A transfer and tipping machine for a material tray

Abstract

The present invention discloses a transfer and turnover machine for a material tray. Its manipulator is located at the middle position of the structure, and an input table, an output table, a turnover mechanism, a line scanning mechanism and a placement rack are distributed around the manipulator. The manipulator transfers the fine-tuning tray with chips to the input table, the line scanning mechanism, the turnover mechanism and the placement rack; the manipulator transfers the material loading tray to the output table and the turnover mechanism, the line scanning mechanism performs line scanning on the chips, the turnover mechanism turns over the chips and transfers the fine-tuning tray to the material loading tray, and the placement rack temporarily stores the material tray. Overall, the detection, turning over and transfer of the chips are completed through automated transfer, ensuring the yield of chip processing.

Description

Technical Field

[0001] The present invention relates to the field of new energy vehicle chip manufacturing, and in particular to a material tray transfer and turning machine. Background Art

[0002] A large number of chips will be used for electrical control in new energy vehicles. In order to improve the level of automated manufacturing, the current chip production line has begun to realize unmanned automatic conveying and processing through each processing station with robots, transfer equipment, etc., so as to improve production efficiency and liberate labor. The front and back sides of the chip need to be spot welded to complete the connection of some components and circuits. After the chip placed on the material tray completes the spot welding of one side in the previous process, it needs to be turned over and transferred to another material tray and sent to the next process for spot welding on the other side. This requires a transfer and turning mechanism to complete the automatic transfer, replacing manual adaptation of the entire production line for efficient transfer. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a material tray transfer and turning machine, which can complete the transfer of two material trays through structural design, complete the detection of chips on the material trays and turn over the chips, thereby replacing manual accurate turning of chips and taking over the previous and subsequent processes for efficient automated processing.

[0004] The present invention adopts the following technical scheme: a material tray transfer and turning machine, comprising an input table, an output table, a manipulator, a turning mechanism, a line scanning mechanism and a placement rack, the manipulator is located in the middle of the structure, and the input table, the output table, the turning mechanism, the line scanning mechanism and the placement rack are distributed around the manipulator, the input table is used to place the fine-tuning tray with chips delivered from the previous process, the manipulator is used to clamp the fine-tuning tray at the input table and send it to the line scanning mechanism for line scanning of the chips, the fine-tuning tray with qualified line scanning is sent to the turning mechanism by the manipulator, and the fine-tuning tray with unqualified line scanning is sent to the turning mechanism by the machine The robot sends it to the placement rack; the turning mechanism includes a flipping mechanism and a receiving mechanism arranged above and below, the flipping mechanism is used to receive the fine-tuning disk and rotate it to turn it over so that the chip faces downward, the robot places the loading tray at the receiving mechanism, and raises the loading tray to contact the fine-tuning disk to generate vibration, so that the chip falls to the loading tray for transportation; the robot clamps the loading tray with chips at the receiving mechanism and sends it to the output table; the output table is provided with multiple placement positions for the input and output placement of the loading tray, and the placement rack is provided with multiple placement positions for the temporary storage of the fine-tuning trays that fail the line scan and the temporary storage of the fine-tuning trays at the input table.

[0005] As an improvement, the turnover mechanism further includes a base and a vertical frame. The material receiving mechanism is arranged on the base, and the turnover mechanism is arranged on the vertical frame. The turnover mechanism includes a turnover frame, a lower clamp body, an upper clamp body, and a first driving cylinder. There are two sets of vertical frames which are installed on the base. The upper part of the two sets of vertical frames rotatably arranges the turnover frame. The turnover frame is connected to a rotating cylinder for rotation control. A material discharging hole is vertically penetrated through the middle of the turnover frame. A pair of upper clamp bodies and a pair of lower clamp bodies are arranged on the opposite sides of the material discharging hole. A pair of lower clamp bodies are controlled by their respective first driving cylinders at the lower two sides to open or close to change the working position, and form a supporting surface for placing the fine adjustment plate when closed. A pair of upper clamp bodies are controlled by their respective first driving cylinders at the upper two sides to open or close to change the working position, and cooperate with the lower clamp bodies to clamp the fine adjustment plate when closed. When the turnover frame rotates 180 degrees, the upper clamp body and the lower clamp body exchange positions, and at the same time, the upper clamp body and the lower clamp body exchange functions. The material receiving mechanism includes a second supporting part, a second clamping part, a lifting cylinder, and a second driving cylinder. A layout hole is vertically penetrated through the position corresponding to the lower part of the turnover frame on the base. The second supporting part is arranged at the layout hole. The second supporting part is controlled by the lifting cylinder arranged at the lower part for lifting. A pair of second clamping parts are arranged on both sides of the second supporting part. A pair of second clamping parts are controlled by their respective second driving cylinders to open or close to change the working position, and cooperate with the second supporting part to clamp the material loading tray when closed. When the turnover frame rotates 180 degrees, the chip on the fine adjustment plate is turned downward towards the lower material loading tray. When the lower second supporting part rises to the position where the second clamping part abuts against the fine adjustment plate, an impact is generated on the fine adjustment plate, causing the chip to fall onto the material loading tray.

