Substrate conveying device and substrate conveying method

Abstract

The present disclosure provides a substrate conveyance device and a substrate conveyance method that can perform accurate motion control even when a conveyance object other than a substrate is conveyed using a substrate conveyance module. A control section of the substrate conveyance device adjusts a magnetic force of a first magnet provided at a bottom surface section of a substrate conveyance chamber, a substrate is conveyed by a substrate conveyance module provided with a second magnet, a parameter storage section stores model parameters for expressing a relationship between a work force applied to a control model and a motion, the control model is a model that expresses a conveyance object and the substrate conveyance module as a whole, a control time table creation section outputs a control time table that specifies a work force for causing the substrate conveyance module to act, using model parameters corresponding to the conveyance object and an action time table that specifies a motion of the substrate conveyance module. A magnetic force adjustment section performs feedforward control in which the magnetic force of the first magnet is adjusted to apply the work force based on the control time table.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a substrate conveyance device and a substrate conveyance method. BACKGROUND

[0002] For example, in a device that implements processing for a semiconductor wafer (hereinafter, also referred to as "wafer") as a substrate (wafer processing device), conveyance of the wafer is performed between a carrier that houses the wafer and a wafer processing chamber for performing processing. When the conveyance of the wafer is performed, a wafer conveyance mechanism of various structures is used.

[0003] The applicant is developing a wafer processing device that uses a substrate conveyance module that uses magnetic levitation to perform conveyance of a substrate.

[0004] For example, a substrate carrier that transports a semiconductor substrate between processing chambers in a state of levitating from a board by magnetic levitation is described in Patent Literature 1.

[0005] PRIOR ART DOCUMENTS

[0006] PATENT LITERATURE

[0007] Patent Literature 1: Japanese Patent Application Laid-Open No. 2018-504784 SUMMARY

[0008] PROBLEMS TO BE SOLVED BY THE INVENTION

[0009] The present disclosure provides a technology that performs accurate operation control even in a case where conveyance of a substrate other than a substrate is performed using a substrate conveyance module.

[0010] SOLUTION TO PROBLEM

[0011] The present disclosure relates to a device that performs conveyance of a substrate with respect to a substrate processing chamber, the device including:

[0012] a substrate conveyance chamber that has a bottom surface portion provided with a first magnet that adjusts a magnetic force and a side wall portion that is connected to the substrate processing chamber and in which an opening portion for conveying the substrate into and out of the substrate processing chamber is formed;

[0013] a substrate conveyance module that includes a holding portion configured to be able to hold a plurality of conveyance objects, the plurality of conveyance objects being the substrate or equipment used in the substrate conveyance chamber or the substrate processing chamber, and a second magnet between which a repulsive force acts, the substrate conveyance module being configured to be able to move in the substrate conveyance chamber by magnetic levitation using the repulsive force; and

[0014] a control section that controls a work force for causing the substrate transfer module to act using feedforward control by changing the repulsive force by adjusting a magnetic force of the first magnet,

[0015] wherein the control section has:

[0016] a parameter storage section that stores at least one model parameter for expressing a relationship between a work force applied to a control model and a motion of the control model, which is a model that expresses the substrate and the substrate transfer module as a whole, in a manner corresponding to each of the plurality of transferred objects;

[0017] a control schedule creation section that acquires determination information for determining the transferred object and an action schedule that specifies a motion of the substrate transfer module along a time axis, and outputs, as a control schedule that specifies the work force along the time axis, a work force that should be applied in a case where the substrate transfer module that holds the transferred object corresponding to the determination information is caused to act based on the action schedule, using the model parameter of the control model corresponding to the determination information stored in the parameter storage section; and

[0018] a magnetic force adjustment section that adjusts the magnetic force of the first magnet to apply the work force based on the control schedule to the substrate transfer module that transfers the transferred object corresponding to the determination information, thereby executing the feedforward control.

[0019] Effects of the Invention

[0020] According to the present disclosure, accurate motion control can be performed even in a case where a substrate transfer module is used to transfer a transferred object other than a substrate. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a plan view showing a first example of a structure of a wafer processing system.

[0022] Figure 2 is a plan view showing a first example of a structure of a transfer module.

[0023] Figure 3 is a perspective view showing an example of a structure of a transfer module and a board.

[0024] Figure 4 is a block diagram related to an example of a structure of a wafer processing system.

[0025] Figure 5A is a perspective view related to a first example of a control model.

[0026] Figure 5Bis a perspective view related to a second configuration example of a control model.

[0027] Figure 6 is a plan view showing an example of an operation of a transport module.

[0028] Figure 7 is an example of a timing chart related to feedforward control.

[0029] Figure 8 is an example of a flowchart related to operation control of a transport module.

[0030] Figure 9 is a plan view showing a second configuration example of a wafer processing system.

[0031] Figure 10 is a plan view showing a second configuration example of a transport module.

[0032] Figure 11 is a side view related to an example of a transport operation of the transport module.

[0033] Figure 12 is a schematic view showing an example of a transport operation of a transport module in which a failure has occurred.

[0034] Figure 13 is a schematic view showing an example of a transport operation of a component. DETAILED DESCRIPTION

[0035] <wafer processing system>

[0036] Hereinafter, the structure of an "apparatus that performs transport of a substrate" according to an embodiment of the present disclosure will be described with reference to Figure 1 The apparatus that performs transport of a substrate is provided in a wafer processing system 101.

[0037] A multi-chamber type wafer processing system 101 provided with a plurality of wafer processing chambers 110 as substrate processing chambers is shown in Figure 1 As shown in Figure 1 , the wafer processing system 101 is provided with a load port 141, an atmospheric transport chamber 140, a load interlock chamber 130, a vacuum transport chamber 160, and a plurality of wafer processing chambers 110. In the following description, the position where the load port 141 is provided is set as a proximal side.

[0038] In the wafer processing system 101, the load port 141, the atmospheric transport chamber 140, the load interlock chamber 130, and the vacuum transport chamber 160 are arranged in the horizontal direction in the order described from the proximal side. In addition, when viewed from the proximal side, the plurality of wafer processing chambers 110 are arranged on the left and right of the vacuum transport chamber 160.

[0039] Loading ports 141 are configured as a stage for holding a carrier C for housing a wafer W to be processed. When viewed from the front, four loading ports 141 are arranged in the left-right direction. As the carrier C, for example, a FOUP (Front Opening Unified Pod) can be used.

[0040] The atmospheric transport chamber 140 is equipped with an atmospheric pressure (normal pressure) atmosphere, for example, forming a downward flow of clean air. Furthermore, a wafer transport mechanism 142 for transporting wafer W is provided inside the atmospheric transport chamber 140. The wafer transport mechanism 142 within the atmospheric transport chamber 140 is, for example, composed of a multi-jointed arm. This wafer transport mechanism 142 transports wafer W between the carrier C and the loading interlock chamber 130. Additionally, an alignment chamber (not shown) for aligning wafer W is provided, for example, on the left side of the atmospheric transport chamber 140.

[0041] Three loading interlock chambers 130 are arranged, for example, side-by-side, between the vacuum transfer chamber 160 and the atmospheric transfer chamber 140. Each loading interlock chamber 130 has a lifting pin 131 that lifts and holds the transferred wafer W from below. For example, three lifting pins 131 are arranged at equal intervals along the circumference, allowing for free lifting. Furthermore, the lifting pin 113, described later, is also configured similarly.

