Multilayer ceramic electronic components

Abstract

The present invention provides a multilayer ceramic electronic component, which includes: a ceramic body including a dielectric layer and a plurality of internal electrodes arranged to face each other, and the dielectric layer is interposed between the plurality of internal electrodes; and external electrodes arranged on the outer surface of the ceramic body and electrically connected to the internal electrodes, respectively. The external electrode includes an electrode layer electrically connected to the internal electrode, and the electrode layer extends to the first surface and the second surface of the ceramic body. The electrode layer includes a first layer connected to the internal electrode and a second layer arranged on the first layer, at least one point at which the slopes of the tangents of one of the first layer and the second layer are opposite to each other is arranged on the first surface or the second surface of the ceramic body, and each of the first layer and the second layer is arranged on at least one of the third surface and the fourth surface of the ceramic body, and is arranged on the first surface or the second surface of the ceramic body.

Description

[0001] This application is a divisional application of the invention patent application "Multilayer Ceramic Electronic Components" with application date of December 28, 2018 and application number 201811622003.3. Technical Field

[0002] The present disclosure relates to a multilayer ceramic electronic component, and more particularly, to a multilayer ceramic electronic component having excellent reliability. Background Art

[0003] Generally, electronic components using ceramic materials (such as capacitors, inductors, piezoelectric elements, varistors, thermistors, etc.) include a ceramic body formed using ceramic materials, internal electrodes arranged inside the ceramic body, and external electrodes arranged on the surface of the ceramic body and respectively connected to the internal electrodes.

[0004] Among the multilayer ceramic electronic components, a multilayer ceramic capacitor includes a plurality of stacked dielectric layers, internal electrodes disposed opposite to each other with the dielectric layer interposed therebetween, and external electrodes electrically connected to the internal electrodes.

[0005] Due to advantages of multilayer ceramic capacitors such as compact structure, high capacitance, easy mounting, etc., multilayer ceramic capacitors have been widely used as components in mobile communication devices such as computers, personal digital assistants (PDAs), mobile phones, etc.

[0006] With the recent trend toward high performance, light weight, thinness, shortening, and small size of electronic devices, electronic components have been required to have small size, high performance, and ultra-high capacitance.

[0007] According to the high capacitance and miniaturization of the multilayer ceramic capacitor, a technology for significantly improving the capacitance per unit volume is required.

[0008] In the case of an internal electrode, a high capacitance should be achieved by increasing the number of stacked layers, which is achieved by significantly increasing the area of ​​the internal electrode while significantly reducing the volume of the internal electrode.

[0009] Due to the high capacitance and miniaturization of multilayer ceramic capacitors, ensuring reliability (in detail, moisture-proof reliability) is becoming an important issue. Summary of the invention

[0010] An aspect of the present disclosure is to provide a multilayer ceramic electronic component and a method of manufacturing the same having excellent reliability.

[0011] According to one aspect of the present disclosure, a multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to face each other, and the dielectric layer is interposed between the plurality of internal electrodes, the ceramic body having a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction; and an external electrode disposed on an outer surface of the ceramic body and electrically connected to the internal electrodes. The external electrode includes an electrode layer electrically connected to the internal electrode and a plating layer disposed on the electrode layer, the electrode layer and the plating layer extending to the first surface and the second surface of the ceramic body. At at least one point in an area within a range of ±0.2BW around a point (0.5BW) as a midpoint of a total width BW of the electrode layer, the slopes of tangents to one of the electrode layer and the plating layer are opposite to each other, and the total width BW of the electrode layer is the total width of a portion of the electrode layer disposed on the first surface or the second surface of the ceramic body.

[0012] According to one aspect of the present disclosure, a multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and a first internal electrode and a second internal electrode arranged to face each other, and the dielectric layer is interposed between the first internal electrode and the second internal electrode, the ceramic body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; and an external electrode including a first electrode layer in contact with the first internal electrode, a second electrode layer arranged on the first electrode layer and exposing an end portion of the first electrode layer, and a first plating layer and a second plating layer arranged on the first electrode layer and the second electrode layer. The first electrode layer and the second electrode layer and the first plating layer and the second plating layer extend from the third surface to the first surface and the second surface of the ceramic body, and in an area within the range of ±0.2BW in the second direction around a point (0.5BW) which is the midpoint of the total width BW of the first electrode layer, at least one of the first electrode layer, the first plating layer and the second plating layer has a recess, and the total width BW of the first electrode layer is the total width in the second direction of the portion of the first electrode layer arranged on the first surface or the second surface of the ceramic body. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0014] Figure 1 is a perspective view of a multilayer ceramic capacitor according to an exemplary embodiment of the present disclosure;

[0015] Figure 2 is a perspective view showing an outer shape of a ceramic body according to an exemplary embodiment in the present disclosure;

[0016] Figure 3 is along Figure 1 A cross-sectional view taken along line II' in FIG.

