Optical path control member and display device comprising the same

Abstract

The optical path control member according to the embodiment includes: a first substrate in which a first direction and a second direction are defined; a first electrode provided on the first substrate; a second substrate provided on the first substrate, in which the first direction and the second direction are defined; a second electrode provided under the second substrate; and an optical conversion unit provided between the first electrode and the second electrode, wherein: the second substrate and the second electrode include cut portions that pass through the second substrate and the second electrode, the cut portions including: 1-1 and 1-2 cut portions that are provided in the second direction while facing each other; and 2-1 and 2-2 cut portions that are provided in the first direction while facing each other; a first sealing portion is provided on the 1-1 and 1-2 cut portions, and a second sealing portion is provided inside the 2-1 and 2-2 cut portions.

Description

Technical Field

[0001] The embodiments relate to an optical path control component and a display device including the optical path control component. Background Technology

[0002] The light-shielding film blocks the transmission of light from the light source and is attached to the front surface of the display panel. Thus, when the display plays a picture, the light-shielding film adjusts the viewing angle of the light according to the incident angle of the light to display a clear image quality at the viewing angle required by the user. The display panel is a display device used in mobile phones, laptops, tablets, car navigation devices, vehicle touch screens, etc.

[0003] In addition, light-blocking films can be used on windows of vehicles, buildings, etc., to partially block external light to prevent glare or to prevent the interior from being seen from the outside.

[0004] In other words, a light-blocking film can be a light path control component that controls the movement path of light to block light in a specific direction and transmit light in a specific direction. Therefore, by controlling the light transmission angle through a light-blocking film, the user's viewing angle can be controlled.

[0005] Meanwhile, such light-blocking films can be divided into two types: light-blocking films that can always control the viewing angle regardless of the surrounding environment or user environment, and switchable light-blocking films that allow users to open / close the viewing angle control according to the surrounding environment or user environment.

[0006] Such a switchable light-blocking film can be achieved by the following method: in this method, the housing is converted into a light-transmitting part and a light-blocking part by filling the interior of the housing with a light-converting material and by dispersing and aggregating particles. The light-converting material includes particles that are movable when a voltage is applied and a dispersion liquid for dispersing the particles.

[0007] In other words, a switchable light-shielding film may include multiple receptacles filled with a dispersion liquid in order to change the light path.

[0008] As described above, a viscous dispersion is filled within the containment. Therefore, the following problems exist: when using the switchable light-shielding film, the dispersion may leak to the outside, or impurities may seep into the dispersion, thereby deteriorating the driving characteristics and reliability of the switchable light-shielding film.

[0009] Furthermore, when a switchable light-shielding film is combined with a display panel for use as a display device, the pattern of the switchable light-shielding film may overlap with the pattern of the display panel, resulting in moiré patterns. Therefore, when users use this display device, there is a problem of degraded visibility due to moiré patterns.

[0010] Therefore, a new optical path control component with a novel structure is needed to solve the above problems. Summary of the Invention

[0011] Technical issues

[0012] The embodiments relate to an optical path control component with improved visibility and reliability, and a display device including the optical path control component.

[0013] Technical solution

[0014] The optical path control component according to an embodiment includes: a first substrate in which a first direction and a second direction are defined; a first electrode disposed on the first substrate; a second substrate disposed on the first substrate in which the first direction and the second direction are defined; a second electrode disposed below the second substrate; and an optical conversion unit disposed between the first electrode and the second electrode, wherein the second substrate and the second electrode include cut portions passing through the second substrate and the second electrode, the cut portions including: a 1-1 cut portion and a 1-2 cut portion, the 1-1 cut portion and the 1-2 cut portion being configured to face each other in the second direction; and a 2-1 cut portion and a 2-2 cut portion, the 2-1 cut portion and the 2-2 cut portion being configured to face each other in the first direction, a first sealing portion being disposed on the 1-1 cut portion and the 1-2 cut portion, and a second sealing portion being disposed inside the 2-1 cut portion and the 2-2 cut portion.

[0015] Beneficial effects

[0016] In the optical path control component according to the first embodiment, a cut portion, a second electrode, a buffer layer, and an optical conversion unit that pass through the entire or a portion of the second substrate can be formed on the second substrate.

[0017] Furthermore, the first sealing part and the second sealing part can be respectively disposed inside the cutting part.

[0018] The first sealing part and the second sealing part are configured to seal the inlet and outlet of the receiving part for containing the light conversion material, and extend along the side region of the light conversion unit, that is, the side region in the first direction.

[0019] Therefore, the first sealing part can prevent the light conversion material in the accommodating part from flowing out to the outside of the light conversion unit, and the first sealing part and the second sealing part can prevent impurities from penetrating into the light conversion unit from the outside, thereby improving the reliability of the optical path control component.

[0020] Furthermore, since the first sealing portion and the second sealing portion are disposed within the cut portion formed on the second substrate, the size of the optical path control component can be reduced compared to the first sealing portion and the second sealing portion formed outside the optical conversion unit, and the sealing performance of the optical path control component can be improved by preventing the sealing component material from being deformed by the external environment.

[0021] Furthermore, in the optical path control member according to the first embodiment, the first connecting electrode may be disposed on the first protrusion, and the second connecting electrode may be disposed on the second protrusion formed on the second substrate.

[0022] The surfaces of the first substrate and the second substrate may not protrude as a whole, and the first protrusion and the second protrusion may only protrude the area where the first connection region and the second connection electrode can be formed.

[0023] Furthermore, in the optical path control component according to the first embodiment, since the first connecting electrode and the second connecting electrode are disposed on the same plane, the first connecting electrode and the second connecting electrode can be easily connected to a printed circuit board, etc.

[0024] Accordingly, the area of ​​the first and second protrusions can be reduced. Consequently, when the optical path control component is coupled to the display panel and applied to the display device, other components of the display device can be located in areas not corresponding to the first and second protrusions, thereby reducing the bezel area of ​​the display device.

[0025] In other words, the optical path control component according to the first embodiment reduces the size of the frame area where the connecting electrodes are set, thereby reducing the frame area of ​​the display device using the optical path control component.

[0026] In the optical path control member according to the second embodiment, the receiving portion can be provided by tilting the receiving portion relative to the second direction of the substrate at a predetermined tilt angle.

[0027] Therefore, when the optical path control component and the display panel are combined to form a display device, the moiré pattern caused by the overlap of the pattern of the receiving part of the optical path control component with the pixel pattern of the display panel can be prevented.

[0028] Accordingly, when a user views the display device from the outside, moiré patterns caused by the overlap of the pattern of the receiving part of the optical path control component with the pattern of the pixels of the display panel can be prevented.

[0029] Furthermore, the optical path control member according to the second embodiment can prevent the optical conversion material from flowing out onto the side surface of the optical path control member when the receiving part is tilted.

[0030] In other words, since the first sealing part and the second sealing part are provided at both ends of the optical path control member in the first direction and the second direction to seal the light conversion material in the receiving part, the situation of the light conversion material flowing out to the outside or external impurities penetrating into the light conversion material can be minimized.

[0031] Furthermore, by forming a region where the sealing part and the light conversion material are mixed, the adhesive properties of the sealing part can be improved through an anchoring effect. Therefore, the adhesion of the sealing part can be improved to prevent detachment, thereby improving the reliability and sealing performance of the optical path control component.

[0032] According to the third embodiment, the optical path control component can be provided by connecting a first protrusion of the first substrate and a second protrusion of the second substrate.

[0033] Therefore, when the first substrate and the second substrate are stacked, alignment errors can be reduced.

[0034] Therefore, defects can be prevented and process efficiency can be improved during the manufacturing of optical path control components.

[0035] Furthermore, the adhesive layer is spaced apart from the electrode connection portion disposed in the third cut portion which serves as the second connection region, and an insulating layer is disposed between the electrode connection portion and the adhesive layer, thereby preventing the electrode connection portion from being electrically connected to the first electrode by means of the dielectric constant of the adhesive layer.

[0036] Therefore, the material of the adhesive layer can be freely selected, and electrical short circuits caused by the dielectric constant of the adhesive layer can be prevented, thereby improving the driving characteristics and reliability of the optical path control components. Attached Figure Description

[0037] Figure 1 This is a perspective view of the optical path control component according to the first embodiment.

[0038] Figure 2 This is a top view of the first substrate of the optical path control component according to the first embodiment.

[0039] Figure 3 This is a top view of the second substrate of the optical path control component according to the first embodiment.

[0040] Figure 4 This is a top view of a second substrate on which the first substrate and the second substrate of the optical path control component according to the first embodiment are stacked.

[0041] Figure 5 and Figure 6 It is along Figure 1 A sectional view taken along line A-A'.

[0042] Figure 7 It is along Figure 1 The sectional view taken by the B-B' line.

[0043] Figure 8 It is along Figure 1 The sectional view taken by the C-C' line.

[0044] Figure 9 It is along Figure 1 The sectional view taken by the D-D' line.

[0045] Figure 10 It is along Figure 1 The sectional view taken by the E-E' line.

[0046] Figure 11 It is along Figure 1 A cross-sectional view taken along line F-F'.

[0047] Figure 12 It is along Figure 1 The cross-sectional view taken by the G-G' line.

[0048] Figure 13 It is along Figure 1 The cross-sectional view taken by the H-H' line.

[0049] Figure 14 It is along Figure 1 The sectional view taken by the I-I' line.

[0050] Figure 15 This is a perspective view of the optical path control component according to the second embodiment.

[0051] Figure 16 This is a top view of the first substrate of the optical path control component according to the second embodiment.

[0052] Figure 17 This is a top view of the second substrate of the optical path control component according to the second embodiment.

[0053] Figure 18 This is a top view of the second substrate, which is a first substrate and a second substrate of the optical path control component according to the second embodiment, being stacked together.

[0054] Figure 19 It is along Figure 15 The sectional view taken by the J-J' line.

[0055] Figure 20 It is along Figure 15 A cross-sectional view taken by the K-K' line.

[0056] Figure 21 It is along Figure 15 The sectional view taken by the L-L' line.

[0057] Figure 22 yes Figure 18 An enlarged view of region A in the image.

[0058] Figure 23 yes Figure 18 A magnified view of region B in the image.

[0059] Figure 24 yes Figure 18 A magnified view of region C in the image.

[0060] Figure 25 yes Figure 18 An enlarged view of region D in the image.

[0061] Figure 26 This is a perspective view of the optical path control component according to the third embodiment.

[0062] Figure 27 This is a top view of the first substrate of the optical path control component according to the third embodiment.

[0063] Figure 28 This is a top view of the second substrate of the optical path control component according to the third embodiment.

[0064] Figure 29 This is a top view of a second substrate in which a first substrate and a second substrate of an optical path control member are stacked, according to a third embodiment.

[0065] Figure 30 It is along Figure 26 The cross-sectional view taken by the M-M' line.

[0066] Figure 31 This is a perspective view of the optical path control component according to the fourth embodiment.

[0067] Figure 32 This is a top view of the second substrate of the optical path control component according to the fourth embodiment.

[0068] Figure 33 This is a top view of a second substrate in which a first substrate and a second substrate of an optical path control member are stacked, according to the fourth embodiment.

[0069] Figure 34 and Figure 35 It is along Figure 31 The cross-sectional view taken by the O-O' line.

[0070] Figure 36 It is along Figure 31 The cross-sectional view taken by the P-P' line.

[0071] Figure 37 It is along Figure 31 A cross-sectional view taken along the Q-Q' line.

[0072] Figures 38 to 42 It is along Figure 31 Various sectional views taken by the R-R' line in the diagram.

[0073] Figure 43 It is along Figure 31 A sectional view taken by the S-S' line.

[0074] Figure 44 It is along Figure 31 The cross-sectional view taken by the T-T' line.

[0075] Figure 45 It is along Figure 31 A cross-sectional view taken by the U-U' line.

[0076] Figure 46 This is a view used to describe an optical path control module according to an embodiment, in which optical path control components and a printed circuit board are combined.

[0077] Figures 47 to 64 This is a view used to describe a method of manufacturing an optical path control component according to an embodiment.

[0078] Figure 65 and Figure 66 This is a cross-sectional view of a display device that utilizes the optical path control component according to an embodiment.

[0079] Figures 67 to 69 This is a view used to describe an embodiment of a display device that applies a light path control component according to an embodiment. Detailed Implementation

[0080] In the following, embodiments of the invention will be described in detail with reference to the accompanying drawings. However, the spirit and scope of the invention are not limited to the portion of the described embodiments, and it may be implemented in various other forms. Furthermore, one or more elements of the embodiments may be selectively combined and substituted within the spirit and scope of the invention.

[0081] Furthermore, unless otherwise explicitly defined and described, the terms (including technical and scientific terms) used in the embodiments of this invention may be interpreted as having the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains, and terms such as those defined in common dictionaries may be interpreted as having the same meaning as their meaning in the context of the relevant art.

[0082] Furthermore, the terminology used in the embodiments of this invention is for describing the embodiments and is not intended to limit the invention. In this specification, unless specifically stated in the wording, the singular form may also include the plural form, and when described as "at least one (or more) of A (and), B and C", it may include at least one of all combinations that can be combined among A, B, and C.

[0083] Furthermore, when describing the elements of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are used only to distinguish elements from other elements, and they do not limit the nature, order, or sequence of the elements.

[0084] In addition, when an element is described as being "connected" or "combined" to another element, it can include not only cases where the element is directly "connected" or "combined" to other elements, but also cases where the element is "connected" or "combined" to another element through which the element is connected or "combined" with other elements.

[0085] Furthermore, when described as being formed or set "above" or "below" each element, "above" or "below" can include not only cases where two elements are directly connected to each other, but also cases where one or more other elements are formed or set between the two elements.

[0086] Furthermore, when expressed as "up" or "down", it can include not only the upward direction based on a single element, but also the downward direction based on a single element.

[0087] In the following description, an optical path control component according to an embodiment will be described with reference to the accompanying drawings. The optical path control component described below relates to a switchable optical path control component driven in various modes according to the movement of electrophoretic particles caused by the application of a voltage.

[0088] The following text will refer to Figures 1 to 14 The optical path control component according to the first embodiment is described.

[0089] refer to Figures 1 to 14 According to the first embodiment, the optical path control component 1000 may include a first substrate 110, a second substrate 120, a first electrode 210, a second electrode 220, and an optical conversion unit 300.

[0090] The first substrate 110 can support the first electrode 210. The first substrate 110 can be rigid or flexible.

[0091] Furthermore, the first substrate 110 may be transparent. For example, the first substrate 110 may include a transparent substrate capable of transmitting light.

[0092] The first substrate 110 may include glass, plastic, or a flexible polymer film. For example, the flexible polymer film may be made of any of polyethylene terephthalate (PET), polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polyethersulfone (PES), cyclic olefin copolymer (COC), triacetyl cellulose (TAC) film, polyvinyl alcohol (PVA) film, polyimide (PI) film, and polystyrene (PS). This is merely an example, but this embodiment is not limited thereto.

[0093] In addition, the first substrate 110 may be a flexible substrate with flexible features.

[0094] Furthermore, the first substrate 110 can be a curved or bent substrate. That is, the optical path control member including the first substrate 110 can also be formed to have flexible, curved, or bent features. Accordingly, the optical path control member according to the embodiment can be changed to various designs.

[0095] The first substrate 110 may extend in a first direction 1A, a second direction 2A and a third direction 3A.

[0096] In detail, the first substrate 110 may include a first direction 1A corresponding to the length direction or width direction of the first substrate 110, a second direction 2A extending in a direction different from the first direction 1A and corresponding to the length direction or width direction of the first substrate 110, and a third direction 3A extending in a direction different from the first direction 1A and the second direction 2A and corresponding to the thickness direction of the first substrate 110.

[0097] For example, the first direction 1A can be defined as the length direction of the first substrate 110, the second direction 2A can be defined as the width direction of the first substrate 110 perpendicular to the first direction 1A, and the third direction 3A can be defined as the thickness direction of the first substrate 110. Alternatively, the first direction 1A can be defined as the width direction of the first substrate 110, the second direction 2A can be defined as the length direction of the first substrate 110 perpendicular to the first direction 1A, and the third direction 3A can be defined as the thickness direction of the first substrate 110.