[0006] As an improvement, grooves are arranged on the surfaces of the upper clamp body, the lower clamp body and the fine adjustment plate in contact. The edges of the grooves are adapted to the edges of the fine adjustment plate for cooperative limiting during placement or clamping. The upper clamp body and the lower clamp body both include clamp blocks arranged symmetrically left and right. A gap is formed between the left and right clamp blocks. The corners of the fine adjustment plate are placed or clamped at the clamp blocks.

[0007] As an improvement, the upper clamp body, the lower clamp body and the first driving cylinder are arranged at positions close to the rotation axis of the turnover frame front and back, so that the left and right positions of the turnover frame are open for external mechanisms to move and pick up the fine adjustment plate. The second clamping part is arranged on the left and right sides of the second supporting part, so as to be staggered with the positions of the upper clamp body and the lower clamp body.

[0008] As an improvement, the second supporting part is a platform. A number of convex columns for positioning the material loading tray are arranged on the surface of the platform. The second clamping part is a clamping piece. The platform is installed on an installation frame. The clamping piece is hinged to the installation frame and is located on both sides of the platform. The second driving cylinder is installed on the bottom surface of the installation frame and is hinged to the clamping piece. The lifting cylinder is installed at the lower part of the base and is connected to the installation frame.

[0009] As an improvement, a rubber part is arranged on the clamping piece. The rubber part is used to abut against the material loading tray for limiting and relieving the impact.

[0010] As an improvement, the placement rack includes vertical racks on both sides and a horizontal rack disposed between the vertical racks on both sides. A plurality of placement slots for placing fine-tuning disks are horizontally arranged on the horizontal rack. A cavity is provided at the bottom of the placement slot, and a sensor for detecting whether a fine-tuning disk is stored in the placement slot is disposed in the cavity. A wire groove runs horizontally through the bottoms of a plurality of placement slots, and the wire groove communicates with the cavity. The wires of the sensors lead to both sides through the wire groove.

[0011] As an improvement, through holes are formed in the vertical racks, and the through holes correspond to the wire grooves for the wires to pass through. A wiring rack is further installed on the outer side of the vertical rack, and the wiring rack allows the wires to run downward along the wiring rack.

[0012] As an improvement, the placement rack further includes a spare rack. The spare rack is disposed between the vertical racks on both sides and below the horizontal rack. A plurality of placement positions for placing loading trays are horizontally arranged on the spare rack. The placement positions correspond one-to-one with the placement slots above. Each placement position is provided with a column for positioning the loading tray; a cavity is provided above the placement position, and a sensor for detecting whether a loading tray is stored in the placement position is disposed in the cavity. A wire groove runs horizontally through a plurality of placement positions, and the wire groove communicates with the cavity. The wires of the sensors lead to both sides through the wire groove, and through holes corresponding to the wire grooves at the placement positions are formed in the vertical racks for the wires to pass through to the wiring rack for wiring.

[0013] Advantages of the present invention: The transfer of two material trays and the chips thereon is completed by relying on a manipulator, the detection of the completion degree of chip spot welding is completed at the online scanning mechanism, and the turning over and transfer of the chips are completed at the turning mechanism; the material trays are temporarily stored and manually reworked through the placement rack, ensuring the yield of chip processing while automatically detecting and transporting. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a three-dimensional structural schematic diagram of the present invention.

[0015] Figure 2 is a three-dimensional structural schematic diagram of the turning mechanism of the present invention with a material tray.

[0016] Figure 3 is a three-dimensional structural schematic diagram of the turning mechanism of the present invention without a material tray.

[0017] Figure 4 is a three-dimensional structural schematic diagram of the turning mechanism of the present invention.

[0018] Figure 5 is a three-dimensional structural schematic diagram of the material receiving mechanism of the present invention.

[0019] Figure 6 is a three-dimensional structural schematic diagram of the front of the placement rack of the present invention.

[0020] Figure 7 It is a schematic three-dimensional structure diagram of the back of the placement rack of the present invention.

[0021] Figure 8 It is a schematic three-dimensional structure diagram of the line scanning mechanism of the present invention. Detailed implementation manners

[0022] The following will make a detailed description of specific embodiments of the present invention with reference to the accompanying drawings.