[0042] The loading interlock chamber 130 is configured to switch between atmospheric pressure and vacuum atmosphere. The loading interlock chamber 130 is connected to the atmospheric transport chamber 140 via a gate valve 133. Additionally, the loading interlock chamber 130 is connected to the vacuum transport chamber 160 via a gate valve 132.

[0043] The vacuum transfer chamber 160 is equivalent to the substrate transfer chamber of this disclosure. For example... Figure 1 As shown, the vacuum transfer chamber 160 is constructed from a frame that is long in the front-to-back direction and rectangular in shape when viewed from above. The vacuum transfer chamber 160 is depressurized and created as a vacuum environment by a vacuum exhaust mechanism (not shown). Figure 1 In the wafer processing system 101 shown in the example, three wafer processing chambers 110 are connected to the left and right side walls of the vacuum transfer chamber 160 via gate valves 111, for a total of six wafer processing chambers 110. The wafers W are moved in and out between the vacuum transfer chamber 160 and the wafer processing chambers 110 through the openings that are opened and closed by the gate valves 111.

[0044] Each wafer processing chamber 110 is depressurized and becomes a vacuum atmosphere through a vacuum exhaust mechanism (not shown). A stage 112 is provided inside each wafer processing chamber 110, and the wafer W is subjected to prescribed processing while placed on the stage 112. Examples of processing performed on the wafer W include etching, film deposition, cleaning, and ashing.

[0045] For example, when processing is performed while heating the wafer W, a heater is provided on the stage 112. When the processing of the wafer W is performed using processing gas, a processing gas supply unit consisting of spray heads or the like is provided in the wafer processing chamber 110. However, illustrations of these heaters and processing gas supply units are omitted. Additionally, a lifting pin 113 for transferring and loading / unloading the wafer W is provided on the stage 112. The wafer processing chamber 110 is equivalent to the substrate processing chamber of this embodiment.

[0046] <Transfer Module 30>

[0047] In this example, the wafer processing system 101 uses a magnetically levitated transfer module (substrate transfer module) 30 to transfer the wafer W. Figure 2 As shown, the transport module 30 has a main body 31 that is rectangular in shape when viewed from above, and is configured to directly hold the wafer W on the upper surface of the main body 31. That is, the main body 31 of the transport module 30 is formed as a stage 34 serving as a holding portion for holding the wafer W. For example, the stage 34 is formed as a flat square plate. Furthermore, a module-side magnet 33 is provided inside the main body 31 of the transport module 30, as shown in Figure 30. Figure 3 The structure will be described in the following text.

[0048] The transport module 30 enters the wafer processing chamber 110 and the loading interlock chamber 130, where it exchanges wafer W with lifting pins 113 and 131. A slit 341 is formed in the transport module 30 to avoid interference with the lifting pins 113 and 131 and to facilitate the exchange of wafer W. The slit 341 is formed along a track through which the lifting pins 113 and 131 pass when the stage 34 enters and exits the position below the wafer W held by the lifting pins 113 and 131. Furthermore, the slit 341 is configured to reverse the entry direction relative to the lower position of the wafer W by 180°. This structure avoids interference between the transport module 30 and the lifting pins 113 and 131, and allows the transport module 30 to be aligned vertically with the center of the wafer W.

[0049] <Magnetic levitation mechanism>

[0050] like Figure 3 As schematically shown, a plurality of plates (moving plates) 10 are provided on the bottom surface of the vacuum transfer chamber 160. These plates 10 are provided on the entire bottom surface of the vacuum transfer chamber 160, which becomes the moving area of ​​the transfer module 30. In addition, transfer areas are provided such that the transfer module 30 moves into the loading interlock chamber 130 and the wafer processing chamber 110 in this example, so plates 10 are also provided on the bottom surface of these loading interlock chambers 130 and the wafer processing chamber 110.

[0051] Multiple movable surface coils 11 are arranged inside the plate 10. The movable surface coils 11 generate a magnetic field by being powered from the power supply unit 53. The movable surface coils 11 are equivalent to the first magnet of this disclosure.

[0052] On the other hand, a plurality of module-side magnets 33, for example, made of permanent magnets, are arranged inside the conveying module 30. A repulsive force (magnetic force) acts between the module-side magnets 3 and the magnetic field generated by the moving surface-side coil 11. Through this action, the conveying module 30 can be magnetically levitated relative to the moving surface of the upper surface side of the plate 10. The module-side magnets 33 provided on the conveying module 30 are equivalent to the second magnets of this disclosure.

[0053] Furthermore, the plate 10 can adjust the position and intensity of the generated magnetic field by multiple moving-surface coils 11, thereby changing the state of the magnetic field. By controlling this magnetic field, the conveying module 30 can move in a desired direction on the moving surface, the levitation distance from the moving surface can be adjusted, and the orientation of the conveying module 30 can be adjusted. The magnetic field on the plate 10 side is controlled by selecting the moving-surface coil 11 to be powered and adjusting the amount of power supplied to the moving-surface coil 11.

[0054] Furthermore, the multiple module-side magnets 33 can also be composed of coils that are powered by a battery located within the transport module 30 and function as electromagnets. Alternatively, both permanent magnets and coils can be used to construct the module-side magnets 33.

[0055] The vacuum transfer chamber 160 of the structure described above is provided with multiple transfer modules 30, which can move simultaneously to transfer the wafer W.

[0056] The vacuum transfer chamber 160 described above, which includes a transfer module 30 and is connected to the wafer processing chamber 110, is equivalent to the substrate transfer apparatus disclosed herein.

[0057] <Control Unit 5>

[0058] The wafer processing system 101 includes a control unit 5. The control unit 5 is a computer equipped with a CPU and a storage unit, used to control various parts of the wafer processing system 101. The storage unit stores a program containing groups of steps (commands) for controlling the movement of the transfer module 30, the operation of the wafer processing chamber 110, etc. This program is stored, for example, on a storage medium such as a hard disk, optical disk, magneto-optical disk, memory card, or non-volatile memory, and is installed onto the computer from that storage medium.

[0059] <Wafer W's transport operation>

[0060] Next, an example of the wafer W transport operation in the wafer processing system 101 with the above-described structure will be described. First, when the carrier C containing the wafer W to be processed is placed in the loading port 141, the wafer W is removed from the carrier C by the wafer transport mechanism 142 in the atmospheric transport chamber 140. Next, the wafer W is transported to an alignment chamber (not shown) for alignment. Furthermore, when the wafer W is removed from the alignment chamber by the wafer transport mechanism 142, the gate valve 133 is opened.

[0061] When the wafer transport mechanism 142 enters the loading interlock chamber 130, the lifting pin 131 lifts the wafer W and accepts it. Then, when the wafer transport mechanism 142 retracts from the loading interlock chamber 130, the gate valve 133 is closed. Furthermore, the atmosphere inside the loading interlock chamber 130 is switched from atmospheric pressure to a vacuum atmosphere.

[0062] After a vacuum atmosphere is created inside the loading interlock chamber 130, the gate valve 132 is opened. At this time, inside the vacuum transfer chamber 160, near the connection point of the loading interlock chamber 130, the transfer module 30 is positioned directly opposite the loading interlock chamber 130 and is in standby mode with magnetic levitation.

[0063] Moreover, such as Figure 1 As shown, the transfer module 30 enters the loading interlock chamber 130 and is positioned below the wafer W supported by the lifting pin 131. Furthermore, when the lifting pin 131 is lowered, the wafer W is transferred to the stage 34 of the transfer module 30.