[0098] For ease of description, the first direction 1A will be described as the length direction of the first substrate 110, the second direction 2A will be described as the width direction of the first substrate 110, and the third direction 3A will be described as the thickness direction of the first substrate 110.

[0099] The first electrode 210 may be disposed on one surface of the first substrate 110. More specifically, the first electrode 210 may be disposed on the upper surface of the first substrate 110. That is, the first electrode 210 may be disposed between the first substrate 110 and the second substrate 120.

[0100] The first electrode 210 may include a transparent conductive material. For example, the first electrode 210 may include a conductive material having a light transmittance of about 80% or higher. For example, the first electrode 210 may include a metal oxide, such as indium tin oxide, indium zinc oxide, copper oxide, tin oxide, zinc oxide, titanium oxide, etc.

[0101] The first electrode 210 can have a thickness of 10 nm to 300 nm.

[0102] Alternatively, the first electrode 210 may comprise various metals to achieve low resistance. For example, the first electrode 210 may comprise at least one metal of chromium (Cr), nickel (Ni), copper (Cu), aluminum (Al), silver (Ag), molybdenum (Mo), gold (Au), titanium (Ti), and alloys thereof.

[0103] The first electrode 210 may be disposed on the entire surface of one surface of the first substrate 110. More specifically, the first electrode 210 may be disposed as a surface electrode on one surface of the first substrate 110. However, this embodiment is not limited thereto, and the first electrode 210 may be formed by a plurality of patterned electrodes having a uniform pattern (e.g., a mesh or stripe shape).

[0104] For example, the first electrode 210 may include multiple conductive patterns. More specifically, the first electrode 210 may include multiple intersecting mesh lines and multiple mesh openings formed by the mesh lines.

[0105] Accordingly, even though the first electrode 210 comprises metal, it cannot be visually identified from the outside, thus improving visibility. Furthermore, the opening increases light transmittance, thereby improving the brightness of the optical path control component according to the embodiment.

[0106] The second substrate 120 may be disposed on the first substrate 110. More specifically, the second substrate 120 may be disposed on the first electrode 210 on the first substrate 110.

[0107] The second substrate 120 may include a material capable of transmitting light. The second substrate 120 may include a transparent material. The second substrate 120 may include a material that is the same as or similar to the material of the first substrate 110 described above.

[0108] For example, the second substrate 120 may include glass, plastic, or a flexible polymer film. For instance, the flexible polymer film may be made of any of the following: polyethylene terephthalate (PET), polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polyethersulfone (PES), cyclic olefin copolymer (COC), triacetyl cellulose (TAC) film, polyvinyl alcohol (PVA) film, polyimide (PT) film, and polystyrene (PS). This is merely an example, and the embodiment is not limited thereto.

[0109] In addition, the second substrate 120 can be a flexible substrate with flexible features.

[0110] Furthermore, the second substrate 120 can be a curved or bent substrate. That is, the optical path control member including the second substrate 120 can also be formed to have flexible, curved, or bent characteristics. Accordingly, the optical path control member according to the embodiment can be modified into various designs.

[0111] The second substrate 120 may also extend along the first direction 1A, the second direction 2A and the third direction 3A in the same manner as the first substrate 110 described above.

[0112] In detail, the second substrate 120 may include a first direction 1A corresponding to the length or width direction of the second substrate 120, a second direction 2A extending in a direction different from the first direction 1A and corresponding to the length or width direction of the second substrate 120, and a third direction 3A extending in a direction different from the first direction 1A and the second direction 2A and corresponding to the thickness direction of the second substrate 120.

[0113] For example, the first direction 1A can be defined as the length direction of the second substrate 120, the second direction 2A can be defined as the width direction of the second substrate 120 perpendicular to the first direction 1A, and the third direction 3A can be defined as the thickness direction of the second substrate 120.

[0114] Alternatively, the first direction 1A can be defined as the width direction of the second substrate 120, the second direction 2A can be defined as the length direction of the second substrate 120 perpendicular to the first direction 1A, and the third direction 3A can be defined as the thickness direction of the second substrate 120.

[0115] For ease of description, the first direction 1A will be described as the length direction of the second substrate 120, the second direction 2A will be described as the width direction of the second substrate 120, and the third direction 3A will be described as the thickness direction of the second substrate 120.

[0116] The second electrode 220 can be disposed on one surface of the second substrate 120. More specifically, the second electrode 220 can be disposed on the lower surface of the second substrate 120. That is, the second electrode 220 can be disposed on one surface of the second substrate 120 where the second substrate 120 and the first substrate 110 face each other. In other words, the second electrode 220 can be positioned facing the first electrode 210 on the first substrate 110. In other words, the second electrode 220 can be disposed between the first electrode 210 and the second substrate 120.

[0117] The second electrode 220 may include the same or similar material as the first substrate 110 described above.

[0118] The second electrode 220 may include a transparent conductive material. For example, the second electrode 220 may include a conductive material having a light transmittance of about 80% or higher. As an example, the second electrode 220 may include a metal oxide, such as indium tin oxide, indium zinc oxide, copper oxide, tin oxide, zinc oxide, titanium oxide, etc.

[0119] The second electrode 220 may have a thickness of about 10 nm to about 300 nm.

[0120] Alternatively, the second electrode 220 may comprise various metals to achieve low resistance. For example, the second electrode 220 may comprise at least one metal selected from chromium (Cr), nickel (Ni), copper (Cu), aluminum (Al), silver (Ag), molybdenum (Mo), gold (Au), titanium (Ti), and alloys thereof.

[0121] The second electrode 220 may be disposed on the entire surface of one surface of the second substrate 120. However, this embodiment is not limited thereto, and the second electrode 220 may be formed of a plurality of patterned electrodes having a uniform pattern (e.g., a mesh or stripe shape).

[0122] For example, the second electrode 220 may include multiple conductive patterns. More specifically, the second electrode 220 may include multiple intersecting mesh lines and multiple mesh openings formed by the mesh lines.

[0123] Accordingly, even though the second electrode 220 comprises metal, it cannot be visually identified from the outside, thus improving visibility. Furthermore, the increased light transmittance through the opening improves the brightness of the optical path control component according to the embodiment.

[0124] Cutting portions can be formed on the second substrate 120. More specifically, the second substrate 120 may include a plurality of cutting portions.

[0125] refer to Figure 1The second substrate 120 may include a 1-1 cutting portion h1-1, a 1-2 cutting portion h1-2, a 2-1 cutting portion h2-1, and a 2-2 cutting portion h2-2.

[0126] Cutting parts h1-1 (1-1), h1-2 (1-2), h2-1 (2-1), and h2-2 (2-2) can be formed into holes or grooves.

[0127] For example, at least one of the 1-1 cutting portion h1-1, 1-2 cutting portion h1-2, 2-1 cutting portion h2-1, and 2-2 cutting portion h2-2 can be formed in a groove shape, in which one end serving as the upper surface of the second substrate is open and the other end serving as the lower surface of the optical conversion unit is closed. Furthermore, at least one of the 1-1 cutting portion h1-1, 1-2 cutting portion h1-2, 2-1 cutting portion h2-1, and 2-2 cutting portion h2-2 can be formed in a groove shape, in which one end serving as the upper surface of the second substrate is open and the other end serving as the lower surface of the optical conversion unit is either open or closed, and either of the two side portions perpendicular to the length direction of the cutting portion has an opening.

[0128] In detail, the 1-1 cutting portion h1-1, the 2-1 cutting portion h2-1, and the 2-2 cutting portion h2-2 can be disposed inside the second substrate 120. Accordingly, the 1-1 cutting portion h1-1, the 2-1 cutting portion h2-1, and the 2-2 cutting portion h2-2 can be formed into a groove shape, with one end of the groove shape being open as the upper surface of the second substrate and the other end being closed as the lower surface of the light conversion unit.

[0129] Furthermore, the 1-2 cutting portion h1-2 can be provided on the upper surface and a side surface of the second substrate. Accordingly, the 1-2 cutting portion h1-2 can be formed in the shape of a groove, with one end open as the upper surface of the second substrate and the other end closed as the lower surface of the light conversion unit, and a side opening of the cutting portion perpendicular to the length direction of the cutting portion.

[0130] At least one of the 1-1 cutting portion h1-1, 1-2 cutting portion h1-2, 2-1 cutting portion h2-1 and 2-2 cutting portion h2-2 can be formed as a shape in which the length and / or short width narrows as it extends from the second substrate 120 toward the first substrate 110.

[0131] Cutting portions h1-1 (1-1) and h1-2 (1-2) can be positioned facing each other. More specifically, cutting portions h1-1 and h1-2 can extend along a first direction 1A of the second substrate 120, and can be positioned facing each other. That is, cutting portions h1-1 and h1-2 can extend along the length of the second substrate 120, and can be positioned facing each other.

[0132] Cutting portion h1-1 (1-1) and cutting portion h1-2 (1-2) can have the same shape and area. Alternatively, cutting portion h1-1 (1-1) and cutting portion h1-2 (1-2) can have different shapes and / or areas.

[0133] At least one of the 1-1 cutting portion h1-1 and the 1-2 cutting portion h1-2 can be configured to be spaced apart from or in contact with both ends of the second substrate 120.

[0134] Cutting portions h2-1 (2-1) and h2-2 (2-2) can be positioned facing each other. More specifically, cutting portions h2-1 and h2-2 can extend in the second direction 2A of the second substrate 120, and can be positioned facing each other. That is, cutting portions h2-1 and h2-2 can extend in the width direction of the second substrate 120, and can be positioned facing each other.

[0135] Cutting portions h2-1 (2-1) and h2-2 (2-2) can have the same shape and area. Alternatively, cutting portions h2-1 (2-1) and h2-2 (2-2) can have different shapes and / or areas.

[0136] At least one of the cutting portions h2-1 (2-1) and h2-2 (2-2) can be configured to be spaced apart from or in contact with both ends of the second substrate 120.

[0137] Accordingly, the 1-1 cutting portion h1-1, the 1-2 cutting portion h1-2, the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2 can be configured to extend along the edge of the second substrate 120.

[0138] At least two of the cutting portions h1-1 (1-1), h1-2 (1-2), h2-1 (2-1), and h2-2 (2-2) can be connected to each other. Furthermore, at least two of the cutting portions h1-1 (1-1), h1-2 (1-2), h2-1 (2-1), and h2-2 (2-2) can be spaced apart from each other.

[0139] For example, refer to Figure 1 Cutting section h1-1 (1-1) can be connected to cutting sections h2-1 (2-1) and h2-2 (2-2), cutting section h1-2 (1-2) can be connected to cutting section h2-1 (2-1), cutting section h2-1 (2-1) can be connected to cutting sections h1-1 (1-1) and h1-2 (1-2), and cutting section h2-2 (2-2) can be connected to cutting section h1-1 (1-1). Accordingly, cutting sections h1-2 (1-2) and h2-2 (2-2) can be spaced apart from each other.

[0140] Accordingly, an opening region OA formed between the 1-2 cutting portion h1-2 and the 2-2 cutting portion h2-2 can be formed in the second substrate 120.

[0141] The current and voltage applied from the electrode connection portion 700 of the second connection portion CA2 through the opening region OA can be transmitted through the second electrode 220 in the direction of the receiving portion 320 of the light conversion unit 300.

[0142] Simultaneously, at least one of the following cut portions can be formed in the second substrate 120: 1-1 cut portion h1-1, 1-2 cut portion h1-2, 2-1 cut portion h2-1, and 2-2 cut portion h2-2. That is, all cut portions of 1-1 cut portion h1-1, 1-2 cut portion h1-2, 2-1 cut portion h2-1, and 2-2 cut portion h2-2 can be formed in the second substrate 120, or a portion of 1-1 cut portion h1-1, 1-2 cut portion h1-2, 2-1 cut portion h2-1, and 2-2 cut portion h2-2 can be omitted, with only at least one cut portion formed. The number of cut portions can vary depending on the manufacturing process of the optical path control component.

[0143] Cutting portions h1-1 (1-1), h1-2 (1-2), h2-1 (2-1), and h2-2 (2-2) can be formed on the second substrate 120. Furthermore, cutting portions h1-1 (1-1), h1-2 (1-2), h2-1 (2-1), and h2-2 (2-2) can be formed to pass through at least one of the second substrate 120, the light conversion unit 300, and the second electrode 220.

[0144] Furthermore, cutting portions h1-1 (1-1), h1-2 (1-2), h2-1 (2-1), and h2-2 (2-2) may have the same penetration depth. Alternatively, at least one of cutting portions h1-1 (1-1), h1-2 (1-2), h2-1 (2-1), and h2-2 (2-2) may have a depth different from the other cutting portions.

[0145] The penetration depths of cutting sections h1-1 (1-1), h1-2 (1-2), h2-1 (2-1), and h2-2 (2-2) will be described in detail below.

[0146] Furthermore, sealing material can be provided in the 1-1 cutting section h1-1, the 1-2 cutting section h1-2, the 2-1 cutting section h2-1, and the 2-2 cutting section h2-2. Accordingly, the sealing material can be provided in the 1-1 cutting section h1-1, the 1-2 cutting section h1-2, the 2-1 cutting section h2-1, and the 2-2 cutting section h2-2 to form a sealing section 500.

[0147] That is, the first sealing part 510 can be provided on the 1-1 cutting part h1-1 and the 1-2 cutting part h1-2, and the second sealing part 520 can be provided on the 2-1 cutting part h2-1 and the 2-2 cutting part h2-2.

[0148] That is, a 1-1 sealing part can be provided on the 1-1 cutting part h1-1, a 1-2 sealing part can be provided on the 1-2 cutting part h1-2, a 2-1 sealing part can be provided on the 2-1 cutting part h2-1, and a 2-2 sealing part can be provided on the 2-2 cutting part h2-2.

[0149] Meanwhile, in order to minimize the border area of ​​the optical path control component, in at least one of the 1-1 cutting portion h1-1, 1-2 cutting portion h1-2, 2-1 cutting portion h2-1 and 2-2 cutting portion h2-2, by removing the whole or part of at least one outer surface of the cutting portion and removing the outer surface from the outer surface of the cutting portion to the outer surface of the substrate, a portion of the cutting portion can be the outermost surface of the optical path control component.

[0150] For example, since the opening region is formed by removing the outer surface from the cut portion to the outer surface of the second substrate, the outermost portion of the optical path control member in the opening region can be a part of the cut portion; that is, the sealing portion can be the outermost surface of the optical path control member. Accordingly, at least one of the first sealing portion 510 and the second sealing portion 520 can be the outermost surface of the optical path control member.

[0151] The sealing part 500 provided in the cutting part will be described in detail below.

[0152] The first substrate 110 and the second substrate 120 may have the same or different dimensions.

[0153] In detail, the first length extending in the first direction 1A of the first substrate 110 may have the same or similar dimensions as the second length extending in the first direction 1A of the second substrate 120.

[0154] For example, the first length and the second length can have dimensions of 300mm to 400mm.

[0155] Furthermore, the first width extending in the second direction 2A of the first substrate 110 may have the same or similar dimensions as the second width extending in the second direction of the second substrate 120.

[0156] For example, the first width and the second width can have dimensions ranging from 150mm to 200mm.

[0157] Furthermore, the first thickness extending in the third direction 3A of the first substrate 110 may have the same or similar dimensions as the second thickness extending in the third direction upward of the second substrate 120.

[0158] For example, the first thickness and the second thickness can have dimensions of 1 mm or less.

[0159] Furthermore, the first substrate 110 and the second substrate 120 may have different areas.

[0160] In detail, the first substrate 110 and the second substrate 120 may include protrusions. (See reference...) Figure 2 and Figure 3 The first substrate 110 may include a first protrusion PA1, and the second substrate 120 may include a second protrusion PA2. More specifically, the first substrate 110 and the second substrate 120 may each include a first protrusion PA1 and a second protrusion PA2, and the first protrusion PA1 and the second protrusion PA2 are configured to be offset from each other.