[0023] As Figure 1 、 2 、3, 4, 5, 6, 7, 8 show a specific embodiment of the transfer and turnover machine of the material tray of the present invention. This embodiment includes an input table 1, an output table 2, a manipulator 3, a turnover mechanism 0, a line scanning mechanism 4, and a placement rack 51. The manipulator 3 is located at the middle position of the structure, and distributes the input table 1, the output table 2, the turnover mechanism 0, the line scanning mechanism 4, and the placement rack 51 around the manipulator 3. The input table 1 is used to place the trimming trays with chips conveyed from the previous process. The manipulator 3 is used to clamp the trimming tray at the input table 1 and send it to the line scanning mechanism 4 for line scanning of the chips. The trimming trays with qualified line scanning are sent to the turnover mechanism 0 by the manipulator 3, and the trimming trays with unqualified line scanning are sent to the placement rack 51 by the manipulator 3; the turnover mechanism 0 includes a flipping mechanism 04 and a receiving mechanism 03 arranged up and down. The flipping mechanism 04 is used to receive the trimming tray and rotate it to turn the chip downward. A carrier tray is placed at the receiving mechanism 03 by the manipulator 3, and the carrier tray is lifted to abut against the trimming tray to generate vibration, so that the chips fall onto the carrier tray for transfer; the manipulator 3 clamps and sends the carrier tray with chips at the receiving mechanism 03 to the output table 2; the output table 2 is provided with multiple placement positions for input and output placement of the carrier trays, and the placement rack 51 is provided with multiple placement positions for temporarily storing the trimming trays with unqualified line scanning and temporarily storing the trimming trays at the input table 1.

[0024] When the present invention is in use, refer to Figure 1, a manipulator 3 for clamping the fine-tuning tray and the loading tray is arranged in the middle of the device. Around the manipulator 3, the turning mechanism 0, the input table 1, the line scanning mechanism 4, the placing rack 51 and the output table 2 of the present invention are arranged. The fine-tuning tray carrying the chips is placed on the input table 1 from the previous process. The manipulator 3 clamps the fine-tuning tray to the line scanning mechanism 4 to perform line scanning to determine whether all the spot welding positions on the chips are completed. At the same time, the manipulator 3 clamps an empty loading tray from the output table 2 to the material receiving mechanism 03. After the line scanning mechanism 4 detects that the chips are correct, the manipulator 3 transfers the fine-tuning tray to the turning mechanism 04, and the turning mechanism 04 turns the fine-tuning tray so that the chips face down. The material receiving mechanism 03 drives the loading tray to rise and vibrates the turning mechanism 04, so that the chips fall onto the loading tray to complete the transfer. The chips can be sent to the subsequent process for reverse processing after being turned over. After that, the manipulator 3 successively clamps the loading tray at the material receiving mechanism 03 to the output table 2 and clamps the fine-tuning tray at the turning mechanism 04 to the output table 2. During the whole process, it is possible that the line scanning mechanism 4 detects that not all the spot welding positions on the chips are completed, which may be due to missed welding during the previous processing. The manipulator 3 can send the fine-tuning tray carrying the chips to the placing rack 51 for manual repair welding. After the repair welding is completed, the manipulator 3 grabs it and re-enters the overall process. On the other hand, when the line scanning mechanism 4 has not completed the line scanning detection of the chips on the fine-tuning tray, the fine-tuning tray on the input table 1 can be sent to the placing rack 51 for temporary storage first, without affecting the delivery of the subsequent material tray at the corresponding station.

[0025] As a specific implementation of the improvement, the turnover mechanism 0 further includes a base 01 and a vertical frame 02. The material receiving mechanism 03 is arranged on the base 01, and the turnover mechanism 04 is arranged on the vertical frame 02. The turnover mechanism 04 includes a turnover frame 041, a lower clamp body 042, an upper clamp body 043, and a first driving cylinder 044. There are two groups of vertical frames 02 which are installed on the base 01. The upper part of the two groups of vertical frames 02 rotatably arranges the turnover frame 041. The turnover frame 041 is connected to a rotary cylinder 040 for rotation control. A material placing hole 045 is vertically penetrated through the middle of the turnover frame 041. A pair of upper clamp bodies 043 and a pair of lower clamp bodies 042 are arranged on the two opposite sides of the material placing hole 045. A pair of lower clamp bodies 042 are controlled by their respective first driving cylinders 044 at the lower two sides to open or close to change the working position, and form a supporting surface for placing the fine adjustment plate when closed. A pair of upper clamp bodies 043 are controlled by their respective first driving cylinders 044 at the upper two sides to open or close to change the working position, and cooperate with the lower clamp bodies 042 to clamp the fine adjustment plate when closed. When the turnover frame 041 rotates 180 degrees, the upper clamp body 043 and the lower clamp body 042 exchange positions, and at the same time, the upper clamp body 043 and the lower clamp body 042 exchange functions. The material receiving mechanism 03 includes a second supporting part 031, a second clamping part 032, a lifting cylinder 033, and a second driving cylinder 034. A layout hole 035 is vertically penetrated through the position corresponding to the lower part of the turnover frame 041 on the base 01. The second supporting part 031 is arranged at the layout hole 035. The second supporting part 031 is controlled by the lifting cylinder 033 arranged at the lower part for lifting. A pair of second clamping parts 032 are arranged on the two sides of the second supporting part 031. A pair of second clamping parts 032 are controlled by their respective second driving cylinders 034 to open or close to change the working position, and cooperate with the second supporting part 031 to clamp the loading tray when closed. When the turnover frame 041 rotates 180 degrees, the chip on the fine adjustment plate is turned downward towards the lower loading tray. When the lower second supporting part 031 rises to the position where the second clamping part 032 abuts against the fine adjustment plate, an impact is generated on the fine adjustment plate, so that the chip falls onto the loading tray.

