow guiding structures 130 may be provided on the second substrate 120 and may be arranged along the length of the second substrate 120, so that the multiple flow guiding structures 130 are adapted to the multiple sub-channels 101c.

[0056] Each flow guiding structure 130 may include a plurality of flow guiding protrusions 131 (the flow guiding protrusions 131 may be flow guiding bosses or flow guiding blocks) arranged at intervals, and the plurality of flow guiding protrusions 131 may be arranged along the width direction of the second substrate 120. A liquid distribution port 132 may be formed between two adjacent flow guiding protrusions 131, and the liquid distribution port 132 may be connected to the medium channel 204. In this way, the liquid distribution port 132 corresponding to the sub-channel 101c can guide the cooling medium to the corresponding medium channel 204, thereby making the cooling medium flow more uniformly in the sub-channel 101c. Of course, the flow guiding structure 130 may also be provided in the first substrate 110. In addition, the flow guiding structure 130 may be integrally formed with the first substrate 110 or the second substrate 120, thereby saving the installation process of the heat dissipation device 10.

[0057] In other implementations, please refer to Figures 8 to 10 The main difference between heat dissipation device 10a and heat dissipation device 10 is that the design of the flow guiding structure 130a, the porous heat dissipation component 200a and the cooling medium flow channel 101d of heat dissipation device 10a is different from the design of the flow guiding structure 130, the porous heat dissipation component 200 and the cooling medium flow channel 101d of heat dissipation device 10.

[0058] The cooling medium flow channel 101d is formed by flow channel grooves provided on the second substrate 120a in conjunction with the first substrate 110a. For the sake of simplicity, the following description will refer directly to the above. Figure 8 and Figure 9 The second substrate 120a shown illustrates the cooling medium flow channel 101a.

[0059] The cooling medium flow channel 101d includes an inlet flow channel 101e, an outlet flow channel 101g, and multiple sub-flow channels 101f, each sub-flow channel 101f connecting the inlet flow channel 101e and the outlet flow channel 101g. The cooling medium inlet 102a is connected to the inlet flow channel 101e, and the cooling medium outlet 103a is connected to the outlet flow channel 101g. The cooling medium can flow in from the cooling medium inlet 102a, then from the inlet flow channel 101e to the multiple sub-flow channels 101f, then from the multiple sub-flow channels 101f to the outlet flow channel 101g, and finally out from the cooling medium outlet 103a. Of course, the cooling medium flows within the heat sink 100a to carry away the heat from the heat sink 100a, so that the heat dissipation device 10a can perform heat exchange.

[0060] Each sub-channel 101f is connected between the inlet channel 101e and the outlet channel 101g. The cooling medium inlet 102 is connected to the inlet channel 101e, and the cooling medium outlet 103a is connected to the outlet channel 101g. The cooling medium can flow in from the cooling medium inlet 102a, then from the inlet channel 101e to the multiple sub-channels 101f, then from the multiple sub-channels 101f to the outlet channel 101g, and finally out from the cooling medium outlet 103a. Of course, the cooling medium flows in the heat sink 100a to remove the heat from the heat sink 100, so that the heat dissipation device 10a can perform heat exchange.

[0061] In this embodiment, the inlet channel 101e extends along the arrangement direction of the multiple sub-channels 101f (that is, the length direction of the second substrate 120a), which is beneficial for the inlet channel 101e to distribute the cooling medium more evenly to the multiple sub-channels 101f.

[0062] Multiple sub-channels 101f can extend along the width direction of the second substrate 120a and be arranged at intervals along the length direction of the second substrate 120a, so that the multiple sub-channels 101f can be arranged more evenly on the second substrate 120a, which is conducive to the uniform distribution of the cooling medium within the heat dissipation body 100a, making the temperature of the heat dissipation body 100a more uniform, improving the temperature uniformity performance of the heat dissipation device 10a, and facilitating the heat dissipation device 10a to quickly adjust the temperature of the cabinet equipment to a constant value.

[0063] Furthermore, the shape of the sub-channel 101f can be adapted to the shape of the porous heat sink 200a, which is beneficial for accommodating the sub-channel 101f while reducing the volume of the heat sink body 100a, and thus reducing the volume of the heat sink device 10a.

[0064] The outlet flow channel 101g can also extend along the arrangement direction of the multiple sub-flow channels 101f (i.e., the length direction of the second substrate 120a), thereby facilitating the connection of the outlet flow channel 101g to the multiple sub-flow channels 101f and to the cooling medium outlet 103. It also cooperates with the multiple sub-flow channels 101f to ensure the orderly arrangement of the cooling medium flow channels 101d, saving the path of the cooling medium flow and thus facilitating rapid heat dissipation. In this embodiment, the inlet flow channel 101e and the outlet flow channel 101g surround the multiple sub-flow channels 101f, which is beneficial for arranging a larger number of sub-flow channels 101f within the limited volume of the heat dissipation body 100, maximizing the layout of the sub-flow channels 101f, and increasing heat dissipation efficiency.