[0161] In other words, the first protrusion PA1 and the second protrusion PA2 can be configured not to overlap on the third direction 3A.

[0162] Optionally, this embodiment is not limited to this, and the first protrusion PA1 and the second protrusion PA2 may include overlapping regions that overlap each other and non-overlapping regions that do not overlap each other. That is, the first protrusion PA1 and the second protrusion PA2 may include overlapping regions that overlap each other in a third direction and non-overlapping regions that do not overlap each other.

[0163] In this case, the first protrusion PA1 and the second protrusion PA2 can have different areas. That is, the first substrate 110 and the second substrate 120 can have different sizes due to the difference in the size of the protrusions.

[0164] Connection areas for connecting to external printed circuit boards or flexible printed circuit boards can be formed in the first protrusion PA1 of the first substrate 110 and the second protrusion PA2 of the second substrate 120, respectively.

[0165] In detail, the first connecting region CA1 can be disposed on the first protrusion PA1, and the second connecting region CA2 can be disposed on the second protrusion PA2. When the first protrusion PA1 and the second protrusion PA2 are disposed in a position that is offset from each other, the first connecting region CA1 and the second connecting region CA2 can be configured not to overlap in the third direction 3A.

[0166] Conductive materials can be exposed on the upper surfaces of the first connection area CA1 and the second connection area CA2, respectively, and the optical path control component can be electrically connected to an external printed circuit board or flexible printed circuit board through the first connection area CA1 and the second connection area CA2.

[0167] For example, pad portions can be provided on the first connection area CA1 and the second connection area CA2, and a conductive adhesive including at least one of anisotropic conductive film (ACF) and anisotropic conductive paste (ACP) can be provided between the pad portions and the printed circuit board or flexible printed circuit board to connect the optical path control components.

[0168] Alternatively, a conductive adhesive comprising at least one of anisotropic conductive film (ACF) and anisotropic conductive paste (ACP) can be provided between the first connection area CA1 and the second connection area CA2 and the printed circuit board or flexible printed circuit board, thereby directly connecting the optical path control component without the need for a solder pad portion.

[0169] The conductive materials constituting the first connection region CA1 and the second connection region CA2 will be described in detail below.

[0170] The light conversion unit 300 can be disposed between the first substrate 110 and the second substrate 120. More specifically, the light conversion unit 300 can be disposed between the first electrode 210 and the second electrode 220.

[0171] An adhesive layer or a buffer layer may be provided between the light conversion unit 300 and the first substrate 110 or between the light conversion unit 300 and the second substrate 120, and the first substrate 110, the second substrate 120 and the light conversion unit 300 may be bonded to each other through the adhesive layer and / or the buffer layer.

[0172] For example, an adhesive layer 410 can be provided between the first electrode 210 and the light conversion unit 300 to bond the first substrate 110 and the light conversion unit 300.

[0173] In addition, a buffer layer 420 can be provided between the second electrode 220 and the light conversion unit 300 to improve the adhesion between the second electrode 220, which includes different materials, and the light conversion unit 300.

[0174] The aforementioned cutting portion can be formed to pass through the entirety or a portion of the buffer layer 420 and the light conversion unit 300. That is, the cutting portion can pass through the second substrate 120, the second electrode 220 and the buffer layer 420 in a third-direction direction, and can also pass through the entirety or a portion of the light conversion unit 300.

[0175] The light conversion unit 300 may include multiple partition walls and a receiving portion. A light conversion material 330, including light conversion particles that move when a voltage is applied and a dispersion liquid for dispersing the light conversion particles, may be provided in the receiving portion 320, and the light transmission characteristics of the light path control component may be changed by the light conversion particles.

[0176] Furthermore, a sealing portion 500 for sealing the light conversion material 330 and a dam portion 600 for easily injecting the light conversion material 330 can be provided in the receiving portion 320.

[0177] refer to Figure 3 and Figure 4 The receiving portion 320 can be configured to extend in one direction. More specifically, the receiving portion 320 can extend in a direction corresponding to the second direction 2A of the first substrate 110 or the second substrate 120. That is, the receiving portion 320 can be configured to extend in a direction corresponding to the width direction of the first substrate 110 or the second substrate 120.

[0178] Accordingly, the two ends of the receiving portion 320 of the optical path control member according to the first embodiment can be configured to face the two ends of the first substrate 110 or the second substrate 120, respectively. That is, one end of the receiving portion 320 can be configured to face the end of the first substrate 110 or the second substrate 120 in the second direction 2A. The other end of the receiving portion 320 can be configured to face the other end of the first substrate 110 or the second substrate 120 in the second direction 2A.

[0179] Accordingly, the two ends of the receiving portion 320 may be configured to contact the first sealing portion 510 which is configured to face the second direction 2A, and may be configured to be spaced apart from the second sealing portion 520.

[0180] Meanwhile, although not shown in the figure, the receiving portion 320 may be configured to extend to the second protrusion, and the receiving portion 320 on the second protrusion may not include light conversion material or may include less light conversion material than other receiving portions.

[0181] Figure 5 and Figure 6 It is along Figure 1 A sectional view taken along line A-A'.

[0182] refer to Figure 5 and Figure 6The light conversion unit 300 may be a partition wall portion 310 and a receiving portion 320.

[0183] The partition wall portion 310 can be defined as a partition wall portion that divides the receiving portions. That is, the partition wall portion 310 can transmit light as a blocking area that divides multiple receiving portions. In other words, light emitted in the direction of the first substrate 110 or the second substrate 120 can pass through the partition wall portion.

[0184] The partition wall portion 310 and the receiving portion 320 may be configured to extend in a second direction 2A of the first substrate 110 and the second substrate 120. That is, the partition wall portion 310 and the receiving portion 320 may be configured to extend in the width direction or the length direction of the first substrate 110 and the second substrate 120.

[0185] The partition wall portion 310 and the receiving portion 320 can be configured to have different widths. For example, the width of the partition wall portion 310 can be larger than the width of the receiving portion 320.

[0186] Furthermore, the receiving portion 320 may be formed in a shape that extends from the first electrode 210 to the second electrode 220 and narrows in width.

[0187] The partition wall portion 310 and the receiving portion 320 can be arranged alternately. In more detail, the partition wall portion 310 and the receiving portion 320 can be arranged alternately. That is, each of the partition wall portions 310 can be arranged between adjacent receiving portions 320, and each of the receiving portions 320 can be arranged between adjacent partition wall portions 310.

[0188] The partition wall 310 may include a transparent material. The partition wall 310 may also include a material that can transmit light.

[0189] The partition wall portion 310 may include a resin material. For example, the partition wall portion 310 may include a photocurable resin material. As an example, the partition wall portion 310 may include a UV resin or a transparent photoresist resin. Alternatively, the partition wall portion 310 may include a polyurethane resin or an acrylic resin.

[0190] The receiving portion 320 can be formed to partially transmit light conversion unit 300. Accordingly, the receiving portion 320 can be configured to contact the adhesive layer 410 and can be configured to be spaced apart from the buffer layer 420. Accordingly, a base portion 350 can be formed between the receiving portion 320 and the buffer layer 420.

[0191] A light conversion material 330, including light conversion particles 330a and a dispersion 330b in which the light conversion particles 330a are dispersed, can be disposed in a receiving portion 320.

[0192] Dispersion 330b may be a material used to disperse light-converting particles 330a. Dispersion 330b may include a transparent material. Dispersion 330b may include a non-polar solvent. Furthermore, dispersion 330b may include a material capable of transmitting light. For example, dispersion 330b may include at least one of halogenated hydrocarbon oils, paraffin oils, and isopropanol.

[0193] The light conversion particles 330a can be configured to be dispersed in the dispersion 330b. More specifically, a plurality of light conversion particles 330a can be configured to be spaced apart from each other in the dispersion 330b.

[0194] The light conversion particle 330a may include a material capable of absorbing light. That is, the light conversion particle 330a may be a light-absorbing particle. The light conversion particle 330a may have a color. For example, the light conversion particle 330a may have a black-based color. As an example, the light conversion particle 330a may include carbon black.

[0195] The light-converting particle 330a can be polarized by charging its surface. For example, the surface of the light-converting particle 330a can carry a negative (-) charge. Therefore, depending on the applied voltage, the light-converting particle 330a can move toward the first electrode 210 or the second electrode 220.

[0196] The light transmittance of the containment portion 320 can be changed by the light conversion particles 330a. Specifically, the containment portion 320 can be converted into a light-blocking portion and a light-transmitting portion by changing the light transmittance due to the movement of the light conversion particles 330a. In other words, the light transmittance passing through the containment portion 320 can be changed by the dispersion and aggregation of the light conversion particles 330a disposed within the dispersion liquid 330b.

[0197] For example, the optical path control component according to the embodiment can switch from a first mode to a second mode or from a second mode to a first mode by applying a voltage to the first electrode 210 and the second electrode 220.

[0198] In detail, in the optical path control member according to the first embodiment, the receiving portion 320 becomes a light-shielding portion in the first mode, and light at a specific angle can be blocked by the receiving portion 320. That is, the user's viewing angle from the outside is narrowed, so the optical path control member can be driven in a privacy mode.

[0199] Furthermore, in the optical path control member according to the first embodiment, the receiving portion 320 becomes a light-transmitting portion in the second mode, and in the optical path control member according to the first embodiment, light can be transmitted through both the partition wall portion 310 and the receiving portion 320. That is, the user's viewing angle from the outside can be expanded, so the optical path control member can be driven in an exposed mode.

[0200] The transition from the first mode to the second mode, that is, the transition from the light-blocking portion to the light-transmitting portion of the receiving portion 320, can be achieved by moving the light-converting particles 330a in the receiving portion 320. In other words, the light-converting particles 330a can have an electric charge on their surface and can move towards the first electrode or the second electrode according to the characteristics of the charge and the application of voltage. That is, the light-converting particles 330a can be electrophoretic particles.

[0201] For example, when no voltage is applied to the optical path control member from the outside, the light conversion particles 330a of the accommodating portion 320 are uniformly dispersed in the dispersion liquid 330b, and the accommodating portion 320 can block light through the light conversion particles. Therefore, in the first mode, the accommodating portion 320 can be driven as a light-shielding portion.

[0202] Furthermore, the light conversion particle 330a can be moved when a voltage is applied to the optical path control member from the outside. For example, the light conversion particle 330a can be moved to one end or the other end of the receiving portion 320 by a voltage transmitted via the first electrode 210 and the second electrode 220. That is, the light conversion particle 330a can move from the receiving portion 320 to the first electrode 210 or the second electrode 220.

[0203] For example, when a voltage is applied to the first electrode 210 and / or the second electrode 220, an electric field is formed between the first electrode 210 and the second electrode 220, and the negatively charged light conversion particles 330a can move toward the positive electrodes of the first electrode 210 and the second electrode 220 using the dispersion liquid 330b as a medium.

[0204] As an example, in the initial mode or when no voltage is applied to the first electrode 210 and / or the second electrode 220, such as Figure 5 As shown, the light conversion particles 330a can be uniformly dispersed in the dispersion liquid 330b, and the receiving part 320 can be driven as a light-shielding part.

[0205] Furthermore, when voltage is applied to the first electrode 210 and / or the second electrode 220, such as Figure 8 As shown, the light conversion particle 330a can move toward the second electrode 220 in the dispersion 330b. That is, the light conversion particle 330a can move in one direction, and the receiving portion 320 can be driven to become a light-transmitting portion.

[0206] Accordingly, the optical path control component according to the embodiment can be driven in two modes depending on the user's surrounding environment. That is, when the user needs light transmission only at a specific viewing angle, the receiving part is driven as a light-blocking part, or in an environment where the user needs high brightness, a voltage can be applied to drive the receiving part as a light-transmitting part.

[0207] Therefore, since the optical path control component according to the embodiment can be implemented in two modes according to the user's requirements, the optical path control component can be applied regardless of the user's environment.

[0208] The second sealing portion 520 can be provided on the outermost side of the optical path control member. Specifically, the second sealing portions 520 extending in the second direction 2A and facing each other can be provided on the outermost side of the optical path control member in the first direction 1A.

[0209] The second sealing part 520 can be provided inside the aforementioned cutting part. More specifically, the second sealing part 520 can be provided inside the 2-1 cutting part h2-1 and the 2-2 cutting part h2-2.

[0210] That is, the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2 can be formed to pass through part or all of the second substrate 120, the second electrode 220, the buffer layer 420 and the light conversion unit 300 including the base portion 350 and the partition wall portion 310 in sequence, and the second sealing portion 520 can be formed by providing a sealing material inside the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2.

[0211] That is, one surface of the partition wall portion 310 or the adhesive layer 410 can be exposed through the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-1, and the second sealing portion 520 can be configured to contact the partition wall portion 310 or the adhesive layer 410.

[0212] The second sealing portion 520 may be configured to contact the side surface of the second substrate 120. Furthermore, the second sealing portion 520 may be configured to contact the side surface of the second electrode 220. Furthermore, the second sealing portion 520 may be configured to contact the side surface of the buffer layer 420. Furthermore, the second sealing portion 520 may be configured to contact the side surface of the base portion 350. Furthermore, the second sealing portion 520 may be configured to contact the side surface of the partition wall portion 310.

[0213] The second sealing part 520 may be provided on the side surface of the optical path control member, that is, on the side surface in the second direction 2A, to prevent impurities that may penetrate from the outside from penetrating into the optical conversion unit 300.

[0214] The second sealing portion 520 can be configured to completely fill the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2, or it can be configured to have a height lower than the depth of the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2. Therefore, as Figure 5 and Figure 6As shown, the upper surface of the second sealing portion 520 can be configured to have a lower height than the upper surface of the second substrate 120. That is, a step can be formed between the upper surface of the second sealing portion 520 and the upper surface of the second substrate 120. Furthermore, the upper surface of the second sealing portion 520 can be formed into a recessed shape.

[0215] At the same time, Figure 5 and Figure 6 The text describes the depth to which the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2 are formed until one surface of the partition wall portion of the light conversion unit 300 is exposed, but this embodiment is not limited to this.

[0216] In other words, the depths of the 2-1 cutting section h2-1 and the 2-2 cutting section h2-2 can be varied by the process method and process time used to form the 2-1 cutting section h2-1 and the 2-2 cutting section h2-2.

[0217] For example, at least one of the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2 can be formed up to a depth that partially extends through the light conversion unit 300, and correspondingly, a surface of the base portion, the partition wall portion 310, or the receiving portion 320 can be exposed through the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2.

[0218] Accordingly, the second sealing portion 520 can be configured to be spaced apart from the adhesive layer 410.

[0219] Optionally, at least one of the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2 can be formed up to a depth that partially extends through the light conversion unit 300, and correspondingly, one surface of the adhesive layer 410 can be exposed through the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2.

[0220] Alternatively, at least one of the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2 may be formed up to a depth that partially extends through the adhesive layer 410, and correspondingly, one surface of the adhesive layer 410 may be exposed through the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2.

[0221] Alternatively, at least one of the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2 may be formed up to a depth that partially extends through the first electrode 210, and correspondingly, a surface of the first electrode 210 may be exposed through the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2.

[0222] Alternatively, at least one of the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2 may be formed to a depth extending partially through the first substrate 110, and correspondingly, a surface of the first substrate 110 may be exposed through the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2.

[0223] Figure 7 It is along Figure 1 A sectional view taken along line B-B'. That is to say, Figure 7 It is a cross-sectional view showing the two ends of one of the first sealing parts 510.

[0224] refer to Figure 7 The first sealing portion 510 may be disposed within the 1-1 cutting portion h1-1. The first sealing portion 510 may be configured to contact the side surface of the second substrate 120. Furthermore, the first sealing portion 510 may be configured to contact the side surface of the second electrode 220. Furthermore, the first sealing portion 510 may be configured to contact the side surface of the buffer layer 420. Furthermore, the first sealing portion 510 may be configured to contact the side surface of the base portion 350. Furthermore, the first sealing portion 510 may be configured to contact the side surface of the partition wall portion 310.