[0026] As Figure 2 , 3As shown in Figures 4 and 5, the specific vertical frame 02 allows the flip mechanism 04 to form a certain height, which is convenient for the arrangement of the material receiving mechanism 03 below and the manipulator 3 to reach in and pick up and place the loading tray. The flip frame 041 is arranged on the vertical frame 02 through an axis structure for rotation. The axis structure is connected to the rotary cylinder 040 through a connecting shaft. The rotary cylinder 040 rotates the flip frame 041 180 degrees. The discharge hole 045 is set larger than the fine-tuning disk and leaves enough space for the gripper of the manipulator 3 to reach in and complete the pick-up and placement of the fine-tuning disk; a pair of upper clamps 043 and a pair of lower clamps 042 do not strictly limit their upper and lower relationships through their names. It can be understood that when the flip frame 041 is flipped, the lower clamp 042 is at the bottom, and the upper clamp 043 is at the top, that is, the functions are interchanged after the positions are interchanged. During specific implementation, the pair of lower clamps 042 below are adjusted to the closing position by the first driving cylinder 044, and the pair of upper clamps 043 are initially in the opening position, and the pair of lower clamps 042 form supporting surfaces on both sides for the fine-tuning disk to be placed; after the manipulator 3 places the fine-tuning disk on the pair of lower clamps 042, the first driving cylinder 044 adjusts the pair of upper clamps 043 to the closing position, and then the upper and lower clamps clamp the fine-tuning disk, and then the flip frame 041 completes a 180-degree rotation, so that the chip faces downward, and the chip on the fine-tuning disk and the fine-tuning disk are structurally locked and limited through the hole-axis mechanism, and the chip is not It will not fall by itself when subjected to external force; the second support part 031 at the material receiving mechanism 03 forms a support surface for the material carrier to be placed. After the manipulator 3 places the material carrier on the second support part 031, the second driving cylinder 034 adjusts the second clamping part 032 to the closing position, and then the second support part 031 and the second clamping part 032 clamp the material carrier, and then the lifting cylinder 033 lifts the material carrier. When it rises to the right position, the second clamping part 032 vibrates on both sides against the fine-tuning disk, and the chip is separated from the fine-tuning disk and falls to the material carrier by the external force, thereby completing the flipping transfer of the chip. The flipping mechanism 0 facilitates the automatic flipping of the chip after the spot welding detection is completed in the equipment, and then it is transported to the subsequent station for further processing on the reverse side, freeing up labor and improving processing efficiency. After the material receiving mechanism 03 completes the transfer of the chip, the flip frame 041 does not need to be rotated and reset. The upper and lower clamps that have exchanged positions are adjusted to the open position through a pair of upper clamps located above. The robot arm 3 can then take the fine-tuning disk away from above, and then the next fine-tuning disk can be operated, thereby simplifying the movement of the flip frame 041 and improving the operating efficiency of the mechanism.

[0027] As an improved specific implementation method, grooves 046 are provided on the surfaces of the upper clamp body 043 and the lower clamp body 042 that are in contact with the fine-tuning disk, and the edges of the grooves 046 are adapted to the edges of the fine-tuning disk for matching and limiting when placed or clamped; the upper clamp body 043 and the lower clamp body 042 both include clamping blocks 047 that are symmetrically arranged on the left and right, and a gap is formed between the left and right clamping blocks 047, and the corners of the fine-tuning disk are placed or clamped at the clamping blocks 047.

[0028] like Figure 3 As shown, the setting of the groove 046 makes the limit of the fine-tuning disk more stable. The pair of upper clamps 043 and the pair of lower clamps 042 on both sides can complete the clamping from the top and bottom by relying on the corresponding fine-tuning disk that is stable with the groove 046. The fine-tuning disk will not be displaced during the rotation process, ensuring the accuracy of the upper and lower positions of the chip after flipping, and can accurately correspond to the loading disk below. The clamping blocks 047 arranged symmetrically on the left and right are used for placing or clamping the corners of the fine-tuning disk. Reducing the contact area with the fine-tuning disk does not affect the stability of placement or clamping. The small-area clamping blocks 047 are more conducive to ensuring the plane accuracy of manufacturing, making the placement and clamping smooth, and avoiding the unevenness problem that may be caused when the entire large plane contacts the fine-tuning disk.