[0017] Figure 4 yes Figure 3 Magnified view of area "E". DETAILED DESCRIPTION

[0018] Hereinafter, exemplary embodiments in the present disclosure will be described in detail with reference to the accompanying drawings, in which the same reference numerals (which are the same or correspond) are used to depict the components regardless of the figure numbers and redundant explanations are omitted.

[0019] Exemplary embodiments of the present disclosure relate to a ceramic electronic component. The electronic component using ceramic materials may be a capacitor, an inductor, a piezoelectric component, a varistor, a thermistor, etc. In the following, a multilayer ceramic capacitor will be described as an example of a ceramic electronic component.

[0020] Figure 1 is a perspective view of a multilayer ceramic capacitor according to an exemplary embodiment in the present disclosure.

[0021] Figure 2 is a perspective view showing an outer shape of a ceramic body according to an exemplary embodiment in the present disclosure.

[0022] Figure 3 is along Figure 1 A cross-sectional view taken along line II' in FIG.

[0023] Figure 4 yes Figure 3 Magnified view of area "E".

[0024] Reference Figures 1 to 4 , a multilayer ceramic capacitor 100 according to an exemplary embodiment includes a ceramic body 110 , internal electrodes 121 and 122 disposed inside the ceramic body 110 , and external electrodes 131 and 132 disposed on an outer surface of the ceramic body 110 .

[0025] exist Figure 1In the embodiment, the “length direction” of the multilayer ceramic capacitor 100 may be defined as the “L” direction, the “width direction” of the multilayer ceramic capacitor 100 may be defined as the “W” direction, and the “thickness direction” of the multilayer ceramic capacitor 100 may be defined as the “T” direction. The “thickness direction” may be used as having the same concept as the direction of stacking dielectric layers (e.g., “stacking direction”).

[0026] The ceramic body 110 may have a hexahedral shape or a similar shape, but the shape of the ceramic body 110 is not limited thereto.

[0027] The ceramic body 110 may include a first surface S1 and a second surface S2 disposed opposite to each other in a first direction, a third surface S3 and a fourth surface S4 connecting the first surface S1 and the second surface S2 and disposed opposite to each other in the second direction, and a fifth surface S5 and a sixth surface S6 connecting the first surface S1 to the fourth surface S4 and disposed opposite to each other in a third direction.

[0028] The first surface S1 and the second surface S2 are surfaces opposite to each other in the thickness direction (first direction) of the ceramic body 110. The third surface S3 and the fourth surface S4 may be defined as surfaces opposite to each other in the length direction (second direction) of the ceramic body 110. The fifth surface S5 and the sixth surface S6 may be defined as surfaces opposite to each other in the width direction (third direction) of the ceramic body 110.

[0029] The plurality of internal electrodes 121 and 122 disposed inside the ceramic body 110 may have ends exposed through the third surface S3 or the fourth surface S4 .

[0030] The internal electrodes 121 and 122 may include a pair of electrodes (a first internal electrode 121 and a second internal electrode 122 ).

[0031] One end of the first internal electrode 121 may be exposed through the third surface S3 , and one end of the second internal electrode 122 may be exposed through the fourth surface S4 .

[0032] The other end of the first internal electrode 121 may be disposed at a prescribed interval from the fourth surface S4 , and the other end of the second internal electrode 122 may be disposed at a prescribed interval from the third surface S3 , which will be described in detail later.

[0033] The first and second external electrodes 131 and 132 may be disposed on the third and fourth surfaces S3 and S4 of the ceramic body 110 to be electrically connected to the internal electrodes 121 and 122 .

[0034] Each of the internal electrodes may have a thickness of, for example, 0.4 micrometers (μm) or less, but the thickness thereof is not limited thereto.