[0225] Furthermore, a second sealing portion 520 may be provided on the first sealing portion 510 in the region where the 1-1 cutting portion, the 2-1 cutting portion, and the 2-2 cutting portion overlap. That is, since the second sealing portion 520 is formed after the first sealing portion 510 is formed, the second sealing portion 520 may be provided on the first sealing portion 510 in the region where the first sealing portion 510 and the second sealing portion 520 overlap.

[0226] For example, the 1-1 cutting portion h1-1 can be formed to pass through the entire second substrate 120, second electrode 220, buffer layer 420, and light conversion unit 300, and the first sealing portion 510 can be configured to contact the side surfaces of the second substrate 120, the second electrode 220, the buffer layer 420, the base portion 350, and the partition wall portion 310. The 1-1 cutting portion h1-1 can be configured to contact one end in the first direction 1A and both ends in the second direction 2A of the second substrate 120.

[0227] In other words, the 1-1 cut portion h1-1 can be formed by removing one outer surface of the second substrate 120 in the first direction 1A and both outer surfaces of the second substrate 120 in the second direction 2A. Accordingly, in one outer surface of the second substrate 120 in the first direction 1A, a portion of the 1-1 cut portion h1-1 can be the outermost surface of the second substrate 120, and in the portion of the 1-1 cut portion h1-1 formed in one of the two outer surfaces of the second substrate 120 in the second direction 2A, a portion of the 1-1 cut portion h1-1 can be the outermost surface of the second substrate 120.

[0228] The 1-1 cutting section h1-1 can be formed to pass sequentially through the second substrate 120, the second electrode 220, the buffer layer 420, and the light conversion unit 300 including the base section 350 and the partition wall section 310. Subsequently, the first sealing section 510 can be formed by providing a sealing material inside the 1-1 cutting section h1-1.

[0229] The sealing materials of the first sealing part 510 and the second sealing part 520 may be the same material. Alternatively, the sealing materials of the first sealing part 510 and the second sealing part 520 may be different materials.

[0230] As an example, the sealing material of at least one of the first sealing portion 510 and the second sealing portion 520 may include a photocurable material. Furthermore, the sealing material of at least one of the first sealing portion 510 and the second sealing portion 520 may include a material with low reactivity with the photoconversion material. For example, the sealing material of at least one of the first sealing portion 510 and the second sealing portion 520 may include polyurethane acrylate.

[0231] The 1-1 cutting portion h1-1 can be formed to pass sequentially through the second substrate 120, the second electrode 220, the buffer layer 420, and the light conversion unit 300 including the base portion 350 and the partition wall portion 310, and thus one surface of the adhesive layer 410 can be exposed through the 1-1 cutting portion h1-1.

[0232] Accordingly, the first sealing part 510 provided in the 1-1 cutting part h1-1 can be configured to contact the adhesive layer 410 in the 1-1 cutting part h1-1.

[0233] The first sealing portion 520 can be provided on the side surface of the optical path control member, that is, the side surface in the first direction 1A, to seal the receiving portion 320 of the light conversion unit 300. In other words, while preventing the light conversion material 330 contained in the receiving portion 320 from flowing out to the outside, it can also prevent impurities that may penetrate from the outside from penetrating into the light conversion unit 300.

[0234] The first sealing portion 510 can be configured to completely fill the 1-1 cut portion h1-1, or it can be configured to have a height lower than the depth of the 1-1 cut portion h1-1. Accordingly, the upper surface of the first sealing portion 510 can be configured to have a height lower than the upper surface of the second substrate 120. That is, a step can be formed between the upper surface of the first sealing portion 510 and the upper surface of the first substrate 110. Furthermore, the upper surface of the first sealing portion 510 can be formed into a recessed shape.

[0235] Figure 8 It is along Figure 1 A sectional view taken along line C-C'. That is, Figure 8 It is a cross-sectional view showing the two ends of the sealing parts that are connected in the first direction, with the first sealing part 510 and the second sealing part 520 cut apart.

[0236] refer to Figure 8 Cutting parts h1-2 (1-2) and h2-1 (2-1) can be connected to each other.

[0237] Furthermore, the 1-2 cutting portion h1-2 can be spaced apart from the 2-2 cutting portion h2-2. That is, one end of the 1-2 cutting portion h1-2 can be spaced apart from the 2-2 cutting portion h2-2.

[0238] The 1-2 cutting portion h1-2 and the 2-2 cutting portion h2-2 can be spaced apart from each other, thereby forming an opening region OA between the 1-2 cutting portion h1-1 and the 2-2 cutting portion h2-2.

[0239] The electrode connection portion 700 of the second connection region CA2, which is provided on the second protrusion PA2 of the second substrate 120 via the second electrode 220 provided in the opening region OA, can be connected to the second electrode 220 instead of being disconnected. That is, the current and voltage transmitted through the opening region OA can be applied to the light conversion material 330 provided inside the receiving portion 320 between the first sealing portion 510 and the second sealing portion.

[0240] Since the 1-2 cutting section h1-2 and the 2-1 cutting section h2-1 are connected, the first sealing part 510 provided on the 1-2 cutting section h1-2 and the second sealing part 520 provided on the 2-1 cutting section h2-1 can be connected to each other. Furthermore, since the 1-2 cutting section h1-2 and the 2-2 cutting section h2-2 are spaced apart from each other, the first sealing part 510 provided on the 1-2 cutting section h1-2 can be spaced apart from the second sealing part 520 provided on the 2-2 cutting section h2-2.

[0241] Meanwhile, the figure shows that the 2-1 cutting portion h2-1 is spaced apart from the end, i.e., the outer surface, of the second substrate 120 in the first direction 1A. However, this embodiment is not limited to this, and the 2-1 cutting portion h2-1 can be formed by removing one outer surface of the second substrate 120 in the first direction 1A, as described above with the 1-1 cutting portion h1-1. Accordingly, a portion of the 2-1 cutting portion h2-1 on one outer surface of the second substrate 120 in the first direction 1A can be the outermost surface of the second substrate 120.

[0242] Meanwhile, the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2 can be configured to have different lengths. Specifically, the length of the 2-2 cutting portion h2-2 in the second direction 2A can be greater than the length of the 2-1 cutting portion h2-1 in the second direction 2A.

[0243] The 2-2 cutting portion h2-2 can be configured as a second protrusion PA2 extending to the second substrate 120, and correspondingly, the length of the 2-2 cutting portion h2-2 can be configured to be longer than the length of the 2-1 cutting portion h2-1.

[0244] Accordingly, the length of the second sealing portion 520 provided in the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2 can also be varied. That is, the length of the second sealing portion 520 provided in the 2-2 cutting portion h2-2 can be longer than the length of the second sealing portion 520 provided in the 2-1 cutting portion h2-1.

[0245] The first sealing part and the second sealing part can be respectively located in the 1-1 cutting part, the 1-2 cutting part, the 2-1 cutting part and the 2-2 cutting part.

[0246] Furthermore, a second sealing portion 520 may be provided on the first sealing portion 510 in the region where the 1-2 cutting portion and the 2-1 cutting portion overlap. That is, since the second sealing portion 520 is formed after the first sealing portion 510 is formed, the second sealing portion 520 may be provided on the first sealing portion 510 in the region where the first sealing portion 510 and the second sealing portion 520 overlap. The first sealing portion and the second sealing portion may be configured to seal the inlet and outlet of the receiving portion for containing the light conversion material, and may be configured to extend along the side surface region of the light conversion unit, i.e., the side surface region in the first direction.

[0247] Therefore, the first sealing part can prevent the light conversion material inside the accommodating part from flowing out to the outside of the light conversion unit, and the first sealing part and the second sealing part can prevent impurities from penetrating into the light conversion unit from the outside, thereby improving the reliability of the optical path control component.

[0248] Furthermore, since the first sealing portion and the second sealing portion are disposed inside the cut portion formed on the second substrate, the size of the optical path control component can be reduced compared to forming the first sealing portion and the second sealing portion outside the optical conversion unit, and the sealing characteristics of the optical path control component can be improved by preventing the sealing portion material from being deformed by the external environment.

[0249] Figure 9 It is along Figure 1 The cross-sectional view taken by the D-D' line. That is, Figure 9 It is a cross-sectional view taken along the protruding areas of the first substrate and the second substrate.

[0250] refer to Figure 9 The first protrusion PA1 of the first substrate 110 and the second protrusion PA2 of the second substrate 120 can be configured to be spaced apart from each other. That is, the first protrusion PA1 of the first substrate 110 and the second protrusion PA2 of the second substrate 120 can be configured to be spaced apart from each other in the first direction 1A.

[0251] Therefore, the first substrate 110, the first electrode 210 and the adhesive layer 410 may not be disposed below the second protrusion PA2.

[0252] Therefore, the first connecting region CA1 provided on the first protrusion PA1 and the second connecting region CA2 provided on the second protrusion PA2 are physically spaced apart from each other, thereby preventing the first connecting region CA1 and the second connecting region CA2 from being electrically connected to each other through the adhesive layer.

[0253] A first connection region CA1 may be disposed on a first protrusion PA1. A first electrode 210 may be exposed in the first connection region CA1. That is, the first electrode 210 on the first substrate 110 may be exposed by partially removing the adhesive layer 410 on the first protrusion PA1, and correspondingly, the upper surface of the first electrode 210 may be exposed in the first connection region CA1. In other words, the first electrode 210 exposed in the first connection region CA1 may be a first connection electrode connected to an external printed circuit board or a flexible printed circuit board.

[0254] Furthermore, a second connection region CA2 may be provided on the second protrusion PA2. A third cutting portion h3 may be formed in the second connection region CA2. An electrode connection portion 700 comprising conductive material may be provided in the third cutting portion h3.

[0255] The electrode connection portion 700 may include a material different from that of at least one of the first electrode 210 and the second electrode 220. Furthermore, the light transmittance of the electrode connection portion 700 may be lower than that of at least one of the first electrode 210 and the second electrode 220.

[0256] For example, the electrode connection portion 700 may include metal. More specifically, the electrode connection portion 700 may include a metal slurry in which metal particles are dispersed in an adhesive.

[0257] The electrode connection portion 700 may be configured to contact the side surface of the second substrate 120. Furthermore, the electrode connection portion 700 may be configured to contact the side surface of the second electrode 220. Furthermore, the electrode connection portion 700 may be configured to contact the side surface of the buffer layer 420. Furthermore, the electrode connection portion 700 may be configured to contact the side surface of the base portion 350. Furthermore, the electrode connection portion 700 may be configured to contact the side surface of the partition wall portion 310.

[0258] In other words, the electrode connection portion 700 can be configured to contact at least one side surface of the second substrate 120, the second electrode 220, the buffer layer 420, the base portion 350, and the partition wall portion 310.

[0259] Furthermore, a protective layer can be additionally provided on the lower surface of the electrode connection. This prevents oxidation or denaturation of the exposed electrode connection.

[0260] The upper surface of the electrode connection portion 700 may be disposed on the same plane as the upper surface of the second substrate 120, or it may be lower. For example, the upper surface of the electrode connection portion 700 may be disposed on the same plane as the upper surface of the second substrate 120. Alternatively, the upper surface of the electrode connection portion 700 may be disposed lower than the upper surface of the second substrate 120.

[0261] Accordingly, the upper surface of the electrode connection portion 700 and the upper surface of the second substrate 120 can be formed on the same plane without steps, or steps can be provided so that the upper surface of the electrode connection portion 700 is lower.

[0262] Accordingly, the overall thickness of the optical path control component can be prevented from increasing due to the height of the electrode connection portion 700, thereby reducing the total thickness of the optical path control component.

[0263] The electrode connection portion 700 can be electrically connected to the second electrode 220 and can be exposed to the outside of the second substrate 120. That is, the electrode connection portion 700 can be exposed on the second protrusion PA2 of the second substrate 120. In other words, the upper surface of the electrode connection portion 700 can be exposed in the second connection region CA2.

[0264] Accordingly, the electrode connection portion 700 exposed in the second connection area CA2 can be a second connection electrode connected to an external printed circuit board or a flexible printed circuit board.

[0265] Accordingly, the first electrode 210 and the second electrode 220 can be connected to the same printed circuit board or flexible printed circuit board for mutual electrical connection through the first connection electrode of the first connection region and the second connection electrode of the second connection region, respectively.

[0266] In this case, since the first connecting electrode and the second connecting electrode are disposed on the same surface, the first connecting electrode and the second connecting electrode can be easily connected when the first connecting electrode and the second connecting electrode are connected to a printed circuit board.

[0267] Alternatively, the first electrode 210 and the second electrode 220 can be electrically connected to another printed circuit board or flexible printed circuit board via a first connecting electrode in the first connecting region and a second connecting electrode in the second connecting region, respectively. That is, the first connecting electrode can be connected to the first circuit board, and the second connecting electrode can be connected to a second circuit board that is different from the first circuit board.

[0268] In the optical path control component according to the first embodiment, the first connection electrode of the first connection region and the second connection electrode of the second connection region can be disposed on the first protrusion and the second protrusion formed on the first substrate and the second substrate.

[0269] The surfaces of the first substrate and the second substrate may not protrude integrally, and the first protrusion and the second protrusion may only protrude the area in which the first connection region and the second connection electrode may be formed.

[0270] Accordingly, the area of ​​the first and second protrusions can be reduced. Therefore, when the optical path control components are integrated into the display panel and applied to the display device, other components of the display device can be located in areas that do not correspond to the first and second protrusions, thereby reducing the bezel area of ​​the display device.

[0271] In other words, the optical path control component according to the first embodiment reduces the size of the frame area where the connecting electrodes are provided, thereby reducing the frame area of ​​the display device using the optical path control component.

[0272] Figure 10 It is along Figure 1 The cross-sectional view taken by line E-E' in the diagram. That is, Figure 10 It is a cross-sectional view taken from both ends along the second direction of the 2-2 cut section.

[0273] refer to Figure 10 The 2-2 cutting portion h2-2 can be configured to extend from the second protrusion PA2 of the second substrate 120 in the second direction 2A.

[0274] refer to Figure 10 Cutting section h1-1 (1-1) and cutting section h2-2 (2-2) can be connected to each other.

[0275] Since the 1-1 cutting part h1-1 and the 2-2 cutting part h2-2 are connected, the first sealing part 510 provided in the 1-1 cutting part h1-1 and the second sealing part 520 provided in the 2-2 cutting part h2-2 can be configured to be connected to each other.

[0276] Furthermore, in the area where the 1-1 cutting portion h1-1 and the 2-2 cutting portion h2-2 overlap, the second sealing portion 520 can be provided on the first sealing portion 510. That is, since the second sealing portion 520 is formed after the first sealing portion 510 is formed, the second sealing portion 520 can be provided on the first sealing portion 510 in the area where the first sealing portion 510 and the second sealing portion 520 overlap.

[0277] Meanwhile, in the figure, it is shown that the 2-2 cutting portion h2-2 is spaced apart from the end, i.e., the outer surface, of the second substrate 120 in the first direction 1A. However, this embodiment is not limited to this, and the 2-2 cutting portion h2-2 can be formed by removing one outer surface of the second substrate 120 in the first direction 1A, as described above for the 1-1 cutting portion h1-1. Accordingly, in one outer surface of the second substrate 120 in the first direction 1A, a portion of the 2-2 second cutting portion h2-2 can be the outermost surface of the second substrate 120.

[0278] Figure 11 It is along Figure 1 The sectional view taken by the F-F' line in the figure, and Figure 12 It is along Figure 1 The cross-sectional view taken by the G-G' line in the figure, that is, Figure 11 and Figure 12 It is a cross-sectional view obtained by cutting the second connecting region CA2 set on the second protrusion PA2 along the second direction.

[0279] refer to Figure 11 and 12 The second connection area CA2 may include an area that overlaps with the first sealing part 510 and an area that does not overlap with the first sealing part 510.

[0280] That is, since the 1-2 cutting portion h1-2 and the 2-2 cutting portion h2-2 are set to be spaced apart from each other, the second connecting region CA2 can be set in the region that overlaps with the opening region OA in the second direction and in the region that overlaps with the first sealing portion 510 set in the 1-2 cutting portion h1-2.