[0029] As an improved specific implementation method, the upper clamp body 043, the lower clamp body 042 and the first driving cylinder 044 are arranged at the front and rear positions close to the rotation axis of the flip frame 041, so that the left and right positions of the flip frame 041 are open for an external mechanism to movably take and place the fine-tuning disk; the second clamping portion 032 is arranged on the left and right sides of the second support portion 031, so as to be staggered with the positions of the upper clamp body 043 and the lower clamp body 042.

[0030] like Figure 1 , 2 As shown in Figures 3, 4, and 5, the upper clamp body 043, the lower clamp body 042, and the first drive cylinder 044 are basically located on the axis of the rotating shaft of the flip frame 041. The air pipe of the first drive cylinder 044 can be connected to the outside from the front and rear axes, so that the left and right sides can maintain a good open state, which is convenient for the displacement of the manipulator 3 on the side, without structural interference, and more convenient for the layout of each station. The second clamping part 032 is arranged on the left and right sides, staggered with the upper clamp body 043 and the lower clamp body 042, so that the second clamping part 032 can resist the upper fine-tuning disk without interference, realizing the function of chip drop transfer; the air path of the second drive cylinder 034 itself is also directly hidden from the bottom of the base 01 and connected to the outside, which does not affect the layout of the components and does not occupy space.

[0031] As an improved specific implementation method, the second supporting portion 031 is a platform, and the surface of the platform is provided with a plurality of protrusions 0311 for positioning the loading tray. The second clamping portion 032 is a clip. The platform is mounted on a mounting frame 030. The clip is hinged to the mounting frame 030 and is located on both sides of the platform. The second driving cylinder 034 is mounted on the bottom surface of the mounting frame 030 and hinged to the clip. The lifting cylinder 033 is installed at the lower part of the base 01 and connected to the mounting frame 030.

[0032] like Figure 1 , 2As shown in Figures 3, 5, the arrangement holes 035 provided on the base 01 facilitate the installation frame 030 and the components thereon to be accommodated in the space below the base 01, so that there is a more suitable space between the flip frame 041 and the platform for the manipulator 3 to reach in and take and place the loading tray. The platform is installed on the surface of the installation frame 30, and the second driving cylinder 034 is installed on the bottom surface of the installation frame 030. The space layout is reasonably utilized to reduce the interference of the upper space, which is convenient for the manipulator 3 to reach in. The platform itself forms a plane to place the loading tray, and then the loading tray is positioned by the boss 0311, making the overall structure simpler. The boss 0311 matches the corresponding positioning hole on the loading tray, thereby ensuring that the loading tray is placed accurately and stably. In terms of the overall structure, all components except the platform and the clip are arranged at the bottom of the installation frame 030, making better use of the space.

[0033] As an improved specific implementation method, a rubber piece 0321 is provided on the clip, and the rubber piece 0321 is used to contact the loading tray to limit the position and alleviate the impact.

[0034] like Figure 5 As shown, by setting the rubber part 0321, on the one hand, the elastic force can better resist the loading plate to achieve position limitation; on the other hand, when the upper structure of the clip resists the fine-tuning plate to generate vibration or impact, the rubber part 0321 can alleviate the reaction force and reduce the impact of the impact on the loading plate limit, which is more conducive to the stability of positioning and the long-term use of the components.

[0035] As an improved specific implementation method, the placement rack 51 includes vertical racks 511 on both sides and a horizontal rack 512 arranged between the vertical racks 511 on both sides. A plurality of placement slots 52 for placing fine-tuning disks are horizontally arranged on the horizontal rack 512. A cavity 521 is provided at the bottom of the placement slot 52. A sensor 50 for detecting whether the placement slot 52 stores a fine-tuning disk is provided in the cavity 521. A wiring slot 522 is horizontally passed through the bottom of the plurality of placement slots 52. The wiring slot 522 is connected to the cavity 521. The circuit of the sensor 50 leads to both sides through the wiring slot 522.