[0035] According to an exemplary embodiment, at least 200 dielectric layers may be stacked, each of which includes an internal electrode disposed thereon.

[0036] According to an exemplary embodiment, the ceramic body 110 may include a plurality of dielectric layers 111 stacked therein.

[0037] The plurality of dielectric layers 111 forming the ceramic body 110 are in a sintered state. Adjacent dielectric layers 111 may be integrated with each other so that a boundary therebetween may not be noticeable.

[0038] The dielectric layer 111 may be formed by sintering a ceramic green sheet including ceramic powder.

[0039] The ceramic powder is not limited as long as it is commonly used in the art.

[0040] Ceramic powders may include, for example, barium titanate (BaTiO 3 )-based ceramic powder, but not limited thereto.

[0041] BaTiO 3 The base ceramic powder can be BaTiO 3 Some of the materials such as calcium (Ca), zirconium (Zr), etc. are used in 1- x Ca x )TiO 3 、Ba(Ti 1-y Ca y ) 3 、(Ba 1-x Ca x )(Ti 1-y Zr y ) 3 、Ba(Ti 1-y Zr y ) 3 , but not limited to this.

[0042] The ceramic green sheet may include transition metals, rare earth elements, magnesium (Mg), aluminum (Al), and the like in addition to the ceramic powder.

[0043] The thickness of the dielectric layer 111 may be appropriately varied according to the capacitance design of the multilayer ceramic capacitor.

[0044] For example, the thickness of the dielectric layer 111 disposed between two internal electrodes adjacent to each other after sintering may be 0.4 μm or less, but the thickness of the dielectric layer 111 is not limited thereto.

[0045] In exemplary embodiments, the thickness of the dielectric layer 111 may refer to an average thickness.

[0046] The average thickness of the dielectric layer 111 may be measured by scanning a cross section in a length direction of the ceramic body 110 using a scanning electron microscope (SEM), such as Figure 3 as shown in .

[0047] For example, the average thickness can be obtained by measuring the thickness at 30 equidistant points in the length direction on an image of any dielectric layer extracted from an image obtained by scanning a cross section along the length-thickness direction (LT) cut from a central portion in the width direction W of the ceramic body 110 and averaging the measured thickness values.

[0048] 30 equidistant points may be measured in the capacitance forming portion (a region where the first internal electrode 121 and the second internal electrode 122 overlap each other).

[0049] The average thickness of the dielectric layers can be further generalized if the measurement of the average thickness is performed for up to ten or more dielectric layers.

[0050] The ceramic body 110 may include an effective portion A as a portion contributing to forming capacitance of the capacitor, and a top cover portion C1 and a bottom cover portion C2 as edge portions disposed above and below the effective portion A, respectively.

[0051] The effective portion A may be formed by repeatedly stacking a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

[0052] The material and structure of the top cover portion C1 and the bottom cover portion C2 may be the same as those of the dielectric layer 111 except that they do not include the inner electrodes.

[0053] For example, the top cover portion C1 and the bottom cover portion C2 may include a barium titanate (BaTiO 3 ) based ceramic materials.

[0054] The top cover portion C1 and the bottom cover portion C2 may be formed by vertically stacking a single dielectric layer or two or more dielectric layers on top and bottom surfaces of the active portion A. The cover portions C1 and C2 may basically serve to prevent damage of the inner electrodes due to physical stress or chemical stress.

[0055] Each of the top cover portion C1 and the bottom cover portion C2 may have a thickness of 20 μm or less, but the thickness of each of the top cover portion C1 and the bottom cover portion C2 is not limited thereto.

[0056] With the recent trend of electronic devices toward high performance, light weight, thinness, shortening and small size, electronic components have been required to have small size, high performance and ultra-high capacitance. Therefore, the top cover part and the bottom cover part provided inside the ceramic body are reducing in thickness.

[0057] In the case where each of the top cover portion C1 and the bottom cover portion C2 has a thickness of 20 μm or less, external moisture and a plating solution may easily penetrate through the thin cover portions C1 and C2 , thereby increasing the probability of deterioration of moisture-proof reliability.

[0058] According to an exemplary embodiment, the external electrode may be coated multiple times to prevent the breakage of the external electrode disposed on the corner portion of the ceramic body. In addition, in order to improve moisture-proof reliability, points of tangent lines with opposite slopes may be formed in specific areas of the electrode layer and the plating layer (which are disposed on the top and bottom surfaces of the ceramic body).

