Liquid Cooling Plate, Liquid Cooling Module, Heat Dissipation System and Heat Dissipation Method

Abstract

This application relates to a liquid cooling plate, a liquid cooling module, a heat dissipation system and a heat dissipation method. The liquid cooling plate of this application includes a cover plate, a bottom plate assembly and heat dissipation fins. The bottom plate assembly includes a copper plate and a heat spreader. The copper plate is connected to the cover plate to form a liquid cooling cavity for accommodating a coolant. An inlet and an outlet communicating with the liquid cooling cavity are provided on the cover plate. The copper plate has opposite first and second surfaces. The first surface faces the liquid cooling cavity, and an installation groove is provided on the second surface. The heat spreader is embedded in the installation groove and is used to fit the component to be cooled. The heat dissipation fins are arranged on the first surface and are located in the liquid cooling cavity. The coolant enters the liquid cooling cavity through the inlet, flows through the heat dissipation fins and then flows out of the liquid cooling cavity through the outlet. By using the liquid cooling plate, the liquid cooling module, the heat dissipation system and the heat dissipation method in this application, the heat dissipation efficiency of the component to be cooled in the electronic device can be improved, and the power consumed by the air cooling module and the noise generated by the fan module can be reduced.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic devices, and particularly to a liquid cooling plate, a liquid cooling module, a heat dissipation system and a heat dissipation method. Background Art

[0002] As the power consumption of electronic devices is getting higher and the volume of electronic devices is getting smaller, the heat flux density inside the electronic devices is getting larger. In order to solve the heat dissipation problem of electronic devices, an air cooling module and a liquid cooling module are simultaneously arranged in the electronic devices for collaborative heat dissipation in the prior art. However, when using the liquid cooling module for heat dissipation, the copper bottom plate of the liquid cooling plate of the liquid cooling module is difficult to conduct the heat of the component to be cooled out in time and quickly, resulting in the heat of the component to be cooled not being able to be dissipated in time, which affects the operation reliability. Summary of the Invention

[0003] Based on this, it is necessary to provide a liquid cooling plate, a liquid cooling module, a heat dissipation system and a heat dissipation method that can improve the heat dissipation efficiency of the component to be cooled in the electronic device and reduce the power consumed by the air cooling module in view of the above technical problems.

[0004] To achieve the above object, in a first aspect, the present application provides a liquid cooling plate, including:

[0005] A cover plate;

[0006] A bottom plate assembly, the bottom plate assembly includes a copper plate and a heat spreader, the copper plate is connected to the cover plate to form a liquid cooling cavity for accommodating a coolant, the cover plate is provided with a liquid inlet and a liquid outlet communicating with the liquid cooling cavity, the copper plate has opposite first and second surfaces, the first surface faces the liquid cooling cavity, the second surface is provided with a mounting groove, the heat spreader is embedded in the mounting groove, and the heat spreader is used for fitting against the component to be cooled; and

[0007] Heat dissipation fins, the heat dissipation fins are arranged on the first surface and located in the liquid cooling cavity, and the coolant enters the liquid cooling cavity through the liquid inlet, flows through the heat dissipation fins and then flows out of the liquid cooling cavity through the liquid outlet.

[0008] In an embodiment of the present application, the projection of the heat dissipation fins on the first surface coincides with the projection of the heat spreader on the first surface.

[0009] In an embodiment of the present application, along the direction from the second surface to the first surface, the distance between the bottom surface of the mounting groove and the first surface is not less than 0.5 mm.

[0010] In an embodiment of the present application, the side of the heat spreader facing away from the bottom surface of the groove is flush with the second surface of the copper plate.

[0011] In one embodiment of the present application, the heat dissipation fins are formed on the first surface of the copper plate by the shovel tooth process; and / or,

[0012] After the heat dissipation fins are formed on the first surface, the mounting groove is formed on the second surface by the CNC process.

[0013] To achieve the above object, in a second aspect, the present application provides a liquid cooling module, including the liquid cooling plate as described in the first aspect above.

[0014] To achieve the above object, in a third aspect, the present application provides a heat dissipation system, including the liquid cooling module as described in the second aspect above, and

[0015] an air cooling module for air cooling the component to be cooled;

[0016] a control module electrically connected to the air cooling module and the liquid cooling module, and the control module is used to control the liquid cooling module and the air cooling module.

