Connection structure

Abstract

The connection structure (100) includes a circuit board (1), an insulating member (3), a housing (2), and a wire (4). The insulating member (3) includes a first portion (3a) and a second portion (3b). The first portion (3a) is fixed to the circuit board (1). The second portion (3b) faces the first portion (3a). The second portion (3b) is fixed to the housing (2). The housing (2) includes a grounded contact (21). The wire (4) electrically connects the circuit board (1) and the housing (2) in a state of being wound around the insulating member (3). The shortest distance along the surface of the housing (2) from the position where the wire (4) is connected to the housing (2) to the contact (21) is shorter than the shortest distance along the surface of the housing (2) from the second portion (3b) of the insulating member (3) to the contact (21).

Description

Technical Field

[0001] The present invention relates to a connection structure. Background Art

[0002] When a power converter such as a switching power supply is mounted on a circuit board, high-frequency noise current is generated due to the switching operation of the power converter. The high-frequency noise current is transmitted through a portion having a low high-frequency impedance. For example, the parasitic capacitance of the circuit board has a low high-frequency impedance. The circuit board is connected to a frame grounded for safety through a conductive connection member. Therefore, the high-frequency noise current flows out from the circuit board to the ground wire through the connection member and the frame. The high-frequency noise current flowing out to the ground wire deteriorates the electromagnetic compatibility of the electrical equipment as a common-mode current. In addition, since the high-frequency noise current flowing into the frame causes radiated noise, the electromagnetic compatibility of the electrical equipment is deteriorated.

[0003] For example, in the connection structure between a circuit board and a frame described in Japanese Patent Laid-Open No. 2003-133779 (Patent Document 1), the core material of the threaded member connecting the circuit board and the frame is an insulating material. In addition, the tap (thread tooth) of the threaded member has conductivity. Therefore, the connection structure between the circuit board and the frame has a high inductance component. The connection structure between the circuit board and the frame functions as an inductor that suppresses the high-frequency noise current flowing from the circuit board to the frame, and thus, unnecessary radiated noise (radiated noise) is reduced.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Patent Laid-Open No. 2003-133779 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] In the connection structure between the circuit board and the frame described in the above publication, a conductive tap (thread tooth) is fixed to the core material of the threaded member. Therefore, the connection portion of the connection structure with the frame is limited to the position where the threaded member is fixed to the frame. Therefore, when the position where the threaded member is fixed to the frame is separated from the ground wire, the distance that the high-frequency noise current flows along the surface of the frame becomes longer.

[0009] Means for Solving the Problems

[0010] The connection structure of the present invention includes a circuit board, an insulating member, a housing, and a wire. The insulating member includes a first part and a second part. The first part is fixed to the circuit board. The second part faces the first part. The second part is fixed to the housing. The housing includes a contact. The contact is grounded. The wire electrically connects the circuit board and the housing in a state of being wound around the insulating member. The shortest distance along the surface of the housing from the position where the wire is connected to the housing to the contact is shorter than the shortest distance along the surface of the housing from the second part of the insulating member to the contact.

[0011] Effect of the Invention

[0012] According to the connection structure of the present invention, the shortest distance along the surface of the housing from the position where the wire is connected to the housing to the contact is shorter than the shortest distance along the surface of the housing from the second part of the insulating member to the contact. Therefore, the distance that the high-frequency noise current flows along the surface of the housing can be shortened. Description of the Drawings

[0013] Figure 1 is a perspective view schematically showing the structure of the connection structure of Embodiment 1.

[0014] Figure 2 is Figure 1 a partial side view of the connection structure shown.

[0015] Figure 3 is a partial side view schematically showing the structure of the connection structure of Embodiment 2.

[0016] Figure 4 is a partial side view schematically showing the structure of the connection structure of Embodiment 3.

[0017] Figure 5 is a partial side view schematically showing the structure of the connection structure of Embodiment 4.

[0018] Figure 6 is a partial side view schematically showing the structure of the connection structure of Embodiment 5. Detailed Embodiments

[0019] Hereinafter, the embodiments will be described based on the drawings. In addition, the same or corresponding parts are denoted by the same reference numerals, and repeated descriptions will not be repeated.

[0020] Embodiment 1

[0021] Use Figure 1 and Figure 2 to describe the structure of the connection structure 100 of Embodiment 1.