[0281] In addition, refer to Figure 12A dam portion 600 can be provided between the second connection regions CA2, that is, between the electrode connection portion 700 and the first sealing portion 510. In other words, the dam portion 600 can be provided on the second protrusion PA2 between the electrode connection portion 700 and the first sealing portion 510.

[0282] The dam section 600 can be formed by filling the cut portion that passes through the second substrate 120, the second electrode 220, the buffer layer 410 and the light conversion unit 300 with a dam-forming material.

[0283] The dam section 600 is a material that controls the injection length of the light conversion material 330 when it is injected into the receiving section 320, and the dam section 600 can prevent the light conversion material 330 from overflowing in the external direction of the dam section, that is, in the direction of the electrode connection section 700.

[0284] In the manufacturing process of the optical path control component, a portion of the dam section 600 can be removed, a portion of the dam section 600 can be retained, and a portion of the dam section can be retained in the area adjacent to the second connection area CA2.

[0285] At the same time, such as Figure 12 As shown, when the light conversion unit 300 between the electrode connection portion 700 and the dam portion 600 is the area of ​​the partition wall portion 310, the light conversion unit 300, the buffer layer 420, the second electrode 220 and the second substrate 120 can be retained between the electrode connection portion 700 and the dam portion 600.

[0286] Alternatively, when the light conversion unit 300 between the electrode connection portion 700 and the dam portion 600 is the area of ​​the receiving portion 320, the material of the dam portion 600 can be moved into the receiving portion 320, so that the dam portion 600 and the electrode connection portion 700 can come into contact with each other.

[0287] Furthermore, when the light conversion unit 300 between the dam portion 600 and the first sealing portion 510 is the receiving portion 320 region, the light conversion unit 300, the buffer layer 420, the second electrode 220, and the second substrate 120 can be retained between the dam portion 600 and the first sealing portion 510, such as... Figure 12 As shown in the image.

[0288] Alternatively, when the light conversion unit 300 between the dam section 600 and the first sealing section 510 is the area of ​​the receiving section 320, the materials of the first sealing section 510 and the dam section 600 can be moved into the receiving section 320, so that the first sealing section 510 and the dam section 600 can come into contact with each other.

[0289] Figure 13 It is along Figure 1 A cross-sectional view taken along line H-H'. That is, Figure 13It is a cross-sectional view of a housing portion of the optical path control component taken along the second direction.

[0290] refer to Figure 13 The light conversion material 330 can be disposed inside the receiving portion 320. More specifically, the light conversion material 330 and the first sealing portion 510 can be disposed inside the receiving portion 320.

[0291] The first sealing part 510 may be provided at one end and the other end of the receiving part 320 in the second direction 2A to seal the light conversion material 330 provided inside the receiving part 320.

[0292] The light conversion material 330 inside the receiving part 320 can be sealed by the first sealing part 510, thereby preventing the light conversion material 330 from flowing out of the optical path control component.

[0293] The first sealing portion 510 provided in the 1-1 cutting section h1-1 can be configured to contact the light conversion material 330. Furthermore, the first sealing portion 510 provided in the 1-2 cutting section h1-2 can be configured to contact the light conversion material 300 and the first mixing region 810.

[0294] The first mixing region 810 may be the area containing both the material of the dam section 600 that is removed during the manufacturing process of the optical path control component and the material of the first sealing section 510.

[0295] In other words, the first mixing region 810 may include the same or different material as the first sealing part 510.

[0296] For example, when the materials of the first sealing portion 510 and the dam portion 600 are the same, the first mixing region 810 may be the region in which the first sealing portion 510 extends.

[0297] Alternatively, when the materials of the first sealing part 510 and the dam part 600 include different materials, the first mixing region 810 may be a region where the materials of the first sealing part 510 and the dam part 600 are mixed, or a region where the materials of the first sealing part 510 and the dam part 600 do not mix with each other but have an interface while being placed separately and together.

[0298] By providing a first mixing zone 810 inside the receiving section 320, the generation of air bubbles in the receiving section 320 can be minimized.

[0299] In other words, as the amount of material injected into the dam section 600 in any of the receiving sections changes, the size of the space between the first sealing section 510 and the dam section 600 can change, and by setting the sealing material of the first sealing section 510 in an appropriate amount in this space, the interior of the receiving section can be filled with the first sealing section 510, the light conversion material 330, etc.

[0300] Therefore, it can prevent the formation of air bubbles and the resulting light leakage caused by gaps inside the housing 320.

[0301] Figure 14 It is along Figure 1 A sectional view taken along line I-I'. That is, Figure 14 It is a cross-sectional view of a partition wall of the optical path control component taken along the second direction.

[0302] refer to Figure 14 The partition wall portion 310 can be disposed in the region corresponding to the partition wall portion 310, and the partition wall portion 310 can be removed entirely from the second substrate 120 to form the first sealing portion 510.

[0303] In other words, the first sealing portion 510 can even be provided in the area where the partition wall portion is provided. Therefore, the area of ​​the first sealing portion 510 can increase the size of the partition wall portion that is removed.

[0304] Therefore, the arrangement area of ​​the first sealing portion 510 can be increased without increasing the thickness of the first sealing portion 510. Furthermore, since the contact area of ​​the first sealing portion 510 is increased, the adhesive properties of the first sealing portion can be improved.

[0305] Accordingly, the sealing properties of the light conversion material of the first sealing part 510 can be improved.

[0306] In the optical path control component according to the first embodiment, 1-1 cut portions, 1-2 cut portions, 2-1 cut portions and 2-2 cut portions can be formed that pass through all or part of the optical conversion unit on the second substrate, the second electrode, the buffer layer and the second substrate.

[0307] In addition, the first sealing part and the second sealing part can be respectively provided in the 1-1 cutting part, the 1-2 cutting part, the 2-1 cutting part and the 2-2 cutting part.

[0308] The first sealing part and the second sealing part can be configured to seal the inlet and outlet of the receiving part for containing the light conversion material, and can be configured to extend along the side region of the light conversion unit, i.e., the side region in the first direction.

[0309] Therefore, the first sealing part can prevent the light conversion material inside the accommodating part from flowing out to the outside of the light conversion unit, and the first sealing part and the second sealing part can prevent impurities from penetrating into the light conversion unit from the outside, thereby improving the reliability of the optical path control component.

[0310] Furthermore, since the first sealing portion and the second sealing portion are disposed inside the cut portion formed on the second substrate, the size of the optical path control component can be reduced compared to forming the first sealing portion and the second sealing portion outside the optical conversion unit, and the sealing characteristics of the optical path control component can be improved by preventing the sealing material from deteriorating due to the external environment.

[0311] Furthermore, in the optical path control member according to the first embodiment, the first connecting electrode may be disposed on a first protrusion formed on the first substrate, and the second connecting electrode may be disposed on a second protrusion formed on the second substrate.

[0312] The surfaces of the first substrate and the second substrate may not protrude as a whole, and the first protrusion and the second protrusion may only protrude the area in which the first connection region and the second connection electrode can be formed.

[0313] Accordingly, the areas of the first and second protrusions can be reduced. Therefore, when the optical path control component is coupled to the display panel and applied to the display device, other components of the display device can be located in areas that do not correspond to the first and second protrusions, thereby reducing the bezel area of ​​the display device.

[0314] In other words, the optical path control component according to the first embodiment reduces the size of the frame area in which the connecting electrodes are disposed, thereby reducing the frame area of ​​the display device using the optical path control component.

[0315] Below, we will refer to Figures 15 to 24 The optical path control component according to the second embodiment is described.

[0316] In the description of the optical path control component according to the second embodiment, descriptions that are the same as or similar to those of the optical path control component according to the first embodiment will be omitted, and the same reference numerals will be assigned to the same components.

[0317] refer to Figures 15 to 25 In the optical path control component according to the second embodiment, unlike the first embodiment described above, the receiving portion 320 of the optical conversion unit is tilted at a predetermined angle.

[0318] refer to Figures 15 to 18 The receiving portion 320 can extend in a direction different from the first direction 1A and the second direction 2A.

[0319] Accordingly, at least one end and the other end of at least one of the receiving portions 320 may contact the first sealing portion 510, and at least one end and the other end of at least one receiving portion may contact the first sealing portion 510 and the second sealing portion 520.

[0320] As the receiving portion tilts at a predetermined tilt angle, when the optical path control component is combined with the display panel to form a display device, moiré patterns caused by the overlap of the receiving portion of the optical path control component and the display panel can be prevented.

[0321] In other words, one end and the other end of the receiving portion 320 according to the second embodiment can be formed on both the outer surface of the optical path control member in the first direction and the outer surface in the second direction.

[0322] Figure 19 It is along Figure 15 and 18 The cross-sectional view taken by the J-J' line. That is, Figure 19 It is a cross-sectional view obtained by cutting a portion of the optical path control component along the tilt angle direction.

[0323] refer to Figure 19 The light conversion material 330 can be disposed inside the receiving portion 320. More specifically, the light conversion material 330 and the first sealing portion 510 can be disposed inside the receiving portion 320.

[0324] The first sealing part 510 may be provided at one end and the other end of the receiving part 320 in the second direction 2A to seal the light conversion material 330 provided inside the receiving part 320.

[0325] In other words, at least one of the multiple accommodating portions of the light conversion unit can be configured to contact only the first sealing portion 510.

[0326] The light conversion material 330 inside the receiving part 320 can be sealed by the first sealing part 510, thereby preventing the light conversion material 330 from flowing out of the outside of the optical path control component.

[0327] The first sealing portion 510 provided in the 1-1 cutting section h1-1 can be configured to contact the light conversion material 330. Furthermore, the first sealing portion 510 provided in the 1-2 cutting section h1-2 can be configured to contact the light conversion material 300 and the first mixing region 810.

[0328] The first mixing region 810 may be the region containing the material of the dam section 600 that is removed during the manufacturing process of the optical path control component and the material of the first sealing section 510.

[0329] In other words, the first mixing region 810 may include the same or different material as the first sealing part 510.

[0330] For example, when the materials of the first sealing portion 510 and the dam portion 600 are the same, the first mixing region 810 may be the region extending from the first sealing portion 510.

[0331] Alternatively, when the materials of the first sealing part 510 and the dam part 600 include different materials, the first mixing region 810 may be a region where the materials of the first sealing part 510 and the dam part 600 are mixed, or a region where the materials of the first sealing part 510 and the dam part 600 do not mix with each other but have an interface while being placed together separately.

[0332] By providing a first mixing zone 810 inside the receiving section 320, the generation of air bubbles in the receiving section 320 can be minimized.

[0333] That is, as the amount of material injected into the dam section 600 in any of the receiving sections changes, the size of the space between the first sealing section 510 and the dam section 600 can change. By distributing the sealing material of the first sealing section 510 in an appropriate amount in this space, the interior of the receiving section can be filled with the first sealing section 510, the light conversion material 330, etc.

[0334] Therefore, it can prevent the formation of air bubbles due to gaps inside the receiving part 320 and the resulting light leakage.

[0335] Figure 20 It is along Figure 15 and 18 The cross-sectional view taken by the K-K' line. That is, Figure 20 It is a cross-sectional view obtained by cutting the outermost receiving part of the optical path control component along the tilt angle direction.

[0336] refer to Figure 20 The light conversion material 330 can be disposed inside the receiving portion 320. More specifically, the light conversion material 330, the first sealing portion 510, and the second sealing portion 520 can be disposed inside the receiving portion 320.

[0337] The first sealing part 510 and the second sealing part 520 can seal the light conversion material 330 disposed inside the receiving part 320.

[0338] That is, the first sealing part 510 can seal the end of the receiving part 320 in the second direction of the outer surface direction, and the second sealing part 520 can seal the end of the receiving part 320 in the first direction of the outer surface direction.

[0339] That is, at least one of the multiple receiving portions of the light conversion unit may be configured to contact the first sealing portion 510 and the second sealing portion 520.

[0340] The light conversion material 330 inside the receiving portion 320 is sealed by the first sealing portion 510 and the second sealing portion 520, thereby preventing the light conversion material from flowing out to the outside.

[0341] The first sealing portion 510 disposed in the 1-1 cutting section h1-1 can be configured to contact the light conversion material 330. Alternatively, the first sealing portion 510 disposed on the 1-1 cutting section h1-1 can contact the light conversion material 330 and the second mixing region 820.

[0342] The second mixing region 820 may be a region that includes both the first sealing part 510 and the light conversion material 330.

[0343] In other words, in the first sealing part 510 provided in the 1-1 cutting part h1-1, in the area overlapping with the receiving part 320, a portion of the sealing material permeates into the receiving part 320, or the light conversion material 330 can permeate into the 1-1 cutting part h1-1.

[0344] In the second mixing region 820, the light conversion material 330 and the sealing material can be configured to be separate from each other or to be mixed with each other.

[0345] Furthermore, in the first sealing portion 510 provided in the 1-1 cutting portion h1-1, a portion of the sealing material seeps into the receiving portion 320 in the area overlapping with the receiving portion 320. The first sealing portion 510 can improve the adhesive properties of the second sealing portion through the anchoring effect, thereby preventing the second sealing portion from detaching.

[0346] Furthermore, the second sealing portion 520 provided in the 2-1 cutting section h2-1 can be configured to contact the photoelectric conversion material 330. Specifically, one surface of the second sealing portion 520 facing the first sealing portion can contact the photoelectric conversion material 330. Additionally, the photoelectric conversion material 330 can be present in the direction of the other surface opposite to this first surface, so as to contact the photoelectric conversion material 330. Furthermore, a second mixing region including both the photoelectric conversion material 330 and the sealing material can be provided in the direction of the other surface opposite to this first surface.

[0347] Figure 21 It is along Figure 15 and 18 The cross-sectional view taken by the L-L' line. That is, Figure 21 It is a cross-sectional view taken along the extension direction of the second sealing part of the optical path control component.

[0348] refer to Figure 21The second sealing portion 520 can be formed through the second substrate 120, the second electrode 220, and the buffer layer 410, and can be formed by removing a portion of the receiving portion 320 and the partition wall portion 310. Furthermore, the second sealing portion 520 can be formed across the receiving portion 320 and the partition wall portion 310. That is, the partition wall portion 310 and the receiving portion 320 can be alternately disposed below the second sealing portion 520.

[0349] The light conversion material 330 can be disposed inside the unremoved receiving portion 320. Specifically, when the light conversion material 330 is filled into the receiving portion 320, one end of the light conversion material 330 inside the receiving portion 320 can be sealed by the first sealing portion 510 to minimize movement of the light conversion material. Subsequently, the light conversion material remaining in the receiving portion below the second sealing portion can also be sealed by forming the 2-1 cutting portion h2-1 and the second sealing portion 520. That is, the second sealing portion 520 can contact the side and top surfaces of the light conversion material 330 and can seal the light conversion material 330.

[0350] Preferably, when the second sealing portion is formed, both the receiving portion and the partition wall portion are removed so as to prevent the light conversion material from flowing out to the outside.

[0351] At the same time, a third mixing region can be formed in the area where the second sealing part 520 and the receiving part 320 overlap, that is, in the area where they are in contact with each other.

[0352] The third mixing region can be the region where the second sealing part 520 and the light conversion material 330 are mixed.

[0353] That is, in the second sealing part 520 provided in the 2-1 cutting part h2-1, in the area overlapping with the receiving part 320, a portion of the sealing material permeates into the receiving part 320, or the light conversion material can permeate into the 2-1 cutting part h2-1 to mix with the light conversion material 330.

[0354] Therefore, the second sealing part 520 can improve the adhesion performance of the second sealing part through the anchoring effect, thereby preventing the second sealing part from detaching.

[0355] at the same time, Figure 22 yes Figure 18 A magnified view of region A in the image. (Reference) Figure 22 At least one end of the first sealing portion 510 provided on the dam portion 600 and the 1-2 cutting portion h1-2 in the first direction may be configured to protrude further toward one end of the second substrate than one end of the second connecting region CA2 in the first direction.

[0356] For example, the distance between one end of the first sealing portion 510 and the end of the second substrate 120 in the first direction may be smaller than the distance between the end of the second connection region CA2 and the end of the second substrate 120 in the first direction.