[0064] Next, the transport module 30, holding wafer W, exits from the loading interlock chamber 130 and moves along a pre-set path within the vacuum transport chamber 160 to the wafer processing chamber 110, which is the destination for transporting wafer W. For example... Figure 1 As shown, after the transport module 30 reaches the position directly opposite the wafer processing chamber 110, the gate valve 111 is opened, allowing the transport module 30 to enter the wafer processing chamber 110. Then, the wafer W is transferred to the loading stage 112 via the lifting pin 113, and the transport module 30 is retracted from the wafer processing chamber 110. After the gate valve 111 is closed, the processing of the wafer W begins.

[0065] In the processing of wafer W, the wafer W placed on the stage 112 is heated to a preset temperature as needed. Additionally, if a processing gas supply unit is provided, processing gas is supplied to the wafer processing chamber 110. In this way, the desired processing is performed on the wafer W.

[0066] After processing wafer W for a preset period, heating of wafer W is stopped, and the supply of processing gas is also stopped. Alternatively, cooling gas can be supplied to wafer processing chamber 110 to cool wafer W as needed. Then, wafer W is transported in the reverse process of loading, and wafer W is returned from wafer processing chamber 110 to loading interlock chamber 130.

[0067] Furthermore, after switching the atmosphere of the loading interlock chamber 130 to an atmospheric pressure atmosphere, the wafer W in the loading interlock chamber 130 is taken out by the wafer transport mechanism 142 on the atmospheric transport chamber 140 side and sent back to the designated carrier C.

[0068] <Feedforward Control>

[0069] In the wafer W transport operation of the wafer processing system 101 described above, the transport module 30 moves while levitating from the bottom surface of the vacuum transport chamber 160, the loading interlock chamber 130, and the wafer processing chamber 110. Unlike multi-joint robotic arms, the movement utilizing magnetic levitation results in fewer changes in physical properties due to friction and posture variations. Therefore, the transport module 30 can be treated as an ideal rigid body, and the relationship between externally applied forces and the movement of the transport module 30 can be easily determined.

[0070] If the above relationship can be determined, the position and orientation of the conveying module 30 can be pre-arranged, and feedforward control (hereinafter also referred to as "FF control") can be performed. In this feedforward control, the force applied to make the conveying module 30 operate according to the arranged schedule (the repulsive force between the moving surface coil 11 and the module-side magnet 33) is adjusted. Compared with feedback control that adjusts the applied force based on the detection results of the position and orientation of the conveying module 30, FF control can perform control with less delay.

[0071] Therefore, in the wafer processing system 101 of this example, the control unit 5 described above is configured to use FF control to perform the operation control of the transfer module 30.

[0072] On the other hand, various components are configured in the wafer processing chamber 110 and the vacuum transfer chamber 160, which sometimes require maintenance, replacement, and cleaning. Furthermore, by configuring various sensors within the wafer processing chamber 110 and the vacuum transfer chamber 160 as needed, and using these sensors to detect the internal conditions, it is possible to improve wafer W processing and equipment maintenance. Moreover, inside the vacuum transfer chamber 160 and the wafer processing chamber 110, sometimes the wafer W may be damaged, or the transfer module 30 may malfunction, requiring the removal of the damaged wafer W or the transfer module 30.

[0073] In these situations, it is necessary to remove components, transport modules 30, or install sensors inside the wafer processing chamber 110 and vacuum transport chamber 160. However, to perform this work, it is necessary to stop the operation of the wafer processing system 101 as needed and restore the interior of the wafer processing chamber 110 and vacuum transport chamber 160 from a vacuum atmosphere to atmospheric pressure before opening the chamber. Furthermore, to restart the operation of the wafer processing system 101, the wafer processing chamber 110 and vacuum transport chamber 160 must be depressurized to a vacuum atmosphere again. Since wafer W cannot be processed, the time required for these operations becomes an opportunity loss.

[0074] Regarding this point, the wafer processing system 101 in this example has a transport module 30 that can move within the vacuum transport chamber 160 and the wafer processing chamber 110. If the transport module 30 can be used, for example, via the loading interlock chamber 130, to move components, damaged wafers W, malfunctioning transport modules 30, and sensors in and out, then there is no need to perform pressure switching or opening operations in the wafer processing chamber 110 and the vacuum transport chamber 160.

[0075] On the other hand, the transport of objects that differ in weight and shape from undamaged wafers W (hereinafter also referred to as "normal wafers W") becomes the main reason for the deterioration of the motion control of the transport module 30, which is controlled by FF.

[0076] Therefore, the wafer processing system 101 in this example presupposes that, in addition to the usual wafer W, it also transports various transported items such as components that are to be repaired or replaced, damaged wafer W, malfunctioning transport module 30, and various sensors through the transport module 30, and performs FF control.

[0077] Here, the components used in the wafer processing chamber 110 and the vacuum transfer chamber 160, the damaged wafer W, the malfunctioning transfer module 30, and the sensors are equivalent to the "equipment used in the vacuum transfer chamber 160 or the wafer processing chamber 110" in this example. Additionally, the normal wafer W and various devices are equivalent to the "transferred items" of the transfer module 30.

[0078] Furthermore, the control unit 5 is configured to change the content of FF control according to the type of these transported items.

[0079] Below, refer to Figures 4-8 This section explains the structure and control content of the control unit 5, which is related to the motion control of the conveying module 30.

[0080] <Detailed Structure of Control Unit 5>

[0081] Figure 4This is a block diagram showing the electrical structure related to the motion control of the conveying module 30. Regarding the motion control of the conveying module 30 using feedback control, the control unit 5 includes a parameter storage unit 503, a control timetable generation unit 502, and a magnetic force adjustment unit 501.

[0082] The parameter storage unit 503 stores model parameters that represent the relationship between the force applied to the conveying module 30 while it is holding the conveyed object and the movement of the conveying module 30.

[0083] The model parameters are stored in a manner that corresponds to various transport objects, including the typical wafer W. Examples of transport objects other than the typical wafer W include components used in the wafer processing chamber 110, the vacuum transport chamber 160, a damaged wafer W, a malfunctioning transport module 30, and various sensors. A specific example of a component is a focusing ring 114 disposed on a stage 112 in the wafer processing chamber 110 for processing wafer W using plasma-generated processing gases. Furthermore, an example of a sensor is a wafer with a camera mounted on a circular plate with a diameter approximately the same as the wafer W's diameter.

[0084] <Model Parameters>

[0085] In the wafer processing system 101 of this example, the model parameters are determined based on a control model that integrates the transported material and the transport module 30. Referring again below... Figure 5A , Figure 5B This section will illustrate specific examples of the control model and model parameters.

[0086] Figure 5A This is a perspective view of the transport module 30, which is typically used to transport a wafer W. Let the mass of the transport module 30 be m0, and the mass of the wafer W be m1. Figure 5A The direction of the arrow shown applies a force F1. As a result, when the transport module 30 carrying the wafer W moves in a straight line, the theoretical expression for the relationship between the force F1 and the acceleration a is represented by the following equation (1).

[0087] F1=(m0+m1)a…(1)

[0088] Here, when the wafer W and the transport module 30 are regarded as a control model 3A integrated together and their total mass is set as M1 (=m0+m1), equation (1) is rewritten as equation (1)'.

[0089] F1=M1a…(1)'

[0090] Equation (1)' shows the relationship between the force applied to the control model 3A and the linear motion of the control model 3A, which is a model that integrates the wafer W and the transport module 30. At this time, the mass M1 of the control model 3A is equivalent to the model parameters used to represent the relationship between the force applied for linear motion and the acceleration.