[0017] To achieve the above object, in a fourth aspect, the present application provides a heat dissipation method applied to the heat dissipation system as described in the third aspect above, including:

[0018] Confirm the liquid cooling efficiency of the liquid cooling module according to the ratio of the thickness of the heat spreader in the liquid cooling plate to the thickness of the copper plate at the position where the mounting groove is not provided;

[0019] The control module controls the liquid cooling module and the component to be cooled to operate simultaneously;

[0020] Obtain the real-time temperature of the component to be cooled, and when the real-time temperature is a preset value, the control module starts the air cooling module.

[0021] In one embodiment of the present application, the method for the control module to start the air cooling module includes:

[0022] The control module calculates the fan speed in the air cooling module according to the real-time temperature and the liquid cooling efficiency of the liquid cooling module;

[0023] The control module starts the fan in the air cooling module according to the calculated fan speed.

[0024] In one embodiment of the present application, the control module performs a PID operation on the real-time temperature and the liquid cooling efficiency of the liquid cooling module to obtain the fan speed.

[0025] The above technical solutions of the present application have the following advantages compared with the prior art:

[0026] The liquid cooling plate, liquid cooling module, heat dissipation system and heat dissipation method described in this application include a cover plate, a bottom plate assembly and heat dissipation fins. By embedding a heat pipe in the copper plate of the bottom plate assembly, while keeping the original thickness of the copper plate unchanged, the heat conduction efficiency between the bottom plate assembly and the component to be cooled is improved. Thus, the heat in the component to be cooled can be better transferred to the heat dissipation fins and taken away by the coolant, so as to improve the heat dissipation efficiency of the liquid cooling module, and the pump power consumption of the liquid cooling module can also be increased.

[0027] In addition, since the liquid cooling module has the advantages of low noise and high efficiency compared with the air cooling module, when the heat dissipation efficiency of the liquid cooling module is further improved, the noise of the air cooling module can be further reduced, and at the same time, the energy consumption of the system can also be reduced. Description of the Drawings

[0028] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0029] Figure 1 Schematic perspective view of a liquid cooling plate in an embodiment;

[0030] Figure 2 Exploded structure schematic view of a liquid cooling plate in an embodiment;

[0031] Figure 3 Schematic view of the exploded structure (another perspective) of a liquid cooling plate in an embodiment;

[0032] Figure 4 For an embodiment, it is a schematic perspective view cut along the Figure 1 A-A direction in;

[0033] Figure 5 Schematic perspective view of a liquid cooling module in another embodiment;

[0034] Figure 6 Schematic block diagram of a heat dissipation system in an embodiment;

[0035] Figure 7 Flowchart of a heat dissipation method in another embodiment;

[0036] Figure 8 Flowchart of the method for starting an air cooling module by a control module in an embodiment.

[0037] Explanation of the reference numerals in the drawings of the specification:

[0038] 1. Cover plate; 10. Liquid cooling chamber; 11. Liquid inlet; 12. Liquid outlet; 2. Bottom plate assembly; 21. Copper plate; 211. Installation groove; 21a. First surface; 21b. Second surface; 21c. Bottom surface of the groove; 22. Heat pipe; 3. Heat dissipation fins; 100. Liquid cooling plate; 200. Liquid cooling module; 201. Liquid inlet assembly; 2011. Liquid inlet joint; 2012. Liquid inlet pipe; 202. Liquid outlet assembly; 2021. Liquid outlet joint; 2022. Liquid outlet pipe; 300. Heat dissipation system; 301. Air cooling module; 302. Control module; 400. Heat dissipation method. Detailed implementation manner

[0039] To make the objectives, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are only a part rather than all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0040] As the functions of electronic devices are increasing, various electronic components inside the electronic devices are gradually increasing, and the power consumption of each electronic component is also gradually increasing, resulting in more and more heat generated inside the electronic devices. At the same time, high temperature will have a greater impact on the stable operation of the electronic components inside the electronic device, and there may even be a possibility of high-temperature damage. Therefore, it is necessary to improve the heat dissipation function of the electronic device.

[0041] During the design process, in order to improve the effective heat dissipation of the component to be cooled, the inventor will adopt a combination of air cooling and liquid cooling to dissipate heat from the component to be cooled. However, in the existing liquid cooling modules, the liquid cooling plates are usually made of copper structures to conduct the heat in the component to be cooled to the coolant. However, due to the priority of the thermal conductivity of copper, the heat dissipation efficiency of the liquid cooling plate will be greatly affected, and the heat will accumulate on the surface of the component to be cooled and cannot be dissipated, resulting in the inability to quickly achieve effective heat dissipation of the component to be cooled. In addition, since the current design direction of electronic devices is towards miniaturization, when improving the liquid cooling plate and the liquid cooling module, it will also be affected by the available layout space inside the electronic device, resulting in difficulty in improving the liquid cooling efficiency of the liquid cooling module.