[0059] For example, the high capacitance micro multilayer ceramic capacitor according to an exemplary embodiment is characterized in that when each of the top cover part C1 and the bottom cover part C2 has a thickness of 20 μm or less, the external electrodes are coated multiple times to improve moisture-proof reliability.

[0060] Accordingly, in a conventional multilayer ceramic capacitor in which the thickness of each of the top cover part C1 and the bottom cover part C2 is greater than 20 μm, by coating the external electrodes multiple times (similar to the exemplary embodiment), although points with opposite tangent slopes are not formed in specific areas of the electrode layer and the plating layer (which are provided on the top and bottom surfaces of the ceramic body), moisture-proof reliability is not a significant problem.

[0061] The first and second internal electrodes 121 and 122 may be formed using a conductive paste including at least one of, for example, silver (Ag), lead (Pb), platinum (Pt), nickel (Ni), and copper (Cu), but the materials of the first and second internal electrodes 121 and 122 are not limited thereto.

[0062] The multilayer ceramic capacitor according to the exemplary embodiment may include a first external electrode 131 electrically connected to the first internal electrode 121 and a second external electrode 132 electrically connected to the second internal electrode 122 .

[0063] The first and second external electrodes 131 and 132 may be electrically connected to the first and second internal electrodes 121 and 122 , respectively, to form capacitance, and a potential to which the second external electrode 132 is connected may be different from a potential to which the first external electrode 131 is connected.

[0064] The first and second external electrodes 131 and 132 may be respectively disposed on the third and fourth surfaces S3 and S4 in the length direction (second direction) of the ceramic body 110 , and may extend to the first and second surfaces S1 and S2 in the thickness direction (first direction) of the ceramic body 110 .

[0065] The first external electrode 131 is disposed on an outer surface of the ceramic body 110 and includes electrode layers 131a and 131b electrically connected to the internal electrode 121 and plating layers 131c and 131d disposed on the electrode layers 131a and 131b. The second external electrode 132 is disposed on the other outer surface of the ceramic body 110 and includes electrode layers 132a and 132b electrically connected to the internal electrode 122 and plating layers 132c and 132d disposed on the electrode layers 132a and 132b.

[0066] The external electrodes 131 and 132 include a first external electrode 131 disposed at one side of the ceramic body 110 and a second external electrode 132 disposed at the other side.

[0067] The electrode layers 131a, 131b, 132a, and 132b may include conductive metal and glass.

[0068] The conductive metal used for the electrode layers 131a, 131b, 132a and 132b is not limited as long as it can be electrically connected to the internal electrodes to form a capacitor. The conductive metal may be at least one selected from the group consisting of, for example, copper (Cu), silver (Ag), nickel (Ni) and alloys thereof.

[0069] The conductive paste is prepared by adding glass frit to a conductive metal powder, and the electrode layers 131 a , 131 b , 132 a , and 132 b may be formed by coating the conductive paste and sintering the coated conductive paste.

[0070] For example, the electrode layers 131 a , 131 b , 132 a , and 132 b may be sintered electrodes formed by sintering a paste containing a conductive metal.

[0071] The conductive metal included in the electrode layers 131 a , 131 b , 132 a , and 132 b is electrically conducted to the first and second internal electrodes 121 and 122 to implement electrical characteristics.

[0072] The glass included in the electrode layers 131 a , 131 b , 132 a , and 132 b serves as a sealant for the conductive metal to block external moisture.

[0073] The first external electrode 131 is disposed on one surface in the length direction L (second direction) of the ceramic body 110 and includes first electrode layers 131a and 131b electrically connected to the first internal electrode 121 and first plating layers 131c and 131d disposed on the first electrode layers 131a and 131b.

[0074] The second external electrode 132 is disposed on the other surface of the ceramic body 110 in the length direction L (second direction), and includes second electrode layers 132a and 132b electrically connected to the second internal electrode 122 and second plating layers 132c and 132d disposed on the second electrode layers 132a and 132b.

[0075] The electrode layers 131a, 131b, 132a and 132b can be arranged on both side surfaces in the length direction L of the ceramic body 110, and can extend to portions of the first surface S1 and the second surface S2 (the top surface and the bottom surface of the ceramic body 110) or can further extend to portions of the fifth surface 5 and the sixth surface 6.

