A film tearing device for PCB boards, a double-sided film tearing device and a film tearing method

Abstract

The present invention discloses a film tearing device for PCB boards, a double-sided film tearing device and a film tearing method in the technical field of automation equipment. The double-sided film tearing device includes two film tearing devices and a flipping device located between the two film tearing devices. The film tearing device includes a single-sided film tearing device main body, which is provided with a first film separating mechanism for separating a single piece of adhesive film from the end of the large PCB board, a film tearing mechanism for completely separating the adhesive film from the large PCB board, and a film recycling mechanism for clamping the single piece of adhesive film that has been separated from the large PCB board; the film tearing method includes steps such as adsorbing the large PCB board, separating the single piece of adhesive film from the end of the PCB, completely peeling the single piece of adhesive film from the large PCB board, recycling the single piece of adhesive film, flipping and performing reverse operations. The present invention simulates the entire manual film tearing process of workers, can adapt to the distribution modes of multiple adhesive films, and can also be applicable to the structure of the whole adhesive film. Moreover, the entire film tearing process has a high degree of automation, improves production efficiency, and reduces labor costs.

Description

Technical Field

[0001] The present invention relates to the technical field of automation equipment. Specifically, it relates to a film tearing device for PCB boards, a double-sided film tearing device, and a film tearing method. Background Art

[0002] During the production process of PCB boards, it is necessary to first perform surface treatment on the PCB boards and then carry out subsequent processes. Therefore, it is necessary to mount a protective film on the surface of the PCB boards, and then tear off the protective film after the PCB boards are processed. Since traditional protective films are all torn off manually, this method has low efficiency, poor productivity, and the manual operation of the operators will cause damage to the PCB boards or hands.

[0003] Based on this, there is currently an automatic film tearing device capable of tearing the protective film on the surface of the PCB. For example, the Chinese invention patent with the publication number CN105129170A discloses a fully automatic film tearing machine. In this fully automatic film tearing machine, a conveying mechanism provides transportation power for the PCB board with the film protective films attached to both sides, so that after the PCB board passes through the film lifting mechanism, the conductive rubber roller mechanism, and the comb-shaped film separating mechanism in sequence, the edge of the film protective film is lifted, the film protective film is torn off from both sides of the PCB and wound and adhered to the conductive rubber roller mechanism, the film protective film is separated from the conductive rubber roller mechanism, and finally neatly stacked by the collecting board, thus completing the fully automatic film tearing process.

[0004] This fully automatic film tearing machine mainly relies on the film lifting mechanism to separate the protective film on the surface of the PCB. The film lifting mechanism contacts and lifts the film protective films on both sides of the PCB board through gears. The gears include a wheel body and film lifting teeth wound around the surface of the wheel body, so that the film lifting teeth can lift the protective film. At the same time, the film protective film is adhered by two upper and lower rubber rollers, and the PCB board drives the rubber rollers to rotate, and then the film protective film is separated by the separating comb.

[0005] However, since the protective films are symmetrically distributed on the upper and lower surfaces of the PCB board, and the ends of the upper and lower corresponding protective films protrude from the end surface of the PCB board, the upper and lower protective films are connected and adhered. The existing adsorption film tearing method cannot adapt to this situation and it is difficult to separate the upper and lower layers of protective films, which requires manual film tearing operations. Summary of the Invention

[0006] In order to overcome the deficiencies of the existing technology, the present invention provides a film tearing device for PCB boards, a double-sided film tearing device, and a film tearing method.

[0007] The technical solution of the present invention is as follows:

[0008] A film tearing device for PCB boards, characterized in that it includes a single-sided film tearing device main body, and the single-sided film tearing device main body is provided with:

[0009] The first film separating mechanism is located at the front or rear side of the main body of the single-sided film tearing device. The first film separating mechanism includes a first film separating clamping part for separating two single-piece adhesive films, and a first film separating driving part for driving the first film separating clamping part to move upward so that the upper single-piece adhesive film is separated from the end part of the large PCB board.

[0010] The film tearing mechanism is located beside the main body of the single-sided film tearing device. The film tearing mechanism includes a film tearing clamping part for clamping the above-mentioned single-piece adhesive film, and a film tearing driving part for driving the film tearing clamping part to move upward so that the single-piece adhesive film is separated from the large PCB board.

[0011] And the adhesive film recycling mechanism is located beside the main body of the single-sided film tearing device. The adhesive film recycling mechanism includes a recycling clamping part for clamping the single-piece adhesive film that has been separated from the large PCB board, and a recycling driving part for driving the recycling clamping part to move downward so that the single-piece adhesive film is recycled.

[0012] The present invention according to the above solution is characterized in that the main body of the single-sided film tearing device includes mounting side plates, and a film tearing space for accommodating the large PCB board is formed between the two mounting side plates.

[0013] Furthermore, a film tearing width positioning and adjusting assembly is also provided between the two mounting side plates. The film tearing width positioning and adjusting assembly includes a film tearing width positioning plate, a film tearing width positioning adjusting motor, a film tearing width positioning adjusting belt, a film tearing width positioning adjusting guide post, and a film tearing width positioning substrate. The film tearing width positioning adjusting guide post is fixed between the two mounting side plates, the film tearing width positioning substrate is fixed on one of the mounting side plates, the film tearing width positioning plate is fixed on the film tearing width positioning adjusting belt, and the film tearing width positioning plate is sleeved on the film tearing width positioning adjusting guide post. The film tearing width positioning adjusting belt is connected to the film tearing width positioning adjusting motor, so that the film tearing width positioning adjusting motor drives the film tearing width positioning plate to slide left and right along the film tearing width positioning adjusting guide post through the film tearing width positioning adjusting belt.

[0014] The present invention according to the above solution is characterized in that the first film separating mechanism and the film tearing mechanism are both installed on a film tearing position adjusting plate, and the film tearing position adjusting plate is connected to a first transmission mechanism. The first transmission mechanism is used to drive the film tearing position adjusting plate to move left and right to adjust the film separating position of the first film separating mechanism and the film tearing position of the film tearing mechanism.

[0015] Further, the first transmission mechanism includes a film tearing position adjustment motor, a film tearing position adjustment belt, a film tearing position adjustment screw rod, and a film tearing position adjustment guide rod. The film tearing position adjustment plate is sleeved on the film tearing position adjustment screw rod and the film tearing position adjustment guide rod, and the film tearing position adjustment screw rod is connected to the film tearing position adjustment motor through the film tearing position adjustment belt. When the film tearing position adjustment motor drives the film tearing position adjustment screw rod to rotate through the film tearing position adjustment belt, the film tearing position adjustment plate slides along the film tearing position adjustment guide rod.