[0042] In summary, in order to effectively improve the cooling efficiency of the liquid cooling plate and the liquid cooling module within a limited space, the present application provides a liquid cooling plate, a liquid cooling module, a heat dissipation system, and a heat dissipation method. The liquid cooling plate in the present application includes a cover plate, a bottom plate assembly, and heat dissipation fins. Among them, the bottom plate assembly includes a copper plate and a heat pipe, and an installation groove is provided on the copper plate, and the heat pipe is embedded in the installation groove and is used to fit the component to be cooled. That is, without changing the original size of the liquid cooling plate, by embedding a heat pipe with higher thermal conductivity at the bottom of the copper plate, the heat conduction efficiency between the component to be cooled and the bottom plate assembly can be effectively improved, thereby effectively improving the liquid cooling efficiency of the liquid cooling plate to solve the above problems.

[0043] The liquid cooling plate, the liquid cooling module, the heat dissipation system, and the heat dissipation method will be introduced below with specific embodiments.

[0044] Embodiment 1

[0045] Please refer to Figures 1 to 3 , a liquid cooling plate 100 is provided in the first aspect of the present application. The liquid cooling plate 100 includes a cover plate 1, a bottom plate assembly 2, and heat dissipation fins 3. Among them, the bottom plate assembly 2 includes a copper plate 21 and a heat pipe 22. The copper plate 21 is connected to the cover plate 1 to form a liquid cooling cavity 10. The liquid cooling cavity 10 is used to accommodate a coolant, so as to use the coolant to achieve the heat dissipation effect on the component to be cooled. An inlet 11 and an outlet 12 communicating with the liquid cooling cavity 10 are provided on the cover plate 1 to facilitate the inflow and outflow of the coolant into and out of the liquid cooling cavity 10. The copper plate 21 has opposite first surface 21a and second surface 21b. The first surface 21a faces the liquid cooling cavity 10, and the heat dissipation fins 3 are provided on the first surface 21a and are located in the liquid cooling cavity 10. After the coolant enters the liquid cooling cavity 10 through the inlet 11, it will flow through the heat dissipation fins 3 and then flow out of the liquid cooling cavity 10 through the outlet 12. At this time, the coolant flowing through the heat dissipation fins 3 can make full contact with the heat dissipation fins 3, so as to improve the heat exchange efficiency between the heat dissipation fins 3 and the coolant, and further improve the heat dissipation efficiency of the liquid cooling plate 100. At the same time, an installation groove 211 is provided on the second surface 21b, and the heat pipe 22 is embedded in the installation groove 211, and the heat pipe 22 is used to fit the component to be cooled. Compared with the liquid cooling plate 100 that relies solely on the copper plate 21 for heat conduction, since the thermal conductivity of the heat pipe 22 is better than that of the copper plate 21. Therefore, the heat pipe 22 can conduct heat faster, and use the high thermal conductivity of the heat pipe 22 to quickly transfer the heat of the component to be cooled to the liquid cooling cavity 10 and perform heat exchange with the coolant, thereby improving the heat dissipation efficiency of the liquid cooling plate 100.

[0046] In addition, since the structure of the heat pipe 22 itself is relatively complex, embedding the heat pipe 22 in the copper plate 21 can, without affecting the thickness of the copper plate 21, that is, without changing the overall volume of the liquid cooling plate 100, combine the copper plate 21 with the heat pipe 22. This method can not only ensure the structural strength of the bottom plate assembly 2, but also facilitate the connection between the heat dissipation fins 3 and the copper plate 21, thus avoiding the problem that improving the heat dissipation efficiency of the liquid cooling plate 100 may affect its own volume and structural strength.

[0047] It can be understood that the cover plate 1 and the heat dissipation fins 3 can be made of copper or aluminum, and the materials of the cover plate 1 and the heat dissipation fins 3 are not limited in this embodiment.

[0048] Exemplarily, for the convenience of subsequent maintenance and repair, the cover plate 1 and the copper plate 21 are detachably connected, that is, the cover plate 1 and the copper plate 21 can be bolted, snap-connected, etc., so as to separate the cover plate 1 from the copper plate 21 subsequently, and then clean and repair the heat dissipation fins 3. It can be understood that in other embodiments, the cover plate 1 and the copper plate 21 can also be connected in other ways, which are not limited in this embodiment.