[0076] The plating layers 131d, 131c, 132d, and 132c may be disposed on the electrode layers 131a, 131b, 132a, and 132b.

[0077] The electrode layers 131a, 131b, 132a, and 132b may be formed using the same conductive metal as the first and second internal electrodes 121 and 122, but the material of the electrode layers 131a, 131b, 132a, and 132b is not limited thereto. For example, the electrode layers 131a, 131b, 132a, and 132b may be formed using copper (Cu), silver (Ag), nickel (Ni), or an alloy thereof.

[0078] The electrode layers 131a and 131b and 132a and 132b can be respectively arranged on the third surface S3 and the fourth surface S4 arranged opposite to each other in the second direction of the ceramic body 110, and can include first layers 131a and 132a respectively electrically connected to the internal electrodes 121 and 122 and second layers 131b and 132b respectively arranged on the first layers 131a and 132a as follows: the width of the portions of the second layers 131b and 132b respectively arranged on the first surface S1 and the second surface S2 in the length direction is smaller than the width of the portions of the first layers 131a and 132a respectively arranged on the first surface S1 and the second surface S2 in the length direction.

[0079] The second layers 131 b and 132 b may cover corner portions of the ceramic body 110 .

[0080] According to an exemplary embodiment, since the first layers 131a and 132a and the second layers 131b and 132b as electrode layers cover the corner portions of the ceramic body 110, external moisture and a plating solution may be prevented from penetrating into the corner portions of the ceramic body 110 by multiple coatings. Therefore, moisture-proof reliability may be improved.

[0081] The plated layers 131 c , 131 d , 132 c , and 132 d may include nickel plated layers 131 c and 132 c and tin plated layers 131 d and 132 d disposed on the nickel plated layers 131 c and 132 c , but are not limited thereto.

[0082] The plated layers 131c, 131d, 132c, and 132d may cover end portions of the first layers 131a and 132a.

[0083] According to an exemplary embodiment, the electrode layers 131a, 131b, 132a and 132b and the plating layers 131c, 131d, 132c and 132d extend to the first and second surfaces S1 and S2 of the ceramic body 110 or further extend to portions of the fifth and sixth surfaces 5 and 6 of the ceramic body 110.

[0084] At least one point I P At the electrode layers 131a and 132a, the slopes of the tangent lines to the plating layers 131c, 131d, 132c and 132d are opposite to each other. P The total width BW of the electrode layer is the total width of the electrode layer disposed on the first surface S1 or the second surface S2 of the ceramic body 110 in the length direction. P (The recess) is located in an area within a range of ±0.2BW in the length direction around a point (0.5BW) which is the midpoint of the total width BW of the electrode layer in the length direction, and the total width BW of the electrode layer is the total width of the electrode layer in the length direction arranged on the first surface S1 or the second surface S2 of the ceramic body 110.

[0085] The total width BW of the electrode layers disposed on the first and second surfaces of the ceramic body is the width of the first layers 131 a and 132 a in the length direction.

[0086] As described above, at least one point I at which the slopes of the tangent lines of the electrode layers 131a and 132a and the plated layers 131c, 131d, 132c, and 132d are opposite to each other. PThe outer electrode disposed on the corner portion of the ceramic body 110 is not disconnected, and the moisture-proof property can be enhanced to improve reliability.

[0087] An area within a range of ±0.2BW around a point (0.5BW) which is a midpoint of the total width BW of the electrode layer (the total width of the electrode layer disposed on the first surface S1 or the second surface S2 of the ceramic body 110) is as follows Figure 4 An area accounting for 40% of the total width BW of the first layers 131a and 132a is shown in FIG. 1 and can be represented by 0.4BW.

[0088] There may be at least one point I where the slopes of the tangent lines of the electrode layers 131a and 132a are opposite to each other in a region within a range of ±0.2BW around a point (0.5BW) which is a midpoint of the total width BW of the electrode layer (the total width of the electrode layer disposed on the first surface S1 or the second surface S2 of the ceramic body 110). P and / or at least one point I at which the slopes of the tangent lines of the plating layers 131c, 131d, 132c and 132d are opposite to each other. P .