[0091] Next, so that the control model revolves around Figure 5A The rotation center O, shown by the dashed line, applies a rotational force N1 to the control model by rotating clockwise. Here, the wafer W is held in the transport module 30 such that the center of the transport module 30, which has a roughly square planar shape, overlaps with the center of the wafer W. In this example, the rotation center O is set by the center positions of the wafer W and the transport unit 30. Furthermore, the influence of the notches formed on the wafer W and the positioning plane can be ignored, and the use... Figure 2 In the case of the influence of the slit 341 of the conveying module 30, the rotation center O is controlled by the center of gravity G of the model 3A.

[0092] exist Figure 5A When the control model 3A is rotating, the theoretical formula representing the relationship between the rotational force N1 and the angular acceleration α is expressed by the following formula (2).

[0093] N1=I1α…(2)

[0094] I1 is the moment of inertia of the control model 3A, determined by the mass M1, shape, position of the center of gravity G, and position of the rotation center O of the control model 3A.

[0095] Equation (2) expresses the relationship between the rotational force applied to the control model 3A and the rotational motion of the control model 3A. In this case, the inertial torque I1 is equivalent to the model parameter used to express the relationship between the rotational force applied for rotational motion and the angular acceleration. Furthermore, the rotation center O can also be located outside the control model 3A. In this case, the control model 3A performs circular motion around the rotation center O.

[0096] then, Figure 5B This is a perspective view of the transport module 30, which is transporting the L-shaped component, namely transport item 4. Let the mass of transport item 4 be m2, and then... Figure 5A The direction of the arrow shown applies a force F2. As a result, when the conveying module 30 carrying the conveyed object 4 moves in a straight line, the relationship between the force F2 and the acceleration a is expressed by the following equation (3).

[0097] F2=(m0+m2)a…(3)

[0098] Here, when the transported object 4 and the transport module 30 are considered as a whole and their total mass is set as M2 (=m0+m2), equation (3) is rewritten as equation (3)'.

[0099] F2=M2a…(3)'

[0100] Equation (3)' shows the relationship between the force applied to the control model 3B and the linear motion of the control model 3B, which is a model that integrates the transported object 4 and the transport module 30. At this time, the mass M2 of the control model 3B is equivalent to the model parameters used to express the relationship between the force applied for linear motion and the acceleration.

[0101] Next, so that the control model 3B is used to rotate Figure 5B The rotational force N2 is applied to the control model 3B by rotating clockwise from the rotation center O, indicated by the dashed line. Here, the transported object 4 is held in a predetermined position on the transport module 30 with a predetermined posture. Furthermore, the rotation center O is set to be located at the center of the transport module 30. In this example, the rotation center O is located at a position offset from the center of gravity G of the control model 3B.

[0102] exist Figure 5B When the control model described above rotates, the theoretical formula representing the relationship between the rotational force N2 and the angular acceleration α is expressed by the following formula (4).

[0103] N2=I2α…(4)

[0104] I2 is the moment of inertia of the control model 3B, determined by the mass M2, shape, position of the center of gravity G, and position of the rotation center O of the control model 3B.

[0105] Equation (4) shows the relationship between the rotational force applied to the control model 3B and the rotational motion of the control model 3B. In this case, the inertial torque I2 is equivalent to the model parameters used to express the relationship between the rotational force applied for rotational motion and the angular acceleration. Furthermore, the rotation center O can also be located outside the control model 3A, which is consistent with... Figure 5A The control uses the same model 3A.

[0106] As illustrated above, the model parameters are determined by control models 3A and 3B, which represent the conveyed object and the conveying module 30 as a whole, and are set in a way that establishes correspondences for various conveyed objects. Furthermore, the model parameters are set according to the type of motion, such as linear motion or rotational motion. In addition, model parameters for the conveying module 30 in the state where no conveyed object is being transported are also preset.

[0107] <Control Timetable Production Department 502>

[0108] The control timetable production unit 502 has the function of outputting a "control timetable" which shows the working force to be applied when the conveying module 30 holding the conveyed object operates based on a preset "action timetable" along the time axis.

[0109] In the wafer processing system 101, when the carrier C is placed on the loading port 141, a transport schedule is created for each wafer W housed within the carrier C. The transport schedule specifies, along a time axis, when each wafer W removed from the carrier C is transported to which wafer processing chamber 110, and when the processed wafer W is then removed from the wafer processing chamber 110 and transported to the carrier C.

[0110] A transport schedule is created based on a processing procedure that specifies, for example, the processing to be performed on each wafer W within the carrier C (processing variables: heating temperature of wafer W, pressure within wafer processing chamber 110, supply time of processing gas, processing time, etc.). The processing variables are set via an interface unit 54. The interface unit 54 is, for example, configured using a touch panel operated by an operator.

[0111] When creating a delivery schedule, for example, when creating a schedule that specifies that delivery will take place in [location]... Figure 1 The vacuum transfer chamber 160 is equipped with a schedule for the operation (movement) of multiple transfer modules 30. The schedule specifies, along the time axis, when and where each transfer module 30 receives the wafer W, to what extent the received wafer W is transferred, and the movement path of the transfer module 30.

[0112] For transports other than normal wafers W, information is also set along the timeline specifying when and where each transport is received, and until when and where each transport is transported.

[0113] The transport schedule and motion schedule described above are generated by the control unit 5, for example. Alternatively, the system can be configured to acquire motion schedules generated externally via communication.

[0114] The control schedule generation unit 502 acquires the determination information for determining the transported item to be transported by the transport module 30 and the aforementioned operation schedule. For example, the determination information is set via the interface unit 54. Furthermore, the control schedule generation unit 502 reads the model parameters of the transported item corresponding to the determination information stored in the parameter storage unit 503. Then, using these parameters, it calculates the working force that should be applied when the transport module 30, which holds the transported item corresponding to the determination information, operates according to the operation schedule, and outputs it as a control schedule representing the working force along the time axis. In addition, the determination information can also determine the state of "no transported item".

[0115] Simplified examples are listed below. Figure 6 The diagram illustrates an example of the operation of the transport module 30 based on an action schedule. The transport module 30 moves linearly from point P1, exiting the loading interlock chamber 130, towards the inner side of the vacuum transport chamber 160 (in the X' direction of the secondary coordinate system set for the transport module 30). Next, the transport module 30 changes direction at point P2 and moves linearly to point P3 in the left direction (in the Y' direction of the secondary coordinate system when viewed from the near-front side). Then, the transport module 30 is set to rotate 90 degrees clockwise. Furthermore, the secondary coordinate system sets the counter-clockwise rotation direction θ as the positive rotation direction.

[0116] In order to within the specified period (e.g.) Figure 7 The implementation period is from T0 to T9 as shown. Figure 6 The illustrated action includes, in the action timetable, the moving speed and rotational speed of the conveying module 30 along the time axis (linear motion). Figure 7 (a) and (c) show the moving speed (V) of the conveying module 30 in the X' and Y' directions, respectively. X’ V Y’ ), Figure 7 (e) shows the rotational speed (ω) of the conveying module 30 in the θ direction. θ ).

[0117] The control schedule generation unit 502 reads the model parameters stored in the parameter storage unit 503 based on the determination information representing the transported object obtained along with the motion schedule. The transported object determined based on the determination information is... Figure 5A Given the wafer W shown, read the model parameters M1 and I1 regarding the linear movement of points P1 to P2, points P2 to P3, and the rotational movement at point P3.