[0036] like Figure 1 , 6As shown in FIGS. 6 and 7, the placement rack 51 forms a certain height by relying on the vertical racks 511 on both sides, so that the horizontal rack 512 provided in the middle is at a suitable height for the manipulator 3 to pick up and place the fine-tuning disks; a number of placement slots 52 are horizontally arranged on the horizontal rack 512 to facilitate providing a certain storage capacity. And corresponding to the placement slots 52, sensors 50 are provided in the cavities 521, which can detect whether there are fine-tuning disks at all the placement slots 52. Through the information feedback of the control module, the manipulator 3 can efficiently pick up and place the fine-tuning disks, which is more flexible and intelligent, and improves the operation efficiency of the picking and placing equipment. The sensors 50 are accommodated in the cavities 521, and their lines are accommodated and led to both sides through the further provided wire grooves 522, and are externally wired to the control module and the power supply module on the outside, arranging the lines orderly without affecting the normal access of the loading trays, which is convenient for management and maintenance.

[0037] As a specific improved embodiment, through holes 5111 are opened on the vertical racks 511. The through holes 5111 correspond to the wire grooves 522 for the lines to pass through. A wiring rack 5112 is also installed on the outside of the vertical racks 511, and the wiring rack 5112 allows the lines to run downward along the wiring rack 5112.

[0038] As Figure 7 shown, the setting of the through holes 5111 allows the lines to pass through, avoiding the exposed bending caused by the lines passing through from above, which can provide better protection for the lines, and the bent parts of the lines will not be knocked and damaged by external components due to long-term use; after passing through the through holes 5111, the lines are directly accommodated in the wiring rack 5112 and run downward, and then are connected outward along the equipment plane from the lower part, which provides better storage protection for the lines; preferably, after the wiring is completed, a switchable cover can be provided on the outside of the wiring rack 5112 to provide better protection and can be disassembled for line maintenance when needed.

[0039] As a specific improved embodiment, the placement rack 51 further includes a spare rack 513. The spare rack 513 is arranged between the two vertical racks 511 and below the horizontal rack 512. A number of placement positions 53 for placing the loading trays are horizontally arranged on the spare rack 513. The placement positions 53 correspond one by one to the placement slots 52 above. Each placement position 53 is provided with a column 531 for positioning the loading tray; cavities 521 are provided on the placement positions 53, and sensors 50 for detecting whether there are loading trays stored in the placement positions 53 are provided in the cavities 521. A wire groove 522 runs horizontally through a number of the placement positions 53. The wire groove 522 communicates with the cavities 521. The lines of the sensors 50 are led to both sides through the wire groove 522, and through holes 5111 corresponding to the wire groove 522 at the placement positions 53 are opened on the vertical racks 511 for the lines to pass through and run to the wiring rack 5112.

[0040] As Figure 6 、 7As shown in the figure, in order to further increase the capacity of the placement rack 51 and adapt to the placement of the loading tray, a spare rack 513 is provided under the lower layer of the cross rack 512. The same number of placement positions 53 are provided corresponding to the placement slots 52, thereby increasing the overall capacity. The placement position 53 uses the platform and the column 531 to locate the placement position of the loading tray. The column 531 matches the positioning holes provided correspondingly on the loading tray to ensure the accurate and stable placement position of the loading tray. The absence of the groove structure can reduce the displacement amount when the manipulator 3 places and removes the loading tray up and down, reduce the spacing requirement between the cross rack 512 and the spare rack 513, and make the structure more compact. The sensor 50, the cavity 521, and the wire groove 522 at the placement position 53 are set with reference to the placement slot 52 to achieve the same technical effect. The through hole 5111 is also set with reference to the placement slot 52 to achieve the same technical effect, making the wire routing orderly.

[0041] As a specific improved implementation, relief slots 523 that expand outward for the tool to pick up and place the fine-tuning tray are provided on both sides of the placement slot 52 and the placement position 53. The relief slots 523 penetrate through the cross rack 512 and the spare rack 513 vertically and horizontally.

[0042] As Figure 6 、 7 shown in the figure, the gripper of the manipulator 3 grips the material tray from both sides for transportation. The relief slots 523 that expand on both sides of the placement slot 52 and the placement position 53 allow the gripper to enter and perform a certain displacement left and right, so as to perform the orderly picking and placing of the loading tray. The vertically and horizontally penetrating relief slots 523 reduce the manufacturing difficulty on the one hand. The relief slots 523 are directly formed by cutting. The vertically and horizontally penetrating spatial state also facilitates the full up and down displacement of the gripper of the manipulator 3 to extend in and pick up and place the loading tray.

[0043] As a specific improved implementation, a notch 524 is provided on the side of the placement slot 52 where the fine-tuning tray is picked up and placed. The notch 524 forms a space opening for the tool to extend into the lower placement position 53 to pick up and place the fine-tuning tray.

[0044] As Figure 6 、 7 shown in the figure, the setting of the notch 524 provides good space above the placement position 53, allowing the upper arm structure of the manipulator 3 to move freely, achieving a more convenient picking and placing effect on the loading tray at the placement position 53, and reducing the spacing requirement between the cross rack 512 and the spare rack 513, making the structure more compact. When the manipulator 3 or the control module determines that the placement slot 52 above a placement position 53 does not place the fine-tuning tray, the notch 524 can be used for the arm displacement of the manipulator 3 to place the loading tray.