[0049] Furthermore, when the cover plate 1 is connected to the bottom plate assembly 2, to ensure the sealing performance of the liquid cooling cavity 10 and avoid leakage of the coolant, which may affect the normal operation of the component to be cooled. A seal is also provided between the cover plate 1 and the bottom plate assembly 2, and a groove for accommodating the seal is provided on the first surface 21a of the cover plate 1 or the copper plate 21. The seal is press-fitted into the groove so that when the cover plate 1 and the copper plate 21 are connected, the seal can seal the connection gap between the cover plate 1 and the copper plate 21, thus avoiding leakage of the coolant. It can be understood that the above sealing structure is only an example, and in other embodiments, other means can be adopted, which are not specifically limited in this embodiment.

[0050] It should be noted that since the liquid cooling plate 100 can be applied to any electronic device that needs heat dissipation, the electronic device can include but is not limited to mobile phones, computers, tablets, servers, etc., and the component to be cooled can be electronic components such as the main board and battery in the electronic device that need to be cooled and protected. That is, when the liquid cooling plate 100 is arranged in the electronic device, the heat pipe 22 can be attached to the main board or the battery. Its specific installation position can be adjusted according to the application scenario and the specific structure of the component to be cooled, and the application scenario of the liquid cooling plate 100 and the component to be cooled are not limited in this application.

[0051] In some embodiments, the projection of the heat dissipation fin 3 on the first surface 21a coincides with the projection of the heat spreader 22 on the first surface 21a, that is, the projection size of the heat spreader 22 embedded in the installation groove 211 of the copper plate 21 on the first surface 21a is the same as and corresponds to the arrangement range of the heat dissipation fin 3, so that the heat of the heat spreader 22 can be transferred to the heat dissipation fin 3 as soon as possible, and the heat dissipation fin 3 is used to transfer the heat to the coolant, thereby maximizing the heat conduction efficiency of the heat spreader 22, the heat dissipation fin 3, and the coolant. If the arrangement range of the heat dissipation fin 3 is larger or smaller than the projection size of the heat spreader 22 on the first surface 21a, there will be partial non-correspondence between the heat dissipation fin 3 and the heat spreader 22. When the arrangement range of the heat dissipation fin 3 is too large, the volume of the coolant that can be accommodated in the liquid cooling cavity 10 will become smaller, which will affect the heat exchange efficiency between the heat dissipation fin 3 and the coolant; when the arrangement range of the heat dissipation fin 3 is too small, the heat on the heat conduction plate cannot be quickly taken away, affecting the heat dissipation efficiency of the liquid cooling plate 100.

[0052] Exemplarily, in order to improve the heat conduction performance between the heat dissipation fin 3 and the copper plate 21, the heat dissipation fin 3 can be formed on the first surface 21a by the skiving process to avoid the uneven heat resistance and large heat resistance caused by welding connection, thereby improving the heat conduction efficiency between the copper plate 21 and the heat dissipation fin 3.

[0053] Further, after the heat dissipation fin 3 is formed on the first surface 21a (the heat dissipation fin 3 can be formed on the first surface 21a by skiving, or can be formed on the first surface 21a by welding or other means), the installation groove 211 can be formed on the second surface 21b by the CNC process. First, after the heat dissipation fin 3 is formed on the first surface 21a of the copper plate 21, the structural strength of the copper plate 21 at this position can be improved, so that when grooving on the second surface 21b of the copper plate 21, the copper plate 21 can be effectively prevented from being damaged. At the same time, using the CNC process (computer numerical control precision machining) for grooving can improve the flatness accuracy of the groove bottom surface 21c, so that when the heat spreader 22 is connected to the groove bottom surface 21c, the heat spreader 22 can be closely attached to the groove bottom surface 21c, thereby improving the connection strength and heat conduction efficiency between the heat spreader 22 and the groove bottom surface 21c.

[0054] Please combine Figure 4 In some embodiments, along the direction from the second surface 21b to the first surface 21a (such as the Z direction in Figure 4 ), the distance H1 between the groove bottom surface 21c of the installation groove 211 and the first surface 21a is not less than 0.5 mm, which can be 0.5 mm, 0.55 mm, 0.6 mm, 0.65 mm, etc., to avoid the groove bottom thickness of the installation groove 211 being too small, affecting the structural strength of the copper plate 21 at the position of the installation groove 211, thereby avoiding affecting the setting of the heat dissipation fin 3 and the heat spreader 22.