[0065] The multiple flow guiding protrusions 131a of the flow guiding structure 130a can be adaptively adjusted according to the distribution of the cooling medium flow channel 101d, for example, arranged along the length direction of the second substrate 120a.

[0066] The porous heat sink 200a may have a medium channel 204b along its length, and multiple sub-channels 204c of the medium channel 204b may be arranged along the width direction of the porous heat sink 200a. Furthermore, multiple medium guide grooves 205a may be arranged along the width direction of the porous heat sink 200a. Other structures of the heat sink 10a can be implemented with reference to the embodiments of the heat sink 10, such as providing a turbulence structure on the first substrate 110a and providing guide protrusions on the inlet channel 101a of the second substrate 120a. In this way, the heat sink 10a can have the same heat exchange effect as the heat sink 10.

[0067] This invention proposes a cabinet device (not shown in the figure), which includes a frame and a heat dissipation device 10 or 10a. The heat dissipation device 10 or 10a can be connected to the frame, thereby allowing the frame and the heat dissipation device 10 or 10a to be assembled to form the cabinet of the cabinet device. The specific structure of the heat dissipation device is as described in the above-mentioned various embodiments. Since the cabinet device can adopt all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of all the above-mentioned embodiments, and will not be described in detail here.

[0068] In this invention, unless otherwise explicitly specified or limited, the terms "installation," "connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, an integral connection, or a transmission connection; they can be a direct connection or an indirect connection via an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0069] Furthermore, the terms "first," "second," etc., are used only for distinguishing descriptions and should not be construed as referring to specific or particular structures. The description of "some embodiments" means that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this invention, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate different embodiments or examples described in this invention, as well as the features of different embodiments or examples.

[0070] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A heat dissipation device, characterized in that, include: The heat dissipation body is provided with a cooling medium channel, a cooling medium inlet and a cooling medium outlet, the cooling medium inlet and the cooling medium outlet being connected to the cooling medium channel; the heat dissipation body includes a first substrate and a second substrate, the first substrate and the second substrate being stacked opposite each other to form the cooling medium channel. as well as A porous heat sink is located within a cooling medium flow channel. The porous heat sink has a first outer surface and a second outer surface, which are located on both sides of the porous heat sink. The porous heat sink is provided with a medium channel that penetrates the first outer surface and the second outer surface, and the medium channel is connected to the cooling medium flow channel. The cooling medium flow channel includes an inlet flow channel, an outlet flow channel, and multiple sub-flow channels. Each sub-flow channel is connected between the inlet flow channel and the outlet flow channel. The number of porous heat dissipation components is multiple. Each sub-flow channel is provided with a porous heat dissipation component. The medium channel of each porous heat dissipation component is connected to the corresponding sub-flow channel. The plurality of sub-channels extend along the length direction of the second substrate and are spaced apart along the length direction of the second substrate; the inlet channel extends along the length direction of the second substrate; the outlet channel extends along the length direction of the second substrate.

2. The heat dissipation device according to claim 1, characterized in that, The first outer surface and the second outer surface are located on opposite sides of the porous heat sink.

3. The heat dissipation device according to claim 2, characterized in that, Each of the porous heat sinks also has a third outer surface, which is connected between the first outer surface and the second outer surface. The third outer surface is provided with a medium flow channel, which is connected to the cooling medium flow channel.

4. The heat dissipation device according to claim 1, characterized in that, The medium channel includes multiple sub-channels, which are arranged at intervals, and each sub-channel is connected to a corresponding sub-flow channel.

5. The heat dissipation device according to claim 1, characterized in that, The heat dissipation body also includes multiple flow guiding structures. Each sub-channel is connected to one end of the inlet channel and is provided with the flow guiding structure. Each flow guiding structure includes multiple flow guiding protrusions arranged at intervals. A liquid distribution port is formed between two adjacent flow guiding protrusions and is connected to the medium channel.

6. The heat dissipation device according to claim 1, characterized in that, The heat dissipation body also includes multiple flow guide bumps, which are located in the inlet flow channel and are arranged in a matrix.

7. The heat dissipation device according to claim 1, characterized in that, The heat dissipation device further includes a turbulence structure, which is disposed within the cooling medium flow channel and located between the heat dissipation body and the porous heat dissipation component.

8. The heat dissipation device according to claim 7, characterized in that, The turbulence structure includes multiple needle-like protrusions arranged in an array.

9. A cabinet device, characterized in that, include: frame; The heat dissipation device as described in any one of claims 1 to 8, wherein the heat dissipation device is connected to the frame.

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