[0118] Furthermore, the working force to be applied to the control model 3A (the transport module 30 holding the wafer W) is determined using model parameter M1. This control model 3A is a model that integrates the wafer W and the transport module 30. That is, the linear movement of points P1 to P2 (…). Figure 7 During the period from T0 to T3, according to Figure 7 The moving speed V of the conveying module 30 in the X' direction at various times shown in (a) X’ Obtain the acceleration 'a' at each moment in that direction. X’ ( Figure 7 (b)). Moreover, when the acceleration a at each moment is... X’ When the model parameter M1 is substituted into the previously stated equation (1), a control schedule is obtained that represents the working force to be applied to the conveying module 30 along the time axis.

[0119] Here, Figure 7 (b) shows the acceleration a at each moment. X’ It can be obtained Figure 7 The control schedule production unit 502 produces the action schedule of (a). Alternatively, it can be configured to obtain the schedule from an external source. Figure 7 The acceleration a at each moment of (b) X’ This serves as a "timetable for the movement of the conveying module 30" (described later). Figure 7 (The same in (d) and (f)).

[0120] Furthermore, the linear movement along the path from point P2 to P3 ( Figure 7 The period from time T3 to T6), and the rotation at point P3 ( Figure 7 The same applies to the period from T6 to T9. Figure 7 The acceleration at each moment in that direction is obtained by observing the changes in velocity in the Y' and θ directions of (c) and (e). Figure 7 (d) and (f)).

[0121] Furthermore, regarding the linear movement along the path from point P2 to P3, Figure 7 The acceleration a at each time step (d) Y’ Substituting the model parameter M1 into equation (1)' yields the control time schedule. Additionally, regarding the rotation at P3, Figure 7 The control time schedule is obtained by substituting the acceleration α and model parameter I1 at each time step of (f) into equation (2).

[0122] On the other hand, the items to be transported are determined based on specific information. Figure 5B In the case of the transported item 4 shown, model parameters M2 and I2 are read from the parameter storage unit 503. Furthermore, using the previously described equations (3)' and (4), the control schedule for the control model 3B (the transport module 30 holding the transported item 4) is obtained in the same way as in the case of the control model 3A.

[0123] <Magnetic Adjustment Unit 501>

[0124] The control timetable generation unit 502 outputs the generated control timetable to the magnetic force adjustment unit 501. The magnetic force adjustment unit 501 performs the following control: adjusting the magnetic force of the moving surface side coil 11 to... Figure 6 The conveying module 30 (which conveys the items being conveyed) is subjected to a working force based on a control schedule. That is, to Figure 4 The power supply unit 53 shown outputs a control signal for selecting the movable surface coil 11 to be powered and adjusting the amount of power supplied to the selected movable surface coil 11.

[0125] The power supply unit 53, based on the control signal obtained from the magnetic adjustment unit 501, performs the selection of the moving surface side coil 11 to be powered and the adjustment of the magnitude of the power supplied to the selected moving surface side coil 11. As a result, the conveying module 30 is activated based on... Figure 7 The action schedule shown in (a), (c), and (e) is used for the purpose of... Figure 6 The FF controls the movement and pose changes of the shown movement path.

[0126] Here, the action of the conveying module 30 is not only Figure 6 The simple movements illustrated can also be complex movements involving curvilinear motion, etc. By... Figure 7 By combining the movement actions in the X' and Y' directions, as well as the rotation and circular motion actions in the θ direction shown in the figures, control schedules for more complex actions can be created. Furthermore, when the transport module 30 is configured to enter areas outside the vacuum transport chamber 160, such as the wafer processing chamber 110 and the loading interlock chamber 130, the action schedule and control schedule are created to include the actions in these areas.

[0127] As explained above, the wafer processing system 101 in this example creates a control schedule based on model parameters set using control models that vary depending on the transported material, and an operation schedule. By performing FF control of the transport module 30 based on this control schedule, control with minimal delay can be achieved even when transporting different types of transported materials.

[0128] <Feedback Correction Department 504>

[0129] On the other hand, during the motion control of the conveying module 30, various unforeseen disturbances may occur. For example, vibrations caused by the movement of people or heavy objects around the wafer processing system 101 or by earthquakes are the main reasons for the deviation between the motion schedule and the actual motion of the conveying module 30.

[0130] In addition, regarding such Figure 3 As shown, multiple moving-side coils 11 are arranged on the plate 10, and sometimes the winding states of the moving-side coils 11 differ from each other within a tolerance range. Furthermore, the arrangement positions of each moving-side coil 11 within the plate 10 and the module-side magnets 33 within the conveying module 30 are sometimes arranged with deviations within a tolerance range. Due to these equipment factors, even if the same amount of power is supplied, the working force applied to the conveying module 30 may vary depending on the position of the plate 10.

[0131] Furthermore, regarding transported objects whose shape cannot be uniquely determined in advance, such as a damaged wafer W, control models are set under approximate assumptions in cases such as "part of wafer W is missing" or "wafer W is bent". Consequently, the model parameters corresponding to this control model sometimes cannot accurately represent the actual movement of the transport module 30.

[0132] In this case, if high-precision model parameters cannot be obtained under conditions of disturbance or when the working force varies depending on the position, the conveying module 30 may also fail to reach the accurate position within the specified period when only FF control is performed. Therefore, Figure 4 The control unit 5 described herein has a feedback (FB) correction unit 504, which is used to supplement the FF control described herein to achieve more accurate motion control.

[0133] To detect the position and orientation of the conveying module 30 used in the FB calibration unit 504, a sensor unit 51 is provided in the vacuum conveying chamber 160. The position and orientation detection unit 52 determines the position and orientation of the conveying module 30 based on the information obtained from the sensor unit 51.

[0134] As the sensor unit 51, examples include multiple Hall sensors, laser displacement meters, and cameras from the imaging and conveying module 30, all installed at predetermined positions within the plate 10. Figure 4 The document describes an example in which multiple Hall sensors are provided on the plate 10 as a sensor unit 51.

[0135] The FB correction unit 504 compares the position or posture of the conveying module 30 specified in the operation schedule with the actual position or posture of the conveying module 30 detected by the sensor unit 51. Furthermore, the correction is performed by adjusting the magnetic force of the moving surface side coil 11 through the magnetic force adjustment unit 501 to reduce the deviation of these positions or postures.

[0136] That is, the FB correction unit 504 outputs a correction signal to the magnetic force adjustment unit 501, which selects the timing of power supply to the moving surface coil 11 and corrects the magnitude of the power supplied to the selected moving surface coil 11. The magnetic force adjustment unit 501 adds the correction amount obtained by the FB correction unit 504 to the control signal obtained based on the control schedule and outputs it to the power supply unit 53.

[0137] <Parameter Update Section 505>

[0138] By supplementing FF control with the FB correction unit 504, the decrease in control accuracy caused by the aforementioned equipment factors and model parameter factors can be suppressed. On the other hand, when the proportion of the correction amount obtained from the FB correction unit 504 is consistently high, it is difficult to fully utilize the inherent characteristics of FF control, such as its ability to perform control with minimal delay.

[0139] Therefore, as Figure 4 As described, the control unit 5 includes a parameter update unit 505 for updating model parameters. The parameter update unit 505 has the following function: if the correction amount of the FB correction unit 504 exceeds a preset threshold for a preset period of time, it updates the model parameters by reducing the correction amount.

[0140] In the example using the FB correction unit 504, the relationship between the working force that causes the conveying module 30 to move and the components of the FF control and the correction amount of the FB can be expressed by the following equation (5).