[0055] It should be noted that restricting the thickness of the bottom of the installation groove 211 can, on the one hand, ensure the strength of the copper plate 21 at this position, and on the other hand, it can show that the installation groove 211 provided on the copper plate 21 is not a through groove. Since the structure of the heat pipe 22 is relatively more complex than that of the copper plate 21, the process of milling teeth on the heat pipe 22 may affect the vacuum structure of the heat pipe 22, and when the heat dissipation fins 3 are welded to the heat pipe 22, it will also generate welding thermal resistance, which affects the heat conduction efficiency between the heat pipe 22 and the heat dissipation fins 3. Therefore, the thickness of the bottom of the above-mentioned groove can facilitate the formation of the heat dissipation fins 3 on the copper plate 21 through the milling teeth process, and improve the heat conduction efficiency of the heat pipe 22, the copper plate 21, and the heat dissipation fins 3.

[0056] In one embodiment, since the heat pipe 22 needs to be attached to the component to be cooled, the side of the heat pipe 22 facing away from the bottom surface 21c of the groove can be flush with the second surface 21b of the copper plate 21, that is, the sum of the thickness H2 of the heat pipe 22 and the thickness H1 of the bottom of the installation groove 211 is equal to the thickness H3 of the position of the copper plate 21 where the installation groove 211 is not provided, so as to facilitate the close attachment of the heat pipe 22, the copper plate 21, and the component to be cooled, and thus be able to quickly transfer the heat on the component to be cooled to the bottom plate assembly 2. If the side of the heat pipe 22 facing away from the bottom surface 21c protrudes from the second surface 21b, then at this time, a gap will be generated between the second surface 21b of the copper plate 21 and the component to be cooled, and it cannot utilize the heat conduction effect of the remaining positions of the copper plate 21 on the component to be cooled. And at this time, there are side wall surfaces of the heat pipe 22 that are not in contact with the copper plate 21, which is not conducive to quickly transferring the heat of the heat pipe 22 to the copper plate 21 and the liquid cooling cavity 10; if the side of the heat pipe 22 facing away from the bottom surface 21c is recessed from the second surface 21b, when the bottom plate assembly 2 is attached to the component to be cooled, it is not conducive to realizing the contact between the heat pipe 22 and the component to be cooled, thus affecting the heat transfer between the component to be cooled and the heat pipe 22.

[0057] Furthermore, after the heat dissipation fins 3 are formed on the first surface 21a, the installation groove 211 can be formed on the second surface 21b by CNC process. First, after the heat dissipation fins 3 are formed on the first surface 21a of the copper plate 21, the structural strength of the copper plate 21 at this position can be improved, so that when grooving on the second surface 21b of the copper plate 21, the copper plate 21 can be effectively prevented from being damaged. At the same time, using the CNC process for grooving can improve the flatness accuracy of the bottom surface 21c, so as to facilitate the close attachment of the heat pipe 22 to the bottom surface 21c when the heat pipe 22 is connected to the bottom surface 21c, thereby improving the connection strength and heat conduction efficiency between the heat pipe 22 and the bottom surface 21c.

[0058] The liquid cooling plate 100 provided in the first aspect of the present application can improve the heat conduction efficiency between the bottom plate assembly 2 and the component to be cooled by the heat pipe 22 embedded in the copper plate 21. At the same time, by arranging the heat dissipation fins 3 in the liquid cooling cavity 10, the heat on the copper plate 21 can be quickly transferred to the coolant, effectively improving the heat dissipation efficiency of the liquid cooling plate 100, thereby realizing the effective protection of the component to be cooled and improving the working stability of the component to be cooled.

[0059] Embodiment 2

[0060] Please refer to Figure 5 , a liquid cooling module 200 is provided in the second aspect of the present application. The liquid cooling module 200 includes a liquid inlet assembly 201, a liquid outlet assembly 202, and the liquid cooling plate 100 as described in the first aspect above. The liquid inlet assembly 201 and the liquid outlet assembly 202 are respectively connected to the liquid inlet 11 and the liquid outlet 12 on the cover plate 1 to realize the introduction and export of the coolant, so as to facilitate the flow of the coolant. The liquid cooling module 200 with the above liquid cooling plate 100 can improve the heat dissipation efficiency of the liquid cooling module 200, thereby realizing the effective protection of the component to be cooled and improving the working stability of the component to be cooled.