[0022] As Figure 1As shown, the connection structure 100 includes a circuit board 1, a housing 2, an insulating member 3, and a wire 4. The circuit board 1 and the housing 2 are included in the internal structure of the electrical device. The electrical device is, for example, a power conversion device. The power conversion device is, for example, an uninterruptible power supply device, a large-capacity air conditioner, or the like. In the present embodiment, the circuit board 1 and the housing 2 face each other. The circuit board 1 may also be housed inside the housing 2.

[0023] A power converter 11 is mounted on the circuit board 1. The power converter 11 is, for example, a switching power supply. The power converter 11 includes a semiconductor element for power conversion (not shown). The semiconductor element for power conversion is, for example, a metal oxide semiconductor field effect transistor (MOSFET: Metal Oxide Semiconductor Field Effect Transistor) made of silicon (Si), etc. The power converter 11 is configured to convert the power supply voltage by using the switching function of the semiconductor element for power conversion. A radiator (not shown) configured to cool the semiconductor element for power conversion may also be further mounted on the circuit board 1.

[0024] The switching power supply is, for example, used as the power supply circuit of an uninterruptible power supply device. In the present embodiment, the uninterruptible power supply device includes a semiconductor element for power conversion. The circuit board 1 is, for example, used as the power supply circuit of a gate drive circuit configured to drive the semiconductor element for power conversion of the uninterruptible power supply device.

[0025] The housing 2 includes a contact 21. The contact 21 is grounded. The contact 21 is electrically connected to the ground wire EG. The ground wire EG is not necessarily arranged at a flat position where the circuit board 1 can be arranged. The ground wire EG may also be arranged, for example, on a column (not shown) of the housing 2. Therefore, the ground wire EG is not necessarily arranged at a position where the insulating member 3 can be fixed. The material of the housing 2 is, for example, metal. The housing 2 may also form the outer shape of the electrical device.

[0026] In addition, in Figure 1 , four insulating members 3 and four wires 4 are arranged between the circuit board 1 and the housing 2, but as long as at least one insulating member 3 and at least one wire 4 are arranged, it is okay. Other connection members may also be provided between the circuit board 1 and the housing 2. The number and position of the insulating members 3 and the wires 4 can be determined, for example, according to the circuit structure of the power converter 11 such as the switching power supply mounted on the circuit board 1. In Figure 2 , one insulating member 3 and one wire 4 are arranged between the circuit board 1 and the housing 2.

[0027] As Figure 2As shown, the insulating member 3 is clamped between the circuit board 1 and the housing 2. The insulating member 3 extends from the circuit board 1 toward the housing 2. The insulating member 3 extends along the axial direction. In the present embodiment, the axial direction of the insulating member 3 refers to the direction along the direction from the circuit board 1 toward the housing 2.

[0028] The insulating member 3 includes a first portion 3a and a second portion 3b. The first portion 3a is fixed to the circuit board 1. A first threaded hole 3c is provided in the first portion 3a. The first threaded hole 3c forms an internal thread. The second portion 3b faces the first portion 3a. The second portion 3b is fixed to the housing 2. A second threaded hole 3d is provided in the second portion 3b. The second threaded hole 3d forms an internal thread. The second portion 3b is fixed to the housing 2.

[0029] In the present embodiment, the insulating member 3 includes a groove G provided over the entire circumference of the outer periphery. The groove G is provided along the circumferential direction of the insulating member 3. In the present embodiment, a plurality of grooves G are arranged along the axial direction of the insulating member 3 in the insulating member 3.

[0030] The insulating member 3 is, for example, an insulator. The insulator may be a general-purpose product. In addition, in the present embodiment, the general-purpose product is a component that can be easily obtained by ordinary consumers.

[0031] The wire 4 electrically connects the circuit board 1 and the housing 2 in a state of being wound around the insulating member 3. The wire 4 is wound along the circumferential direction of the insulating member 3. In the present embodiment, the wire 4 is wound around the insulating member 3 along the groove G. The wire 4 is configured to be deformable.

[0032] The wire 4 includes a first end 4a and a second end 4b. The first end 4a is electrically connected to the circuit board 1. The first end 4a may be arranged separately from the first portion 3a. In the present embodiment, the first end 4a is arranged separately from the first portion 3a. The second end 4b is electrically connected to the housing 2. The second end 4b is arranged separately from the second portion 3b. The first end 4a and the second end 4b are not fixed to the insulating member 3.