[0141] F = F FF +F FB …(5)

[0142] Here, F represents the working force applied to the conveying module 30. FF This indicates the components of FF control obtained based on the control schedule production unit 502, F FB This indicates the components of the correction amount output by the FB correction unit 504. It is possible to control the F based on the working force represented by the control timetable output from the control timetable production unit 502 and the correction amount output from the FB correction unit 504. FF F FB Size.

[0143] For example, in F FB The size relative to F FF The size ratio (|F) FB | / |F FF If the state continues to exceed a preset threshold, the parameter update unit 505 updates the model parameters stored in the parameter storage unit 503. As an example of a threshold, F... FB Size exceeding F FF The case is 10% of the size. Furthermore, it is not limited to the case relative to F. FF The threshold can be defined by the proportion of its size. For example, it can also be defined for F. FB The absolute value is used to set the threshold.

[0144] In addition, when the working force applied to the conveying module 30 is the rotational force N described in equations (2) and (4), the influence of the correction amount of FB can be grasped in the same way as in the above example.

[0145] On the other hand, if the model parameters are updated only when the correction amount of the FB correction unit 504 exceeds the threshold for a short period of time, updates will be performed frequently, and the motion control of the transport module 30 may become unstable. Therefore, if the correction amount exceeds the preset period for a preset period of time, the parameter update unit 505 updates the model parameters.

[0146] As an example of determining whether model parameters need to be updated, F can be illustrated in the motion control of the entire movement path of the conveying module 30 from the receiving position to the handover position of the conveyed item. FB The condition where the value continuously exceeds the threshold. Additionally, model parameter updates can be implemented if this state is repeated multiple times.

[0147] As a method for updating model parameters, it is possible to exemplify the case of inverse calculation based on the corrected working force. Figure 5A , Figure 5B In the example, based on the actual working force applied to the conveying module 30 (F in equation (5)) and equations (1)' and (3)', the new model parameters, namely the masses M1 and M2, of the control models 3A and 3B are calculated in reverse. When the model parameters M1 and M2 calculated in reverse change over time, their average value can be set as the new model parameters.

[0148] The model parameters (moments of inertia I1, I2) for the case where the conveying module 30 rotates can also be obtained using the same method.

[0149] In addition, Figure 4 In the control unit 5 shown, the FB correction unit 504 and the parameter update unit 505 are not necessary. For example, the correction of the FB correction unit 504 and the updating of the model parameters can be omitted according to the accuracy required for the motion control of the conveying module 30.

[0150] <Function of Control Unit 5>

[0151] Reference Figure 8 The flowchart illustrates an example of how the control unit 5, which has the structure described above, performs motion control on a certain conveying module 30.

[0152] First, as a preparation (start) before the wafer processing system 101 starts operating, the model parameters of each transported item are determined according to the contents of the transport module 30, and the model parameters are stored in the parameter storage unit 503 (step S101, process of determining parameters).

[0153] Next, after the wafer processing system 101 is running and it becomes the time to transport wafer W and other transported items via the transport module 30, the determination information and operation schedule of the transported items are obtained (step S102). Then, the model parameters of the transported items (including the state of untransported items) corresponding to the determination information are read out, and the control schedule is created using the operation schedule and model parameters and output (step S103, the process of outputting the control schedule).

[0154] The magnetic force adjustment unit 501 executes power supply control via the power supply unit 53 based on the generated control schedule, and performs the conveying action of the conveying module 30 (step S104, the process of implementing feedforward control). At this time, if the control unit 5 is equipped with the FB correction unit 504, the position and posture of the conveying module 30 are detected by the sensor unit 51 (the process of detecting the position or posture of the conveying module 30). Then, correction is performed to reduce the deviation of the detection result from the position and posture of the conveying module 30 specified in the action schedule (the process of implementing feedback correction). Then, if the conveying action has not ended, these actions continue (step S105: "No").

[0155] After the conveying action is completed (step S105: "Yes"), the correction amount of the FB correction unit 504 is greater than the threshold, and this state exceeds the preset period, so it is confirmed whether the model parameters need to be updated (step S106). If no update is needed, the action is ended, and the time is waited for the next conveying item to be conveyed (step S106; "No" → step S102).

[0156] If it is necessary to update the model parameters (step S106; "Yes"), the new model parameters are obtained by the method described above, and the results are input into the parameter storage unit 503 to update the model parameters (step S107, process of updating model parameters), and then wait for the opportunity to transport the next transported item (go to step S102).

[0157] <Effect>

[0158] According to the wafer processing system 101 disclosed herein, the following effects are achieved: Based on a control model that integrates the transported object and the transport module 30, various model parameters are prepared to represent the relationship between the working force and motion applied to the control model, depending on the transported object. By switching these model parameters to create a control schedule that specifies the working force for moving the transport module 30 along the time axis, accurate motion control (FF control) can be performed even when transporting objects other than the wafer W.

[0159] <Wafer Processing System 101a>

[0160] Figures 9-11 This is a structural example of a wafer processing system 101a that uses the transfer module 30a according to other embodiments to transfer the transported items. Furthermore, in the following description... Figures 9-13 In China, regarding the use Figures 1-6 The common structural designations of the wafer processing system 101 and the transfer module 30 described herein are the same as the common reference numerals in the figures shown in these figures.

[0161] Figure 9 The wafer processing system 101a shown uses a transfer module 30a with an arm 32 to transfer items. In this respect, it differs from the transfer module 30 of the first embodiment, where the upper surface of the main body 31 of the transfer module 30 serves as a stage 34 for holding the transferred items. In the transfer module 30a, the structure of the main body 31, which is rectangular when viewed from above, is substantially the same as that of the transfer module 30 of the first embodiment. That is, it is similar to... Figure 3 The example shown also has multiple module-side magnets 33 disposed inside the main body 31. However, in this example, the main body 31 of the conveying module 30a does not have a slit 341 formed.

[0162] like Figure 10 , Figure 11 As shown, an arm 32 for horizontally holding the wafer W is provided in the main body 31. The arm 32 is provided in a horizontal direction extending from the base end on the side of the main body 31. A fork is provided at the front end of the arm 32, which can be configured to surround the area where three lifting pins 131, 112 are provided from the left and right. The fork corresponds to the holding part in the transport module 30a.

[0163] With the main body 31 positioned within the vacuum transfer chamber 160, the transfer module 30a inserts its arm 32 into the wafer processing chamber 110 and the loading interlock chamber 130 to transfer the wafer W. Therefore, the length L of the arm 32 is configured to allow the wafer W held in the arm 32 to enter a position above the lifting pins 113 and 131.

[0164] On the other hand, Figure 9 In the example shown, the length of the short side of the rectangular vacuum transfer chamber 160 when viewed from above is the width of the two transfer modules 30a holding the wafer W, which are staggered in a left-right arrangement. Furthermore, the length of the short side of the vacuum transfer chamber 160 in this example is shorter than the total length of the transfer module 30a holding the wafer W, from the main body 31 to the front end of the wafer W.

[0165] When transporting wafer W within a vacuum transport chamber 160 where the length of the transport module 30a in the short side direction is shorter than the total length of the transport module 30a, the transport module 30a, upon receiving wafer W in the loading interlock chamber 130, performs a retraction action. When the transport module 30a retracts to a side position within the wafer processing chamber 110, the main body 31 moves inward through the configuration position of the gate valve 111 of the wafer processing chamber 110. This action maintains the front end of the arm 32 of wafer W positioned to the side of the gate valve 111.