[0016] Further, a second film separating mechanism is further provided on the film tearing position adjustment plate. The second film separating mechanism is located at the rear side or the front side of the single-sided film tearing device main body, and is used for separating the upper and lower single-piece adhesive films on the rear side or the front side of the large PCB board.

[0017] Furthermore, the second film separating mechanism is arranged on the film tearing position adjustment plate through a second transmission mechanism. The second transmission mechanism is used for driving the second film separating mechanism to move back and forth to adjust the film separating position of the second film separating mechanism.

[0018] On the other hand, a double-sided film tearing device is characterized in that it includes a frame. Two of the above-mentioned film tearing devices for PCB boards are arranged inside the frame, and a turning device for turning the PCB is arranged between the two film tearing devices for PCB boards.

[0019] In a third aspect, a film tearing method for a PCB board is characterized by including the following steps:

[0020] Step (1): After the large PCB board is loaded, the suction cup adsorbs the large PCB board to prevent the large PCB board from moving upward.

[0021] Step (2): The first film separating mechanism separates the single-piece adhesive film on the upper side of the large PCB board, separates it from the single-piece adhesive film on the lower side of the large PCB board, and separates it from the end portion of the large PCB board.

[0022] Step (3): The film tearing mechanism clamps the upper single-piece adhesive film that has been separated from the end portion of the large PCB board, and the film tearing mechanism drives the single-piece adhesive film to continue to separate from the large PCB board so that it is peeled off from the large PCB board, completing the film tearing process of one single-piece adhesive film.

[0023] Step (4): Move the first film separating mechanism and the film tearing mechanism to the position of the next single-piece adhesive film, and repeat Step (2) and Step (3) to complete the separation of all single-piece adhesive films.

[0024] Step (5): The film recovery mechanism clamps and recovers all the single-piece adhesive films that have been peeled off on the film tearing mechanism.

[0025] Step (6), flip the large PCB board and repeat the above film tearing process to complete the film tearing of the entire large PCB board.

[0026] The present invention according to the above solution is characterized in that in step (2), it further includes the process of separating the single-piece adhesive film at the other end of the large PCB board by the second film separating mechanism.

[0027] The beneficial effect of the present invention according to the above solution is that the first film separating mechanism (similar to the second film separating mechanism) in the present invention can simulate the manual film separating process of workers, separate the upper and lower single-piece adhesive films that are adhered to each other, and complete the separation of the adhesive film from the large PCB board through the film tearing mechanism. The whole process simulates the entire manual film tearing process of workers, can adapt to the distribution modes of multiple adhesive films, and can also be applicable to the structure of a whole piece of adhesive film, with a wider adaptability.

[0028] Realize the film tearing operation of the adhesive film on the surface of the large PCB board through an automated method, making the film tearing process highly automated, improving production efficiency, and reducing labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic structural diagram of a large PCB board with an adhesive film;

[0030] Figure 2 It is a schematic structural diagram of the film tearing device in the present invention;

[0031] Figure 3 It is a schematic internal structural diagram of the film tearing device in the present invention;

[0032] Figure 4 It is a schematic structural diagram of the film tearing device for a PCB board with a large PCB board in the present invention;

[0033] Figure 5 It is a schematic structural diagram of the film tearing device for a PCB board in the present invention;

[0034] Figure 6 It is a schematic structural diagram of the film tearing device for a PCB board in the present invention from another perspective;

[0035] Figure 7 It is a schematic diagram after removing the motor protection housing in the present invention;

[0036] Figure 8 It is a schematic structural diagram of the forward baffle mechanism in the present invention;

[0037] Figure 9 It is a schematic structural diagram of the forward baffle mechanism from another perspective in the present invention;

[0038] Figure 10Schematic diagram of the first film separating mechanism in the present invention;

[0039] Figure 11 Schematic diagram of another perspective of the first film separating mechanism in the present invention;

[0040] Figure 12 Schematic diagram of the second film separating mechanism in the present invention;

[0041] Figure 13 Schematic diagram of another perspective of the second film separating mechanism in the present invention;

[0042] Figure 14 Schematic diagram of the film tearing mechanism in the present invention;

[0043] Figure 15 Schematic diagram of another perspective of the film tearing mechanism in the present invention;

[0044] Figure 16 Schematic diagram of the adhesive film recycling mechanism in the present invention;

[0045] Figure 17 Schematic diagram of another perspective of the adhesive film recycling mechanism in the present invention.

[0046] In the figure, each reference numeral is as follows:

[0047] 01, large PCB board with adhesive film; 011, single-piece adhesive film;

[0048] 1, film tearing device for PCB board; 2, flipping device;

[0049] 100, main body of the single-sided film tearing device;

[0050] 101, mounting side plate;

[0051] 111, forward driving motor; 112, forward driving belt; 113, forward driving wheel set; 114, idle wheel set;

[0052] 120, forward baffle mechanism;

[0053] 121, forward baffle base; 122, forward baffle support plate; 123, forward baffle support cylinder; 124, forward baffle cylinder; 125, forward baffle post; 126, suction cup;

[0054] 131, rear support base; 132, rear support plate; 133, rear support cylinder;

[0055] 141, film tearing position adjusting plate; 142, film tearing position adjusting motor; 143, film tearing position adjusting belt; 144, film tearing position adjusting screw rod; 145, film tearing position adjusting guide rod;

[0056] 151. Film tearing length adjustment guide rail; 152. Film tearing length adjustment motor; 153. Film tearing length adjustment belt;

[0057] 161. Film tearing width positioning plate; 162. Film tearing width positioning adjustment motor; 163. Film tearing width positioning adjustment belt; 164. Film tearing width positioning adjustment guide post; 165. Film tearing width positioning base plate;

[0058] 1611. Film tearing width positioning post;

[0059] 200. First film separating mechanism;

[0060] 211. First film separating mounting plate; 212. First film separating guide rail; 221. First film separating cylinder; 222. First film separating cylinder output shaft; 230. First film separating sliding part; 241. First film pressing-down cylinder; 242. First film pressing-down part; 250. First film separating knife;

[0061] 300. Second film separating mechanism;

[0062] 311. Second film separating mounting plate; 312. Second film separating guide rail; 320. Second film separating cylinder; 330. Second film separating sliding part; 341. Second film pressing-down cylinder; 342. Second film pressing-down part; 350. Second film separating knife;

[0063] 400. Film tearing mechanism;

[0064] 411. Film tearing mounting plate; 412. Film tearing guide rail; 421. Film tearing cylinder; 422. Film tearing cylinder output shaft; 430. Film tearing sliding part; 441. Film tearing clamp arm cylinder; 442. Film tearing clamp arm jaw; 450. Film tearing support arm;

[0065] 500. Glue film recycling mechanism;