[0033] The shortest distance along the surface of the housing 2 from the position where the wire 4 is connected to the housing 2 to the contact point 21 is shorter than the shortest distance along the surface of the housing 2 from the second portion 3b of the insulating member 3 to the contact point 21. In addition, the shortest distance along the surface of the housing 2 refers to the creepage distance of the housing 2. The shortest distance along the surface of the housing 2 from the second end 4b to the contact point 21 is shorter than the shortest distance along the surface of the housing 2 from the second portion 3b of the insulating member 3 to the contact point 21.

[0034] The wire 4 is wound around the outer periphery of the insulating member 3, and thus has a winding structure. Therefore, the wire 4 has a higher self-inductance than when it extends linearly between the circuit board 1 and the housing 2. Impedance is proportional to self-inductance. Therefore, the wire 4 has a higher high-frequency impedance than in the case of having a straight shape. In addition, in the present embodiment, the high-frequency impedance refers to the impedance in the high-frequency region. Thereby, it is possible to suppress the propagation of high-frequency noise current from the circuit board 1 to the housing 2 via the wire 4.

[0035] The connection structure 100 further includes a first fastening member 51, a second fastening member 52, a third fastening member 53, and a fourth fastening member 54. The circuit board 1 is provided with an internal thread configured to be threadedly engaged with the first fastening member 51 and an internal thread configured to be threadedly engaged with the third fastening member 53. The housing 2 is provided with an internal thread configured to be threadedly engaged with the second fastening member 52 and an internal thread configured to be threadedly engaged with the fourth fastening member 54.

[0036] The first fastening member 51 fixes the first part 3a to the circuit board 1. The first fastening member 51 is a first threaded member configured to be threadedly engaged with the first threaded hole 3c. The first threaded member is an external threaded member. The first threaded member may be a general-purpose product. The material of the first fastening member 51 is a magnetic material. The first fastening member 51 is, for example, an iron external threaded member. The first head 51H of the first fastening member 51 may also be exposed on the side opposite to the insulating member 3 with respect to the circuit board 1. The first head 51H may be exposed to the air. When the wire 4 is wound around the first fastening member 51, the self-impedance of the wire 4 increases, and thus the high-frequency impedance of the wire 4 increases. When the wire 4 is wound around the first fastening member 51, heat may be generated in the first fastening member 51 due to iron loss. The heat generated due to the iron loss of the first fastening member 51 can be cooled from the first head 51H. The heat generated due to the iron loss of the first fastening member 51 can be cooled by any one of natural air cooling and forced air cooling. Thereby, the quality of the connection structure 100 and the electrical device having the connection structure 100 can be improved.

[0037] The second fastening member 52 fixes the second part 3b to the housing 2. The second fastening member 52 is a second threaded member configured to be threadedly engaged with the second threaded hole 3d. The second threaded member is an external threaded member. The second threaded member may be a general-purpose product. The material of the second fastening member 52 is a magnetic material. The second fastening member 52 is, for example, an external threaded member. When the wire 4 is wound around the second fastening member 52, the self-impedance of the wire 4 increases, and thus the high-frequency impedance of the wire 4 increases. When the wire 4 is wound around the second fastening member 52, heat may be generated in the second fastening member 52 due to iron loss. The heat generated due to the iron loss of the second fastening member 52 can be dissipated to the housing 2. The heat dissipated to the housing 2 is dissipated to the outside of the housing 2. Thus, the second fastening member 52 is effectively cooled. Therefore, the quality of the connection structure 100 and the electrical device having the connection structure 100 can be improved.

[0038] The third fastening member 53 fixes the first end 4a to the circuit board 1. The third fastening member 53 is a third threaded member configured to be threadedly engaged with the internal thread provided on the circuit board 1. The third threaded member is an external threaded member. The third threaded member may be a general-purpose product. The material of the third fastening member 53 may be a magnetic material. The third fastening member 53 is, for example, an iron external threaded member.

[0039] The fourth fastening member 54 fixes the second end 4b to the housing 2. The fourth fastening member 54 is a fourth threaded member configured to be threadedly engaged with the internal thread provided on the housing 2. The fourth threaded member is an external threaded member. The fourth threaded member may be a general-purpose product. The material of the fourth fastening member 54 may be a magnetic material. The fourth fastening member 54 is, for example, an iron external threaded member.

[0040] Next, use Figure 2 to describe the high-frequency noise current flowing in the connection structure 100.