[0357] That is, the first width W1 between the end of the first sealing portion 510, defined as the opening region OA, and the end of the second substrate 120 in the first direction can be smaller than the second width W2 between the end of the electrode connection portion 700 of the second connection region CA2 and the end of the second substrate 120 in the first direction.

[0358] In this case, when the electrode connection portion 700 of the second substrate 120 is included as a plurality, the second width W2 can be defined as the width between the outermost electrode connection portion and the end of the second substrate 120 in the first direction.

[0359] Furthermore, the third width W3 between the first sealing portion 510 and the electrode connection portion 700 in the 1-2 cutting section h1-2 can be larger than the second width W2. This ensures that a dam-like space is formed between the first sealing portion 510 and the electrode connection portion 700, as shown below. Figure 25 Accordingly, it can prevent the light conversion material from flowing out to the third cutting portion h3 used to form the electrode connection portion and interfering with the current movement between the second electrode 220 and the electrode connection portion 700.

[0360] at the same time, Figure 23 yes Figure 18 A magnified view of region B in the image. (See reference) Figure 23 Multiple receiving sections can be set in the opening area OA.

[0361] In detail, more than three, five, ten, fifteen, or twenty accommodating units can be set up in the opening area OA.

[0362] In addition, the width W4 of the opening region OA can be 100μm or more, 300μm or more, 600μm or more, 800μm or more, or 1000μm or more.

[0363] When fewer than three receiving portions are provided in the opening region OA, or when the width is less than 100 μm, sufficient current and voltage may not be able to be applied from the electrode connection portion to the light conversion material 330 disposed inside the receiving portion 320 between the first sealing portion 510 and the second sealing portion 520, thus potentially reducing the light conversion efficiency. Furthermore, when the width of the opening region OA is too small, breakage may occur during manufacturing, thus reducing process efficiency.

[0364] Furthermore, one, two, three, four, or five or more receiving portions can contact the side surface of the opening area side of the first sealing portion 510. This is formed by tilting the receiving portion 320, allowing a large amount of light conversion material to be formed in the receiving portions near the opening area among the multiple receiving portions, thereby further increasing the light conversion area. (See below...) Figure 23 The image shows a receiving portion contacting the side surface of the opening region of the first sealing portion 510, but the number of receiving portions in contact as described above is not limited to this.

[0365] at the same time, Figure 24 yes Figure 18 A magnified view of region C in the middle. (Reference) Figure 24 The receiving part 320 can be tilted at a predetermined angle.

[0366] In detail, when the tilt angle θ1 of the receiving portion is defined as the acute angle between the receiving portion and the extension line of the first sealing portion 510 provided in the 1-2 cutting portion h1-2, the tilt angle θ1 of the first sealing portion 510 can be smaller than the acute angle θ2 between the imaginary line connecting one end of the 1-1 cutting portion h1-1 in the first direction to one end of the 1-2 cutting portion h1-2 in the first direction and the first sealing portion 510 provided on the 1-2 cutting portion h1-2.

[0367] Therefore, the area of ​​the receptacle where the light conversion material is not injected due to the opening region can be minimized. In other words, in the optical path control component, the angle formed by the width of the opening region in the first direction and the receptacle should be an acute angle to form multiple light conversion regions of the optical path control component. That is, in the optical path control component, when the angle formed by the width of the opening region in the first direction and the receptacle is a right angle, the light conversion material may not be formed entirely on the side surface of the substrate corresponding to the opening region, thus reducing the light conversion region of the optical path control component.

[0368] For example, the tilt angle of the receiving part can be 60° to 89°, 65° to 87°, or 75° to 85°.

[0369] At the same time, refer to Figure 25 The accommodating portion 320 may include a region that does not contain the light conversion material 330.

[0370] In detail, Figure 25 yes Figure 18The diagram shows an enlarged view of region D. The light conversion material may not be present in the receiving portion, or it may be present only in a portion of the receiving portion, or it may be present only in a portion of multiple receiving portions. In other words, the receiving portion can be formed outside the sealing portion, and since a region without light conversion material is formed in the receiving portion outside the sealing portion, a region preventing the penetration of external impurities outside the sealing portion can be formed. This minimizes the penetration of external impurities into the light conversion material.

[0371] In the optical path control member according to the second embodiment, the receiving portion can be provided by tilting the receiving portion relative to the second direction of the substrate at a predetermined tilt angle.

[0372] Accordingly, when the optical path control component and the display panel are combined to form a display device, the occurrence of moiré pattern caused by the overlap of the pattern of the receiving part of the optical path control component and the pixel pattern of the display panel can be prevented.

[0373] Therefore, when a user views the display device from the outside, it can prevent the moiré pattern caused by the overlap of the pattern of the receiving part of the optical path control component and the pixel pattern of the display panel from being visually recognized.

[0374] Furthermore, the optical path control member according to the second embodiment can prevent the light conversion material from flowing out onto the side surface of the optical path control member as the receiving portion tilts.

[0375] In other words, since the first sealing part and the second sealing part are provided at both ends of the optical path control member in the first direction and the second direction to seal the light conversion material in the receiving part, the outflow of the light conversion material to the outside or the infiltration of external impurities into the light conversion material can be minimized.

[0376] Furthermore, by forming a region where the sealing part and the light conversion material are mixed, the adhesive properties of the sealing part can be improved through an anchoring effect. Therefore, the adhesion of the sealing part can be improved to prevent detachment, thereby improving the reliability and sealing performance of the optical path control component.

[0377] Below, we will refer to Figures 26 to 30 The optical path control component according to the third embodiment is described.

[0378] In the description of the optical path control component according to the third embodiment, descriptions that are the same as or similar to those of the optical path control component according to the first and second embodiments described above will be omitted, and the same reference numerals will be assigned to the same components.

[0379] refer to Figures 26 to 29In the optical path control component according to the third embodiment, the first protrusion PA1 and the second protrusion PA2 can be configured to overlap each other. That is, unlike the first and second embodiments, the first protrusion PA1 and the second protrusion PA2 may not be configured to be offset from each other, and may be configured to completely or partially overlap each other.

[0380] Accordingly, when manufacturing optical path control components, by promoting the alignment of the first substrate 110 and the second substrate 120, defects caused by errors occurring during the stacking of the first substrate and the second substrate can be prevented, thereby improving process efficiency.

[0381] Figure 30 It is along Figure 26 The cross-sectional view taken by the M-M' line. That is, Figure 30 It is a cross-sectional view of the second connecting region CA2 located on the second protrusion PA2 along the second direction.

[0382] refer to Figure 30 The second connection region CA2 can be disposed on the second protrusion PA2, and the third cutting portion h3 can be formed in the second connection region CA2. An electrode connection portion 700 comprising conductive material can be disposed inside the third cutting portion h3.

[0383] The third cut section h3 can pass through the second substrate 120, the second electrode 220, and the buffer layer 420. In addition, the third cut section h3 can partially pass through the light conversion unit 300.

[0384] Accordingly, the third cutting portion h3 can be formed as an exposure light conversion unit 300. Therefore, the electrode connection portion 700 provided in the third cutting portion h3 can be configured to be spaced apart from the adhesive layer 410.

[0385] Furthermore, the insulating layer 750 disposed between the electrode connection portion 700 and the adhesive layer 410 can be disposed within the third cutting portion h3.

[0386] When the electrode connection portion 700 and the adhesive layer 410 are spaced apart from each other, and an insulating layer 750 is provided between the electrode connection portion 700 and the adhesive layer 410, the dielectric constant of the adhesive layer 410 can prevent the electrode connection portion 700 from being electrically connected to the first electrode 210.

[0387] Therefore, the limitations on the material selection of the adhesive layer 410 can be reduced, and electrical short circuits caused by the dielectric constant of the adhesive layer 410 can be prevented, thereby improving the driving characteristics and reliability of the optical path control component.

[0388] In the optical path control component according to the third embodiment, the first protrusion of the first substrate and the second protrusion of the second substrate can be configured to overlap each other.

[0389] Therefore, in the process of manufacturing optical path control components, defects caused by the bonding process can be prevented, and process efficiency can be improved.

[0390] Furthermore, the adhesive layer is spaced apart from the electrode connection portion disposed within the third cut portion, which serves as the second connection region, and an insulating layer is disposed between the electrode connection portion and the adhesive layer, thereby preventing the electrode connection portion from being electrically connected to the first electrode by means of the dielectric constant of the adhesive layer.

[0391] Therefore, the material of the adhesive layer can be freely selected, and electrical short circuits caused by the dielectric constant of the adhesive layer can be prevented, thereby improving the driving characteristics and reliability of the optical path control components.

[0392] Below, we will refer to Figures 31 to 39 The optical path control component according to the fourth embodiment is described.

[0393] In the description of the optical path control component according to the fourth embodiment, descriptions that are the same as or similar to those of the optical path control components according to the first, second, and third embodiments described above will be omitted, and the same reference numerals will be assigned to the same components. Furthermore, the optical path control component according to the fourth embodiment can be used in conjunction with the optical path control components according to the first, second, and third embodiments described above.

[0394] refer to Figures 31 to 39 According to the fourth embodiment, the optical path control component may include a first substrate 110, a second substrate 120, a first electrode 210, a second electrode 220, and an optical conversion unit 300.

[0395] Cutting portions can be formed on the second substrate 120. More specifically, the second substrate 120 may include a plurality of cutting portions.

[0396] refer to Figure 31 The second substrate 120 may include a 1-1 cutting portion h1-1, a 1-2 cutting portion h1-2, a 2-1 cutting portion h2-1, and a 2-2 cutting portion h2-2.

[0397] In the optical path control component according to the fourth embodiment, unlike the optical path control component according to the first to third embodiments described above, the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2 can be formed to a depth up to expose one surface of the insulating layer 410.

[0398] The second sealing portion 520 can be provided on the outermost side of the optical path control member. Specifically, the second sealing portion 520, which extends in the second direction 2A and is configured to face each other, can be provided on the outermost side of the optical path control member in the first direction 1A.

[0399] The second sealing part 520 can be provided inside the aforementioned cutting part. Specifically, the second sealing part 520 can be provided inside the 2-1 cutting part h2-1 and the 2-2 cutting part h2-2.

[0400] That is, the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2 can be formed to pass sequentially through the second substrate 120, the second electrode 220, the buffer layer 420 and the light conversion unit 300 including the base portion 350 and the partition wall portion 310, and the second sealing portion 520 can be formed by providing a sealing material inside the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2.

[0401] That is, one surface of the partition wall portion 310 or the adhesive layer 410 can be exposed through the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-1, and the second sealing portion 520 can be configured to contact the adhesive layer 410.

[0402] The second sealing portion 520 may be configured to contact the side surface of the second substrate 120. Furthermore, the second sealing portion 520 may be configured to contact the side surface of the second electrode 220. Furthermore, the second sealing portion 520 may be configured to contact the side surface of the buffer layer 420. Furthermore, the second sealing portion 520 may be configured to contact the side surface of the base portion 350. Furthermore, the second sealing portion 520 may be configured to contact the side surface of the partition wall portion 310.

[0403] The second sealing part 520 may be provided on the side surface of the optical path control member, that is, the side surface in the second direction 2A, to prevent impurities that may penetrate from the outside from penetrating into the optical conversion unit 300.

[0404] The second sealing portion 520 can be configured to completely fill the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2, or it can be configured to have a height lower than the depth of the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2. Therefore, as Figure 5 and Figure 6 As shown, the upper surface of the second sealing portion 520 can be configured to have a lower height than the upper surface of the second substrate 120. That is, a step can be formed between the upper surface of the second sealing portion 520 and the upper surface of the second substrate 120. Furthermore, the upper surface of the second sealing portion 520 can be formed into a recessed shape.

[0405] Cutting portions h2-1 (2-1) and h2-2 (2-2) can be configured to have different lengths. Specifically, the length of cutting portion h2-2 (2-2) in the second direction 2A can be greater than the length of cutting portion h2-1 (2-1) in the second direction 2A.

[0406] The 2-2 cutting portion h2-2 can be configured to extend to the second protrusion PA2 of the second substrate 120, and correspondingly, the length of the 2-2 cutting portion h2-2 can be configured to be greater than the length of the 2-1 cutting portion h2-1.

[0407] Accordingly, the length of the second sealing portion 520 disposed inside the 2-1 cutting portion h2-1 and the 2-2 cutting portion h2-2 can also be varied. That is, the length of the second sealing portion 520 disposed inside the 2-2 cutting portion h2-2 can be greater than the length of the second sealing portion 520 disposed inside the 2-1 cutting portion h2-1.

[0408] The first sealing part and the second sealing part can be respectively located in the 1-1 cutting part, the 1-2 cutting part, the 2-1 cutting part and the 2-2 cutting part.

[0409] The first sealing part and the second sealing part can be configured to seal the inlet and outlet of the receiving part for containing the light conversion material, and can be configured to extend along the side surface region of the light conversion unit, i.e., the side surface region in the first direction.

[0410] Accordingly, the first sealing part can prevent the light conversion material inside the accommodating part from flowing out to the outside of the light conversion unit, and the first sealing part and the second sealing part can prevent impurities from penetrating into the light conversion unit from the outside, thereby improving the reliability of the optical path control component.

[0411] Furthermore, since the first sealing portion and the second sealing portion are disposed inside the cut portion formed on the second substrate, the size of the optical path control component can be reduced compared to forming the first sealing portion and the second sealing portion outside the optical conversion unit, and the sealing characteristics of the optical path control component can be improved by preventing the sealing material from deteriorating due to the external environment.

[0412] Figures 38 to 42 It is along Figure 31 Various sectional views taken along the R-R' line. That is, Figures 38 to 42 It is a cross-sectional view taken along the protruding areas of the first substrate and the second substrate.

[0413] refer to Figures 38 to 42 The first protrusion PA1 of the first substrate 110 and the second protrusion PA2 of the second substrate 120 can be configured to be spaced apart from each other. That is, the first protrusion PA1 of the first substrate 110 and the second protrusion PA2 of the second substrate 120 can be configured to be spaced apart from each other in the first direction 1A.

[0414] Accordingly, the first connecting region CA1 provided on the first protrusion PA1 and the second connecting region CA2 provided on the second protrusion PA2 are physically spaced apart from each other, thereby preventing the first connecting region CA1 and the second connecting region CA2 from being electrically connected to each other through the adhesive layer.

[0415] A first connection region CA1 may be disposed on a first protrusion PA1. A first electrode 210 may be exposed in the first connection region CA1. That is, the first electrode 210 on the first substrate 110 may be exposed by partially etching the adhesive layer 410 on the first protrusion PA1, and correspondingly, the upper surface of the first electrode 210 may be exposed in the first connection region CA1. In other words, the first electrode 210 exposed in the first connection region CA1 may be a first connection electrode connected to an external printed circuit board or a flexible printed circuit board.

[0416] Furthermore, a second connecting region CA2 may be disposed on the second protrusion PA2. A third cutting portion h3 may be formed in the second connecting region CA2. More specifically, a plurality of third cutting portions h3 may be formed in the second connecting region CA2. More specifically, a plurality of third cutting portions h3 spaced apart from each other may be formed in the second connecting region CA2.

[0417] The first connection area CA1 and the second connection area CA2 can be disposed on the same surface. Therefore, when the same printed circuit board is connected to the first connection area CA1 and the second connection area CA2, since the first connection area CA1 and the second connection area CA2 are disposed on the same surface, the first connection area CA1, the second connection area CA2 and the printed circuit board can be easily connected.

[0418] Figures 38 to 41 Only six third cutting portions h3 are shown, which are spaced apart from each other. However, this embodiment is not limited to this. The number of third cutting portions h3 may be less than six or more than six.

[0419] An electrode connection portion 700, including a conductive material, can be disposed inside the third cutting portion h3.

[0420] The electrode connection portion 700 may include a material different from at least one of the first electrode 210 and the second electrode 220. Furthermore, the light transmittance of the electrode connection portion 700 may be smaller than the light transmittance of at least one of the first electrode 210 and the second electrode 220.