[0066] 511. Glue film recycling mounting plate; 512. Glue film recycling guide rail; 520. Glue film recycling cylinder; 530. Glue film recycling flipping cylinder; 541. First glue film recycling arm; 542. Second glue film recycling arm; 550. Collection basket. Detailed implementation manners

[0067] The present invention will be further described below in conjunction with the accompanying drawings and implementation manners:

[0068] As Figure 1As shown, in order to avoid the impact on the parts of the large PCB board that do not need to be sprayed or soaked with green oil or electroplated during the process of spraying or soaking green oil or electroplating process, it is necessary to lay a film on the large PCB board for protection, covering the parts of the large PCB board that do not need to be sprayed or soaked with green oil or electroplated. For example, in the PCB gold plating process, by laying a film to cover the PCB pads, circuits or exposed copper films that do not need to be gold plated, etc., to avoid waste of gold powder. Since the gold finger positions on the large PCB board are arranged side by side, the films are laid in rows and are respectively located on the upper and lower sides of the large PCB board, forming a large PCB board 01 with films, and the two ends of the single film on the upper and lower sides of the large PCB board 01 with films protrude from the ends of the large PCB board 01 with films and are bonded together.

[0069] In order to replace manual operation during the process of tearing off the above single film in the later stage, and save the film tearing time and improve the film tearing accuracy, the present invention provides a double-sided film tearing device, which can simulate the operation of human hands and perform peeling operations on the film on the upper surface of the large PCB board 01 with films and the film on the lower surface of the large PCB board 01 with films respectively.

[0070] As Figure 2 , Figure 3 shown, the double-sided film tearing device includes a frame, and a device for double-sided film tearing of the large PCB board 01 with films is arranged inside the frame. The large PCB board 01 with films is loaded from one side of the frame, and the PCB board after film tearing is unloaded from the other end. The film here is a PET film.

[0071] The device for double-sided film tearing of the large PCB board 01 with films includes two film tearing devices 1 for PCB boards, and each film tearing device 1 for PCB boards is used to perform film tearing operation on one side of the large PCB board 01 with films. A turning device 2 for turning the PCB is arranged between the two film tearing devices 1 for PCB boards. Therefore, during the film tearing process, first perform film tearing operation on one side of the large PCB board 01 with films. After completion, turn it over through the turning device 2, and then perform film tearing operation on the other side of the large PCB board 01 with films.

[0072] As Figures 4 to 17 shown, the present invention provides a film tearing device for PCB boards, which includes a single-sided film tearing device main body 100. A first film separating mechanism 200, a film tearing mechanism 400 and a film recycling mechanism 500 are arranged on the single-sided film tearing device main body 100. Among them, the single-sided film tearing device main body 100 serves as the support main body of the entire film tearing device and provides a placement space for the large PCB board; the first film separating mechanism 200 is used to realize the separation operation between the film and the end of the large PCB board; the film tearing mechanism 400 is used to drive the film to be completely separated from the large PCB board; the film recycling mechanism 500 is used to realize the recycling of the film.

[0073] The main body 100 of the single-sided film tearing device includes mounting side plates 101. A film tearing space for accommodating the large PCB board is formed between the two mounting side plates 101. In the implementation process, the large PCB board can be directly placed in this film tearing space manually, or the large PCB board can be loaded into this film tearing space by means of fully automatic feeding. The following structures are introduced based on the fully automatic feeding method, realizing the automation of the entire film tearing process of the large PCB board.

[0074] A forward driving wheel set 113 for driving the large PCB board forward is provided between the two mounting side plates 101. The forward driving wheel set 113 is connected to a forward driving motor 111 through a forward driving belt 112, so that the forward driving motor 111 drives the forward driving wheel set 113 to rotate through the forward driving belt 112, so as to make the large PCB board located in this film tearing space move forward. While driving the large PCB board forward through the forward driving wheel set 113, in order to reduce the friction between the large PCB board and the single-sided film tearing device and ensure the smooth progress of the large PCB board and reduce the wear of the large PCB board, an idle wheel set 114 is also provided between the two mounting side plates 101. The idle wheel set 114 is used to support the large PCB board during the forward movement of the large PCB board, so that when the large PCB board is transmitted forward, the idle wheel set 114 contacts the large PCB board and rotates with it. Both the forward driving wheel set 113 and the idle wheel set 114 here include a plurality of rubber wheels.

[0075] Since the edge of the large PCB board needs to be film separated during the film tearing process, in order to prevent the large PCB board from moving forward excessively, a forward baffle mechanism 120 for blocking the forward movement of the large PCB board is provided at the front end of this film tearing space, so that when the large PCB board moves forward to the position, the forward baffle mechanism 120 can block the forward movement of the large PCB board and make it stop.

[0076] For details, please refer to Figure 8 、 Figure 9 , the forward baffle mechanism 120 includes a base and a forward baffle cylinder 124 fixed on the base. The output end of the forward baffle cylinder 124 is connected to a forward baffle column 125, so that when the forward baffle cylinder 124 drives the forward baffle column 125 to extend, it blocks the forward movement of the large PCB board, and when the forward baffle cylinder 124 drives the forward baffle column 125 to retract, it allows the large PCB board to move forward.

[0077] The base includes a forward baffle base 121 fixed to the mounting side plate 101 and a forward baffle support plate 122 located above the forward baffle base 121. The forward baffle support plate 122 is connected to the output shaft of the forward baffle support cylinder 123. Among them, the forward baffle base 121 provides an installation foundation for the forward baffle support cylinder 123, etc.; and the forward baffle support cylinder 123 provides a supporting force for the large PCB board during the film separation process through the forward baffle support plate 122, avoiding damage such as bending of the large PCB board caused by the downward pressure on the large PCB board during the film separation process. In addition, a suction cup 126 is also connected to the forward baffle support plate 122, so that after the forward baffle support plate 122 together with the suction cup 126 is driven by the forward baffle support cylinder 123 to move upward, the suction cup 126 can adsorb the large PCB board, avoiding the large PCB board being lifted by the single-piece adhesive film during the film separation and film tearing processes and affecting the film separation and film tearing effects.

[0078] Preferably, a rear support base 131 fixed to the mounting side plate 101, a rear support plate 132 located above the rear support base 131, and a rear support cylinder 133 fixed to the rear support base 131 are provided at the rear end of the film tearing space. The top of the output shaft of the rear support cylinder 133 is used to support the rear support plate 132. The rear support base 131 and the rear support plate 132 are used to provide a supporting force during the film separation process at the rear side position of the large PCB board.