[0041] The circuit board 1 has a stray capacitance (parasitic capacitance) connected to the power conversion semiconductor element of the power converter 11. When a power conversion semiconductor element such as a metal-oxide-semiconductor field-effect transistor in the power converter 11 performs a switching operation, a sharp voltage change occurs. When the voltage change is applied to the stray capacitance, a high-frequency noise current is generated. The high-frequency noise current is proportional to the time change of the voltage and the stray capacitance value.

[0042] The high-frequency noise current selectively propagates in a portion having a low high-frequency impedance. Thus, the high-frequency noise current flows out from the power converter 11 such as a switching power supply to the outside. For example, the capacitance between the windings of a transformer in a switching power supply has a low high-frequency impedance. In addition, for example, the stray capacitance between the circuit patterns of the circuit board 1 has a low high-frequency impedance. In addition, for example, the stray capacitance between the power conversion semiconductor element and a radiator (not shown) has a low high-frequency impedance.

[0043] The high-frequency noise current flowing out from the power converter 11 reaches the wire 4 through a portion having a low high-frequency impedance. The high-frequency noise current can be propagated to the housing 2 via the wire 4. In order to suppress the propagation of the high-frequency noise current to the housing 2, it is necessary for the wire 4 to have a high high-frequency impedance. In the present embodiment, since the wire 4 is wound around the insulating member 3, the wire 4 has a high high-frequency impedance.

[0044] Next, the operation and effect of the present embodiment will be described.

[0045] According to the connection structure 100 of Embodiment 1, as Figure 2 shown, the shortest distance along the surface of the housing 2 from the position where the wire 4 is connected to the housing 2 to the contact point 21 is shorter than the shortest distance along the surface of the housing 2 from the second portion 3b of the insulating member 3 to the contact point 21. Therefore, compared with the case where the wire 4 is fixed to the housing 2 at the position of the insulating member 3, the distance that the high-frequency noise current flows on the surface of the housing 2 can be shortened.

[0046] Thereby, the circulation of the high-frequency noise current inside the housing 2 can be suppressed. Assuming that the high-frequency noise current circulates inside the housing 2, since a current loop is formed, radiated noise is generated. According to the connection structure 100 of the present embodiment, the circulation of the high-frequency noise current inside the housing 2 can be suppressed, so that the generation of radiated noise can be suppressed. Therefore, the electromagnetic environment compatibility (EMC: Electromagnetic Compatibility) of the electrical device having the connection structure 100 is improved.

[0047] As Figure 2 shown, the connection structure 100 further includes a first fastening member 51, a second fastening member 52, a third fastening member 53, and a fourth fastening member 54. Therefore, the circuit board 1, the housing 2, the insulating member 3, and the wire 4 can be fixed by the fastening members.

[0048] As Figure 2 shown, the first fastening member 51 is a first threaded member configured to be threadedly engaged with the first threaded hole 3c. The second fastening member 52 is a second threaded member configured to be threadedly engaged with the second threaded hole 3d. The first threaded member and the second threaded member are external threaded members. Therefore, the first fastening member 51 and the second fastening member 52 can use off-the-shelf external threaded members. In addition, the insulating member 3 can use an off-the-shelf insulator. Therefore, compared with the case where the connection structure 100 includes conductive thread teeth, an insulating core material, and a conductive tap spirally wound around the core material, the manufacturing cost of the connection structure 100 can be reduced.

[0049] As Figure 2As shown, the insulating member 3 includes a groove G provided throughout the entire circumference of the outer periphery. Therefore, the creepage distance of the insulating member 3 is longer than the case where the groove G is not provided on the insulating member 3. Therefore, it is possible to suppress the high-frequency noise current from propagating from the circuit board 1 to the housing 2 along the surface of the insulating member 3. Therefore, the generation of radiated noise can be suppressed.

[0050] As Figure 2 shown, the wire 4 is configured to be deformable. Therefore, the position where the circuit board 1 is electrically connected to the housing 2 is not limited to the position of the insulating member 3. Therefore, the degree of freedom in design is improved.

[0051] Embodiment 2

[0052] Next, the structure of the connection structure 100 of Embodiment 2 will be described using Figure 3 . Unless otherwise specified, Embodiment 2 has the same structure and effects as those of the above-described Embodiment 1. Therefore, the same reference numerals are given to the same structures as those of the above-described Embodiment 1, and the description will not be repeated.