[0089] In a product applying a thin film dielectric layer and an internal electrode (after sintering, the dielectric layer 111 has a thickness of 0.4 μm or less, and each of the first and second internal electrodes 121 and 122 has a thickness of 0.4 μm or less), moisture resistance reliability may be deteriorated.

[0090] Therefore, when the dielectric layer 111 has a thickness of 0.4 μm or less and each of the first and second internal electrodes 121 and 122 has a thickness of 0.4 μm or less, the electrode layers should be coated multiple times and at least one point I where the slopes of tangent lines of the electrode layers 131a and 132a and the plating layers 131c, 131d, 132c, and 132d are opposite to each other should be formed in a region within a range of ±0.2BW around a point (0.5BW) which is a midpoint of the total width BW of the electrode layers. P Therefore, it is possible to prevent the moisture-proof reliability from being deteriorated.

[0091] The term “thin film” used herein means that the thickness of the dielectric layer and the internal electrode is smaller than that of conventional products, and also means that each of the dielectric layer 111 and the first and second internal electrodes 121 and 122 has a thickness of 0.4 μm or less.

[0092] In an exemplary embodiment, the point I at which the slopes of the tangent lines of the electrode layers 131a and 132a and the plated layers 131c, 131d, 132c, and 132d are opposite to each other. P It can be the point where the slope of the tangent line changes from a negative value to a positive value. The slopes are opposite to each other when the signs of the slope values ​​are opposite, i.e., one is positive and the other is negative.

[0093] For example, Figure 4 As shown in FIG. 1 , the slope of the tangent line ST1 is opposite to the point I where the slopes of the tangent lines of the electrode layers 131a and 132a and the plated layers 131c, 131d, 132c, and 132d are opposite to each other. P The previous area can have negative values. P Thereafter, the slope of the tangent line ST2 may have a positive value.

[0094] In an exemplary embodiment, at least one point I at which the slope of the tangent line of the electrode layers 131a and 132a and the plated layers 131c, 131d, 132c, and 132d changes from a negative value to a positive value. P Located in a region within a range of ±0.2BW around a point (0.5BW) which is a midpoint of a total width BW of the electrode layer (the total width of the electrode layer provided on the first surface S1 or the second surface S2 of the ceramic body 110 ).

[0095] As a result, the moisture-proof reliability of the multilayer ceramic electronic component can be improved.

[0096] Hereinafter, a method of manufacturing a multilayer ceramic capacitor according to an exemplary embodiment will be described below.

[0097] According to exemplary embodiments, a plurality of ceramic green sheets may be prepared.

[0098] In order to form a ceramic green sheet, a slurry may be prepared by mixing ceramic powder, a binder, a solvent, etc. The slurry may be formed into a sheet having a thickness of several micrometers by a doctor blade technique. Then, the ceramic green sheet may be sintered to form a ceramic sheet such as Figure 2 The dielectric layer 111 is shown in FIG.

[0099] The ceramic green sheet may have a thickness of 0.6 μm. Therefore, after sintering, the dielectric layer may have a thickness of 0.4 μm or less.

[0100] Next, a conductive paste for an internal electrode may be coated on the ceramic green sheet to form an internal electrode pattern. The internal electrode pattern may be formed by a screen printing method, a gravure printing method, or the like.

[0101] The conductive paste for the internal electrode may include a conductive metal and an additive, and the additive may be at least one of a non-metallic oxide and a metal oxide.

[0102] The conductive metal may include nickel. The additive may include barium titanate or strontium titanate as a metal oxide.

[0103] The internal electrode pattern may have a thickness of 0.5 μm or less. Therefore, after sintering, the internal electrode may have a thickness of 0.4 μm or less.

[0104] The ceramic green sheets having the internal electrode patterns formed thereon may be stacked and may be pressurized in a stacking direction to compress the ceramic green sheets, forming a ceramic stack structure having the internal electrode patterns formed therein.

[0105] The ceramic laminated structure is cut into sheets according to each region corresponding to a single capacitor.

[0106] In this case, the ceramic laminate structure may be cut in such a manner that end portions of the internal electrode patterns are alternately exposed through side surfaces of the ceramic laminate structure.

[0107] The ceramic laminate structure formed into a sheet may be sintered to form a ceramic body.

[0108] The sintering process may be performed under a reducing atmosphere. In addition, the sintering process may be performed by controlling a temperature increase rate. At a temperature of 700° C. or less, the temperature increase rate may be 30° C. / 60 s to 50° C. / 60 s.