[0079] Since the sizes of the large PCB boards are different during the production process, in order to complete the film tearing operations of large PCB boards with different widths, a film tearing width positioning and adjusting assembly is also provided between the two mounting side plates 101 in the present invention. It is used to adjust the width of the film tearing space so as to accurately adjust and position it with the corresponding large PCB board, avoiding the large PCB board shaking in the film tearing space and affecting the accuracy of the film separation and film tearing positions.

[0080] For details, please refer to Figure 6 、 Figure 7 , the film tearing width positioning and adjusting assembly includes a film tearing width positioning plate 161, a film tearing width positioning adjusting motor 162, a film tearing width positioning adjusting belt 163, a film tearing width positioning adjusting guide post 164, and a film tearing width positioning substrate 165. By adjusting the distance between the film tearing width positioning plate 161 and the film tearing width positioning substrate 165, the film tearing width of the PCB is positioned between the film tearing width positioning plate 161 and the film tearing width positioning substrate 165 to achieve the purpose of spatial position adjustment.

[0081] The film tearing width positioning adjustment guide post 164 is fixed between two mounting side plates 101 and is used to play a role in guiding the movement. The film tearing width positioning base plate 165 is fixed on one of the mounting side plates 101. The film tearing width positioning plate 161 is fixed on the film tearing width positioning adjustment belt 163, and the film tearing width positioning plate 161 is sleeved on the film tearing width positioning adjustment guide post 164. The film tearing width positioning adjustment belt 163 is connected to the film tearing width positioning adjustment motor 162, so that the film tearing width positioning adjustment motor 162 drives the film tearing width positioning plate 161 to slide left and right along the film tearing width positioning adjustment guide post 164 through the film tearing width positioning adjustment belt 163, so as to realize the adjustment of the distance between the film tearing width positioning plate 161 and the film tearing width positioning base plate 165.

[0082] Preferably, a plurality of film tearing width positioning posts 1611 protruding upward are provided on the film tearing width positioning plate 161. The film tearing width positioning posts 1611 are inserted into the gaps between the empty wheel sets 114 and between the empty wheel sets 114 and the forward driving wheel set 113 without affecting the rotation of each empty wheel set 114, and the large PCB board is limited. Correspondingly, the film tearing width positioning base plate 165 is located above the empty wheel sets 114 and the forward driving wheel set 113 and corresponds to the height position of the large PCB board.

[0083] The single-sided film tearing device main body 100 in the present invention further includes a film tearing position adjustment plate 141, which is used to adjust the specific positions of film separation and film tearing. Specifically, the film tearing position adjustment plate 141 is connected to the first transmission mechanism, and the first transmission mechanism is used to drive the film tearing position adjustment plate 141 to move left and right to adjust the film separation position of the first film separation mechanism 200 and the film tearing position of the film tearing mechanism 400.

[0084] For details, please refer to Figures 4 to 7 The first transmission mechanism includes a film tearing position adjustment motor 142, a film tearing position adjustment belt 143, a film tearing position adjustment screw 144, and a film tearing position adjustment guide rod 145. Among them, the film tearing position adjustment motor 142 realizes the position adjustment drive of the film tearing position adjustment plate 141, and the film tearing position adjustment screw 144 and the film tearing position adjustment guide rod 145 cooperate with each other to realize the transmission of the film tearing position adjustment plate 141. The film tearing position adjustment plate 141 is sleeved on the film tearing position adjustment screw 144 and the film tearing position adjustment guide rod 145, and the film tearing position adjustment screw 144 is connected to the film tearing position adjustment motor 142 through the film tearing position adjustment belt 143, so that when the film tearing position adjustment motor 142 drives the film tearing position adjustment screw 144 to rotate through the film tearing position adjustment belt 143, the film tearing position adjustment plate 141 slides along the film tearing position adjustment guide rod 145.

[0085] Preferably, both ends of the film tearing position adjusting screw 144 and both ends of the film tearing position adjusting guide rod 145 are sleeved on the two side mounting side plates 101, so that the positions of the film tearing position adjusting screw 144 and the film tearing position adjusting guide rod 145 are both stable, ensuring the stability of the position adjustment of the film tearing position adjusting plate 141.

[0086] I. The first film separating mechanism 200

[0087] For details, please refer to Figures 4 to 7 , Figure 10 , Figure 11 . The first film separating mechanism 200 is installed on the film tearing position adjusting plate 141 and is located on the front side or the rear side of the single-sided film tearing device main body 100 (shown as the front side in this embodiment, that is, the front side in the forward movement direction of the large PCB board). It is used to separate the single-piece adhesive films on the upper and lower sides of the edge of the large PCB board and drive the single-piece adhesive film on the upper side to separate from the edge of the large PCB board.

[0088] The first film separating mechanism 200 includes a first film separating and clamping part for separating the upper and lower single-piece adhesive films, and a first film separating driving part for driving the first film separating and clamping part to move upward so that the single-piece adhesive film on the upper side separates from the end of the large PCB board.

[0089] Specifically, the first film separating driving part includes a first film separating mounting plate 211, a first film separating guide rail 212, a first film separating cylinder 221, and a first film separating cylinder output shaft 222: The first film separating mounting plate 211 is fixed on the film tearing position adjusting plate 141, the first film separating guide rail 212 is fixed on the inner side of the first film separating mounting plate 211, the first film separating cylinder 221 is located at the top of the first film separating mounting plate 211, and the first film separating cylinder output shaft 222 is connected to the first film separating and clamping part. The first film separating guide rail 212 and the first film separating cylinder output shaft 222 in the present invention are inclined, and their upper ends are inclined towards the rear side of the single-sided film tearing device main body 100, so that when the first film separating cylinder 221 drives the first film separating and clamping part and the single-piece adhesive film to separate through the first film separating cylinder output shaft 222, the process of separating and tearing the film can be realized while separating, and the process of tearing the film is smoother, avoiding the situation that it is difficult to separate the single-piece adhesive film from the large PCB board.

[0090] Specifically, the first film separating and clamping part is used to separate the upper and lower single-piece adhesive films, and is also used to clamp the upper single-piece adhesive film and can cooperate with the first film separating driving part to separate it from the large PCB board. The first film separating and clamping part includes a first film sliding part, a first film pressing-down air cylinder 241, a first film pressing-down part 242, and a first film separating knife 250: In the first film separating and clamping part, the first film sliding part is connected to the output shaft 222 of the first film air cylinder, and is sleeved on the first film guide rail 212 and can slide up and down along the first film guide rail 212; the first film separating knife 250 is fixed to the end of the first film sliding part, and moving the first film mechanism 200 forward can make the first film separating knife 250 separate the upper and lower single-piece adhesive films; the first film pressing-down air cylinder 241 is fixed to the front side of the first film sliding part, and the output end of the first film pressing-down air cylinder 241 is connected to the first film pressing-down part 242, so that the first film pressing-down air cylinder 241 can drive the first film pressing-down part 242 to press down, and the first film pressing-down part 242 and the first film separating knife 250 cooperate to realize the clamping action of the single-piece adhesive film.