[0421] For example, the electrode connection portion 700 may include metal. More specifically, the electrode connection portion 700 may include a metal paste in which metal particles are dispersed in a binder.

[0422] The electrode connection portion 700 can be configured to contact the side surface of the second substrate 120 within the third cutting portion h3. Furthermore, the electrode connection portion 700 can be configured to contact the side surface of the second electrode 220 within the third cutting portion h3. Furthermore, the electrode connection portion 700 can be configured to contact the side surface of the buffer layer 420 within the third cutting portion h3. Furthermore, the electrode connection portion 700 can be configured to contact the side surface of the base portion 350 within the third cutting portion h3. Furthermore, the electrode connection portion 700 can be configured to contact the side surface of the partition wall portion 310 within the third cutting portion h3.

[0423] In other words, the electrode connection portion 700 can be configured to contact at least one side surface of the second substrate 120, the second electrode 220, the buffer layer 420, the base portion 350, and the partition wall portion 310.

[0424] For example, refer to Figure 38 The third cutting portion h3 can be formed to pass through all of the second substrate 120, the second electrode 220, the buffer layer 420, the base portion 350 and the partition wall portion 310.

[0425] Accordingly, the electrode connection portion 700 may be configured to contact the side surface of the second substrate 120, the side surface of the second electrode 220, the side surface of the buffer layer 420, the side surface of the base portion 350, and the side surface of the partition wall portion 310 inside the third cutting portion h3.

[0426] Or, refer to Figure 39 The third cutting portion h3 can be formed to pass through the second substrate 120, the second electrode 220, the buffer layer 420, and the base portion 350. That is, the third cutting portion h3 may not be formed in the partition wall portion 310, or it can be formed by removing only a portion of the partition wall portion 310.

[0427] Accordingly, the electrode connection portion 700 may be configured to contact the side surface of the second substrate 120, the side surface of the second electrode 220, the side surface of the buffer layer 420, and the side surface of the base portion 350 within the third cutting portion h3.

[0428] The upper surface of the electrode connection portion 700 may be disposed on the same plane as the upper surface of the second substrate 120, or it may be lower. For example, the upper surface of the electrode connection portion 700 may be disposed on the same plane as the upper surface of the second substrate 120. Or, as... Figure 8 As shown, the upper surface of the electrode connection portion 700 can be set lower than the upper surface of the second substrate 120.

[0429] Correspondingly, the upper surface of the electrode connection portion 700 and the upper surface of the second substrate 120 can be formed on the same plane without steps, or steps can be provided so that the upper surface of the electrode connection portion 700 is lower.

[0430] Accordingly, the total thickness of the optical path control component can be prevented from increasing due to the height of the electrode connection portion 700, thereby reducing the total thickness of the optical path control component.

[0431] The electrode connection portion 700 can be electrically connected to the second electrode 220 and can be exposed to the outside of the second substrate 120. That is, the electrode connection portion 700 can be exposed on the second protrusion PA2 of the second substrate 120. In other words, the upper surface of the electrode connection portion 700 can be exposed in the second connection region CA2.

[0432] Accordingly, the electrode connection portion 700 exposed in the second connection area CA2 can be a second connection electrode connected to an external printed circuit board or a flexible printed circuit board.

[0433] Accordingly, the first electrode 210 and the second electrode 220 can be electrically connected to the same printed circuit board or flexible printed circuit board through the first connecting electrode of the first connecting region and the second connecting electrode of the second connecting region, respectively.

[0434] Alternatively, the first electrode 210 and the second electrode 220 can be electrically connected to another printed circuit board or flexible printed circuit board via a first connection electrode in the first connection region and a second connection electrode in the second connection region, respectively. That is, the first connection electrode can be connected to the first circuit board, and the second connection electrode can be connected to a second circuit board that is different from the first circuit board.

[0435] Since the electrode connection portion 700 is disposed within multiple third cut portions instead of a single cut portion, the contact area between the electrode connection portion 700 and the second electrode 220 can be increased. Accordingly, as the contact area between the electrode connection portion and the second electrode increases, the electrical connection characteristics of the second electrode, the electrode connection portion, and the printed circuit board can be improved.

[0436] At the same time, refer to Figure 40 Depending on whether a conductive material is provided, the third cutting part h3 may include cutting part h3-1 (3-1) and cutting part h3-2 (3-2).

[0437] In detail, the third cutting part h3 may include a 3-1 cutting part h3-1 in which a conductive material is disposed and a 3-2 cutting part h3-2 in which no conductive material is disposed.

[0438] The 3-1 cutting section h3-1, which is provided with conductive material, can be an electrode connection section 700. Furthermore, the 3-2 cutting section h3-2, which is not provided with conductive material, can be a dummy section 710. Figure 40 In this embodiment, the 3-2 cutting portion h3-2 is defined as a region without conductive material, but this embodiment is not limited to this. The 3-2 cutting portion h3-2 can be defined as a region partially provided with conductive material.

[0439] In other words, conductive material may not be provided on at least one of the plurality of third cut portions h3. That is, the second connection region CA may include a non-conductive dummy portion 710.

[0440] Because the second connection region CA2 includes a dummy portion 710, the printed circuit board may not be connected to the areas of the plurality of third cut portions that are not filled with conductive material or have minimal conductive material filling. Therefore, the electrical connection characteristics between the second connection region CA2 and the printed circuit board can be improved.

[0441] Furthermore, when the dummy part 710 is provided at both ends of the second connection area CA2, the position of the second connection area CA2 can be easily identified from the outside, and when the second connection area CA2 is connected to the printed circuit board, connection failures due to alignment errors can be minimized.

[0442] At the same time, refer to Figure 41 A merging portion 720 may be provided on the electrode connection portion 700. More specifically, the merging portion 720 may be provided on the electrode connection portion 700 to connect to the electrode connection portion 700 provided in the plurality of third cutting portions h3.

[0443] The merging portion 720 may include a conductive material that is the same as or similar to the conductive material of the electrode connection portion 700.

[0444] The electrode connection portion 700 and the printed circuit board can be easily connected via the merging portion 720. That is, when the printed circuit board is connected to the electrode connection portions disposed within the plurality of third cutting portions, connection failure due to alignment errors can be prevented. In other words, it can prevent the printed circuit board from failing to connect to the electrode connection portions disposed within a portion of the plurality of third cutting portions due to alignment errors between the electrode connection portion and the printed circuit board.

[0445] Therefore, the merging section can facilitate the connection between the electrode connection section 700 and the printed circuit board, and can improve the electrical connection characteristics.

[0446] At the same time, refer to Figure 42 The merging portion 720 can be disposed inside the second substrate 120. That is, the merging portion 720 can be disposed inside the second substrate 120.

[0447] That is, a groove g for providing the merging portion 720 can be first formed in the second substrate 120, and the third cutting portion h3 can be provided below the groove g.

[0448] The merging part 720 can be configured to be completely embedded inside the second substrate 120, or it can be partially embedded by protruding from the upper surface of the second substrate 120.

[0449] Therefore, the increase in the thickness of the optical path control component can be minimized by the merging portion 720, and the merging portion 720 is securely supported inside the second substrate 120, thereby improving the reliability of the optical path control component.

[0450] In the optical path control component according to the fourth embodiment, the first connection electrode of the first connection region and the second connection electrode of the second connection region can be disposed on the first protrusion and the second protrusion formed on the first substrate and the second substrate.

[0451] The surfaces of the first substrate and the second substrate may not protrude as a whole, and the first protrusion and the second protrusion may only protrude from the area in which the first connection region and the second connection electrode can be formed.

[0452] Accordingly, the area of ​​the first and second protrusions can be reduced. Therefore, when the optical path control component is integrated into the display panel and applied to the display device, other components of the display device can be placed in areas that do not correspond to the first and second protrusions, thereby reducing the bezel area of ​​the display device.

[0453] In other words, the optical path control component according to the first embodiment reduces the size of the frame area in which the connecting electrodes are disposed, thereby reducing the frame area of ​​the display device using the optical path control component.

[0454] Figure 43 It is along Figure 31 A sectional view taken along line S-S'. That is, Figure 43 It is a cross-sectional view taken from both ends of the 2-2 cut section in the second direction.

[0455] refer to Figure 43 The 2-2 cutting portion h2-2 can be configured to extend from the second protrusion PA2 of the second substrate 120 in the second direction 2A.

[0456] refer to Figure 43 Cutting section h1-1 (1-1) and cutting section h2-2 (2-2) can be connected to each other.

[0457] Since the 1-1 cutting part h1-1 and the 2-2 cutting part h2-2 are connected, the first sealing part 510 provided on the 1-1 cutting part h1-1 and the second sealing part 520 provided on the 2-2 cutting part h2-2 can be configured to be connected to each other.

[0458] Meanwhile, the figure shows that the 2-2 cut portion h2-2 is spaced apart from the end, i.e., the outer surface, of the second substrate 120 in the first direction 1A. However, this embodiment is not limited to this, and the 2-2 cut portion h2-2 can be formed by removing one outer surface of the second substrate 120 in the first direction 1A, as described above for the 1-1 cut portion h1-1. Accordingly, a portion of the 2-2 cut portion h2-2 may be the outermost surface of the second substrate 120 in the first direction 1A.

[0459] Figure 44 It is along Figure 31 A sectional view taken from the T-T' region in the image. Figure 45 It is along Figure 31 The cross-sectional view taken from the U-U' region in the image, i.e. Figure 44 and Figure 45 It is a cross-sectional view of the second connecting region CA2 located on the second protrusion PA2 along the second direction.

[0460] refer to Figure 44 and 45 The second connection area CA2 may include an area that overlaps with the first sealing part 510 and an area that does not overlap with the first sealing part 510.

[0461] That is, since the 1-2 cutting portion h1-2 and the 2-2 cutting portion h2-2 are set to be spaced apart from each other, the second connecting region CA2 can be set in the region that overlaps with the opening region OA in the second direction and in the region that overlaps with the first sealing portion 510 set in the 1-2 cutting portion h1-2.

[0462] In addition, refer to Figure 45 A dam portion 600 can be provided between the second connection regions CA2, that is, between the electrode connection portion 700 and the first sealing portion 510. In other words, the dam portion 600 can be provided on the second protrusion PA2 between the electrode connection portion 700 and the first sealing portion 510.

[0463] The dam section 600 can be formed by filling the cut section through the second substrate 120, the second electrode 220, the buffer layer 410 and the light conversion unit 300 with the material that forms the dam.

[0464] The dam section 600 is a material that controls the injection length of the light conversion material 330 when it is injected into the receiving section 320, and the dam section 600 can prevent the light conversion material 330 from overflowing in the direction outside the dam, that is, in the direction of the electrode connection section 700.

[0465] During the manufacturing process of the optical path control component, a portion of the dam section 600 can be removed, a portion of the dam section 600 can be retained, and a portion of the dam section can be retained in the area adjacent to the second connection area CA2.

[0466] At the same time, refer to Figure 45 The image shows that the light conversion unit 300 is located between the electrode connection portion 700 and the dam portion 600, but this embodiment is not limited to this.

[0467] That is, when the light conversion unit 300 between the electrode connection portion 700 and the dam portion 600 is the area of ​​the partition wall portion 310, such as Figure 35 As shown, the light conversion unit 300, buffer layer 420, second electrode 220 and second substrate 120 can be retained between the electrode connection portion 700 and the dam portion 600.

[0468] However, when the light conversion unit 300 between the electrode connection portion 700 and the dam portion 600 is the area of ​​the receiving portion 320, the material of the dam portion 600 can move into the receiving portion 320, so that the dam portion 600 and the electrode connection portion 700 can come into contact with each other.

[0469] In addition, refer to Figure 45 The image shows the light conversion unit 300 being retained between the dam section 600 and the first sealing section 510, but this embodiment is not limited to this.

[0470] That is, when the light conversion unit 300 between the dam portion 600 and the first sealing portion 510 is the receiving portion 320 region, the light conversion unit 300, the buffer layer 420, the second electrode 220 and the second substrate 120 can be retained between the dam portion 600 and the first sealing portion 510.

[0471] However, when the optical conversion unit 300 between the dam portion 600 and the first sealing portion 510 is the receiving portion 320 region, the materials of the first sealing portion 510 and the dam portion 600 can move to the receiving portion 320, so that the first sealing portion 510 and the dam portion 600 can come into contact with each other.

[0472] Below, we will refer to Figure 46 Describes the optical path control module according to an embodiment.

[0473] refer to Figure 46According to the embodiment, the optical path control module includes the optical path control component described above and a flexible printed circuit board (FPCB) electrically connected to the optical path control component.

[0474] refer to Figure 46 The flexible printed circuit board 900 may include a substrate 910 and wiring electrodes 920 disposed on the substrate 910.

[0475] The wiring electrode 920 may include a first wiring electrode 921 and a second wiring electrode 922.

[0476] The first wiring electrode 921 and the second wiring electrode 922 can be disposed on the same substrate 910. For example, the first wiring electrode 921 and the second wiring electrode 922 can be disposed on the same surface of the substrate 910.

[0477] The first wiring electrode 921 can be connected to the first electrode 210 of the optical path control component. Furthermore, the second wiring electrode 922 can be connected to the second electrode 220 of the optical path control component. Therefore, the optical path control component and the flexible printed circuit board can be electrically connected to each other.

[0478] The first electrode 210 and the second electrode 220 of the optical path control component can be disposed on the same surface.

[0479] That is, since the first electrode 210 is disposed on the upper surface of the first substrate 110, a plurality of cut portions are formed on the second substrate 120, and the second electrode 220 is disposed on the upper surface of the second substrate 120 through the electrode connection portion, the first electrode 210 and the second electrode 220 can be disposed on the same surface of the optical path control member.

[0480] Accordingly, the optical path control components and the flexible printed circuit board can be electrically connected on one surface through a flexible printed circuit board.

[0481] In related technologies, there is a problem that the first electrode and the second electrode are set in different directions and connected by two printed circuit boards, which increases the frame area of ​​the optical path control module, or the first electrode and the second electrode are set on different surfaces, making it difficult to connect the flexible printed circuit board to the electrode.

[0482] However, in the optical path control module according to an embodiment of the present invention, since the first electrode and the second electrode are disposed on the same surface of the optical path control member and are connected to each other on the same surface using a flexible printed circuit board, the connection between the path control member and the flexible printed circuit board can be facilitated while reducing the border area of ​​the optical path control module.

[0483] Below, we will refer to Figures 47 to 64A method for manufacturing an optical path control component according to an embodiment is described. In the description of the method for manufacturing the optical path control component according to the embodiment, descriptions that are the same as or similar to those of the optical path control component according to the above embodiment will be omitted, and the same reference numerals will be assigned to the same parts.

[0484] refer to Figure 47 and Figure 48 The first substrate 110 and the second substrate 120 can be bonded together by the adhesive layer 410. That is, the first substrate 110 and the second substrate 120 can be bonded together so that the second substrate 120 is disposed on the first substrate 110.

[0485] Accordingly, one surface of the adhesive layer 410 may be exposed in the first hole H1, the second hole H2, the third cut portion and the first protrusion PA1 formed in the second substrate 120.

[0486] Subsequently, reference Figure 49 and Figure 50 The dam section 600 can be formed by filling the interior of the second hole H2 with the material that forms the dam section 600.

[0487] The dam section 600 can partially or completely fill the area between the first hole H1 and the second hole H2 along the receiving section 320.

[0488] The dam section 600 may include polyurethane acrylate, but this embodiment is not limited thereto.

[0489] Subsequently, reference Figure 51 and Figure 52 The light conversion material 330, comprising light conversion particles 330a and dispersion 330b, can be injected into the receiving portion 320 through the first hole H1. Therefore, the light conversion material 330 can be filled into the receiving portion 320, the first hole H1, and the second hole H2.

[0490] The receiving portion 320 can be tilted at a predetermined tilt angle relative to the second direction 2A, and correspondingly, the light conversion material 330 can also be tilted and filled at a predetermined tilt angle.

