一种电子元件用多层整板陶瓷基座及其制造方法
By setting through holes and slurry-filling holes in the multilayer ceramic substrate and using conductive lines and connecting lines to achieve conductivity between the electrodes and the pads, the problem of electroplating not being possible with multilayer substrates is solved, ensuring the electroplating effect without affecting the performance of individual products.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHINAMETAL TECH (HENAN) CO LTD
- Filing Date
- 2022-12-27
- Publication Date
- 2026-07-17
AI Technical Summary
In existing technologies, multilayer substrates cannot achieve conductivity between all electrodes and pads during manufacturing, making it impossible to complete the electroplating of the entire ceramic substrate.
The design employs at least two layers of solid substrate, with through holes and slurry filling holes. Conductivity between the electrodes and pads is achieved through conductive lines and connecting lines. After electroplating, the conductive lines and connecting lines are broken to complete the electroplating of the solid ceramic substrate.
Effective conductivity between electrodes and pads in a multilayer substrate is achieved, ensuring electroplating results and not affecting the performance of individual products after cutting.
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Figure CN116169981B_ABST
Abstract
Citation Information
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