[0061] Furthermore, in order to prevent the coolant from leaking at the liquid inlet 11 and the liquid outlet 12, the liquid inlet assembly 201 and the liquid outlet assembly 202 are respectively hermetically connected to the liquid inlet 11 and the liquid outlet 12. Specifically, the liquid inlet assembly 201 may include a liquid inlet joint 2011 and a liquid inlet pipe 2012 connected to the liquid inlet joint 2011. The liquid inlet joint 2011 is connected to the liquid inlet 11, and a sealing member is provided at the connection between the liquid inlet joint 2011 and the liquid inlet 11. The sealing member can be arranged between the liquid inlet joint and the liquid inlet 11, that is, embedded in the side wall of the liquid inlet 11. When the liquid inlet joint 2011 is inserted into the liquid inlet 11, the sealing member is in interference fit with the liquid inlet 11 and the liquid inlet joint 2011 to achieve a sealed connection, thereby effectively preventing the coolant from leaking. Similarly, the liquid outlet assembly 202 may include a liquid outlet joint 2021 and a liquid outlet pipe 2022 connected to the liquid outlet joint 2021. The liquid outlet joint 2021 is connected to the liquid outlet 12, and a sealing member is provided at the connection between the liquid outlet joint 2021 and the liquid outlet 12. The sealing member can be arranged between the liquid outlet joint and the liquid outlet 12, that is, embedded in the side wall of the liquid outlet 12. When the liquid outlet joint 2021 is inserted into the liquid outlet 12, the sealing member is in interference fit with the liquid outlet 12 and the liquid outlet joint 2021 to achieve a sealed connection, thereby effectively preventing the coolant from leaking.

[0062] The liquid cooling plate 100 includes a cover plate 1, a bottom plate assembly 2 and heat dissipation fins 3. Among them, the bottom plate assembly 2 includes a copper plate 21 and a heat pipe 22. The copper plate 21 is connected to the cover plate 1 to form a liquid cooling cavity 10. The liquid cooling cavity 10 is used to accommodate a coolant, so as to use the coolant to dissipate heat from the component to be cooled. The cover plate 1 is provided with a liquid inlet 11 and a liquid outlet 12 communicating with the liquid cooling cavity 10, so as to facilitate the inflow and outflow of the coolant into and out of the liquid cooling cavity 10. The copper plate 21 has opposite first surface 21a and second surface 21b. The first surface 21a faces the liquid cooling cavity 10, and the heat dissipation fins 3 are arranged on the first surface 21a and located in the liquid cooling cavity 10. After the coolant enters the liquid cooling cavity 10 through the liquid inlet 11, it will flow through the heat dissipation fins 3 and then flow out of the liquid cooling cavity 10 through the liquid outlet 12. At this time, the coolant flowing through the heat dissipation fins 3 can be in full contact with the heat dissipation fins 3, so as to improve the heat exchange efficiency between the heat dissipation fins 3 and the coolant, and further improve the heat dissipation efficiency of the liquid cooling plate 100. At the same time, the second surface 21b is provided with a mounting groove 211, and the heat pipe 22 is embedded in the mounting groove 211, and the heat pipe 22 is used to fit the component to be cooled. Compared with the liquid cooling plate 100 that simply relies on the copper plate 21 for heat conduction, since the heat conduction performance of the heat pipe 22 is better than that of the copper plate 21. Therefore, the heat pipe 22 can conduct heat faster, so as to use the high heat conduction performance of the heat pipe 22 to quickly transfer the heat of the component to be cooled to the liquid cooling cavity 10 and exchange heat with the coolant, thereby improving the heat dissipation efficiency of the liquid cooling plate 100.

[0063] In order to enable the coolant to flow fully in the liquid cooling cavity 10, the liquid inlet 11 and the liquid outlet 12 on the cover plate 1 can be arranged at the diagonal positions of the liquid cooling cavity 10 to extend the moving path of the coolant in the liquid cooling cavity 10, thereby extending the heat exchange time between the coolant and the heat dissipation fins 3, so as to achieve full heat exchange between the coolant and the heat dissipation fins 3 and improve the cooling efficiency of the liquid cooling plate 100.

[0064] Embodiment III

[0065] Please combine Figure 6 In the third aspect of the present application, a heat dissipation system 300 is provided. The heat dissipation system 300 includes an air cooling module 301, a control module 302 and the liquid cooling module 200 as described in the second aspect above. Among them, the air cooling module 301 is used to perform air cooling on the component to be cooled. The control module 302 is electrically connected to the air cooling module 301 and the liquid cooling module 200. The control module 302 is used to control the liquid cooling module 200 and the air cooling module 301, that is, the control module 302 can realize the heat dissipation effect on the component to be cooled by controlling parameters such as the start, stop and wind speed of the air cooling module 301 and the liquid cooling module 200, so as to reduce the system power consumption and realize the effective utilization of energy.