[0053] As Figure 3 shown, the wire 4 of the present embodiment is wound around the groove G in multiple layers. The wire 4 is wound around the groove G in the circumferential direction of the insulating member 3 in multiple layers. The wire 4 is wound, for example, in three layers along the circumferential direction of the insulating member of the groove G. The wire 4 forms a winding structure in which multiple layers overlap.

[0054] Next, the effects of the present embodiment will be described.

[0055] According to the connection structure 100 of Embodiment 2, as Figure 3 shown, the wire 4 is wound around the groove G in multiple layers. Therefore, the wire 4 has a higher self-inductance than the case where it is wound around the groove G in a single layer. Therefore, the wire 4 has a higher high-frequency impedance than the case where it is wound around the groove G in a single layer. Therefore, it is possible to suppress the high-frequency noise current from flowing from the circuit board 1 to the housing 2 via the wire 4. As a result, the electromagnetic environment compatibility of the electrical device having the connection structure 100 is improved.

[0056] As Figure 3As shown, the wire 4 is wound around the groove G in multiple layers. Therefore, it is possible to wind the wire 4 having a stable potential close to that of the ground wire EG around the insulating member 3 in multiple layers. Therefore, it is possible to suppress high-frequency noise current generated due to the stray capacitance of the portion of the wire 4 connected to the housing 2 and the second fastening member 52. In addition, the potential of the circuit board 1 may shift, for example, due to potential fluctuations during the switching operation of the power converter 11 such as a switching power supply. However, the stray capacitance of the portion of the wire 4 connected to the circuit board 1 and the first fastening member 51 is smaller than the stray capacitance of the portion of the wire 4 connected to the housing 2 and the second fastening member 52. Therefore, the impedance of the portion of the wire 4 connected to the circuit board 1 and the first fastening member 51 is higher than the impedance of the portion of the wire 4 connected to the housing 2 and the second fastening member 52. Therefore, it is possible to suppress the generation of high-frequency noise current in the circuit board 1. Therefore, the electromagnetic environment compatibility of the electrical device having the connection structure 100 is improved.

[0057] Embodiment 3

[0058] Next, use Figure 4 to describe the structure of the connection structure 100 of Embodiment 3. Unless otherwise specified, Embodiment 3 has the same structure and effects as those of the above-described Embodiment 1. Therefore, the same reference numerals are given to the same structures as those of the above-described Embodiment 1, and the description will not be repeated.

[0059] As Figure 4 shown, the connection structure 100 of the present embodiment further includes at least one coupling body 6. The insulating member 3 includes a plurality of insulating portions 30. The plurality of insulating portions 30 are stacked from the circuit board 1 toward the housing 2. The plurality of insulating portions 30 are stacked along the axial direction of the insulating member 3. The plurality of insulating portions 30 are arranged in series. Adjacent insulating portions 30 among the plurality of insulating portions 30 are connected to each other by at least one coupling body 6. Each of the plurality of insulating portions 30 is, for example, a commercially available insulator.

[0060] Each of the plurality of insulating portions 30 includes a plurality of grooves G provided over the entire circumference of the outer periphery. The plurality of insulating portions 30 may also have the same structure as each other.

[0061] In the present embodiment, the plurality of insulating portions 30 include a first insulating portion 31, a central insulating portion 32, and a second insulating portion 33. The first insulating portion 31, the central insulating portion 32, and the second insulating portion 33 are stacked in this order from the circuit board 1 toward the housing 2. The first insulating portion 31 is fixed to the circuit board 1. The first insulating portion 31 is connected to the central insulating portion 32 by the coupling body 6. The central insulating portion 32 is sandwiched between the first insulating portion 31 and the second insulating portion 33. The second insulating portion 33 is fixed to the housing 2. The second insulating portion 33 is connected to the central insulating portion 32 by the coupling body 6. The first portion 3a is disposed on the first insulating portion 31. The second portion 3b is disposed on the second insulating portion 33.

[0062] At least one coupling body 6 is disposed inside a plurality of insulating portions 30. The coupling body 6 connects adjacent insulating portions 30 to each other. The coupling body 6 is inserted across adjacent insulating portions 30. The coupling body 6 extends along the axial direction of the insulating member 3 inside adjacent insulating portions 30. Further, in the present embodiment, since three insulating portions 30 are provided, two coupling bodies 6 are provided.