[0045] As a specific improved implementation, the placement rack 51 further includes a base 514. The base 514 is arranged between the two side vertical racks 511 and is located at the bottom for installation with the external structure.

[0046] As shown Figure 1 , 6 , as shown in Figures 6 and 7, the base 514 is used to reinforce the bottoms of the two side vertical frames 511, and mounting holes are further provided on the base 514. The base 514 can be installed and fixed to the bracket of the overall device, enabling the placement rack 51 to be stably used.

[0047] As a specific embodiment of an improvement, as shown Figure 8 in, the line scan mechanism 4 can be implemented by the prior art. It has a basic line scan function and includes at least a line scan head 41, a line scan frame 42, a left - right translation assembly 43, a lifting assembly 44, and a front - rear translation assembly 45. The line scan frame 42 is used to place the material tray, and the line scan frame 42 is arranged on the front - rear translation assembly 45. After the material tray is placed on it, the front - rear translation assembly 45 moves the line scan frame 42 under the line scan head 41. The line scan head 41 is arranged on the lifting assembly 44, and the lifting assembly 44 is arranged on the left - right translation assembly 43. When performing line scan detection, through the set operating trajectories of the left - right translation assembly 43, the lifting assembly 44, and the front - rear translation assembly 45, the line scan frame 42 and the line scan head 41 perform relative movements, enabling the line scan head 41 to complete the line scan detection of a predetermined position on the line scan frame 42.

[0048] The above are only the preferred embodiments of the present invention. The protection scope of the present invention is not limited to the above - mentioned embodiments. All technical solutions falling within the concept of the present invention belong to the protection scope of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements should also be regarded as within the protection scope of the present invention.

Claims

1. A transfer and turnover machine for a material tray, characterized in that: The invention comprises an input table (1), an output table (2), a manipulator (3), a material turning mechanism (0), a line scanning mechanism (4) and a placement rack (51), wherein the manipulator (3) is located in the middle of the transfer and turning machine, and the input table (1), the output table (2), the material turning mechanism (0), the line scanning mechanism (4) and the placement rack (51) are distributed around the manipulator (3), the input table (1) is used to place a fine-tuning disk with a chip delivered from a previous process, and the manipulator (3) is used to clamp the fine-tuning disk at the input table (1) and send it to the line scanning mechanism (4) to perform line scanning on the chip, and the fine-tuning disk with qualified line scanning is sent to the material turning mechanism (0) by the manipulator (3), and the fine-tuning disk with unqualified line scanning is sent to the placement rack by the manipulator (3). The turning mechanism (0) comprises a turning mechanism (04) and a receiving mechanism (03) arranged above and below, the turning mechanism (04) being used to receive the fine-tuning disk and rotate and turn it over so that the chip faces downward, the receiving mechanism (03) being used to place a loading disk by a manipulator (3), and to raise the loading disk to contact the fine-tuning disk to generate vibration, so that the chip falls to the loading disk for transportation; the manipulator (3) clamps the loading disk with the chip at the receiving mechanism (03) and sends it to the output platform (2); the output platform (2) is provided with a plurality of placement positions for input and output placement of the loading disk, and the placement rack (51) is provided with a plurality of placement positions for temporary storage of the fine-tuning disks that fail the line scan and the temporary storage of the fine-tuning disks at the input platform (1); The material turning mechanism (0) further comprises a base (01) and a stand (02), the material receiving mechanism (03) is arranged on the base (01), and the turning mechanism (04) is arranged on the stand (02); The turning mechanism (04) comprises a turning frame (041), a lower clamping body (042), an upper clamping body (043) and a first driving cylinder (044); the vertical frame (02) is divided into two groups and is installed on the base (01); the turning frames (041) are rotatably arranged on the upper parts of the two groups of the vertical frames (02); the turning frames (041) are connected to the rotating cylinder (040) for rotation control; a discharge hole (045) is arranged in the middle of the turning frame (041) from top to bottom; a pair of upper clamping bodies (043) and a pair of lower clamping bodies (042) are arranged on opposite sides of the discharge hole (045); A pair of lower clamping bodies (042) are controlled by respective first driving cylinders (044) at both sides of the lower part to open or close and change the working position, and when closed, form a support surface for placing the fine-tuning disk; a pair of upper clamping bodies (043) are controlled by respective first driving cylinders (044) at both sides of the upper part to open or close and change the working position, and when closed, cooperate with the lower clamping bodies (042) to clamp the fine-tuning disk, and the flip frame (041) is rotated 180 degrees to allow the upper clamping body (043) and the lower clamping body (042) to exchange positions, and at the same time, the upper clamping body (043) and the lower clamping body (042) to exchange functions; The material receiving mechanism (03) includes a second support portion (031), a second clamping portion (032), a lifting cylinder (033), and a second driving cylinder (034). A layout hole (035) is vertically and throughly arranged on the base (01) corresponding to the lower position of the flipping frame (041). The second support portion (031) is arranged at the layout hole (035). The second support portion (031) is controlled to lift by the lifting cylinder (033) arranged at the lower part. A pair of second clamping portions (032) are arranged on both sides of the second support portion (031). The pair of second clamping portions (032) are controlled by their respective second driving cylinders (034) to open or close to change the working position, and cooperate with the second support portion (031) to clamp the material loading tray when closed. When the flipping frame (041) rotates 180 degrees, the chip on the fine-tuning plate is flipped downward towards the lower material loading tray. When the lower second support portion (031) rises until it touches the fine-tuning plate by the second clamping portion (032), an impact is generated on the fine-tuning plate, causing the chip to fall onto the material loading tray. Grooves (046) are arranged on the surfaces of the upper clamping body (043) and the lower clamping body (042) that contact the fine-tuning plate. The edges of the grooves (046) are adapted to the edges of the fine-tuning plate for cooperative limiting during placement or clamping. The upper clamping body (043) and the lower clamping body (042) each include clamping blocks (047) arranged symmetrically left and right. A gap is formed between the left and right clamping blocks (047). The corners of the fine-tuning plate are placed or clamped at the clamping blocks (047). The placement rack (51) includes vertical racks (511) on both sides and a horizontal rack (512) arranged between the vertical racks (511) on both sides. A number of placement grooves (52) for placing the fine-tuning plate are horizontally arranged on the horizontal rack (512). A cavity (521) is arranged at the bottom of the placement groove (52). A sensor (50) for detecting whether the placement groove (52) stores a fine-tuning plate is arranged in the cavity (521). A wire groove (522) is horizontally and throughly arranged at the bottom of a number of placement grooves (52). The wire groove (522) communicates with the cavity (521). The wires of the sensor (50) lead to both sides through the wire groove (522).