[0166] In this way, after the front end of the arm 32 reaches the side of the gate valve 111, in addition to the backward movement, the front end of the arm 32 is rotated toward the gate valve 111. Then, the gate valve 111 is opened, and while rotating in a manner to insert the wafer W into the wafer processing chamber 110, the movement direction of the transport module 30a is switched to forward.

[0167] As already described, the length of the short side of the vacuum transfer chamber 160 is shorter than the total length of the transfer module 30a holding the wafer W. Even in this case, by combining the rotational operation with the forward / backward switching operation of the transfer module 30a, the wafer W can be transferred into the vacuum transfer chamber 160 relative to the wafer processing chamber 110.

[0168] In the motion control of the conveying module 30a illustrated above, the function of the control unit 5, which uses the motion schedule and model parameters to create the control schedule, remains unchanged. On the other hand, in the conveying module 30a that uses the arm 32 to convey items, the effects of vibration may become greater. When conveying items under conditions of large vibration, deviations in the holding position of the arm 32, falling, and contact between the conveyed item and other equipment may occur.

[0169] Therefore, the wafer processing system 101a in this example stores the mass m of the transported object, the moment of inertia I' of the transport module 30a holding the transported object, the spring constant k, and the attenuation coefficient c in the parameter storage unit 503, as model parameters for representing the vibration generated in the arm 32 when the arm 32, which is the holding part, is regarded as a leaf spring.

[0170] By expressing the characteristic frequency of arm 32 theoretically, the vibration f of arm 32 can be represented as a function f(m, I', k, c) of these model parameters. To reduce this vibration, while making... Figure 11 When the conveying module 30a described herein moves in the X' direction, it can move vertically in a manner that traces a trajectory with a frequency consistent with the frequency of the vibration f and a phase opposite to that of the vibration f, thereby performing vibration reduction control (see reference). Figure 11(The dashed arrows shown in the diagram). Alternatively, a notch filter can be placed in the feedback loop to reduce the vibration f corresponding to the characteristic frequency of arm 32.

[0171] Furthermore, even when it is difficult to determine the vibration f using a theoretical formula, the model parameters can be determined through machine learning. For example, the vibration f can be represented by the following equation (6), and the action of conveying the object can be repeated multiple times without vibration reduction control. The model parameters A, ω, and θ can be determined by machine learning, for example, using a neural network.

[0172] f=Asin(ωt+θ)…(6)

[0173] Where A is the amplitude, ω is the angular velocity, and θ is the initial phase.

[0174] Furthermore, machine learning, such as neural networks, can be performed not only when determining model parameters, but also when updating model parameters in the parameter update unit 505. For example, a vibration sensor, which serves as a sensor unit, is provided in the main body 31 to correct the frequency and phase of the vibration reduction motion, so that the amplitude of the vibration detected by the vibration sensor is reduced.

[0175] If the correction amount of the FB correction unit 504 exceeds a preset threshold for a preset period of time, the model parameters A, ω, and θ in equation (6) can be updated, for example. At this time, the vertical movement of the conveying module 30 used for vibration reduction control can be controlled based on the corrected control signal output from the magnetic force adjustment unit 501. The vertical movement can also be learned through machine learning to derive equation (6) and determine the new model parameters.

[0176] In the above explanation, regarding the determination and updating of the model parameters of the control model, examples are given of the case where the determination is made based on the theoretical formula of the relationship between the performance and the motion of the control model, and the case where the determination is made through machine learning.

[0177] In addition, the state equations containing model parameters and representing the FF control and FB correction of the transport modules 30 and 30a can be formulated, thereby formulating the observer that estimates the internal state of the control system. Based on the estimation results of the internal state of the control system obtained using the observer, the model parameters can be determined and updated.

[0178] Figure 12 , Figure 13 This illustrates an example of multiple transport modules 30 working together to transport items.

[0179] first, Figure 12The following scenario is illustrated schematically: the transported item is a faulty transport module 30b, which is transported by two other transport modules 30b. In this figure, the faulty transport module 30b is marked with a shaded line.

[0180] In this example, a protrusion 35 is provided on the side of each conveying module 30b. A recess 36, into which the protrusion 35 can be inserted, is provided on the side opposite to the side where the protrusion 35 is provided. Furthermore, as... Figure 12 As shown, multiple conveying modules 30b are connected by inserting the protrusion 35 of one conveying module 30b into the recess 36 of another conveying module 30b.

[0181] As described above, by configuring multiple conveying modules 30b to be interconnected, for example, in the event that one conveying module 30b malfunctions and cannot move, the malfunctioning conveying module 30b can be connected by other conveying modules 30b sandwiching it. The malfunctioning conveying module 30b is held and conveyed by the other conveying modules 30.

[0182] Regarding the conveying module 30b illustrated above, the model parameters are predetermined based on a control model that uses the malfunctioning conveying module 30b as the object being conveyed. Furthermore, a control schedule is created using these model parameters and the action schedule, and action control is performed. This function is similar to... Figures 1-11 The examples described are the same.

[0183] On the other hand, when the two transport modules 30b that have malfunctioned during cooperative transport are controlled independently, deviations in motion control sometimes occur. When these deviations occur, the gap between the two transport modules 30b widens, and the malfunctioning transport module 30b may fall. Therefore, in this example, the transport module 30a designates one of the transport modules 30b as the master 30A and performs the previously described FF control on the master 30A. On the other hand, the remaining transport modules 30b are designated as slaves 30B, and the magnetic force of the moving surface coil 11 is adjusted for the slaves 30B to apply a working force to the slaves 30B to follow the master 30A. In this way, by performing master-slave control, it is possible to prevent the transported item from falling due to deviations in control.

[0184] Furthermore, the multiple transfer modules 30 can cooperate to transfer components located within the vacuum transfer chamber 160 or the wafer processing chamber 110 as transport objects. Moreover, the multiple transfer modules 30 can be configured to cooperate in transferring components within the loading interlock chamber 130.

[0185] exist Figure 13The diagram shows three transfer modules 30 working together to transfer the focusing ring 114 of the stage 112 located in the wafer processing chamber 110.

[0186] When three or more conveying modules 30 are working together, one master module 30A and another slave module 30B are also set up. Moreover, for the master module 30A, motion control is performed based on a control schedule created using model parameters and motion schedules. By making the remaining slave modules 30B follow the master module 30A, it is possible to prevent the conveyed items from falling and to perform accurate motion control.

[0187] Here, the structure of the apparatus for transporting the transported object via the transport module 30 is not limited to the vacuum transport chamber 160 example described above. For example, the control method of this example can be applied even when transporting or processing the wafer W at atmospheric pressure. Examples of processing performed at atmospheric pressure include, for instance, coating the wafer W with photoresist for exposure, coating the wafer W with developer, developing the wafer W, and cleaning the substrate with a cleaning solution.

[0188] The embodiments disclosed herein should be considered illustrative in all respects, not restrictive. The above embodiments may be omitted, substituted, or modified in various ways without departing from the appended claims and their spirit.

[0189] Explanation of reference numerals in the attached figures

[0190] W: Wafer; 101, 101a: Wafer processing system; 110: Wafer processing chamber; 160: Vacuum transfer chamber; 30, 30a, 30b: Transfer module; 33: Module-side magnet; 5: Control unit; 501: Magnetic force adjustment unit; 502: Control time schedule generation unit; 503: Parameter storage unit.