[0066] Through simulation analysis, since the vapor chamber 22 is known as a superconductor with a thermal conductivity of about 20,000, which is 50 times that of the copper plate 21, considering the thermal resistance of the components after welding, there is a loss during the heat transfer process. Using a heat dissipation simulation software to evaluate, it is initially considered that if the thermal conductivity of the vapor chamber 22 is reduced by half, the thermal conductivity is 1,000, which is also 25 times that of the copper plate 21.

[0067] The thermal conductivity of the liquid cooling plate 100 of the present application is 25 times that of the liquid cooling plate 100 without the vapor chamber 22, enabling the heat of components such as the CPU chip and power supply waiting to be cooled to be quickly transferred to the coolant through the vapor chamber 22. At this time, the flow rate of the coolant can be reduced, the fan speed of the air cooling module 301 of the heat dissipation system 300 can be reduced, and the power consumption of the drive source for driving the coolant to flow can be reduced, making the PUE value of the electronic device or computer room lower.

[0068] It can be understood that the control module 302 can be a single-chip microcomputer, a program in a computer, or an intelligent touch panel, and the control module 302 can be set inside the electronic device, outside the electronic device, or at other positions, as long as it can be electrically connected to each component. In this embodiment, the setting of the control module 302 is not limited.

[0069] It should be noted that when the component to be cooled includes multiple electronic components that need to be cooled, multiple liquid cooling modules 200 and air cooling modules 301 can be provided, or the liquid cooling module 200 can be set for the electronic components with faster temperature rise and higher functional requirements, and the air cooling module 301 can be set at a position where multiple electronic components can be cooled to achieve multi-level protection of the component to be cooled.

[0070] Embodiment 4

[0071] Please refer to Figure 7 and Figure 8 and in combination with Figure 4 The fourth aspect of the present application provides a heat dissipation method 400, which can be applied to the heat dissipation system 300 as described in the above third aspect, including:

[0072] S401. Confirm the liquid cooling efficiency of the liquid cooling module 200 according to the ratio of the thickness H2 of the vapor chamber 22 in the liquid cooling plate 100 to the thickness H3 of the copper plate 21 at the position without the installation groove 211.

[0073] In this embodiment, after the heat pipe 22 is embedded in the installation groove 211 of the copper plate 21 of the bottom plate assembly 2, the heat conduction efficiency of the bottom plate assembly 2 will be changed, thereby affecting the liquid cooling efficiency of the liquid cooling plate 100 and the liquid cooling module 200. At the same time, the thickness H3 of the position on the copper plate 21 where the installation groove 211 is not provided is the original thickness of the copper plate 21. The heat conduction efficiency of the bottom plate assembly 2 formed by setting heat pipes 22 with different thicknesses on the same copper plate 21 is different, and the larger the ratio of the thickness H2 of the heat pipe 22 to the thickness H3 of the position on the copper plate 21 where the installation groove 211 is not provided, the better the heat conduction efficiency of the bottom plate assembly 2 and the higher the cooling efficiency of the liquid cooling plate 100. However, in different heat dissipation systems 300, due to different requirements, heat pipes 22 with different thicknesses may be set. In addition, since an air cooling module 301 is also provided in the heat dissipation system 300, in order to achieve the cooperative heat dissipation of the air cooling module 301 and the liquid cooling module 200, it is necessary to confirm the liquid cooling efficiency of the liquid cooling module 200 in the heat dissipation system 300, so as to facilitate the subsequent control of the loss power.

[0074] S402. The control module 302 controls the liquid cooling module 200 and the component to be cooled to run simultaneously;

[0075] In this embodiment, since the liquid cooling module 200 has better heat dissipation effect and lower power consumption than the air cooling module 301, in the initial stage of the operation of the component to be cooled, the liquid cooling module 200 can be made to run preferentially to achieve the cooling protection of the component to be cooled, and it also helps to reduce the power consumption of the air cooling module 301 and the noise generated by the operation of the air cooling module 301.

[0076] S403. Obtain the real-time temperature of the component to be cooled. When the real-time temperature is a preset value, the control module 302 starts the air cooling module 301;

[0077] When the heating speed of the component to be cooled is relatively fast, limited by the self-cooling limit of the liquid cooling module 200, the real-time temperature of the component to be cooled may still reach the preset value. At this time, the control module 302 can control the air cooling module 301 to start to achieve the auxiliary heat dissipation effect.

[0078] It should be noted that the above-mentioned component to be cooled can be one component or multiple components. When the component to be cooled includes multiple devices, the liquid cooling module 200 can be set on the device with higher heat dissipation requirements. At the same time, when the real-time temperature of this device or other devices reaches the preset value, the air cooling module 301 can be started for auxiliary heat dissipation.