2. The transfer and tipping machine for a material tray according to claim 1, wherein: The upper clamping body (043), the lower clamping body (042), and the first driving cylinder (044) are arranged at positions close to the rotation axis of the flipping frame (041) front and back, so that the left and right positions of the flipping frame (041) are open for an external mechanism to move and pick up the fine-tuning plate. The second clamping portions (032) are arranged on the left and right sides of the second support portion (031), so as to be staggered from the positions of the upper clamping body (043) and the lower clamping body (042).

3. The transfer and tipping machine for a material tray according to claim 1, characterized in that: The second support part (031) is a platform, and a plurality of protruding columns (0311) for positioning the loading tray are arranged on the surface of the platform. The second clamping part (032) is a clamping piece. The platform is installed on a mounting frame (030). The clamping piece is hinged to the mounting frame (030) and is located on both sides of the platform. The second driving cylinder (034) is installed on the bottom surface of the mounting frame (030) and is hinged to the clamping piece. The lifting cylinder (033) is installed on the lower part of the base (01) and is connected to the mounting frame (030).

4. The transfer and tipping machine for a material tray according to claim 3, characterized in that: A rubber part (0321) is arranged on the clamping piece, and the rubber part (0321) is used for abutting against the loading tray for limiting and relieving impact.

5. A transfer and tipping machine for a material tray according to claim 1, characterized in that: A through hole (5111) is formed in the vertical frame (511), and the through hole (5111) corresponds to the wire routing groove (522) for the circuit to pass through. A wire routing frame (5112) is further installed on the outer side of the vertical frame (511), and the wire routing frame (5112) allows the circuit to route downward along the wire routing frame (5112).

6. The transfer and tipping machine for a material tray according to claim 5, characterized in that: The placing rack (51) further includes a spare rack (513). The spare rack (513) is arranged between the two vertical frames (511) and is located below the cross frame (512). A plurality of placing positions (53) for placing the loading trays are horizontally arranged on the spare rack (513). The placing positions (53) correspond one by one to the placing grooves (52) above. Each placing position (53) is provided with a column body (531) for positioning the loading tray. A cavity (521) is arranged on the placing position (53), and a sensor (50) for detecting whether the placing position (53) stores a loading tray is arranged in the cavity (521). A wire routing groove (522) runs through the plurality of placing positions (53) horizontally. The wire routing groove (522) is communicated with the cavity (521). The wires of the sensor (50) lead to both sides through the wire routing groove (522), and through holes (5111) corresponding to the wire routing grooves (522) at the placing positions (53) are formed in the vertical frames (511) for the wires to pass through to the wire routing frame (5112) for wire routing.

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