[0091] Different from the inclined settings of the first film guide rail 212 and the output shaft 222 of the first film air cylinder, the output end of the first film pressing-down air cylinder 241 in the present invention is perpendicular to the placement direction of the large PCB board to achieve an accurate clamping action.

[0092] II. The second film separating mechanism 300

[0093] Since long adhesive films are provided on the sides of some large PCB boards, the adhesive films are arranged along the edges of the large PCB boards and are perpendicular to the directions of the strip-shaped single-piece adhesive films. This part of the adhesive film needs to cooperate with the separating knife for a skidding operation during the film separating process. Therefore, a corresponding film separating mechanism, that is, the second film separating mechanism 300, needs to be provided on the other side of the large PCB board for the film separating process of such adhesive films.

[0094] For details, please refer to Figures 4 to 7 、 Figure 12 、 Figure 13 , the second film separating mechanism 300 is installed on the film tearing position adjusting plate 141 and is located at the rear side or the front side of the single-sided film tearing device main body 100 (shown as the rear side in this embodiment, that is, the rear side in the forward movement direction of the large PCB board), and is used to separate the upper and lower single-piece adhesive films on the rear side or the front side of the large PCB board.

[0095] The second film separating mechanism 300 includes a second film separating and clamping part for separating the upper and lower single-piece adhesive films, and a second film separating driving part for driving the second film separating and clamping part to move upward so that the upper single-piece adhesive film is separated from the end part of the large PCB board.

[0096] Specifically, the second film separating driving part includes a second film separating mounting plate 311, a second film separating guide rail 312 and a second film separating cylinder 320. The second film separating mounting plate 311 is mounted on the film tearing position adjusting plate 141. The second film separating guide rail 312 is fixed to the front side of the second film separating mounting plate 311. The second film separating cylinder 320 is fixed to the top of the second film separating mounting plate 311, and the output shaft of the second film separating cylinder 320 is connected to the second film separating clamping part for driving the second film separating clamping part to slide up and down along the second film separating guide rail 312.

[0097] Preferably, the second film separating mechanism 300 (i.e., the second film separating mounting plate 311) is arranged on the film tearing position adjusting plate 141 through a second transmission mechanism. The second transmission mechanism is used to drive the second film separating mechanism 300 to move back and forth to adjust the film separating position of the second film separating mechanism 300, so as to adapt to the rear film separating of PCB large boards with different lengths. In this embodiment, the second transmission mechanism includes a film tearing length adjusting guide rail 151, a film tearing length adjusting motor 152, and a film tearing length adjusting belt 153. The second film separating mechanism 300 is fixed to the film tearing length adjusting belt 153, and the second film separating mechanism 300 is sleeved on the film tearing length adjusting guide rail 151. The film tearing length adjusting belt 153 is connected to the film tearing length adjusting motor 152, so that the film tearing length adjusting motor 152 drives the second film separating mechanism 300 to slide back and forth along the film tearing length adjustment through the film tearing length adjusting belt 153.

[0098] Since the second film separating mechanism 300 is only used to cooperate with the first film separating mechanism 200 to separate the upper and lower single-piece adhesive films and does not need to clamp the single-piece adhesive film to the film tearing mechanism 400, the second film separating guide rail 312 in this embodiment can be arranged vertically.

[0099] Specifically, the second film clamping part is used to separate the upper and lower single-piece adhesive films, and is also used to clamp the upper single-piece adhesive film and can cooperate with the second film separating driving part to separate it from the large PCB board. The second film clamping part includes a second film sliding part 330, a second film pressing cylinder 341, a second film pressing piece 342, and a second film separating knife 350. In the second film clamping part, the second film sliding part 330 is connected to the output shaft of the second film cylinder 320, and the second film sliding part 330 is sleeved on the second film guide rail 312, so that the second film cylinder 320 can drive the second film sliding part 330 to slide up and down along the second film guide rail 312. The second film separating knife 350 is fixed to the end of the second film sliding part 330. Moving the second film mechanism 300 forward can make the second film separating knife 350 separate the upper and lower single-piece adhesive films. The second film cylinder 320 is fixed to the front side of the second film sliding part 330, and the output end of the second film cylinder 320 is connected to the second film pressing piece 342, so that the second film pressing cylinder 341 can drive the second film pressing piece 342 to press down, and the second film pressing piece 342 and the second film separating knife 350 cooperate to realize the clamping action of the single-piece adhesive film.

[0100] III. Film Tearing Mechanism 400

[0101] For details, please refer to Figures 4 to 7 、 Figure 14 、 Figure 15 The film tearing mechanism 400 is installed on the film tearing position adjusting plate 141, which is located beside the single-sided film tearing device main body 100. The film tearing mechanism 400 includes a film tearing clamping part for clamping the above single-piece adhesive film, and a film tearing driving part for driving the film tearing clamping part to move up to separate the single-piece adhesive film from the large PCB board.

[0102] Specifically, the film tearing driving part includes a film tearing mounting plate 411, a film tearing guide rail 412, a film tearing cylinder 421, and a film tearing cylinder output shaft 422. The film tearing mounting plate 411 is installed on the film tearing position adjusting plate 141 and is close to the first film separating mechanism 200 so as to be able to accurately clamp the single-piece adhesive film that has been separated. The film tearing guide rail 412 is fixed to the front side of the film tearing mounting plate 411. The film tearing cylinder 421 is fixed to the top of the film tearing mounting plate 411. The film tearing cylinder output shaft 422 is connected to the film tearing clamping part and is used to drive the film tearing clamping part to slide up and down along the film tearing guide rail 412 by the air film cylinder, thereby driving the single-piece adhesive film to separate from the large PCB board.

[0103] Specifically, the film tearing and clamping part includes a film tearing sliding part 430, a film tearing clamping arm cylinder 441, a film tearing clamping arm claw 442, and a film tearing support arm 450: The film tearing sliding part 430 is connected to the output shaft 422 of the film tearing cylinder and is sleeved on the film tearing guide rail 412 for sliding up and down along the film tearing guide rail 412 driven by the film tearing cylinder 421; The film tearing clamping arm claw 442 is located at the bottom of the film tearing sliding part 430 and is driven by the film tearing clamping arm cylinder 441 to complete the clamping and releasing operations. The process of the film tearing clamping arm cylinder 441 driving the film tearing clamping arm claw 442 to clamp and release is a known technology and will not be elaborated here; The film tearing support arm 450 is also located at the bottom of the film tearing sliding part 430 and cooperates with the film tearing clamping arm claw 442 to support the separated single-piece adhesive film and can complete the recovery clamping operation of the single-piece adhesive film.