Claims

1. A substrate conveying apparatus for conveying substrates to a substrate processing chamber, the substrate conveying apparatus comprising: A substrate transfer chamber has a bottom portion and a side wall portion. The bottom portion is provided with a first magnet with adjustable magnetic force. The side wall portion is connected to the substrate processing chamber and has an opening formed in the side wall portion for transferring the substrate into and out of the substrate processing chamber. A substrate transport module includes a holding part and a second magnet. The holding part is configured to hold multiple transported items, which are the substrate or devices used in the substrate transport chamber or the substrate processing chamber. A repulsive force acts between the second magnet and the first magnet. The substrate transport module is configured to move within the substrate transport chamber by magnetic levitation utilizing the repulsive force. The control unit adjusts the repulsive force by regulating the magnetic force of the first magnet, thereby using feedforward control to control the working force used to operate the substrate transport module. in, The control unit includes: The parameter storage unit stores at least one model parameter, which represents the relationship between the working force applied to the control model and the movement of the control model, in a manner corresponding to the various transport objects of the various transport objects. The control model is a model that represents the transport object and the substrate transport module as an integral whole. The control schedule production unit acquires determination information for determining the transported object and an operation schedule that defines the movement of the substrate transport module along the time axis. Using the model parameters of the control model corresponding to the determination information stored in the parameter storage unit, it calculates the working force that should be applied when the substrate transport module holding the transported object corresponding to the determination information operates based on the operation schedule, and outputs it as a control schedule that defines the working force along the time axis. as well as A magnetic force adjustment unit adjusts the magnetic force of the first magnet to apply the working force based on the control schedule to the substrate conveying module that conveys the object corresponding to the determined information, thereby performing the feedforward control. The substrate conveying module is configured such that multiple substrate conveying modules cooperate to convey a common conveyed object. The magnetic force adjustment unit sets one of the substrate transport modules as the master and performs the feedforward control on the master, sets the remaining substrate transport modules as slaves and adjusts the magnetic force of the first magnet for the slaves, so as to apply the working force to the slaves to follow the master in performing the operation.

2. The substrate conveying device according to claim 1, characterized in that, The model parameters are a set of at least one of the following parameters (1) to (3): (1) The mass of the control model used to represent the relationship between the working force and acceleration applied for linear motion; (2) The moment of inertia of the control model used to represent the relationship between the working force applied for rotational motion and the angular acceleration; as well as (3) When the arm-shaped retaining part is regarded as a leaf spring, the mass of the conveyed object used to perform vibration reduction operation and to express the vibration generated in the retaining part, the inertial torque of the retaining part holding the conveyed object, the spring constant, and the damping coefficient.

3. The substrate conveying device according to claim 1 or 2, characterized in that, The model parameters are determined based on theoretical formulas representing the relationship between the motion of the control model and the model itself.

4. The substrate conveying device according to claim 1 or 2, characterized in that, The model parameters are determined by machine learning based on the results obtained from multiple actual implementations of the transport of the transported items using the substrate transport module.

5. The substrate conveying device according to claim 1 or 2, characterized in that, The system includes a sensor unit that detects the position and orientation of the substrate transport module moving within the substrate processing chamber. The control unit includes a feedback correction unit, which compares the position or posture of the substrate transport module determined based on the operation schedule with the position or posture of the substrate transport module transporting the transported object detected by the sensor unit, and corrects the adjustment of the magnetic force of the first magnet by the magnetic force adjustment unit, so as to reduce the deviation of these positions or postures.

6. The substrate conveying device according to claim 5, characterized in that, The system includes a parameter update unit that updates the model parameters stored in the parameter storage unit in such a way that the correction amount of the feedback correction unit exceeds a preset threshold for a preset period of time.

7. The substrate conveying device according to claim 6, characterized in that, The parameter update unit updates the model parameters by performing machine learning based on the results obtained from actually performing the transport of the transported object multiple times using the substrate transport module, in order to reduce the correction amount.

8. A substrate conveying method for conveying substrates to a substrate processing chamber. The substrate transport method uses a substrate transport module for transport. The substrate transport module includes a holding portion and a second magnet. The holding portion is housed within a substrate transport chamber and configured to hold multiple transportable items. The substrate transport chamber has a bottom portion with an adjustable magnetic force provided by a first magnet and a sidewall portion connected to a substrate processing chamber and having an opening for loading and unloading substrates. The multiple transportable items are the substrate or devices used in the substrate transport chamber or the substrate processing chamber. A repulsive force acts between the second magnet and the first magnet. The substrate transport module is configured to move within the substrate transport chamber via magnetic levitation utilizing this repulsive force. The substrate transfer method includes the following steps when using the substrate transfer module for transfer: The model parameters are determined and correspond to the various transported objects. They are used to represent the relationship between the working force applied to the control model and the movement of the control model. The control model is a model that integrates the transported objects and the substrate transport module. Acquire determination information for determining the transported object and an action schedule that defines the movement of the substrate transport module along the time axis. Use the model parameters of the control model corresponding to the determination information, determined by the process of determining the parameters, to calculate the working force to be applied when the substrate transport module holding the transported object corresponding to the determination information operates based on the action schedule. Output the working force as a control schedule that defines the working force along the time axis. The magnetic force of the first magnet is adjusted to apply the working force based on the control schedule to the substrate conveying module that conveys the object corresponding to the determined information, thereby performing feedforward control. In the case where multiple substrate transfer modules are configured to cooperate in transferring a common transported object, in the process of performing the feedforward control, one substrate transfer module is designated as the master and the feedforward control is performed on the master, while the remaining substrate transfer modules are designated as slaves and the magnetic force of the first magnet is adjusted for the slaves to apply the working force to the slaves so as to follow the master in performing the operation.

9. The substrate conveying method according to claim 8, characterized in that, The model parameters are a set of at least one of the following parameters (1) to (3): (1) The mass of the control model used to represent the relationship between the working force and acceleration applied for linear motion; (2) The moment of inertia of the control model used to represent the relationship between the working force applied for rotational motion and the angular acceleration; as well as (3) When the arm-shaped retaining part is regarded as a leaf spring, the mass of the conveyed object used to perform vibration reduction operation and to express the vibration generated in the retaining part, the inertial torque of the retaining part holding the conveyed object, the spring constant, and the damping coefficient.

10. The substrate conveying method according to claim 8 or 9, characterized in that, The model parameters are determined based on theoretical formulas representing the relationship between the motion of the control model and the model itself.

11. The substrate conveying method according to claim 8 or 9, characterized in that, The model parameters are determined by machine learning based on the results obtained from multiple actual implementations of the transport of the transported items using the substrate transport module.

12. The substrate conveying method according to claim 8 or 9, characterized in that, It also includes the following processes: Detecting the position and orientation of the substrate transfer module moving within the substrate processing chamber; and Feedback correction is implemented, in which the position or posture of the substrate transport module determined based on the action schedule during the process of performing the feedforward control is compared with the position or posture of the substrate transport module transporting the transported object detected during the process of performing the detection, and the adjustment of the magnetic force of the first magnet is corrected so that the deviation of these positions or postures is reduced.

13. The substrate conveying method according to claim 12, characterized in that, If, during the feedback correction process, the state in which the correction amount of the feedback correction that adjusts the magnetic force of the first magnet exceeds a preset threshold persists for a preset period, the model parameters determined by the process of determining the model parameters are updated in such a way that the correction amount is reduced.

14. The substrate conveying method according to claim 13, characterized in that, In the process of updating the model parameters, the model parameters are updated in a manner that reduces the correction amount by performing machine learning based on the results obtained from actually performing the transport of the transported object using the substrate transport module multiple times.

Images