[0063] At least one coupling body 6 is a magnetic body. The coupling body 6 may be a general-purpose product. The coupling body 6 may be, for example, an iron external thread member. The material of the coupling body 6 may also be ferrite or the like which is a ferromagnetic body.

[0064] The wire 4 is wound around a plurality of insulating portions 30 around at least one coupling body 6. The wire 4 is wound around a plurality of insulating portions 30 across the plurality of insulating portions 30. The wire 4 is wound in each of a plurality of grooves G respectively provided in the plurality of insulating portions 30.

[0065] In addition, in Figure 4 , the winding is wound in a single layer on the insulating portion 30, but the winding method of the wire 4 is not limited to a single layer. As will be described later in Embodiment 4 and Embodiment 5, the wire 4 may also be wound in multiple layers.

[0066] Next, the effects of the present embodiment will be described.

[0067] According to the connection structure 100 of Embodiment 3, as Figure 4 shown, the insulating member 3 includes a plurality of insulating portions 30. The plurality of insulating portions 30 are stacked from the circuit board 1 toward the housing 2. Therefore, compared with the case where the insulating member 3 is composed of only one member, the axial dimension of the insulating member 3 can be easily changed. Thereby, the distance between the circuit board 1 and the housing 2 can be easily changed, and thus the design freedom of the connection structure 100 is improved.

[0068] As Figure 4 shown, the insulating member 3 includes a plurality of insulating portions 30. Each of the plurality of insulating portions 30 may be an insulator as a general-purpose product. Therefore, the manufacturing cost of the connection structure 100 can be reduced.

[0069] As Figure 4 shown, the connection structure 100 includes at least one coupling body 6. The coupling body 6 is a magnetic body. The wire 4 is wound around a plurality of insulating portions 30 around at least one coupling body 6. Therefore, the coupling body 6 is surrounded by a winding structure formed by the wire 4. Thereby, the coupling body 6 adds a magnetic path inside the winding structure. Therefore, the self-impedance of the wire 4 increases. Therefore, it is possible to suppress high-frequency noise current from flowing from the circuit board 1 to the housing 2 via the wire 4. Thereby, the electromagnetic environment compatibility of the electrical device having the connection structure 100 is improved.

[0070] Embodiment 4

[0071] Next, use Figure 5 to describe the structure of the connection structure 100 of Embodiment 4. Unless otherwise specified, Embodiment 4 has the same structure and effects as Embodiment 3 described above. Therefore, the same reference numerals are assigned to the same structures as those in Embodiment 3 described above, and the description will not be repeated.

[0072] As Figure 5 shown, in the present embodiment, the wire 4 is wound in multiple layers around at least one of the plurality of insulating portions 30. The wire 4 is wound in multiple layers around the groove G of at least one insulating portion 30 among the plurality of insulating portions 30. The winding density of the wire 4 around the insulating portion 30 can be adjusted as appropriate.

[0073] The winding density of the wire 4 around the central insulating portion 32 can be higher than the winding density of the wire 4 around the first insulating portion 31 and the winding density of the wire 4 around the second insulating portion 33. The wire 4 can be wound around the central insulating portion 32 by concentrated winding. In the present embodiment, the wire 4 being wound around the central insulating portion 32 by concentrated winding means that the wire 4 is wound more around the central insulating portion 32 than around the first insulating portion 31 and the second insulating portion 33. The wire 4 can also be wound around the insulating portion 30 disposed at the center in the axial direction of the insulating member 3 among the plurality of insulating portions 30 by concentrated winding.

[0074] Next, the effects of the present embodiment will be described.

[0075] According to the connection structure 100 of Embodiment 4, as Figure 5 shown, the wire 4 is wound in multiple layers around at least one of the plurality of insulating portions 30. Therefore, the winding density of the wire 4 around the insulating portion 30 can be adjusted as appropriate. Therefore, the wire 4 can be wound around the insulating portion 30 disposed at the center in the axial direction of the insulating member 3 among the plurality of insulating portions 30 by concentrated winding. The insulating portion 30 disposed at the center in the axial direction of the insulating member 3 has higher workability than the insulating portions 30 disposed at the ends in the axial direction of the insulating member 3. Thereby, the workability of winding the wire 4 around the insulating portion 30 is improved, and thus the assemblability of the connection structure 100 is improved. Therefore, the manufacturing cost of the connection structure 100 can be reduced.