[0104] Similar to the process of the first film separating mechanism 200 moving for film separation, in order to enable the film tearing driving part to drive the film tearing and clamping part to be associated with the position of the single-piece adhesive film and the PCB large board during the upward movement, the film tearing guide rail 412 and the film tearing cylinder output shaft 422 in the present invention are inclined. The upper end is inclined towards the rear side of the single-sided film tearing device main body 100, that is, towards the direction of advancing to the film tearing position. Since the film tearing mechanism 400 completes the overall film tearing process of the PCB large board in the length direction, the inclination angles of the film tearing guide rail 412 and the film tearing cylinder output shaft 422 in the present invention are greater than the inclination angles of the first film separating guide rail 212 and the first film separating cylinder output shaft 222.

[0105] IV. Adhesive film recovery mechanism 500

[0106] For details, please refer to Figures 4 to 7 、 Figure 16 、 Figure 17 The adhesive film recovery mechanism 500 is installed beside the single-sided film tearing device main body 100 and is set opposite to the film tearing mechanism 400. The adhesive film recovery mechanism 500 includes a recovery clamping part for clamping the single-piece adhesive film that has been separated from the PCB large board and a recovery driving part for driving the recovery clamping part to move downward to recover the single-piece adhesive film.

[0107] Specifically, the recovery driving part includes a film recovery mounting plate 511, a film recovery guide rail 512, and a film recovery cylinder 520: The film recovery mounting plate 511 is installed beside the single-sided film tearing device main body 100. The film recovery guide rail 512 is fixed to the side of the film recovery mounting plate 511. The film recovery cylinder 520 is fixed to the top of the film recovery mounting plate 511, and its output shaft is connected to the single-piece adhesive film recovery clamping part for driving the single-piece adhesive film recovery clamping part to slide up and down along the film recovery guide rail 512.

[0108] Specifically, the single-piece film recycling clamping part includes a film recycling turning cylinder 530, a first film recycling arm 541, a second film recycling arm 542, a collection basket 555 and a recycling basket (not shown in the figure): The film recycling turning cylinder 530 is sleeved on the film recycling guide rail 512 and connected to the film recycling cylinder 520, so that the film recycling cylinder 520 can drive the film recycling turning cylinder 530 to slide up and down along the film recycling guide rail 512; The first film recycling arm 541 is connected to the film recycling turning cylinder 530, so that the film recycling turning cylinder 530 can drive the first film recycling arm 541 to turn in the horizontal and vertical directions, so that when the first film recycling arm 541 extends horizontally, it can clamp the separated single-piece film from the film tearing mechanism 400, and when the first film recycling arm 541 extends vertically, it can complete the recycling of the film; The collection basket 555 is located below the film recycling turning cylinder 530, and the second film recycling arm 542 is located below the collection basket 555, so that when the first film recycling arm 541 extends vertically, the film can be sent to the position of the second film recycling arm 542 after passing through the collection basket 555. The collection basket 555 realizes the collection of the film and prevents the film from being scattered and being unfavorable for the second film recycling arm 542 to clamp. The recycling basket is located below the second film recycling arm 542, so that after the second film recycling arm 542 is released, the film falls into the recycling basket to realize the recycling of the film.

[0109] In this embodiment, the second film recycling arm 542 is used as an "intermediary" in the film recycling process, which avoids the film sticking to the first film recycling arm 541 during film recycling and thus cannot be recycled, and the first film recycling arm 541 with the adhered film will affect the subsequent film recycling process. The second film recycling arm 542 can clamp the film and drop it into the recycling basket. Even if the second film recycling arm 542 adheres to the film, it does not affect the subsequent film recycling process of the first film recycling arm 541.

[0110] Since the existing processes of film separation, tearing and recycling of the film are all manually operated, the secretions such as human sweat will contaminate the recycled film, making it difficult to reuse the film after recycling; even if the operator wears tools such as gloves, it is difficult to avoid the contamination of impurities such as debris. The present invention realizes the separation, tearing and recycling of all single-piece films on the PCB large board through a fully automatic device, which not only improves the production efficiency, but also avoids the contamination of the recycled film, enables it to be reused, and saves resources.

[0111] Such as Figures 1 to 17 , based on the above-mentioned double-sided film tearing device for the PCB large board, the present invention also provides a film tearing method for the PCB board. Before the film tearing process is realized, each limiting mechanism, the film tearing position adjusting plate 141, etc. are shifted to the initial state. The specific film tearing process includes the following steps:

[0112] S1. After the large PCB board is loaded, the suction cup 126 adsorbs the large PCB board to prevent it from moving upward.

[0113] In this process, the operator can directly place the large PCB board by hand in the film tearing space between the two mounting side plates 101, or the loading and unloading mechanism can automatically load a single large PCB board.

[0114] When the large PCB board is automatically loaded, the forward driving motor 111 drives the large PCB board to move forward through the forward driving belt 112 and the forward driving wheel set 113 in sequence, and the idle wheel set 114 provides the supporting force; when the large PCB board moves to the film tearing position, the forward baffle cylinder 124 drives the forward baffle column 125 to lift, blocking the large PCB board to make it stop moving. At this time, the forward driving motor 111 is turned off, and the large PCB board is in a stopped state; the forward baffle cylinder 124 drives the forward baffle column 125 to descend, leaving a position moving space for the first film separating mechanism 200; the forward baffle supporting cylinder 123 drives the forward baffle supporting plate 122 to move upward. While the forward baffle supporting plate 122 supports the large PCB board, the suction cup 126 adsorbs the large PCB board to prevent its position from moving.

[0115] S2. Complete the film tearing operation on one side of the large PCB board. Before the film tearing of the large PCB board is completed, the rear supporting cylinder 133 drives the rear supporting plate 132 to rise, so that the rear supporting plate 132 realizes the support of the large PCB board, avoiding damage to the large PCB board due to the downward pressure during the film tearing process.

[0116] In one embodiment, after one single piece of adhesive film is torn, the tearing process of another single piece of adhesive film is completed. Specifically, it includes:

[0117] A1. The first film separating mechanism 200 separates the single piece of adhesive film located on the upper side of the large PCB board, making it separate from the single piece of adhesive film located on the lower side of the large PCB board and separate from the end part of the large PCB board.

[0118] A2. The film tearing mechanism 400 clamps the upper single piece of adhesive film that has been separated from the end part of the large PCB board, and the film tearing mechanism 400 drives the single piece of adhesive film to continue to separate from the large PCB board so that it is peeled off from the large PCB board, completing the film tearing process of one single piece of adhesive film.