[0109] The external electrode may be formed to be electrically connected to the internal electrode exposed to the side surface of the ceramic body while covering the side surface of the ceramic body. A plating layer such as nickel, tin, etc. may be formed on the surface of the external electrode.

[0110] More specifically, the multilayer ceramic capacitor according to the exemplary embodiment may be manufactured by the method described below.

[0111] Barium titanate powder, ethanol as an organic solvent, and polyvinyl butyral as a binder were mixed and ball-milled to prepare a ceramic slurry. A ceramic green sheet was prepared using the ceramic slurry.

[0112] The internal electrodes were formed by printing a nickel-containing conductive paste for internal electrodes on the ceramic green sheets. 2 A green laminate structure having laminated internal electrodes is obtained by isostatic pressing under a pressure of 1000 rpm.

[0113] The compressed green laminate structure was cut to form green sheets. During the debinding process, the green sheets were kept in an atmosphere at a temperature of 230°C for 60 hours. The debinding green sheets were sintered at a temperature of 1000°C to form sintered sheets. The sintering process was performed in a reducing atmosphere to prevent oxidation of the internal electrodes and at a temperature lower than 10% of the equilibrium oxygen partial pressure of Ni / NiO.-11 Up to 10 -10 Standard atmospheric pressure (atm) is used to provide a reducing atmosphere.

[0114] An electrode layer is formed on the outside of the sintered sheet using a paste for external electrodes including copper powder and glass powder. A nickel plating layer and a tin plating layer are formed on the electrode layer by plating.

[0115] A first layer is formed on the outside of the sintered sheet using a paste for external electrodes including copper powder and glass powder. A second layer is formed on the first layer using a paste for external electrodes including copper powder and glass powder similar to those of the first layer so that the second layer is formed to have a smaller width in the length direction of the ceramic body than the first layer in the length direction of the ceramic body.

[0116] The electrode layer can be double coated by the first layer and the second layer to double form a sintered electrode layer on the corner portion of the ceramic body. Therefore, the problem that the external electrode is not coated on the corner portion of the ceramic body can be prevented to improve moisture-proof reliability.

[0117] As described above, according to the exemplary embodiment, the external electrode is multi-layer coated. Therefore, there is no disconnection of the external electrode provided on the corner portion of the ceramic body. In addition, the points where the slopes of the tangent lines are opposite to each other are located in specific areas of the electrode layer and the plating layer provided on the top and bottom surfaces of the ceramic body. Therefore, the moisture-proof property can be enhanced to improve reliability.

[0118] While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the invention as defined by the appended claims.

Claims

1. A multilayer ceramic electronic component comprising: a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to face each other with the dielectric layer interposed between the plurality of internal electrodes, the ceramic body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; as well as an external electrode disposed on an outer surface of the ceramic body and connected to the internal electrode, wherein the external electrode includes an electrode layer connected to the internal electrode, and the electrode layer extends to the first surface and the second surface of the ceramic body, The electrode layer is disposed on at least one of the third surface and the fourth surface, and includes a first layer connected to the internal electrode and a second layer disposed on the first layer, the second layer being disposed in such a manner that a width of a portion of the second layer disposed on the first surface or the second surface of the ceramic body is smaller than a width of a portion of the first layer disposed on the first surface or the second surface of the ceramic body, At least one point at which slopes of tangent lines of one of the first layer and the second layer are opposite to each other is provided on the first surface or the second surface of the ceramic body, and Each of the first layer and the second layer is disposed on the at least one of the third surface and the fourth surface, and is disposed on the first surface or the second surface.

2. The multilayer ceramic electronic component according to claim 1, wherein: The external electrode further includes a plating layer disposed on the second layer, and the plating layer extends to the first surface and the second surface of the ceramic body, and At least one point at which the slopes of tangent lines of one of the plating layers are opposite to each other is provided on the first surface or the second surface of the ceramic body.

3. The multilayer ceramic electronic component according to claim 2, wherein: The at least one point where the slopes of the tangent lines of one of the coatings are opposite to each other is arranged in an area within a range of ±0.2BW around a "0.5BW" point, and the "0.5BW" point is the midpoint of the total width BW of the portion of the electrode layer arranged on the first surface or the second surface of the ceramic body.