[0491] For example, after one of the first holes H1 facing each other is designated as the inlet and the other first hole H1 is designated as the outlet, the light conversion material is dispensed into the inlet, and then the light conversion material can be filled into the receiving part 320 by a capillary method of drawing the light conversion material from the outlet.

[0492] Subsequently, reference Figure 53 and Figure 54 The first sealing part 510 can be formed by filling the interior of the first hole H1 and the second hole H2 with sealing material.

[0493] The first sealing part 510 may include the same material as the dam part 600, but this embodiment is not limited thereto.

[0494] In addition, in order to easily fill the sealing material into the first hole H1, an additional step (e.g., a cleaning step) can be performed before filling the sealing material to form an injection path for the sealing material by cleaning the interior of the first hole H1.

[0495] Simultaneously, when the first sealing part 510 is disposed inside the first hole H1 and the second hole H2, a portion of the first sealing part 510 can move into the receiving part 320. Therefore, the light conversion material 510 and the sealing material can be disposed together in the receiving part 320.

[0496] Subsequently, reference Figure 55 The third cut portion h3 can be filled with conductive material to form the electrode connection portion 700 of the second substrate 120.

[0497] The electrode connection portion 700 can be configured to contact the second electrode 220 within the third cutting portion h3, thereby becoming a second connection electrode connected to the printed circuit board.

[0498] Subsequently, reference Figures 56 to 59 A fourth hole H4 and a fifth hole H5 can be additionally formed. Specifically, the fourth hole H4 and the fifth hole H5, which extend in the second direction, can be formed on the second substrate 120. That is, at least one of the fourth hole H4 and the fifth hole H5 can be formed by irradiating the first substrate 110 with a laser from the second substrate 120.

[0499] At least one of the fourth hole H4 and the fifth hole H5 can be configured to overlap with the first hole H1 and the second hole H2.

[0500] As shown below Figure 62 As shown, when a cutting process is performed to minimize the bezel of a display or optical path control component, in order to prevent ink from flowing downwards from the accommodating portion exposed in the lateral direction, at least one of the fourth hole H4 and the fifth hole H5 may be formed.

[0501] Alternatively, a fourth or fifth hole may not be formed. After the cutting process, with the ink on the other side of the exposed side surface of the container blocked by the first seal, the light conversion material in the container may not flow downward to the outside of the light path control member due to the pressure difference between the atmospheric pressure inside the container and the atmospheric pressure outside the light path control member.

[0502] However, since reliability may deteriorate when mode switching occurs multiple times, the mode switching reliability of the entire optical path control component can be improved by forming a fourth or fifth hole to seal the side surface of the optical path control component.

[0503] refer to Figures 57 to 60 The fourth hole H4 and the fifth hole H5 can be formed to have different depths.

[0504] For example, refer to Figure 57 The fourth hole H4 and the fifth hole H5 can pass through the second substrate 120, the second electrode 220 and the buffer layer 420, and can be formed by removing a portion of the light conversion unit 300.

[0505] Or, refer to Figure 58 The fourth hole H4 and the fifth hole H5 can be formed to pass through the second substrate 120, the second electrode 220, the buffer layer 420 and the light conversion unit 300.

[0506] Or, refer to Figure 59 The fourth hole H4 and the fifth hole H5 can pass through the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion unit 300, the adhesive layer 410, and the first electrode 210, and the fourth hole H4 and the fifth hole H5 can be formed by removing a portion of the first substrate 110.

[0507] The figure illustrates that the fourth hole H4 and the fifth hole H5 are formed to have the same depth, but this embodiment is not limited to this, and the fourth hole H4 and the fifth hole H5 can be formed to have different depths.

[0508] Subsequently, reference Figure 60 and Figure 61 The second sealing part 520 can be formed by providing sealing material in the fourth hole H4 and the fifth hole H5.

[0509] The second sealing part 520 may include the same material as the dam part 600 and the first sealing part 510 described above, but this embodiment is not limited thereto.

[0510] Subsequently, reference Figure 62 and 63 , Figure 63 The optical path control component can be used in Figure 62 The final product is obtained by cutting along the dotted line direction.

[0511] At the same time, refer to Figure 64 The outer surface of the optical path control component can be formed into various shapes by setting the cutting lines in various positions.

[0512] By virtue of this, compared to the second substrate, the area of ​​the portion containing the light conversion material formed in the light path control member can be freely configured to be 10% or more, 20% or more, 25% or more, 30% or more, 40% or more, or 50% or more. Furthermore, the area of ​​the portion containing the light conversion material can be adjusted to 10% to 60%, 20% to 50%, or 20% to 40%. Thus, the front transmittance and side transmittance of the light path control member can be adjusted within the desired range. Furthermore, the bezel area of ​​the display panel on which the light path control member is mounted can be reduced, ensuring sufficient area for mounting other components required in the display panel.

[0513] Below, for reference Figures 65 to 69 This section describes a display device that applies an optical path control component according to an embodiment.

[0514] refer to Figure 65 and Figure 66 According to the embodiment, the optical path control component 1000 can be disposed above or below the display panel 2000.

[0515] The display panel 2000 and the optical path control component 1000 can be configured to be bonded to each other. For example, the display panel 2000 and the optical path control component 1000 can be bonded to each other via an adhesive layer 1500. The adhesive layer 1500 can be transparent. For example, the adhesive layer 1500 can include an adhesive or adhesive layer containing an optically transparent adhesive material.

[0516] The adhesive layer 1500 may include a release film. Specifically, when bonding the optical path control component to the display panel, the optical path control component and the display panel can be bonded after the release film is removed.

[0517] The display panel 2000 may include a first substrate 2100 and a second substrate 2200. When the display panel 2000 is a liquid crystal display panel, the light path control member may be formed below the liquid crystal panel. That is, when the surface seen by the user in the liquid crystal panel is defined as the upper part of the liquid crystal panel, the light path control member may be disposed below the liquid crystal panel. The display panel 2000 may be formed in a structure in which the first substrate 2100, including a film transistor (TFT) and a pixel electrode, and the second substrate 2200, including a color filter layer, are bonded to each other with a liquid crystal layer interposed between them.

[0518] Furthermore, the display panel 2000 can be a liquid crystal display panel with a color filter on transistor (COT) structure, wherein thin-film transistors, color filters, and a black electrolyte are formed on a first' substrate 2100, and a second' substrate 2200 is bonded to the first' substrate 2100, with a liquid crystal layer interposed between the first' substrate 2100 and the second' substrate 2200. That is, thin-film transistors can be formed on the first' substrate 2100, a protective film can be formed on the thin-film transistors, and a color filter layer can be formed on the protective film. Additionally, pixel electrodes that contact the thin-film transistors can be formed on the first' substrate 2100. Here, to improve the aperture ratio and simplify the masking process, the black electrolyte can be omitted, and a common electrode can be formed to serve as the black electrolyte.

[0519] Furthermore, when the display panel 2000 is a liquid crystal display panel, the display device may further include a backlight unit 3000 that provides light from the rear surface of the display panel 2000.

[0520] That is, such as Figure 65 As shown, the light path control component can be disposed below the liquid crystal panel and on the backlight unit 3000, and the light path control component can be disposed between the backlight unit 3000 and the display panel 2000.

[0521] Or, such as Figure 66 As shown, when the display panel 2000 is an organic light-emitting diode (OLED) panel, a light path control component can be formed on the OLED panel. That is, when the surface observed by the user in the OLED panel is defined as the upper part of the OLED panel, the light path control component can be disposed on the OLED panel. The display panel 2000 may include self-emissive elements that do not require a separate light source. In the display panel 2000, thin-film transistors can be formed on the first substrate 2100, and organic light-emitting elements in contact with the thin-film transistors can be formed. The organic light-emitting element may include an anode, a cathode, and an organic light-emitting layer formed between the anode and the cathode. Furthermore, a second substrate 2200, configured as a packaging substrate for encapsulation, may be further included on the organic light-emitting element.

[0522] Furthermore, although not shown in the accompanying drawings, a polarizing plate can be further disposed between the optical path control member 1000 and the display panel 2000. This polarizing plate can be a linear polarizing plate or an external light reflection anti-polarizing plate. For example, when the display panel 2000 is a liquid crystal display panel, the polarizing plate can be a linear polarizing plate. Furthermore, when the display panel 2000 is an organic light-emitting diode panel, the polarizing plate can be an external light reflection anti-polarizing plate.

[0523] Furthermore, additional functional layers 1300, such as anti-reflective layers and anti-glare layers, can be provided on the optical path control member 1000. Specifically, the functional layer 1300 can be adhered to one surface of the first substrate 110 of the optical path control member. Although not shown in the figures, the functional layer 1300 can be adhered to the first substrate 110 of the optical path control member via an adhesive layer. Furthermore, a release film for protecting the functional layer can be provided on the functional layer 1300.

[0524] Furthermore, a touch panel can be further installed between the display panel and the optical path control components.

[0525] The accompanying drawings show that the light path control component is disposed on the upper part of the display panel, but this embodiment is not limited to this. The light path control component can be disposed in various positions, such as the light-adjustable position, i.e., the lower part of the display panel, or between the second substrate and the first substrate of the display panel, etc.

[0526] Furthermore, as shown in the accompanying drawings, the light conversion unit of the light path control member according to this embodiment is in a direction parallel or perpendicular to the outer surface of the second substrate, but the light conversion unit is formed to be tilted at a predetermined angle from the outer surface of the second substrate. This reduces moiré patterns that occur between the display panel and the light path control member.

[0527] refer to Figures 67 to 69 The optical path control component according to the embodiment can be applied to various display devices.

[0528] refer to Figures 67 to 69 The optical path control component according to the embodiment can be applied to a display device that displays a display screen.

[0529] For example, when Figure 67 When the power shown is applied to the optical path control member, the receiving portion functions as a light-transmitting portion, thereby allowing the display device to be driven in an open mode, and when... Figure 68 When no power is applied to the optical path control component, the housing acts as a light-shielding part, so that the display device can be driven in a light-shielding mode.

[0530] Therefore, users can easily drive the display device in either privacy mode or normal mode depending on the amount of power applied.

[0531] Light emitted from the backlight unit or the self-emissive element can move from the first substrate to the second substrate. Alternatively, light emitted from the backlight unit or the self-emissive element can also move from the second substrate to the first substrate.

[0532] In addition, refer to Figure 69 The display device that uses the optical path control component according to the embodiment can also be applied to the interior of a vehicle.

[0533] For example, a display device including the optical path control component according to an embodiment can display confirmed vehicle information and a video of the vehicle's movement route. This display device can be positioned between the driver's seat and the passenger seat of the vehicle.

[0534] Furthermore, the optical path control component according to the embodiment can be applied to an instrument panel that displays vehicle speed, engine, alarm signals, etc.

[0535] Furthermore, the optical path control component according to the embodiment can be applied to the front windshield (FG) or the left and right side windows of a vehicle.

[0536] The features, structures, effects, etc., described in the above embodiments are included in at least one embodiment of the present invention, but are not limited to only one embodiment. Furthermore, the features, structures, and effects described in each embodiment can be combined or modified by those skilled in the art for other embodiments. Therefore, it should be understood that such combinations and modifications are included within the scope of the present invention.

[0537] Furthermore, while the foregoing primarily describes embodiments, these embodiments are merely examples and do not limit the invention. Those skilled in the art will understand that numerous variations and applications not presented above can be made without departing from the essential characteristics of the embodiments. For example, each component specifically represented in the embodiments can be varied. Moreover, it should be understood that differences relating to such variations and applications are included within the scope of the invention as defined in the appended claims.

Claims

1. An optical path control component, comprising: A first substrate, wherein a first direction and a second direction are defined in the first substrate; The first electrode is disposed above the first substrate; A second substrate is disposed above the first substrate, wherein the first direction and the second direction are defined in the second substrate; The second electrode is disposed below the second substrate; as well as A light conversion unit is disposed between the first electrode and the second electrode. The second substrate and the second electrode include cut portions that pass through the second substrate and the second electrode. The cutting section includes: Cutting section 1-1 and cutting section 1-2 are configured to face each other in the second direction; Cutting portions 2-1 and 2-2 are configured to face each other in the first direction; and The opening region is formed by spacing the 1-2 cutting portion and the 2-2 cutting portion apart. A first sealing portion is provided on the 1-1 cutting portion and the 1-2 cutting portion, and a second sealing portion is provided inside the 2-1 cutting portion and the 2-2 cutting portion. The light conversion unit includes multiple partition walls, multiple receiving parts, and a base. The containment portion is provided with a light conversion material comprising light conversion particles and a dispersion liquid, and The light conversion material is in contact with at least one of the first sealing portion and the second sealing portion. The first substrate includes a first protrusion. The second substrate includes a second protrusion, and The optical path control component further includes a dam portion disposed on the second protrusion, the dam portion being composed of a material that controls the injection length of the optical conversion material when the optical conversion material is injected into the receiving portion.

2. The optical path control component according to claim 1, further comprising a buffer layer disposed between the second electrode and the optical conversion unit. At least one of the 1-1 cutting section, the 1-2 cutting section, the 2-1 cutting section, and the 2-2 cutting section passes through the buffer layer and the base section.

3. The optical path control component according to claim 2, further comprising an adhesive layer disposed between the first electrode and the optical conversion unit. in, At least one of the first sealing portion and the second sealing portion is configured to be in direct contact with the adhesive layer.

4. The optical path control component according to claim 1, wherein, The light conversion material of at least one of the plurality of accommodating portions is in contact with the first sealing portion, and The light conversion material of at least one of the plurality of accommodating portions is in contact with the first sealing portion and the second sealing portion.

5. The optical path control component according to claim 1, wherein, The receiving portion extends in a direction different from the second direction.

6. The optical path control component according to claim 1, wherein, The first electrode is exposed on the first protrusion. A third cut portion is formed in the second protrusion, passing through the second substrate and the second electrode, and An electrode connection portion that connects to the side surface of the second electrode is provided inside the third cutting portion.

7. The optical path control component according to claim 6, wherein, The dam section is located between the electrode connection section and the first sealing section.

8. The optical path control component according to claim 6, wherein, The electrode connection portion contains a material different from the material of at least one of the first electrode and the second electrode.

9. The optical path control component according to claim 7, further comprising an adhesive layer disposed between the first electrode and the optical conversion unit.

10. The optical path control component according to claim 9, wherein, An insulating layer is further provided between the electrode connection portion and the adhesive layer.

11. The optical path control component according to claim 1, wherein, A first mixing region is provided between the first sealing part and the dam part, the first mixing region containing both the material of the first sealing part and the material of the dam part.

12. The optical path control component according to claim 1, wherein, At least one of the plurality of accommodating portions includes a second mixing region, the second mixing region comprising both the light conversion material and the material of the second sealing portion.

13. The optical path control component according to claim 1, wherein, A third mixing region is included between the second sealing portion and the light conversion material, the third mixing region comprising both the light conversion material and the material of the second sealing portion.

14. The optical path control component according to claim 1, wherein, The depths of the 1-1 cutting section and the 1-2 cutting section are different from those of the 2-1 cutting section and the 2-2 cutting section.

15. The optical path control component according to claim 1, wherein, The lengths of the 2-1 cutting portion and the 2-2 cutting portion are different in the second direction.

16. The optical path control component according to claim 1, wherein, The 1-1 cutting section is connected to the 2-1 cutting section and the 2-2 cutting section. The 1-2 cutting section is connected to the 2-1 cutting section. The 2-1 cutting section is connected to the 1-1 cutting section and the 1-2 cutting section, and The 2-2 cutting section is connected to the 1-1 cutting section.

17. A display device, comprising: The panel includes at least one of a display panel and a touch panel; as well as The optical path control component according to claim 1, wherein the optical path control component is disposed above or below the panel.

18. The display device according to claim 17, wherein, The panel includes a backlight unit and a liquid crystal display panel. The optical path control component is disposed between the backlight unit and the liquid crystal display panel, and The light emitted from the backlight unit moves from the first substrate to the second substrate.

19. The display device according to claim 17, wherein, The panel includes an organic light-emitting diode panel. The optical path control component is disposed on the organic light-emitting diode panel, and The light emitted from the panel moves from the first substrate toward the second substrate.

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