[0119] A3. Move the first film separating mechanism 200 and the film tearing mechanism 400 to the position of the next single piece of adhesive film, and repeat steps A2 and A3 to complete the separation of all the single pieces of adhesive film.

[0120] Since the single piece of adhesive film has strong tensile properties, in the second embodiment, in order to speed up the film tearing process, the "preliminary separation" of all the upper single pieces of adhesive film can be carried out first, and then the film tearing operation is completed by the film tearing mechanism 400 uniformly:

[0121] After the first film separation mechanism 200 completes the end separation of a single-piece adhesive film from the large PCB board, move the film tearing position adjustment plate 141, and then the first film separation mechanism 200 completes the end separation of another single-piece adhesive film from the large PCB board;

[0122] B2. Repeat this operation until the "preliminary separation" of multiple single-piece adhesive films is completed (that is, the separation of the single-piece adhesive film from the end of the large PCB board in step 2);

[0123] B3. Clamp them uniformly by the film tearing mechanism 400, and synchronously complete the peeling process through the film tearing mechanism 400.

[0124] In order to avoid the situation that the first film separation and mechanism cannot provide a stable clamping effect during the separation of the single-piece adhesive film, in the third embodiment, after the end of each single-piece adhesive film is separated from the large PCB board, it is first clamped by the film tearing mechanism 400, and then the film tearing operation is completed by the film tearing mechanism 400 after all single-piece adhesive films are separated:

[0125] C1. After the first film separation mechanism 200 completes the end separation of a single single-piece adhesive film from the large PCB board, it is clamped by the film tearing mechanism 400;

[0126] C2. After adjusting the film tearing position adjustment plate 141, the first film separation mechanism 200 completes the separation operation of another single-piece adhesive film from the end of the large PCB board, and then it is clamped by the film tearing mechanism 400;

[0127] C3. Repeat this operation. After all single-piece adhesive films are clamped by the film tearing mechanism 400, the peeling operation is completed together.

[0128] In the above three embodiments, when the end of each single-piece adhesive film is separated from the large PCB board:

[0129] (1) The first film separation cylinder 221 drives the first film separation sliding part to slide along the first film separation guide rail 212 to the film separation height;

[0130] (2) The film tearing position adjustment motor 142 drives the film tearing position adjustment plate 141 to move, so that the first film separation knife 250 is located at the film separation position on the edge of the large PCB board. The film tearing position adjustment motor 142 continues to drive the film tearing position adjustment plate 141 to move, so that the first film separation knife 250 separates the upper and lower layers of the single-piece adhesive film;

[0131] (3) The first film pressing cylinder 241 drives the first film pressing part 242 to press down, so that the first film pressing part 242 and the first film separation knife 250 cooperate with each other to clamp the single-piece adhesive film;

[0132] (4) The first film separating cylinder 221 drives the first film separating sliding part to move upward a certain distance along the first film separating guide rail 212, so that while the single-piece adhesive film moves upward, it moves to the right in the figure, realizing the separation from the edge of the PCB large board.

[0133] In the above three embodiments, during the process of completely separating each single-piece adhesive film from the PCB large board:

[0134] (1) The film tearing cylinder 421 drives the film tearing sliding part 430 to move to the position of the single-piece adhesive film;

[0135] (2) The film tearing clamp arm cylinder 441 drives the film tearing clamp arm claws 442 to clamp the single-piece adhesive film that has been separated from the edge of the PCB large board, and the film tearing support arm 450 stretches and supports the single-piece adhesive film;

[0136] (3) The film tearing cylinder 421 drives the film tearing sliding part 430 to move upward a certain distance along the film tearing guide rail 412, so that while the single-piece adhesive film moves upward, it moves to the right in the figure, realizing the complete separation from the PCB large board.

[0137] In the above three embodiments, when the edge of the PCB large board to be torn has adhesive films distributed vertically in strips, it further includes the process of the second film separating mechanism 300 separating the single-piece adhesive film at the other end of the PCB large board, and this process can be carried out synchronously with the first film separating mechanism 200:

[0138] (1) The second film separating cylinder 320 drives the second film separating sliding part 330 to slide to the film separating height;

[0139] (2) When the film tearing position adjusting motor 142 drives the film tearing position adjusting plate 141 and the first film separating mechanism 200 to move, it synchronously drives the second film separating mechanism 300 to move synchronously, so that the second film separating knife 350 is located at the film separating position on the edge of the PCB large board. When the film tearing position adjusting motor 142 continues to drive the film tearing position adjusting plate 141 to move, the second film separating knife 350 separates the upper and lower layers of single-piece adhesive films;

[0140] (3) The second film pressing cylinder 341 drives the second film pressing part 342 to press down, so that the second film pressing part 342 and the second film separating knife 350 cooperate with each other to clamp the single-piece adhesive film;

[0141] (4) The second film separating cylinder 320 drives the second film separating sliding part 330 to move upward a certain distance along the second film separating guide rail 312, so that the single-piece adhesive film is separated from the edge of the PCB large board.

[0142] S3. The adhesive film recycling mechanism 500 clamps all the single-piece adhesive films that have been peeled off on the film tearing mechanism 400 and recycles them.

[0143] (1)After all the single-piece adhesive films are separated from the large PCB board, the film tearing position adjustment motor 142 drives the film tearing position adjustment plate 141 to approach the adhesive film recycling mechanism 500;

[0144] (2)The adhesive film recycling turning cylinder 530 drives the first adhesive film recycling arm 541 to turn over and face the film tearing mechanism 400, so that the first adhesive film recycling arm 541 receives all the single-piece adhesive films separated by the film tearing mechanism 400;

[0145] (2)The adhesive film recycling turning cylinder 530 drives the first adhesive film recycling arm 541 to turn over, so that the first adhesive film recycling arm 541 faces downwards;

[0146] (3)The single-piece adhesive film passes through the collection basket 555 and is clamped by the second adhesive film recycling arm 542, and the first adhesive film recycling arm 541 releases all the adhesive films and returns to its original position;

[0147] (4)After the first adhesive film recycling arm 541 retracts, the second adhesive film recycling arm 542 releases the clamping jaws, so that all the adhesive films fall into the recycling basket below.

[0148] S4. Flip the large PCB board and repeat the above film tearing process to complete the film tearing of the entire large PCB board.

[0149] (1)The large PCB board Figure 2 The film tearing device 1 for the PCB board on the right side completes the single-sided film tearing process, and moves to the flipping device 2 under the drive of the forward drive motor 111 and the forward drive wheel set 113 to realize the flipping of the upper and lower surfaces;

[0150] (2)Driven by the drive assembly in the flipping device, the large PCB board moves to Figure 2 The film tearing device 1 for the PCB board on the left side, and completes the film tearing process of the other side. This film tearing process is the same as the above film tearing process and will not be elaborated here;

[0151] (3)The large PCB board completes the entire film tearing process and is unloaded.