[0079] In one embodiment, a heat dissipation method 400 is also provided:

[0080] In the above step S403, the method for the control module 302 to start the air cooling module 301 includes:

[0081] S4031. The control module 302 calculates the rotational speed of the fan in the air-cooling module 301 based on the real-time temperature and the liquid-cooling efficiency of the liquid-cooling module 200.

[0082] In this embodiment, calculating the fan rotational speed according to the real-time temperature and the liquid-cooling efficiency of the liquid-cooling module 200 enables the air-cooling module 301 and the liquid-cooling module 200 to cooperate in cooling the component to be cooled, so as to avoid ignoring the liquid-cooling effect of the liquid-cooling module 200 when only calculating the real-time temperature alone, resulting in excessive power consumption of the air-cooling module 301 and thus wasting energy.

[0083] S4032. The control module 302 starts the fan in the air-cooling module 301 according to the calculated fan rotational speed.

[0084] In this embodiment, the control module 302 controlling the air-cooling module 301 according to the calculated fan rotational speed helps subsequent monitoring of the fan rotational speed and timely adjustment of the fan rotational speed, so as to achieve the flexibility of controlling the air-cooling module 301.

[0085] In one embodiment, a heat dissipation method 400 is further provided:

[0086] The control module 302 performs a PID operation on the real-time temperature and the liquid-cooling efficiency of the liquid-cooling module 200 to obtain the fan rotational speed.

[0087] In this embodiment, by using the PID operation, precise control of the fan rotational speed can be achieved, and the fan rotational speed can be adjusted in real time to improve the heat dissipation efficiency and energy utilization rate.

[0088] The technical features of the above embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0089] The above-described embodiments only represent several implementation manners of the present application. Their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several deformations and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A liquid cooling plate, characterized in that, Comprising: Cover plate; Bottom plate assembly, the bottom plate assembly includes a copper plate and a heat pipe, the copper plate is connected to the cover plate and forms a liquid cooling cavity, the liquid cooling cavity is used to accommodate a coolant, the cover plate is provided with a liquid inlet and a liquid outlet communicating with the liquid cooling cavity, the copper plate has opposite first and second surfaces, the first surface faces the liquid cooling cavity, the second surface is provided with a mounting groove, the heat pipe is embedded in the mounting groove, and the heat pipe is used to fit the component to be cooled; And Heat dissipation fins, the heat dissipation fins are arranged on the first surface and located in the liquid cooling cavity, the coolant enters the liquid cooling cavity through the liquid inlet, flows through the heat dissipation fins, and then flows out of the liquid cooling cavity through the liquid outlet; Wherein, the projection of the heat dissipation fins on the first surface coincides with the projection of the heat pipe on the first surface; The heat dissipation fins are formed on the first surface of the copper plate by a skived fin process; and / or, After the heat dissipation fins are formed on the first surface, the mounting groove is formed on the second surface by a CNC process.

2. The liquid cooling plate according to claim 1, wherein Along the direction from the second surface to the first surface, the distance between the bottom surface of the mounting groove and the first surface is not less than 0.5 mm.

3. The liquid cooling plate according to claim 2, wherein The side of the heat pipe facing away from the bottom surface of the groove is flush with the second surface of the copper plate.

4. A liquid cooling module, characterized in that, Comprising the liquid cooling plate according to any one of claims 1-3.

5. A heat dissipation system, characterized in that, Comprising the liquid cooling module according to claim 4, and Air cooling module, the air cooling module is used to air-cool the component to be cooled; Control module, the control module is electrically connected to the air cooling module and the liquid cooling module, and the control module is used to control the liquid cooling module and the air cooling module.

6. A heat dissipation method, characterized in that, Applied to the heat dissipation system according to claim 5, comprising: Confirming the liquid cooling efficiency of the liquid cooling module according to the ratio of the thickness of the heat pipe in the liquid cooling plate to the thickness of the copper plate at the position where the mounting groove is not provided; The control module controls the liquid cooling module and the component to be cooled to operate simultaneously; Obtaining the real-time temperature of the component to be cooled, and when the real-time temperature is a preset value, the control module starts the air cooling module.

7. The heat dissipation method according to claim 6, wherein The method for the control module to start the air cooling module includes: The control module calculates the fan speed in the air cooling module according to the real-time temperature and the liquid cooling efficiency of the liquid cooling module; The control module starts the fan in the air cooling module according to the calculated fan speed.

8. The heat dissipation method according to claim 7, wherein The control module performs a PID operation on the real-time temperature and the liquid cooling efficiency of the liquid cooling module to obtain the fan speed.

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