[0076] Embodiment 5

[0077] Next, use Figure 6 to describe the structure of the connection structure 100 of Embodiment 5. Unless otherwise specified, Embodiment 5 has the same structure and effects as Embodiment 3 described above. Therefore, the same reference numerals are assigned to the same structures as those in Embodiment 3 described above, and the description will not be repeated.

[0078] As Figure 6As shown, the wire 4 of the present embodiment is wound around at least one coupling body 6 in multiple layers around a plurality of insulating portions 30. The wire 4 is wound around at least one coupling body 6 in multiple layers along the circumferential direction of the plurality of insulating portions 30 around the plurality of insulating portions 30.

[0079] Next, the effects of the present embodiment will be described.

[0080] According to the connection structure 100 of Embodiment 5, the wire 4 is wound around at least one coupling body 6 in multiple layers around a plurality of insulating portions 30. Therefore, the leakage magnetic flux generated from the wire 4 is concentrated around the coupling body 6. Therefore, the leakage magnetic flux generated from the wire 4 forms a magnetic flux loop around the coupling body 6. Assuming that the magnetic flux loop reaches the circuit board 1, since it may cause malfunction of unillustrated electronic components mounted on the circuit board 1, malfunctions may occur in the electrical device incorporating the circuit board 1. According to the present embodiment, since the magnetic flux loop of the leakage magnetic flux is formed around the coupling body 6, it is possible to suppress the magnetic flux loop from reaching the circuit board 1. Therefore, malfunction of the circuit board 1 can be suppressed. Therefore, the reliability of the electrical device having the circuit board 1 with the connection structure 100 is improved.

[0081] The embodiments disclosed herein should be considered illustrative in all respects and not restrictive. The scope of the present disclosure is represented by the claims rather than the above description, and includes all modifications within the meaning and scope equivalent to the claims.

[0082] Description of Reference Numerals

[0083] 1 Circuit board, 2 Housing, 3 Insulating member, 3a First portion, 3b Second portion, 4 Wire, 4a First end, 4b Second end, 6 Coupling body, 21 Contact point, 30 Insulating portion, 51 First fastening member, 52 Second fastening member, 53 Third fastening member, 54 Fourth fastening member, 100 Connection structure, G Groove.

Claims

1. A connection structure, wherein, Comprising: A circuit board; An insulating member including a first portion fixed to the circuit board and a second portion facing the first portion; A housing that fixes the second portion and includes a grounded contact point; And A wire that electrically connects the circuit board and the housing in a state of being wound around the insulating member, The shortest distance along the surface of the housing from the position where the wire is connected to the housing to the contact point is shorter than the shortest distance along the surface of the housing from the second portion of the insulating member to the contact point.

2. The connection structure according to claim 1, wherein, The connection structure further comprises: A first fastening member; A second fastening member; A third fastening member; and A fourth fastening member, The wire includes a first end electrically connected to the circuit board and a second end electrically connected to the housing, The first fastening member fixes the first portion and the circuit board, The second fastening member fixes the second portion and the housing, The third fastening member fixes the first end and the circuit board, The fourth fastening member fixes the second end and the housing.

3. The connection structure according to claim 2, wherein, A first threaded hole is provided in the first portion, A second threaded hole is provided in the second portion, The first fastening member is a first threaded member configured to be threadedly engaged with the first threaded hole, The second fastening member is a second threaded member configured to be threadedly engaged with the second threaded hole.

4. The connection structure according to any one of claims 1 to 3, wherein, The insulating member includes a groove provided throughout the entire circumference of the outer periphery, The wire is wound around the insulating member along the groove.

5. The connection structure according to claim 4, wherein, The wire is wound in multiple layers along the groove.

6. The connection structure according to any one of claims 1 to 3, wherein, The connection structure further comprises at least one bonding body as a magnetic body, The insulating member includes a plurality of insulating portions laminated from the circuit board toward the housing, The at least one bonding body is disposed inside the plurality of insulating portions, Adjacent insulating portions among the plurality of insulating portions are connected to each other by the at least one bonding body, The wire is wound around the plurality of insulating portions around the at least one bonding body.

7. The connection structure according to claim 6, wherein, The wire is wound in multiple layers around at least one of the plurality of insulating portions.

8. The connection structure according to claim 6, wherein, The wire is wound in multiple layers around the plurality of insulating portions around the at least one bonding body.

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