[0152] It should be noted that during the film tearing process of the second side of the previous large PCB board, the next large PCB board can Figure 2 Realize single-sided film tearing at the film tearing device 1 for the PCB board on the right side. The film tearing processes of the two large PCB boards do not interfere with each other, increasing the film tearing efficiency.

[0153] In the present invention, the first film separating mechanism simulates the operation of a worker's single hand to separate two single-piece adhesive films up and down. The film tearing mechanism simulates the process of a worker's single hand to tear the adhesive film. In cooperation with the second film separating mechanism, it simulates the operation of another worker to separate two adhesive films. The whole process is accurately operated, without causing damage to the large PCB board, and can adapt to the distribution structures of multiple single-piece adhesive films. By replacing manual operation, the film tearing process is accelerated. Moreover, by tearing the film in a fully automatic manner, it avoids the influence of manual film tearing by workers on the cleanliness of the recycled adhesive film, enabling it to be recycled and reused, thus saving resources.

[0154] It should be understood that those of ordinary skill in the art can make improvements or transformations according to the above description, and all such improvements and transformations shall fall within the protection scope of the appended claims of the present invention.

[0155] The above has made an exemplary description of the present invention patent in conjunction with the accompanying drawings. Obviously, the implementation of the present invention patent is not limited by the above methods. As long as various improvements are made by adopting the method concept and technical solution of the present invention patent, or the concept and technical solution of the present invention patent are directly applied to other occasions without improvement, they are all within the protection scope of the present invention.

Claims

1. A film tearing device for a PCB board, characterized in that, Comprising a single-sided film tearing device main body, on which are provided: A first film separating mechanism, which is located at the front or rear side of the single-sided film tearing device main body. The first film separating mechanism includes a first film separating clamping part for separating two single-piece adhesive films up and down, and a first film separating driving part for driving the first film separating clamping part to move upward so that the upper single-piece adhesive film is separated from the end part of the PCB large board; A film tearing mechanism, which is located beside the single-sided film tearing device main body. The film tearing mechanism includes a film tearing clamping part for clamping the above-mentioned single-piece adhesive film, and a film tearing driving part for driving the film tearing clamping part to move upward so that the single-piece adhesive film is separated from the PCB large board; And a film recovery mechanism, which is located beside the single-sided film tearing device main body. The film recovery mechanism includes a film recovery clamping part for clamping the single-piece adhesive film that has been separated from the PCB large board, and a recovery driving part for driving the recovery clamping part to move downward so that the single-piece adhesive film is recovered; The first film separating mechanism and the film tearing mechanism are both installed on a film tearing position adjusting plate, and the film tearing position adjusting plate is connected to a first transmission mechanism. The first transmission mechanism is used to drive the film tearing position adjusting plate to move left and right to adjust the film separating position of the first film separating mechanism and the film tearing position of the film tearing mechanism; The first transmission mechanism includes a film tearing position adjusting motor, a film tearing position adjusting belt, a film tearing position adjusting screw rod, and a film tearing position adjusting guide rod. The film tearing position adjusting plate is sleeved on the film tearing position adjusting screw rod and the film tearing position adjusting guide rod, and the film tearing position adjusting screw rod is connected to the film tearing position adjusting motor through the film tearing position adjusting belt. When the film tearing position adjusting motor drives the film tearing position adjusting screw rod to rotate through the film tearing position adjusting belt, the film tearing position adjusting plate slides along the film tearing position adjusting guide rod; A second film separating mechanism is further provided on the film tearing position adjusting plate. The second film separating mechanism is located at the rear or front side of the single-sided film tearing device main body and is used to separate two single-piece adhesive films up and down on the rear or front side of the PCB large board.

2. The film tearing device for PCB board according to claim 1, characterized in that, The single-sided film tearing device main body includes mounting side plates, and a film tearing space for accommodating the PCB large board is formed between the two mounting side plates.

3. The film tearing device for PCB board according to claim 2, characterized in that, A film tearing width positioning and adjusting assembly is further provided between the two mounting side plates. The film tearing width positioning and adjusting assembly includes a film tearing width positioning plate, a film tearing width positioning adjusting motor, a film tearing width positioning adjusting belt, a film tearing width positioning adjusting guide column, and a film tearing width positioning substrate. The film tearing width positioning adjusting guide column is fixed between the two mounting side plates, the film tearing width positioning substrate is fixed on one of the mounting side plates, the film tearing width positioning plate is fixed on the film tearing width positioning adjusting belt, and the film tearing width positioning plate is sleeved on the film tearing width positioning adjusting guide column. The film tearing width positioning adjusting belt is connected to the film tearing width positioning adjusting motor, so that the film tearing width positioning adjusting motor drives the film tearing width positioning plate to slide left and right along the film tearing width positioning adjusting guide column through the film tearing width positioning adjusting belt.

4. The film tearing device for PCB board according to claim 1, characterized in that, The second film separating mechanism is arranged on the film tearing position adjusting plate through a second transmission mechanism, and the second transmission mechanism is used to drive the second film separating mechanism to move back and forth to adjust the film separating position of the second film separating mechanism.

5. A double-sided film tearing device, characterized in that, It includes two film tearing devices for PCB boards as described in claims 1-4, and a turning device for turning the PCB board is arranged between the two film tearing devices for PCB boards.

6. A method for tearing off a film for a PCB board, characterized in that, Applicable to the double-sided film tearing equipment described in claim 5, including the following steps: Step (1), after the large PCB board is loaded, the suction cup adsorbs the large PCB board to prevent the large PCB board from moving up; Step (2), the first film separating mechanism separates the single-piece adhesive film on the upper side of the large PCB board, so that it is separated from the single-piece adhesive film on the lower side of the large PCB board and separated from the end part of the large PCB board; Step (3), the film tearing mechanism clamps the single-piece adhesive film on the upper side that has been separated from the end part of the large PCB board, and the film tearing mechanism drives the single-piece adhesive film to continue to be separated from the large PCB board so that it is peeled off from the large PCB board, completing the film tearing process of one single-piece adhesive film; Step (4), move the first film separating mechanism and the film tearing mechanism to the position of the next single-piece adhesive film, and repeat Step (2) and Step (3) to complete the separation of all single-piece adhesive films; Step (5), the film recovery mechanism clamps and recovers all the single-piece adhesive films that have been peeled off on the film tearing mechanism; Step (6), turn the large PCB board over and repeat the above film tearing process to complete the film tearing of the entire large PCB board.

7. The film tearing method for PCB board according to claim 6, characterized in that, In Step (2), it also includes the process of the second film separating mechanism separating the single-piece adhesive film at the other end of the large PCB board.

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