4. The multilayer ceramic electronic component according to claim 2, wherein: The point at which the slopes of the tangent lines of the one of the plating layers are opposite to each other is a point at which the slope of the tangent line changes from a negative value to a positive value.

5. The multilayer ceramic electronic component according to claim 1, wherein: The at least one point at which the slopes of the tangent lines of one of the first layer and the second layer are opposite to each other is arranged in an area within a range of ±0.2BW around a "0.5BW" point, and the "0.5BW" point is the midpoint of the total width BW of the portion of the electrode layer arranged on the first surface or the second surface of the ceramic body.

6. The multilayer ceramic electronic component according to claim 3 or 5, wherein: The total width BW of the portion of the electrode layer disposed on the first surface or the second surface of the ceramic body is the width of the first layer.

7. The multilayer ceramic electronic component according to claim 2, wherein: The plating layer covers an end portion of the first layer.

8. The multilayer ceramic electronic component according to claim 1, wherein: The second layer covers a corner portion of the ceramic body.

9. The multilayer ceramic electronic component according to claim 1, wherein: The width of the portion of the second layer disposed on the first surface or the second surface of the ceramic body is the width of the portion of the second layer disposed on the first surface or the second surface of the ceramic body in the second direction, and The width of the portion of the first layer disposed on the first surface or the second surface of the ceramic body is a width of the portion of the first layer disposed on the first surface or the second surface of the ceramic body in the second direction.

10. The multilayer ceramic electronic component according to claim 1, wherein At least one of the dielectric layers has a thickness of 0.4 microns or less.

11. The multilayer ceramic electronic component according to claim 10, wherein: At least one of the internal electrodes has a thickness of 0.4 micrometers or less.

12. The multilayer ceramic electronic component according to claim 11, wherein: The inner electrode has an average thickness of 0.4 micrometers or less.

13. The multilayer ceramic electronic component according to claim 1, wherein: The average thickness of the dielectric layer is 0.4 micrometers or less.

14. The multilayer ceramic electronic component according to claim 1, wherein: At least one of the internal electrodes has a thickness of 0.4 micrometers or less.

15. The multilayer ceramic electronic component according to claim 1, wherein: The inner electrode has an average thickness of 0.4 micrometers or less.

16. The multilayer ceramic electronic component according to claim 1, wherein: The ceramic body includes an effective portion and cover portions disposed above and below the effective portion, in which a capacitor is formed by including the plurality of internal electrodes disposed opposite to each other with the dielectric layer interposed therebetween, and The thickness of each of the cover portions is 20 micrometers or less.

17. The multilayer ceramic electronic component according to claim 1, wherein: The point at which the slopes of the tangent lines of one of the first layer and the second layer are opposite to each other is a point at which the slope of the tangent line changes from a negative value to a positive value.

18. The multilayer ceramic electronic component according to claim 17, wherein: One of the dielectric layers has a thickness of 0.4 microns or less.

19. The multilayer ceramic electronic component according to claim 1, wherein: The at least one point is arranged in an area within the range of ±0.2BW in the second direction around a "0.5BW" point, and the "0.5BW" point is the midpoint of the total width BW of the portion of the electrode layer arranged in the second direction on the first surface or the second surface of the ceramic body.

20. The multilayer ceramic electronic component according to claim 1, wherein The electrode layer includes conductive metal and glass.

21. The multilayer ceramic electronic component of claim 2, wherein the plating layer comprises a nickel plating layer and a tin plating layer.

22. A multilayer ceramic electronic component comprising: a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to face each other with the dielectric layer interposed between the plurality of internal electrodes, the ceramic body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; as well as an external electrode disposed on an outer surface of the ceramic body and connected to the internal electrode, wherein the external electrode includes an electrode layer connected to the internal electrode, and the electrode layer extends to the first surface and the second surface of the ceramic body, The electrode layer is disposed on at least one of the third surface and the fourth surface, and includes a first layer connected to the internal electrode and a second layer disposed on the first layer, the second layer being disposed in such a manner that a width of a portion of the second layer disposed on the first surface or the second surface of the ceramic body is smaller than a width of a portion of the first layer disposed on the first surface or the second surface of the ceramic body, At least one point at which slopes of tangent lines of one of the first layer and the second layer are opposite to each other is provided on the first surface or the second surface of the ceramic body, and Each of the first layer and the second layer includes a conductive metal and glass.

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